LM2832ZMYX/NOPB [TI]

High Frequency 2.0A Load - Step-Down DC-DC Regulator 8-MSOP-PowerPAD -40 to 125;


型号：	LM2832ZMYX/NOPB
厂家：	TEXAS INSTRUMENTS
描述：	High Frequency 2.0A Load - Step-Down DC-DC Regulator 8-MSOP-PowerPAD -40 to 125 信息通信管理开关光电二极管
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LM2832

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SNVS455A –AUGUST 2006–REVISED APRIL 2013

LM2832 High Frequency 2.0A Load - Step-Down DC-DC Regulator

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FEATURES

DESCRIPTION

The LM2832 regulator is a monolithic, high frequency,

PWM step-down DC/DC converter in a 6 Pin WSON

and a 8 Pin eMSOP-PowerPAD package. It provides

all the active functions to provide local DC/DC

conversion with fast transient response and accurate

regulation in the smallest possible PCB area. With a

minimum of external components, the LM2832 is

easy to use. The ability to drive 2.0A loads with an

internal 150 mΩ PMOS switch using state-of-the-art

0.5 µm BiCMOS technology results in the best power

density available. The world-class control circuitry

allows on-times as low as 30ns, thus supporting

exceptionally high frequency conversion over the

entire 3V to 5.5V input operating range down to the

minimum output voltage of 0.6V. Switching frequency

is internally set to 550 kHz, 1.6 MHz, or 3.0 MHz,

allowing the use of extremely small surface mount

inductors and chip capacitors. Even though the

operating frequency is high, efficiencies up to 93%

are easy to achieve. External shutdown is included,

featuring an ultra-low stand-by current of 30 nA. The

LM2832 utilizes current-mode control and internal

compensation to provide high-performance regulation

over a wide range of operating conditions. Additional

features include internal soft-start circuitry to reduce

inrush current, pulse-by-pulse current limit, thermal

shutdown, and output over-voltage protection.

•

Input Voltage Range of 3.0V to 5.5V

Output Voltage Range of 0.6V to 4.5V

2.0A Output Current

High Switching Frequencies

–

1.6MHz (LM2832X)

0.55MHz (LM2832Y)

3.0MHz (LM2832Z)

•

150mΩ PMOS Switch

0.6V, 2% Internal Voltage Reference

Internal Soft-Start

Current Mode, PWM Operation

Thermal Shutdown

Over Voltage Protection

APPLICATIONS

•

Local 5V to Vcore Step-Down Converters

Core Power in HDDs

Set-Top Boxes

USB Powered Devices

DSL Modems

Typical Application Circuit

GND

LM2832

= 3.3V @ 2.0A

= 5V

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM2832

SNVS455A –AUGUST 2006–REVISED APRIL 2013

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Connection Diagrams

VIND

VINA

GND

DAP

GND

VINA

VIND

DAP

GND

Figure 1. 6-Pin WSON

Figure 2. 8-Pin eMSOP-PowerPAD

PIN DESCRIPTIONS 8-PIN eMSOP-PowerPAD

Name

VIND

VINA

GND

Function

Power Input supply.

Control circuitry supply voltage. Connect VINA to VIND on PC board.

3, 5, 7

Signal and power ground pin. Place the bottom resistor of the feedback network as close as

possible to this pin.

Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than

VIN + 0.3V.

Feedback pin. Connect to external resistor divider to set output voltage.

Output switch. Connect to the inductor and catch diode.

DAP

Die Attach Pad

Connect to system ground for low thermal impedance, but it cannot be used as a primary GND

connection.

PIN DESCRIPTIONS 6-PIN WSON

Function

Name

Feedback pin. Connect to external resistor divider to set output voltage.

GND

Signal and power ground pin. Place the bottom resistor of the feedback network as close as

possible to this pin.

VIND

VINA

Output switch. Connect to the inductor and catch diode.

Power Input supply.

Control circuitry supply voltage. Connect VINA to VIND on PC board.

Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than

VINA + 0.3V.

DAP

Die Attach Pad

Connect to system ground for low thermal impedance, but it cannot be used as a primary GND

connection.

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Absolute Maximum Ratings^{(1) (2)}

VIN

-0.5V to 7V

-0.5V to 3V

-0.5V to 7V

2kV

FB Voltage

EN Voltage

SW Voltage

ESD Susceptibility

Junction Temperature⁽³⁾

Storage Temperature

Soldering Information

150°C

−65°C to +150°C

220°C

Infrared or Convection Reflow (15 sec)

(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.

Operating Ratings

VIN

3V to 5.5V

Junction Temperature

−40°C to +125°C

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Electrical Characteristics

VIN = 5V unless otherwise indicated under the Conditions column. Limits in standard type are for T_J= 25°C only; limits in

boldface type apply over the junction temperature (T_J) range of -40°C to +125°C. Minimum and Maximum limits are ensured

through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T_J= 25°C, and are

provided for reference purposes only.

