LM2931AS-5.0 [TI]
Series Low Dropout Regulators; 系列低压降稳压器
| 型号： | LM2931AS-5.0 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Series Low Dropout Regulators |
| 文件： | 总29页 (文件大小：4176K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM2931-N
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SNOSBE5G –MARCH 2000–REVISED APRIL 2013
LM2931-N Series Low Dropout Regulators
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1
FEATURES
DESCRIPTION
The LM2931-N positive voltage regulator features a
very low quiescent current of 1mA or less when
supplying 10mA loads. This unique characteristic and
the extremely low input-output differential required for
proper regulation (0.2V for output currents of 10mA)
make the LM2931-N the ideal regulator for standby
power systems. Applications include memory standby
circuits, CMOS and other low power processor power
supplies as well as systems demanding as much as
100mA of output current.
2
•
•
•
•
•
•
•
•
•
•
Very Low Quiescent Current
Output Current in Excess of 100 mA
Input-output Differential Less than 0.6V
Reverse Battery Protection
60V Load Dump Protection
−50V Reverse Transient Protection
Short Circuit Protection
Internal Thermal Overload Protection
Mirror-image Insertion Protection
Designed originally for automotive applications, the
LM2931-N and all regulated circuitry are protected
from reverse battery installations or 2 battery jumps.
During line transients, such as a load dump (60V)
when the input voltage to the regulator can
momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
down to protect both internal circuits and the load.
The LM2931-N cannot be harmed by temporary
mirror-image insertion. Familiar regulator features
such as short circuit and thermal overload protection
are also provided.
Available in TO-220, TO-92, TO-263, or SOIC-8
Packages
•
Available as Adjustable with TTL Compatible
Switch
The LM2931-N family includes a fixed 5V output
(±3.8% tolerance for A grade) or an adjustable output
with ON/OFF pin. Both versions are available in a
TO-220 power package, DDPAK/TO-263 surface
mount package, and an 8-lead SOIC package. The
fixed output version is also available in the TO-92
plastic package.
Connection Diagrams
FIXED VOLTAGE OUTPUT
Figure 1. TO-220 3-Lead Power Package
Front View
Figure 2. DDPAK/TO-263 Surface-Mount Package
Top View
Figure 3. Side View
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM2931-N
SNOSBE5G –MARCH 2000–REVISED APRIL 2013
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*NC = Not internally connected. Must be electrically isolated from the rest of the circuit for the DSBGA package.
Figure 4. 8-Pin SOIC
Top View
Figure 5. TO-92 Plastic Package
Bottom View
Figure 6. 6-Bump DSBGA
Figure 7. DSBGA Laser Mark
Top View
(Bump Side Down)
ADJUSTABLE OUTPUT VOLTAGE
Figure 8. TO-220 5-Lead Power Package
Front View
Figure 9. DDPAK/TO-263
5-Lead Surface-Mount Package
Top View
Figure 10. Side View
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Figure 11. 8-Pin SOIC
Top View
Typical Applications
*Required if regulator is located far from power supply filter.
**C2 must be at least 100 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator. The equivalent series resistance (ESR) of this capacitor is critical; see curve.
Figure 12. LM2931-N Fixed Output
Note: Using 27k for R1 will automatically compensate for errors in VOUT due to the input bias current of the ADJ pin
(approximately 1 μA).
Figure 13. LM2931-N Adjustable Output
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Input Voltage
Operating Range
26V
Overvoltage Protection
LM2931A, LM2931C (Adjustable)
LM2931-N
60V
50V
Internal Power Dissipation
(3) (4)
Internally Limited
Operating Ambient Temperature
Range
−40°C to +85°C
125°C
Maximum Junction Temperature
Storage Temperature Range
Lead Temp. (Soldering, 10 seconds)
−65°C to +150°C
230°C
(5)
ESD Tolerance
2000V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
(4) The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient
temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92
package, θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263
package, θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the
sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally
connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;
and with 1.6 or more square inches of copper area, θJA is 32°C/W.
(5) Human body model, 100 pF discharged through 1.5 kΩ.
ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION
(1)
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100μF (unless otherwise specified)
LM2931-N-3.3
Parameter
Output Voltage
Conditions
Units
Limit
Typ
(2)
3.3
3.465
3.135
VMAX
VMIN
4V ≤ VIN ≤ 26V, IO = 100 mA
−40°C ≤ TJ ≤ 125°C
3.630
2.970
VMAX
VMIN
Line Regulation
Load Regulation
Output Impedance
4V ≤ VIN ≤ 26V
4
33
50
mVMAX
mVMAX
mΩ
5mA ≤ IO ≤ 100mA
10
100mADC and 10mArms
100Hz - 10kHz
,
200
Quiescent Current
IO ≤ 10mA, 4V ≤ VIN ≤ 26V
0.4
1.0
mAMAX
−40°C ≤ TJ ≤ 125°C
IO = 100mA, VIN = 14V, TJ = 25°C
15
330
13
mA
μVrms
Output Noise Voltage
Long Term Stability
Ripple Rejection
10Hz -100kHz, COUT = 100μF
mV/1000 hr
dB
fO = 120Hz
80
(1) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
(2) All limits are specified for TJ = 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold
type face).
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ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION (continued)
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100μF (unless otherwise specified) (1)
LM2931-N-3.3
Limit
Parameter
Dropout Voltage
Conditions
Units
Typ
(2)
IO = 10mA
IO = 100mA
0.05
0.30
0.2
0.6
VMAX
Maximum Operational Input Voltage
Maximum Line Transient
33
70
26
50
VMIN
VMIN
RL = 500Ω, VO ≤ 5.5V,
T = 1ms, τ ≤ 100ms
Reverse Polarity Input Voltage, DC
V
O ≥ −0.3V, RL = 500Ω
−30
−80
−15
−50
VMIN
VMIN
Reverse Polarity Input Voltage,
Transient
T = 1ms, τ ≤ 100ms, RL = 500Ω
ELECTRICAL CHARACTERISTICS FOR FIXED 5V VERSION
(1)
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100 μF (unless otherwise specified)
LM2931A-5.0
LM2931-N-5.0
Parameter
Output Voltage
Conditions
Units
Limit
Limit
Typ
Typ
(2)
(2)
5
5.19
4.81
5
5.25
4.75
VMAX
VMIN
6.0V ≤ VIN ≤ 26V, IO = 100mA
−40°C ≤ TJ ≤ 125°C
5.25
4.75
5.5
4.5
VMAX
VMIN
Line Regulation
9V ≤ VIN ≤ 16V
6V ≤ VIN ≤ 26V
2
4
10
30
2
4
10
30
mVMAX
Load Regulation
5 mA ≤ IO ≤ 100mA
14
50
14
50
mVMAX
Output Impedance
100mADC and 10mArms
100Hz -10kHz
,
200
200
mΩ
Quiescent Current
IO ≤ 10mA, 6V ≤ VIN ≤ 26V
0.4
1.0
0.4
1.0
mAMAX
−40°C ≤ TJ ≤ 125°C
IO = 100mA, VIN = 14V, TJ = 25°C
15
500
20
30
15
500
20
mAMAX
Output Noise Voltage
Long Term Stability
10Hz -100kHz, COUT = 100μF
μVrms
mV/1000
hr
Ripple Rejection
Dropout Voltage
fO = 120 Hz
80
55
80
dBMIN
VMAX
VMIN
IO = 10mA
IO = 100mA
0.05
0.3
0.2
0.6
0.05
0.3
0.2
0.6
Maximum Operational Input
Voltage
33
26
33
26
Maximum Line Transient
RL = 500Ω, VO ≤ 5.5V,
T = 1ms, τ ≤ 100ms
70
60
70
50
VMIN
VMIN
Reverse Polarity Input Voltage,
DC
VO ≥ −0.3V, RL = 500Ω
−30
−15
−30
−15
Reverse Polarity Input Voltage,
Transient
T = 1ms, τ ≤ 100ms, RL = 500Ω
−80
−50
−80
−50
VMIN
(1) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
(2) All limits are specified for TJ = 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold
type face).
