LM2936MMX-3.3/NOPB [TI]
Ultra-Low Quiescent Current LDO Voltage Regulator;
| 型号： | LM2936MMX-3.3/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Ultra-Low Quiescent Current LDO Voltage Regulator 光电二极管 输出元件 调节器 |
| 文件： | 总34页 (文件大小：1264K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM2936
SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator
1 Features
3 Description
The LM2936 ultra-low quiescent current regulator
1
•
•
•
LM2936 Operating VIN range of 5.5 V to 40 V
LM2936HV Operating VIN range of 5.5 V to 60 V
features low dropout voltage and low current in the
standby mode. With less than 15-μA quiescent
current at a 100-μA load, the LM2936 is ideally suited
for automotive and other battery operated systems.
The LM2936 retains all of the features that are
common to low dropout regulators including a low
dropout PNP pass device, short circuit protection,
reverse battery protection, and thermal shutdown.
The LM2936 has a 40-V maximum operating voltage
limit, a −40°C to 125°C operating temperature range,
and ±3% output voltage tolerance over the entire
output current, input voltage, and temperature range.
The LM2936 is available in a TO-92 through-hole
package, as well as SOIC-8, VSSOP, SOT–223, and
TO-252 surface mount packages.
Ultra Low Quiescent Current (IQ ≤ 15 μA for
IOUT = 100 μA)
•
•
•
Fixed 3-V, 3.3-V or 5-V with 50-mA Output
±2% Initial Output Tolerance
±3% Output Tolerance Over Line, Load, and
Temperature
•
•
•
•
•
•
Dropout Voltage Typically 200 mV at IOUT = 50 mA
–24-V Input Voltage Protection
–50-V Input Transient Protection
Internal Short Circuit Current Limit
Internal Thermal Shutdown Protection
Shutdown Pin Available with LM2936BM Package
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
4.90 mm x 3.91 mm
6.10 mm x 6.58 mm
3.00 mm x 3.00 mm
6.50 mm x 3.50 mm
4.30 mm x 4.30 mm
2 Applications
SOIC (8)
•
•
•
Automotive
TO-252 (3)
VSSOP (8)
SOT-223 (4)
TO-92 (3)
Industrial Controls
Point of Load
LM2936
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
VIN
IN
OUT
VOUT
GND
CIN
COUT
100 nF *
10 µF **
* Required if regulator is located more than 2″ from power supply filter capacitor.
** Required for stability. See Electrical Characteristics for 3-V LM2936 for required values. Must be rated over
intended operating temperature range. Effective series resistance (ESR) is critical, see Typical Characteristics. Locate
capacitor as close as possible to the regulator output and ground pins. Capacitance may be increased without bound.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2936
SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
www.ti.com
Table of Contents
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 13
Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application ................................................. 14
Power Supply Recommendations...................... 15
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics for 3-V LM2936................. 5
6.6 Electrical Characteristics for 3.3-V LM2936.............. 6
6.7 Electrical Characteristics for 5-V LM2936................. 7
6.8 Typical Characteristics.............................................. 8
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
8
9
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Examples................................................... 16
10.3 Thermal Considerations........................................ 16
11 Device and Documentation Support ................. 18
11.1 Documentation Support ........................................ 18
11.2 Trademarks........................................................... 18
11.3 Electrostatic Discharge Caution............................ 18
11.4 Glossary................................................................ 18
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (March 2013) to Revision O
Page
•
Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision M (March 2013) to Revision N
Page
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 13
2
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5 Pin Configuration and Functions
LM2936DT TO-252 (NDP) Package
LM2936MP SOT-223 (DCY) Package
3-Pins
4-Pins
Top View
Top View
IN 1
IN 1
4 GND
(TAB)
4 GND
GND 2
(TAB)
OUT 3
OUT 3
LM2936BM SOIC (D) Package
LM2936M SOIC (D) Package
8-Pins
8-Pins
Top View
Top View
OUT 1
GND 2
GND 3
NC 4
8 IN
OUT 1
GND 2
GND 3
NC 4
8 IN
7 GND
6 GND
5 NC
7 GND
6 GND
5 SD
LM2936Z TO-92 (LP) Package
3-Pins
LM2936MM VSSOP (DGK) Package
8-Pins
Bottom View
Top View
OUT 1
NC 2
NC 3
NC 4
8 IN
OUT
GND
IN
1
2
3
7 GND
6 NC
5 NC
Pin Functions
PIN
NDP
I/O
DESCRIPTION
D
D
NAME
DGK
DCY
LP
(LM2936BM) (LM2936M)
IN
8
8
1
4
8
7
1
3
2
I
Unregulated input voltage.
Ground.
GND
2, 3, 6, 7
2, 3, 6, 7
2, 4
—
Regulated output voltage. Requires a minimum
output capacitance, with specific ESR, on this pin
to maintain stability.