Symbol

Parameter

Conditions

Min

Typ

Max

0.612

0.616

Units

WSON-6 Package

0.588

0.584

0.600

V_FB

Feedback Voltage

eMSOP-PowerPAD-8

Package

ΔV_FB/V_IN

Feedback Voltage Line Regulation

Feedback Input Bias Current

V_IN= 3V to 5V

0.02

0.1

2.73

2.3

0.43

1.6

0.55

3.0

%/V

I_B

100

V_INRising

V_INFalling

2.90

Undervoltage Lockout

UVLO Hysteresis

UVLO

F_SW

1.85

LM2832-X

LM2832-Y

LM2832-Z

LM2832-X

LM2832-Y

LM2832-Z

LM2832-X

LM2832-Y

LM2832-Z

WSON-6 Package

1.2

0.4

2.25

1.95

0.7

Switching Frequency

Maximum Duty Cycle

MHz

3.75

D_MAX

D_MIN

Minimum Duty Cycle

Switch On Resistance

150

155

R_DS(ON)

mΩ

eMSOP-PowerPAD-8

Package

240

0.4

I_CL

Switch Current Limit

Shutdown Threshold Voltage

Enable Threshold Voltage

Switch Leakage

V_IN= 3.3V

2.4

1.8

3.25

V_{EN_TH}

I_SW

I_EN

100

3.3

2.8

4.3

Enable Pin Current

Sink/Source

LM2832X V_FB= 0.55

LM2831Y V_FB= 0.55

LM2832Z V_FB= 0.55

All Options V_EN= 0V

Quiescent Current (switching)

4.5

6.5

I_Q

Quiescent Current (shutdown)

Junction to Ambient

0 LFPM Air Flow⁽¹⁾

WSON-6 and eMSOP-

PowerPAD-8 Packages

θ_JA

°C/W

WSON-6 and eMSOP-

PowerPAD-8 Packages

θ_JC

Junction to Case⁽¹⁾

°C/W

°C

T_SD

Thermal Shutdown Temperature

165

(1) Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.

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Typical Performance Characteristics

All curves taken at VIN = 5.0V with configuration in typical application circuit shown in Applications Information section of this

datasheet. T_J= 25°C, unless otherwise specified.

η vs Load "X, Y and Z" Vin = 3.3V, Vo = 1.8V

η vs Load "X" Vin = 5V, Vo = 1.8V & 3.3V

Figure 3.

Figure 4.

η vs Load - "Y" Vin = 5V, Vo = 3.3V & 1.8V

η vs Load "Z" Vin = 5V, Vo = 3.3V & 1.8V

Figure 5.

Figure 6.

Load Regulation Vin = 3.3V, Vo = 1.8V (All Options)

Load Regulation Vin = 5V, Vo = 1.8V (All Options)

Figure 7.

Figure 8.

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Typical Performance Characteristics (continued)

All curves taken at VIN = 5.0V with configuration in typical application circuit shown in Applications Information section of this

datasheet. T_J= 25°C, unless otherwise specified.

Load Regulation Vin = 5V, Vo = 3.3V (All Options)

Oscillator Frequency vs Temperature - "X"

1.81

1.76

1.71

1.66

1.61

1.56

1.51

1.46

1.41

1.36

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

Figure 9.

Figure 10.

Oscillator Frequency vs Temperature - "Y"

Oscillator Frequency vs Temperature - "Z"

3.45

0.60

3.35

3.25

3.15

3.05

2.95

2.85

2.75

0.58

0.56

0.54

0.52

0.50

0.48

2.65

2.55

0.46

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

TEMPERATURE (°C)

Figure 11.

Figure 12.

Current Limit vs Temperature Vin = 3.3V

RDSON vs Temperature (WSON-6 Package)

3800

3700

3600

3500

3400

3300

3200

3100

3000

2900

2800

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (^oC)

Figure 13.

Figure 14.

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Typical Performance Characteristics (continued)

All curves taken at VIN = 5.0V with configuration in typical application circuit shown in Applications Information section of this

datasheet. T_J= 25°C, unless otherwise specified.

RDSON vs Temperature (eMSOP-PowerPAD-8 Package)

LM2832X I_Q(Quiescent Current)

3.6

3.5

3.4

3.3

3.2

3.1

3.0

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

Figure 15.

Figure 16.

LM2832Y I_Q(Quiescent Current)

LM2832Z I_Q(Quiescent Current)

2.65

4.6

2.6

2.55

2.5

4.5

4.4

4.3

4.2

4.1

4.0

2.45

2.4

2.35

2.3

2.25

2.2

2.15

-45

-40 -10 20 50 80 110 125 130

TEMPERATURE (°C)

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

Figure 17.

Figure 18.

Line Regulation Vo = 1.8V, Io = 500mA

V_FBvs Temperature

0.610

0.605

0.600

0.595

0.590

-45 -40 -10 20 50 80 110 125 130

TEMPERATURE (ºC)

Figure 19.

Figure 20.

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Typical Performance Characteristics (continued)

All curves taken at VIN = 5.0V with configuration in typical application circuit shown in Applications Information section of this

datasheet. T_J= 25°C, unless otherwise specified.

Gain vs Frequency (Vin = 5V, Vo = 1.2V @ 1A)

Phase Plot vs Frequency (Vin = 5V, Vo = 1.2V @ 1A)

Figure 21.

Figure 22.

