LM2796TLX/NOPB [TI]

具有 3/2x 开关电容器升压的双显示白光 LED 驱动器 | YZR | 18 | -30 to 85;


型号：	LM2796TLX/NOPB
厂家：	TEXAS INSTRUMENTS
描述：	具有 3/2x 开关电容器升压的双显示白光 LED 驱动器 \| YZR \| 18 \| -30 to 85 开关驱动接口集成电路电容器驱动器
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中文：	中文翻译
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LM2796

www.ti.com

SNVS273A –MAY 2004–REVISED MAY 2013

LM2796 Dual-Display White LED Driver with 3/2x Switched Capacitor Boost

Check for Samples: LM2796

FEATURES

DESCRIPTION

The LM2796 is a charge-pump based white-LED

driver that is ideal for mobile phone display

backlighting. It can drive up to 7 LEDs in parallel with

up to 20mA through each LED. Regulated internal

current sources deliver excellent current and

brightness matching in all LEDs. The LED-driver

current sources are split into two independently

controlled groups. The primary group (4 LEDs) can

be used to backlight the main phone display. The

second group (3 LEDs) can be used to backlight a

secondary display or to provide other lighting features

(keypad LEDs, for example). Brightness of the two

groups can be adjusted independently with pulse-

width modulated (PWM) digital signals.

•

Drives up to 7 LEDs with up to 20mA Each

LEDs Controlled in 2 Distinct Groups, for

Backlighting 2 Displays (Main LCD and Sub-

LCD)

•

Excellent Current and Brightness Matching

High-Efficiency 3/2x Charge Pump

Extended Li-Ion Input: 2.7V to 5.5V

PWM Brightness Control: 100Hz - 1kHz

18-bump Thin DSBGA Package: (2.1mm x

2.4mm x 0.6mm)

APPLICATIONS

The LM2796 works off an extended Li-Ion input

voltage range (2.7V to 5.5V). Voltage boost is

achieved with a high-efficiency 3/2×-gain charge

pump.

•

Mobile Phone Display Lighting

Mobile Phone Keypad Lighting

PDAs

General LED Lighting

The LM2796 is available in TI’s chip-scale 18-bump

DSBGA package.

Typical Application Circuit

1 mF

Master Enable and Current Source Enables for

ON/OFF Control and PWM Dimming

C1+

C1-

C2+

C2-

ENA

ENB

P_OUT

V_IN

2.7V to 5.5V

3/2× Charge Pump

(1× when V_IN> 4.7V)

LM2796

C_IN

C_POUT

1 mF*

I_SET

D3B

GND

D1A

D2A

D3A

D4A

D1B

D2B

R_SET

*If total LED current is above 80 mA, as can occur

when all 7 outputs are ON simultaneously, 2.2 mF

Capacitors: TDK C1608X5R1A105K,

or equivalent

capacitors are recommended for C_INand C_POUT

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM2796

SNVS273A –MAY 2004–REVISED MAY 2013

www.ti.com

Connection Diagram

Top View

Bottom View

Figure 1. 18-Bump Thin DSBGA Package, Large Bump

Package Number YZR0018

PIN DESCRIPTION

Pin #s

Pin Names

Pin Descriptions

V_IN

Input voltage. Input range: 2.7V to 5.5V.

GND

P_OUT

Ground

A1, B2, A5, E1

Charge pump output. Approximately 1.5×V_IN

C1+, C1-, C2+, C2- Flying capacitor connections.

EN Enable pin. Logic input. High = normal operation, Low = shutdown (charge pump and all

current sources OFF).

D1A, D2A, D3A, D4A LED Outputs - Group A

D6, E5, D4, E3

C5, B4, C3

D1B, D2B, D3B

EN-A

LED Outputs - Group B

Enable for Group-A LEDs (current outputs). Logic input.

High = Group-A LEDs ON. Low = Group A LEDs OFF.

Pulsing this pin with a PWM signal (100Hz-1kHz) can be used to dim LEDs.

EN-B

I_SET

Enable for Group-B LEDs (current outputs). Logic input.

High = Group-B LEDs ON. Low = Group B LEDs OFF.

