LM2771 [TI]

低纹波 250mA 开关电容器降压直流/直流转换器;
LM2771
型号: LM2771
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

低纹波 250mA 开关电容器降压直流/直流转换器

开关 电容器 转换器
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LM2771  
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LM2771 Low-Ripple 250mA Switched Capacitor Step-Down DC/DC Converter  
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1
FEATURES  
DESCRIPTION  
The LM2771 is a switched capacitor step-down  
regulator that produces a 1.5V output without the use  
of an inductor. It is capable of supplying loads up to  
250mA. The LM2771 operates with an input voltage  
from 2.7V to 5.5V, and requires only 3 low-cost  
ceramic capacitors.  
2
Low-Noise Fixed Frequency Operation  
1.5V Output Voltage  
Li-Ion (3.6V) to 1.5V with 81% Efficiency  
1.7% Output Voltage Accuracy  
Very Low Output Ripple: 8mV @ 250mA  
Output Currents up to 250mA  
The LM2771 uses a regulated 0.5x charge pump to  
give power conversion efficiencies nearly twice as  
high as an LDO. Pre-regulated 1.1MHz fixed-  
frequency switching results in very low ripple and  
noise on both the input and the output. When output  
currents are low (<30mA typ.), the part automatically  
switches to a low-ripple PFM regulation mode to  
maintain high efficiency over the entire load range. At  
input voltages below 3.5V (Typ), the charge pump  
goes into pass mode, with efficiencies similar to an  
LDO.  
2.7V to 5.5V Input Range  
Shutdown Disconnects Load from VIN  
1.1MHz Switching Frequency  
No Inductors…Small Solution Size  
Current Limit and Thermal Protection  
WSON-10 Package (3mm × 3mm × 0.8mm)  
APPLICATIONS  
DSP, Memory, and Microprocessor Power  
Supplies  
Mobile Phones and Pagers  
Portable Electronic Devices  
Typical Application Circuit  
V
: 1.5V  
OUT  
V
IN  
= 3.0V to 5.5V  
I
up to 250 mA  
OUT  
V
V
OUT  
IN  
C
IN  
1 mF  
C
OUT  
4.7mF  
LM2771  
C1+  
C1-  
GND  
EN  
Cfly  
1 mF  
Capacitors: 1 mF - TDK C1005X5R1A105K  
4.7 mF - TDK C1608X5R0J475K  
or equivalent  
Figure 1.  
Figure 2. LM2771 Efficiency vs.  
Low-Dropout Linear Regulator (LDO) Efficiency  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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LM2771  
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Connection Diagram  
Figure 3. 10-Pin Non-Pullback Leadless Frame Package (WSON-10)  
Package Number DSC0010A  
1
2
3
4
5
10 EN  
EN 10  
1
2
3
4
5
V
V
IN  
IN  
GND  
9
8
7
6
GND GND  
9
GND  
NC  
C1+ C1+  
C1- C1-  
NC  
8
7
6
V
V
OUT  
OUT  
NC  
NC  
NC  
NC  
Die-Attach  
Pad: GND  
Die-Attach  
Pad: GND  
Bottom View  
Top View  
Pin Descriptions  
Pin #  
Name  
VIN  
Description  
1
2
Input Voltage: Recommended VIN operating range 3.0V to 5.5V.  
GND  
VOUT  
NC  
Ground  
3
Output Voltage  
4
No Connect  
5
NC  
No Connect  
6
C1-  
Flying Capacitor 1: Negative Terminal  
Flying Capacitor 1: Positive Terminal  
No Connect  
7
C1+  
NC  
8
9
GND  
EN  
Ground  
10  
Enable Pin Logic Input. Applying a logic HIGH voltage signal enables the part. A logic LOW  
voltage signal places the the device in shutdown.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)(3)  
VIN Pin Voltage  
-0.3V to 6.0V  
EN Pin Voltage  
-0.3V to (VIN+0.3V) w/ 6.0V max  
Continuous Power Dissipation(4)  
Internally Limited  
150ºC  
Junction Temperature (TJ-MAX  
Storage Temperature Range  
)
-65ºC to +150º C  
265ºC  
Maximum Lead Temperature(5)  
Human Body Model  
Machine Model  
2.0kV  
ESD Rating(6)  
200V  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) All voltages are with respect to the potential at the GND pins.  
