LM2791LD-H/NOPB [TI]
IC LED DISPLAY DRIVER, DSO10, 3 X 3 MM, 0.80 MM HEIGHT, LLP-10, Display Driver;
| 型号： | LM2791LD-H/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | IC LED DISPLAY DRIVER, DSO10, 3 X 3 MM, 0.80 MM HEIGHT, LLP-10, Display Driver 驱动 接口集成电路 |
| 文件： | 总18页 (文件大小：868K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM2791
www.ti.com
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
LM2791 Current Regulated Switched Capacitor LED Driver with Analog Brightness
Control
Check for Samples: LM2791
1
FEATURES
DESCRIPTION
The LM2791 is a CMOS charge-pump voltage
doubler and regulator that provides two regulated
current sources. The LM2791 is designed to drive two
white (or blue) LEDs with matched currents (within ±
0.3%) to produce balanced light sources for display
backlights. They accept an input voltage range from
2
•
Output Matching of ± 0.3%
•
•
•
•
•
•
•
•
•
•
•
Drives up to Two LEDs
3V to 5.8V Input Voltage
Up to 36mA Output Current
Soft Start Limits Inrush Current
Analog Brightness Control
Separate Shutdown Input
3V to 5.8V and maintain
a constant current
determined by an external set resistor.
The LM2791 delivers up to 36mA of load current to
accommodate two high forward voltage (typically
white) LEDs. The switching frequency is 450kHz
(min.) to keep the conducted noise spectrum away
from sensitive frequencies within portable RF
devices.
Very Small Solution Size - No Inductor
0.7mA Typical Operating Current
1µA (max.) Shutdown Current
450kHz Switching Frequency (min.)
Linear Regulation Generates Predictable Noise
Spectrum
In the LM2791, brightness is controlled by applying a
voltage between GND and 3.0V to the BRGT pin. The
LM2791 is available in active high or low shutdown
versions. The shutdown pin reduces the operating
current to 1µA (max.).
•
WSON-10 Package: 3mm X 3mm X 0.8mm
APPLICATIONS
The LM2791 is available in a 10 pin WSON CSP
package.
•
•
•
White LED Display Backlights
White LED Keypad Backlights
1-Cell Li-Ion Battery-Operated Equipment
Including PDAs, Hand-Held PCs, Cellular
Phones
•
Flat Panel Displays
Basic Application Circuit
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated
LM2791
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
www.ti.com
Connection Diagram
Figure 1. Top View
10-Lead WSON
PIN DESCRIPTIONS
Pin
1
Name
BRGT
POUT
C1−
Function
Variable voltage input controls output current.
Charge pump output.
2
3
Connect this pin to the negative terminal of C1.
Connect this pin to the positive terminal of C1.
Current source outputs. Connect directly to LED.
Current source outputs. Connect directly to LED.
Power supply ground input.
4
C1+
5
D2
6
D1
7
GND
VIN
8
Power supply voltage input.
9
SD/SD
ISET
Shutdown input. Device operation is inhibited when pin is asserted.
Current Sense Input. Connect resistor to ground to set constant current through LED.
10
Block Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM2791
LM2791
www.ti.com
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
Absolute Maximum Ratings(1)
VIN
−0.3 to 6V
-0.3 to (VIN +0.2V)
400 mW
BRGT, SD
Power Dissipation(2)
(2)
TJMAX
150°C
(3)
θJA
55°C/W
Storge Temperature
Lead Temp. (Soldering, 5 sec.)
ESD Rating
−65°C to +100°C
260°C
Human Body Model
Machine Model
2KV
200V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions.
(2) D1 and D2 may be shorted to GND without damage. POUT may be shorted to GND for 1sec without damage.
