LM185BWG/883 [TI]
可调节微功耗电压基准 | NAC | 10 | -55 to 125;型号: | LM185BWG/883 |
厂家: | TEXAS INSTRUMENTS |
描述: | 可调节微功耗电压基准 | NAC | 10 | -55 to 125 电源电路 参考电压源 |
文件: | 总15页 (文件大小:459K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LM185QML
www.ti.com
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
LM185QML Adjustable Micropower Voltage References
Check for Samples: LM185QML
1
FEATURES
DESCRIPTION
The LM185 are micropower 3-terminal adjustable
band-gap voltage reference diodes. Operating from
1.24 to 5.3V and over a 10μA to 20mA current range,
they feature exceptionally low dynamic impedance
and good temperature stability. On-chip trimming is
used to provide tight voltage tolerance. Since the
LM185 band-gap reference uses only transistors and
resistors, low noise and good long-term stability
result.
2
•
•
•
•
Adjustable from 1.24V to 5.30V
Operating Current of 10μA to 20mA
1Ω Dynamic Impedance
Low Temperature Coefficient
Careful design of the LM185 has made the device
tolerant of capacitive loading, making it easy to use in
almost any reference application. The wide dynamic
operating range allows its use with widely varying
supplies with excellent regulation.
The extremely low power drain of the LM185 makes it
useful for micropower circuitry. This voltage reference
can be used to make portable meters, regulators or
general purpose analog circuitry with battery life
approaching shelf life. Further, the wide operating
current allows it to replace older references with a
tighter tolerance part.
Connection Diagrams
Figure 1. PFM Metal Can Package (Bottom View)
See Package Number NDV0003H
Figure 2. 20-Leadless Chip Carrier (Top View)
See Package Number NAJ0020A
10
N/C
N/C
N/C
N/C
V-
1
2
3
4
5
+V
REF
9
8
7
6
N/C
N/C
ADJ
N/C
Figure 3. 10-Lead CLGA (Top View)
See Package Number NAC0010A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
LM185QML
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
www.ti.com
Block Diagram
Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM185QML
LM185QML
www.ti.com
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
Absolute Maximum Ratings(1)
Reverse Current
30mA
10mA
Forward Current
Operating Temperature Range
Storage Temperature
−55°C ≤ TA ≤ 125°C
−55°C ≤ TA ≤ 150°C
150°C
Maximum Junction Temperature TJmax
Lead Temperature (soldering, 10 seconds)
Thermal Resistance
300°C
θJA
LCCC Package (Still Air)
100°C/W
73°C/W
LCCC Package (500LF/Min Air
flow)
Metal Can Package (Still Air)
300°C/W
139°C/W
Metal Can Package (500LF/Min
Air flow)
CLGA Package (Still Air)
194°C/W
128°C/W
CLGA Package (500LF/Min Air
flow)
θJC
LCCC Package
Metal Can Package
CLGA Package
LCCC Package
Metal Can Package
CLGA Package
25°C/W
57°C/W
23°C/W
TBD
Package Weight (Typical)
ESD Tolerance(2)
TBD
210mg
500V
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
(2) Human body model, 1.5 kΩ in series with 100 pF.
Table 1. Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Static tests at
Temp °C
25
1
2
Static tests at
125
-55
25
3
Static tests at
4
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
Settling time at
Settling time at
Settling time at
5
125
-55
25
6
7
8A
8B
9
125
-55
25
10
11
12
13
14
125
-55
25
125
-55
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM185QML
LM185QML
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
www.ti.com
LM185B Electrical Characteristics DC Parameters
Sub-
groups
Symbol
VRef
Parameter
Conditions
Notes
Min
Max
Unit
Reference Voltage
IR = 100µA
1.228
1.215
1.228
1.215
1.228
1.215
1.228
1.215
1.228
1.215
1.288
1.215
1.288
1.215
1.288
1.215
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.0
V
V
1
2, 3
1
IR = 9µA
IR = 10µA
IR = 1mA
V
V
2, 3
1
V
V
2, 3
1
IR = 20mA
V
V
2, 3
1
VR = 5.3V, IR = 100µA
V
V
2, 3
1
VR = 5.3V, IR = 45µA
VR = 5.3V, IR = 50µA
VR = 5.3V, IR = 1.0mA
V
V
2, 3
1
V
V
2, 3
1
VR = 5.3V, IR = 20mA
V
V
2, 3
1
ΔVRef/ΔIR Reference Voltage
9µA ≤ IR ≤ 1mA
10µA ≤ IR ≤ 1mA
1mA ≤ IR ≤ 20mA
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
Change with Current
1.5
2, 3
1
10
20
2, 3
1
VR = 5.3V, 45µA ≤ IR ≤ 1mA
VR = 5.3V, 50µA ≤ IR ≤ 1mA
VR = 5.3V, 1mA ≤ IR ≤ 20mA
1.0
1.5
2, 3
1
10
20
2, 3
1
ΔVRef
ΔVO
/
Reference Voltage
Change with Output
Voltage
VR = 5.3V, IR = 100µA
3.0
6.0
2, 3
IF
Feedback Current
IR = 9µA
20
25
20
25
20
25
20
25
9.0
10
45
50
nA
nA
nA
nA
nA
nA
nA
nA
µA
µA
µA
µA
1
2, 3
1
IR = 10µA
IR = 20mA
2, 3
1
VR = 5.3V, IR = 45µA
VR = 5.3V, IR = 50µA
VR = 5.3V, IR = 20mA
2, 3
1
2, 3
1
IC
Minimum Operating
Current
VR = VRef
VR = 5.3V
See(1)
See(1)
See(1)
See(1)
2, 3
1
2, 3
(1) Functional test.
