LM2429TE [TI]

IC,VIDEO AMPLIFIER,TRIPLE,BIPOLAR,ZIP,11PIN,PLASTIC;
LM2429TE
型号: LM2429TE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

IC,VIDEO AMPLIFIER,TRIPLE,BIPOLAR,ZIP,11PIN,PLASTIC

放大器
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October 2004  
LM2429  
Monolithic Triple Channel 15 MHz DTV Driver  
General Description  
Features  
n 0V to 5V input range  
The LM2429 is an integrated high voltage CRT driver circuit  
designed for use in DTV applications. The IC contains three  
high input impedance, wide band amplifiers which directly  
drive the RGB cathodes of a CRT. Each channel has its gain  
internally set to −51 and can drive CRT capacitive loads as  
well as resistive loads present in other applications, limited  
only by the package’s power dissipation.  
n Greater than 130VPP output swing capability  
n Stable with 0–20 pF capacitive loads and inductive  
peaking networks  
n Convenient TO-220 staggered thin lead package style  
Applications  
The IC is packaged in an industry standard 11-lead TO-220  
molded plastic power package designed specifically to meet  
high voltage spacing requirements. See Thermal Consider-  
ations section.  
n AC coupled DTV applications using the 480p format as  
well as standard NTSC and PAL formats.  
Connection Diagram  
Schematic Diagram  
20073102  
Note: Tab is at GND  
Top View  
Order Number LM2429  
20073101  
FIGURE 1. Simplified Connection and Pinout Diagram  
FIGURE 2. Simplified Schematic Diagram  
(One Channel)  
© 2004 National Semiconductor Corporation  
DS200731  
www.national.com  
Absolute Maximum Ratings (Notes 1,  
3)  
Operating Ranges (Note 2)  
VCC  
+130V to +180V  
+7V to +13V  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
VBB  
VIN  
+0V to +4V  
VOUT  
+15V to +175V  
Refer to Figure 11  
Supply Voltage (VCC  
)
+200V  
+15V  
Case Temperature  
Bias Voltage (VBB  
)
)
Do not operate the part without a heat sink.  
Input Voltage (VIN  
-0.5V to VBB +0.5V  
−65˚C to +150˚C  
Storage Temperature Range (TSTG  
Lead Temperature  
)
<
(Soldering, 10 sec.)  
300˚C  
ESD Tolerance,  
Human Body Model  
Machine Model  
Junction Temperature  
θJC (typ)  
2kV  
200V  
150˚C  
2.9˚C/W  
Electrical Characteristics  
(See Figure 3 for Test Circuit) Unless otherwise noted: VCC = +180V, VBB = +8V, CL = 8pF, TC = 50˚C. DC Tests: VIN  
=
2.5VDC. AC Tests: Output = 130VPP (35V - 165V) at 1MHz.  
LM2429  
Symbol  
ICC  
Parameter  
Supply Current  
Conditions  
Units  
Min  
Typical  
Max  
All Three Channels, No Input Signal,  
No Output Load  
16  
30  
mA  
IBB  
Bias Current  
All Three Channels  
12  
105  
168  
-51  
1.0  
8
17  
mA  
VDC  
VDC  
VOUT, 1  
VOUT, 2  
AV  
DC Output Voltage  
DC Output Voltage  
DC Voltage Gain  
Gain Matching  
Linearity Error  
Rise Time  
No AC Input Signal, VIN = 2.5VDC  
No AC Input Signal, VIN = 1.2VDC  
No AC Input Signal  
100  
163  
-48  
110  
173  
-54  
AV  
LE  
(Note 4), No AC Input Signal  
(Notes 4, 5), No AC Input Signal  
(Note 6), 10% to 90%  
dB  
%
tR  
26  
30  
5
ns  
ns  
%
tF  
Fall Time  
(Note 6), 90% to 10%  
OS  
Overshoot  
(Note 6)  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.  
