LM34910C [TI]

High Voltage (50V, 1.25A) Step Down Switching Regulator;
LM34910C
型号: LM34910C
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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High Voltage (50V, 1.25A) Step Down Switching Regulator

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LM34910C  
www.ti.com  
SNVS517B MAY 2007REVISED MARCH 2013  
LM34910C High Voltage (50V, 1.25A) Step Down Switching Regulator  
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1
FEATURES  
DESCRIPTION  
The LM34910C Step Down Switching Regulator  
features all of the functions needed to implement a  
low cost, efficient, buck bias regulator capable of  
supplying 1.25A to the load. This buck regulator  
contains a 55V N-Channel Buck Switch, and is  
available in the thermally enhanced WSON-10  
package. The hysteretic regulation scheme requires  
no loop compensation, results in fast load transient  
response, and simplifies circuit implementation. The  
operating frequency remains constant with line and  
load variations due to the inverse relationship  
between the input voltage and the on-time. The  
current limit detection is set at 1.25A. Additional  
features include: VCC under-voltage lockout, thermal  
shutdown, gate drive under-voltage lockout, and  
maximum duty cycle limiter.  
2
Integrated 55V, N-Channel Buck Switch  
Integrated Start-Up Regulator  
Input Voltage Range: 8V to 50V  
No Loop Compensation Required  
Ultra-Fast Transient Response  
Operating Frequency Remains Constant with  
Load Current and Input Voltage  
Maximum Duty Cycle Limited During Start-Up  
Adjustable Output Voltage  
Valley Current Limit At 1.25A  
Precision Internal Reference  
Low Bias Current  
Highly Efficient Operation  
Thermal Shutdown  
Package  
WSON-10 (4 mm x 4 mm)  
Exposed Thermal Pad For Improved Heat  
Dissipation  
TYPICAL APPLICATIONS  
High Efficiency Point-Of-Load (POL) Regulator  
Non-Isolated Telecommunication Buck  
Regulator  
Secondary High Voltage Post Regulator  
Connection Diagram  
SW  
BST  
ISEN  
1
2
3
4
5
10  
9
VIN  
VCC  
8
RON/SD  
SS  
SGND  
RTN  
7
6
FB  
10-Lead WSON  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2013, Texas Instruments Incorporated  
LM34910C  
SNVS517B MAY 2007REVISED MARCH 2013  
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Typical Application Circuit and Block Diagram  
7V SERIES  
REGULATOR  
8V-50V  
Input  
LM34910C  
V
V
CC  
IN  
10  
9
C3  
THERMAL  
SHUTDOWN  
V
CC  
UVLO  
C5  
C1  
-
RON  
+
280 ns  
OFF TIMER  
ON TIMER  
RON  
SD  
/
0.7V  
8
R
ON START  
START  
COMPLETE  
COMPLETE  
BST  
IN  
2
GATE DRIVE  
UVLO  
C4  
V
2.5V  
11.5 mA  
DRIVER  
LOGIC  
SS  
7
6
L1  
LEVEL  
SHIFT  
C6  
DRIVER  
SW  
1
V
OUT1  
+
-
FB  
REGULATION  
COMPARATOR  
+
OVER-  
VOLTAGE  
2.875V  
COMPARATOR  
D1  
CURRENT LIMIT  
COMPARATOR  
R3  
-
I
SEN  
R1  
V
OUT2  
3
4
+
-
RSENSE  
50 mW  
-
+
RTN  
5
62.5 mV  
C2  
S
GND  
R2  
PIN DESCRIPTIONS  
Pin  
Name  
Description  
Application Information  
Internally connected to the buck switch source. Connect to  
the external inductor, diode, and boost capacitor.  
1
SW  
Switching Node  
Connect a 0.022 µF capacitor from SW to this pin. An  
internal diode charges the capacitor during the off-time.  
2
3
BST  
ISEN  
Boost pin for boot-strap capacitor  
Internally the current sense resistor connects from this pin to  
SGND. Re-circulating current flows out of this pin to the free-  
wheeling diode. Current limit is set at 1.25A.  