4
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM185QML
LM185QML
www.ti.com
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
LM185BY Electrical Characteristics DC Parameters
Sub-
groups
Symbol
VRef
Parameter
Conditions
Notes
Min
Max
Unit
Reference Voltage
IR = 100µA
1.228
1.215
1.228
1.215
1.228
1.215
1.228
1.215
1.228
1.215
1.288
1.215
1.288
1.215
1.288
1.215
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.252
1.255
1.0
V
V
1
2, 3
1
IR = 9µA
IR = 10µA
IR = 1mA
V
V
2, 3
1
V
V
2, 3
1
IR = 20mA
V
V
2, 3
1
VR = 5.3V, IR = 100µA
V
V
2, 3
1
VR = 5.3V, IR = 45µA
VR = 5.3V, IR = 50µA
VR = 5.3V, IR = 1.0mA
V
V
2, 3
1
V
V
2, 3
1
VR = 5.3V, IR = 20mA
V
V
2, 3
1
ΔVRef/ΔIR Reference Voltage
9µA ≤ IR ≤ 1mA
10µA ≤ IR ≤ 1mA
1mA ≤ IR ≤ 20mA
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
Change with Current
1.5
2, 3
1
10
20
2, 3
1
VR = 5.3V, 45µA ≤ IR ≤ 1mA
VR = 5.3V, 50µA ≤ IR ≤ 1mA
VR = 5.3V, 1mA ≤ IR ≤ 20mA
1.0
1.5
2, 3
1
10
20
2, 3
1
ΔVRef
ΔVO
/
Reference Voltage
Change with Output
Voltage
VR = 5.3V, IR = 100µA
3.0
6.0
2, 3
IF
Feedback Current
IR = 9µA
20
25
20
25
20
25
20
25
9.0
10
45
50
50
nA
nA
1
2, 3
1
IR = 10µA
IR = 20mA
nA
nA
2, 3
1
VR = 5.3V, IR = 45µA
VR = 5.3V, IR = 50µA
VR = 5.3V, IR = 20mA
nA
nA
2, 3
1
nA
nA
2, 3
1
IC
Minimum Operating
Current
VR = VRef
VR = 5.3V
See(1)
See(1)
See(1)
See(1)
See(2)
µA
µA
2, 3
1
µA
µA
2, 3
1, 2, 3
TC
Temperature
Coefficient
PPM/°C
(1) Functional test.
(2) The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between
the operating TMin & TMax, divided by (TMax − TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax
−
TMin
)
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM185QML
LM185QML
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
Temperature Drift of 3
Representative Units
Feedback Current
Figure 4.
Figure 5.
Minimum Operating Current
Reverse Characteristics
Figure 6.
Figure 7.
Reverse Characteristics
Forward Characteristics
Figure 8.
Figure 9.
6
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM185QML
LM185QML
www.ti.com
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Output Noise Voltage
Dynamic Output Impedance
Figure 10.
Figure 11.
Response Time
Figure 12.
Temperature Coefficient Typical
LM185
Figure 13.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM185QML
LM185QML
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
www.ti.com
TYPICAL APPLICATIONS
Precision 10V Reference
Low AC Noise Reference
Figure 14.
Figure 15.
25V Low Current Shunt Regulator
200 mA Shunt Regulator
Figure 16.
Figure 17.
Series-Shunt 20 mA Regulator
High Efficiency Low Power Regulator
Figure 18.
Figure 19.
8
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM185QML
LM185QML
www.ti.com
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
Voltage Level Detector
Voltage Level Detector
Figure 20.
Figure 21.
Fast Positive Clamp
Bidirectional Clamp
±2.4V
2.4V + ΔVD1
Figure 22.
Figure 23.
Bidirectional Adjustable Clamp
±1.8V to ±2.4V
Bidirectional Adjustable Clamp
±2.4V to ±6V
Figure 24.
Figure 25.
*D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the
threshold current, except with I=O.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM185QML
LM185QML
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
www.ti.com
Simple Floating Current Detector
Precision Floating Current Detector
Figure 26.
Figure 27.
Current Source
Centigrade Thermometer, 10mV/°C
Figure 28.
Figure 29.
Freezer Alarm
1.2V Reference
Figure 30.
Figure 31.
10
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM185QML
LM185QML
www.ti.com
SNVS386D –NOVEMBER 2005–REVISED MARCH 2013
5.0V Reference
Figure 32.
REVISION HISTORY SECTION
Released
Revision
Section
Originator
Changes
11/08/05
A
New Release, Corporate format
L. Lytle
2 MDS data sheets converted into one Corp.
data sheet format. MNLM185B-X Rev 0B0 and
MNLM185BY-X Rev 0B0 will be archived.
04/06/06
B
Ordering Information Table, WG
Connection Diagram, Absolute
Maximum Ratings Section, Physical
Dimensions Section
R. Malone
Added NSID, Connection Diagram, Physical
Dimension Dwg, Thermal Resistance and
Package Weight for NAC package. Revision A
will be Archived.
06/12/08
03/27/13
C
D
LM185B and LM185BY Electrical
Section
Larry McGee
Correct IC test, VR = VREF condition, subgroup
1, 2, 3 moved limits to the maximum column.
Revision B will be Archived.
All
Changed layout of National Data Sheet to TI
format.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM185QML
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
5962-9091402QYA
ACTIVE
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185BWG
/883 Q
5962-90914
02QYA ACO
02QYA >T
LM185BWG/883
ACTIVE
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185BWG
/883 Q
5962-90914
02QYA ACO
02QYA >T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
NAC0010A
WG10A (Rev H)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
LM185BXH-1.2/NOPB
1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.235V, MBCY2, HERMETIC SEALED, METAL CAN, TO-46, 2 PIN
NSC
©2020 ICPDF网 联系我们和版权申明