LM2665M6X/NOPB [TI]
输入电压为 1.8V 至 5.5V 的开关电容倍压器 | DBV | 6 | -40 to 85;
| 型号： | LM2665M6X/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 输入电压为 1.8V 至 5.5V 的开关电容倍压器 | DBV | 6 | -40 to 85 开关 控制器 开关式稳压器 开关式控制器 光电二极管 电源电路 开关式稳压器或控制器 |
| 文件： | 总16页 (文件大小：906K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM2665
www.ti.com
SNVS009F –NOVEMBER 1999–REVISED MAY 2013
LM2665 Switched Capacitor Voltage Converter
Check for Samples: LM2665
1
FEATURES
DESCRIPTION
The LM2665 CMOS charge-pump voltage converter
operates as a voltage doubler for an input voltage in
the range of +2.5V to +5.5V. Two low cost capacitors
and a diode (needed during start-up) are used in this
circuit to provide up to 40 mA of output current. The
LM2665 can also work as a voltage divider to split a
voltage in the range of +1.8V to +11V in half.
2
•
•
•
•
•
Doubles or Splits Input Supply Voltage
6-Pin SOT-23 Package
12Ω Typical Output Impedance
90% Typical Conversion Efficiency at 40 mA
1µA Typical Shutdown Current
The LM2665 operates at 160 kHz oscillator frequency
to reduce output resistance and voltage ripple. With
an operating current of only 650 µA (operating
efficiency greater than 90% with most loads) and 1µA
typical shutdown current, the LM2665 provides ideal
performance for battery powered systems. The
device is in a SOT-23 package.
APPLICATIONS
•
•
•
•
•
•
Cellular Phones
Pagers
PDAs
Operational Amplifier Power Suppliers
Interface Power Suppliers
Handheld Instruments
Basic Application Circuits
Voltage Doubler
Splitting Vin in Half
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM2665
SNVS009F –NOVEMBER 1999–REVISED MAY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
V+ to GND Voltage:
5.8V
OUT to GND Voltage:
11.6V
OUT to V+ Voltage:
5.8V
SD
(GND − 0.3V) to (V+ + 0.3V)
V+ and OUT Continuous Output Current
Output Short-Circuit Duration to GND(3)
50 mA
1 sec.
Continuous Power
600 mW
Dissipation (TA = 25°C)(4)
(4)
TJMax
150°C
210°C/W
(4)
θJA
Operating Junction Temperature Range
Storage Temperature Range
Lead Temp. (Soldering, 10 seconds)
ESD Rating
−40° to 85°C
−65°C to +150°C
300°C
2kV
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be
avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.
(4) The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA)/θJA, where TJMax is the maximum junction
temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package.
Electrical Characteristics
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: V+ = 5V, C1 = C2 = 3.3 μF.(1)
Symbol
Parameter
Condition
Min
Typ
Max
Units
(2)
(3)
(2)
V+
IQ
Supply Voltage
2.5
5.5
V
Supply Current
No Load
650
1
1250
µA
µA
ISD
Shutdown Supply Current
Shutdown Pin Input Voltage
VSD
Shutdown Mode
Normal Operation
2.0
(4)
V
0.8
(5)
IL
Output Current
40
mA
RSW
Sum of the Rds(on)of the four internal
MOSFET switches
IL = 40 mA
IL = 40 mA
3.5
8
Ω
ROUT
fOSC
fSW
Output Resistance(6)
Oscillator Frequency
Switching Frequency
Power Efficiency
12
160
80
25
Ω
(7)80
40
kHz
kHz
(7)
PEFF
RL (1.0k) between GND and OUT
IL = 40 mA to GND
86
93
%
90
(1) In the test circuit, capacitors C1 and C2 are 3.3 µF, 0.3Ω maximum ESR capacitors. Capacitors with higher ESR will increase output
resistance, reduce output voltage and efficiency.
(2) Min. and Max. limits are guaranteed by design, test, or statistical analysis.
(3) Typical numbers are not guaranteed but represent the most likely norm.
(4) The minimum input high for the shutdown pin equals 40% of V+.
(5) The maximum input low of the shutdown pin equals 20% of V+.
(6) Specified output resistance includes internal switch resistance and capacitor ESR. See the details in the application information for
positive voltage doubler.
(7) The output switches operate at one half of the oscillator frequency, fOSC = 2fSW
.