OUT
1
1
3
1
3
1
O
Shutdown. LM2936BM only. Pull this pin HIGH (> 2
V) to turn the output OFF. If this pin is left open,
pull ed low (< 0.6 V), or connected to GND, the
output will be ON by default. Avoid having any
voltage between 0.6 V and 2 V on this pin as the
output status may not be predicable across the
operating range.
SD
NC
5
4
—
—
—
—
—
—
—
—
I
No internal connection, Connect to GND, or leave
open.
4, 5
2, 3, 4, 5, 6
—
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6 Specifications
(1)(2)
6.1 Absolute Maximum Ratings
MIN
MAX
UNIT
Input voltage (survival)
−50
60
V
(3)
Power dissipation
Internally limited
150
Junction temperature (TJMAX
)
°C
Storage temperature, Tstg
−65
150
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) − TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and
the LM2936 may go into thermal shutdown.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
6.3 Recommended Operating Conditions
MIN
MAX
125
40
UNIT
°C
V
Temperature, TJ
−40
5.5
5.5
0
Input voltage, VIN , LM2936
Input voltage, VIN , LM2936HV only
Shutdown pin voltage, VSD, LM2936BM only
60
V
40
V
6.4 Thermal Information
LM2936
SOIC (D)
TO-252
(NDP)
VSSOP
(DGK)
SOT-223
(DCY)
TO-92 (LP)
THERMAL METRIC(1)
UNIT
8 PINS
111.4
56.3
51.9
10.9
51.4
n/a
3 PINS
50.5
52.6
29.7
4.8
8 PINS
173.4
65.9
94.9
9.6
4 PINS
62.8
44.2
11.7
3.6
3 PINS
156.8
80.4
n/a
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
RθJC(top)
RθJB
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
24.5
136.0
n/a
ψJB
29.3
1.6
93.3
n/a
11.6
n/a
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics for 3-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ = 25°C, unless otherwise specified.
PARAMETER
3-V LM2936HV ONLY
Output voltage
TEST CONDITIONS
MIN(1)
TYP(2)
MAX(1)
UNIT
5.5 V ≤ VIN ≤ 48 V, 100 µA ≤ IOUT ≤ 50 mA,(2)
–40°C ≤ TJ ≤ 125°C
2.91
3
3.09
30
V
Line regulation
6 V ≤ VIN ≤ 60 V, IOUT = 1 mA
10
mV
ALL 3-V LM2936
2.94
2.91
3
3.06
3.09
4 V ≤ VIN ≤ 26 V, 100 µA ≤ IOUT ≤ 50 mA,(2)
–40°C ≤ TJ ≤ 125°C
3.000
Output voltage
V
Quiescent current
IOUT = 100 μA, 8 V ≤ VIN ≤ 24 V
IOUT = 10 mA, 8 V ≤ VIN ≤ 24 V
IOUT = 50 mA, 8 V ≤ VIN ≤ 24 V
9 V ≤ VIN ≤ 16 V
15
0.2
1.5
5
20
0.5
2.5
10
μA
mA
mA
Line regulation
Load regulation
Dropout voltage
mV
mV
6 V ≤ VIN ≤ 40 V, IOUT = 1 mA
100 μA ≤ IOUT ≤ 5 mA
5 mA ≤ IOUT ≤ 50 mA
10
30
10
30
10
30
IOUT = 100 μA
0.05
0.20
120
450
500
20
0.1
0.40
250
V
IOUT = 50 mA
V
mA
Short-circuit current
Output impedance
Output noise voltage
Long-term stability
Ripple rejection
VOUT = 0 V
65
IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz
10 Hz–100 kHz
mΩ
μV
mV/1000 Hr
dB
Vripple = 1 Vrms, ƒripple = 120 Hz
−40
−50
−60
Reverse polarity
transient input voltage
RL = 500 Ω, t = 1 ms
−80
V
Output voltage with
reverse polarity input
VIN = −15 V, RL = 500 Ω
0
−0.3
V
V
Ω
Maximum Line Transient
RL = 500 Ω, VOUT ≤ 3.3 V, T = 40 ms
COUT = 22 µF, 0.1 mA ≤ IOUT ≤ 50 mA
60
Output bypass
capacitance (COUT) ESR
0.3
8
SHUTDOWN INPUT − 3-V LM2936BM ONLY
Output voltage, VOUT
Output off, VSD = 2.4 V, RLOAD = 500 Ω
0
0.01
V
V
Shutdown high
Output off, RLOAD = 500 Ω
2
1.1
threshold voltage, VIH
Shutdown low
threshold voltage, VIL
Output on, RLOAD = 500 Ω
1.1
12
30
0.6
V
Shutdown high
current, IIH
Output off, VSD = 2.4 V, RLOAD = 500Ω
μA
μA
Quiescent current
Output off, VSD = 2.4 V, RLOAD = 500 Ω,
includes IIH current
(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
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6.6 Electrical Characteristics for 3.3-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ = 25°C, unless otherwise specified.
