LM2930 [TI]
具有反向电压保护功能的 150mA、26V、低压降稳压器;
| 型号： | LM2930 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有反向电压保护功能的 150mA、26V、低压降稳压器 稳压器 |
| 文件： | 总13页 (文件大小：1342K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM2930
www.ti.com
SNVS745D –APRIL 1998–REVISED APRIL 2013
LM2930 3-Terminal Positive Regulator
Check for Samples: LM2930
1
FEATURES
DESCRIPTION
The LM2930 3-terminal positive regulator features an
ability to source 150 mA of output current with an
input-output differential of 0.6V or less. Efficient use
of low input voltages obtained, for example, from an
automotive battery during cold crank conditions,
allows 5V circuitry to be properly powered with supply
voltages as low as 5.6V. Familiar regulator features
such as current limit and thermal overload protection
are also provided.
2
•
•
•
•
•
•
•
•
Input-Output Differential Less Than 0.6V
Output Current in Excess of 150 mA
Reverse Battery Protection
40V Load Dump Protection
Internal Short Circuit Current Limit
Internal Thermal Overload Protection
Mirror-Image Insertion Protection
P+ Product Enhancement Tested
Designed originally for automotive applications, the
LM2930 and all regulated circuitry are protected from
reverse battery installations or 2 battery jumps.
During line transients, such as a load dump (40V)
when the input voltage to the regulator can
momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
down to protect both internal circuits and the load.
The LM2930 cannot be harmed by temporary mirror-
image insertion.
VOLTAGE RANGE
•
•
•
•
LM2930T-5.0: 5V
LM2930T-8.0: 8V
LM2930S-5.0: 5V
LM2930S-8.0: 8V
Fixed outputs of 5V and 8V are available in the
plastic TO-220 and SFM power packages.
Connection Diagrams
TO-220 Plastic Package
Figure 1. Front View
See Package Number NDE
SFM Plastic Surface-Mount Package
Figure 2. Top View
See Package Number KTT
Figure 3. Side View
See Package Number KTT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
LM2930
SNVS745D –APRIL 1998–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Input Voltage
Operating Range
26V
40V
Overvoltage Protection
Reverse Voltage (100 ms)
Reverse Voltage (DC)
−12V
−6V
(3)
Internal Power Dissipation
Internally Limited
−40°C to +85°C
125°C
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
−65°C to +150°C
230°C
Lead Temp. (Soldering, 10 seconds)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the
TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper
area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA
is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Electrical Characteristics(1)
LM2930-5.0 VIN=14V, IO=150 mA, Tj=25°C (2), C2=10 μF, unless otherwise specified
Parameter
Output Voltage
Conditions
Typ
Tested
Limit(3)
Design
Limit(4)
Unit
5
5.3
4.7
VMAX
VMIN
6V≤VIN≤26V, 5 mA≤IO≤150 mA
−40°C≤TJ≤125°C
5.5
4.5
VMAX
VMIN
Line Regulation
9V≤VIN≤16V, IO=5 mA
6V≤VIN≤26V, IO=5 mA
5 mA≤IO≤150 mA
7
30
25
80
50
mVMAX
mVMAX
mVMAX
mΩ
Load Regulation
Output Impedance
Quiescent Current
14
100 mADC & 10 mArms, 100 Hz−10 kHz
IO=10 mA
200
4
7
mAMAX
mAMAX
μVrms
mV/1000 hr
dB
IO=150 mA
18
40
Output Noise Voltage
Long Term Stability
Ripple Rejection
Current Limit
10 Hz−100 kHz
140
20
fO=120 Hz
56
400
700
150
0.6
mAMAX
mAMIN
VMAX
Dropout Voltage
IO=150 mA
0.32
Output Voltage Under
Transient Conditions
−12V≤VIN≤40V, RL=100Ω
5.5
VMAX
−0.3
VMIN
(1) All characteristics are measured with a capacitor across the input of 0.1 μF and a capacitor across the output of 10 μF. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output
voltage changes due to changes in internal temperature must be taken into account separately.
