LM25069 [TI]
具有功率限制和电源正常指示功能的 2.9V 至 17V 热插拔控制器;
| 型号： | LM25069 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有功率限制和电源正常指示功能的 2.9V 至 17V 热插拔控制器 控制器 |
| 文件： | 总31页 (文件大小：1534K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM25069
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SNVS607E –FEBRUARY 2011–REVISED MARCH 2013
LM25069 Positive Low Voltage Power Limiting Hot Swap Controller
Check for Samples: LM25069
1
FEATURES
APPLICATIONS
2
•
•
Operating R ange: +2.9V to +17V
•
•
•
Server Backplane Systems
In-rush Current Limit for Safe Board Insertion
into Live Power Sources
Base Station Power Distribution Systems
Solid State Circuit Breaker
•
Programmable Maximum Power Dissipation in
the External Pass Device
PACKAGE
•
•
Adjustable Current Limit
•
VSSOP-10
Circuit Breaker Function for Severe Over-
Current Events
DESCRIPTION
The LM25069 positive hot swap controller provides
intelligent control of the power supply voltage to the
load during insertion and removal of circuit cards from
a live system backplane or other "hot" power sources.
The LM25069 provides in-rush current control to limit
system voltage droop and transients. The current limit
and power dissipation in the external series pass N-
Channel MOSFET are programmable, ensuring
operation within the Safe Operating Area (SOA). The
POWER GOOD output indicates when the output
voltage is within 1.3V of the input voltage. The input
under-voltage and over-voltage lockout levels and
hysteresis are programmable, as well as the initial
insertion delay time and fault detection time. The
LM25069-1 latches off after a fault detection, while
the LM25069-2 automatically restarts at a fixed duty
cycle. The LM25069 is available in a 10 pin VSSOP
package.
•
•
•
•
Internal High Side Charge Pump and Gate
Driver for External N-channel MOSFET
Adjustable Under-Voltage Lockout (UVLO) and
Hysteresis
Adjustable Over-Voltage Lockout (OVLO) and
Hysteresis
Initial Insertion Timer Allows Ringing and
Transients to Subside After System
Connection
•
Programmable Fault Timer Avoids Nuisance
Trips
•
•
Active High Open Drain POWER GOOD Output
Available in Latched Fault and Automatic
Restart Versions
Typical Application
V
V
OUT
SYS
VIN
SENSE GATE
OUT
UVLO/EN
LM25069
Power
Good
PGD
PWR
OVLO
TIMER
GND
Figure 1. Positive Power Supply Control
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
LM25069
SNVS607E –FEBRUARY 2011–REVISED MARCH 2013
www.ti.com
Connection Diagram
1
10
SENSE
GATE
OUT
VIN
UVLO/EN
OVLO
2
3
9
8
PGD
PWR
4
5
7
6
TIMER
GND
Figure 2. Top View
10-Lead VSSOP
PIN DESCRIPTIONS
Pin #
Name
Description
Applications Information
1
SENSE
Current sense input
The voltage across the current sense resistor (RS) is measured from VIN to this pin. If
the voltage across RS reaches 50mV the load current is limited and the fault timer
activates.
2
3
VIN
Positive supply input
Under-voltage lockout
A small ceramic bypass capacitor close to this pin is recommended to suppress
transients which occur when the load current is switched off.
UVLO/EN
An external resistor divider from the system input voltage sets the under-voltage turn-
on threshold. An internal 20 µA current source provides hysteresis. The enable
threshold at the pin is 1.17V. This pin can also be used for remote shutdown control.
4
OVLO
Over-voltage lockout
An external resistor divider from the system input voltage sets the over-voltage turn-off
threshold. An internal 20 µA current source provides hysteresis. The disable threshold
at the pin is 1.16V.
5
6
GND
Circuit ground
TIMER
Timing capacitor
An external capacitor connected to this pin sets the insertion time delay and the Fault
Timeout Period. The capacitor also sets the restart timing of the LM25069-2.
7
8
PWR
PGD
Power limit set
An external resistor connected to this pin, in conjunction with the current sense resistor
(RS), sets the maximum power dissipation allowed in the external series pass
MOSFET.
Power Good indicator
An open drain output. When the external MOSFET VDS decreases below 1.3V, the
PGD indicator is active (high). When the external MOSFET VDS increases above 1.9V
the PGD indicator switches low.
9
OUT
Output feedback
Gate drive output
Connect to the output rail (external MOSFET source). Internally used to determine the
MOSFET VDS voltage for power limiting, and to control the PGD indicator.
10
GATE
Connect to the external MOSFET’s gate. This pin's voltage is limited at 19.5V above
ground.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings(1)(2)(3)
VIN to GND(4)
-0.3V to 20V
-0.3V to 20V
-0.3V to 20V
-0.3V to 20V
-0.3V to +0.3V
2kV
SENSE, OUT, PGD to GND
UVLO to GND
OVLO to GND
VIN to SENSE
ESD Rating(5)
Human Body Model
Storage Temperature
Junction Temperature
Lead Temperature (soldering 4 sec)
-65°C to +150°C
+150°C
+260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) For detailed information on soldering plastic VSSOP packages refer to the Packaging Databook available from Texas Instruments.
(4) Current out of a pin is indicated as a negative number.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Operating Ratings
VIN Supply Voltage
+2.9V to 17V
0V to 17V
PGD Off Voltage
Junction Temp. Range
−40°C to +85°C
Electrical Characteristics
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +85°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the
following conditions apply: VIN = 12V.
Symbol
Input (VIN pin)
IIN-EN
Parameter
Conditions
Min.
Typ.
Max.
Units
Input Current, enabled
UVLO = 2V and OVLO = 0.7V, VIN = 14V
UVLO = 0.7V or OVLO = 2V
VIN Increasing
1.6
1.0
2.6
150
2.4
1.6
2.8
mA
mA
V
IIN-DIS
Input Current, disabled
Power On Reset threshold at VIN
POR hysteresis
POR
PORHYS
VIN decreasing
mV
OUT pin
IOUT-EN
OUT bias current, enabled
OUT bias current, disabled(1)
OUT = VIN, Normal operation
0.30
-12
µA
IOUT-DIS
Disabled, OUT = 0V, SENSE = VIN
UVLO, OVLO pins
UVLOTH
UVLO threshold
UVLO hysteresis current
UVLO delay
1.154
15
1.17
20
1.183
26
V
UVLOHYS
UVLODEL
UVLO = 1V
µA
µs
Delay to GATE high
Delay to GATE low
UVLO = 3V
15
8.3
UVLOBIAS
OVLOTH
UVLO bias current
OVLO threshold
1
µA
V
1.142
-26
1.16
-20
16
1.185
-15
OVLOHYS
OVLODEL
OVLO hysteresis current
OVLO delay
OVLO = 2V
µA
µs
Delay to GATE high
Delay to GATE low
OVLO = 1V
8.2
OVLOBIAS
OVLO bias current
1
µA
(1) OUT bias current (disabled) due to leakage current through an internal 1.0 MΩ resistance from SENSE to VOUT.