PARAMETER
3.3-V LM2936HV ONLY
Output voltage
TEST CONDITIONS
MIN(1)
TYP(2)
MAX(1)
UNIT
5.5 V ≤ VIN ≤ 48 V, 100 µA ≤ IOUT ≤ 50 mA,(3)
–40°C ≤ TJ ≤ 125°C
3.201
3.300
10
3.399
30
V
Line regulation
6 V ≤ VIN ≤ 60 V, IOUT = 1 mA
mV
ALL 3.3-V LM2936
3.234
3.201
3.300
3.300
3.366
3.399
4 V ≤ VIN ≤ 26 V, 100 µA ≤ IOUT ≤ 50 mA,(3)
–40°C ≤ TJ ≤ 125°C
Output voltage
V
Quiescent current
IOUT = 100 μA, 8 V ≤ VIN ≤ 24 V
IOUT = 10 mA, 8 V ≤ VIN ≤ 24 V
IOUT = 50 mA, 8 V ≤ VIN ≤ 24 V
9 V ≤ VIN ≤ 16 V
15
0.2
1.5
5
20
0.5
2.5
10
μA
mA
mA
Line regulation
Load regulation
Dropout voltage
mV
mV
6 V ≤ VIN ≤ 40 V, IOUT = 1 mA
100 μA ≤ IOUT ≤ 5 mA
5 mA ≤ IOUT ≤ 50 mA
10
30
10
30
10
30
IOUT = 100 μA
0.05
0.2
120
450
500
20
0.10
0.4
250
V
IOUT = 50 mA
V
mA
Short-circuit current
Output impedance
Output noise voltage
Long-term stability
Ripple rejection
VOUT = 0 V
65
IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz
10 Hz–100 kHz
mΩ
μV
mV/1000 Hr
dB
Vripple = 1 Vrms, ƒripple = 120 Hz
−40
−50
−60
Reverse polarity
transient input voltage
RL = 500 Ω, T = 1 ms
−80
V
Output voltage with
reverse polarity input
VIN = −15 V, RL = 500 Ω
0
−0.3
V
V
Ω
maximum line transient
RL = 500 Ω, VOUT ≤ 3.63 V, T = 40 ms
COUT = 22 µF, 0.1 mA ≤ IOUT ≤ 50 mA
60
Output bypass
capacitance (COUT) ESR
0.3
8
SHUTDOWN INPUT − 3.3-V LM2936BM ONLY
Output voltage, VOUT
Output off, VSD = 2.4 V, RLOAD = 500 Ω
0
0.01
V
V
Shutdown high
Output off, RLOAD = 500 Ω
2
1.1
threshold voltage, VIH
Shutdown low
threshold voltage, VIL
Output on, RLOAD = 500 Ω
1.1
12
30
0.6
V
Shutdown high
current, IIH
Output off, VSD = 2.4V, RLOAD = 500 Ω
μA
μA
Quiescent current
Output off, VSD = 2.4V, RLOAD = 500 Ω,
includes IIH current
(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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6.7 Electrical Characteristics for 5-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ = 25°C, unless otherwise specified.
PARAMETER
5-V LM2936HV ONLY
Output voltage
TEST CONDITIONS
MIN(1)
TYP(2)
MAX(1)
UNIT
5.5 V ≤ VIN ≤ 48 V, 100 µA ≤ IOUT ≤ 50 mA,(3)
–40°C ≤ TJ ≤ 125°C
4.85
5
5.15
35
V
Line regulation
6 V ≤ VIN ≤ 60 V, IOUT = 1 mA
15
mV
ALL 5-V LM2936
4.9
5
5
5.1
5.5 V ≤ VIN ≤ 26 V, 100 µA ≤ IOUT ≤ 50 mA,(3)
–40°C ≤ TJ ≤ 125°C
4.85
5.15
Output voltage
V
Quiescent current
IOUT = 100 μA, 8 V ≤ VIN ≤ 24 V
IOUT = 10 mA, 8 V ≤ VIN ≤ 24 V
IOUT = 50 mA, 8 V ≤ VIN ≤ 24 V
9 V ≤ VIN ≤ 16 V
9
0.2
1.5
5
15
0.5
2.5
10
μA
mA
mA
Line regulation
Load regulation
Dropout voltage
mV
mV
6 V ≤ VIN ≤ 40 V, IOUT = 1 mA
100 μA ≤ IOUT ≤ 5 mA
5 mA ≤ IOUT ≤ 50 mA
10
30
10
30
10
30
IOUT = 100 μA
0.05
0.2
120
450
500
20
0.1
0.4
250
V
IOUT = 50 mA
V
mA
Short-circuit current
Output impedance
Output noise voltage
Long-term stability
Ripple rejection
VOUT = 0 V
65
IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz
10 Hz–100 kHz
mΩ
μV
mV/1000 Hr
dB
Vripple = 1 Vrms, ƒripple = 120 Hz
−40
−50
−60
Reverse polarity
transient input voltage
RL = 500 Ω, T = 1 ms
−80
V
Output voltage with
reverse polarity input
VIN = −15 V, RL = 500 Ω
0
−0.3
V
V
Ω
Maximum line transient
RL = 500 Ω, VOUT ≤ 5.5 V, T = 40 ms
COUT = 10 µF, 0.1 mA ≤ IOUT ≤ 50 mA
60
Output bypass
capacitance (COUT) ESR
0.3
8
SHUTDOWN INPUT − 5-V LM2936BM ONLY
Output voltage, VOUT
Output off, VSD = 2.4 V, RLOAD = 500 Ω
0
0.01
V
V
Shutdown high
Output off, RLOAD = 500 Ω
2
1.1
threshold voltage, VIH
Shutdown low
threshold voltage, VIL
Output on, RLOAD = 500 Ω
1.1
12
30
0.6
V
Shutdown high
current, IIH
Output off, VSD = 2.4 V, RLOAD = 500 Ω
μA
μA
Quiescent current
Output off, VSD = 2.4 V, RLOAD = 500Ω,
includes IIH current
(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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6.8 Typical Characteristics