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and  
disengages at TJ=140ºC (typ.).  
(5) For detailed information on soldering requirements and recommendations, please refer to Texas Instruments' Application Note 1187  
(Literature Number SNOA401): Leadless Leadframe Package (LLP).  
(6) The Human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin. The machine model is a 200pF  
capacitor discharged directly into each pin. MIL-STD-883 3015.7  
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Operating Ratings(1)(2)  
Input Voltage Range  
2.7V to 5.5V  
0mA to 250mA  
-30°C to +110°C  
-30°C to +85°C  
Recommended Load Current Range  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range(3)  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) All voltages are with respect to the potential at the GND pins.  
(3) Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 110ºC), the  
maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package  
in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).  
Thermal Properties  
Junction-to-Ambient Thermal Resistance (θJA), WSON-10 Package(1)  
55°C/W  
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power  
dissipation exists, special care must be paid to thermal dissipation issues.  
Electrical Characteristics(1)(2)  
Limits in standard typeface are for TJ = 25ºC. Limits in boldface type apply over the full operating junction temperature range  
(-30°C TJ +110°C) . Unless otherwise noted, specifications apply to the LM2771 Typical Application Circuit (pg. 1) with:  
VIN = 3.6V; V(EN) = 1.8V, CIN = C1 = 1.0µF, COUT = 4.7µF.(3)  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
3.0V VIN 5.5V  
0mA IOUT 200mA  
1.455  
(3%)  
1.545  
(+3%)  
1.5  
3.0V VIN 5.5V  
IOUT = 150mA  
1.475  
(1.7%)  
1.525  
(+1.7%)  
VOUT  
1.5V Output Voltage Regulation  
1.5  
1.5  
V
3.0V < VIN 5.5V,  
0mA IOUT 250mA  
1.445  
(3.7%)  
1.545  
(+3%)  
VOUT = 1.5V  
0mA IOUT 250mA  
VOUT/IOUT  
Output Load Regulation  
0.17  
mV/mA  
VOUT/VIN  
E
Output Line Regulation  
Power Efficiency  
0.1  
81  
45  
8
%/V  
%
IOUT = 200mA  
IOUT = 0mA(4)  
IQ  
Quiescent Supply Current  
Fixed Frequency Output Ripple  
PFM–Mode Output Ripple  
Shutdown Current  
50  
µA  
VR  
40mA IOUT 250mA  
IOUT < 40mA  
mV  
mV  
µA  
VR–PFM  
ISD  
12  
0.1  
1.1  
1.0  
V(EN) = 0V  
0.5  
FSW  
ROL  
Switching Frequency  
3.2V VIN 5.5V  
IOUT = 200mA(5)  
0.80  
1.40  
MHz  
Open–Loop Output Resistance  
VIN = 5.5V  
ICL  
Output Current Limit  
500  
150  
mA  
0V VOUT 0.2V(6)  
tON  
VIL  
VIH  
IIH  
Turn-on Time  
µs  
V
Logic-low Input Voltage  
Logic-high Input Voltage  
Logic-high Input Current  
Logic-low Input Current  
3.0V VIN 5.5V  
3.0V VIN 5.5V  
V(EN) = 1.8V(7)  
Logic Input = 0V  
0
0.5  
VIN  
0.95  
V
5
µA  
µA  
IIL  
0.1  
(1) All voltages are with respect to the potential at the GND pins.  
(2) Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most  
likely norm.  
(3) CIN, COUT, C1: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.  
(4) VOUT is set to 1.6V during this test.  
