LM35CZ/LFT1 [TI]
LM35 Precision Centigrade Temperature Sensors; LM35精密摄氏温度传感器
| 型号： | LM35CZ/LFT1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM35 Precision Centigrade Temperature Sensors |
| 文件： | 总29页 (文件大小：1303K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
LM35 Precision Centigrade Temperature Sensors
1
FEATURES
DESCRIPTION
The LM35 series are precision integrated-circuit
2
•
•
•
•
•
•
•
•
•
•
•
Calibrated Directly in ° Celsius (Centigrade)
Linear + 10 mV/°C Scale Factor
temperature sensors, with an output voltage linearly
proportional to the Centigrade temperature. Thus the
LM35 has an advantage over linear temperature
sensors calibrated in ° Kelvin, as the user is not
required to subtract a large constant voltage from the
output to obtain convenient Centigrade scaling. The
LM35 does not require any external calibration or
trimming to provide typical accuracies of ±¼°C at
room temperature and ±¾°C over a full −55°C to
+150°C temperature range. Low cost is assured by
trimming and calibration at the wafer level. The low
output impedance, linear output, and precise inherent
calibration of the LM35 make interfacing to readout or
control circuitry especially easy. The device is used
with single power supplies, or with plus and minus
supplies. As the LM35 draws only 60 μA from the
supply, it has very low self-heating of less than 0.1°C
in still air. The LM35 is rated to operate over a −55°C
to +150°C temperature range, while the LM35C is
rated for a −40°C to +110°C range (−10° with
improved accuracy). The LM35 series is available
packaged in hermetic TO transistor packages, while
the LM35C, LM35CA, and LM35D are also available
in the plastic TO-92 transistor package. The LM35D
is also available in an 8-lead surface-mount small-
outline package and a plastic TO-220 package.
0.5°C Ensured Accuracy (at +25°C)
Rated for Full −55°C to +150°C Range
Suitable for Remote Applications
Low Cost Due to Wafer-Level Trimming
Operates from 4 to 30 V
Less than 60-μA Current Drain
Low Self-Heating, 0.08°C in Still Air
Nonlinearity Only ±¼°C Typical
Low Impedance Output, 0.1 Ω for 1 mA Load
+VS
+VS
(4 V to 20 V)
LM35
VOUT
R1
OUTPUT
0 mV + 10.0 mV/°C
LM35
tVS
Figure 1. Basic Centigrade Temperature Sensor
(+2°C to +150°C)
Choose R1 = –VS / 50 µA
VOUT = 1500 mV at 150°C
VOUT = 250 mV at 25°C
VOUT = –550 mV at –55°C
Figure 2. Full-Range Centigrade Temperature
Sensor
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM35
SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
METAL CAN PACKAGE
TO (NDV)
SMALL-OUTLINE MOLDED PACKAGE
SOIC-8 (D)
TOP VIEW
+VS VOUT
1
2
8
7
VOUT
N.C.
+VS
t
GND
N.C.
Case is connected to negative pin (GND)
N.C.
N.C.
N.C.
3
4
6
5
GND
N.C. = No connection
PLASTIC PACKAGE
TO-92 (LP)
PLASTIC PACKAGE
TO-220 (NEB)
BOTTOM VIEW
+VS VOUT GND
LM
35DT
+VS
VOUT
Tab is connected to the negative pin
(GND).
NOTE: The LM35DT pinout is different than
the discontinued LM35DP
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ABSOLUTE MAXIMUM RATINGS(1)(2)
MIN
–0.2
–1
MAX
35
UNIT
V
Supply voltage
Output voltage
6
V
Output current
Electrostatic discharge (ESD) susceptibility(3)
10
mA
V
2500
180
150
150
150
300
260
220
215
150
110
100
Storage temperature
TO Package
–60
–60
–65
–65
TO-92 Package
°C
TO-220 Package
SOIC-8 Package
Lead temperature
TO Package (soldering, 10 seconds)
TO-92 and TO-220 Package (soldering, 10 seconds)
°C
°C
SOIC Package
Infrared (15 seconds)
Vapor phase (60 seconds)
Specified operating temperature LM35, LM35A
–55
–40
0
(4)
range: TMIN to TMAX
LM35C, LM35CA
LM35D
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions. See Note 1.
(3) Human body model, 100 pF discharged through a 1.5-kΩ resistor.
