LM34DMX/NOPB [TI]
带华氏刻度的 ±1°F 5V 至 30V 模拟输出温度传感器 | D | 8 | 0 to 100;
| 型号： | LM34DMX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 带华氏刻度的 ±1°F 5V 至 30V 模拟输出温度传感器 | D | 8 | 0 to 100 温度传感 输出元件 传感器 换能器 温度传感器 |
| 文件： | 总33页 (文件大小：966K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM34
SNIS161D –MARCH 2000–REVISED JANUARY 2016
LM34 Precision Fahrenheit Temperature Sensors
1 Features
3 Description
The LM34 series devices are precision integrated-
1
•
•
•
•
•
•
•
•
•
•
•
Calibrated Directly in Degrees Fahrenheit
Linear 10.0 mV/°F Scale Factor
circuit temperature sensors, whose output voltage is
linearly proportional to the Fahrenheit temperature.
The LM34 device has an advantage over linear
temperature sensors calibrated in degrees Kelvin,
because the user is not required to subtract a large
constant voltage from its output to obtain convenient
Fahrenheit scaling. The LM34 device does not
require any external calibration or trimming to provide
typical accuracies of ±1/2°F at room temperature and
±1-1⁄2°F over a full −50°F to 300°F temperature
range. Lower cost is assured by trimming and
calibration at the wafer level. The low output
impedance, linear output, and precise inherent
calibration of the LM34 device makes interfacing to
readout or control circuitry especially easy. It can be
used with single power supplies or with plus and
minus supplies. Because the LM34 device draws only
75 µA from its supply, the device has very low self-
heating, less than 0.2°F in still air.
1.0°F Accuracy Assured (at 77°F)
Rated for Full −50° to 300°F Range
Suitable for Remote Applications
Low Cost Due to Wafer-Level Trimming
Operates From 5 to 30 Volts
Less Than 90-μA Current Drain
Low Self-Heating, 0.18°F in Still Air
Nonlinearity Only ±0.5°F Typical
Low-Impedance Output, 0.4 Ω for 1-mA Load
2 Applications
•
•
•
•
Power Supplies
Battery Management
HVAC
The LM34 device is rated to operate over a −50°F to
300°F temperature range, while the LM34C is rated
for a −40°F to 230°F range (0°F with improved
accuracy). The LM34 devices are series is available
packaged in hermetic TO-46 transistor packages;
while the LM34C, LM34CA, and LM34D are available
in the plastic TO-92 transistor package. The LM34D
device is available in an 8-lead, surface-mount, small-
outline package. The LM34 device is a complement
to the LM35 device (Centigrade) temperature sensor.
Appliances
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
4.90 mm × 3.91 mm
4.30 mm × 4.30 mm
4.699 mm × 4.699 mm
SOIC (8)
LM34
TO-92 (3)
TO-46 (3)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Basic Fahrenheit Temperature Sensor (5°F to
300°F)
Full-Range Fahrenheit Temperature Sensor
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM34
SNIS161D –MARCH 2000–REVISED JANUARY 2016
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Table of Contents
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 12
Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application .................................................. 13
8.3 System Examples ................................................... 14
Power Supply Recommendations...................... 16
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics: LM34A and LM34CA ....... 5
8
9
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 17
11 Device and Documentation Support ................. 18
11.1 Trademarks........................................................... 18
11.2 Electrostatic Discharge Caution............................ 18
11.3 Glossary................................................................ 18
6.6 Electrical Characteristics: LM34, LM34C, and
LM34D........................................................................ 7
6.7 Typical Characteristics.............................................. 9
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
Changes from Revision C (January 2015) to Revision D
Page
•
Changed NDV Package (TO-46) pinout from Top View to Bottom View ............................................................................... 3
Changes from Revision B (November 2000) to Revision C
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
2
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5 Pin Configuration and Functions
NDV Package
3-PIn TO-46
(Bottom View)
+ë{ ëhÜÇ
t
Db5
Case is connected to negative pin (GND)
D Package
8-PIn SO8
(Top View)
1
8
7
ëhÜÇ
b./.
+ë{
b./.
2
3
4
b./.
b./.
b./.