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ELECTRICAL CHARACTERISTICS FOR ADJUSTABLE VERSION
VIN = 14V, VOUT = 3V, IO = 10 mA, TJ = 25°C, R1 = 27k, C2 = 100 μF (unless otherwise specified)
(1)
Parameter
Reference Voltage
Conditions
Typ
Limit
Units Limit
1.20
1.26
1.14
1.32
1.08
24
VMAX
VMIN
I
O ≤ 100 mA, −40°C ≤ Tj ≤ 125°C, R1 = 27k
VMAX
Measured from VOUT to Adjust Pin
VMIN
Output Voltage Range
VMAX
3
VMIN
Line Regulation
Load Regulation
Output Impedance
Quiescent Current
VOUT + 0.6V ≤ VIN ≤ 26V
5 mA ≤ IO ≤ 100 mA
100 mADC and 10 mArms, 100 Hz–10 kHz
IO = 10 mA
0.2
0.3
40
1.5
1
mV/VMAX
%
MAX
mΩ/V
mAMAX
mA
0.4
15
1
1
IO = 100 mA
During Shutdown RL = 500Ω
10 Hz–100 kHz
0.8
100
0.4
0.02
0.05
0.3
mAMAX
μVrms/V
%/1000 hr
%/V
Output Noise Voltage
Long Term Stability
Ripple Rejection
fO = 120 Hz
Dropout Voltage
IO ≤ 10 mA
0.2
0.6
VMAX
IO = 100 mA
VMAX
Maximum Operational Input
Voltage
33
70
26
60
VMIN
VMIN
Maximum Line Transient
IO = 10 mA, Reference Voltage ≤ 1.5V
T = 1 ms, τ ≤ 100 ms
Reverse Polarity Input
Voltage, DC
VO ≥ −0.3V, RL = 500Ω
−30
−80
−15
−50
VMIN
Reverse Polarity Input
Voltage, Transient
On/Off Threshold Voltage
On
T = 1 ms, τ ≤ 100 ms, RL = 500Ω
VMIN
VO=3V
2.0
2.2
20
1.2
3.25
50
VMAX
VMIN
Off
On/Off Threshold Current
μAMAX
(1) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
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TYPICAL PERFORMANCE CHARACTERISTICS
Dropout Voltage
Dropout Voltage
Figure 14.
Figure 15.
Low Voltage Behavior
Output at Voltage Extremes
Figure 16.
Figure 17.
Line Transient Response
Load Transient Response
Figure 18.
Figure 19.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Peak Output Current
Quiescent Current
Figure 20.
Figure 21.
Quiescent Current
Quiescent Current
Figure 22.
Figure 23.
Ripple Rejection
Ripple Rejection
Figure 24.
Figure 25.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Operation During Load
Dump
Output Impedance
Figure 26.
Figure 27.
Maximum Power Dissipation
(SOIC-8)
Reference Voltage
Figure 28.
Figure 29.
Maximum Power Dissipation
(TO-220)
Maximum Power Dissipation
(TO-92)
Figure 30.
Figure 31.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Maximum Power Dissipation
(1)
(TO-263)
On/Off Threshold
Figure 32.
Figure 33.
Output Capacitor ESR
Figure 34.
(1) The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient
temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92
package, θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263
package, θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the
sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally
connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;
and with 1.6 or more square inches of copper area, θJA is 32°C/W.
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SCHEMATIC DIAGRAM
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APPLICATION HINTS
One of the distinguishing factors of the LM2931-N series regulators is the requirement of an output capacitor for
device stability. The value required varies greatly depending upon the application circuit and other factors. Thus
some comments on the characteristics of both capacitors and the regulator are in order.
High frequency characteristics of electrolytic capacitors depend greatly on the type and even the manufacturer.
As a result, a value of capacitance that works well with the LM2931-N for one brand or type may not necessary
be sufficient with an electrolytic of different origin. Sometimes actual bench testing, as described later, will be the
only means to determine the proper capacitor type and value. Experience has shown that, as a rule of thumb, the
more expensive and higher quality electrolytics generally allow a smaller value for regulator stability. As an
example, while a high-quality 100 μF aluminum electrolytic covers all general application circuits, similar stability
can be obtained with a tantalum electrolytic of only 47μF. This factor of two can generally be applied to any
special application circuit also.