Current sense input  
Re-circulating current flows into this pin to the current sense  
resistor.  
4
5
6
7
8
SGND  
RTN  
FB  
Sense Ground  
Circuit Ground  
Feedback  
Ground for all internal circuitry other than the current limit  
detection.  
Internally connected to the regulation and over-voltage  
comparators. The regulation level is 2.5V.  
An internal 11.5 µA current source charges an external  
capacitor to 2.5V to provide the softstart function.  
SS  
Softstart  
An external resistor from VIN to this pin sets the buck switch  
on-time. Grounding this pin shuts down the regulator.  
RON/SD  
On-time Control and Shutdown  
Nominally regulated to 7.0V. An external voltage (8V-14V)  
can be connected to this pin to reduce internal dissipation.  
9
VCC  
VIN  
Output from the start-up regulator  
Input supply voltage  
An internal diode connects VCC to VIN  
.
10  
Nominal input range is 8.0V to 50V.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
2
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Absolute Maximum Ratings(1)(2)  
VIN to GND  
55V  
BST to GND  
70V  
SW to GND (Steady State)  
ESD Rating(3)  
-1.5V  
Human Body Model  
2kV  
BST to VCC  
55V  
VIN to SW  
55V  
BST to SW  
14V  
VCC to GND  
14V  
SGND to RTN  
-0.3V to +0.3V  
See Text  
-0.3V to 4V  
-0.3 to 7V  
-55°C to +150°C  
150°C  
Current out of ISEN  
SS to RTN  
All Other Inputs to GND  
Storage Temperature Range  
Junction Temperature  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin.  
Operating Ratings(1)  
VIN  
8.0V to 50V  
Junction Temperature  
40°C to + 125°C  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.  
Electrical Characteristics  
Specifications with standard typeface are for TJ = 25°C, and those with boldface type apply over full Operating Junction  
Temperature range. VIN = 24V, RON = 200k unless otherwise stated(1)  
.
Symbol  
Parameter  
Conditions  
Min  
6.6  
Typ  
Max  
7.4  
Units  
Start-Up Regulator, VCC  
VCCReg  
VCC regulated output  
7
V
V
ICC = 0 mA,  
VIN-VCC dropout voltage  
1.4  
VCC = VCCReg - 100 mV  
0 mA ICC 5 mA  
VCC = 0V  
VCC output impedance  
VCC current limit(2)  
140  
9
mA  
UVLOVCC  
VCC under-voltage lockout  
threshold  
VCC increasing  
5.8  
V
UVLOVCC hysteresis  
UVLOVCC filter delay  
IIN operating current  
IIN shutdown current  
VCC decreasing  
150  
3
mV  
µs  
100 mV overdrive  
Non-switching, FB = 3V  
RON/SD = 0V  
0.63  
80  
1
mA  
µA  
250  
Switch Characteristics  
Rds(on)  
UVLOGD  
Buck Switch Rds(on)  
ITEST = 200 mA  
0.45  
4.3  
0.95  
5.5  
V
Gate Drive UVLO  
VBST - VSW Increasing  
3.0  
UVLOGD hysteresis  
440  
mV  
(1) Typical specifications represent the most likely parametric norm at 25°C operation.  
(2) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading  
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Electrical Characteristics (continued)  
Specifications with standard typeface are for TJ = 25°C, and those with boldface type apply over full Operating Junction  
Temperature range. VIN = 24V, RON = 200k unless otherwise stated(1)  
.
