LM1894MX/NOPB [TI]

立体动态降噪系统 | D | 14 | 0 to 70;
LM1894MX/NOPB
型号: LM1894MX/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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立体动态降噪系统 | D | 14 | 0 to 70

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LM1894  
www.ti.com  
SNAS551C DECEMBER 1994REVISED APRIL 2013  
LM1894 Dynamic Noise Reduction System DNR  
Check for Samples: LM1894  
1
FEATURES  
DESCRIPTION  
The LM1894 is a stereo noise reduction circuit for use  
with audio playback systems. The DNR system is  
non-complementary, meaning it does not require  
encoded source material. The system is compatible  
with virtually all prerecorded tapes and FM  
broadcasts. Psychoacoustic masking, and an  
adaptive bandwidth scheme allow the DNR to  
achieve 10 dB of noise reduction. DNR can save  
circuit board space and cost because of the few  
additional components required.  
2
Non-Complementary Noise Reduction, “Single  
Ended”  
Low Cost External Components, No Critical  
Matching  
Compatible with All Prerecorded Tapes and  
FM  
10 dB Effective Tape Noise Reduction  
CCIR/ARM Weighted  
Wide Supply Range, 4.5V to 18V  
1 Vrms Input Overload  
APPLICATIONS  
Automotive Radio/Tape Players  
Compact Portable Tape Players  
Quality HI-FI Tape Systems  
VCR Playback Noise Reduction  
Video Disc Playback Noise Reduction  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1994–2013, Texas Instruments Incorporated  
LM1894  
SNAS551C DECEMBER 1994REVISED APRIL 2013  
www.ti.com  
Typical Application  
*R1 + R2 = 1 kΩ total.  
See Application Hints.  
Figure 1. Component Hook-Up for Stereo DNR System  
14-Pin SOIC or PDIP or TSSOP  
See D or NFF0014A or PW Package  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
Supply Voltage  
20V  
VS/2  
Input Voltage Range, Vpk  
Operating Temperature(3)  
Storage Temperature  
0°C to +70°C  
65°C to +150°C  
260°C  
PDIP Package  
SOIC Package  
Soldering (10 seconds)  
Vapor Phase (60 seconds)  
Infrared (15 seconds)  
Soldering Information  
215°C  
220°C  
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) For operation in ambient temperature above 25°C, the device must be derated based on a 150°C maximum junction temperature and a  
thermal resistance of:  
(a) 80°C/W junction to ambient for the PDIP package,  
(b) 105°C/W junction to ambient for the SOIC package, and  
(c) 150°C/W junction to ambient for the TSSOP package.  
2
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SNAS551C DECEMBER 1994REVISED APRIL 2013  
Electrical Characteristics  
VS = 8V, TA = 25°C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified  
Parameter  
Operating Supply Range  
Conditions  
Min  
Typ  
8
Max  
18  
Units  
V
4.5  
Supply Current  
VS = 8V  
17  
30  
mA  
MAIN SIGNAL PATH  
Voltage Gain  
DC Ground Pin 9(1)  
0.9  
3.7  
1  
1.1  
4.3  
V/V  
V
DC Output Voltage  
Channel Balance  
Minimum Balance  
4.0  
DC Ground Pin 9  
1.0  
1.0  
dB  
AC Ground Pin 9 with 0.1  
675  
27  
965  
1400  
Hz  
μFCapacitor(1)  
Maximum Bandwidth  
Effective Noise Reduction  
Total Harmonic Distortion  
Input Headroom  
DC Ground Pin 9(1)  
CCIR/ARM Weighted(2)  
34  
10  
0.05  
1.0  
46  
14  
0.1  
kHz  
dB  
DC Ground Pin 9  
%
Maximum VIN for 3% THD  
AC Ground Pin 9  
Vrms  
Output Headroom  
Signal to Noise  
Maximum VOUT for 3% THD  
DC Ground Pin 9  
V
S 1.5  
Vp-p  
BW = 20 Hz–20 kHz, re 300 mV  
AC Ground Pin 9  
79  
77  
dB  
dB  
DC Ground Pin 9  
CCIR/ARM Weighted re 300 mV(3)  
AC Ground Pin 9  
82  
70  
88  
76  
dB  
dB  
DC Ground Pin 9  
CCIR Peak, re 300 mV(4)  
AC Ground Pin 9  
77  
64  
dB  
dB  
kΩ  
dB  
DC Ground Pin 9  
Input Impedance  
Pin 2 and Pin 13  
14  
20  
26  
20  
Channel Separation  
Power Supply Rejection  
DC Ground Pin 9  
50  
70  
C14 = 100 μF,  
VRIPPLE = 500 mVrms,  
f = 1 kHz  
40  
56  
dB  
Output DC Shift  
Reference DVM to Pin 14 and  
Measuree Output DC Shift from  
Minimum to Maximum Band-width(5)  
4.0  
mV  
(1) To force the DNR system into maximum bandwidth, DC ground the input to the peak detector, pin 9. A negative temperature coefficient  
of 0.5%/°C on the bandwidth, reduces the maximum bandwidth at increased ambient temperature or higher package dissipation. AC  
ground pin 9 or pin 6 to select minimum bandwidth. To change minimum and maximum bandwidth, see Application Hints.  