Pulsing this pin with a PWM signal (100Hz-1kHz) can be used to dim LEDs.

Placing a resistor (R_SET) between this pin and GND sets the LED current for all LEDs. LED

Current = 100 × (1.25V ÷ R_SET).

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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LM2796

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SNVS273A –MAY 2004–REVISED MAY 2013

ABSOLUTE MAXIMUM RATINGS^(1)(2)(3)

V_INpin voltage

-0.3V to 7.1V

EN, ENA, ENB pin voltages

-0.3V to (V_IN+0.3V)w/ 5.6V

max

Continuous Power Dissipation⁽⁴⁾

Internally Limited

150ºC

Junction Temperature (T_J-MAX

Storage Temperature Range

)

-65ºC to +150º C

265ºC

Maximum Lead Temperature (Soldering, 10 sec.)

ESD Rating⁽⁵⁾

Human Body Model

Machine Model

2.0kV

200V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2) All voltages are with respect to the potential at the GND pin.

(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J= 160°C (typ.) and

disengages at T_J= 120°C (typ.). The thermal shutdown function is specified by design.

(5) The Human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin. The machine model is a 200pF capacitor

discharged directly into each pin. MIL-STD-883 3015.7

OPERATING RATING⁽¹⁾⁽²⁾

Input Voltage Range

2.7V to 5.5V

-30°C to +125°C

-30°C to +85°C

Junction Temperature (T_J) Range

Ambient Temperature (T_A) Range⁽³⁾

(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2) All voltages are with respect to the potential at the GND pin.

(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP

125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (θ_JA), as given by the following equation: T_A-MAX= T_J-MAX-OP– (θ_JA× P_D-MAX).

THERMAL PROPERTIES

Juntion-to-Ambient Thermal Resistance (θ_JA

(1)

)

100°C/W

(1) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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ELECTRICAL CHARACTERISTICS⁽¹⁾⁽²⁾

Limits in standard typeface and typical values apply for T_J= 25ºC. Limits in boldface type apply over the full operating

junction temperature range (-30°C ≤ T_J≤ +85°C) . Unless otherwise specified: V_IN= 3.6V; V_Dxx= 3.6V; V(EN) = 2.0V; Group A

and Group B LEDs not ON simultaneously⁽³⁾(ENA = V_INand ENB = GND, or ENA = GND and ENB = V_IN); R_SET= 8.35kΩ;

C_IN, C₁, C₂, and C_POUT= 1µF⁽⁴⁾

Symbol

Parameter

Condition

Min

Typ

Max

Units

3.0V ≤ V_IN≤ 4.2V, and V_IN= 5.5V

2.5V ≤ V_Dxx≤ 3.8V;

R_SET= 8.35kΩ

13.8

(-8%)

16.2

(+8%)

(%)

3.0V ≤ V_IN≤ 5.5V;

2.5V ≤ V_Dxx≤ 3.6V;

R_SET= 6.25kΩ

3.0V ≤ V_IN≤ 5.5V;

2.5V ≤ V_Dxx≤ 3.9V;

R_SET= 12.5kΩ

I_Dxx

Output Current Regulation

2.7V ≤ V_IN≤ 3.0V;

2.5V ≤ V_Dxx≤ 3.3V;

R_SET= 8.35kΩ

ENA and ENB ON (all 7 I_DXoutputs active), V_IN

3.0V, C_IN= C_OUT= 2.2µF

Current Matching Between Any

I_Dxx-MATCHTwo Group A Outputs or Group B V_IN= 3.0V⁽⁵⁾

Outputs

2.7V ≤ V_IN≤ 4.2V;

I_Q

Quiescent Supply Current

No Load Current,

3.5

EN = ON, ENA = ENB = OFF

I_SD

Shutdown Supply Current

I_SETPin Voltage

2.7V ≤ V_IN≤ 5.5V, EN = OFF

2.7V ≤ V_IN≤ 5.5V

4.5

µA

V_SET

1.25

Output Current to Current Set

Ratio

I_Dxx/I_SET

R_OUT

100

2.7

Charge Pump Output

Resistance⁽⁶⁾

V_IN= 3.0V

Ω

I_Dxx= 95% X I_Dxx(nom)