2
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
Electrical Characteristics (continued)
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: V+ = 5V, C1 = C2 = 3.3 μF.(1)
Symbol
Parameter
Condition
Min
Typ
Max
Units
(2)
(3)
(2)
VOEFF
Voltage Conversion Efficiency
No Load
99
99.96
%
Test Circuit
Figure 1. LM2665 Test Circuit
Typical Performance Characteristics
(Circuit of Figure 1, V+ = 5V unless otherwise specified)
Supply Current vs
Supply Voltage
Supply Current vs
Temperature
Figure 2.
Figure 3.
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
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Typical Performance Characteristics (continued)
(Circuit of Figure 1, V+ = 5V unless otherwise specified)
Output Source
Resistance
vs
Output Source
Resistance
vs
Supply
Voltage
Temperature
Figure 4.
Figure 5.
Efficiency
vs
Load Current
Output Voltage Drop
vs Load Current
Figure 6.
Figure 7.
Oscillator Frequency vs
Supply Voltage
Oscillator Frequency vs
Temperature
Figure 8.
Figure 9.
4
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
Typical Performance Characteristics (continued)
(Circuit of Figure 1, V+ = 5V unless otherwise specified)
Shutdown Supply
Current vs
Temperature
Figure 10.
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LM2665
SNVS009F –NOVEMBER 1999–REVISED MAY 2013
www.ti.com
CONNECTION DIAGRAM
6-Pin Small Outline Package
1
2
3
6
5
4
Figure 11. DBV Package Top View
Figure 12. Actual Size
Pin Functions
Function
Pin
Name
Voltage Doubler
Power supply positive voltage input.
Power supply ground input
Voltage Split
Positive voltage output.
Same as doubler
1
2
3
V+
GND
CAP−
Connect this pin to the negative terminal of the charge-
pump capacitor
Same as doubler.
4
SD
Shutdown control pin, tie this pin to ground in normal
operation.
Same as doubler.
5
6
OUT
Positive voltage output.
Power supply positive voltage input
CAP+
Connect this pin to the positive terminal of the charge-pump Same as doubler
capacitor.
Circuit Description
The LM2665 contains four large CMOS switches which are switched in a sequence to double the input supply
voltage. Energy transfer and storage are provided by external capacitors. Figure 13 illustrates the voltage
conversion scheme. When S2 and S4 are closed, C1 charges to the supply voltage V+. During this time interval,
switches S1 and S3 are open. In the next time interval, S2 and S4 are open; at the same time, S1 and S3 are
closed, the sum of the input voltage V+ and the voltage across C1 gives the 2V+ output voltage when there is no
load. The output voltage drop when a load is added is determined by the parasitic resistance (Rds(on) of the
MOSFET switches and the ESR of the capacitors) and the charge transfer loss between capacitors. Details will
be discussed in the following application information section.
Figure 13. Voltage Doubling Principle
6
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
APPLICATION INFORMATION
POSITIVE VOLTAGE DOUBLER
The main application of the LM2665 is to double the input voltage. The range of the input supply voltage is 2.5V
to 5.5V.
The output characteristics of this circuit can be approximated by an ideal voltage source in series with a
resistance. The voltage source equals 2V+. The output resistance Rout is a function of the ON resistance of the
internal MOSFET switches, the oscillator frequency, the capacitance and ESR of C1 and C2. Since the switching
current charging and discharging C1 is approximately twice as the output current, the effect of the ESR of the
pumping capacitor C1 will be multiplied by four in the output resistance. The output capacitor C2 is charging and
discharging at a current approximately equal to the output current, therefore, its ESR only counts once in the
output resistance. A good approximation of Rout is:
(1)
where RSW is the sum of the ON resistance of the internal MOSFET switches shown in Figure 13.
The peak-to-peak output voltage ripple is determined by the oscillator frequency, the capacitance and ESR of the
output capacitor C2:
(2)
High capacitance, low ESR capacitors can reduce both the output resistance and the voltage ripple.
The Schottky diode D1 is only needed for start-up. The internal oscillator circuit uses the OUT pin and the GND
pin. Voltage across OUT and GND must be larger than 1.8V to insure the operation of the oscillator. During start-
up, D1 is used to charge up the voltage at the OUT pin to start the oscillator; also, it protects the device from
turning-on its own parasitic diode and potentially latching-up. Therefore, the Schottky diode D1 should have
enough current carrying capability to charge the output capacitor at start-up, as well as a low forward voltage to
prevent the internal parasitic diode from turning-on. A Schottky diode like 1N5817 can be used for most
applications. If the input voltage ramp is less than 10V/ms, a smaller Schottky diode like MBR0520LT1 can be
used to reduce the circuit size.
