LM3480IM3-15/NOPB [TI]

100mA、30V 低压降稳压器 | DBZ | 3 | -40 to 125;
LM3480IM3-15/NOPB
型号: LM3480IM3-15/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

100mA、30V 低压降稳压器 | DBZ | 3 | -40 to 125

光电二极管 输出元件 电源电路 线性稳压器IC 调节器
文件: 总15页 (文件大小:996K)
中文:  中文翻译
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LM3480  
www.ti.com  
SNVS011E JUNE 1999REVISED MARCH 2013  
LM3480 100 mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator  
Check for Samples: LM3480  
1
FEATURES  
DESCRIPTION  
The LM3480 is an integrated linear voltage regulator.  
It features operation from an input as high as 30V  
and a ensured maximum dropout of 1.2V at the full  
100 mA load. Standard packaging for the LM3480 is  
the 3-lead SOT-23 package.  
2
3.3, 5, 12, and 15V Versions Available  
Packaged in the Tiny 3-Lead SOT-23 Package  
APPLICATIONS  
Tiny Alternative to LM78LXX Series and  
Similar Devices  
The 5, 12, and 15V members of the LM3480 series  
are intended as tiny alternatives to industry standard  
LM78LXX series and similar devices. The 1.2V quasi  
low dropout of LM3480 series devices makes them a  
nice fit in many applications where the 2 to 2.5V  
dropout of LM78LXX series devices precludes their  
(LM78LXX series devices) use.  
Tiny 5V±5% to 3.3V, 100 mA Converter  
Post Regulator for Switching DC/DC Converter  
Bias Supply for Analog Circuits  
KEY SPECIFICATIONS  
The LM3480 series features a 3.3V member. The  
SOT-23 packaging and quasi low dropout features of  
the LM3480 series converge in this device to provide  
a very nice, very tiny 3.3V, 100 mA bias supply that  
regulates directly off the system 5V±5% power  
supply.  
30V Maximum Input for Operation  
1.2V Ensured Maximum Dropout Over Full  
Load and Temperature Ranges  
100 mA Ensured Minimum Load Current  
±5% Ensured Output Voltage Tolerance Over  
Full Load and Temperature Ranges  
40 to +125°C Junction Temperature Range for  
Operation  
Typical Application Circuit  
Connection Diagram  
Figure 1. Top View  
SOT-23 Package  
Package Number DBZ0003A  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
LM3480  
SNVS011E JUNE 1999REVISED MARCH 2013  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
Input Voltage (IN to GND)  
35V  
333mW  
(3)  
Power Dissipation  
(3)  
Junction Temp.  
+150°C  
Ambient Storage Temp.  
65 to +150°C  
(4)  
Soldering Time, Temp.  
Wave  
Infrared  
Vapor Phase  
4 sec., 260°C  
10 sec., 240°C  
75 sec., 219°C  
(5)  
ESD  
2kV  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and  
associated test conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.  
(3) The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ - TA)/θJA where TJ  
is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 333 mW rating  
results from substituting the Absolute Maximum junction temperature, 150°C, for TJ , 50°C for TA, and 300°C/W for θJA. More power can  
be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures. The Absolute  
Maximum power dissipation can be increased by 3.33 mW for each °C below 50°C ambient. It must be derated by 3.33 mW for each °C  
above 50°C ambient. A θJA of 300°C/W represents the worst-case condition of no heat sinking of the 3-lead plastic SOT-23 package.  
Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction temperature to about 150°C.  
(4) Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline  
packages, refer to the Packaging Databook .  
(5) For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kresistor.  
Operating Ratings(1)  
Max. Input Voltage (IN to GND)  
30V  
40 to +125°C  
250mW  
Junction Temp. (TJ)  
(2)  
Max. Power Dissipation  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and  
associated test conditions, see the Electrical Characteristics.  
(2) As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature.  
The 250 mW rating appearing under Operating Ratings results from substituting the maximum junction temperature for operation,  
125°C, for TJ, 50°C for TA, and 300°C/W for θJA in P = (TJ - TA)/θJA. More power can be dissipated at lower ambient temperatures. Less  
power can be dissipated at higher ambient temperatures. The maximum power dissipation for operation appearing under Operating  
Ratings can be increased by 3.33 mW for each °C below 50°C ambient. It must be derated by 3.33 mW for each °C above 50°C  
ambient. A θJA of 300°C/W represents the worst-case condition of no heat sinking of the 3-lead plastic SOT-23 package. Heat sinking  
enables the dissipation of more power during operation.  
Electrical Characteristics LM3480-3.3, LM3480-5.0  
Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits appearing in boldface type apply over the entire  
(1) (2) (3)  
junction temperature range for operation, 40 to +125°C.  
Nominal Output Voltage (VNOM  
)
3.3V  
Typical  
5.0V  
Typical  
Units  
Symbol  
Parameter  
Conditions  
VIN = VNOM + 1.5V,  
Limit  
Limit  
VOUT  
Output Voltage  
3.30  
10  
5.00  
12  
V
1 mA IOUT 100 mA  
3.17  
3.14  
3.43  
3.46  
4.80  
4.75  
5.20  
5.25  
V(min)  
V(min)  
V(max)  
V(max)  
ΔVOUT  
Line Regulation  
VNOM + 1.5V VIN 30V,  
mV  
IOUT = 1 mA  
25  
25  
mV(max)  
(1) A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.  
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All  
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical  
process control.  
(3) All voltages except dropout are with respect to the voltage at the GND pin.  
2
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM3480  
 