(4) Thermal resistance of the TO-46 package is 400°C/W, junction to ambient, and 24°C/W junction to case. Thermal resistance of the TO-
92 package is 180°C/W junction to ambient. Thermal resistance of the small outline molded package is 220°C/W junction to ambient.
Thermal resistance of the TO-220 package is 90°C/W junction to ambient. For additional thermal resistance information see table in the
APPLICATIONS section.
ELECTRICAL CHARACTERISTICS(1)(2)
LM35A
LM35CA
UNITS
(MAX.)
PARAMETER
TEST CONDITIONS
TYP
TESTED
LIMIT(3)
DESIGN
LIMIT(4)
TYP TESTED
LIMIT(3)
DESIGN
LIMIT(4)
TA = 25°C
±0.2
±0.3
±0.4
±0.4
±0.18
+10
±0.5
±0.2
±0.3
±0.4
±0.4
±0.15
+10
±0.5
TA = –10°C
TA = TMAX
TA = TMIN
±1
Accuracy(5)
°C
±1
±1
±1
±1.5
Nonlinearity(6)
T
MIN ≤ TA ≤ TMAX
MIN ≤ TA ≤ TMAX
±0.35
±0.3
°C
Sensor gain
(average slope)
T
+9.9,
+9.9,
+10.1
mV/°C
+10.1
Load regulation(7)
0 ≤ IL ≤ 1 mA
TA = 25°C
MIN ≤ TA ≤ TMAX
±0.4
±0.5
±1
±0.4
±0.5
±1
mV/mA
mV/V
T
±3
±3
TA = 25°C
±0.01
±0.02
±0.05
±0.01
±0.02
±0.05
Line regulation(7)
4 V ≤ VS ≤ 30 V
±0.1
±0.1
(1) Unless otherwise noted, these specifications apply: −55°C ≤ TJ ≤ 150°C for the LM35 and LM35A; −40°C ≤ TJ ≤ 110°C for the LM35C
and LM35CA; and 0°C ≤ TJ ≤ 100°C for the LM35D. VS = 5 Vdc and ILOAD = 50 μA, in the circuit of Figure 2. These specifications also
apply from +2°C to TMAX in the circuit of Figure 1. Specifications in boldface apply over the full rated temperature range.
(2) Specifications in boldface apply over the full rated temperature range.
(3) Tested Limits are ensured and 100% tested in production.
(4) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(5) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(6) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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UNITS
ELECTRICAL CHARACTERISTICS(1)(2) (continued)
LM35A
LM35CA
PARAMETER
TEST CONDITIONS
TYP
TESTED
LIMIT(3)
DESIGN
LIMIT(4)
TYP TESTED
LIMIT(3)
DESIGN
(MAX.)
LIMIT(4)
VS = 5 V, 25°C
56
105
67
68
1
56
91
67
68
1
VS = 5 V
131
133
114
Quiescent current(8)
µA
VS = 30 V, 25°C
VS = 30 V
56.2
105.5
0.2
56.2
91.5
0.2
116
4 V ≤ VS ≤ 30 V, 25°C
4 V ≤ VS ≤ 30 V
Change of quiescent
current(7)
µA
0.5
2
0.5
2
Temperature
+0.39
+0.5
+0.39
+0.5
coefficient of
µA/°C
quiescent current
Minimum temperature In circuit of Figure 1, IL = 0
for rate accuracy
+1.5
+2
+1.5
+2
°C
°C
Long term stability
TJ = TMAX, for 1000 hours
±0.08
±0.08
(8) Quiescent current is defined in the circuit of Figure 1.
ELECTRICAL CHARACTERISTICS(1)(2)
LM35
LM35C, LM35D
UNITS
(MAX.)
