LM360MX [TI]
具有差分输出的高速、低电压比较器 | D | 8 | 0 to 70;
| 型号： | LM360MX |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有差分输出的高速、低电压比较器 | D | 8 | 0 to 70 放大器 光电二极管 比较器 |
| 文件： | 总17页 (文件大小：1121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM160, LM360
www.ti.com
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
LM160/LM360 High Speed Differential Comparator
Check for Samples: LM160, LM360
1
FEATURES
DESCRIPTION
The LM160/LM360 is a very high speed differential
input, complementary TTL output voltage comparator
2
•
•
•
•
•
•
•
•
Ensured high speed: 20 ns max
Tight delay matching on both outputs
Complementary TTL outputs
High input impedance
with
improved
characteristics
over
pin-for-pin
the
μA760/μA760C, for which it is
a
replacement. The device has been optimized for
greater speed, input impedance and fan-out, and
lower input offset voltage. Typically delay varies only
3 ns for overdrive variations of 5 mV to 400 mV.
Low speed variation with overdrive variation
Fan-out of 4
Low input offset voltage
Complementary outputs having minimum skew are
provided. Applications involve high speed analog to
digital convertors and zero-crossing detectors in disk
file systems.
Series 74 TTL compatible
CONNECTION DIAGRAMS
TO-99 Package
SOIC or PDIP Package
(1)
Figure 1. Package Number LMC0008C
Figure 2. Package Number D0008A or P0008E
(1) Also available in SMD# 5962-8767401
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
www.ti.com
(1) (2)
Absolute Maximum Ratings
Positive Supply Voltage
Negative Supply Voltage
Peak Output Current
+8V
−8V
20 mA
Differential Input Voltage
±5V
Input Voltage
V+ ≥ VIN ≥ V−
(3)
ESD Tolerance
1600V
Operating Temperature
Range
LM160
LM360
−55°C to +125°C
0°C to +70°C
−65°C to +150°C
260°C
Storage Temperature Range
Lead Temperature
Soldering Information
PDIP Package
(Soldering, 10 sec.)
Soldering (10 seconds)
Vapor Phase (60 seconds)
Infrared (15 seconds)
260°C
215°C
220°C
SOIC Package
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) The device may be damaged if used beyond the maximum ratings.
(2) Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications.
(3) Human body model, 1.5 kΩ in series with 100 pF.
2
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
LM160, LM360
www.ti.com
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
Electrical Characteristics
(TMIN ≤ TA ≤ TMAX
)
Parameter
Conditions
Min
Typ
Max
Units
Operating Conditions
Supply Voltage VCC
Supply Voltage VCC
Input Offset Voltage
Input Offset Current
Input Bias Current
+
4.5
5
−5
2
6.5
−6.5
5
V
V
−
−4.5
R
S ≤ 200Ω
mV
μA
μA
Ω
0.5
5
3
20
Output Resistance (Either Output)
Response Time
VOUT = VOH
100
13
12
14
(1) (2)
TA = 25°C, VS = ±5V
TA = 25°C, VS = ±5V
TA = 25°C, VS = ±5V
25
20
ns
ns
ns
(3) (2)
(4) (2)
Response Time Difference between Outputs
(1) (2)
(tpd of +VIN1) − (tpd of −VIN2
(tpd of +VIN2) − (tpd of −VIN1
(tpd of +VIN1) − (tpd of +VIN2
(tpd of −VIN1) − (tpd of −VIN2
Input Resistance
)
)
)
)
TA = 25°C
2
2
ns
ns
ns
ns
kΩ
pF
(1) (2)
TA = 25°C
(1) (2)
TA = 25°C
2
(1) (2)
TA = 25°C
2
f = 1 MHz
f = 1 MHz
RS = 50Ω
17
3
Input Capacitance
Average Temperature Coefficient of
Input Offset Voltage
8
μV/°C
Average Temperature Coefficient of
Input Offset Current
7
nA/°C
Common Mode Input Voltage Range
Differential Input Voltage Range
Output High Voltage (Either Output)
Output Low Voltage (Either Output)
Positive Supply Current
VS = ±6.5V
±4
±5
±4.5
V
V
IOUT = −320 μA, VS = ±4.5V
ISINK = 6.4 mA
2.4
3
0.25
18
V
0.4
32
V
VS = ±6.5V
mA
mA
Negative Supply Current
VS = ±6.5V
−9
−16
(1) Response time measured from the 50% point of a 30 mVp-p 10 MHz sinusoidal input to the 50% point of the output.
(2) Measurements are made in AC Test Circuit, Fanout = 1
(3) Response time measured from the 50% point of a 2 Vp-p 10 MHz sinusoidal input to the 50% point of the output.
(4) Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic
threshold.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM160 LM360
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
Input Current
vs
Ambient
Temperature
Offset Voltage
Supply Current
vs
Ambient
Temperature
Input Characteristics
Delay of Output 1 With
Respect to Output 2 vs
Ambient Temperature
Propagation Delay vs
Ambient Temperature
4
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
LM160, LM360
www.ti.com
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Common-Mode
Pulse Response
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM160 LM360
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
www.ti.com
AC TEST CIRCUIT
VIN=±50 mV
V+=+5V
FANOUT=1
FANOUT=4
R=630Ω
R=2.4k
V−=−5V
C=15 pF
C=30 pF
6
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
LM160, LM360
www.ti.com
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
SCHEMATIC DIAGRAM
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM160 LM360
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (March 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM360M
LM360M/NOPB
LM360MX
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
95
Non-RoHS
& Green
Call TI
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-1-235C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
LM
360M
ACTIVE
ACTIVE
ACTIVE
95
RoHS & Green
SN
Call TI
SN
LM
360M
2500
Non-RoHS
& Green
LM
360M
LM360MX/NOPB
2500 RoHS & Green
LM
360M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM360MX
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.5
6.5
5.4
5.4
2.0
2.0
8.0
8.0
12.0
12.0
Q1
Q1
LM360MX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM360MX
SOIC
SOIC
D
D
8
8
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
LM360MX/NOPB
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM360M
LM360M
D
D
D
SOIC
SOIC
SOIC
8
8
8
95
95
95
495
495
495
8
8
8
4064
4064
4064
3.05
3.05
3.05
LM360M/NOPB
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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