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Electrical Characteristics (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +85°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the
following conditions apply: VIN = 12V.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Power Limit (PWR pin)
PWRLIM-1
PWRLIM-2
IPWR
Power limit sense voltage (VIN-SENSE) SENSE-OUT = 12V, RPWR = 69.8 kΩ
SENSE-OUT = 6V, RPWR = 34.8 kΩ
19
19
25
25
31
31
mV
mV
µA
Ω
PWR pin current
VPWR = 2.5V
UVLO = 0.7V
-15
140
RSAT(PWR)
PWR pin impedance when disabled
Gate Control (GATE pin)
IGATE
Source current
Sink current
Normal Operation
UVLO = 1V
-27
1.5
-20
2
-13
2.7
µA
mA
mA
VIN - SENSE = 150 mV or VIN < POR,
VGATE = 5V
160
260
375
VGATE
Current Limit
VCL
Gate output voltage in normal operation GATE voltage with respect to ground
18
45
19.5
21
55
V
Threshold voltage
Response time
VIN-SENSE voltage
50
15
23
12
62
mV
µs
tCL
VIN-SENSE stepped from 0 mV to 80 mV
Enabled, SENSE = OUT
Disabled, OUT = 0V
ISENSE
SENSE input current
µA
Enabled, OUT = 0V
Circuit Breaker
VCB
tCB
Threshold voltage
Response time
VIN - SENSE
75
95
110
mV
µs
VIN - SENSE stepped from 0 mV to 150
mV, time to GATE low, no load
0.19
0.36
Timer (TIMER pin)
VTMRH
Upper threshold
Lower threshold
1.6
0.9
1.72
1.0
0.3
0.3
-5.5
2
1.85
1.1
V
V
VTMRL
Restart cycles (LM25069-2)
End of 8th cycle (LM25069-2)
Re-enable Threshold (LM25069-1)
V
V
ITIMER
Insertion time current
-7.5
1.5
-3.5
2.5
-50
3.4
µA
mA
µA
µA
%
Sink current, end of insertion time
Fault detection current
Fault sink current
TIMER pin = 2V
-110
1.6
-80
2.5
0.67
20
DCFAULT
tFAULT
Fault Restart Duty Cycle
Fault to GATE low delay
LM25069-2 only
TIMER pin reaches the upper threshold
µs
Power Good (PGD pin)
PGDTH
Threshold measured at SENSE-OUT
Decreasing
1.3
0.6
15
1.9
V
Threshold Hysteresis
ISINK = 2 mA
PGDVOL
PGDIOH
Output low voltage
Off leakage current
30
1
mV
µA
VPGD = 17V
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Typical Performance Characteristics
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 12V
VIN Pin Input Current
vs.
VIN
SENSE Pin Input Current
Figure 3.
Figure 4.
OUT Pin Input Current
GATE Pin Voltage
Figure 5.
Figure 6.
GATE Pin Source Current
MOSFET Power Dissipation Limit
Figure 7.
Figure 8.
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Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 12V
PGD Pin Low Voltage
Input Current, Enabled
vs.
vs.
Sink Current
Temperature
Figure 9.
Figure 10.
UVLO Threshold
vs.
Temperature
UVLO Hysteresis Current
vs.
Temperature
Figure 11.
Figure 12.
OVLO Threshold
vs.
Temperature
OVLO Hysteresis Current
vs.
Temperature
Figure 13.
Figure 14.
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Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 12V
Current Limit Threshold
Circuit Breaker Threshold
vs.
vs.
Temperature
Temperature
Figure 15.
Figure 16.
Power Limit Threshold
vs.
GATE Output Voltage
vs.
Temperature
Temperature
Figure 17.
Figure 18.
GATE Source Current
vs.
PGD Low Voltage
vs.
Temperature
Temperature
Figure 19.
Figure 20.
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Block Diagram
LM25069
Charge
Pump
LDO
Bias
Circuit
Breaker
95 mV
20 mA
I
VIN
D
GATE
2 mA
19.5V
260 mA
Current
Limit
SENSE
Gate
Control
50 mV
Current Limit/
Power Limit
Control
1M
V
DS
Power
Limit
OUT
5.5 mA
Insertion
Timer
80 mA
Fault
Discharge
PGD
1.3V/
1.9V
TIMER
15 mA
PWR
2 mA
End
Insertion
Time
2.5 mA
Fault
Discharge
20 mA
1.72V
OVLO
1.16V
1.17V
1.0V
UVLO/EN
2.6V
VIN
0.3V
20 mA
POR
GND
Q1
V
OUT
V
SYS
R
S
C
L
C
IN
R1
R2
R3
SENSE GATE
OUT
UVLO/EN
R
R
PG
LM25069
Power
Good
PGD
PWR
OVLO
TIMER GND
PWR
C
T
Figure 21. Basic Application Circuit
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FUNCTIONAL DESCRIPTION
The LM25069 is designed to control the in-rush current to the load upon insertion of a circuit card into a live
backplane or other "hot" power source, thereby limiting the voltage sag on the backplane’s supply voltage, and
the dV/dt of the voltage applied to the load. Effects on other circuits in the system are minimized, preventing
possible unintended resets. A controlled shutdown when the circuit card is removed can also be implemented
using the LM25069. In addition to a programmable current limit, the LM25069 monitors and limits the maximum
power dissipation in the series pass device to maintain operation within the device Safe Operating Area (SOA).
Either current limiting or power limiting for an extended period of time results in the shutdown of the series pass
device. In this event, the LM25069-1 latches off until the circuit is re-enabled by external control, while the
LM25069-2 automatically restarts with defined timing. The circuit breaker function quickly switches off the series
pass device upon detection of a severe over-current condition. The Power Good (PGD) output pin indicates
when the output voltage is within 1.3V of the system input voltage (VSYS). Programmable under-voltage lock-out
(UVLO) and over-voltage lock-out (OVLO) circuits enable the LM25069 when the system input voltage is
between the desired thresholds. The typical configuration of a circuit card with LM25069 hot swap protection is
shown in Figure 22.