PARAMETER
TEST CONDITIONS
TYP
TESTED
LIMIT(3)
DESIGN
LIMIT(4)
TYP TESTED
LIMIT(3)
DESIGN
LIMIT(4)
TA = 25°C
±0.4
±0.5
±0.8
±0.8
±1
±0.4
±0.5
±0.8
±0.8
±0.6
±0.9
±0.9
±0.2
+10
±1
TA = –10°C
TA = TMAX
TA = TMIN
TA = 25°C
TA = TMAX
TA = TMIN
±1.5
±1.5
±2
Accuracy, LM35,
LM35C(5)
°C
°C
±1.5
±1.5
±1.5
Accuracy, LM35D(5)
Nonlinearity(6)
±2
±2
T
MIN ≤ TA ≤ TMAX
MIN ≤ TA ≤ TMAX
±0.3
+10
±0.5
±0.5
°C
Sensor gain
(average slope)
T
+9.8,
+9.8,
+10.2
mV/°C
+10.2
Load regulation(7)
0 ≤ IL ≤ 1 mA
TA = 25°C
MIN ≤ TA ≤ TMAX
±0.4
±0.5
±2
±0.4
±0.5
±2
mV/mA
mV/V
T
±5
±5
TA = 25°C
±0.01
±0.02
±0.1
±0.01
±0.02
±0.1
Line regulation(7)
4 V ≤ VS ≤ 30 V
±0.2
±0.2
(1) Unless otherwise noted, these specifications apply: −55°C ≤ TJ ≤ 150°C for the LM35 and LM35A; −40°C ≤ TJ ≤ 110°C for the LM35C
and LM35CA; and 0°C ≤ TJ ≤ 100°C for the LM35D. VS = 5 Vdc and ILOAD = 50 μA, in the circuit of Figure 2. These specifications also
apply from +2°C to TMAX in the circuit of Figure 1. Specifications in boldface apply over the full rated temperature range.
(2) Specifications in boldface apply over the full rated temperature range.
(3) Tested Limits are ensured and 100% tested in production.
(4) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(5) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(6) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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ELECTRICAL CHARACTERISTICS(1)(2) (continued)
LM35
LM35C, LM35D
UNITS
PARAMETER
TEST CONDITIONS
TYP
TESTED
LIMIT(3)
DESIGN
LIMIT(4)
TYP TESTED
LIMIT(3)
DESIGN
LIMIT(4)
(MAX.)
VS = 5 V, 25°C
56
105
80
82
2
56
91
80
82
2
VS = 5 V
158
161
138
141
Quiescent current(8)
µA
VS = 30 V, 25°C
VS = 30 V
56.2
105.5
0.2
56.2
91.5
0.2
4 V ≤ VS ≤ 30 V, 25°C
4 V ≤ VS ≤ 30 V
Change of quiescent
current(9)
µA
0.5
3
0.5
3
Temperature
+0.39
+0.7
+0.39
+0.7
coefficient of
µA/°C
quiescent current
Minimum temperature In circuit of Figure 1, IL = 0
for rate accuracy
+1.5
+2
+1.5
+2
°C
°C
Long term stability
TJ = TMAX, for 1000 hours
±0.08
±0.08
(8) Quiescent current is defined in the circuit of Figure 1.
(9) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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TYPICAL PERFORMANCE CHARACTERISTICS
THERMAL RESISTANCE
JUNCTION TO AIR
THERMAL TIME CONSTANT
400
300
200
100
0
45
40
35
30
25
20
15
10
5
T0-46
T0-46
T0-92
T0-92
0
0
400
800
1200
1600
2000
0
400
800
1200
1600
2000
C002
AIR VELOCITY (FPM)
AIR VELOCITY (FPM)
C001
Figure 3.
Figure 4.
THERMAL RESPONSE IN STILL AIR
THERMAL RESPONSE IN STIRRED OIL BATH
120
100
80
120
100
80
T0-46
60
60
T0-92
40
40
20
20
0
0
±20
±20
0
2
4
6
8
0
2
4
6
8
C004
TIME (MINUTES)
Figure 5.
TIME (SEC)
Figure 6.
C003
QUIESCENT CURRENT
vs
TEMPERATURE
(IN CIRCUIT OF Figure 1)
MINIMUM SUPPLY VOLTAGE
vs
TEMPERATURE
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
160
140
120
100
80
TYPICAL
IOUT = 2.0 mA
TYPICAL
IOUT = 1.0 mA
60
40
TYPICAL
IOUT = 0 ꢀA or 50 ꢀA
20
0
25
75
125
175
±75
±25
25
75
125
175
±75
±25
C005
TEMPERATURE (C)
TEMPERATURE (C)
C006
Figure 7.
Figure 8.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
QUIESCENT CURRENT
vs
TEMPERATURE
(IN CIRCUIT OF Figure 2)
ACCURACY
vs
TEMPERATURE (ENSURED)
200
180
160
140
120
100
80
2.0
1.5
LM35
1.0
0.5
LM35A
TYPICAL
0.0
±0.5
±1.0
±1.5
±2.0
LM35A
60
LM35
75
40
25
75
125
175
25
125
175
±75
±25
±75
±25
TEMPERATURE (C)
TEMPERATURE (C)
C007
C008
Figure 9.
Figure 10.