(5) Open loop output resistance can be used to predict output voltage when, under low VIN and high IOUT conditions, VOUT falls out of  
regulation. VOUT = VIN/2 (ROL × IOUT  
)
(6) Maximum input current is equal to half the maximum output current for buck-mode switched capacitor converters.  
(7) There is a 350kpull-down resistor connected internally between the EN pin and GND.  
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Block Diagram  
LM2771  
V
IN  
1.3M  
700k  
C1+  
C1-  
SWITCH  
ARRAY  
GAIN  
CONTROL  
SWITCH  
CONTROL  
1
1,  
1.25V  
Ref.  
G =  
,
,
2
GND  
V
OUT  
Current  
Sense  
PFM  
Control  
1.1 MHz  
OSC.  
EN  
Enable/  
Shutdown  
Control  
EN  
Soft-Start  
Ramp  
0.8V  
Ref.  
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Typical Performance Characteristics  
Unless otherwise specified: VIN = 3.6V, CIN = C1 = 1.0µF, COUT = 4.7µF, TA = 25ºC. Capacitors are low-ESR multi-layer  
ceramic capacitors (MLCC's).  
Output Voltage  
Output Voltage  
vs.  
vs.  
Input Voltage  
Output Current  
Efficiency  
vs.  
Input Voltage  
Efficiency  
vs.  
Output Current  
Input Voltage Ripple, Load=6(250mA)  
Output Voltage Ripple, Load=6(250mA)  
CH1: VIN, CIN = 1µF; Scale: 50mV/Div, AC Coupled  
CH2: VIN, CIN = 10µF; Scale: 50mV/Div, AC Coupled  
Time scale: 200ns/Div  
CH2: VOUT, COUT = 4.7µF; Scale: 20mV/Div, AC Coupled  
Time scale: 200ns/Div  
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Typical Performance Characteristics (continued)  
Unless otherwise specified: VIN = 3.6V, CIN = C1 = 1.0µF, COUT = 4.7µF, TA = 25ºC. Capacitors are low-ESR multi-layer  
ceramic capacitors (MLCC's).  
Load Step, 15mA to 200mA  
Load Step, 200mA to 15mA  
CH2: VOUT; Scale: 20mV/Div, AC Coupled  
CH4: IOUT; Scale: 200mA/Div  
Time scale: 20µs/Div  
CH2: VOUT; Scale: 20mV/Div, AC Coupled  
CH4: IOUT; Scale: 200mA/Div  
Time scale: 10µs/Div  
Oscillator Frequency  
vs.  
Line Step, 3.6V to 4.5V with Load=7.5(200mA)  
Input Voltage  
CH1: VIN; Scale: 1V/Div, AC Coupled  
CH2: VOUT; Scale: 20mV/Div, AC Coupled  
Time scale: 40µs/Div  
Startup and Shutdown Behavior, Load=6(250mA)  
CH1: VEN; Scale: 2V/Div, DC Coupled  
CH2: VOUT; Scale: 500mV/Div, DC Coupled  
Time scale: 100µs/Div  
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OPERATION DESCRIPTION  
OVERVIEW  
The LM2771 is a switched capacitor converter that produces a regulated, low voltage output. The core of the part  
is a highly efficient charge pump that utilizes fixed frequency pre-regulation and Pulse Frequency Modulation to  
minimize ripple and power losses over wide input voltage and output current ranges. A description of the  
principal operational characteristics of the LM2771 is detailed in the CIRCUIT DESCRIPTION, and EFFICIENCY  
PERFORMANCE sections. These sections refer to details in the Block Diagram.  
CIRCUIT DESCRIPTION  
The core of the LM2771 is a two-phase charge pump controlled by an internally generated non-overlapping  
clock. The charge pump operates by using an external flying capacitor, C1, to transfer charge from the input to  
the output. At input voltages below 3.5V (typ.) the LM2771 operates in a "pass mode", with the input current  
being equal to the load current. At input voltages above 3.5V (typ.) the part utilizes a gain of ½, resulting in an  
input current equal to half the load current.  