R_SET= 8.35kΩ

(I_Dxx(nom) ≈ 15mA)

320

220

Current Source Headroom Voltage

Requirement⁽⁷⁾

V_HR

I_Dxx= 95%X I_Dxx(nom)

R_SET= 12.5kΩ

(I_Dxx(nom) ≈ 10mA)

f_SW

Switching Frequency

Start-up Time

3.0V ≤ V_IN≤ 4.2V

325

500

100

4.75

675

kHz

µs

t_START

I_Dx= 90% steady state

1.5x to 1x Threshold

Charge pump gain cross-over:

Gain = 1.5 when V_INis below

threshold. Gain = 1 when V_INis

above threshold.

1.5x/1x

1x to 1.5x Threshold

4.55

Logic Pin Specifications: EN, ENA, ENB

V_ILInput Logic Low

2.7V ≤ V_IN≤ 5.5V

0.5

(1) All voltages are with respect to the potential at the GND pin.

(2) Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not specified, but do represent the most

likely norm.

(3) If both LED groups are to be ON simultaneously, the maximum V_Dxxvoltage may need to be derated, depending on minimum input

voltage conditions. Refer to the "MAXIMUM OUTPUT CURRENT, MAXIMUM LED VOLTAGE, MINIMUM INPUT VOLTAGE" section.

(4) C_IN, C_OUT, C₁, and C₂: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics

(5) For the two groups of outputs on a part (Group A and Group B), the following are determined: the maximum output current in the group

(MAX), the minimum output current in the group (MIN), and the average output current of the group (AVG). For each group, two

matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the

matching figure for the group. The matching figure for a given part is considered to be the highest matching figure of the two groups.

The typical specification provided is the most likely norm of the matching figure for all parts.

(6) Output resistance (R_OUT) models all voltage losses in the charge pump. R_OUTcan be used to estimate the voltage at the charge pump

output (P_OUT): V_Pout= (1.5 × V_IN) – (R_OUT× I_OUT). In the equation, I_OUTis the total output current: the sum of all active Dxx output

currents and all current drawn from P_OUT. The equation applies when the charge pump is operating with a gain of 3/2 (V_IN≤ 4.75V typ.).

(7) Headroom voltage: V_HR= V_Pout– V_Dxx. If headroom voltage requirement is not met, LED current regulation will be compromised.

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LM2796

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SNVS273A –MAY 2004–REVISED MAY 2013

ELECTRICAL CHARACTERISTICS⁽¹⁾⁽²⁾(continued)

Limits in standard typeface and typical values apply for T_J= 25ºC. Limits in boldface type apply over the full operating

junction temperature range (-30°C ≤ T_J≤ +85°C) . Unless otherwise specified: V_IN= 3.6V; V_Dxx= 3.6V; V(EN) = 2.0V; Group A

and Group B LEDs not ON simultaneously⁽³⁾(ENA = V_INand ENB = GND, or ENA = GND and ENB = V_IN); R_SET= 8.35kΩ;

C_IN, C₁, C₂, and C_POUT= 1µF⁽⁴⁾

Symbol

V_IH

Parameter

Input Logic High

Condition

Min

1.1

Typ

Max

V_IN

Units

2.7V ≤ V_IN≤ 5.5V

V_ENx= 0V

V_ENx= 3V⁽⁸⁾

0.1

I_LEAK

Input Leakage Current

µA

(8) There is a 300kΩ(typ.) pull-down resistor connected internally between each enable pin (EN, ENA, ENB) and GND.

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LM2796

SNVS273A –MAY 2004–REVISED MAY 2013

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TYPICAL PERFORMANCE CHARACTERISTICS

Unless otherwise specified: V_IN= 3.6V; V_DXX= 3.6V; V(EN) = 2.0V; V(ENA) = 2.0V; V(ENB) = 0V; R_SET= 8.3 kΩ; C_IN, C₁, C₂,

and C_POUT= 1 µF.

LED Current

vs.

Input Voltage

LED Current

vs.