(3) For more information regarding the WSON package, please refer to Application note AN-1187. (SNOA401)
Operating Conditions
Input Voltage (VIN
)
3.0V to 5.8V
0 to 3.0V
BRGT
Ambient Temperature (TA)
Junction Temperature (TJ)
−30°C to +85°C
−30°C to +100°C
Copyright © 2001–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM2791
LM2791
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
www.ti.com
Electrical Characteristics(1)
Limits in standard typeface are for TJ = 25°C and limits in boldface type apply over the full Operating Temperature Range.
Unless otherwise specified, C1 = CIN = CHOLD = 1 µF, VIN = 3.6V, VDIODE = 3.6V, RSET = 332Ω, BRGT pin = 0V.
Symbol
Parameter
Diode Current at ID1,2
Conditions
VIN= 3V, RSET = 270Ω
VIN= 3V
Min
Typ
18
Max
Units
IDX
16.5
Available Current at Output Dx
14.5
15.1
15.7
16.8
VIN= 3.3V
12.8
13.3
17.7
18.4
mA
VIN= 3.6V
VIN = 4.4V
IDx
Load Regulation at Output Dx
VIN =3.6V
VDX=3.0V
VDX=4.0V
16
15.4
mA
mA
%
IDX
Line Regulation of Dx Output
Current
3.3V ≤ VIN ≤ 4.4V
VDX = 3.6V
15.7
0.3
ID-MATCH
IQ
Current Matching Between Any
Two Outputs
3.0V ≤ VIN ≤ 4.4V
VD1, VD2 = 3.6V
Quiescent Supply Current
3.0V ≤ VIN ≤ 4.4V, Active, No Load
Current
0.7
2
mA
µA
ISD
Shutdown Supply Current
3.0V ≤ VIN ≤ 5.5V, Shutdown at
85°C
0.1
0.3
1
(2)
VIH
SD Input Logic High
3.0V ≤ VIN ≤ 5.5V,
0.8VIN
V
V
(2)
VIL
SD Input Logic Low
3.0V ≤ VIN ≤ 5.5V,
0.2VIN
ILEAK-SD
RBRGT
ISET
SD Input Leakage Current
BRGT Input Resistance
ISET Pin Output Current
0V ≤ VSD ≤ VIN
0.1
250
IDx/25
650
10
µA
kΩ
mA
kHz
µs
(3)
fSW
Switching Frequency
3.0V ≤ VIN ≤ 4.4V
450
850
tSTART
Startup Time(4)
IDx = 90% steady state
(1) In the test circuit, all capacitors are 1.0µF, 0.3Ω maximum ESR capacitors. Capacitors with higher ESR will increase output resistance,
reduce output voltage and efficiency.
(2) The internal thresholds of the shutdown bar are set at about 40% of VIN
.
(3) The output switches operate at one half of the oscillator frequency, fOSC = 2fSW
(4) Specified by design.Not productin tested.
.
4
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM2791
LM2791
www.ti.com
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
Typical Performance Characteristics
Unless otherwise specified, C1 = CIN, CHOLD= 1uF, VIN= 3.6V, VDIODE = 3.6V, BRGT pin =0V, RSET = 330Ω
Supply Current
vs
Supply Voltage
Supply Current at No Load
Figure 2.
Figure 3.
IDIODE
vs
VDIODE
SD-Threshold
Figure 4.
Figure 5.
Diode Current
vs.
Temperature
IDIODE
vs
RSet
Figure 6.
Figure 7.
Copyright © 2001–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM2791
LM2791
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified, C1 = CIN, CHOLD= 1uF, VIN= 3.6V, VDIODE = 3.6V, BRGT pin =0V, RSET = 330Ω
IDIODE
VSET
vs
vs
BRGT
BRGT
Figure 8.
Figure 9.
Switching Frequency
vs
Switching Frequency
vs.
Supply Voltage
Temperature
Figure 10.
Figure 11.
Start Up Time @ 3.0VIN
Start Up Time @ 3.6VIN
Figure 12.
Figure 13.
6
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM2791
LM2791
www.ti.com
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
Typical Performance Characteristics (continued)
Unless otherwise specified, C1 = CIN, CHOLD= 1uF, VIN= 3.6V, VDIODE = 3.6V, BRGT pin =0V, RSET = 330Ω
Start Up Time @ 4.2 VIN
Figure 14.