R
V
V
OUT
S
SYS
Q1
+12V
LIVE POWER
SOURCE
C
VIN
L
OUT
PGD
LOAD
LM25069
GND
GND
PLUG - IN BOARD
Figure 22. LM25069 Application
Power Up Sequence
The VIN operating range of the LM25069 is +2.9V to +17V, with a transient capability to 20V. Referring to the
Block Diagram and Figure 21 and Figure 23, as the voltage at VIN initially increases, the external N-channel
MOSFET (Q1) is held off by an internal 260 mA pull-down current at the GATE pin. The strong pull-down current
at the GATE pin prevents an inadvertent turn-on as the MOSFET’s gate-to-drain (Miller) capacitance is charged.
Additionally, the TIMER pin is initially held at ground. When the VIN voltage reaches the POR threshold the
insertion time begins. During the insertion time, the capacitor at the TIMER pin (CT) is charged by a 5.5 µA
current source, and Q1 is held off by a 2 mA pull-down current at the GATE pin regardless of the VIN voltage.
The insertion time delay allows ringing and transients at VIN to settle before Q1 is enabled. The insertion time
ends when the TIMER pin voltage reaches 1.72V. CT is then quickly discharged by an internal 2 mA pull-down
current. The GATE pin then switches on Q1 when VSYS exceeds the UVLO threshold. If VSYS is above the UVLO
threshold at the end of the insertion time, Q1 switches on at that time. The GATE pin charge pump sources 20
µA to charge Q1’s gate capacitance. The maximum voltage at the GATE pin is limited by an internal 19.5V zener
diode.
As the voltage at the OUT pin increases, the LM25069 monitors the drain current and power dissipation of
MOSFET Q1. In-rush current limiting and/or power limiting circuits actively control the current delivered to the
load. During the in-rush limiting interval (t2 in Figure 23) an internal 80 µA fault timer current source charges CT.
If Q1’s power dissipation and the input current reduce below their respective limiting thresholds before the
TIMER pin reaches 1.72V the 80 µA current source is switched off, and CT is discharged by the internal 2.5 µA
current sink (t3 in Figure 23). The in-rush limiting interval is complete when the voltage at the OUT pin increases
to within 1.3V of the input voltage (VSYS), and the PGD pin switches high.
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If the TIMER pin voltage reaches 1.72V before in-rush current limiting or power limiting ceases (during t2), a fault
is declared and Q1 is turned off. See the Fault Timer & Restart section for a complete description of the fault
mode.
V
SYS
UVLO
POR
V
IN
1.72V
2 mA
mA
80
mA
5.5
2.5 mA
TIMER
Pin
260 mA
pull-down
GATE
Pin
2 mA pull-down
20 mA source
I
LIMIT
Load
Current
Output
Voltage
1.3V
(OUT Pin)
PGD
t 3
Normal Operation
t 1
t 2
In-rush
Limiting
Insertion Time
Figure 23. Power Up Sequence (Current Limit only)
Gate Control
A charge pump provides the voltage at the GATE pin to enhance the N-Channel MOSFET’s gate. During normal
operating conditions (t3 in Figure 23) the gate of Q1 is held charged by an internal 20 µA current source. The
voltage at the GATE pin (with respect to ground) is limited by an internal 19.5V zener diode. See the graph
GATE Pin voltage. Since the gate-to-source voltage applied to Q1 could be as high as 19.5V during various
conditions, a zener diode with the appropriate voltage rating must be added between the GATE and OUT pins if
the maximum VGS rating of the selected MOSFET is less than 19.5V. The external zener diode must have a
forward current rating of at least 260 mA.
When the system voltage is initially applied, the GATE pin is held low by a 260 mA pull-down current. This helps
prevent an inadvertent turn-on of the MOSFET through its drain-gate capacitance as the applied system voltage
increases.
During the insertion time (t1 in Figure 23) the GATE pin is held low by a 2 mA pull-down current. This maintains
Q1 in the off-state until the end of t1, regardless of the voltage at VIN or UVLO.
Following the insertion time, during t2 in Figure 23, the gate voltage of Q1 is modulated to keep the current or
power dissipation level from exceeding the programmed levels. While in the current or power limiting mode the
TIMER pin capacitor is charging. If the current and power limiting cease before the TIMER pin reaches 1.72V the
TIMER pin capacitor then discharges, and the circuit enters normal operation.
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If the in-rush limiting condition persists such that the TIMER pin reached 1.72V during t2, the GATE pin is then
pulled low by the 2 mA pull-down current. The GATE pin is then held low until either a power up sequence is
initiated (LM25069-1), or until the end of the restart sequence (LM25069-2). See the Fault Timer & Restart
section.
If the system input voltage falls below the UVLO threshold, or rises above the OVLO threshold, the GATE pin is
pulled low by the 2 mA pull-down current to switch off Q1.
Current Limit
The current limit threshold is reached when the voltage across the sense resistor RS (VIN to SENSE) reaches 50
mV. In the current limiting condition, the GATE voltage is controlled to limit the current in MOSFET Q1. While the
current limit circuit is active, the fault timer is active as described in the Fault Timer & Restart section. If the load
current falls below the current limit threshold before the end of the Fault Timeout Period, the LM25069 resumes
normal operation. For proper operation, the RS resistor value should be no larger than 200 mΩ. Higher values
may result in instability in the current limit control loop.
Circuit Breaker
If the load current increases rapidly (e.g., the load is short-circuited) the current in the sense resistor (RS) may
exceed the current limit threshold before the current limit control loop is able to respond. If the current exceeds
approximately twice the current limit threshold (95 mV/RS), Q1 is quickly switched off by the 260 mA pull-down
current at the GATE pin, and a Fault Timeout Period begins. When the voltage across RS falls below 95 mV the
260 mA pull-down current at the GATE pin is switched off, and the gate voltage of Q1 is then determined by the
current limit or the power limit functions. If the TIMER pin reaches 1.72V before the current limiting or power
limiting condition ceases, Q1 is switched off by the 2 mA pull-down current at the GATE pin as described in the
Fault Timer & Restart section.