R_SETResistance

16.0

15.5

15.0

14.5

14.0

= 25°C, T = -30°C

= 85°C

2.8 3.1 3.4 3.7 4.0 4.3 4.6 4.9 5.2 5.5

100

120

- INPUT VOLTAGE (V)

RESISTANCE (kW)

SET

Figure 2.

Figure 3.

LED Current

vs.

PWM Duty Cycle,

Charge Pump Output Resistance

vs. Ambient Temperature

PWM Applied to ENA and/or ENB

4.0

3.6

3.2

2.8

2.4

2.0

= 2.7V

= 3.0V

= 3.3V

= 3.6V

-30

120

100

- AMBIENT TEMPERATURE (ºC)

PWM DUTY CYCLE (%)

Figure 4.

Figure 5.

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LM2796

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SNVS273A –MAY 2004–REVISED MAY 2013

CIRCUIT DESCRIPTION

OVERVIEW

The LM2796 is primarily intended for Lithium-Ion battery driven white-LED drive applications, and is well suited to

drive white LEDs that are used for backlighting small-format displays. The part has seven matched constant-

current outputs, each capable of driving up to 20mA (or more) through white LEDs. The well-matched current

sources ensure the current through all the LEDs is virtually identical. This keeps brightness of all LEDs matched

to near perfection so that they can provide a consistent backlight over the entire display.

The core of the LM2796 is a 1.5x/1x dual-mode charge pump. The input of the charge pump is connected to the

V_INpin. The recommended input voltage range of the LM2796 is 2.7V to 5.5V. The output of the charge pump is

the P_OUTpin ( “Pump OUTput”). The output voltage of the charge pump is unregulated and varies with input

voltage and load current.

The charge pump operates in the 1.5x mode when the input voltage is below 4.75V (typ.). In this mode, the

input-to-output voltage gain of the charge pump is 1.5, and the voltage at the output of the charge pump will be

approximately 1.5x the input voltage (V(P_OUT) ≈ 1.5 * V_IN). When in the 1.5x mode, the charge pump provides

the voltage boost that is required to drive white LEDs from a Li-Ion battery. (White LEDs typically have a forward

voltage in the range of 3.3V to 4.0V. A Li-Ion battery typically is not considered to be fully discharged until the

battery voltage falls to 3.0V (approx.) )

The charge pump operates in the 1x mode when the input voltage is above 4.75V (typ.). In these conditions,

voltage boost is not required to drive the LEDs, so the charge pump merely passes the input voltage to P_OUT

(V(P_OUT) ≈ V_IN). This reduces the input current and the power dissipation of the LM2796 when the input voltage is

high.

The matched current outputs are generated with a precision current mirror that is biased off the charge pump

output. Matched currents are ensured with the use of tightly matched internal devices and internal mismatch

cancellation circuitry. Top-side current drive allows LEDs to be connected between each current output and

GND, simplifying PWB routing and connectivity.

There are seven regulated current outputs. These seven outputs are split into two groups, a group of 4 outputs

and a group of 3 outputs. There is an ON/OFF control pin for each group.

The DC current through the LEDs is programmed with an external resistor. Changing currents on-the-fly can be

achieved with the use of digital pulse (PWM) signals.

ENABLE PINS: EN, ENA, ENB

The LM2796 has 3 enable pins. All three are active-high logic (HIGH = ON). There are internal pull-down

resistors (300kΩ typ.) that are connected internally between each of the enable pins and GND.

The EN pin is the master enable pin for the part. When voltage on this pin is low (<0.5V), the part is in shutdown

mode. All internal circuitry is OFF and the part consumes very little supply current when the LM2796 is

shutdown. When the voltage on the EN pin is high (>1.1V), the part is active. The charge pump is ON, and it is

possible to turn on the output currents to drive the LEDs.

ENA and ENB are used to turn the output currents ON and OFF. ENA activates/deactivates the four group-A

outputs (D1A-D4A). ENB activates/deactivates the three group-B outputs (D1B-D3B).