Copyright © 2001–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM2791
LM2791
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
www.ti.com
CIRCUIT DESCRIPTION
The LM2791 provides two matched current sources for driving high forward voltage drop LEDs from Li-Ion
battery sources. The device has on-chip current regulators which are composed of current mirrors with a 25 to 1
ratio. The mirrors control the LED current without using current limiting resistors in the LED current path. The
device can drive up to a total of 36mA through the LEDs.
The LED brightness can be controlled by both analog and or digital methods. The digital technique uses a PWM
(Pulse Width Modulation) signal applied to the shutdown input. The analog technique applies an analog voltage
to the brightness (BRGT) pin (see Application Information). For lowest cost, the LM2791 can be used for
constant brightness by grounding BRGT and enabling the shutdown pin.
APPLICATION INFORMATION
SOFT START
LM2791 includes a soft start function to reduce the inrush currents and high peak current during power up of the
device. Soft start is implemented internally by ramping the bandgap more slowly than the applied voltage. This is
done by holding the bandgap in shutdown for a short time. During soft start, the switch resistances limit the
inrush current used to charge the flying and hold capacitors.
SHUTDOWN MODE
A shutdown pin (SD or /SD) is available to disable the LM2791 and reduce the quiescent current to 1µA
maximum. The LM2791 is available with both senses of shutdown polarity.
During normal operation mode of the "-L" options, an active high logic signal to the SD pin or tying the SD pin to
VIN, will enable the device. Pulling SD low or connectingSD to ground will disable the device.
During normal operation mode of the "-H" options, an active low logic signal to the SD pin or tying the SD pin to
GND, will enable the device. Pulling SD high or connecting SD to VIN will disable the device.
CAPACITOR SELECTION
Low equivalent series resistance (ESR) capacitors such as X5R or X7R are recommended to be used for CIN,
C1, C2, and CHOLD for best performance. Ceramic capacitors with less than or equal to 0.3 ohms ESR value are
recommended for this application. Table 1 below lists suggested capacitor suppliers for the typical application
circuit.
8
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM2791
LM2791
www.ti.com
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
Table 1. Low ESR Capacitor Manufactures
Manufacturer
TDK
Contact
website
(847) 803 6100
(800) 831 9172
(800) 348 2496
www.component.tdk.com
www.murata.com
MuRata
Taiyo Yuden
www.t-yuden.com
SCHOTTKY DIODE SELECTION
A schottky diode (D1) must be used between VIN and POUT for proper operation. During start-up, the low voltage
drop across this diode is used to charge COUT and start the oscillator. It is necessary to protect the device from
turning-on its own parasitic diode and potentially latching-up. As a result, it is important to select a schottky diode
that will carry at least 200mA or higher current to charge the output capacitor during start-up. A schottky diode
like 1N5817 can be used for most applications or a surface mount diode such as BAT54-series and MA2J704
used to reduce the circuit size. Table 2 below lists suggested schottky diode manufactures.
Table 2. Diode Manufactures
Manufacturer
Contact
Schottky Diodes
www.onsemi.con
ON Semiconductor
(800) 344 3860
(800) 234 7381
(408) 945 5622
Phillips Semiconductors
Panasonic Semiconductor
www.philipssemiconduc tor.com
www.panasonic.com
LED SELECTION
The LM2791 is designed to drive LEDs with a forward voltage of about 3.0V to 4.0V or higher. The typical and
maximum VF depends highly on the manufacturer and their technology. Table 3 lists two suggested
manufactures and example part numbers. Each supplier makes many LEDs that work well with the LM2791. The
LEDs suggested below are in a surface mount package and TOPLED or SIDEVIEW configuration with a
maximum forward current of 20mA. These diodes also come in SIDELED or SIDEVIEW configuration and
various chromaticity groups. For applications that demand color and brightness matching, care must be taken to
select LEDs from the same chromaticity group. Forward current matching is assured over the LED process
variations due to the constant current output of the LM2791. For best fit selection for an application, consult the
manufacturer for detailed information.