Power Limit
An important feature of the LM25069 is the MOSFET power limiting. The Power Limit function can be used to
maintain the maximum power dissipation of MOSFET Q1 within the device SOA rating. The LM25069 determines
the power dissipation in Q1 by monitoring its drain-source voltage (SENSE to OUT), and the drain current
through the sense resistor (VIN to SENSE). The product of the current and voltage is compared to the power
limit threshold programmed by the resistor at the PWR pin. If the power dissipation reaches the limiting threshold,
the GATE voltage is modulated to regulate the current in Q1. While the power limiting circuit is active, the fault
timer is active as described in the Fault Timer & Restart section.
Fault Timer & Restart
When the current limit or power limit threshold is reached during turn-on or as a result of a fault condition, the
gate-to-source voltage of Q1 is modulated to regulate the load current and power dissipation in Q1. When either
limiting function is activated, an 80 µA fault timer current source charges the external capacitor (CT) at the
TIMER pin as shown in Figure 25 (Fault Timeout Period). If the fault condition subsides during the Fault Timeout
Period before the TIMER pin reaches 1.72V, the LM25069 returns to the normal operating mode and CT is
discharged by the 2.5 µA current sink. If the TIMER pin reaches 1.72V during the Fault Timeout Period, Q1 is
switched off by a 2 mA pull-down current at the GATE pin. The subsequent restart procedure then depends on
which version of the LM25069 is in use.
The LM25069-1 latches the GATE pin low at the end of the Fault Timeout Period. CT is then discharged to
ground by the 2.5 µA fault current sink. The GATE pin is held low by the 2 mA pull-down current until a power up
sequence is externally initiated by cycling the input voltage (VSYS), or momentarily pulling the UVLO pin below its
threshold with an open-collector or open-drain device as shown in Figure 24. The voltage at the TIMER pin must
be less than 0.3V for the restart procedure to be effective.
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V
SYS
VIN
R1
UVLO/EN
Restart
Control
LM25069-1
R2
R3
OVLO
GND
Figure 24. Latched Fault Restart Control
The LM25069-2 provides an automatic restart sequence which consists of the TIMER pin cycling between 1.72V
and 1V seven times after the Fault Timeout Period, as shown in Figure 25. The period of each cycle is
determined by the 80 µA charging current, and the 2.5 µA discharge current, and the value of the capacitor CT.
When the TIMER pin reaches 0.3V during the eighth high-to-low ramp, the 20 µA current source at the GATE pin
turns on Q1. If the fault condition is still present, the Fault Timeout Period and the restart cycle repeat.
The Fault Timeout Period during restart cycles is approximately 18% shorter than the initial fault timeout period
which initiated the restart cycle. This is due to the fact that the TIMER pin transitions from 0.3V to 1.72V after
each restart time, rather than from ground.
Fault
Detection
I
LIMIT
Load
Current
20 mA
Gate Charge
2 mA
pulldown
GATE
Pin
2.5 mA
1.72V
80 mA
TIMER
Pin
1V
1
2
3
7
8
0.3V
t
Fault Timeout
Period
RESTART
Figure 25. Restart Sequence (LM25069-2)
Under-Voltage Lock-Out (UVLO)
The series pass MOSFET (Q1) is enabled when the input supply voltage (VSYS) is within the operating range
defined by the programmable under-voltage lockout (UVLO) and over-voltage lock-out (OVLO) levels. Typically
the UVLO level at VSYS is set with a resistor divider (R1-R3) as shown in Figure 21. Refering to the Block
Diagram when VSYS is below the UVLO level, the internal 20 µA current source at UVLO is enabled, the current
source at OVLO is off, and Q1 is held off by the 2 mA pull-down current at the GATE pin. As VSYS is increased,
raising the voltage at UVLO above its threshold the 20 µA current source at UVLO is switched off, increasing the
voltage at UVLO, providing hysteresis for this threshold. With the UVLO pin above its threshold, Q1 is switched
on by the 20 µA current source at the GATE pin if the insertion time delay has expired. See the Applications
Section for a procedure to calculate the values of the threshold setting resistors (R1-R3). The minimum possible
UVLO level at VSYS can be set by connecting the UVLO pin to VIN. In this case Q1 is enabled after the insertion
time.
Over-Voltage Lock-Out (OVLO)
The series pass MOSFET (Q1) is enabled when the input supply voltage (VSYS) is within the operating range
defined by the programmable under-voltage lockout (UVLO) and over-voltage lock-out (OVLO) levels. If VSYS
raises the OVLO pin voltage above its threshold Q1 is switched off by the 2 mA pull-down current at the GATE
pin, denying power to the load. When the OVLO pin is above its threshold, the internal 20 µA current source at
OVLO is switched on, raising the voltage at OVLO to provide threshold hysteresis. When VSYS is reduced below
the OVLO level Q1 is enabled. See the Applications Section for a procedure to calculate the threshold setting
resistor values.
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Shutdown Control
The load current can be remotely switched off by taking the UVLO pin below its threshold with an open collector
or open drain device, as shown in Figure 26. Upon releasing the UVLO pin the LM25069 switches on the load
current with in-rush current and power limiting.
V
SYS
VIN
R1
UVLO/EN
LM25069
Shutdown
Control
R2
R3
OVLO
GND
Figure 26. Shutdown Control
Power Good Pin
The Power Good indicator pin (PGD) is connected to the drain of an internal N-channel MOSFET capable of
sustaining 17V in the off-state, and transients up to 20V. An external pull-up resistor is required at PGD to an
appropriate voltage to indicate the status to downstream circuitry. The off-state voltage at the PGD pin can be
higher or lower than the voltages at VIN and OUT. PGD is switched high when the voltage from SENSE to OUT
(the external MOSFET’s VDS) decreases below 1.3V. PGD switches low when the MOSFET’s VDS is increased
past 1.9V. If the UVLO pin is taken below its threshold or the OVLO pin taken above its threshold, to disable the
LM25069, PGD switches low within 10 µs without waiting for the voltage at OUT to fall. The PGD output pin is
high when the voltage at VIN is less than 1.6V.
Application Information (Refer to Figure 21)
CURRENT LIMIT, RS
The LM25069 monitors the current in the external MOSFET (Q1) by measuring the voltage across the sense
resistor (RS), connected from VIN to SENSE. The required resistor value is calculated from:
50 mV
RS =
ILIM
where
•
ILIM is the desired current limit threshold
(1)
If the voltage across RS reaches 50 mV, the current limit circuit modulates the gate of Q1 to regulate the current
at ILIM. While the current limiting circuit is active, the fault timer is active as described in the Fault Timer & Restart
section. For proper operation, RS must be no larger than 200 mΩ.