LM3480  
www.ti.com  
SNVS011E JUNE 1999REVISED MARCH 2013  
Electrical Characteristics LM3480-3.3, LM3480-5.0 (continued)  
Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits appearing in boldface type apply over the entire  
(1) (2) (3)  
junction temperature range for operation, 40 to +125°C.  
Nominal Output Voltage (VNOM  
)
3.3V  
Typical  
5.0V  
Typical  
Units  
Symbol  
Parameter  
Conditions  
VIN = VNOM + 1.5V,  
Limit  
40  
Limit  
40  
ΔVOUT  
Load Regulation  
20  
20  
mV  
mV(max)  
10 mA IOUT 100 mA  
IGND  
Ground Pin Current  
Dropout Voltage  
VNOM + 1.5V VIN 30V,  
No Load  
2
2
mA  
mA(max)  
4
4
VIN  
-
IOUT = 10 mA  
0.7  
0.7  
V
VOUT  
0.9  
1.0  
0.9  
1.0  
V(max)  
V(max)  
IOUT = 100 mA  
0.9  
0.9  
V
1.1  
1.2  
1.1  
1.2  
V(max)  
V(max)  
en  
Output Noise Voltage VIN = 10V,  
Bandwidth: 10 Hz to 100 kHz  
100  
150  
µVrms  
LM3480-12, LM3480-15  
Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits appearing in boldface type apply over the entire  
(1) (2) (3)  
junction temperature range for operation, 40 to +125°C.  
Nominal Output Voltage (VNOM  
)
12V  
Typical  
15V  
Typical  
Units  
Symbol  
VOUT  
Parameter  
Conditions  
VIN = VNOM + 1.5V,  
Limit  
Limit  
Output Voltage  
12.00  
15.00  
V
1 mA IOUT 100 mA  
11.52  
11.40  
12.48  
12.60  
14.40  
14.25  
15.60  
15.75  
V(min)  
V(min)  
V(max)  
V(max)  
ΔVOUT  
ΔVOUT  
IGND  
Line Regulation  
Load Regulation  
VNOM + 1.5V VIN 30V,  
IOUT = 1 mA  
14  
36  
2
16  
45  
2
mV  
mV(max)  
40  
60  
4
40  
75  
4
VIN = VNOM + 1.5V,  
10 mA IOUT 100 mA  
mV  
mV(max)  
Ground Pin Current VNOM + 1.5V VIN 30V,  
mA  
mA(max)  
No Load  
VIN  
-
Dropout Voltage  
IOUT = 10 mA  
0.7  
0.7  
V
VOUT  
0.9  
1.0  
0.9  
1.0  
V(max)  
V(max)  
IOUT = 100 mA  
0.9  
0.9  
V
1.1  
1.2  
1.1  
1.2  
V(max)  
V(max)  
en  
Output Noise  
Voltage  
VIN = 10V,  
Bandwidth: 10 Hz to 100 kHz  
360  
450  
µVrms  
(1) A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.  
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All  
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical  
process control.  
(3) All voltages except dropout are with respect to the voltage at the GND pin.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: LM3480  
 