Simplified Block Diagram

VIN

SENSE

Thermal

ENABLE and UVLO

SHDN

LIMIT

OVP

SHDN

1.15x V

REF

Ramp_Artificial

Control Logic

SENSE

1.6 MHz

PFET

DRIVER

Internal -Comp

= 0.6V

REF

SOFT-START

Internal - LDO

GND

Figure 23.

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APPLICATIONS INFORMATION

THEORY OF OPERATION

The LM2832 is a constant frequency PWM buck regulator IC that delivers a 2.0A load current. The regulator has

a preset switching frequency of 1.6MHz or 3.0MHz. This high frequency allows the LM2832 to operate with small

surface mount capacitors and inductors, resulting in a DC/DC converter that requires a minimum amount of

board space. The LM2832 is internally compensated, so it is simple to use and requires few external

components. The LM2832 uses current-mode control to regulate the output voltage. The following operating

description of the LM2832 will refer to the Simplified Block Diagram (Figure 23) and to the waveforms in

Figure 24. The LM2832 supplies a regulated output voltage by switching the internal PMOS control switch at

constant frequency and variable duty cycle. A switching cycle begins at the falling edge of the reset pulse

generated by the internal oscillator. When this pulse goes low, the output control logic turns on the internal

PMOS control switch. During this on-time, the SW pin voltage (V_SW) swings up to approximately V_IN, and the

inductor current (I_L) increases with a linear slope. I_Lis measured by the current sense amplifier, which generates

an output proportional to the switch current. The sense signal is summed with the regulator’s corrective ramp and

compared to the error amplifier’s output, which is proportional to the difference between the feedback voltage

and V_REF. When the PWM comparator output goes high, the output switch turns off until the next switching cycle

begins. During the switch off-time, inductor current discharges through the Schottky catch diode, which forces the

SW pin to swing below ground by the forward voltage (V_D) of the Schottky catch diode. The regulator loop

adjusts the duty cycle (D) to maintain a constant output voltage.

D = T /T

ON SW

Voltage

OFF

Inductor

Current

Figure 24. Typical Waveforms

SOFT-START

This function forces V_OUTto increase at a controlled rate during start up. During soft-start, the error amplifier’s

reference voltage ramps from 0V to its nominal value of 0.6V in approximately 600 µs. This forces the regulator

output to ramp up in a controlled fashion, which helps reduce inrush current.

OUTPUT OVERVOLTAGE PROTECTION

The over-voltage comparator compares the FB pin voltage to a voltage that is 15% higher than the internal

reference V_REF. Once the FB pin voltage goes 15% above the internal reference, the internal PMOS control

switch is turned off, which allows the output voltage to decrease toward regulation.

UNDERVOLTAGE LOCKOUT

Under-voltage lockout (UVLO) prevents the LM2832 from operating until the input voltage exceeds 2.73V (typ).

The UVLO threshold has approximately 430 mV of hysteresis, so the part will operate until V_INdrops below 2.3V

(typ). Hysteresis prevents the part from turning off during power up if V_INis non-monotonic.

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CURRENT LIMIT

The LM2832 uses cycle-by-cycle current limiting to protect the output switch. During each switching cycle, a

current limit comparator detects if the output switch current exceeds 3.25A (typ), and turns off the switch until the

next switching cycle begins.

THERMAL SHUTDOWN

Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature

exceeds 165°C. After thermal shutdown occurs, the output switch doesn’t turn on until the junction temperature

drops to approximately 150°C.

Design Guide

INDUCTOR SELECTION

The Duty Cycle (D) can be approximated quickly using the ratio of output voltage (V_O) to input voltage (V_IN):

V_OUT

D =

V_IN

(1)

The catch diode (D1) forward voltage drop and the voltage drop across the internal PMOS must be included to

calculate a more accurate duty cycle. Calculate D by using the following formula:

V_OUT+ V_D

D =

V_IN+ V_D- V_SW

(2)

V_SWcan be approximated by:

V_SW= I_OUTx R_DSON

(3)

The diode forward drop (V_D) can range from 0.3V to 0.7V depending on the quality of the diode. The lower the

V_D, the higher the operating efficiency of the converter. The inductor value determines the output ripple current.

Lower inductor values decrease the size of the inductor, but increase the output ripple current. An increase in the

inductor value will decrease the output ripple current.

One must ensure that the minimum current limit (2.4A) is not exceeded, so the peak current in the inductor must

be calculated. The peak current (I_LPK) in the inductor is calculated by:

I_LPK= I_OUT+ Δi_L

(4)

OUT

- V

OUT

Figure 25. Inductor Current

V_IN- V_OUT

2Di_L

DT_S

(5)

(6)

In general,

Δi_L= 0.1 x (I_OUT) → 0.2 x (I_OUT

)

If Δi_L= 20% of 2A, the peak current in the inductor will be 2.4A. The minimum ensured current limit over all

operating conditions is 2.4A. One can either reduce Δi_L, or make the engineering judgment that zero margin will

be safe enough. The typical current limit is 3.25A.

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The LM2832 operates at frequencies allowing the use of ceramic output capacitors without compromising

transient response. Ceramic capacitors allow higher inductor ripple without significantly increasing output ripple.