The two phases of the switched capacitor switching cycle will be referred to as the "charge phase" and the  
"discharge phase". During the charge phase, the flying capacitor is charged by the input supply. After half of the  
switching cycle [ t = 1/(2×FSW) ], the LM2771 switches to the discharge phase. In this configuration, the charge  
that was stored on the flying capacitor in the charge phase is transferred to the output.  
The LM2771 uses fixed frequency pre-regulation to regulate the output voltage to 1.5V during moderate to high  
load currents. The input and output connections of the flying capacitor is made with internal MOS switches. Pre-  
regulation limits the gate drive of the MOS switch connected between the voltage input and the flying capacitor.  
Controlling the on resistance of this switch limits the amount of charge transferred into and out of the flying  
capacitor during the charge and discharge phases, and in turn helps to keep the output ripple very low.  
When output currents are low (<30mA typ.), the LM2771 automatically switches to a low-ripple Pulse Frequency  
Modulation (PFM) form of regulation. In PFM mode, the flying capacitor stays in the discharge phase until the  
output voltage drops below a predetermined trip point. When this occurs, the flying capacitor switches back to the  
charge phase. After being charged, the flying capacitor repeats the process of staying in the discharge phase  
and switching to the charge phase when necessary.  
EFFICIENCY PERFORMANCE  
Charge-pump efficiency is derived in the following two ideal equations (supply current and other losses are  
neglected for simplicity):  
IIN = G × IOUT E = (VOUT × IOUT) ÷ (VIN × IIN) = VOUT ÷ (G × VIN)  
(1)  
In the equations, G represents the charge pump gain. Efficiency is at its highest as G×VIN approaches VOUT  
.
Refer to the efficiency graph in the Typical Performance Characteristics section for detailed efficiency data. The  
transition between Pass mode and the gain of ½ is clearly distinguished by the sharp discontinuity in the  
efficiency curve.  
SHUTDOWN  
The LM2771 is in shutdown mode when the voltage on the enable pin (EN) is logic-low. In shutdown, the  
LM2771 draws virtually no supply current. When in shutdown, the output of the LM2771 is completely  
disconnected from the input. The internal feedback resistors will pull the output voltage down to 0V.  
SOFT-START  
The LM2771 employs soft start circuitry to prevent excessive input inrush currents during startup. At startup, the  
output voltage gradually rises from 0V to the nominal output voltage. This occurs in 150µs (typ.). Soft-start is  
engaged when the part is enabled, including situations where voltage is established simultaneously on the VIN  
and EN pins.  
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THERMAL SHUTDOWN  
Protection from damage related to overheating is achieved with a thermal shutdown feature. When the junction  
temperature rises to 150ºC (typ.), the part switches into shutdown mode. The LM2771 disengages thermal  
shutdown when the junction temperature of the part is reduced to 140ºC (typ.). Due to the high efficiency of the  
LM2771, thermal shutdown and/or thermal cycling should not be encountered when the part is operated within  
specified input voltage, output current, and ambient temperature operating ratings. If thermal cycling is seen  
under these conditions, the most likely cause is an inadequate PCB layout that does not allow heat to be  
sufficiently dissipated out of the WSON package.  
CURRENT LIMIT PROTECTION  
The LM2771 charge pump contains current limit protection circuitry that protects the device during VOUT fault  
conditions where excessive current is drawn. Output current is limited to 500mA (typ).  
Application Information  
RECOMMENDED CAPACITOR TYPES  
The LM2771 requires 3 external capacitors for proper operation. Surface-mount multi-layer ceramic capacitors  
are recommended. These capacitors are small, inexpensive and have very low equivalent series resistance  
(ESR, 15mtyp.). Tantalum capacitors, OS-CON capacitors, and aluminum electrolytic capacitors generally  
are not recommended for use with the LM2771 due to their high ESR, as compared to ceramic capacitors.  
For most applications, ceramic capacitors with an X7R or X5R temperature characteristic are preferred for use  
with the LM2771. These capacitors have tight capacitance tolerance (as good as ±10%) and hold their value over  
temperature (X7R: ±15% over -55ºC to 125ºC; X5R: ±15% over -55ºC to 85ºC).  