Note 2: Operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and  
test conditions, see the Electrical Characteristics. Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. The guaranteed  
specifications apply only for the test conditions listed. Some performance characteristics may change when the device is not operated under the listed test  
conditions.  
Note 3: All voltages are measured with respect to GND, unless otherwise specified.  
Note 4: Calculated value from Voltage Gain test on each channel.  
Note 5: Linearity Error is the variation in DC gain from V = 1.1V to V = 3.8V.  
IN  
IN  
<
f
Note 6: Input from signal generator: t , t  
1 ns.  
r
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2
AC Test Circuit  
20073103  
Note: 8pF load includes parasitic capacitance.  
FIGURE 3. Test Circuit (One Channel)  
Figure 3 shows a typical test circuit for evaluation of the LM2429. This circuit is designed to allow testing of the LM2429 in a 50Ω  
environment without the use of an expensive FET probe. The two 4990resistors form a 400:1 divider with the 50resistor and  
the oscilloscope. A test point is included for easy use of an oscilloscope probe.The compensation capacitor is used to  
compensate the network to achieve flat frequency response.  
3
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Typical Performance Characteristics (VCC = +180VDC, VBB = +8VDC, CL = 8pF, VOUT = 130VPP  
(35V − 165V), Test Circuit - Figure 3 unless otherwise specified)  
20073105  
20073104  
FIGURE 7. Speed vs Load Capacitance  
FIGURE 4. VOUT vs VIN  
20073106  
20073108  
FIGURE 5. LM2429 Pulse Response  
FIGURE 8. Speed vs Offset  
20073118  
20073109  
FIGURE 6. Bandwidth  
FIGURE 9. Speed vs Case Temperature  
www.national.com  
4
Typical Performance Characteristics (VCC = +180VDC, VBB = +8VDC, CL = 8pF, VOUT = 130VPP  
(35V − 165V), Test Circuit - Figure 3 unless otherwise specified) (Continued)  
20073107  
FIGURE 10. Power Dissipation vs Frequency  
20073116  
FIGURE 11. Power Derating Curve  
20073119  
FIGURE 12. Cathode Pulse Response  
5
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Typical Performance Characteristics (VCC = +180VDC, VBB = +8VDC, CL = 8pF, VOUT = 130VPP  
(35V − 165V), Test Circuit - Figure 3 unless otherwise specified) (Continued)  
TABLE 1. Power Dissipation for Various Video Patterns  
Power Dissipation (W)  
Pattern  
Format  
480i  
480p  
1.8  
4.0  
3.1  
3.3  
2.8  
3.0  
2.7  
3.9  
2.6  
4.1  
7.3  
8.9  
4.3  
4.4  
6.2  
6.3  
7.1  
8.7  
11.4  
15.4  
Raster  
Full White Field  
1.8  
4.0  
3.1  
3.2  
2.7  
3.0  
2.7  
3.6  
2.3  
3.8  
5.2  
6.1  
3.4  
3.7  
5.0  
4.6  
5.0  
5.6  
7.2  
11.5  
White Box, 75% Screen Size  
Gray Bars  
Color Bars 75% Amplitude  
Color Bars 100% Amplitude  
SMPTE Color Bars  
SMPTE 133  
Cross Hatch 16x12  
Resolution Chart  
Multiburst  
White Text on Black Background  
Windows Pattern  
Windows Pattern  
Windows Pattern  
Vertical Lines 5 On 5 Off  
Vertical Lines 4 On 4 Off  
Vertical Lines 3 On 3 Off  
Vertical Lines 2 On 2 Off  
Vertical Lines 1 On 1 Off  
<
f
Note: Input from signal generator: t , t  
2 ns.  
r
Theory of Operation  
Application Hints  
The LM2429 is a high voltage monolithic three channel CRT  
driver suitable for HDTV applications. The LM2429 operates  
with 180V and 8V power supplies. The part is housed in the  
industry standard 11-lead TO-220 molded plastic power  
package with thin leads for improved metal-to-metal spacing.  