See the OUTPUT CAPACITOR for more details on calculating output voltage ripple. Now that the ripple current

is determined, the inductance is calculated by:

DT_S

2Di_L

x (V_IN- V_OUT

)

L =

where

T_S=

f_S

(8)

When selecting an inductor, make sure that it is capable of supporting the peak output current without saturating.

Inductor saturation will result in a sudden reduction in inductance and prevent the regulator from operating

correctly. Because of the speed of the internal current limit, the peak current of the inductor need only be

specified for the required maximum output current. For example, if the designed maximum output current is 1.0A

and the peak current is 1.25A, then the inductor should be specified with a saturation current limit of > 1.25A.

There is no need to specify the saturation or peak current of the inductor at the 3.25A typical switch current limit.

The difference in inductor size is a factor of 5. Because of the operating frequency of the LM2832, ferrite based

inductors are preferred to minimize core losses. This presents little restriction since the variety of ferrite-based

inductors is huge. Lastly, inductors with lower series resistance (R_DCR) will provide better operating efficiency. For

recommended inductors see Example Circuits.

INPUT CAPACITOR

An input capacitor is necessary to ensure that V_INdoes not drop excessively during switching transients. The

primary specifications of the input capacitor are capacitance, voltage, RMS current rating, and ESL (Equivalent

Series Inductance). The recommended input capacitance is 22 µF.The input voltage rating is specifically stated

by the capacitor manufacturer. Make sure to check any recommended deratings and also verify if there is any

significant change in capacitance at the operating input voltage and the operating temperature. The input

capacitor maximum RMS input current rating (I_RMS-IN) must be greater than:

Di²

D I_OUT²(1-D) +

I_{RMS_IN}

(9)

Neglecting inductor ripple simplifies the above equation to:

I_{RMS_IN}= I_OUT

D(1 - D)

(10)

It can be shown from the above equation that maximum RMS capacitor current occurs when D = 0.5. Always

calculate the RMS at the point where the duty cycle D is closest to 0.5. The ESL of an input capacitor is usually

determined by the effective cross sectional area of the current path. A large leaded capacitor will have high ESL

and a 0805 ceramic chip capacitor will have very low ESL. At the operating frequencies of the LM2832, leaded

capacitors may have an ESL so large that the resulting impedance (2πfL) will be higher than that required to

provide stable operation. As a result, surface mount capacitors are strongly recommended.

Sanyo POSCAP, Tantalum or Niobium, Panasonic SP, and multilayer ceramic capacitors (MLCC) are all good

choices for both input and output capacitors and have very low ESL. For MLCCs it is recommended to use X7R

or X5R type capacitors due to their tolerance and temperature characteristics. Consult capacitor manufacturer

datasheets to see how rated capacitance varies over operating conditions.

OUTPUT CAPACITOR

The output capacitor is selected based upon the desired output ripple and transient response. The initial current

of a load transient is provided mainly by the output capacitor. The output ripple of the converter is:

R_ESR

DV_OUT= DI_L

8 x F_SWx C_OUT

(11)

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When using MLCCs, the ESR is typically so low that the capacitive ripple may dominate. When this occurs, the

output ripple will be approximately sinusoidal and 90° phase shifted from the switching action. Given the

availability and quality of MLCCs and the expected output voltage of designs using the LM2832, there is really no

need to review any other capacitor technologies. Another benefit of ceramic capacitors is their ability to bypass

high frequency noise. A certain amount of switching edge noise will couple through parasitic capacitances in the

inductor to the output. A ceramic capacitor will bypass this noise while a tantalum will not. Since the output

capacitor is one of the two external components that control the stability of the regulator control loop, most

applications will require a minimum of 22 µF of output capacitance. Capacitance often, but not always, can be

increased significantly with little detriment to the regulator stability. Like the input capacitor, recommended

multilayer ceramic capacitors are X7R or X5R types.

CATCH DIODE

The catch diode (D1) conducts during the switch off-time. A Schottky diode is recommended for its fast switching

times and low forward voltage drop. The catch diode should be chosen so that its current rating is greater than:

I_D1= I_OUTx (1-D)

(12)

The reverse breakdown rating of the diode must be at least the maximum input voltage plus appropriate margin.

To improve efficiency, choose a Schottky diode with a low forward voltage drop.

OUTPUT VOLTAGE

The output voltage is set using the following equation where R2 is connected between the FB pin and GND, and

R1 is connected between V_Oand the FB pin. A good value for R2 is 10kΩ. When designing a unity gain

converter (Vo = 0.6V), R1 should be between 0Ω and 100Ω, and R2 should be equal or greater than 10kΩ.