Capacitors with a Y5V or Z5U temperature characteristic are generally not recommended for use with the  
LM2771. These types of capacitors typically have wide capacitance tolerance (+80%, -20%) and vary  
significantly over temperature (Y5V: +22%, -82% over -30ºC to +85ºC range; Z5U: +22%, -56% over +10ºC to  
+85ºC range). Under some conditions, a 1µF-rated Y5V or Z5U capacitor could have a capacitance as low as  
0.1µF. Such detrimental deviation is likely to cause Y5V and Z5U capacitors to fail to meet the minimum  
capacitance requirements of the LM2771.  
Net capacitance of a ceramic capacitor decreases with increased DC bias. This degradation can result in lower  
capacitance than expected on the input and/or output, resulting in higher ripple voltages and currents. Using  
capacitors at DC bias voltages significantly below the capacitor voltage rating will usually minimize DC bias  
effects. Consult capacitor manufacturers for information on capacitor DC bias characteristics.  
Capacitance characteristics can vary quite dramatically with different application conditions, capacitor types, and  
capacitor manufacturers. It is strongly recommended that the LM2771 circuit be thoroughly evaluated early in the  
design-in process with the mass-production capacitors of choice. This will help ensure that any such variability in  
capacitance does not negatively impact circuit performance.  
The table below lists some leading ceramic capacitor manufacturers.  
Manufacturer  
AVX  
Contact Information  
www.avx.com  
Murata  
www.murata.com  
www.t-yuden.com  
www.component.tdk.com  
www.vishay.com  
Taiyo-Yuden  
TDK  
Vishay-Vitramon  
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OUTPUT CAPACITOR AND OUTPUT VOLTAGE RIPPLE  
The output capacitor in the LM2771 circuit (COUT) directly impacts the magnitude of output voltage ripple. Other  
prominent factors also affecting output voltage ripple include input voltage, output current and flying capacitance.  
Due to the complexity of the regulation topology, providing equations or models to approximate the magnitude of  
the ripple can not be easily accomplished. But one important generalization can be made: increasing  
(decreasing) the output capacitance will result in a proportional decrease (increase) in output voltage ripple.  
In typical high-current applications, a 4.7µF low-ESR ceramic output capacitor is recommended. Different output  
capacitance values can be used to reduce ripple, shrink the solution size, and/or cut the cost of the solution. But  
changing the output capacitor may also require changing the flying capacitor and/or input capacitor to maintain  
good overall circuit performance. Performance of the LM2771 with different capacitor setups in discussed in the  
section RECOMMENDED CAPACITOR CONFIGURATIONS.  
High ESR in the output capacitor increases output voltage ripple. If a ceramic capacitor is used at the output, this  
is usually not a concern because the ESR of a ceramic capacitor is typically very low and has only a minimal  
impact on ripple magnitudes. If a different capacitor type with higher ESR is used (tantalum, for example), the  
ESR could result in high ripple. To eliminate this effect, the net output ESR can be significantly reduced by  
placing a low-ESR ceramic capacitor in parallel with the primary output capacitor. The low ESR of the ceramic  
capacitor will be in parallel with the higher ESR, resulting in a low net ESR based on the principles of parallel  
resistance reduction.  
INPUT CAPACITOR AND INPUT VOLTAGE RIPPLE  
The input capacitor (CIN) is a reservoir of charge that aids a quick transfer of charge from the supply to the flying  
capacitor during the charge phase of operation. The input capacitor helps to keep the input voltage from  
drooping at the start of the charge phase when the flying capacitor is connected to the input. It also filters noise  
on the input pin, keeping this noise out of sensitive internal analog circuitry that is biased off the input line.  
Much like the relationship between the output capacitance and output voltage ripple, input capacitance has a  
dominant and first-order effect on input ripple magnitude. Increasing (decreasing) the input capacitance will result  
in a proportional decrease (increase) in input voltage ripple. Input voltage, output current, and flying capacitance  
also will affect input ripple levels to some degree.  