While the maximum load current in normal operation can be used to determine the required power rating for
resistor RS, basing it on the current limit value provides a more reliable design since the circuit can operate near
the current limit threshold continuously. The resistor’s surge capability must also be considered since the circuit
breaker threshold is approximately twice the current limit threshold. Connections from RS to the LM25069 should
be made using Kelvin techniques. In the suggested layout of Figure 27 the small pads at the lower corners of the
sense resistor connect only to the sense resistor terminals, and not to the traces carrying the high current. With
this technique, only the voltage across the sense resistor is applied to VIN and SENSE, eliminating the voltage
drop across the high current solder connections.
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HIGH CURRENT PATH
FROM
TO MOSFET' S
DRAIN
SENSE
RESISTOR
RS
SYSTEM
INPUT
VOLTAGE
SENSE
10
VIN
3
9
8
7
LM25069
4
5
6
Figure 27. Sense Resistor Connections
POWER LIMIT THRESHOLD
The LM25069 determines the power dissipation in the external MOSFET (Q1) by monitoring the drain current
(the current in RS), and the VDS of Q1 (SENSE to OUT pins). The resistor at the PWR pin (RPWR) sets the
maximum power dissipation for Q1, and is calculated from the following equation:
RPWR = 2.32 x 105 x RS x PFET(LIM)
where
•
•
PFET(LIM) is the desired power limit threshold for Q1
RS is the current sense resistor described in the Current Limit section
(2)
For example, if RS is 10 mΩ , and the desired power limit threshold is 20W, RPWR calculates to 46.4 kΩ. If Q1’s
power dissipation reaches the threshold Q1’s gate is modulated to regulate the load current, keeping Q1’s power
from exceeding the threshold. For proper operation of the power limiting feature, RPWR must be ≤150 kΩ. While
the power limiting circuit is active, the fault timer is active as described in the Fault Timer & Restart section.
Typically, power limit is reached during startup, or if the output voltage falls due to a severe overload or short
circuit.
The programmed maximum power dissipation should have a reasonable margin from the maximum power
defined by the FET's SOA chart if the LM25069-2 is used since the FET will be repeatedly stressed during fault
restart cycles. The FET manufacturer should be consulted for guidelines.
If the application does not require use of the power limit function the PWR pin can be left open.
The accuracy of the power limit function at turn-on may degrade if a very low value power dissipation limit is set.
The reason for this caution is that the voltage across the sense resistor, which is monitored and regulated by the
power limit circuit, is lowest at turn-on when the regulated current is at minimum. The voltage across the sense
resistor during power limit can be expressed as follows:
RPWR
2.32 x 105 x VDS
RS x PFET(LIM)
VDS
VSENSE = IL x RS =
=
where
•
•
IL is the current in RS
VDS is the voltage across Q1
(3)
For example, if the power limit is set at 20W with RS = 10 mohms, and VDS = 15V the sense resistor voltage
calculates to 13.3 mV, which is comfortably regulated by the LM25069. However, if a lower power limit is set
lower (e.g., 2W), the sense resistor voltage calculates to 1.33 mV. At this low level noise and offsets within the
LM25069 may degrade the power limit accuracy. To maintain accuracy, the sense resistor voltage should not be
less than 5 mV.
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TURN-ON TIME
The output turn-on time depends on whether the LM25069 operates in current limit, or in both power limit and
current limit, during turn-on.
A) Turn-on with current limit only: The current limit threshold (ILIM) is determined by the current sense resistor
(RS). If the current limit threshold is less than the current defined by the power limit threshold at maximum VDS
the circuit operates at the current limit threshold only during turn-on. Referring to Figure 30a, as the load current
reaches ILIM, the gate-to-source voltage is controlled at VGSL to maintain the current at ILIM. As the output voltage
reaches its final value, (VDS ≊ 0V) the drain current reduces to its normal operating value. The time for the OUT
pin voltage to transition from zero volts to VSYS is equal to:
VSYS x CL
tON
=
ILIM
where
•
CL is the load capacitance
(4)
For example, if VSYS = 12V, CL = 1000 µF, and ILIM = 1A, tON calculates to 12 ms. The maximum instantaneous
power dissipated in the MOSFET is 12W. This calculation assumes the time from t1 to t2 in Figure 30a is small
compared to tON, and the load does not draw any current until after the output voltage has reached its final value,
and PGD switches high (Figure 28). If the load draws current during the turn-on sequence (Figure 29), the turn-
on time is longer than the above calculation, and is approximately equal to:
(ILIM x RL) - VSYS
tON = -(RL x CL) x In
(ILIM x RL)
where
•
RL is the load resistance
(5)
The Fault Timeout Period must be set longer than tON to prevent a fault shutdown before the turn-on sequence is
complete.
R
S
Q1
V
SYS
OUT
VIN
PGD
LM25069
C
L
R
L
GND
GND
Figure 28. No Load Current During Turn-On
R
S
Q1
V
SYS
C
OUT
PGD
VIN
L
R
L
LM25069
GND
GND
Figure 29. Load Draws Current During Turn-On
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B) Turn-on with power limit and current limit: The maximum allowed power dissipation in Q1 (PFET(LIM)) is
defined by the resistor at the PWR pin, and the current sense resistor RS. See the POWER LIMIT THRESHOLD
section. If the current limit threshold (ILIM) is higher than the current defined by the power limit threshold at
maximum VDS (PFET(LIM)/VSYS) the circuit operates initially in the power limit mode when the VDS of Q1 is high,
and then transitions to current limit mode as the current increases to ILIM and VDS decreases. See Figure 30b.
Assuming the load (RL) is not connected during turn-on, the time for the output voltage to reach its final value is
approximately equal to:
2
CL x PFET(LIM)
CL x VSYS
tON
=
+
2
2 x PFET(LIM)
2 x ILIM
(6)
For example, if VSYS = 12V, CL = 1000 µF, ILIM = 1A, and PFET(LIM) = 10W, tON calculates to ≊12.2 ms, and the
initial current level (IP) is approximately 0.83A. The Fault Timeout Period must be set longer than tON
.
V
SYS
V
SYS
V
DS
V
DS
Drain Current
Drain Current
I
I
LIM
LIM
0
I
P
0
V
GATE
V
GATE
Gate-to-Source Voltage
V
GSL
V
GSL
V
TH
V
TH
t
t
ON
ON
0
0
t3
t1 t2
0
0
a) Current Limit Only
b) Power Limit and Current Limit
Figure 30. MOSFET Power Up Waveforms
MOSFET SELECTION
It is recommended that the external MOSFET (Q1) selection be based on the following criteria:
•
•
•
•
The BVDSS rating should be greater than the maximum system voltage (VSYS), plus ringing and transients
which can occur at VSYS when the circuit card, or adjacent cards, are inserted or removed.
