LM2940K-8.0/883 [TI]
8V FIXED POSITIVE LDO REGULATOR, 0.3V DROPOUT, MBCY2, METAL CAN, TO-3, 2 PIN;
| 型号： | LM2940K-8.0/883 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 8V FIXED POSITIVE LDO REGULATOR, 0.3V DROPOUT, MBCY2, METAL CAN, TO-3, 2 PIN 输出元件 调节器 |
| 文件： | 总12页 (文件大小：168K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MICROCIRCUIT DATA SHEET
Original Creation Date: 07/22/96
Last Update Date: 10/08/99
MNLM2940-8.0-X REV 1A1
Last Major Revision Date: 07/22/96
1A LOW DROPOUT REGULATOR
General Description
The LM2940 positive voltage regulator features the ability to source 1A of ouput current
with a dropout voltage of typically 0.5V and a maximum of 1V over the entire temperature
range. Furthermore, a quiescent current reduction circuit has been included which reduces
the ground current when the differential between the input voltage and the output voltage
exceeds approximately 3V. The quiescent current with 1A of output current and an
input-output differential of 5V is therefore only 30 mA. Higher quiescent currents only
exist when the regulator is in the dropout mode (Vin - Vout < 3V).
Designed also for vehicular applications, the LM2940 and all regulated circuitry are
protected from reverse battery installations or 2-battery jumps. During line transients,
such as load dump when the input voltage can momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut down to protect both the internal
circuits and the load. The LM2940 cannot be harmed by temporary mirror-image insertion.
Familiar regulator features such as short circuit and thermal overload protection are also
provided.
Industry Part Number
NS Part Numbers
LM2940
LM2940J-8.0/883
LM2940K-8.0/883
Prime Die
LM2940
Controlling Document
SEE FEATURE SECTION
Processing
Subgrp Description
Temp (oC)
MIL-STD-883, Method 5004
1
Static tests at
+25
2
Static tests at
+125
-55
3
Static tests at
4
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
+25
Quality Conformance Inspection
5
+125
-55
6
MIL-STD-883, Method 5005
7
+25
8A
8B
9
+125
-55
+25
10
11
+125
-55
1
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
Features
- Dropout voltage typically 0.5V @ Io = 1A
- Output current in excess of 1A
- Output voltage trimmed before assembly
- Reverse battery protection
- Internal short circuit current limit
- Mirror image insertion protection
- CONTROLLING DOCUMENT
- LM2940J-8.0/883
- LM2940K-8.0/883
5962-9088301QEA
5962-9088301MYA
2
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
(Absolute Maximum Ratings)
(Note 1)
Input Voltage (Survival Voltage <100ms)
60V
Internal Power Dissipation
(Note 2, 3)
Internally Limited
150 C
Maximum Junction Temperature
Storage Temperature Range
-65 C to +150 C
300 C
Lead Temperature
(Soldering, 10 seconds)
Thermal Resistance
ThetaJA
T03 Pkg
T03 Pkg
CERDIP
CERDIP
(Still Air)
40 C/W
TBD
73 C/W
37 C/W
(500LF/Min Air Flow)
(Still Air)
(500LF/Min Air Flow)
ThetaJC
T03 Pkg
CERDIP
5 C/W
3 C/W
(Note 3)
Package Weight
(Typcial)
T03 Pkg
TBD
1970mg
360mg
CERDIP
CERAMIC SOIC
ESD Susceptibility
(Note 4)
4000V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur.
Operating Ratings are conditions for which the device is functional, but do not
guaranteed specific performance limits. For guaranteed specifications and test
conditions see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade
when the device is not operated under the listed test conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to
ambient thermal resistance), and TA (ambient temperature). The maximum allowable
power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number
given in the Absolute Maximum Ratings, whichever is lower.
Note 3: The package material for these devices allows much improved heat transfer over our
standard ceramic packages. In order to take full advantage of this improved heat
transfer, heat sinking must be provided between the package base (directly beneath
the die), and either metal traces on, or thermal vias through, the printed circuit
board. Without this additional heat sinking, device power dissipation must be
calculated using junction-to-ambient, rather than junction-to-case, thermal
resistance. It must not be assumed that the device leads will provide substantial
heat transfer out of the package, since the thermal resistance of the leadframe
material is very poor, relative to the material of the package base. The stated
junction-to-case thermal resistance is for the package material only, and does not
account for the additional thermal resistance between the package base and the
printed circuit board. The user must determine the value of the additional thermal
resistance and must combine this with the stated value for the package, to calculate
the total allowed power dissipation for the device.
Note 4: Human body model, 100pF discharged through 1.5K Ohms
3
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
Recommended Operating Conditions
(Note 1)
Input Voltage
26V
-55 C < TA < +125 C
Operating Temperature Range
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur.
Operating Ratings are conditions for which the device is functional, but do not
guaranteed specific performance limits. For guaranteed specifications and test
conditions see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade
when the device is not operated under the listed test conditions.
4
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
Electrical Characteristics
DC PARAMETERS:
(The following conditions apply to all the following parameters, unless otherwise specified.)