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Softstart Pin  
Pull-up voltage  
2.5  
V
Internal current source  
11.5  
µA  
Current Limit  
ILIM  
Threshold  
Current out of ISEN  
1
1.25  
130  
150  
1.5  
A
Resistance from ISEN to SGND  
Response time  
mΩ  
ns  
On Timer  
tON - 1  
On-time  
VIN = 10V, RON = 200 kΩ  
VIN = 50V, RON = 200 kΩ  
Voltage at RON/SD rising  
Voltage at RON/SD falling  
2.1  
2.75  
560  
0.65  
40  
3.6  
1.1  
µs  
ns  
V
tON - 2  
On-time  
Shutdown threshold  
Threshold hysteresis  
0.35  
mV  
Off Timer  
tOFF  
Minimum Off-time  
280  
ns  
Regulation and Over-Voltage Comparators (FB Pin)  
VREF  
FB regulation threshold  
FB over-voltage threshold  
FB bias current  
SS pin = steady state  
2.440  
2.5  
2.875  
100  
2.550  
V
V
nA  
Thermal Shutdown  
TSD Thermal shutdown temperature  
Thermal shutdown hysteresis  
175  
20  
°C  
°C  
4
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Typical Performance Characteristics  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
F
= 100 kHz  
S
F
S
= 730 kHz  
Load Current = 500 mA  
6.5  
7.0  
7.5  
8.0  
(V)  
8.5  
9.0  
V
IN  
Figure 1. VCC vs VIN  
Figure 2. ON-Time vs VIN and RON  
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Functional Description  
The LM34910C Step Down Switching Regulator features all the functions needed to implement a low cost,  
efficient buck bias power converter capable of supplying 1.25A to the load. This high voltage regulator contains a  
55V N-Channel buck switch, is easy to implement, and is available in the thermally enhanced WSON-10  
package. The regulator’s operation is based on a hysteretic control scheme, and uses an on-time control which  
varies inversely with VIN. This feature allows the operating frequency to remain relatively constant with load and  
input voltage variations. The hysteretic control requires no loop compensation resulting in very fast load transient  
response. The valley current limit detection circuit, internally set at 1.25A, holds the buck switch off until the high  
current level subsides. The functional block diagram is shown in Typical Application Circuit and Block Diagram.  
The LM34910C can be applied in numerous applications to efficiently regulate down higher voltages. Additional  
features include: Thermal shutdown, VCC under-voltage lockout, gate drive under-voltage lockout, and maximum  
duty cycle limiter.  
Hysteretic Control Circuit Overview  
The LM34910C buck DC-DC regulator employs a control scheme based on a comparator and a one-shot on-  
timer, with the output voltage feedback (FB) compared to an internal reference (2.5V). If the FB voltage is below  
the reference the buck switch is turned on for a time period determined by the input voltage and a programming  
resistor (RON). Following the on-time the switch remains off for a minimum of 280 ns, and until the FB voltage  
falls below the reference. The buck switch then turns on for another on-time period. Typically, during start-up, or  
when the load current increases suddenly, the off-times are at the minimum of 280 ns. Once regulation is  
established, the off-times are longer.  
When in regulation, the LM34910C operates in continuous conduction mode at heavy load currents and  
discontinuous conduction mode at light load currents. In continuous conduction mode current always flows  
through the inductor, never reaching zero during the off-time. In this mode the operating frequency remains  
relatively constant with load and line variations. The minimum load current for continuous conduction mode is  
one-half the inductor’s ripple current amplitude. The operating frequency is approximately:  
VOUT  
FS =  
1.3 x 10-10 x RON  
(1)  
The buck switch duty cycle is equal to :  
tON  
VOUT  
VIN  
=
DC =  
tON + tOFF  
(2)  
In discontinuous conduction mode current through the inductor ramps up from zero to a peak during the on-time,  
then ramps back to zero before the end of the off-time. The next on-time period starts when the voltage at FB  
falls below the reference - until then the inductor current remains zero, and the load current is supplied by the  
output capacitor (C2). In this mode the operating frequency is lower than in continuous conduction mode, and  
varies with load current. Conversion efficiency is maintained at light loads since the switching losses reduce with  
the reduction in load and frequency. The approximate discontinuous operating frequency can be calculated as  
follows:  
VOUT2 x L1 x 1.18 x 1020  
FS =  
2
RL x (RON  
)
where  
RL = the load resistance  
(3)  
The output voltage is set by two external resistors (R1, R2). The regulated output voltage is calculated as  
follows:  
VOUT = 2.5 x (R1 + R2) / R2  
(4)  
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Output voltage regulation is based on ripple voltage at the feedback input, requiring a minimum amount of ESR  
for the output capacitor C2. The LM34910C requires a minimum of 25 mV of ripple voltage at the FB pin. In  
cases where the capacitor’s ESR is insufficient additional series resistance may be required (R3 in Typical  
Application Circuit and Block Diagram).  