The maximum continuous current rating should be based on the current limit threshold (50 mV/RS), not the
maximum load current, since the circuit can operate near the current limit threshold continuously.
The Pulsed Drain Current spec (IDM) must be greater than the current threshold for the circuit breaker function
(95 mV/RS).
The SOA (Safe Operating Area) chart of the device, and the thermal properties, should be used to determine
the maximum power dissipation threshold set by the RPWR resistor. The programmed maximum power
dissipation should have a reasonable margin from the maximum power defined by the FET's SOA chart if the
LM25069-2 is used since the FET will be repeatedly stressed during fault restart cycles. The FET
manufacturer should be consulted for guidelines.
2
•
RDS(on) should be sufficiently low that the power dissipation at maximum load current (IL(max) x RDS(on)) does
not raise its junction temperature above the manufacturer’s recommendation.
If the circuit’s input voltage is at the low end of the LM25069’s operating range (<3.5V), or at the high end of the
operating range (>14V), the gate-to-source voltage applied to the MOSFET by the LM25069 is less than 5V, and
can approach 1V in a worst case situation. See the graph “ GATE Pin voltage”. The selected device must have a
suitable Gate-to-Source Threshold Voltage.
The gate-to-source voltage provided by the LM25069 can be as high as 19.5V at turn-on when the output voltage
is zero. At turn-off the reverse gate-to-source voltage will be equal to the output voltage at the instant the GATE
pin is pulled low. If the device chosen for Q1 is not rated for these voltages, an external zener diode must be
added from its gate to source, with the zener voltage less than the device maximum VGS rating. The zener
diode’s working voltage protects the MOSFET during turn-on, and its forward voltage protects the MOSFET
during shutoff. The zener diode’s forward current rating must be at least 260 mA to conduct the GATE pull-down
current when a circuit breaker condition is detected.
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TIMER CAPACITOR, CT
The TIMER pin capacitor (CT) sets the timing for the insertion time delay, fault timeout period, and restart timing
of the LM25069-2.
A) Insertion Delay - Upon applying the system voltage (VSYS) to the circuit, the external MOSFET (Q1) is held
off during the insertion time (t1 in Figure 23) to allow ringing and transients at VSYS to settle. Since each
backplane’s response to a circuit card plug-in is unique, the worst case settling time must be determined for each
application. The insertion time starts when VIN reaches the POR threshold, at which time the internal 5.5 µA
current source charges CT from 0V to 1.72V. The required capacitor value is calculated from:
t1 x 5.5 mA
= t1 x 3.2 x 10-6
CT =
1.72V
(7)
For example, if the desired insertion delay is 250 ms, CT calculates to 0.8 µF. At the end of the insertion delay,
CT is quickly discharged by a 2 mA current sink.
B) Fault Timeout Period - During in-rush current limiting or upon detection of a fault condition where the current
limit and/or power limit circuits regulate the current through Q1, the fault timer current source (80 µA) switches on
to charge CT. The Fault Timeout Period is the time required for the voltage at the TIMER pin to transition from
ground to 1.72V, at which time Q1 is switched off. If the LM25069-1 is in use, the required capacitor value is
calculated from:
tFAULT x 80 mA
= tFAULT x 4.65 x 10-5
CT =
1.72V
(8)
For example, if the desired Fault Timeout Period is 17 ms, CT calculates to 0.8 µF. When the Fault Timeout
Period expires, the LM25069-1 latches the GATE pin low until a power-up sequence is initiated by external
circuitry. If the LM25069-2 is in use, the Fault Timeout Period during restart cycles is approximately 18% shorter
than the initial fault timeout period which initiated the restart cycles since the voltage at the TIMER pin transitions
from 0.3V to 1.72V. Since the Fault Timeout Period must always be longer than the turn-on-time, the required
capacitor value for the LM25069-2 is calculated using this shorter time period:
tFAULT x 80 mA
= tFAULT x 5.63 x 10-5
CT =
1.42V
(9)
For example, if the desired Fault Timeout Period is 17 ms, CT calculates to 0.96 µF. When the Fault Timeout
Period of the LM25069-2 expires, a restart sequence starts as described below (Restart Timiing). Since the
LM25069 normally operates in power limit and/or current limit during a power-up sequence, the Fault Timeout
Period MUST be longer than the time required for the output voltage to reach its final value. See the TURN-ON
TIME section
C) Restart Timing For the LM25069-2, after the Fault Timeout Period described above, CT is discharged by the
2.5 µA current sink to 1.0V. The TIMER pin then cycles through seven additional charge/discharge cycles
between 1V and 1.72V as shown in Figure 25. The restart time ends when the TIMER pin voltage reaches 0.3V
during the final high-to-low ramp. The restart time, after the Fault Timeout Period, is equal to:
1.42V
7 x 0.72V
7 x 0.72V
tRESTART = CT x
+
+
2.5 mA
80 mA
2.5 mA
= CT x 2.65 x 106
(10)
For example, if CT = 0.8 µF, tRESTART = 2.12 seconds. At the end of the restart time, Q1 is switched on. If the fault
is still present, the fault timeout and restart sequence repeats. The on-time duty cycle of Q1 is approximately
0.67% in this mode.
UVLO, OVLO
By programming the UVLO and OVLO thresholds the LM25069 enables the series pass device (Q1) when the
input supply voltage (VSYS) is within the desired operational range. If VSYS is below the UVLO threshold, or above
the OVLO threshold, Q1 is switched off, denying power to the load. Hysteresis is provided for each threshold.
Option A: The configuration shown in Figure 31 requires three resistors (R1-R3) to set the thresholds.
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V
SYS
VIN
20 mA
LM25069
R1
UVLO
OVLO
1.17V
1.16V
TIMER AND GATE
LOGIC CONTROL
R2
R3
20 mA
GND
Figure 31. UVLO and OVLO Thresholds Set By R1-R3
The procedure to calculate the resistor values is as follows:
•
•
•
Choose the upper UVLO threshold (VUVH), and the lower UVLO threshold (VUVL).
Choose the upper OVLO threshold (VOVH).
The lower OVLO threshold (VOVL ) cannot be chosen in advance in this case, but is determined after the
values for R1-R3 are determined. If VOVL must be accurately defined in addition to the other three thresholds,
see Option B below.