ACCURACY
vs
TEMPERATURE (ENSURED)
NOISE VOLTAGE
1600
1400
1200
1000
800
600
400
200
0
2.5
2.0
LM35D
LM35C
1.5
1.0
LM35CA
0.5
TYPICAL
0.0
±0.5
±1.0
±1.5
±2.0
±2.5
LM35CA
LM35C
10
100
1k
10k
100k
25
75
125
175
±75
±25
FREQUENCY (Hz)
TEMPERATURE (C)
C010
C009
Figure 11.
Figure 12.
START-UP RESPONSE
6
4
2
0
0.6
0.4
0.2
0
-0.2
-20 -10
0
10 20 30 40 50 60
TIME (ꢀSEC)
C011
Figure 13.
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APPLICATIONS
The LM35 is applied easily in the same way as other integrated-circuit temperature sensors. Glue or cement the
device to a surface and the temperature should be within about 0.01°C of the surface temperature.
This presumes that the ambient air temperature is almost the same as the surface temperature. If the air
temperature were much higher or lower than the surface temperature, the actual temperature of the LM35 die
would be at an intermediate temperature between the surface temperature and the air temperature, which is
especially true for the TO-92 plastic package where the copper leads are the principal thermal path to carry heat
into the device, so its temperature might be closer to the air temperature than to the surface temperature.
To minimize this problem, ensure that the wiring to the LM35, as it leaves the device, is held at the same
temperature as the surface of interest. The easiest way to do this is to cover up these wires with a bead of epoxy
which will insure that the leads and wires are all at the same temperature as the surface, and that the
temperature of the LM35 die is not affected by the air temperature.
The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that
case the V− terminal of the circuit will be grounded to that metal. Alternatively, mount the LM35 inside a sealed-
end metal tube, and then dip into a bath or screw into a threaded hole in a tank. As with any IC, the LM35 and
accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is
especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit
coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot
corrode the LM35 or its connections.
These devices are sometimes soldered to a small light-weight heat fin to decrease the thermal time constant and
speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the
sensor, to give the steadiest reading despite small deviations in the air temperature.
Table 1. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, θJA
)
SOIC-8(2)
small heat
fin
,
TO, no heat
sink
TO(1), small
heat fin
TO-92, no heat TO-92(2), small
SOIC-8, no
heat sink
TO-220, no
heat sink
sink
heat fin
Still air
400°C/W
100°C/W
100°C/W
50°C/W
100°C/W
40°C/W
40°C/W
30°C/W
180°C/W
90°C/W
90°C/W
45°C/W
140°C/W
70°C/W
70°C/W
40°C/W
220°C/W
105°C/W
110°C/W
90°C/W
90°C/W
26°C/W
Moving air
Still oil
Stirred oil
(Clamped to
metal, Infinite
heat sink)
(24°C/W)
(55°C/W)
(1) Wakefield type 201, or 1-in disc of 0.02-in sheet brass, soldered to case, or similar.
(2) TO-92 and SOIC-8 packages glued and leads soldered to 1-in square of 1/16-in printed circuit board with 2-oz foil or similar.
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TYPICAL APPLICATIONS
HEAVY CAPACITIVE LOAD, WIRING, ETC.
2 k
+
LM35
TO A HIGH-IMPEDANCE LOAD
OUT
v
Figure 14. LM35 with Decoupling from Capacitive Load
HEAVY CAPACITIVE LOAD, WIRING, ETC.
+
OUT
LM35
TO A HIGH-IMPEDANCE LOAD
0.01 PF BYPASS
75
OPTONAL
v
1 PF
Figure 15. LM35 with R-C Damper
CAPACITIVE LOADS
Like most micropower circuits, the LM35 has a limited ability to drive heavy capacitive loads. The LM35 alone is
able to drive 50 pf without special precautions. If heavier loads are anticipated, isolating or decoupling the load
with a resistor is easy (see Figure 14). Or you can improve the tolerance of capacitance with a series R-C
damper from output to ground (see Figure 15).
When the LM35 is applied with a 200-Ω load resistor as shown in Figure 16, Figure 17, or Figure 19, the device
is relatively immune to wiring capacitance because the capacitance forms a bypass from ground to input and not
on the output. However, as with any linear circuit connected to wires in a hostile environment, performance is
affected adversely by intense electromagnetic sources such as relays, radio transmitters, motors with arcing
brushes, and SCR transients, as the wiring acts as a receiving antenna and the internal junctions act as
rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper, such
as 75 Ω, in series with 0.2 or 1 μF from output to ground are often useful. These are shown in Figure 24,
Figure 24, and Figure 27.