6
5
Db5
N.C. = No connection
LP Package
3-Pin TO-92
(Bottom View)
+ë{ ëhÜÇ Db5
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
+VS
TO46/NDV TO92/LP
SO8/D
—
—
—
—
—
—
8
1
4
2
3
5
6
7
POWER Positive power supply pin
VOUT
GND
O
Temperature Sensor Analog Output
Device ground pin, connect to power supply negative terminal
GND
N.C.
—
—
—
No Connection
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6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN
35
6
MAX
–0.2
–1
UNIT
V
Supply voltage
Output voltage
Output current
TO-46 Package
V
10
mA
−76
−76
−65
356
300
150
Storage temperature, Tstg
TO-92 Package
SO-8 Package
°F
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
300
230
212
30
UNIT
LM34, LM34A
LM34C, LM34CA
LM34D
–50
–40
32
Specified operating temperature range
(TMIN ≤ TA ≤ TMAX
°F
V
)
Supply Voltage Range (+VS)
4
6.4 Thermal Information
LM34
THERMAL METRIC(1)
NDV (TO-46)
3 PINS
720
LP (TO-92)
3 PINS
324
D (SO8)
8 PINS
400
UNIT
RθJA
RθJC
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
°F/W
43
—
—
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics: LM34A and LM34CA
Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the
LM34C and LM34CA; and 32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
LM34A
LM34CA
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP MAX
Tested Limit(2)
Design Limit(3)
–1
1
–1
1
TA = 77°F
T A = 0°F
TA = TMAX
TA = TMIN
°F
±0.4
±0.6
±0.4
±0.6
±0.8
±0.8
±0.3
10
Tested Limit
Design Limit
–2
–2
2
2
°F
°F
Accuracy(1)
Tested Limit
Design Limit
–2
–2
2
2
±0.8
Tested Limit
Design Limit
–3
3
°F
±0.8
Tested Limit
Design Limit
(4)
Nonlinearity
–0.7
9.9
0.7
–0.6
0.6
°F
TA = 77°F
TA = 77°F
±0.35
+10
Tested Limit
Design Limit
10.1
Sensor gain (Average
Slope)
+9.9
–1
10.1
1
mV/°F
mV/mA
mV/mA
mV/V
mV/V
Tested Limit
Design Limit
–1
1
TA = 77°F
0 ≤ IL ≤ 1 mA
±0.4
±0.4
±0.5
±0.01
±0.02
Load regulation(5)
Tested Limit
Design Limit
0 ≤ IL ≤ 1 mA
–3
3
–3
3
±0.5
Tested Limit
Design Limit
–0.05
0.05 –0.05
0.05
TA = 77°F
5 V ≤ VS ≤ 30 V
±0.01
±0.02
Line regulation(5)
Tested Limit
Design Limit
5 V ≤ VS ≤ 30 V
–0.1
0.1
–0.1
0.1
(1) Accuracy is defined as the error between the output voltage and 10 mV/°F times the device’s case temperature at specified conditions of
voltage, current, and temperature (expressed in °F).
(2) Tested limits are specified and 100% tested in production.
(3) Design limits are specified (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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Electrical Characteristics: LM34A and LM34CA (continued)
Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the
LM34C and LM34CA; and 32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
LM34A
LM34CA
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP MAX
Tested Limit
Design Limit
90
90
VS = 5 V, TA = 77°F
µA
75
131
76
75
Tested Limit
Design Limit
VS = 5 V
160
92
139
92
µA
µA
116
76
Quiescent current(6)
Tested Limit
Design Limit
VS = 30 V, TA = 77°F
Tested Limit
Design Limit
VS = 30 V
163
2
142
2
µA
132
0.5
1
117
0.5
1
Tested Limit
4 V ≤ VS ≤ 30 V, TA = 77°F
Design Limit
µA
Change of quiescent
current(5)
Tested Limit
Design Limit
5 V ≤ VS ≤ 30 V
3
0.5
5
3
0.5
5
µA
Tested Limit
Design Limit
Temperature coefficient
of quiescent current
µA/°F
0.3
0.3
Tested Limit
Design Limit
In circuit of Basic Fahrenheit
Minimum temperature for Temperature Sensor (5°F to
°F
°F
rated accuracy
300°F), IL = 0
TA = 77°F
3
3
Long-term stability
TJ = TMAX for 1000 hours
±0.16
±0.16
(6) Quiescent current is defined in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
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SNIS161D –MARCH 2000–REVISED JANUARY 2016
6.6 Electrical Characteristics: LM34, LM34C, and LM34D
Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the
LM34C and LM34CA; and +32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
LM34
LM34C, LM34D
PARAMETER
CONDITIONS
UNIT
MIN
TYP MAX
MIN TYP MAX
Tested Limit(2)
Design Limit(3)
–2
2
–2
2
TA = 77°F
TA = 0°F
°F
±0.8
±1
±0.8
±1
Tested Limit
Design Limit
–3
–3
3
3
°F
°F
Accuracy, LM34,
LM34C(1)
Tested Limit
Design Limit