(2) The maximum noise reduction CCIR/ARM weighted is about 14 dB. This is accomplished by changing the bandwidth from maximum to  
minimum. In actual operation, minimum bandwidth is not selected, a nominal minimum bandwidth of about 2 kHz gives 10 dB of noise  
reduction. See Application Hints.  
(3) The CCIR/ARM weighted noise is measured with a 40 dB gain amplifier between the DNR system and the CCIR weighting filter; it is  
then input referred.  
(4) Measured using the Rhode-Schwartz psophometer.  
(5) Pin 10 is DC forced half way between the maximum bandwidth DC level and minimum bandwidth DC level. An AC 1 kHz signal is then  
applied to pin 10. Its peak-to-peak amplitude is VDC (max BW) VDC (min BW).  
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Units  
Electrical Characteristics (continued)  
VS = 8V, TA = 25°C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified  
Parameter  
CONTROL SIGNAL PATH  
Summing Amplifier Voltage Gain  
Gain Amplifier Input Impedance  
Voltage Gain  
Conditions  
Min  
Typ  
Max  
Both Channels Driven  
0.9  
24  
1
1.1  
39  
V/V  
kΩ  
V/V  
Ω
Pin 6  
30  
Pin 6 to Pin 8  
Pin 9  
21.5  
560  
30  
24  
26.5  
840  
36  
Peak Detector Input Impedance  
Voltage Gain  
700  
33  
Pin 9 to Pin 10  
V/V  
μs  
Attack Time  
Measured to 90% of Final Value with  
10 kHz Tone Burst  
300  
500  
700  
Decay Time  
Measured to 90% of Final Value with  
10 kHz Tone Burst  
60  
45  
75  
ms  
V
DC Voltage Range  
Minimum Bandwidth to Maximum  
Bandwidth  
1.1  
3.8  
4
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SNAS551C DECEMBER 1994REVISED APRIL 2013  
Typical Performance Characteristics  
Supply Current vs Supply Voltage  
Channel Separation (Referred to the Output) vs Frequency  
Figure 2.  
Figure 3.  
Power Supply Rejection Ratio  
(Referred to the Output) vs Frequency  
THD vs Frequency  
Figure 4.  
Figure 5.  
Gain of Control Path vs Frequency  
(with 10 kHz FM Pilot Filter)  
3 dB Bandwidth vs Frequency and Control Signal  
Figure 6.  
Figure 7.  
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Typical Performance Characteristics (continued)  
Main Signal Path Bandwidth vs Voltage Control  
Peak Detector Response  
Figure 8.  
Figure 9.  
Output Response  
Figure 10.  
6
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SNAS551C DECEMBER 1994REVISED APRIL 2013  
External Component Guide  
(Figure 1)  
Component  
Value  
Purpose  
C1  
0.1 μF–100 μF  
May be part of power supply, or may be added to suppress power supply  
oscillation.  
C2, C13  
1 μF  
Blocks DC, pin 2 and pin 13 are at DC potential of VS/2. C2, C13 form a low  
frequency pole with 20k RIN  
.
C14  
25 μF–100 μF  
0.0033 μF  
Improves power supply rejection.  
C3, C12  
Forms integrator with internal gm block and op amp. Sets bandwidth  
conversion gain of 33 Hz/μA of gm current.  
C4, C11  
C5  
1 μF  
Output coupling capacitor. Output is at DC potential of VS/2.  
0.1 μF  
Works with R1 and R2 to attenuate low frequency transients which could  
disturb control path operation.  
C6  
0.001 μF  
Works with input resistance of pin 6 to form part of control path frequency  
weighting.  
C8  
0.1 μF  
Combined with L8 and CL forms 19 kHz filter for FM pilot. This is only  
required in FM applications(1)  
.