Figure 1. Maximum Power Dissipation (TO-92)
Figure 2. Dropout Voltage
Figure 3. Dropout Voltage
Figure 4. Quiescent Current
Figure 6. Quiescent Current
Figure 5. Quiescent Current
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Typical Characteristics (continued)
Figure 7. Quiescent Current
Figure 8. Quiescent Current
50
Figure 9. 5-V LM2936 COUT ESR
Figure 10. 3-V LM2936 COUT ESR
Figure 12. Peak Output Current
Figure 11. 3.3-V LM2936 COUT ESR
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Typical Characteristics (continued)
Figure 14. 5-V LM2936 Current Limit
Figure 13. Peak Output Current
Figure 15. 5-V LM2936 Line Transient Response
Figure 17. 5-V LM2936 Ripple Rejection
Figure 16. 5-V LM2936 Output at Voltage Extremes
Figure 18. 5-V LM2936 Load Transient Response
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Typical Characteristics (continued)
Figure 19. 5-V LM2936 Low Voltage Behavior
Figure 20. 5-V LM2936 Output Impedance
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7 Detailed Description
7.1 Overview
The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby
mode. With less than 15 μA quiescent current at a 100-μA load, the LM2936 is ideally suited for automotive and
other battery operated systems. The LM2936 retains all of the features that are common to low dropout
regulators including a low dropout PNP pass device, short circuit protection, reverse battery input protection, and
thermal shutdown. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating
temperature range, and ±3% output voltage tolerance over the entire output current, input voltage, and
temperature range.
7.2 Functional Block Diagram
IN
OUT
PNP
Current
Limit
Thermal
Shutdown
+
Bandgap
Reference
LM2936
GND
7.3 Feature Description
7.3.1 High Input Operating Voltage
Unlike namy other PNP low dropout regulators, the LM2936 remains fully operational with VIN = 40 V, and the
LM2936HV remains fully operational with VIN = 60 V . Owing to power dissipation characteristics of the available
packages, full output current cannot be ensured for all combinations of ambient temperature and input voltage.
While the LM2936HV maintains regulation to 60 V, it will not withstand a short circuit to ground on the output
when VIN is above 40 V because of safe operating area limitations in the internal PNP pass device. Above 60V
the LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use
this device in a design where the input operating voltage may exceed 40 V, or where transients are likely to
exceed 60 V.
7.3.2 Thermal Shutdown (TSD)
The TSD circuitry of the LM2936 has been designed to protect the device against temporary thermal overload
conditions. The TSD circuitry is not intended to replace proper heat-sinking. Continuously running the LM2936
device at TSD may degrade device reliability as the junction temperature will be exceeding the absolute
maximum junction temperature rating. If the LM2936 goes into TSD mode, the output current will be shut off until
the junction temperature falls approximately 10°C, then the output current will automatically be restored. The
LM2936 will continuously cycle in and out of TSD until the condition is corrected. The LM2936 TSD junction
temperature is typically 160°C.
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Feature Description (continued)
7.3.3 Short-Circuit Current Limit
The output current limiting circuitry of the LM2936 has been designed to limit the output current in cases where
the load impedance is unusually low. This includes situations where the output may be shorted directly to ground.
Continuous operation of the LM2936 at the current limit will typically result in the LM2936 transitioning into TSD
mode.