–3
–3
3
3
TA = TMAX
TA = TMIN
TA = 77°F
TA = TMAX
TA = TMIN
±1.6
±1.6
±1.6
±1.6
±1.2
±1.8
±1.8
±0.4
10
Tested Limit
Design Limit
–4
–3
4
3
°F
Tested Limit
Design Limit
°F
Tested Limit
Design Limit
Accuracy, LM34D(1)
–4
–4
–1
4
4
1
°F
Tested Limit
Design Limit
°F
Tested Limit
Design Limit
(4)
Nonlinearity
–1.0
9.8
1
°F
±0.6
10
Tested Limit
Design Limit
10.2
Sensor gain (Average
Slope)
9.8
10.2
2.5
mV/°F
mV/mA
mV/mA
mV/V
mV/V
TA = 77°F
0 ≤ IL ≤ 1 mA
Tested Limit
Design Limit
–2.5
2.5
–2.5
±0.4
±0.5
±0.01
±0.02
±0.4
±0.5
±0.01
±0.02
Load regulation(5)
Tested Limit
Design Limit
TMIN ≤ TA ≤ 150°F
–6.0
–0.1
6
–6
6
0 ≤ IL ≤ 1 mA
Tested Limit
Design Limit
0.1
–0.1
0.1
TA = 77°F,
5 V ≤ VS ≤ 30 V
Line regulation(5)
Tested Limit
Design Limit
5 V ≤ VS ≤ 30 V
–0.2
0.2
–0.2
0.2
(1) Accuracy is defined as the error between the output voltage and 10 mV/˚F times the device’s case temperature at specified conditions of
voltage, current, and temperature (expressed in ˚F).
(2) Tested limits are specified and 100% tested in production.
(3) Design limits are specified (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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Electrical Characteristics: LM34, LM34C, and LM34D (continued)
Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the
LM34C and LM34CA; and +32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
LM34
LM34C, LM34D
PARAMETER
CONDITIONS
UNIT
MIN
TYP MAX
MIN TYP MAX
Tested Limit
Design Limit
100
100
VS = 5 V, TA = 77°F
µA
75
131
76
75
116
76
Tested Limit
Design Limit
VS = 5 V
176
103
154
103
µA
µA
Quiescent current(6)
Tested Limit
Design Limit
VS = 30 V, TA = 77°F
Tested Limit
Design Limit
VS = 30 V
181
3
159
3
µA
132
0.5
1
117
0.5
1
Tested Limit
Design Limit
4 V ≤ VS ≤ 30 V,
TA = +77°F
µA
Change of quiescent
current(5)
Tested Limit
Design Limit
5 V ≤ VS ≤ 30 V
5
0.7
5.0
5
0.7
5
µA
Tested Limit
Design Limit
Temperature coefficient
of quiescent current
µA/°F
0.3
0.3
Tested Limit
Design Limit
In circuit of Basic
Fahrenheit
Temperature Sensor
(5°F to 300°F), IL = 0
Minimum temperature
for rated accuracy
°F
°F
3
3
Long-term stability
TJ = TMAX for 1000 hours
±0.16
±0.16
(6) Quiescent current is defined in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
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6.7 Typical Characteristics
Figure 2. Thermal Time Constant
Figure 1. Thermal Resistance Junction to Air
Figure 4. Thermal Response in Stirred Oil Bath
Figure 3. Thermal Response in Still Air
Figure 6. Quiescent Current vs Temperature (in Circuit of
Figure 5. Minimum Supply Voltage vs Temperature
Basic Fahrenheit Temperature Sensor (5°F to 300°F))
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Typical Characteristics (continued)
Figure 7. Quiescent Current vs Temperature
(in Circuit of Full-Range Fahrenheit Temperature Sensor;
−VS = −5V, R1 = 100k)
Figure 8. Accuracy vs Temperature (Specified)
Figure 10. Noise Voltage
Figure 9. Accuracy vs Temperature (Specified)
Figure 11. Start-Up Response
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SNIS161D –MARCH 2000–REVISED JANUARY 2016
7 Detailed Description
7.1 Overview
The LM34 series devices are precision integrated-circuit temperature sensors, whose output voltage is linearly
proportional to the Fahrenheit temperature. The LM34 device has an advantage over linear temperature sensors
calibrated in degrees Kelvin, because the user is not required to subtract a large constant voltage from its output
to obtain convenient Fahrenheit scaling. The LM34 device does not require any external calibration or trimming
to provide typical accuracies of ±1/2°F at room temperature and ±1-1⁄2°F over a full −50°F to 300°F temperature
range. Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear
output, and precise inherent calibration of the LM34 device makes interfacing to readout or control circuitry
especially easy. It can be used with single power supplies or with plus and minus supplies. Because the LM34
device draws only 75 µA from its supply, the device has very low self-heating, less than 0.2°F in still air.