Another critical characteristic of electrolytics is their performance over temperature. While the LM2931-N is
designed to operate to −40°C, the same is not always true with all electrolytics (hot is generally not a problem).
The electrolyte in many aluminum types will freeze around −30°C, reducing their effective value to zero. Since
the capacitance is needed for regulator stability, the natural result is oscillation (and lots of it) at the regulator
output. For all application circuits where cold operation is necessary, the output capacitor must be rated to
operate at the minimum temperature. By coincidence, worst-case stability for the LM2931-N also occurs at
minimum temperatures. As a result, in applications where the regulator junction temperature will never be less
than 25°C, the output capacitor can be reduced approximately by a factor of two over the value needed for the
entire temperature range. To continue our example with the tantalum electrolytic, a value of only 22μF would
probably thus suffice. For high-quality aluminum, 47μF would be adequate in such an application.
Another regulator characteristic that is noteworthy is that stability decreases with higher output currents. This
sensible fact has important connotations. In many applications, the LM2931-N is operated at only a few milliamps
of output current or less. In such a circuit, the output capacitor can be further reduced in value. As a rough
estimation, a circuit that is required to deliver a maximum of 10mA of output current from the regulator would
need an output capacitor of only half the value compared to the same regulator required to deliver the full output
current of 100mA. If the example of the tantalum capacitor in the circuit rated at 25°C junction temperature and
above were continued to include a maximum of 10mA of output current, then the 22μF output capacitor could be
reduced to only 10μF.
In the case of the LM2931CT adjustable regulator, the minimum value of output capacitance is a function of the
output voltage. As a general rule, the value decreases with higher output voltages, since internal loop gain is
reduced.
At this point, the procedure for bench testing the minimum value of an output capacitor in a special application
circuit should be clear. Since worst-case occurs at minimum operating temperatures and maximum operating
currents, the entire circuit, including the electrolytic, should be cooled to the minimum temperature. The input
voltage to the regulator should be maintained at 0.6V above the output to keep internal power dissipation and die
heating to a minimum. Worst-case occurs just after input power is applied and before the die has had a chance
to heat up. Once the minimum value of capacitance has been found for the brand and type of electrolytic in
question, the value should be doubled for actual use to account for production variations both in the capacitor
and the regulator. (All the values in this section and the remainder of the data sheet were determined in this
fashion.)
LM2931-N DSBGA Light Sensitivity
When the LM2931-N DSBGA package is exposed to bright sunlight, normal office fluorescent light, and other
LED's, it operates within the limits specified in the electrical characteristic table.
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Definition of Terms
Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further
reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value
obtained at 14V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is
not significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured
over a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage at
a specified frequency.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
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REVISION HISTORY
Changes from Revision F (April 2013) to Revision G
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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PACKAGE OPTION ADDENDUM
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21-May-2013
PACKAGING INFORMATION
Orderable Device
LM2931AM-5.0
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