7.3.4 Shutdown (SD) Pin
The LM2936BM has a pin for shutting down the regulator output. Applying a Logic Level High (> 2 V) to the SD
pin will cause the output to turn off. Leaving the SD pin open, connecting it to Ground, or applying a Logic Level
Low (< 0.6 V) will allow the regulator output to turn on.
7.4 Device Functional Modes
The LM2936 design does not include any undervoltage lockout (UVLO), or overvoltage shutdown (OVSD)
functions. Generally, the output voltage will track the input voltage until the input voltage is greater than VOUT + 1
V. When the input voltage is greater than VOUT + 1 V the LM2936 will be in linear operation, and the output
voltage will be regulated; however, the device will be sensitive to any small perturbation of the input voltage.
Device dynamic performance is improved when the input voltage is at least 2 V greater than the output voltage.
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SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby
mode. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating temperature range,
–24-V input voltage protection and ±3% output voltage tolerance over the entire output current, input voltage, and
temperature range This following section presents a simplified discussion of the design process. Also the
WEBENCH® software may be used to generate complete designs. When generating a design, WEBENCH
utilizes iterative design procedure and accesses comprehensive databases of components. Please go to
www.ti.com for more details.
8.2 Typical Application
Figure 21 shows the typical application circuit for the LM2936. For the LM2936 5-V option, the output capacitor,
COUT, must have a capacitance value of at least 10 µF with an equivalent series resistance (ESR) of at least 300
mΩ, but no more than 8 Ω. For the LM2936 3.3-V and 3-V options, the output capacitor, COUT, must have a
capacitance value of at least 22 µF with an ESR of at least 300 mΩ, but no more than 8 Ω. The minimum
capacitance value and the ESR requirements apply across the entire expected operating ambient temperature
range.
VIN
IN
OUT
VOUT
GND
CIN
COUT
100 nF *
10 µF **
* CIN is required only if the regulator is located more than 3 inches from the power-supply-filter capacitors.
** Required for stability. COUT must be at least 10 µF for the LM2936 5-V option, and at least 22 µF for the 3.3-V and
3-V options. Capacitance must be maintained over entire expected operating temperature range, and located as close
as possible to the regulator. The ESR, of the COUT capacitor must at least 300 mΩ, but no more than 8 Ω.
Figure 21. LM2936 Typical Application
8.2.1 Design Requirements
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
5 V
Output voltage
Input voltage
10 V to 26 V
1 mA to 50 mA
0.1 µF
Output current requirement
Input capacitor
Output capacitance
Output capacitor ESR value
10 µF minimum
300 mΩ to 8 Ω
14
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SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
ESR and minimum amount of capacitance.
8.2.2.1.1 Minimum Capacitance
The minimum output capacitance required to maintain stability is at least 10 µF for the LM2936 5-V option, and
at least 22 µF for the 3.3-V and 3-V options. This value may be increased without limit. Larger values of output
capacitance will give improved transient response.
8.2.2.1.2 ESR Limits
The ESR of the output capacitor will cause loop instability if it is too high, or too low. ESR, of the COUT capacitor
must at least 300 mΩ, but no more than 8 Ω.
8.2.2.2 Output Capacitor ESR
It is essential that the output capacitor meet the capacitance and ESR requirements, or oscillations can result.
The ESR is used with the output capacitance in
Ceramic capacitors (MLCC) can be used for COUT only if a series resistor is added to simulate the ESR
requirement. The ESR is not optional, it is mandatory. Typically, a 500-mΩ to 1-Ω series resistor is used for this
purpose. When using ceramic capacitors, due diligence must be given to initial tolerances, capacitance derating
due to applied DC voltage, and capacitance variations due to temperature. Dielectric types X5R and X7R are
preferred.
8.2.3 Application Curve
Figure 22. LM2936 VOUT vs. VIN
9 Power Supply Recommendations
This device is designed to operate from an input supply voltage from at least VOUT + 1 V up to a maximum of 40
V. The input supply should be well regulated and free of spurious noise. To ensure that the LM2936 output
voltage is well regulated the input supply should be at least VOUT + 2 V. A capacitor at the IN pin may not be
specifically required if the bulk input supply filter capacitors are within three inches of the IN pin, but adding one
will not be detrimental to operation.
While the LM2936 maintains regulation to VIN = 60 V, it will not withstand a short circuit on the output with VIN
above 40 V because of safe operating area limitations in the internal PNP pass device. With VIN above 60 V the
LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this
device in a design where the input operating voltage, including transients, is likely to exceed 60 V.
Copyright © 2000–2014, Texas Instruments Incorporated
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10 Layout
10.1 Layout Guidelines
The dynamic performance of the LM2936 is dependent on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2936. Best
performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2936, and as close as
is practical to the package. The ground connections for CIN and COUT should be back to the LM2936 ground pin
using as wide, and as short, of a copper trace as is practical.