For applications where lower output voltage ripple is required the output can be taken directly from a low ESR  
output capacitor as shown in Figure 3. However, R3 slightly degrades the load regulation.  
L1  
SW  
LM34910C  
R1  
R2  
R3  
FB  
V
OUT2  
C2  
Figure 3. Low Ripple Output Configuration  
Start-up Regulator, VCC  
The start-up regulator is integral to the LM34910C. The input pin (VIN) can be connected directly to line voltage  
up to 50V, with transient capability to 55V. The VCC output regulates at 7.0V, and is current limited to 9 mA. Upon  
power up, the regulator sources current into the external capacitor at VCC (C3). When the voltage on the VCC pin  
reaches the under-voltage lockout threshold of 5.8V, the buck switch is enabled and the Softstart pin is released  
to allow the Softstart capacitor (C6) to charge up.  
The minimum input voltage is determined by the regulator’s dropout voltage, the VCC UVLO falling threshold  
(5.7V), and the frequency. When VCC falls below the falling threshold the VCC UVLO activates to shut off the  
output. If VCC is externally loaded, the minimum input voltage increases since the output impedance at VCC is  
140. See Figure 1.  
To reduce power dissipation in the start-up regulator, an auxiliary voltage can be diode connected to the VCC pin.  
Setting the auxiliary voltage to between 8V and 14V shuts off the internal regulator, reducing internal power  
dissipation. The sum of the auxiliary voltage and the input voltage (VCC + VIN) cannot exceed 70V. Internally, a  
diode connects VCC to VIN. See Figure 4.  
V
CC  
C3  
BST  
SW  
C4  
L1  
D2  
LM34910C  
V
OUT1  
D1  
R3  
R1  
R2  
I
SEN  
V
OUT2  
S
GND  
C2  
FB  
Figure 4. Self Biased Configuration  
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Regulation Comparator  
The feedback voltage at FB is compared to the voltage at the Softstart pin (2.5V). In normal operation (the output  
voltage is regulated), an on-time period is initiated when the voltage at FB falls below 2.5V. The buck switch  
stays on for the on-time, causing the FB voltage to rise above 2.5V. After the on-time period, the buck switch  
stays off until the FB voltage falls below 2.5V. Bias current at the FB pin is nominally 100 nA.  
Over-Voltage Comparator  
The voltage at FB is compared to an internal 2.875V reference. If the voltage at FB rises above 2.875V the on-  
time pulse is immediately terminated. This condition can occur if the input voltage or the output load changes  
suddenly, or if the inductor (L1) saturates. The buck switch remains off until the voltage at FB falls below 2.5V.  
ON-Time Timer, and Shutdown  
The on-time for the LM34910C is determined by the RON resistor and the input voltage (VIN), and is calculated  
from:  
1.3 x 10-10 x RON  
tON  
=
VIN  
(5)  
See Figure 2. The inverse relationship with VIN results in a nearly constant frequency as VIN is varied. RON should  
be selected for a minimum on-time (at maximum VIN) greater than 200 ns. This requirement limits the maximum  
frequency for each application, depending on VIN and VOUT, calculated from the following:  
VOUT  
FMAX  
=
VINMAX x 200 ns  
(6)  
The LM34910C can be remotely shut down by taking the RON/SD pin below 0.65V. See Figure 5. In this mode  
the SS pin is internally grounded, the on-timer is disabled, and bias currents are reduced. Releasing the RON/SD  
pin allows normal operation to resume. The voltage at the RON/SD pin is between 1.5V and 3.0V, depending on  
VIN and the RON resistor.  