INTRODUCTION  
National Semiconductor (NSC) is committed to provide ap-  
plication information that assists our customers in obtaining  
the best performance possible from our products. The fol-  
lowing information is provided in order to support this com-  
mitment. The reader should be aware that the optimization of  
performance was done using a specific printed circuit board  
designed at NSC. Variations in performance can be realized  
due to physical changes in the printed circuit board and the  
application. Therefore, the designer should know that com-  
ponent value changes may be required in order to optimize  
performance in a given application. The values shown in this  
document can be used as a starting point for evaluation  
purposes. When working with high bandwidth circuits, good  
layout practices are also critical to achieving maximum per-  
formance.  
The circuit diagram of the LM2429 is shown in Figure 2. The  
PNP emitter follower, Q5, provides input buffering. Q1 and  
Q2 form a fixed gain cascode amplifier with resistors R1 and  
R2 setting the gain at −51. Emitter followers Q3 and Q4  
isolate the high output impedance of the cascode stage from  
the capacitance of the CRT cathode which decreases the  
sensitivity of the device to load capacitance. Q6 provides  
biasing to the output emitter follower stage to reduce cross-  
over distortion at low signal levels.  
Figure 3 shows a typical test circuit for evaluation of the  
LM2429. This circuit is designed to allow testing of the  
LM2429 in a 50environment without the use of an expen-  
sive FET probe. In this test circuit, the two 4.99kresistors  
form a 400:1 wideband, low capacitance probe when con-  
nected to a 50coaxial cable and a 50load (such as a  
50oscilloscope input). The input signal from the generator  
is ac coupled to the base of Q5.  
IMPORTANT INFORMATION  
The LM2429 performance is targeted for the HDTV market.  
The application circuits shown in this document to optimize  
performance and to protect against damage from CRT ar-  
cover are designed specifically for the LM2429. If another  
member of the LM242X family is used, please refer to its  
datasheet.  
www.national.com  
6
EFFECT OF OFFSET  
Application Hints (Continued)  
Figure 8 shows the variation in rise and fall times when the  
output offset of the device is varied from 95V to 105VDC. The  
rise time shows a variation of less than 8% relative to the  
center data point (100VDC). The fall time shows a variation of  
less than 9% relative to the center data point.  
POWER SUPPLY BYPASS  
Since the LM2429 is a wide bandwidth amplifier, proper  
power supply bypassing is critical for optimum performance.  
Improper power supply bypassing can result in large over-  
shoot, ringing or oscillation. 0.1µF capacitors should be con-  
nected from the supply pins, VCC and VBB, to ground, as  
close to the LM2429 as is practical. Additionally, a 22µF or  
larger electrolytic capacitor should be connected from both  
supply pins to ground reasonably close to the LM2429.  
THERMAL CONSIDERATIONS  
Figure 9 shows the performance of the LM2429 in the test  
circuit shown in Figure 3 as a function of case temperature.  
The figure shows that the rise and fall times of the LM2429  
increase by approximately 15% and 30%, respectively, as  
the case temperature increases from 50˚C to 90˚C. This  
corresponds to a speed degradation of 3.75% and 7.5% for  
every 10˚C rise in case temperature.  
ARC PROTECTION  
During normal CRT operation, internal arcing may occasion-  
ally occur. Spark gaps, in the range of 300V, connected from  
the CRT cathodes to CRT ground will limit the maximum  
voltage, but to a value that is much higher than allowable on  
the LM2429. This fast, high voltage, high energy pulse can  
damage the LM2429 output stage. The application circuit  
shown in Figure 13 is designed to help clamp the voltage at  
the output of the LM2429 to a safe level. The clamp diodes,  
D1 and D2, should have a fast transient response, high peak  
current rating, low series impedance and low shunt capaci-  
tance. 1SS83 or equivalent diodes are recommended. D1  
and D2 should have short, low impedance connections to  
VCC and ground respectively. The cathode of D1 should be  
located very close to a separately decoupled bypass capaci-  
tor (C3 in Figure 13). The ground connection of D2 and the  
decoupling capacitor should be very close to the LM2429  
ground. This will significantly reduce the high frequency  
voltage transients that the LM2429 would be subjected to  
during an arcover condition. Resistor R2 limits the arcover  
current that is seen by the diodes while R1 limits the current  
into the LM2429 as well as the voltage stress at the outputs  
Figure 10 shows the power dissipation of the LM2429 vs.  