V_OUT

x R2

- 1

R1 =

V_REF

V_REF= 0.60V

(13)

(14)

PCB LAYOUT CONSIDERATIONS

When planning layout there are a few things to consider when trying to achieve a clean, regulated output. The

most important consideration is the close coupling of the GND connections of the input capacitor and the catch

diode D1. These ground ends should be close to one another and be connected to the GND plane with at least

two through-holes. Place these components as close to the IC as possible. Next in importance is the location of

the GND connection of the output capacitor, which should be near the GND connections of CIN and D1. There

should be a continuous ground plane on the bottom layer of a two-layer board except under the switching node

island. The FB pin is a high impedance node and care should be taken to make the FB trace short to avoid noise

pickup and inaccurate regulation. The feedback resistors should be placed as close as possible to the IC, with

the GND of R1 placed as close as possible to the GND of the IC. The V_OUTtrace to R2 should be routed away

from the inductor and any other traces that are switching. High AC currents flow through the V_IN, SW and V_OUT

traces, so they should be as short and wide as possible. However, making the traces wide increases radiated

noise, so the designer must make this trade-off. Radiated noise can be decreased by choosing a shielded

inductor. The remaining components should also be placed as close as possible to the IC. Please see

Application Note AN-1229 SNVA054 for further considerations and the LM2832 demo board as an example of a

four-layer layout.

Calculating Efficiency, and Junction Temperature

The complete LM2832 DC/DC converter efficiency can be calculated in the following manner.

P_OUT

h =

P_IN

(15)

P_OUT

h =

P_OUT+ P_LOSS

(16)

Calculations for determining the most significant power losses are shown below. Other losses totaling less than

2% are not discussed.

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Power loss (P_LOSS) is the sum of two basic types of losses in the converter: switching and conduction.

Conduction losses usually dominate at higher output loads, whereas switching losses remain relatively fixed and

dominate at lower output loads. The first step in determining the losses is to calculate the duty cycle (D):

V_OUT+ V_D

D =

V_IN+ V_D- V_SW

(17)

V_SWis the voltage drop across the internal PFET when it is on, and is equal to:

V_SW= I_OUTx R_DSON

(18)

V_Dis the forward voltage drop across the Schottky catch diode. It can be obtained from the diode manufactures

Electrical Characteristics section. If the voltage drop across the inductor (V_DCR) is accounted for, the equation

becomes:

V_OUT+ V_D+ V_DCR

D =

V_IN+ V_D+ V_DCR- V_SW

(19)

The conduction losses in the free-wheeling Schottky diode are calculated as follows:

P_DIODE= V_Dx I_OUTx (1-D)

(20)

Often this is the single most significant power loss in the circuit. Care should be taken to choose a Schottky

diode that has a low forward voltage drop.

Another significant external power loss is the conduction loss in the output inductor. The equation can be

simplified to:

P_IND= I_OUT²x R_DCR

(21)

The LM2832 conduction loss is mainly associated with the internal PFET:

Di_L

I_OUT

P_COND= (I_OUT²x D)

R_DSON

1 +

(22)

(23)

If the inductor ripple current is fairly small, the conduction losses can be simplified to:

P_COND= I_OUT²x R_DSONx D

Switching losses are also associated with the internal PFET. They occur during the switch on and off transition

periods, where voltages and currents overlap resulting in power loss. The simplest means to determine this loss

is to empirically measuring the rise and fall times (10% to 90%) of the switch at the switch node.

Switching Power Loss is calculated as follows:

P_SWR= 1/2(V_INx I_OUTx F_SWx T_RISE

)

(24)

(25)

(26)

P_SWF= 1/2(V_INx I_OUTx F_SWx T_FALL

)

P_SW= P_SWR+ P_SWF

Another loss is the power required for operation of the internal circuitry:

P_Q= I_Qx V_IN

(27)

I_Qis the quiescent operating current, and is typically around 2.5mA for the 0.55MHz frequency option.

Typical Application power losses are:

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Table 1. Power Loss Tabulation

V_IN

V_OUT

I_OUT

V_D

5.0V

3.3V

1.75A

0.45V

550kHz

2.5mA

4nS

P_OUT

5.78W

P_DIODE

262mW

F_SW

I_Q

P_Q

P_SWR

12.5mW

10mW

T_RISE

T_FALL

R_DS(ON)

IND_DCR

4nS

P_SWF

10mW

150mΩ

50mΩ

0.667

88%

P_COND

P_IND

P_LOSS

P_INTERNAL

306mW

153mW

753mW

339mW

ΣP_COND+ P_SW+ P_DIODE+ P_IND+ P_Q= P_LOSS

ΣP_COND+ P_SWF+ P_SWR+ P_Q= P_INTERNAL

P_INTERNAL= 339mW

(28)

(29)

(30)

Thermal Definitions

T_J

Chip junction temperature

Ambient temperature

T_A

R_θJCThermal resistance from chip junction to device case

R_θJAThermal resistance from chip junction to ambient air

Heat in the LM2832 due to internal power dissipation is removed through conduction and/or convection.

Conduction Heat transfer occurs through cross sectional areas of material. Depending on the material, the

transfer of heat can be considered to have poor to good thermal conductivity properties (insulator vs.

conductor).

Heat Transfer goes as:

Silicon → package → lead frame → PCB

Convection Heat transfer is by means of airflow. This could be from a fan or natural convection. Natural

convection occurs when air currents rise from the hot device to cooler air.