LM3480  
SNVS011E JUNE 1999REVISED MARCH 2013  
www.ti.com  
Typical Performance Characteristics  
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.  
Dropout Voltage vs Load Current  
Dropout Voltage vs Junction Temperature  
Figure 2.  
Figure 3.  
Ground Pin Current vs Input Voltage  
Ground Pin Current vs Input Voltage  
Figure 4.  
Figure 5.  
Ground Pin Current vs Load Current  
Ground Pin Current vs Junction Temperature  
Figure 6.  
Figure 7.  
4
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM3480  
LM3480  
www.ti.com  
SNVS011E JUNE 1999REVISED MARCH 2013  
Typical Performance Characteristics (continued)  
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.  
Input Current vs Input Voltage  
Input Current vs Input Voltage  
Figure 8.  
Figure 9.  
Line Transient Response  
Line Transient Response  
Figure 10.  
Figure 11.  
Load Transient Response  
Load Transient Response  
Figure 12.  
Figure 13.  
Copyright © 1999–2013, Texas Instruments Incorporated  
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Product Folder Links: LM3480  
LM3480  
SNVS011E JUNE 1999REVISED MARCH 2013  
www.ti.com  
Typical Performance Characteristics (continued)  
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.  
Load Transient Response  
Load Transient Response  
Figure 14.  
Figure 15.  
Output Voltage vs Input Voltage  
Output Voltage vs Input Voltage  
Figure 16.  
Figure 17.  
Output Voltage vs Input Voltage  
Output Voltage vs Input Voltage  
Figure 18.  
Figure 19.  
6
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM3480  
LM3480  
www.ti.com  
SNVS011E JUNE 1999REVISED MARCH 2013  
Typical Performance Characteristics (continued)  
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.  
Output Short- Circuit Current  
Output Short- Circuit Current  
Figure 20.  
Figure 21.  
Power Supply Rejection Ratio  
Power Supply Rejection Ratio  
Figure 22.  
Figure 23.  
Copyright © 1999–2013, Texas Instruments Incorporated  
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Product Folder Links: LM3480  
 
LM3480  
SNVS011E JUNE 1999REVISED MARCH 2013  
www.ti.com  
Typical Performance Characteristics (continued)  
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.  
DC Load Regulation  
Figure 24.  
8
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM3480  
LM3480  
www.ti.com  
SNVS011E JUNE 1999REVISED MARCH 2013  
REVISION HISTORY  
Changes from Revision D (March 2013) to Revision E  
Page  
Changed layout of National Data Sheet to TI format ............................................................................................................ 7  
Copyright © 1999–2013, Texas Instruments Incorporated  
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9
Product Folder Links: LM3480  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
1000  
1000  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LM3480IM3-12  
NRND  
ACTIVE  
SOT-23  
SOT-23  
DBZ  
3
3
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0C  
L0C  
LM3480IM3-12/NOPB  
DBZ  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM3480IM3-15/NOPB  
ACTIVE  
SOT-23  
DBZ  
3
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0D  
LM3480IM3-3.3  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0A  
L0A  
LM3480IM3-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM3480IM3-5.0  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0B  
L0B  
LM3480IM3-5.0/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM3480IM3X-12  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0C  
L0C  
LM3480IM3X-12/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM3480IM3X-15/NOPB  
ACTIVE  
SOT-23  
DBZ  
3
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0D  
LM3480IM3X-3.3  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0A  
L0A  
LM3480IM3X-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM3480IM3X-5.0  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0B  
L0B  
LM3480IM3X-5.0/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM3480IM3-12  
LM3480IM3-12/NOPB  
LM3480IM3-15/NOPB  
LM3480IM3-3.3  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
3
3
3
3
3
3
3
3
3
3
3
3
3
3
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LM3480IM3-3.3/NOPB  
LM3480IM3-5.0  
LM3480IM3-5.0/NOPB  
LM3480IM3X-12  
LM3480IM3X-12/NOPB SOT-23  
LM3480IM3X-15/NOPB SOT-23  
LM3480IM3X-3.3  
LM3480IM3X-3.3/NOPB SOT-23  
LM3480IM3X-5.0 SOT-23  
LM3480IM3X-5.0/NOPB SOT-23  
SOT-23  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM3480IM3-12  
LM3480IM3-12/NOPB  
LM3480IM3-15/NOPB  
LM3480IM3-3.3  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
3
3
3
3
3
3
3
3
3
3
3
3
3
3
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LM3480IM3-3.3/NOPB  
LM3480IM3-5.0  
LM3480IM3-5.0/NOPB  
LM3480IM3X-12  
LM3480IM3X-12/NOPB  
LM3480IM3X-15/NOPB  
LM3480IM3X-3.3  
LM3480IM3X-3.3/NOPB  
LM3480IM3X-5.0  
LM3480IM3X-5.0/NOPB  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
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requirements. Nonetheless, such components are subject to these terms.  
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

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