L8, CL  
C9  
4.7 mH, 0.015 μF  
0.047 μF  
Forms 19 kHz filter for FM pilot. L8 is Toko coil CAN-1A185HM(1)(2)  
.
Works with input resistance of pin 9 to form part of control path frequency  
weighting.  
C10  
1 μF  
1 kΩ  
Set attack and decay time of peak detector.  
R1, R2  
Sensitivity resistors set the noise threshold. Reducing attenuation causes  
larger signals to be peak detected and larger bandwidth in main signal path.  
Total value of R1 + R2 should equal 1 kΩ.  
R8  
100Ω  
Forms RC roll-off with C8. This is only required in FM applications.  
(1) When FM applications are not required, pin 8 and pin 9 hook-up as follows:  
(2) Toko America Inc., 1250 Feehanville Drive, Mt. Prospect IL 60056  
Circuit Operation  
The LM1894 has two signal paths, a main signal path and a bandwidth control path. The main path is an audio  
low pass filter comprised of a gm block with a variable current, and an op amp configured as an integrator. As  
seen in Figure 11, DC feedback constrains the low frequency gain to AV = 1. Above the cutoff frequency of the  
filter, the output decreases at 6 dB/oct due to the action of the 0.0033 μF capacitor.  
The purpose of the control paths is to generate a bandwidth control signal which replicates the ear's sensitivity to  
noise in the presence of a tone. A single control path is used for both channels to keep the stereo image from  
wandering. This is done by adding the right and left channels together in the summing amplifier of Figure 11. The  
R1, R2 resistor divider adjusts the incoming noise level to open slightly the bandwidth of the low pass filter.  
Control path gain is about 60 dB and is set by the gain amplifier and peak detector gain. This large gain is  
needed to ensure the low pass filter bandwidth can be opened by very low noise floors. The capacitors between  
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the summing amplifier output and the peak detector input determine the frequency weighting as shown in the  
Typical Performance Characteristics. The 1 μF capacitor at pin 10, in conjunction with internal resistors, sets the  
attack and decay times. The voltage is converted into a proportional current which is fed into the gm blocks. The  
bandwidth sensitivity to gm current is 33 Hz/μA. In FM stereo applications at 19 kHz pilot filter is inserted  
between pin 8 and pin 9 as shown in Figure 1.  
Figure 12 is an interesting curve and deserves some discussion. Although the output of the DNR system is a  
linear function of input signal, the 3 dB bandwidth is not. This is due to the non-linear nature of the control path.  
The DNR system has a uniform frequency response, but looking at the 3 dB bandwidth on a steady state basis  
with a single frequency input can be misleading. It must be remembered that a single input frequency can only  
give a single 3 dB bandwidth and the roll-off from this point must be a smooth 6 dB/oct.  
A more accurate evaluation of the frequency response can be seen in Figure 13. In this case the main signal  
path is frequency swept, while the control path has a constant frequency applied. It can be seen that different  
control path frequencies each give a distinctive gain roll-off.  
PSYCHOACOUSTIC BASICS  
The dynamic noise reduction system is a low pass filter that has a variable bandwidth of 1 kHz to 30 kHz,  
dependent on music spectrum. The DNR system operates on three principles of psychoacoustics.  
1. White noise can mask pure tones. The total noise energy required to mask a pure tone must equal the energy  
of the tone itself. Within certain limits, the wider the band of masking noise about the tone, the lower the noise  
amplitude need be. As long as the total energy of the noise is equal to or greater than the energy of the tone, the  
tone will be inaudible. This principle may be turned around; when music is present, it is capable of masking noise  
in the same bandwidth.  
2. The ear cannot detect distortion for less than 1 ms. On a transient basis, if distortion occurs in less than 1 ms,  
the ear acts as an integrator and is unable to detect it. Because of this, signals of sufficient energy to mask noise  
open bandwidth to 90% of the maximum value in less than 1 ms. Reducing the bandwidth to within 10% of its  
minimum value is done in about 60 ms: long enough to allow the ambience of the music to pass through, but not  
so long as to allow the noise floor to become audible.  
3. Reducing the audio bandwidth reduces the audibility of noise. Audibility of noise is dependent on noise  
spectrum, or how the noise energy is distributed with frequency. Depending on the tape and the recorder  
equalization, tape noise spectrum may be slightly rolled off with frequency on a per octave basis. The ear  
sensitivity on the other hand greatly increases between 2 kHz and 10 kHz. Noise in this region is extremely  
audible. The DNR system low pass filters this noise. Low frequency music will not appreciably open the DNR  
bandwidth, thus 2 kHz to 20 kHz noise is not heard.  