Thermal impedance is defined as:

R_q=

Power

(31)

(32)

Thermal impedance from the silicon junction to the ambient air is defined as:

T_J- T_A

Power

R_qJA

The PCB size, weight of copper used to route traces and ground plane, and number of layers within the PCB can

greatly effect R_θJA. The type and number of thermal vias can also make a large difference in the thermal

impedance. Thermal vias are necessary in most applications. They conduct heat from the surface of the PCB to

the ground plane. Four to six thermal vias should be placed under the exposed pad to the ground plane if the

WSON package is used.

Thermal impedance also depends on the thermal properties of the application operating conditions (Vin, Vo, Io

etc), and the surrounding circuitry.

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Silicon Junction Temperature Determination Method 1:

To accurately measure the silicon temperature for a given application, two methods can be used. The first

method requires the user to know the thermal impedance of the silicon junction to top case temperature.

Some clarification needs to be made before we go any further.

_θJCis the thermal impedance from all six sides of an IC package to silicon junction.

_ΦJCis the thermal impedance from top case to the silicon junction.

In this data sheet we will use R_ΦJCso that it allows the user to measure top case temperature with a small

thermocouple attached to the top case.

R_ΦJCis approximately 30°C/Watt for the 6-pin WSON package with the exposed pad. Knowing the internal

dissipation from the efficiency calculation given previously, and the case temperature, which can be empirically

measured on the bench we have:

T_J- T_C

Power

R_FJC

(33)

(34)

Therefore:

T_j= (R_ΦJCx P_LOSS) + T_C

From the previous example:

T_j= (R_ΦJCx P_INTERNAL) + T_C

T_j= 30°C/W x 0.339W + T_C

(35)

(36)

The second method can give a very accurate silicon junction temperature.

The first step is to determine R_θJAof the application. The LM2832 has over-temperature protection circuitry.

When the silicon temperature reaches 165°C, the device stops switching. The protection circuitry has a

hysteresis of about 15°C. Once the silicon temperature has decreased to approximately 150°C, the device will

start to switch again. Knowing this, the R_θJAfor any application can be characterized during the early stages of

the design one may calculate the R_θJAby placing the PCB circuit into a thermal chamber. Raise the ambient

temperature in the given working application until the circuit enters thermal shutdown. If the SW-pin is monitored,

it will be obvious when the internal PFET stops switching, indicating a junction temperature of 165°C. Knowing

the internal power dissipation from the above methods, the junction temperature, and the ambient temperature

R_θJAcan be determined.

165°- Ta

P_INTERNAL

R_qJA

(37)

Once this is determined, the maximum ambient temperature allowed for a desired junction temperature can be

found.

An example of calculating R_θJAfor an application using the Texas Instruments LM2832 WSON demonstration

board is shown below.

The four layer PCB is constructed using FR4 with ½ oz copper traces. The copper ground plane is on the bottom

layer. The ground plane is accessed by two vias. The board measures 3.0cm x 3.0cm. It was placed in an oven

with no forced airflow. The ambient temperature was raised to 126°C, and at that temperature, the device went

into thermal shutdown.

From the previous example:

P_INTERNAL= 339mW

(38)

165^oC - 126^oC

= 115^oC/W

R_qJA

339 mW

(39)

If the junction temperature was to be kept below 125°C, then the ambient temperature could not go above 86°C.

T_j- (R_θJAx P_LOSS) = T_A

(40)

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125°C - (115°C/W x 339mW) = 86°C

(41)

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WSON Package

Figure 26. Internal WSON Connection

For certain high power applications, the PCB land may be modified to a "dog bone" shape (see Figure 27). By

increasing the size of ground plane, and adding thermal vias, the R_θJAfor the application can be reduced.

GND

5 VINA

4 VIND

PLANE

Figure 27. 6-Lead WSON PCB Dog Bone Layout

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LM2832X Design Example 1

GND

LM2832

= 1.2V @ 2.0A

= 5V

Figure 28. LM2832X (1.6MHz): Vin = 5V, Vo = 1.2V @ 2.0A

Table 2. Bill of Materials

Part ID

Part Value

2.0A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.4V_fSchottky 2A, 20V_R

2.2µH, 3.5A

Manufacturer

Part Number

LM2832X

C1, Input Cap

TDK

C3216X5ROJ226M

B220/A

C2, Output Cap

TDK

D1, Catch Diode

Diodes Inc.

Coilcraft

Vishay

DS3316P-222

15.0kΩ, 1%

CRCW08051502F

CRCW08051003F

15.0kΩ, 1%

100kΩ, 1%

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LM2832X Design Example 2

GND

LM2832

= 0.6V @ 2.0A

= 5V

Figure 29. LM2832X (1.6MHz): Vin = 5V, Vo = 0.6V @ 2.0A

Table 3. Bill of Materials

Part ID

Part Value

2.0A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.4V_fSchottky 2A, 20V_R

3.3µH, 3.3A

Manufacturer

Part Number

LM2832X

C1, Input Cap

TDK

C3216X5ROJ226M

B220/A

C2, Output Cap

TDK

D1, Catch Diode

Diodes Inc.