SETTING LED CURRENTS

The output currents of the LM2796 can be set to a desired value simply by connecting an appropriately sized

resistor (R_SET) between the I_SETpin of the LM2796 and GND. The output currents (LED currents) are proportional

to the current that flows out of the I_SETpin. The output currents are a factor of 100 greater than the I_SETcurrent.

The feedback loop of an internal amplifier sets the voltage of the I_SETpin to 1.25V (typ.). Placing a resistor

between I_SETand GND programs the I_SETcurrent, and thus the LED currents. The statements above are

simplified in the equations below:

I_Dxx= 100 ×(V_SET/ R_SET

)

(1)

(2)

R_SET= 100 × (1.25V / I_Dxx

)

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Maximum Output Current, Maximum LED Voltage, Minimum Input Voltage

The LM2796 can drive 7 LEDs at 15mA each from an input voltage as low as 3.0V, so long as the LEDs have a

forward voltage of 3.6V or less (room temperature).

The statement above is a simple example of the LED drive capabilities of the LM2796. The statement contains

the key application parameters that are required to validate an LED-drive design using the LM2796: LED current

(I_LED), number of active LEDs (N), LED forward voltage (V_LED), and minimum input voltage (V_IN-MIN).

The equation below can be used to estimate the total output current capability of the LM2796:

I_{LED_MAX}= ((1.5 x V_IN) - V_LED) / ((N x R_OUT) + k_HR

)

(3)

I_{LED_MAX}= ((1.5 x V_IN) - V_LED) / ((N x 2.7Ω) + 22mV/mA)

R_OUT– Output resistance. This parameter models the internal losses of the charge pump that result in voltage

droop at the pump output P_OUT. Since the magnitude of the voltage droop is proportional to the total output

current of the charge pump, the loss parameter is modeled as a resistance. The output resistance of the LM2796

is typically 2.7Ω (V_IN= 3.0V, T_A= 25°C). In equation form:

V_POUT= 1.5×V_IN– N×I_LED×R_OUT

(4)

k_HR– Headroom constant. This parameter models the minimum voltage required to be present across the current

sources for them to regulate properly. This minimum voltage is proportional to the programmed LED current, so

the constant has units of mV/mA. The typical k_HRof the LM2796 is 22mV/mA. In equation form:

(V_POUT– V_LED) > k_HR×I_LED

(5)

The "I_LED-MAX" equation (Equation 3) is obtained from combining the R_OUTequation (Equation 4) with the k_HR

equation (Equation 5) and solving for I_LED. Maximum LED current is highly dependent on minimum input voltage

and LED forward voltage. Output current capability can be increased by raising the minimum input voltage of the

application, or by selecting an LED with a lower forward voltage. Excessive power dissipation may also limit

output current capability of an application.

Soft Start

The LM2796 contains internal soft-start circuitry to limit input inrush currents when the part is enabled. Soft start

is implemented internally with a controlled turn-on of the internal voltage reference. During soft start, the current

through the LED outputs rise at the rate of the reference voltage ramp. Due to the soft-start circuitry, turn-on time

of the LM2796 is approximately 100µs (typ.).

Thermal Protection

Internal thermal protection circuitry disables the LM2796 when the junction temperature exceeds 160°C (typ.).

This feature protects the device from being damaged by high die temperatures that might otherwise result from

excessive power dissipation. The device will recover and operate normally when the junction temperature falls

below 120°C (typ.). It is important that the board layout provides good thermal conduction. This will help to keep

the junction temperature within specified operating ratings.

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APPLICATIONS INFORMATION

ADJUSTING LED BRIGHTNESS (PWM control)

Perceived LED brightness can be adjusted using a PWM control signal to turn the LM2796 current sources ON

and OFF at a rate faster than perceptible by the eye. When this is done, the total brightness perceived is

proportional to the duty cycle (D) of the PWM signal (D = the percentage of time that the LED is on in every

PWM cycle). A simple example: if the LEDs are driven at 15mA each with a PWM signal that has a 50% duty

cycle, perceived LED brightness will be about half as bright as compared to when the LEDs are driven

continuously with 15mA. A PWM signal thus provides brightness (dimming) control for the solution.