V
IN  
Input  
Voltage  
LM34910C  
R
ON  
R /SD  
ON  
STOP  
RUN  
Figure 5. Shutdown Implementation  
Current Limit  
Current limit detection occurs during the off-time by monitoring the recirculating current through the free-wheeling  
diode (D1). Referring to Typical Application Circuit and Block Diagram, when the buck switch is turned off the  
inductor current flows through the load, into SGND, through the sense resistor, out of ISEN and through D1. If that  
current exceeds 1.25A the current limit comparator output switches to delay the start of the next on-time period if  
the voltage at FB is below 2.5V. The next on-time starts when the current out of ISEN is below 1.25A and the  
voltage at FB is below 2.5V. If the overload condition persists causing the inductor current to exceed 1.25A  
during each on-time, that is detected at the beginning of each off-time. The operating frequency may be lower  
due to longer-than-normal off-times.  
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Figure 6 illustrates the inductor current waveform. During normal operation the load current is Io, the average of  
the ripple waveform. When the load resistance decreases the current ratchets up until the lower peak reaches  
1.25A. During the Current Limited portion of Figure 6, the current ramps down to 1.25A during each off-time,  
initiating the next on-time (assuming the voltage at FB is <2.5V). During each on-time the current ramps up an  
amount equal to:  
ΔI = (VIN - VOUT) x tON / L1  
(7)  
During this time the LM34910C is in a constant current mode, with an average load current (IOCL) equal to 1.25A  
+ ΔI/2.  
I
PK  
DI  
I
OCL  
1.25A  
I
O
Load Current  
Increases  
Normal Operation  
Current Limited  
Figure 6. Inductor Current - Current Limit Operation  
The current limit threshold can be increased by connecting an external resistor between SGND and ISEN. The  
external resistor will typically be less than 1. The peak current out of SW and ISEN must not exceed 3.5A. The  
average current out of SW must be less than 3A, and the average current out of ISEN must be less than 2A.  
Therefore IPK in Figure 6 must not exceed 3.5A, and IOCL must not exceed 2A.  
N - Channel Buck Switch and Driver  
The LM34910C integrates an N-Channel buck switch and associated floating high voltage gate driver. The peak  
current allowed through the buck switch is 3.5A, and the maximum allowed average current is 3A. The gate  
driver circuit works in conjunction with an external bootstrap capacitor and an internal high voltage diode. A 0.022  
µF capacitor (C4) connected between BST and SW provides the voltage to the driver during the on-time. During  
each off-time, the SW pin is at approximately -1V, and C4 charges from VCC through the internal diode. The  
minimum off-time of 280 ns ensures a minimum time each cycle to recharge the bootstrap capacitor.  
Softstart  
The softstart feature allows the converter to gradually reach a steady state operating point, thereby reducing  
start-up stresses and current surges. Upon turn-on, after VCC reaches the under-voltage threshold, an internal  
11.5 µA current source charges up the external capacitor at the SS pin to 2.5V. The ramping voltage at SS (and  
the non-inverting input of the regulation comparator) ramps up the output voltage in a controlled manner.  
An internal switch grounds the SS pin if VCC is below the under-voltage lockout threshold, if a thermal shutdown  
occurs, or if the RON/SD pin is grounded.  
Thermal Shutdown  
The LM34910C should be operated so the junction temperature does not exceed 125°C. If the junction  
temperature increases, an internal Thermal Shutdown circuit, which activates (typically) at 175°C, takes the  
controller to a low power reset state by disabling the buck switch and the on-timer, and grounding the Softstart  
pin. This feature helps prevent catastrophic failures from accidental device overheating. When the junction  
temperature reduces below 155°C (typical hysteresis = 20°C), the Softstart pin is released and normal operation  
resumes.  
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APPLICATIONS INFORMATION  
EXTERNAL COMPONENTS  
The following guidelines can be used to select the external components.  
R1 and R2: The ratio of these resistors is calculated from:  
R1/R2 = (VOUT/2.5V) - 1  
(8)  
R1 and R2 should be chosen from standard value resistors in the range of 1.0 k- 10 kwhich satisfy the  
above ratio.  