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5 V
+
VOUT = 10 mV/°C (TAMBIENT = 1 °C)
FROM + 2 °C TO + 40 °C
6.8 k
5%
200
1%
v
+
OUT
LM35
HEAT
FINS
TWISTED PAIR
200
1%
v
Figure 16. Two-Wire Remote Temperature Sensor
(Grounded Sensor)
5 V
+
OUT
LM35
HEAT
FINS
TWISTED PAIR
200
1%
v
VOUT = 10 mV/°C (TAMBIENT = 1 °C)
FROM + 2 °C TO + 40 °C
6.8 k
5%
OR 10K RHEOSTAT
FOR GAIN ADJUST
200
1%
Figure 17. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
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+VS
+
LM35
VOUT
v
1N914
18 k
10%
Figure 18. Temperature Sensor, Single Supply
(−55° to +150°C)
5 V
+
OUT
LM35
0.01 PF
BYPASS
TWISTED PAIR
OPTIONAL
2 k
1%
200
1%
VOUT = 10 mV/°C (TAMBIENT = 10 °C)
FROM t 5 °C TO + 40 °C
2 k
1%
200
1%
Figure 19. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
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+ 5 V TO + 30 V
4.7 k
+
2N2907
OUT
IN
LM317
ADJ
OUT
LM35
402
1%
v
62.5
0.5%
OFFSET
ADJUST
50
Figure 20. 4-To-20 mA Current Source
(0°C to 100°C)
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+VS
(6 V to 20 V)
LM35
45.5 kO
1%
10 kO
1%
VOUT = +1 mV/°F
26.4 kO
1%
18 kO
LM385-1.2
1 MO
1%
Figure 21. Fahrenheit Thermometer
5 V
LM35
Figure 22. Centigrade Thermometer
(Analog Meter)
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SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
www.ti.com
9 V
1 k
LM35
100 ꢀA,
60 mV
FULL-
SCALE
25.5 k
LM385-
2.5
Figure 23. Fahrenheit Thermometer, Expanded Scale Thermometer
(50°F to 80°F, for Example Shown)
5 V
+
3.9 k
OUT
IN
LM35
SERIAL
DATA OUTPUT
ADC08031
REF
1.28 V
GND
100k
FB
75
+
CLOCK
ENABLE
LM385
+
10 k
1 PF
Figure 24. Temperature To Digital Converter
(Serial Output)
(128°C Full Scale)
14
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Product Folder Links: LM35
LM35
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SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
5 V
+
16 k
PARALLEL
DATA
OUTPUT
8
OUT
IN
LM35
GND
ADC0804
75
1 k
INTR
VREF
0.64 V
+
CS
RD
WR
+
2 k
1 PF
Figure 25. Temperature To Digital Converter
(Parallel TRI-STATE Outputs for Standard Data Bus to μP Interface.)
(128°C Full Scale)
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SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
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°F
20 k
67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
7 V
+
20 PF
20 LEDs
18
1
10
9
18
1
10
9
LM3914
LM3914
2
3
4
5
6
7
8
2
3
4
5
6
7
8
NC
7 V
7 V
1.2 k*
+
VA
OUT
LM35
HEAT
FINS
VC
VB
499*
499*
200*
1.5 k*
1 k*
+
RB
1 k
RC
1 k
1.5 k*
1 PF
RA
1 k
*=1% or 2% film resistor
Trim RB for VB = 3.075 V
Trim RC for VC = 1.955 V
Trim RA for VA = 0.075 V + 100 mV/°C ×Tambient
Example, VA = 2.275 V at 22°C
Figure 26. Bar-Graph Temperature Display (Dot Mode)
16
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Product Folder Links: LM35
LM35
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SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
6 V
6.8 k
1 k
fOUT
4N28
+
8
100 k
7
6
5
LM35
GND
LM131
2
3
4
1
12 k
0.01 PF
0.01 PF
1 PF
100 k
47
FULL
SCALE
ADJ
LOW TEMPCO
5 k
Figure 27. LM35 With Voltage-To-Frequency Converter And Isolated Output
(2°C to 150°C; 20 to 1500 Hz)
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BLOCK DIAGRAM
A1
1.38 VPTAT
+VS
nR1
Q1
10E
Q2
E
+
A2
VOUT = 10 mV/°C
V0
.125 R2
nR1
8.8 mV/°C
i
R2
18
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LM35
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SNIS159D –AUGUST 1999–REVISED OCTOBER 2013
REVISION HISTORY
Changes from Revision C (July 2013) to Revision D
Page
•
•
•