DC: Vin = 13V, Io = 1A, Cout = 22uF
PIN-
NAME
SUB-
SYMBOL
Vout
PARAMETER
CONDITIONS
Vin = 13V, Io = 5mA
NOTES
MIN
MAX UNIT
8.24
GROUPS
Output Voltage
7.76
7.60
7.76
7.60
7.76
7.60
7.76
7.60
7.76
7.60
7.76
7.60
7.76
7.60
7.76
7.60
-15
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
1
8.40
8.24
8.40
8.24
8.40
8.24
8.40
8.24
8.40
8.24
8.40
8.24
8.40
8.24
8.40
2, 3
1
Vin = 9.4V, Io = 5mA
Vin = 10V, Io = 5mA
Vin = 26V, Io = 5mA
Vin = 13V, Io = 1A
Vin = 9.4V, Io = 1A
Vin = 9.4V, Io = 50mA
Vin = 13V, Io = 50mA
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
Reverse Polarity Ro = 100 Ohms
Input Voltage DC
1
1, 2,
3
Iq
Quiescent Current Vin = 13V, Io = 5mA
0
15
20
15
20
15
20
50
60
50
80
80
130
mA
mA
mA
mA
mA
mA
mA
mA
mV
mV
mV
mV
1
0
2, 3
1
Vin = 10V, Io = 5mA
0
0
2, 3
1
Vin = 26V, Io = 5mA
0
0
2, 3
1
Vin = 13V, Io = 1A
0
0
2, 3
1
Vrline
Vrload
Line Regulation
Load Regulation
10V < Vin < 26V, Io = 5mA
Vin = 13V, 50mA < Io < 1A
-50
-80
-80
-130
2, 3
1
2, 3
5
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
Electrical Characteristics
DC PARAMETERS:(Continued)
(The following conditions apply to all the following parameters, unless otherwise specified.)
DC: Vin = 13V, Io = 1A, Cout = 22uF
PIN-
NAME
SUB-
SYMBOL
Vdo
PARAMETER
CONDITIONS
NOTES
MIN
MAX UNIT
GROUPS
Dropout Voltage
Io = 1A
0
0
0
0
0.7
V
1
1
V
2, 3
1
Io = 100mA
Vin = 13V
200
300
mV
mV
A
2, 3
1
Isc
Short Circuit
Current
1.6
1.3
A
2, 3
AC PARAMETERS:
(The following conditions apply to all the following parameters, unless otherwise specified.)
AC: Vin = 10V, Io = 1A, Cout = 22uF
Max Line
Vo < 9V, Ro = 100 Ohms, T = 20ms
1
40
V
V
7, 8A,
8B
Transient
Reverse Polarity T = 20ms, Ro = 100 Ohms
Input Voltage
Transient
1
-45
7, 8A,
8B
No
Zo
RR
Output Noise
Voltage
Vin = 13V, Io = 5mA, 10Hz = 100KHz
1
1
0
1000
1
uVrms 4, 5,
6
Output Impedance Vin = 13V, Io = 100mA DC and 20mA AC,
fo = 120Hz
Ohm 4, 5,
6
Ripple Rejection Vin = 13V, 1Vrms, f = 1KHz, Io = 5mA
1
1
54
48
dB
dB
4
5, 6
Note 1: Functional test only.
6
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
Graphics and Diagrams
GRAPHICS#
DESCRIPTION
05826HRA2
06332HRA2
J16ARL
METAL CAN (KA), TO-3, 2LD, LOW PROFILE (B/I CKT)
CERDIP (J), 16 LEAD (B/I CKT)
CERDIP (J), 16 LEAD (P/P DWG)
K02CRE
METAL CAN (KA), TO-3, 2LD, LOW PROFILE (P/P DWG)
METAL CAN (KA), TO-3, 2LD, LOW PROFILE (PINOUT)
CERDIP (J), 16 LEAD (PINOUT)
P000137A
P000159A
See attached graphics following this page.
7
OUTPUT
GROUND
(CASE)
BOTTOM
VIEW
INPUT
LM2940K-XX/883
2 - LEAD TO3
CONNECTION DIAGRAM
BOTTOM VIEW
P000137A
MIL/AEROSPACE OPERATIONS
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CA 95050
NC
1
16
VIN
NC
VOUT
NC
2
3
4
5
6
7
8
15
14
13
12
11
10
9
NC
GND
GND
GND
GND
GND
NC
NC
NC
NC
NC
LM2940J-XX
16 - LEAD DIP
CONNECTION DIAGRAM
TOP VIEW
P000159A
MIL/AEROSPACE OPERATIONS
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CA 95050
MICROCIRCUIT DATA SHEET
MNLM2940-8.0-X REV 1A1
Revision History
Rev ECN # Rel Date Originator Changes
0A0
M0001537 10/08/99
Barbara Lopez
Initial Release of: MNLM2940-8.0-X Rev. 0A0. Added
note for power dissipation and reference to thermal
resistance for Aluminum Nitride package.
1A1
M0003229 10/08/99
Rose Malone
Update MDS: MNLM2940-8.0-X, Rev. 0A0 to
MNLM2940-8.0-X, Rev. 1A1. Moved reference to
Controlling Document to Feature Section. Added to
Absolute Section Thermal Resistance limit for T03
package. Changed Vdo, Io = 100mA, Max. condition for
subgroup 1 from 150mV to 200mV and subgroup 2 from
200mV to 300mV.
8
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