Connections using long trace lengths, narrow trace widths, and/or connections through vias should be avoided
as these will add parasitic inductances and resistances that will give inferior performance, especially during
transient conditions
10.2 Layout Examples
5
6
4
3
VSD
GND
VOUT
COUT
2
1
7
8
CIN
GND
VIN
Figure 23. LM2936BM SOIC (D) Layout
5
6
4
3
GND
VIN
GND
VOUT
2
1
7
8
Figure 24. LM2936M SOIC (D) Layout
Thermal
Vias
4
GND
CIN
COUT
1
3
GND
VIN
VOUT
Figure 25. LM2936 TO-252 (NDP) Layout
10.3 Thermal Considerations
Due to the power dissipation characteristics of the available packages (RθJA), full output current cannot be
ensured for all combinations of ambient temperature and input voltage.
Exceeding the maximum allowable power dissipation as defined by the final package RθJA will cause excessive
die junction temperature, and the regulator may go into thermal shutdown.
Power dissipation, PD, is calculated from the following formula:
PD = ((VIN – VOUT) × IOUT) + (VIN × IGND
)
(1)
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SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
Thermal Considerations (continued)
space
VIN
VOUT
IIN = IGND + IOUT
IOUT
IN
OUT
GND
LOAD
CIN
COUT
IGND
Figure 26. Current Paths for Power Dissipation Calculation
Knowing the power dissipation (PD), the thermal resistance of the package (RθJA), and the ambient temperature
(TA), the junction temperature (TJ) can be estimated using the following formula:
TJ = (PD × RθJA) + TA
(2)
Knowing the thermal resistance of the package (RθJA), the ambient temperature (TA), and the maximum allowed
operating junction temperature (TJ) of 125°C, the maximum power dissipation can be estimated using the
following formula:
PD(MAX) = (125°C – TA) / RθJA
(3)
Alternately, solving for the required thermal resistance (RθJA):
RθJA = (125°C – TA) / PD(MAX)
(4)
The maximum allowed PD information from Equation 3 can be used to estimate the maximum allowed load
current (IOUT), or the maximum allowed VIN
:
VIN(MAX) = (PD(MAX) / IOUT) + VOUT
(5)
(6)
IOUT(MAX) = (PD(MAX) / (VIN – VOUT))
As an example, an application requires : VIN = 14 V, VOUT = 5 V, IOUT = 25 mA, and TA = 85°C. Find the
maximum RθJA to keep the junction temperature under 125°C.
R
R
R
R
θJA ≤ (125°C – TA) / PD(MAX)
θJA ≤ (125°C – 85°C) / ((14 V – 5 V) × 0.025 A)
θJA ≤ 40°C / 0.225W
(7)
(8)
(9)
θJA ≤ 177°C/W
(10)
The EIA/JEDEC standard (JESD51-2) provides methodologies to estimate the junction temperature from external
measurements (ΨJB references the temperature at the PCB, and ΨJT references the temperature at the top
surface of the package) when operating under steady-state power dissipation conditions. These methodologies
have been determined to be relatively independent of the copper thermal spreading area that may be attached to
the package DAP when compared to the more typical RθJA. Refer to Texas Instruments Application Report
Semiconductor and IC Package Thermal Metrics (SPRA953), for specifics.
On the 8-pin SOIC (D) package, the four ground pins are thermally connected to the backside of the die. Adding
approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the JEDEC RθJA rating
from 111.4°C/W to approximately 100°C/W. If this extra copper area is placed directly beneath the SOIC
package there should not be any impact on board density.
The LM2936 has an internally set thermal shutdown point of typically 160°C. Thermal shutdown is outside the
ensured operating temperature range and is intended as a safety feature only. Continuous operation near the
thermal shutdown temperature should be avoided as it may have a negative affect on the life of the device.