8
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SNAS551C DECEMBER 1994REVISED APRIL 2013  
Block Diagram  
Figure 11.  
Figure 12. Output vs Frequency  
Figure 13. 3 dB Bandwidth vs Frequency and  
Control Signal  
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APPLICATION HINTS  
The DNR system should always be placed before tone and volume controls as shown in Figure 1. This is  
because any adjustment of these controls would alter the noise floor seen by the DNR control path. The  
sensitivity resistors R1 and R2 may need to be switched with the input selector, depending on the noise floors of  
different sources, i.e., tape, FM, phono. To determine the value of R1 and R2 in a tape system for instance;  
apply tape noise (no program material) and adjust the ratio of R1 and R2 to open slightly the bandwidth of the  
main signal path. This can easily be done by viewing the capacitor voltage of pin 10 with an oscilloscope, or by  
using the circuit of Figure 14. This circuit gives an LED display of the voltage on the peak detector capacitor.  
Adjust the values of R1 and R2 (their sum is always 1 kΩ) to light the LEDs of pin 1 and pin 18. The LED bar  
graph does not indicate signal level, but rather instantaneous bandwidth of the two filters; it should not be used  
as a signal-level indicator. For greater flexibility in setting the bandwidth sensitivity, R1 and R2 could be replaced  
by a 1 kΩ potentiometer.  
To change the minimum and maximum value of bandwidth, the integrating capacitors, C3 and C12, can be  
scaled up or down. Since the bandwidth is inversely proportional to the capacitance, changing this 0.0039 μF  
capacitor to 0.0033 μF will change the typical bandwidth from 965 Hz–34 kHz to 1.1 kHz–40 kHz. With C3 and  
C12 set at 0.0033 μF, the maximum bandwidth is typically 34 kHz. A double pole double throw switch can be  
used to completely bypass DNR.  
The capacitor on pin 10 in conjunction with internal resistors sets the attack and decay times. The attack time  
can be altered by changing the size of C10. Decay times can be decreased by paralleling a resistor with C10,  
and increased by increasing the value of C10.  
When measuring the amount of noise reduction of the DNR system, the frequency response of the cassette  
should be flat to 10 kHz. The CCIR weighting network has substantial gain to 8 kHz and any additional roll-off in  
the cassette player will reduce the benefits of DNR noise reduction. A typical signal-to-noise measurement circuit  
is shown in Figure 15. The DNR system should be switched from maximum bandwidth to nominal bandwidth with  
tape noise as a signal source. The reduction in measured noise is the signal-to-noise ratio improvement.  
Figure 14. Bar Graph Display of Peak Detector Voltage  
10  
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Figure 15. Technique for Measuring S/N Improvement of the DNR System  
FOR FURTHER READING  
Tape Noise Levels  
1. “A Wide Range Dynamic Noise Reduction System”, Blackmer, “dB” Magazine,August-September 1972,  
Volume 6, #8.  
2. “Dolby B-Type Noise Reduction System”, Berkowitz and Gundry, Sert Journal,May-June 1974, Volume 8.  
3. “Cassette vs Elcaset vs Open Reel”, Toole, Audioscene Canada, April 1978.  
4. “CCIR/ARM: A Practical Noise Measurement Method”, Dolby, Robinson, Gundry, JAES,1978.  
Noise Masking  
1. “Masking and Discrimination”, Bos and De Boer, JAES, Volume 39, #4, 1966.  
2. “The Masking of Pure Tones and Speech by White Noise”, Hawkins and Stevens, JAES, Volume 22, #1,  
1950.  
3. “Sound System Engineering”, Davis Howard W. Sams and Co.  
4. “High Quality Sound Reproduction”, Moir, Chapman Hall, 1960.  
5. “Speech and Hearing in Communication”, Fletcher, Van Nostrand, 1953.  
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Printed Circuit Layout  
Figure 16. DNR Component Diagram  
12  
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SNAS551C DECEMBER 1994REVISED APRIL 2013  
REVISION HISTORY  
Changes from Revision B (April 2013) to Revision C  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 11  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM1894MX/NOPB  
ACTIVE  
SOIC  
D
14  
2500 RoHS & Green  
SN  
Level-1-260C-UNLIM  
0 to 70  
LM1894M  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Feb-2016  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM1894MX/NOPB  
SOIC  
D
14  
2500  
330.0  
16.4  
6.5  
9.35  
2.3  
8.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Feb-2016  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC 14  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
LM1894MX/NOPB  
D
2500  
Pack Materials-Page 2  
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