Frequency when all three channels of the device are driving  
an 8pF load with a 130VPP alternating one pixel on, one pixel  
off signal. The graph assumes a 72% active time (device  
operating at the specified frequency) which is typical in a TV  
application. The other 28% of the time the device is assumed  
to be sitting at the black level (165V in this case). Table 1  
also shows the typical power dissipation of the LM2429 for  
various video patterns in the 480i and 480p video formats.  
Figure 10, Figure 11, and Table 1 give the designer the  
information needed to determine the heatsink requirement  
for the LM2429. For example, if an HDTV application uses  
the 480p format and "Vertical Lines 2 On 2 Off" is assumed  
to be the worst-case pattern to be displayed, then the power  
dissipated will be 11.4W (from Table 1). Figure 11 shows that  
the maximum allowed case temperature is 117˚C when  
11.4W is dissipated. If the maximum expected ambient tem-  
perature is 70˚C, then a maximum heatsink thermal resis-  
tance can be calculated:  
of the device. R2 should be a 1⁄  
2W solid carbon type resistor.  
1
R1 can be a ⁄  
4W metal or carbon film type resistor. Having  
large value resistors for R1 and R2 would be desirable, but  
this has the effect of increasing rise and fall times. Inductor  
L1 is critical to reduce the initial high frequency voltage  
levels that the LM2429 would be subjected to. The inductor  
will not only help protect the device but it will also help  
minimize rise and fall times as well as minimize EMI. For  
proper arc protection, it is important to not omit any of the arc  
protection components shown in Figure 13.  
This example assumes a capacitive load of 8pF and no  
resistive load. The designer should note that if the load  
capacitance is increased the AC component of the total  
power dissipation will also increase.  
Note: A LM126X preamplifier, with rise and fall times of about  
2 ns, was used to drive the LM2429 for these power mea-  
surements. Using a preamplifier with rise and fall times  
slower than the LM126X will cause the LM2429 to dissipate  
less power than shown in Table 1.  
OPTIMIZING TRANSIENT RESPONSE  
In Figure 13, there are three components (R1, R2 and L1)  
that can be adjusted to optimize the transient response of  
the application circuit. Increasing the values of R1 and R2  
will slow the circuit down while decreasing overshoot. In-  
creasing the value of L1 will speed up the circuit as well as  
increase overshoot. It is very important to use inductors with  
very high self-resonant frequencies, preferably above 300  
MHz. Ferrite core inductors from J.W. Miller Magnetics (part  
20073110  
FIGURE 13. One Channel of the LM2429 with the  
Recommended Application Circuit  
#
78FR_ _k) were used for optimizing the performance of the  
device in the NSC application board. The values shown in  
Figure 14 and Figure 15 can be used as a good starting point  
for the evaluation of the LM2429. Using a variable resistor  
for R1 will simplify finding the value needed for optimum  
performance in a given application. Once the optimum value  
is determined, the variable resistor can be replaced with a  
fixed value.  
EFFECT OF LOAD CAPACITANCE  
Figure 7 shows the effect of increased load capacitance on  
the speed of the device. This demonstrates the importance  
of knowing the load capacitance in the application.  
7
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C19VCC bypass capacitor, located very close to pin 2  
and ground pins  
Application Hints (Continued)  
Figure 12 shows the typical cathode pulse response with an  
C20VBB bypass capacitor, located close to pin 11 and  
ground  
output swing of 130VPP using a LM1269 preamplifier.  