The minimum recommended PWM frequency is 100Hz. Frequencies below this may be visibly noticeable as

flicker or blinking. The maximum recommended PWM frequency is 1kHz. Frequencies above this may cause

interference with internal current driver circuitry.

The preferred method for applying a PWM signal to adjust brightness is to keep the master EN voltage ON

continuously and to apply the PWM signal(s) to the current source enable pin(s): ENA and/or ENB. The benefit of

this type of connection can be best understood with a contrary example. When a PWM signal is connected to the

master enable (EN) pin, the charge pump repeatedly turns on and off. Every time the charge pump turns on,

there is an inrush of current as capacitances, both internal and external, are recharged. This inrush current

results in a current and voltage spike at the input of the part. By only applying the PWM signal to ENA/ENB, the

charge pump stays on continuously and much lower input noise results.

In cases where a PWM signal must be connected to the EN pin, measures can be taken to reduce the

magnitude of the charge-pump turn-on voltage spikes. More input capacitance, series resistors and/or ferrite

beads may provide benefits.

If the current and voltage spikes can be tolerated, connecting the PWM signal to the EN pin does provide a

benefit: lower supply current when the PWM signal is active. When the PWM signal is low, the LM2796 will be

shutdown and input current will only be a few micro-amps. This results in a lower time-averaged input current

than the prior suggestion, where EN is kept on continuously.

CAPACITOR SELECTION

The LM2796 requires 4 external capacitors for proper operation. Surface-mount multi-layer ceramic capacitors

are recommended. These capacitors are small, inexpensive and have very low equivalent series resistance (ESR

<20mW typ.). Tantalum capacitors, OS-CON capacitors, and aluminum electrolytic capacitors are not

recommended for use with the LM2796 due to their high ESR, as compared to ceramic capacitors.

For most applications, ceramic capacitors with X7R or X5R temperature characteristic are preferred for use with

the LM2796. These capacitors have tight capacitance tolerance (as good as ±10%) and hold their value over

temperature (X7R: ±15% over -55°C to 125°C; X5R: ±15% over -55°C to 85°C).

Capacitors with Y5V or Z5U temperature characteristic are generally not recommended for use with the LM2796.

Capacitors with these temperature characteristics typically have wide capacitance tolerance (+80%, -20%) and

vary significantly over temperature (Y5V: +22%, -82% over -30°C to +85°C range; Z5U: +22%, -56% over +10°C

to +85°C range). Under some conditions, a nominal 1µF Y5V or Z5U capacitor could have a capacitance of only

0.1µF. Such detrimental deviation is likely to cause Y5V and Z5U capacitors to fail to meet the minimum

capacitance requirements of the LM2796.

The minimum recommended voltage rating for these capacitors is 10V.

DSBGA MOUNTING

The LM2796 is an 18-bump DSBGA with a bump size of approximately 300 micron diameter. The DSBGA

package requires specific mounting techniques detailed in Texas Instruments' Application Note 1112 (Literature

Number SNVA009).

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REVISION HISTORY

Changes from Original (May 2013) to Revision A

Page

•

Changed layout of National Data Sheet to TI format ............................................................................................................ 9

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PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

LM2796TL/NOPB

LM2796TLX/NOPB

ACTIVE

DSBGA

YZR

250

RoHS & Green

SNAGCU

Level-1-260C-UNLIM

-30 to 85

SAJB

3000 RoHS & Green

SNAGCU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

9-Aug-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

LM2796TL/NOPB

LM2796TLX/NOPB

DSBGA

YZR

250

178.0

8.4

2.29

2.59

0.76

4.0

8.0

3000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

9-Aug-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

LM2796TL/NOPB

LM2796TLX/NOPB

DSBGA

YZR

250

210.0

185.0

35.0

3000

Pack Materials-Page 2

MECHANICAL DATA

YZR0018xxx

0.600±0.075

TLA18XXX (Rev D)

D: Max = 2.454 mm, Min =2.393 mm

E: Max = 2.149 mm, Min =2.089 mm

4215052/A

12/12

A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

NOTES:

www.ti.com

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LM2796TLX/NOPB [TI]

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