RON: The minimum value for RON is calculated from:  
200 ns x VINMAX  
RON  
í
1.3 x 10-10  
(9)  
Equation 1 can be used to select RON if a specific frequency is desired as long as the above limitation is met.  
L1: The main parameter affected by the inductor is the output current ripple amplitude (IOR). The limits for IOR  
must be determined at both the minimum and maximum nominal load currents.  
a) If the maximum load current is less than the current limit threshold (1.25A), the minimum load current is used  
to determine the maximum allowable ripple. To maintain continuous conduction mode the lower peak should not  
reach 0 mA. For this case, the maximum ripple current is:  
IOR(MAX1) = 2 x IO(min)  
(10)  
The ripple calculated in Equation 6 is then used in the following equation:  
VOUT x (VIN - VOUT  
IOR x FS x VIN  
)
L1 =  
where  
VIN is the maximum input voltage  
Fs is determined from Equation 1  
(11)  
This provides a minimum value for L1. The next larger standard value should be used, and L1 should be rated  
for the IPK current level.  
b) If the maximum load current is greater than the current limit threshold (1.25A), the LM34910C ensures the  
lower peak reaches 1.25A each cycle, requiring that IOR be at least twice the difference. The upper peak,  
however, must not exceed 3.5A. For this case, the ripple limits are:  
IOR(MAX2) = 2 x (3.5A - IO(max)  
)
(12)  
and  
IOR(MIN1) = 2 x (IO(max) - 1.25A)  
(13)  
The lesser of Equation 12 and Equation 13 is then used in Equation 11. If IOR(MAX2) is used, the maximum VIN is  
used in Equation 11. The next larger value should then be used for L1. If IOR(MIN1) is used, the minimum VIN is  
used in Equation 11. The next smaller value should then be used for L1. L1 must be rated for the peak value of  
the current waveform (IPK in Figure 6).  
C3: The capacitor on the VCC output provides not only noise filtering and stability, but also prevents false  
triggering of the VCC UVLO at the buck switch on/off transitions. For this reason, C3 should be no smaller than  
0.1 µF, and should be a good quality, low ESR, ceramic capacitor.  
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C2, and R3: Since the LM34910C requires a minimum of 25 mVp-p of ripple at the FB pin for proper operation,  
the required ripple at VOUT1 is increased by R1 and R2. This necessary ripple is created by the inductor ripple  
current acting on C2’s ESR + R3. The minimum ripple current is calculated using Equation 11, rearranged to  
solve for IOR at minimum VIN. The minimum ESR for C2 is then equal to:  
25 mV x (R1 + R2)  
ESR(min)  
=
R2 x IOR(min)  
(14)  
If the capacitor used for C2 does not have sufficient ESR, R3 is added in series as shown in Typical Application  
Circuit and Block Diagram. Generally R3 is less than 1. C2 should generally be no smaller than 3.3 µF,  
although that is dependent on the frequency and the allowable ripple amplitude at VOUT1. Experimentation is  
usually necessary to determine the minimum value for C2, as the nature of the load may require a larger value. A  
load which creates significant transients requires a larger value for C2 than a non-varying load.  
D1: The important parameters are reverse recovery time and forward voltage. The reverse recovery time  
determines how long the reverse current surge lasts each time the buck switch is turned on. The forward voltage  
drop is significant in the event the output is short-circuited as it is mainly this diode’s voltage (plus the voltage  
across the current limit sense resistor) which forces the inductor current to decrease during the off-time. For this  
reason, a higher voltage is better, although that affects efficiency. A reverse recovery time of 30 ns, and a  
forward voltage drop of 0.75V are preferred. The reverse leakage specification is important as that can  
significantly affect efficiency. D1’s reverse voltage rating must be at least as great as the maximum VIN, and its  
current rating must equal or exceed IPK Figure 6.  
C1 and C5: C1’s purpose is to supply most of the switch current during the on-time, and limit the voltage ripple  
at VIN, on the assumption that the voltage source feeding VIN has an output impedance greater than zero. If the  
source’s dynamic impedance is high (effectively a current source), it supplies the average input current, but not  
the ripple current.  