Copyright © 2000–2014, Texas Instruments Incorporated
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
Texas Instruments Application Report Semiconductor and IC Package Thermal Metrics (SPRA953)
11.2 Trademarks
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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Product Folder Links: LM2936
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
LM2936BM-3.3/NOPB
LM2936BM-5.0/NOPB
LM2936BMX-3.3/NOPB
LM2936BMX-5.0/NOPB
LM2936DT-3.0/NOPB
LM2936DT-3.3/NOPB
LM2936DT-5.0
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
D
8
8
8
8
3
3
3
3
3
3
3
8
8
8
8
8
8
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
LM293
6B3.3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
D
D
95
2500
2500
75
Green (RoHS
& no Sb/Br)
LM293
6B5.0
SOIC
Green (RoHS
& no Sb/Br)
LM293
6B3.3
SOIC
D
Green (RoHS
& no Sb/Br)
LM293
6B5.0
TO-252
TO-252
TO-252
TO-252
TO-252
TO-252
TO-252
SOIC
NDP
NDP
NDP
NDP
NDP
NDP
NDP
D
Green (RoHS
& no Sb/Br)
LM2936D
T-3.0
75
Green (RoHS
& no Sb/Br)
LM2936D
T-3.3
75
TBD
LM2936D
T-5.0
LM2936DT-5.0/NOPB
LM2936DTX-3.3/NOPB
LM2936DTX-5.0
ACTIVE
ACTIVE
NRND
75
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
LM2936D
T-5.0
2500
2500
2500
95
Green (RoHS
& no Sb/Br)
LM2936D
T-3.3
TBD
LM2936D
T-5.0
LM2936DTX-5.0/NOPB
LM2936HVBMA-3.3
ACTIVE
NRND
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Call TI
LM2936D
T-5.0
TBD
2936H
BM3.3
LM2936HVBMA-3.3/NOPB
LM2936HVBMA-5.0
ACTIVE
NRND
SOIC
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2936H
BM3.3
SOIC
D
95
TBD
2936H
BM5.0
LM2936HVBMA-5.0/NOPB
LM2936HVBMAX3.3
LM2936HVBMAX3.3/NOPB
ACTIVE
NRND
SOIC
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2936H
BM5.0
SOIC
D
2500
2500
TBD
2936H
BM3.3
ACTIVE
SOIC
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
2936H
BM3.3
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM2936HVBMAX5.0/NOPB
LM2936HVMA-5.0
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
VSSOP
D
8
8
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Call TI
CU SN
CU SN
Call TI
CU SN
Call TI
CU SN
CU SN
Level-1-260C-UNLIM
2936H
BM5.0
NRND
ACTIVE
NRND
D
D
95
95
TBD
Call TI
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
2936H
M-5.0
LM2936HVMA-5.0/NOPB
LM2936HVMAX-5.0
LM2936HVMAX-5.0/NOPB
LM2936M-3.0/NOPB
LM2936M-3.3
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2936H
M-5.0
D
2500
2500
95
TBD
2936H
M-5.0
ACTIVE
ACTIVE
NRND
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
2936H
M-5.0
D
Green (RoHS
& no Sb/Br)
LM293
6M-3
D
95
TBD
LM293
6-3.3
LM2936M-3.3/NOPB
LM2936M-5.0
ACTIVE
NRND
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
LM293
6-3.3
D
95
TBD
LM293
6M-5
LM2936M-5.0/NOPB
LM2936MM-3.0/NOPB
ACTIVE
ACTIVE
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LM293
6M-5
DGK
1000
Green (RoHS
& no Sb/Br)
KBC
LM2936MM-3.3
NRND
VSSOP
VSSOP
DGK
DGK
8
8
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
KBB
KBB
LM2936MM-3.3/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM2936MM-5.0/NOPB
LM2936MMX-3.3/NOPB
ACTIVE
ACTIVE
VSSOP
VSSOP
DGK
DGK
8
8
1000
3500
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
KBA
KBB
Green (RoHS
& no Sb/Br)
LM2936MMX-5.0
NRND
VSSOP
VSSOP
DGK
DGK
8
8
3500
3500
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
KBA
KBA
LM2936MMX-5.0/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM2936MP-3.0/NOPB
LM2936MP-3.3
ACTIVE
NRND
SOT-223
SOT-223
DCY
DCY
4
4
1000
1000
Green (RoHS
& no Sb/Br)
CU SN
Call TI
Level-1-260C-UNLIM
Call TI
KACA
KABA
TBD
-40 to 125
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM2936MP-3.3/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KABA
LM2936MP-5.0
NRND
SOT-223
SOT-223
DCY
DCY
4
4
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
KAAA
KAAA
LM2936MP-5.0/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM2936MPX-3.0/NOPB
LM2936MPX-3.3/NOPB
LM2936MPX-5.0/NOPB
LM2936MX-3.3/NOPB
LM2936MX-5.0
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
SOT-223
SOT-223
SOT-223
SOIC
DCY
DCY
DCY
D
4
4
4
8
8
8
3
3
3
3
3
3
2000
2000
2000
2500
2500
2500
1800
1800
2000
2000
2000
1800
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
KACA
KABA
KAAA
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM293