SPLIT V+ IN HALF
Another interesting application shown in the Basic Application Circuits is using the LM2665 as a precision voltage
divider. . This circuit can be derived from the voltage doubler by switching the input and output connections. In
the voltage divider, the input voltage applies across the OUT pin and the GND pin (which are the power rails for
the internal oscillator), therefore no start-up diode is needed. Also, since the off-voltage across each switch
equals Vin/2, the input voltage can be raised to +11V.
SHUTDOWN MODE
A shutdown (SD) pin is available to disable the device and reduce the quiescent current to 1 µA. In normal
operating mode, the SD pin is connected to ground. The device can be brought into the shutdown mode by
applying to the SD pin a voltage greater than 40% of the V+ pin voltage.
CAPACITOR SELECTION
As discussed in the Positive Voltage Doubler section, the output resistance and ripple voltage are dependent on
the capacitance and ESR values of the external capacitors. The output voltage drop is the load current times the
output resistance, and the power efficiency is
(3)
2
Where IQ(V+) is the quiescent power loss of the IC device, and IL Rout is the conversion loss associated with the
switch on-resistance, the two external capacitors and their ESRs.
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
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The selection of capacitors is based on the specifications of the dropout voltage (which equals Iout Rout), the
output voltage ripple, and the converter efficiency. Low ESR capacitors () are recommended to maximize
efficiency, reduce the output voltage drop and voltage ripple.
Low ESR Capacitor Manufacturers
Manufacturer
Nichicon Corp.
Phone
Capacitor Type
PL & PF series, through-hole aluminum electrolytic
TPS series, surface-mount tantalum
593D, 594D, 595D series, surface-mount tantalum
OS-CON series, through-hole aluminum electrolytic
Ceramic chip capacitors
(708)-843-7500
(803)-448-9411
(207)-324-4140
(619)-661-6835
(800)-831-9172
(800)-348-2496
(408)-432-8020
AVX Corp.
Sprague
Sanyo
Murata
Taiyo Yuden
Tokin
Ceramic chip capacitors
Ceramic chip capacitors
Other Applications
PARALLELING DEVICES
Any number of LM2665s can be paralleled to reduce the output resistance. Each device must have its own
pumping capacitor C1, while only one output capacitor Cout is needed as shown in Figure 14. The composite
output resistance is:
(4)
Figure 14. Lowering Output Resistance by Paralleling Devices
CASCADING DEVICES
Cascading the LM2665s is an easy way to produce a greater voltage (A two-stage cascade circuit is shown in
Figure 15).
The effective output resistance is equal to the weighted sum of each individual device:
Rout = 1.5Rout_1 + Rout_2
(5)
Note that, the increasing of the number of cascading stages is pracitically limited since it significantly reduces the
efficiency, increases the output resistance and output voltage ripple.
8
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
Figure 15. Increasing Output Voltage by Cascading Devices
REGULATING VOUT
It is possible to regulate the output of the LM2665 by use of a low dropout regulator (such as LP2980-5.0). The
whole converter is depicted in Figure 16.
A different output voltage is possible by use of LP2980-3.3, LP2980-3.0, or LP2980-adj.
Note that, the following conditions must be satisfied simultaneously for worst case design:
2Vin_min >Vout_min +Vdrop_max (LP2980) + Iout_max × Rout_max (LM2665)
2Vin_max < Vout_max +Vdrop_min (LP2980) + Iout_min × Rout_min (LM2665)
(6)
(7)
Figure 16. Generate a Regulated +5V from +3V Input Voltage
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SNVS009F –NOVEMBER 1999–REVISED MAY 2013
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REVISION HISTORY
Changes from Revision E (May 2013) to Revision F
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
1000
1000
(1)
(2)
(6)
(3)
(4/5)
LM2665M6
NRND
ACTIVE
SOT-23
SOT-23
DBV
6
6
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
S04A
S04A
LM2665M6/NOPB
DBV
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM2665M6X
NRND
SOT-23
SOT-23
DBV
DBV
6
6
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
S04A
S04A
LM2665M6X/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2665M6
LM2665M6/NOPB
LM2665M6X
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
6
6
6
6
1000
1000
3000
3000
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
LM2665M6X/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2665M6
LM2665M6/NOPB
LM2665M6X
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
6
6
6
6
1000
1000
3000
3000
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
LM2665M6X/NOPB
Pack Materials-Page 2
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