Coilcraft

Vishay

DS3316P-332

CRCW08051000F

10.0kΩ, 1%

0Ω

100kΩ, 1%

Vishay

CRCW08051003F

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LM2832X Design Example 3

GND

LM2832

= 3.3V @ 2.0A

= 5V

Figure 30. LM2832X (1.6MHz): Vin = 5V, Vo = 3.3V @ 2.0A

Table 4. Bill of Materials

Part ID

Part Value

2.0A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.4V_fSchottky 2A, 20V_R

2.2µH, 2.8A

Manufacturer

Part Number

LM2832X

C1, Input Cap

TDK

C3216X5ROJ226M

B220/A

C2, Output Cap

TDK

D1, Catch Diode

Diodes Inc.

Coilcraft

Vishay

ME3220-222

10.0kΩ, 1%

CRCW08051002F

CRCW08054532F

CRCW08051003F

45.3kΩ, 1%

100kΩ, 1%

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LM2832Y Design Example 4

GND

LM2832

= 3.3V @ 2.0A

= 5V

Figure 31. LM2832Y (550kHz): Vin = 5V, Vout = 3.3V @ 2.0A

Table 5. Bill of Materials

Part ID

Part Value

1.5A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.3V_fSchottky 1.5A, 30V_R

4.7µH 2.1A

Manufacturer

Part Number

LM2832Y

C1, Input Cap

C2, Output Cap

D1, Catch Diode

TDK

C3216X5ROJ226M

CRS08

TDK

TOSHIBA

TDK

SLF7045T-4R7M2R0-PF

CRCW08051002F

10.0kΩ, 1%

Vishay

10.0kΩ, 1%

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LM2832Y Design Example 5

GND

LM2832

= 1.2V @ 2.0A

= 5V

Figure 32. LM2832Y (550kHz): Vin = 5V, Vout = 1.2V @ 2.0A

Table 6. Bill of Materials

Part ID

Part Value

1.5A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.3V_fSchottky 1.5A, 30V_R

6.8µH 1.8A

Manufacturer

Part Number

LM2832Y

C1, Input Cap

C2, Output Cap

D1, Catch Diode

TDK

C3216X5ROJ226M

CRS08

TDK

TOSHIBA

TDK

SLF7045T-6R8M1R7

CRCW08051002F

10.0kΩ, 1%

Vishay

10.0kΩ, 1%

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LM2832Z Design Example 6

GND

LM2832

= 3.3V @ 2.0A

= 5V

Figure 33. LM2832Z (3MHz): Vin = 5V, Vo = 3.3V @ 2.0A

Table 7. Bill of Materials

Part ID

Part Value

2.0A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.4V_fSchottky 2A, 20V_R

3.3µH, 3.3A

Manufacturer

Part Number

LM2832Z

C1, Input Cap

TDK

C3216X5ROJ226M

B220/A

C2, Output Cap

TDK

D1, Catch Diode

Diodes Inc.

Coilcraft

Vishay

DS3316P-332

10.0kΩ, 1%

CRCW08051002F

CRCW08054532F

CRCW08051003F

45.3kΩ, 1%

100kΩ, 1%

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LM2832Z Design Example 7

GND

LM2832

= 1.2V @ 2.0A

= 5V

Figure 34. LM2832Z (3MHz): Vin = 5V, Vo = 1.2V @ 2.0A

Table 8. Bill of Materials

Part ID

Part Value

2.0A Buck Regulator

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

0.4V_fSchottky 2A, 20V_R

4.7µH, 2.7A

Manufacturer

Part Number

LM2832Z

C1, Input Cap

TDK

C3216X5ROJ226M

B220/A

C2, Output Cap

TDK

D1, Catch Diode

Diodes Inc.

Coilcraft

Vishay

DS3316P-472

10.0kΩ, 1%

CRCW08051002F

CRCW08051003F

10.0kΩ, 1%

100kΩ, 1%

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LM2832X Dual Converters with Delayed Enabled Design Example 8

VIND VINA

= 3.3V @ 2.0A

LM2832

GND

LP3470M5X-3.08

LP3470

RESET

VIND VINA

= 1.2V @ 2.0A

LM2832

GND

Figure 35. LM2832X (1.6MHz): Vin = 5V, Vo = 1.2V @ 2.0A & 3.3V @2.0A

Table 9. Bill of Materials

Part ID

U1, U2

Part Value

2.0A Buck Regulator

Power on Reset

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

Trr delay capacitor

0.4V_fSchottky 2A, 20V_R

3.3µH, 2.7A

Manufacturer

Part Number

LM2832X

LP3470M5X-3.08

C3216X5ROJ226M

C1, C3 Input Cap

C2, C4 Output Cap

TDK

D1, D2 Catch Diode

L1, L2

Diodes Inc.