6-3.3
SOIC
D
TBD
LM293
6M-5
LM2936MX-5.0/NOPB
LM2936Z-3.0/NOPB
LM2936Z-3.3/NOPB
LM2936Z-5.0/LFT1
LM2936Z-5.0/LFT3
LM2936Z-5.0/LFT4
LM2936Z-5.0/NOPB
ACTIVE
LIFEBUY
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
LM293
6M-5
TO-92
TO-92
TO-92
TO-92
TO-92
TO-92
LP
LP
LP
LP
LP
LP
Green (RoHS
& no Sb/Br)
LM2936
Z-3
Green (RoHS
& no Sb/Br)
LM2936
Z-3.3
Green (RoHS
& no Sb/Br)
LM293
6Z-5
Green (RoHS
& no Sb/Br)
LM293
6Z-5
Green (RoHS
& no Sb/Br)
LM293
6Z-5
Green (RoHS
& no Sb/Br)
-40 to 125
LM293
6Z-5
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2936BMX-3.3/NOPB
LM2936BMX-5.0/NOPB
SOIC
SOIC
D
D
8
8
3
3
3
8
8
2500
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
16.4
16.4
16.4
12.4
12.4
6.5
6.5
6.9
6.9
6.9
6.5
6.5
5.4
5.4
2.0
2.0
2.7
2.7
2.7
2.0
2.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
16.0
16.0
16.0
12.0
12.0
Q1
Q1
Q2
Q2
Q2
Q1
Q1
LM2936DTX-3.3/NOPB TO-252
LM2936DTX-5.0 TO-252
LM2936DTX-5.0/NOPB TO-252
NDP
NDP
NDP
D
10.5
10.5
10.5
5.4
LM2936HVBMAX3.3
SOIC
SOIC
LM2936HVBMAX3.3/NOP
B
D
5.4
LM2936HVBMAX5.0/NOP
B
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936HVMAX-5.0
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.5
6.5
5.4
5.4
2.0
2.0
8.0
8.0
12.0
12.0
Q1
Q1
LM2936HVMAX-5.0/NOP
B
LM2936MM-3.0/NOPB
LM2936MM-3.3
VSSOP
VSSOP
VSSOP
VSSOP
DGK
DGK
DGK
DGK
DGK
DGK
8
8
8
8
8
8
1000
1000
1000
1000
3500
3500
178.0
178.0
178.0
178.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
5.3
3.4
3.4
3.4
3.4
3.4
3.4
1.4
1.4
1.4
1.4
1.4
1.4
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
LM2936MM-3.3/NOPB
LM2936MM-5.0/NOPB
LM2936MMX-3.3/NOPB VSSOP
LM2936MMX-5.0 VSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2936MMX-5.0/NOPB VSSOP
LM2936MP-3.0/NOPB SOT-223
DGK
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
D
8
4
4
4
4
4
4
4
4
8
8
8
3500
1000
1000
1000
1000
1000
2000
2000
2000
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
12.4
12.4
12.4
5.3
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
6.5
6.5
6.5
3.4
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
5.4
5.4
5.4
1.4
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.0
2.0
2.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
8.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
12.0
12.0
12.0
Q1
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
LM2936MP-3.3
LM2936MP-3.3/NOPB SOT-223
LM2936MP-5.0 SOT-223
SOT-223
LM2936MP-5.0/NOPB SOT-223
LM2936MPX-3.0/NOPB SOT-223
LM2936MPX-3.3/NOPB SOT-223
LM2936MPX-5.0/NOPB SOT-223
LM2936MX-3.3/NOPB
LM2936MX-5.0
SOIC
SOIC
SOIC
D
8.0
LM2936MX-5.0/NOPB
D
8.0
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2936BMX-3.3/NOPB
LM2936BMX-5.0/NOPB
LM2936DTX-3.3/NOPB
LM2936DTX-5.0
SOIC
SOIC
D
8
8
3
3
3
2500
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
38.0
35.0
38.0
D
TO-252
TO-252
TO-252
NDP
NDP
NDP
LM2936DTX-5.0/NOPB
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2936HVBMAX3.3
SOIC
SOIC
D
D
8
8
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
LM2936HVBMAX3.3/NOP
B
LM2936HVBMAX5.0/NOP
B
SOIC
D
8
2500
367.0
367.0
35.0
LM2936HVMAX-5.0
LM2936HVMAX-5.0/NOPB
LM2936MM-3.0/NOPB
LM2936MM-3.3
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
4
4
4
4
4
4
4
4
8
8
8
2500
2500
1000
1000
1000
1000
3500
3500
3500
1000
1000
1000
1000
1000
2000
2000
2000
2500
2500
2500
367.0
367.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
D
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOIC
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
D
LM2936MM-3.3/NOPB
LM2936MM-5.0/NOPB
LM2936MMX-3.3/NOPB
LM2936MMX-5.0
LM2936MMX-5.0/NOPB
LM2936MP-3.0/NOPB
LM2936MP-3.3
LM2936MP-3.3/NOPB
LM2936MP-5.0
LM2936MP-5.0/NOPB
LM2936MPX-3.0/NOPB
LM2936MPX-3.3/NOPB
LM2936MPX-5.0/NOPB
LM2936MX-3.3/NOPB
LM2936MX-5.0
SOIC
D
LM2936MX-5.0/NOPB
SOIC
D
Pack Materials-Page 3
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004)
M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
3
0,25 (0.010)
0,84 (0.033)
0,66 (0.026)
0°–10°
2,30 (0.091)
0,10 (0.004)
M
4,60 (0.181)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
1,80 (0.071) MAX
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
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