3
3
3
3
3
3
3
3
3
3
8
8
8
95
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
SN
Call TI
Level-1-260C-UNLIM
Call TI
2931A
M-5.0
LM2931AM-5.0/NOPB
LM2931AMX-5.0
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
95
2500
2500
45
Green (RoHS
& no Sb/Br)
2931A
M-5.0
TBD
2931A
M-5.0
LM2931AMX-5.0/NOPB
LM2931AS-5.0
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2931A
M-5.0
DDPAK/
TO-263
KTT
KTT
KTT
KTT
NDE
NDE
LP
TBD
LM2931
AS5.0
LM2931AS-5.0/NOPB
LM2931ASX-5.0
DDPAK/
TO-263
45
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
Call TI
LM2931
AS5.0
DDPAK/
TO-263
500
500
45
TBD
LM2931
AS5.0
LM2931ASX-5.0/NOPB
LM2931AT-5.0
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
Call TI
LM2931
AS5.0
TO-220
TO-220
TO-92
TO-92
TO-92
TO-92
SOIC
TBD
LM2931
AT5.0
LM2931AT-5.0/NOPB
LM2931AZ-5.0/LFT1
LM2931AZ-5.0/LFT3
LM2931AZ-5.0/LFT4
LM2931AZ-5.0/NOPB
LM2931CM
45
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
LM2931
AT5.0
2000
2000
2000
1800
95
Green (RoHS
& no Sb/Br)
LM293
1AZ-5
LP
Green (RoHS
& no Sb/Br)
SNCU
SNCU
SNCU
Call TI
CU SN
Call TI
LM293
1AZ-5
LP
Green (RoHS
& no Sb/Br)
LM293
1AZ-5
LP
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
LM293
1AZ-5
D
TBD
LM29
31CM
LM2931CM/NOPB
LM2931CMX
SOIC
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
LM29
31CM
SOIC
D
2500
TBD
LM29
31CM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM2931CMX/NOPB
LM2931CS
ACTIVE
SOIC
D
8
5
5
2500
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
LM29
31CM
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KTT
45
45
TBD
Call TI
-40 to 85
LM2931CS
LM2931CS/NOPB
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
-40 to 85
LM2931CS
LM2931CT
ACTIVE
ACTIVE
TO-220
KC
5
5
45
45
TBD
Call TI
CU SN
Call TI
-40 to 85
LM2931CT
LM2931CT
LM2931CT/LF03
TO-220
NDH
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
LM2931CT/LF04
LM2931CT/NOPB
LM2931M-5.0
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO-220
TO-220
SOIC
NEB
KC
D
5
5
8
8
8
8
3
3
3
3
3
3
3
45
45
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
SN
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
LM2931CT
LM2931CT
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
95
TBD
2931
M-5.0
LM2931M-5.0/NOPB
LM2931MX-5.0
SOIC
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2931
M-5.0
SOIC
D
2500
2500
45
TBD
2931
M-5.0
LM2931MX-5.0/NOPB
LM2931S-5.0
SOIC
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2931
M-5.0
DDPAK/
TO-263
KTT
KTT
NDE
NDE
LP
TBD
LM2931S
5.0
LM2931S-5.0/NOPB
LM2931T-5.0
DDPAK/
TO-263
45
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
Call TI
LM2931S
5.0
TO-220
TO-220
TO-92
TO-92
TO-92
45
TBD
LM2931T
5.0
LM2931T-5.0/NOPB
LM2931Z-5.0/LFT1
LM2931Z-5.0/LFT2
LM2931Z-5.0/NOPB
45
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM2931T
5.0
2000
2000
1800
Green (RoHS
& no Sb/Br)
LM293
1Z-5
LP
Green (RoHS
& no Sb/Br)
SN
LM293
1Z-5
LP
Green (RoHS
& no Sb/Br)
SNCU
-40 to 85
LM293
1Z-5
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2931AMX-5.0
LM2931AMX-5.0/NOPB
LM2931ASX-5.0
SOIC
SOIC
D
D
8
8
3
2500
2500
500
330.0
330.0
330.0
12.4
12.4
24.4
6.5
6.5
5.4
5.4
2.0
2.0
5.0
8.0
8.0
12.0
12.0
24.0
Q1
Q1
Q2
DDPAK/
TO-263
KTT
10.75 14.85
16.0
LM2931ASX-5.0/NOPB DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75 14.85
5.0
16.0
24.0
Q2
LM2931CMX
LM2931CMX/NOPB
LM2931MX-5.0
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
6.5
6.5
6.5
6.5
5.4
5.4
5.4
5.4
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
LM2931MX-5.0/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2931AMX-5.0
LM2931AMX-5.0/NOPB
LM2931ASX-5.0
SOIC
SOIC
D
D
8
8
3
3
8
8
8
8
2500
2500
500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
45.0
45.0
35.0
35.0
35.0
35.0
DDPAK/TO-263
DDPAK/TO-263
SOIC
KTT
KTT
D
LM2931ASX-5.0/NOPB
LM2931CMX
500
2500
2500
2500
2500
LM2931CMX/NOPB
LM2931MX-5.0
SOIC
D
SOIC
D
LM2931MX-5.0/NOPB
SOIC
D
Pack Materials-Page 2
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
NEB0005F
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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Copyright © 2013, Texas Instruments Incorporated
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