In typical high-current applications, a 1µF low-ESR ceramic capacitor is recommended on the input. Different  
input capacitance values can be used to reduce ripple, shrink the solution size, and/or cut the cost of the  
solution. But changing the input capacitor may also require changing the flying capacitor and/or output capacitor  
to maintain good overall circuit performance. Performance of the LM2771 with different capacitor setups is  
discussed below in RECOMMENDED CAPACITOR CONFIGURATIONS.  
FLYING CAPACITOR  
The flying capacitor (C1) transfers charge from the input to the output. Flying capacitance can impact both output  
current capability and ripple magnitudes. If flying capacitance is too small, the LM2771 may not be able to  
regulate the output voltage when load currents are high. On the other hand, if the flying capacitance is too large,  
the flying capacitor might overwhelm the input and output capacitors, resulting in increased input and output  
ripple.  
Polarized capacitors (tantalum, aluminum electrolytic, etc.) must not be used for the flying capacitor, as they  
could become reverse-biased during LM2771 operation.  
RECOMMENDED CAPACITOR CONFIGURATIONS  
The data in Table 1 can be used to assist in the selection of a capacitor configuration that best balances solution  
size and cost with the electrical requirements of the application.  
As previously discussed, input and output ripple voltages will vary with output current and input voltage. The  
numbers provided show expected ripple voltage when VIN = 3.6V and load currents are between 10mA and  
200mA. The table offers first look at approximate ripple levels and provides a comparison for the different  
capacitor configurations presented, but is not intended to ensure performance.  
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(1)  
Table 1. LM2771 Performance with Different Capacitor Configurations  
CAPACITOR  
CONFIGURATION  
(VIN = 3.6V)  
TYPICAL  
INPUT  
RIPPLE  
TYPICAL  
OUTPUT  
RIPPLE  
CIN = 1µF,  
COUT = 4.7µF,  
C1 = 1µF  
45mV  
94mV  
8mV  
19mV  
11mV  
16mV  
15mV  
CIN = 1µF,  
COUT = 2.2µF,  
C1 = 1µF  
CIN = 0.47µF,  
COUT = 4.7µF,  
C1 = 1µF  
105mV  
102mV  
120mV  
CIN = 0.47µF,  
COUT = 3.3µF,  
C1 = 1µF  
CIN = 0.47µF,  
COUT = 3.3µF,  
C1 = 0.33µF  
(1) Refer to the text in the Recommended Capacitor Configurations section for detailed information on the data in this table  
Layout Guidelines  
Proper board layout will help to ensure optimal performance of the LM2771 circuit. The following guidelines are  
recommended:  
Place capacitors as close to the LM2771 as possible, and preferably on the same side of the board as the IC.  
Use short, wide traces to connect the external capacitors to the LM2771 to minimize trace resistance and  
inductance.  
Use a low resistance connection between ground and the GND pin of the LM2771. Using wide traces and/or  
multiple vias to connect GND to a ground plane on the board is most advantageous.  
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Product Folder Links: LM2771  
 
LM2771  
www.ti.com  
SNVS435A MARCH 2006REVISED MAY 2013  
REVISION HISTORY  
Changes from Original (May 2013) to Revision A  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 10  
Copyright © 2006–2013, Texas Instruments Incorporated  
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11  
Product Folder Links: LM2771  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM2771SD/NOPB  
ACTIVE  
WSON  
DSC  
10  
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
-30 to 110  
L2771  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM2771SD/NOPB  
WSON  
DSC  
10  
1000  
178.0  
12.4  
3.3  
3.3  
1.0  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
WSON DSC 10  
SPQ  
Length (mm) Width (mm) Height (mm)  
210.0 185.0 35.0  
LM2771SD/NOPB  
1000  
Pack Materials-Page 2  
MECHANICAL DATA  
DSC0010A  
SDA10A (Rev A)  
www.ti.com  
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