The temperature sensing element is comprised of a simple base emitter junction that is forward biased by a
current source. The temperature sensing element is buffered by an amplifier and provided to the OUT pin. The
amplifier has a simple class-A output stage thus providing a low impedance output that can source 16 μA and
sink 1 μA.
The temperature sensing element is comprised of a delta-VBE architecture. The temperature sensing element is
then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage with
typical 0.5-Ω output impedance as shown in the Functional Block Diagram. Therefore, the LM34 device can only
source current and the sinking capability of the device is limited to 1 µA.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Capacitive Drive Capability
Like most micropower circuits, the LM34 device has a limited ability to drive heavy capacitive loads. The LM34
device, by itself, is able to drive 50 pF without special precautions. If heavier loads are anticipated, it is easy to
isolate or decouple the load with a resistor; see Figure 12. You can improve the tolerance of capacitance with a
series R-C damper from output to ground; see Figure 13. When the LM34 is applied with a 499-Ω load resistor
(as shown Figure 18 and Figure 19), the device is relatively immune to wiring capacitance because the
capacitance forms a bypass from ground to input, not on the output. However, as with any linear circuit
connected to wires in a hostile environment, its performance can be affected adversely by intense
electromagnetic sources such as relays, radio transmitters, motors with arcing brushes, transients of the SCR,
and so on, as the wiring of the device can act as a receiving antenna and the internal junctions can act as
rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper, such
as 75 Ω in series with 0.2 μF or 1 μF from output to ground, are often useful. See Figure 23, Figure 24 and
Figure 26 for more details.
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Feature Description (continued)
Figure 12. LM34 With Decoupling from Capacitive
Load
Figure 13. LM34 With R-C Damper
7.3.2 LM34 Transfer Function
The accuracy specifications of the LM34 devices are given with respect to a simple linear transfer function shown
in Equation 1:
VOUT = 10 mV/°F × T °F
where
•
•
VOUT is the LM34 output voltage
T is the temperature in °F
(1)
7.4 Device Functional Modes
The only functional mode of the LM34 device is that it has an analog output directly proportional to temperature.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The features of the LM34 device make it suitable for many general temperature sensing applications. Multiple
package options expand on flexibility of the device.
8.2 Typical Application
8.2.1 Basic Fahrenheit Temperature Sensor Application
Figure 14. Basic Fahrenheit Temperature Sensor (5°F to 300°F)
8.2.1.1 Design Requirements
Table 1. Key Requirements
PARAMETER
Accuracy at 77°F
VALUE
±2°F
Accuracy from –50°F to 300°F
Temperature Slope
±3°F
10 mV/°F
8.2.1.2 Detailed Design Procedure
Because the LM34 is a simple temperature sensor that provides an analog output, design requirements related
to layout are more important than electrical requirements (see Layout).