(2) To ensure constant junction temperature, low duty cycle pulse testing is used.
(3) Ensured and 100% production tested.
(4) Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to
calculate outgoing quality levels.
2
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LM2930
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SNVS745D –APRIL 1998–REVISED APRIL 2013
Electrical Characteristics(1)
LM2930-8.0 (VIN=14V, IO=150 mA, Tj=25°C (2), C2=10 μF, unless otherwise specified)
Parameter
Output Voltage
Conditions
Typ
Tested
Limit(3)
Design
Limit(4)
Unit
8
8.5
7.5
VMAX
VMIN
9.4V≤VIN≤26V, 5 mA≤IO≤150 mA,
−40°C≤TJ≤125°C
8.8
7.2
VMAX
VMIN
Line Regulation
9.4V≤VIN≤16V, IO=5 mA
9.4V≤VIN≤26V, IO=5 mA
5 mA≤IO≤150 mA
12
50
50
100
50
mVMAX
mVMAX
mVMAX
mΩ
Load Regulation
Output Impedance
Quiescent Current
25
100 mADC & 10 mArms, 100 Hz−10 kHz
IO=10 mA
300
4
7
mAMAX
mAMAX
μVrms
mV/1000 hr
dB
IO=150 mA
18
40
Output Noise Voltage
Long Term Stability
Ripple Rejection
Current Limit
10 Hz−100 kHz
170
30
fO=120 Hz
52
400
700
150
0.6
mAMAX
mAMIN
VMAX
Dropout Voltage
IO=150 mA
0.32
Output Voltage Under
Transient Conditions
−12V≤VIN≤40V, RL=100Ω
8.8
VMAX
−0.3
VMIN
(1) All characteristics are measured with a capacitor across the input of 0.1 μF and a capacitor across the output of 10 μF. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output
voltage changes due to changes in internal temperature must be taken into account separately.
(2) To ensure constant junction temperature, low duty cycle pulse testing is used.
(3) Ensured and 100% production tested.
(4) Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to
calculate outgoing quality levels.
Typical Application
*Required if regulator is located far from power supply filter.
**COUT must be at least 10 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator. The equivalent series resistance (ESR) of this capacitor should be less than 1Ω
over the expected operating temperature range.
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SNVS745D –APRIL 1998–REVISED APRIL 2013
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Typical Performance Characteristics
Output Impedance
Overvoltage Supply Current
Figure 4.
Figure 5.
Output at Reverse
Supply
Reverse Supply Current
Figure 6.
Figure 7.
Output at Overvoltage
Output Voltage (Normalized to 1V at Tj=25°C)
Figure 8.
Figure 9.
4
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SNVS745D –APRIL 1998–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Dropout Voltage
Dropout Voltage
Figure 10.
Figure 11.
Low Voltage Behavior
High Voltage Behavior
Figure 12.
Figure 13.
Line Transient Response
Load Transient Response
Figure 14.
Figure 15.
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SNVS745D –APRIL 1998–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Peak Output Current
Quiescent Current
Figure 16.
Figure 17.
Quiescent Current
Quiescent Current
Figure 18.
Figure 19.
Ripple Rejection
Ripple Rejection
Figure 20.
Figure 21.
6
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LM2930
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SNVS745D –APRIL 1998–REVISED APRIL 2013
Definition of Terms
Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further
reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value
obtained at 14V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not
significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over
a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
(1)
Maximum Power Dissipation (TO-220)
Maximum Power Dissipation (SFM)
(1) Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the
TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper
area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA
is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Copyright © 1998–2013, Texas Instruments Incorporated
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LM2930
SNVS745D –APRIL 1998–REVISED APRIL 2013
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Schematic Diagram
8
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Product Folder Links: LM2930
LM2930
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SNVS745D –APRIL 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM2930T-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
-40 to 85
LM2930T
-5.0 P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
NDE TO-220
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM2930T-5.0/NOPB
3
45
502
33
6985
4.06
Pack Materials-Page 1
MECHANICAL DATA
NDE0003B
www.ti.com
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