Changed W to Ω ................................................................................................................................................................... 1
Changed W to Ω ................................................................................................................................................................... 3
Changed W to Ω ................................................................................................................................................................... 9
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM35AH
ACTIVE
TO
TO
NDV
3
3
1000
TBD
Call TI
Call TI
-55 to 150
-55 to 150
LM35AH
LM35AH/NOPB
ACTIVE
NDV
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
LM35AH
LM35CAH
ACTIVE
ACTIVE
TO
TO
NDV
NDV
3
3
1000
1000
TBD
Call TI
Call TI
-40 to 110
-40 to 110
LM35CAH
LM35CAH
LM35CAH/NOPB
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
LM35CAZ/LFT4
LM35CAZ/NOPB
ACTIVE
ACTIVE
TO-92
TO-92
LP
LP
3
3
2000
1800
Green (RoHS
& no Sb/Br)
SN | CU SN
SN | CU SN
N / A for Pkg Type
N / A for Pkg Type
LM35
CAZ
Green (RoHS
& no Sb/Br)
-40 to 110
LM35
CAZ
LM35CH
ACTIVE
ACTIVE
TO
TO
NDV
NDV
3
3
1000
1000
TBD
Call TI
Call TI
-40 to 110
-40 to 110
LM35CH
LM35CH/NOPB
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
LM35CH
LM35CZ/LFT1
LM35CZ/LFT4
LM35CZ/NOPB
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
TO-92
LP
LP
LP
3
3
3
2000
2000
1800
TBD
Call TI
Call TI
Call TI
Call TI
TBD
Green (RoHS
& no Sb/Br)
SN | CU SN
N / A for Pkg Type
-40 to 110
LM35
CZ
LM35DH
ACTIVE
ACTIVE
TO
TO
NDV
NDV
3
3
1000
1000
TBD
Call TI
Call TI
0 to 70
0 to 70
LM35DH
LM35DH/NOPB
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
LM35DH
LM35DM
LM35DM/NOPB
LM35DMX
NRND
ACTIVE
NRND
SOIC
SOIC
D
D
8
8
8
8
3
95
95
TBD
Call TI
SN | CU SN
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
LM35D
M
Green (RoHS
& no Sb/Br)
LM35D
M
SOIC
D
2500
2500
45
TBD
LM35D
M
LM35DMX/NOPB
LM35DT
ACTIVE
NRND
SOIC
D
Green (RoHS
& no Sb/Br)
SN | CU SN
Call TI
Level-1-260C-UNLIM
Call TI
LM35D
M
TO-220
NEB
TBD
LM35DT
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Nov-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM35DT/NOPB
ACTIVE
TO-220
NEB
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 100
LM35DT
LM35DZ
OBSOLETE
ACTIVE
TO-92
TO-92
LP
LP
3
3
TBD
Call TI
Call TI
LM35DZ/LFT1
2000
2000
2000
2000
1800
Green (RoHS
& no Sb/Br)
SN | CU SN
N / A for Pkg Type
LM35
DZ
LM35DZ/LFT2
LM35DZ/LFT4
LM35DZ/LFT7
LM35DZ/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
TO-92
TO-92
LP
LP
LP
LP
3
3
3
3
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
LM35
DZ
Green (RoHS
& no Sb/Br)
SN | CU SN
SN | CU SN
SN | CU SN
LM35
DZ
Green (RoHS
& no Sb/Br)
LM35
DZ
Green (RoHS
& no Sb/Br)
0 to 100
LM35
DZ
LM35H
ACTIVE
ACTIVE
TO
TO
NDV
NDV
3
3
1000
1000
TBD
Call TI
Call TI
-55 to 150
-55 to 150
LM35H
LM35H/NOPB
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
LM35H
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
3-Nov-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM35DMX
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.5
6.5
5.4
5.4
2.0
2.0
8.0
8.0
12.0
12.0
Q1
Q1
LM35DMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM35DMX
SOIC
SOIC
D
D
8
8
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
LM35DMX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NDV0003H
H03H (Rev F)
www.ti.com
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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相关型号：
LM35CZ/NOPB
Analog Temperature Sensor, ANALOG TEMP SENSOR-VOLTAGE, -.55-1.5V, 0.40Cel, ROUND, THROUGH HOLE MOUNT, PLASTIC, TO-92, 3 PIN
NSC
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