At maximum load current, when the buck switch turns on, the current into VIN suddenly increases to the lower  
peak of the inductor’s ripple current, ramps up to the peak value, then drop to zero at turn-off. The average  
current during the on-time is the load current. For a worst case calculation, C1 must supply this average load  
current during the maximum on-time. C1 is calculated from:  
IO x tON  
C1 =  
DV  
where  
Io is the load current  
tON is the maximum on-time  
ΔV is the allowable ripple voltage at VIN  
(15)  
C5’s purpose is to help avoid transients and ringing due to long lead inductance at VIN. A low ESR, 0.1 µF  
ceramic chip capacitor is recommended, located close to the LM34910C .  
C4: The recommended value for C4 is 0.022 µF. A high quality ceramic capacitor with low ESR is recommended  
as C4 supplies a surge current to charge the buck switch gate at turn-on. A low ESR also helps ensure a  
complete recharge during each off-time.  
C6: The capacitor at the SS pin determines the softstart time, i.e. the time for the reference voltage at the  
regulation comparator, and the output voltage, to reach their final value. The time is determined from the  
following:  
C6 x 2.5V  
tSS  
=
11.5 mA  
(16)  
Copyright © 2007–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Links: LM34910C  
LM34910C  
SNVS517B MAY 2007REVISED MARCH 2013  
www.ti.com  
PC BOARD LAYOUT  
The LM34910C regulation, over-voltage, and current limit comparators are very fast, and respond to short  
duration noise pulses. Layout considerations are therefore critical for optimum performance. The layout must be  
as neat and compact as possible, and all of the components must be as close as possible to their associated  
pins. The current loop formed by D1, L1, C2 and the SGND and ISEN pins should be as small as possible. The  
ground connection from C2 to C1 should be as short and direct as possible.  
If it is expected that the internal dissipation of the LM34910C will produce excessive junction temperatures during  
normal operation, good use of the PC board’s ground plane can help considerably to dissipate heat. The  
exposed pad on the bottom of the IC package can be soldered to a ground plane, and that plane should extend  
out from beneath the IC, and be connected to ground plane on the board’s other side with several vias, to help  
dissipate the heat. The exposed pad is internally connected to the IC substrate. Additionally the use of wide PC  
board traces, where possible, can help conduct heat away from the IC. Judicious positioning of the PC board  
within the end product, along with the use of any available air flow (forced or natural convection) can help reduce  
the junction temperatures.  
12  
Submit Documentation Feedback  
Copyright © 2007–2013, Texas Instruments Incorporated  
Product Folder Links: LM34910C  
 
LM34910C  
www.ti.com  
SNVS517B MAY 2007REVISED MARCH 2013  
REVISION HISTORY  
Changes from Revision A (March 2013) to Revision B  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 12  
Copyright © 2007–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Links: LM34910C  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Feb-2014  
PACKAGING INFORMATION  
Orderable Device  
LM34910CSD/NOPB  
LM34910CSDE/NOPB  
LM34910CSDX/NOPB  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
WSON  
WSON  
WSON  
DPR  
10  
10  
10  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
L34910C  
ACTIVE  
ACTIVE  
DPR  
DPR  
250  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
L34910C  
L34910C  
4500  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Feb-2014  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM34910CSD/NOPB  
LM34910CSDE/NOPB  
LM34910CSDX/NOPB  
WSON  
WSON  
WSON  
DPR  
DPR  
DPR  
10  
10  
10  
1000  
250  
178.0  
178.0  
330.0  
12.4  
12.4  
12.4  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
1.3  
1.3  
1.3  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
4500  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM34910CSD/NOPB  
LM34910CSDE/NOPB  
LM34910CSDX/NOPB  
WSON  
WSON  
WSON  
DPR  
DPR  
DPR  
10  
10  
10  
1000  
250  
210.0  
210.0  
367.0  
185.0  
185.0  
367.0  
35.0  
35.0  
35.0  
4500  
Pack Materials-Page 2  
MECHANICAL DATA  
DPR0010A  
SDC10A (Rev A)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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