8.2.1.3 Application Curve
Figure 15. Temperature Error
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8.3 System Examples
Figure 16. Full-Range Fahrenheit Temperature
Sensor
Figure 17. Full Range Farenheit Sensor (–50 °F to
300 °F)
VOUT = 10 mV/°F (TA+3°F) from 3°F to 100°F
Figure 18. Two-Wire Remote Temperature Sensor
(Grounded Sensor)
Figure 19. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
Figure 20. 4- to -20 mA Current Source (0°F to
100°F)
Figure 21. Fahrenheit Thermometer (Analog Meter)
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Product Folder Links: LM34
LM34
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SNIS161D –MARCH 2000–REVISED JANUARY 2016
System Examples (continued)
Figure 22. Expanded Scale Thermometer
(50°F to 80°F, for Example Shown)
Figure 23. Temperature-to-Digital Converter
(Serial Output, 128°F Full Scale)
∗
= 1% or 2% film resistor
— Trim
— Trim
— Trim
R
R
R
for
for
for
V
=
=
=
3.525V
2.725V
0.085V
B
C
A
B
V
C
V
+ 40 mV/°F x T
AMBIENT
A
=
— Example,
V
3.285V at 80°F
A
Figure 24. LM34 With Voltage-to-Frequency
Converter and Isolated Output
Figure 25. Bar-Graph Temperature Display
(Dot Mode)
(3°F to 300°F; 30 Hz to 3000 Hz)
Figure 26. Temperature-to-Digital Converter
(Parallel TRI-STATE Outputs for Standard Data Bus
to µP Interface, 128°F Full Scale)
Figure 27. Temperature Controller
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9 Power Supply Recommendations
It may be necessary to add a bypass filter capacitor in noisy environments, as shown in as shown in Figure 13.
10 Layout
10.1 Layout Guidelines
The LM34 device can be easily applied in the same way as other integrated-circuit temperature sensors. The
device can be glued or cemented to a surface and its temperature will be within about 0.02°F of the surface
temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if
the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM34
die would be at an intermediate temperature between the surface temperature and the air temperature. This is
especially true for the TO-92 plastic package, where the copper leads are the principal thermal path to carry heat
into the device, so its temperature might be closer to the air temperature than to the surface temperature.
To minimize this problem, be sure that the wiring to the LM34, as it leaves the device, is held at the same
temperature as the surface of interest. The easiest way to do this is to cover up these wires with a bead of
epoxy, which will insure that the leads and wires are all at the same temperature as the surface, and that the die
temperature of the LM34 device will not be affected by the air temperature.
The TO-46 metal package can be soldered to a metal surface or pipe without damage. In the case where
soldering is used, the V− terminal of the circuit will be grounded to that metal. Alternatively, the LM34 device can
be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole
in a tank. As with any IC, the LM34 and accompanying wiring and circuits must be kept insulated and dry, to
avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where
condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or
dips are often used to insure that moisture cannot corrode the LM34 or its connections.
These devices are sometimes soldered to a small, light-weight heat fin to decrease the thermal time constant
and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the
sensor to give the steadiest reading despite small deviations in the air temperature.
Table 2. Temperature Rise of LM34 Due to Self-Heating (Thermal Resistance)
TO-46,
SMALL HEAT
Fin(1)
TO-92,
SMALL HEAT
Fin(2)
TO-46
NO HEAT SINK
TO-92,
NO HEAT SINK
SO-8
NO HEAT SINK
SO-8
SMALL HEAT Fin
CONDITIONS
Still air
720°F/W
180°F/W
180°F/W
90°F/W
180°F/W
72°F/W
72°F/W
54°F/W
324°F/W
162°F/W
162°F/W
81°F/W
252°F/W
126°F/W
126°F/W
72°F/W
400°F/W
190°F/W
—
200°F/W
160°F/W
—
Moving air
Still oil
Stirred oil
—
—
(Clamped to metal,
infinite heart sink)
(43°F/W )
—
—
(95°F/W )
(1) Wakefield type 201 or 1-inch disc of 0.020-inch sheet brass, soldered to case, or similar.
(2) TO-92 and SO-8 packages glued and leads soldered to 1-inch square of 1/16 inches printed circuit board with 2 oz copper foil, or
similar.
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LM34
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SNIS161D –MARCH 2000–REVISED JANUARY 2016
10.2 Layout Example
VIA to ground plane
VIA to power plane
VOUT
N.C.
N.C.
GND
+VS
N.C.
N.C.
N.C.