C46, C48VCC bypass capacitors, near LM2429 and  
VCC clamp diodes. Very important for arc protection.  
PC BOARD LAYOUT CONSIDERATIONS  
For optimum performance, an adequate ground plane, iso-  
lation between channels, good supply bypassing and mini-  
mizing unwanted feedback are necessary. Also, the length of  
the signal traces from the preamplifier to the LM2429 and  
from the LM2429 to the CRT cathode should be as short as  
possible. The following references are recommended:  
The routing of the LM2429 outputs to the CRT is very critical  
to achieving optimum performance. Figure 17 shows the  
routing and component placement from pin 10 (V1OUT) of  
the LM2429 to the blue cathode. Note that the components  
are placed so that they almost line up from the output pin of  
the LM2429 to the blue cathode pin of the CRT connector.  
This is done to minimize the length of the video path be-  
tween these two components. Note also that D8, D9, R24  
and D6 are placed to minimize the size of the video nodes  
that they are attached to. This minimizes parasitic capaci-  
tance in the video path and also enhances the effectiveness  
of the protection diodes. The anode of protection diode D8 is  
connected directly to a section of the the ground plane that  
has a short and direct path to the LM2429 ground pins. The  
cathode of D9 is connected to VCC very close to decoupling  
capacitor C48 which is connected to the same section of the  
ground plane as D8. The diode placement and routing is  
very important for minimizing the voltage stress on the  
LM2429 during an arcover event. Lastly, notice that S3 is  
placed very close to the blue cathode and is tied directly to  
CRT ground.  
Ott, Henry W., “Noise Reduction Techniques in Electronic  
Systems”, John Wiley & Sons, New York, 1976.  
“Video Amplifier Design for Computer Monitors”, National  
Semiconductor Application Note 1013.  
Pease, Robert A., “Troubleshooting Analog Circuits”,  
Butterworth-Heinemann, 1991.  
Because of its high small signal bandwidth, the part may  
oscillate in a TV if feedback occurs around the video channel  
through the chassis wiring. To prevent this, leads to the video  
amplifier input circuit should be shielded, and input circuit  
wiring should be spaced as far as possible from output circuit  
wiring.  
TYPICAL APPLICATION  
A typical application of the LM2429 is shown in the sche-  
matic for the NSC demonstration board in Figure 14 and  
Figure 15. Used in conjunction with an LM126X preamplifier,  
a complete video channel from input to CRT cathode can be  
achieved. Performance is ideal for DTV applications. The  
NSC demonstration board can be used to evaluate the  
LM126X/LM2429 combination in a TV.  
This demonstration board uses large PCB holes to accom-  
modate socket pins, which function to allow for multiple  
insertions of the LM2429 in a convenient manner. To benefit  
from the enhanced LM2429 package with thin leads, the  
device should be secured in small PCB holes to optimize the  
metal-to-metal spacing between the leads.  
NSC DEMONSTRATION BOARD  
Figure 16 shows the routing and component placement on  
the NSC LM126X/LM2429 demonstration board. This board  
provides a good example of a layout that can be used as a  
guide for future layouts. Note the location of the following  
components:  
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8
Application Hints (Continued)  
20073111  
FIGURE 14. LM126X/LM242X/LM248X Demonstration Board Schematic  
9
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Application Hints (Continued)  
20073112  
FIGURE 15. LM126X/LM242X/LM248X Demonstration Board Schematic (continued)  
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10  
Application Hints (Continued)  
20073113  
FIGURE 16. LM126X/LM242X/LM248X Demonstration Board Layout  
20073114  
FIGURE 17. Trace Routing and Component Placement for Blue Channel Output  
11  
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Physical Dimensions inches (millimeters) unless otherwise noted  
CONTROLLING DIMENSION IS INCH  
VALUES IN [ ] ARE MILLIMETERS  
NS Package Number TE11B  
Order Number LM2429  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship  
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned  
Substances’’ as defined in CSP-9-111S2.  
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