Table 3. White LED Selection:
Component
Manufacture
Osram
Contact
LWT673/LWT67C
NSCW100/ NSCW215
www.osram-os.com
www.nichia.com
Nichia
ISET PIN
An external resistor, RSET, sets the mirror current that is required to provide a constant current through the LEDs.
The current through RSET and the LED is set by the internal current mirror circuitry with a ratio of 25:1 The
currents through each LED are matched within 0.3%. RSET should be chosen not to exceed the maximum current
delivery capability of the device. Table 4 shows a list of RSET values when maximum BRGT = 0V is applied. For
other BRGT voltages, RSET can be calculated using this formula:
RSET = (((BRGT * 0.42) + VOFFSET))/(ILED)* 25
(1)
Table 4. RSETSelections ( when BRGT pin = 0V)
ILED per LED
15mA
*RSET
330Ω
500Ω
1K
10mA
5mA
Copyright © 2001–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM2791
LM2791
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
www.ti.com
Calculation of LED Current When Grounding BRGT:
VIN = 3.6V
VOFFSET = 200mV(Reference Voltage)
RSET = 330Ω
ILED = ( VOFFSET/RSET) *25
ILED = (200mV/330) *25 = 15mA
BRGT PIN
The BRGT pin can be used to smoothly vary the brightness of the White LEDs. In the LM2791, current on BRGT
is connected to an internal resistor divider which gives a factor 0.42 and summed with an offset voltage from the
internal bandgap (200mV). This voltage is fed to the operational amplifier that controls the current through the
mirror resistor RSET. The nominal range on BRGT is 0V to 3V. Care must be taken to prevent voltages on BRGT
that cause LED current to exceed 36mA. Although this will not cause damage to the IC, it will not meet the
specifications listed in the Electrical Characteristics.
Table 5 shows the current through each LED for the LM2791 with various BRGT and RSET values.
Calculation of LED Current When BRGT Pin > 0:
RSET = 2000Ω
BRGT = 2.5V
VOFFSET = 200mV(Reference Voltage)
ILED = (((BRGT * 0.42) + VOFFSET)/ RSET )* 25
ILED = (((2.5*0.42) + 0.20)/2000 )*25 =15.6mA
Table 5. LED Current When Using BRGT Input(1)
RSET (Ω)
BRGT (V)
0.5
1000Ω
ILED (mA)
10.25
15.5
1500Ω
ILED (mA)
6.84
2000Ω
ILED (mA)
5.10
2500Ω
ILED (mA)
4.1
1.0
10.3
7.75
6.2
1.5
20.75
26
13.8
10.37
13.00
15.6
8.3
2.0
17.3
10.4
2.5
31.25
36.5
20.80
24.3
12.5
3.0
18.3
14.6
(1) Values Highlighted in Boldface exceeded maximum current range of the device if both LEDs are in use.
BRIGHTNESS CONTROL USING PWM
Brightness control can be implemented by pulsing a signal at the SD pin. The recommended signal should be
between 100Hz to 1kHz. If the operating PWM frequency is much less than 100Hz, flicker may be seen in the
LEDs. Likewise, if frequency is much higher, brightness in the LEDs will not be linear. When a PWM signal is
used to drive the SD pin of the LM2791, connect BRGT pin to a maximun of GND. RSET value is selected using
the above I
equation as if BRGT pin is used. The brightness is controlled by increasing and decreasing the
SET
duty cycle of the PWM. Zero duty cycle will turn off the brightness and a 50% duty cycle waveform produces an
average current of 7.5mA if RSET is set to produce a maximum LED current of 15mA. So the LED current varies
linearly with the duty cycle.