0.01µ F
Figure 28. Layout Example
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11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: LM34
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM34AH
ACTIVE
TO
NDV
3
500
Non-RoHS &
Non-Green
Call TI
Call TI
-45 to 148
( LM34AH, LM34AH)
( LM34AH, LM34AH)
LM34AH/NOPB
LM34CAH
ACTIVE
ACTIVE
TO
TO
NDV
NDV
3
3
500
500
RoHS & Green
Call TI
Call TI
Level-1-NA-UNLIM
Call TI
-45 to 148
-40 to 110
Non-RoHS &
Non-Green
( LM34CAH, LM34CAH
)
LM34CAH/NOPB
LM34CAZ/NOPB
LM34CZ/NOPB
LM34DH
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO
TO-92
TO-92
TO
NDV
LP
3
3
3
3
500
RoHS & Green
Call TI
SN
Level-1-NA-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Call TI
-40 to 110
-40 to 110
-40 to 110
0 to 100
( LM34CAH, LM34CAH
)
1800 RoHS & Green
1800 RoHS & Green
LM34
CAZ
LP
SN
LM34
CZ
NDV
1000
Non-RoHS &
Non-Green
Call TI
( LM34DH, LM34DH)
LM34DH/NOPB
LM34DM
ACTIVE
NRND
TO
NDV
D
3
8
1000 RoHS & Green
Call TI
Call TI
Level-1-NA-UNLIM
0 to 100
0 to 100
( LM34DH, LM34DH)
SOIC
95
95
Non-RoHS
& Green
Level-1-235C-UNLIM
LM34D
M
LM34DM/NOPB
LM34DMX/NOPB
LM34DZ/LFT7
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
TO-92
TO-92
D
D
8
8
3
3
RoHS & Green
SN
SN
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
0 to 100
0 to 100
LM34D
M
2500 RoHS & Green
2000 RoHS & Green
1800 RoHS & Green
LM34D
M
LP
LP
LM34
DZ
LM34DZ/NOPB
0 to 100
LM34
DZ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM34DMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
LM34DMX/NOPB
D
8
2500
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM34DM
LM34DM
D
D
D
SOIC
SOIC
SOIC
8
8
8
95
95
95
495
495
495
8
8
8
4064
4064
4064
3.05
3.05
3.05
LM34DM/NOPB
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
LP0003A
TO-92 - 5.34 mm max height
S
C
A
L
E
1
.
2
0
0
S
C
A
L
E
1
.
2
0
0
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54)
NOTE 3
SEATING
PLANE
2X
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
3X
0.55
0.38
2X
2.6 0.2
3X
0.35
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
STRAIGHT LEAD OPTION
2.67
2.03
3X
4.19
3.17
3
1
2
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A
TO-92 - 5.34 mm max height
TO-92
FULL R
TYP
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X ( 0.85) HOLE
2X
METAL
(1.5)
2X (1.5)
2X
SOLDER MASK
OPENING
2
3
1
(R0.05) TYP
2X (1.07)
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX
ALL AROUND
TYP
( 1.4)
2X ( 1.4)
METAL
3X ( 0.9) HOLE
METAL
2X
2
3
1
SOLDER MASK
OPENING
(R0.05) TYP
(2.6)
SOLDER MASK
OPENING
(5.2)
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A
TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP
0.5 MIN
16.5
15.5
11.0
8.5
9.75
8.50
19.0
17.5
3.7-4.3 TYP
2.9
2.4
6.75
5.95
TYP
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
PACKAGE OUTLINE
NDV0003H
TO-CAN - 2.67 mm max height
S
C
A
L
E
1
.
2
5
0
TO-46
4.95
4.55
0.76 MAX
2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
0.483
0.407
3X
5.32-5.56
2
3
1
45
(
2.54)
1.16
0.92
1.22
0.72
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
www.ti.com
EXAMPLE BOARD LAYOUT
NDV0003H
TO-CAN - 2.67 mm max height
TO-46
(2.54)
0.07 MAX
ALL AROUND
(
1.2)
METAL
3
3X ( 0.7) VIA
SOLDER MASK
OPENING
(1.27)
1
(R0.05) TYP
2X ( 1.2)
METAL
2
0.07 MAX
TYP
2X
SOLDER MASK
OPENING
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
4219876/A 01/2017
www.ti.com
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Copyright © 2022, Texas Instruments Incorporated
相关型号：
LM34DZ/NOPB
Analog Temperature Sensor, ANALOG TEMP SENSOR-VOLTAGE, -.5-3V, ROUND, THROUGH HOLE MOUNT, PLASTIC, TO-92, 3 PIN
NSC
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