The resistors are calculated as follows:
VUV(HYS)
VUVH - VUVL
R1 =
R3 =
R2 =
=
20 mA
20 mA
(11)
(12)
(13)
1.16V x R1 x VUVL
VOVH x (VUVL œ 1.17V)
1.17V x R1
- R3
VUVL - 1.17V
The lower OVLO threshold is calculated from:
VOVL = [(R1 + R2) x ((1.16V) - 20 mA)] + 1.16V
R3
(14)
As an example, assume the application requires the following thresholds: VUVH = 8V, VUVL = 7V, VOVH = 15V.
8V - 7V
1V
R1 =
= 50 kW
=
20 mA
20 mA
(15)
(16)
(17)
1.16V x 50 kW x 7V
15V x (7V - 1.17V)
R3 =
= 4.64 kW
1.17V x 50 kW
(7V œ 1.17V)
- 4.64 kW = 5.39 kW
R2 =
The lower OVLO threshold calculates to 13.9V, and the OVLO hysteresis is 1.1V. Note that the OVLO hysteresis
is always slightly greater than the UVLO hysteresis in this configuration. When the R1-R3 resistor values are
known, the threshold voltages and hysteresis are calculated from the following:
1.17V
(R2 + R3)
VUVH = 1.17V + [R1 x (20 mA +
)]
(18)
1.17V x (R1 + R2 + R3)
VUVL
=
R2 + R3
(19)
(20)
VUV(HYS) = R1 x 20 µA
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1.16V x (R1 + R2 + R3)
R3
VOVH
=
(21)
VOVL = [(R1 + R2) x ((1.16V) - 20 mA)] + 1.16V
R3
(22)
(23)
VOV(HYS) = (R1 + R2) x 20 µA
Option B: If all four thresholds must be accurately defined, the configuration in Figure 32 can be used.
V
SYS
VIN
20 mA
LM25069
R1
R2
UVLO
OVLO
1.17V
1.16V
TIMER AND GATE
LOGIC CONTROL
R3
R4
20 mA
GND
Figure 32. Programming the Four Thresholds
The four resistor values are calculated as follows:
•
Choose the upper and lower UVLO thresholds (VUVH) and (VUVL).
VUV(HYS)
VUVH - VUVL
R1 =
=
20 mA
20 mA
(24)
(25)
1.17V x R1
R2 =
(VUVL - 1.17V)
•
Choose the upper and lower OVLO threshold (VOVH) and (VOVL).
VOV(HYS)
VOVH - VOVL
R3 =
=
20 mA
20 mA
(26)
(27)
1.16V x R3
(VOVH - 1.16V)
R4 =
As an example, assume the application requires the following thresholds: VUVH = 8V, VUVL = 7V, VOVH = 15.5V,
and VOVL = 14V. Therefore VUV(HYS) = 1V, and VOV(HYS) = 1.5V. The resistor values are:
R1 = 50 kΩ, R2 = 10 kΩ
R3 = 75 kΩ, R4 = 6.07 kΩ
Where the R1-R4 resistor values are known, the threshold voltages and hysteresis are calculated from the
following:
VUVH = 1.17V + [R1 x (1.17V + 20 mA)]
R2
(28)
1.17V x (R1 + R2)
VUVL
=
R2
(29)
(30)
VUV(HYS) = R1 x 20 µA
1.16V x (R3 + R4)
VOVH
=
R4
(31)
VOVL = 1.16V + [R3 x (1.16V - 20 mA)]
R4
(32)
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VOV(HYS) = R3 x 20 µA
(33)
Option C: The minimum UVLO level is obtained by connecting the UVLO pin to VIN as shown in Figure 33. Q1
is switched on when the VIN voltage reaches the POR threshold (≊2.6V). The OVLO thresholds are set using
R3, R4. Their values are calculated using the procedure in Option B.
V
SYS
VIN
20
A
LM25069
10k
UVLO
1.17V
1.16V
TIMER AND GATE
LOGIC CONTROL
R3
R4
Shutdown/
Restart
Control
OVLO
20
A
GND
Figure 33. UVLO = POR with Shutdown/Restart Control
Option D: The OVLO function can be disabled by grounding the OVLO pin. The UVLO thresholds are set as
described in Option B or Option C.
POWER GOOD PIN
During turn-on, the Power Good pin (PGD) is high until the voltage at VIN increases above ≊ 1.6V. PGD then
switches low, remaining low as the VIN voltage increases. When the voltage at OUT increases to within 1.3V of
the SENSE pin (VDS <1.3V), PGD switches high. PGD switches low if the VDS of Q1 increases above 1.9V. A
pull-up resistor is required at PGD as shown in Figure 34. The pull-up voltage (VPGD) can be as high as 17V, and
can be higher or lower than the voltages at VIN and OUT.
V
PGD
R
PG
LM25069
Power
Good
PGD
GND
Figure 34. Power Good Output
If a delay is required at PGD, suggested circuits are shown in Figure 35. In Figure 35a, capacitor CPG adds delay
to the rising edge, but not to the falling edge. In Figure 35b, the rising edge is delayed by RPG1 + RPG2 and CPG
,
while the falling edge is delayed a lesser amount by RPG2 and CPG. Adding a diode across RPG2 (Figure 35c)
allows for equal delays at the two edges, or a short delay at the rising edge and a long delay at the falling edge.
V
PGD
V
V
PGD
R
PGD
R
PG1
PG1
R
PG1
LM25069
LM25069
LM25069
R
PG2
Power
Good
PG
Power
Good
Power
Good
PG
R
PGD
PGD
PGD
PG2
C
C
C
PG
GND
GND
GND
b)
c)
Long delay at rising edge,
short delay at falling edge
a)
Short Delay at Rising Edge and
Long Delay at Falling Edge or
Equal Delays
Delay Rising Edge Only
Figure 35. Adding Delay to the Power Good Output Pin
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Design-in Procedure
The recommended design-in procedure is as follows:
•
Determine the current limit threshold (ILIM). This threshold must be higher than the normal maximum load
current, allowing for tolerances in the current sense resistor value and the LM25069 Current Limit threshold
voltage. Use equation 1 to determine the value for RS.
•
•
Determine the maximum allowable power dissipation for the series pass FET (Q1), using the device’s SOA
information. Use equation 2 to determine the value for RPWR
.
Determine the value for the timing capacitor at the TIMER pin (CT) using equation 3 or equation 4. The fault
timeout period (tFAULT) must be longer than the circuit’s turn-on-time. The turn-on time can be estimated using
the equations in the TURN-ON TIME section of this data sheet, but should be verified experimentally. Review
the resulting insertion time, and restart timing if the LM25069-2 is used.