10
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM2791
LM2791
www.ti.com
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
PARALLEL Dx OUTPUTS FOR INCREASED CURRENT DRIVE
Outputs D1 and D2 may be connected together to drive a single LED. In such a configuration, two parallel
current sources of equal value drive the single LED. RSET and VBRGT should be chosen so that the current
through each of the outputs is programmed to 50% of the total desired LED current. For example, if 30mA is the
desired drive current for the single LED, RSET and VBRGT should be selected so that the current through each of
the outputs is 15mA. Connecting the outputs in parallel does not affect internal operation of the LM2791and has
no impact on the Electrical Characteristics and limits previously presented. The available Dx output current,
maximum Dx voltage, and all other specifications provided in the Electrical Characteristics table apply to this
parallel output configuration, just as they do to the standard 2-LED application circuit.
THERMAL PROTECTION
The LM2791 has internal thermal protection circuitry to disable the charge pump if the junction temperature
exceeds 150°C. This feature will protect the device from damage due to excessive power dissipation. The device
will recover and operate normally when the junction temperature falls below the maximum operating junction
temperature of 100°C. It is important to have good thermal conduction with a proper layout to reduce thermal
resistance.
POWER EFFICIENCY
An ideal power efficiency for a voltage doubler switched capacitor converter is given as the output voltage of the
doubler over twice the input voltage as follows:
Efficiency = (VDIODE* IDIODE) / ( VIN * IDIODE* Gain) = VDIODE / 2VIN
(2)
In the case of the LM2791, a more accurate efficiency calculation can be applied as the given formula below.
Efficiency = ((VD1* ID1) + (VD2* ID2)) / (ISUPPLY* VIN)
(3)
It is clear that the efficiency will depend on the supply voltage in the above equation. As such, the lower the
supply voltage, the higher the efficiency.
POWER DISSIPATION
The maximum allowable power dissipation that this package is capable of handling can be determined as
follows:
PDMax = (TJMax - TA) / θJA
(4)
where TJMax is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-
ambient thermal resistance of the specified package.
The actual power dissipation of the device can be calculated using this equation:
PDissipation = (2VIN -VDIODE)*ILOAD
(5)
As an example, if VIN in the target application is 4.2V, VDIODE = 3.0V and worse case current consumption is
32mA (16mA for each diode).
PDissipation = ((2*4.2) -3.0)*0.032 = 173mW
(6)
Power dissipation must be less than that allowed by the package. Please refer to the Absolute Maximum Rating
of the LM2791.
PCB LAYOUT CONSIDERATIONS
The WSON is a leadframe based Chip Scale Package (CSP) with very good thermal properties. This package
has an exposed DAP (die attach pad) at the center of the package measuring 2.0mm x 1.2mm. The main
advantage of this exposed DAP is to offer lower thermal resistance when it is soldered to the thermal land on the
PCB. For PCB layout, a 1:1 ratio between the package and the PCB thermal land is highly recommended. To
further enhance thermal conductivity, the PCB thermal land may include vias to a ground plane. For more
detailed instructions on mounting WSON packages, please refer to Application Note AN-1187. (SNOA401)
Copyright © 2001–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM2791
LM2791
SNVS156M –FEBRUARY 2001–REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision L (May 2013) to Revision M
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM2791
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
1000
1000
(1)
(2)
(6)
(3)
(4/5)
LM2791LD-L
NRND
ACTIVE
WSON
WSON
NGY
10
10
TBD
Call TI
CU SN
Call TI
-30 to 85
-30 to 85
SNB
SNB
LM2791LD-L/NOPB
NGY
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2791LD-L
WSON
WSON
NGY
NGY
10
10
1000
1000
178.0
178.0
12.4
12.4
3.3
3.3
3.3
3.3
1.0
1.0
8.0
8.0
12.0
12.0
Q1
Q1
LM2791LD-L/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2791LD-L
WSON
WSON
NGY
NGY
10
10
1000
1000
210.0
213.0
185.0
191.0
35.0
55.0
LM2791LD-L/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NGY0010A
LDA10A (Rev B)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明