Coilcraft

Vishay

B220/A

ME3220-102

R2, R4, R5

R1, R6

10.0kΩ, 1%

CRCW08051002F

CRCW08054532F

CRCW08051003F

45.3kΩ, 1%

100kΩ, 1%

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LM2832X Buck Converter & Voltage Double Circuit with LDO Follower Design Example 9

= 5.0V @ 150mA

LDO

LM2832

VIND

VINA

GND

= 5V

= 3.3V @ 2.0A

Figure 36. LM2832X (1.6MHz): Vin = 5V, Vo = 3.3V @ 2.0A & LP2986-5.0 @ 150mA

Table 10. Bill of Materials

Part ID

Part Value

2.0A Buck Regulator

200mA LDO

Manufacturer

Part Number

LM2832X

LP2986-5.0

C1, Input Cap

22µF, 6.3V, X5R

2x22µF, 6.3V, X5R

2.2µF, 6.3V, X5R

0.4V_fSchottky 2A, 20V_R

0.4V_fSchottky 20V_R, 500mA

10µH, 800mA

TDK

C3216X5ROJ226M

C1608X5R0J225M

B220/A

C2, Output Cap

TDK

C3 – C6

TDK

D1, Catch Diode

Diodes Inc.

ON Semi

CoilCraft

Vishay

MBR0520

ME3220-103

2.2µH, 3.5A

DS3316P-222

CRCW08054532F

CRCW08051002F

45.3kΩ, 1%

10.0kΩ, 1%

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SNVS455A –AUGUST 2006–REVISED APRIL 2013

REVISION HISTORY

Changes from Original (April 2013) to Revision A

Page

•

Changed layout of National Data Sheet to TI format .......................................................................................................... 26

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PACKAGE OPTION ADDENDUM

www.ti.com

29-Aug-2015

PACKAGING INFORMATION

Orderable Device

LM2832XMY

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

NRND

MSOP-

PowerPAD

DGN

1000

TBD

Call TI

CU SN

Call TI

CU SN

Call TI

CU SN

Call TI

SLBB

LM2832XMY/NOPB

LM2832XMYX/NOPB

LM2832XSD/NOPB

LM2832XSDX/NOPB

LM2832YMY/NOPB

LM2832YMYX/NOPB

LM2832YSD/NOPB

ACTIVE

MSOP-

PowerPAD

DGN

NGG

DGN

NGG

1000

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

Call TI

MSOP-

PowerPAD

TBD

WSON

1000

4500

1000

Green (RoHS

& no Sb/Br)

Level-3-260C-168 HR

Level-1-260C-UNLIM

Call TI

L196B

SLCB

L197B

WSON

Green (RoHS

& no Sb/Br)

MSOP-

PowerPAD

Green (RoHS

& no Sb/Br)

MSOP-

PowerPAD

TBD

WSON

1000

Green (RoHS

& no Sb/Br)

Level-3-260C-168 HR

LM2832YSDX/NOPB

LM2832ZMY/NOPB

ACTIVE

WSON

NGG

DGN

TBD

Call TI

CU SN

Call TI

-40 to 125

L197B

SLDB

MSOP-

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

PowerPAD

LM2832ZMYX/NOPB

LM2832ZSD/NOPB

LM2832ZSDX/NOPB

ACTIVE

MSOP-

PowerPAD

DGN

NGG

TBD

Call TI

CU SN

Call TI

Level-3-260C-168 HR

Call TI

-40 to 125

SLDB

L198B

WSON

1000

Green (RoHS

& no Sb/Br)

WSON

TBD

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

29-Aug-2015

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

2-Sep-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

1000

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

LM2832XMY

MSOP-

Power

PAD

DGN

178.0

12.4

5.3

3.4

1.4

8.0

12.0

LM2832XMY/NOPB

MSOP-

Power

PAD

LM2832XSD/NOPB

LM2832XSDX/NOPB

LM2832YMY/NOPB

WSON

NGG

DGN

1000

4500

1000

178.0

330.0

178.0

12.4

3.3

5.3

3.3

3.4

1.0

1.4

8.0

12.0

MSOP-

Power

PAD

LM2832YSD/NOPB

LM2832ZMY/NOPB

WSON

NGG

DGN

1000

178.0

12.4

3.3

5.3

3.3

3.4

1.0

1.4

8.0

12.0

MSOP-

Power

PAD

LM2832ZSD/NOPB

WSON

NGG

1000

178.0

12.4

3.3

1.0

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

2-Sep-2015

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

LM2832XMY

MSOP-PowerPAD

WSON

DGN

NGG

DGN

NGG

DGN

NGG

1000

4500

1000

210.0

213.0

367.0

210.0

213.0

210.0

213.0

185.0

191.0

367.0

185.0

191.0

185.0

191.0

35.0

55.0

35.0

55.0

35.0

55.0

LM2832XMY/NOPB

LM2832XSD/NOPB

LM2832XSDX/NOPB

LM2832YMY/NOPB

LM2832YSD/NOPB

LM2832ZMY/NOPB

LM2832ZSD/NOPB

WSON

MSOP-PowerPAD

WSON

MSOP-PowerPAD

WSON

Pack Materials-Page 2

MECHANICAL DATA

DGN0008A

MUY08A (Rev A)

BOTTOM VIEW

www.ti.com

MECHANICAL DATA

NGG0006A

SDE06A (Rev A)

www.ti.com

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LM2832ZMYX/NOPB [TI]

相关型号：

LM2832ZSD

LM2832ZSD/NOPB

LM2832ZSDX

LM2832ZSDX/NOPB

LM2832ZSDX/NOPB

LM2833

LM2833

LM2833XMY

LM2833XMY/NOPB

LM2833XMYX

LM2833XMYX/NOPB

LM2833XSD