•
•
Choose option A, B, C, or D from the UVLO, OVLO section of the Application Information for setting the
UVLO and OVLO thresholds and hysteresis. Use the procedure for the appropriate option to determine the
resistor values at the UVLO and OVLO pins.
Choose the appropriate voltage, and pull-up resistor, for the Power Good output.
PC Board Guidelines
The following guidelines should be followed when designing the PC board for the LM25069:
•
Place the LM25069 close to the board’s input connector to minimize trace inductance from the connector to
the FET.
•
Place a small capacitor (1000 pF) directly adjacent to the VIN and GND pins of the LM25069 to help minimize
transients which may occur on the input supply line. Transients of several volts can easily occur when the
load current is shut off.
•
•
•
The sense resistor (RS) should be close to the LM25069, and connected to it using the Kelvin techniques
shown in Figure 27.
The high current path from the board’s input to the load (via Q1), and the return path, should be parallel and
close to each other to minimize loop inductance.
The ground connection for the various components around the LM25069 should be connected directly to
each other, and to the LM25069’s GND pin, and then connected to the system ground at one point. Do not
connect the various component grounds to each other through the high current ground line.
•
•
Provide adequate heat sinking for the series pass device (Q1) to help reduce stresses during turn-on and
turn-off.
The board’s edge connector can be designed to shut off the LM25069 as the board is removed, before the
supply voltage is disconnected from the LM25069. In Figure 36 the voltage at the UVLO pin goes to ground
before VSYS is removed from the LM25069 due to the shorter edge connector pin. When the board is inserted
into the edge connector, the system voltage is applied to the LM25069’s VIN pin before the UVLO voltage is
taken high.
Copyright © 2011–2013, Texas Instruments Incorporated
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Product Folder Links: LM25069
LM25069
SNVS607E –FEBRUARY 2011–REVISED MARCH 2013
www.ti.com
GND
To
V
SYS
Load
R
S
Q1
SENSE GATE
VIN
OUT
PGD
PWR
R1
R2
R3
UVLO
OVLO
GND TIMER
LM25069
PLUG-IN CARD
CARD EDGE
CONNECTOR
Figure 36. Recommended Board Connector Design
System Considerations
a. Continued proper operation of the LM25069 hot swap circuit requires capacitance be present on the supply
side of the connector into which the hot swap circuit is plugged in, as depicted in Figure 22. The capacitor in
the “Live Power Source” section is necessary to absorb the transient generated whenever the hot swap
circuit shuts off the load current. If the capacitance is not present, inductance in the supply lines will generate
a voltage transient at shut-off which can exceed the absolute maximum rating of the LM25069, resulting in its
destruction.
b. If the load powered by the LM25069 hot swap circuit has inductive characteristics, a Schottky diode is
required across the LM25069’s output, along with some load capacitance. The capacitance and the diode
are necessary to limit the negative excursion at the OUT pin when the load current is shut off. If the OUT pin
transitions more than 0.3V negative the LM25069 will internally reset, interfering with the latch-off feature of
the LM25069-1, or the restart cycle of the LM25069-2. See Figure 37.
R
S
V
OUT
V
SYS
Q1
+12V
LIVE
POWER SOURCE
C
L
SENSE
OUT
VIN
Inductive
Load
LM25069
GND
GND
PLUG-IN BOARD
Figure 37. Output Diode Required for Inductive Loads
22
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Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LM25069
LM25069
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SNVS607E –FEBRUARY 2011–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision D (March 2013) to Revision E
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 22
Copyright © 2011–2013, Texas Instruments Incorporated
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23
Product Folder Links: LM25069
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM25069PMM-1/NOPB
LM25069PMM-2/NOPB
LM25069PMME-1/NOPB
LM25069PMME-2/NOPB
LM25069PMMX-1/NOPB
LM25069PMMX-2/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
DGS
DGS
DGS
DGS
DGS
DGS
10
10
10
10
10
10
1000 RoHS & Green
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
SXNB
SXLB
SXNB
SXLB
SXNB
SXLB
SN
SN
SN
SN
SN
250
250
RoHS & Green
RoHS & Green
3500 RoHS & Green
3500 RoHS & Green
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Nov-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM25069PMM-1/NOPB VSSOP
LM25069PMM-2/NOPB VSSOP
LM25069PMME-1/NOPB VSSOP
LM25069PMME-2/NOPB VSSOP
LM25069PMMX-1/NOPB VSSOP
LM25069PMMX-2/NOPB VSSOP
DGS
DGS
DGS
DGS
DGS
DGS
10
10
10
10
10
10
1000
1000
250
178.0
178.0
178.0
178.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
5.3
3.4
3.4
3.4
3.4
3.4
3.4
1.4
1.4
1.4
1.4
1.4
1.4
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
250
3500
3500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Nov-2014
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM25069PMM-1/NOPB
LM25069PMM-2/NOPB
LM25069PMME-1/NOPB
LM25069PMME-2/NOPB
LM25069PMMX-1/NOPB
LM25069PMMX-2/NOPB
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
DGS
DGS
DGS
DGS
DGS
DGS
10
10
10
10
10
10
1000
1000
250
210.0
210.0
210.0
210.0
367.0
367.0
185.0
185.0
185.0
185.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
250
3500
3500
Pack Materials-Page 2
PACKAGE OUTLINE
DGS0010A
VSSOP - 1.1 mm max height
S
C
A
L
E
3
.
2
0
0
SMALL OUTLINE PACKAGE
C
SEATING PLANE
0.1 C
5.05
4.75
TYP
PIN 1 ID
AREA
A
8X 0.5
10
1
3.1
2.9
NOTE 3
2X
2
5
6
0.27
0.17
10X
3.1
2.9
1.1 MAX
0.1
C A
B
B
NOTE 4
0.23
0.13
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.7
0.4
0 - 8
DETAIL A
TYPICAL
4221984/A 05/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA.
www.ti.com
EXAMPLE BOARD LAYOUT
DGS0010A
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
10X (1.45)
(R0.05)
TYP
SYMM
10X (0.3)
1
5
10
SYMM
6
8X (0.5)
(4.4)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221984/A 05/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DGS0010A
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
10X (1.45)
SYMM
(R0.05) TYP
10X (0.3)
8X (0.5)
1
5
10
SYMM
6
(4.4)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221984/A 05/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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