LM361M [TI]

具有选通信号的 140ns 差分比较器 | D | 14 | 0 to 70;
LM361M
型号: LM361M
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有选通信号的 140ns 差分比较器 | D | 14 | 0 to 70

通信 放大器 光电二极管 比较器
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LM161, LM361  
www.ti.com  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
LM161/LM361 High Speed Differential Comparators  
Check for Samples: LM161, LM361  
1
FEATURES  
DESCRIPTION  
The LM161/LM361 is a very high speed differential  
input, complementary TTL output voltage comparator  
with improved characteristics over the SE529/NE529  
for which it is a pin-for-pin replacement. The device  
has been optimized for greater speed performance  
and lower input offset voltage. Typically delay varies  
only 3 ns for over-drive variations of 5 mV to 500 mV.  
It may be operated from op amp supplies (±15V).  
2
Independent strobes  
Ensured high speed: 20 ns max  
Tight delay matching on both outputs  
Complementary TTL outputs  
Operates from op amp supplies: ±15V  
Low speed variation with overdrive variation  
Low input offset voltage  
Complementary outputs having maximum skew are  
provided. Applications involve high speed analog to  
digital converters and zero-crossing detectors in disk  
file systems.  
Versatile supply voltage range  
CONNECTION DIAGRAMS  
SOIC or PDIP Package  
Figure 1. Top View  
Package Numbers D0014A, NFF0014A  
TO-100 Package  
Figure 2. Package Number LME0010C  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
LM161, LM361  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
www.ti.com  
LOGIC DIAGRAM  
*Output is low when current is drawn from strobe pin.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)  
Absolute Maximum Ratings  
Positive Supply Voltage, V+  
Negative Supply Voltage, V−  
Gate Supply Voltage, VCC  
Output Voltage  
+16V  
16V  
+7V  
+7V  
Differential Input Voltage  
Input Common Mode Voltage  
Power Dissipation  
±5V  
±6V  
600 mW  
65°C to +150°C  
Storage Temperature Range  
Operating Temperature Range  
LM161  
TMIN  
TMAX  
55°C to +125°C  
25°C to +85°C  
0°C to +70°C  
260°C  
LM361  
Lead Temp. (Soldering, 10 seconds)  
For Any Device Lead Below V−  
0.3V  
(1) The device may be damaged by use beyond the maximum ratings.  
Operating Conditions  
Min  
5V  
Typ  
Max  
15V  
LM161  
Supply Voltage V+  
LM361  
5V  
15V  
LM161  
6V  
6V  
4.5V  
4.75V  
15V  
15V  
5.5V  
Supply Voltage V−  
LM361  
LM161  
5V  
5V  
Supply Voltage VCC  
LM361  
5.25V  
1600V  
260°C  
215°C  
(1)  
ESD Tolerance  
PDIP Package  
SOIC Package  
Soldering (10 seconds)(2)  
Vapor Phase (60  
seconds)  
Soldering Information(2)  
Infrared (15 seconds)  
220°C  
(1) Human body model, 1.5 kΩ in series with 100 pF.  
(2) See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.  
2
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM161 LM361  
LM161, LM361  
www.ti.com  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
Electrical Characteristics(1)(2)(1)  
(V+ = +10V, VCC = +5V, V= 10V, TMIN TA TMAX, unless noted)  
Parameter  
Conditions  
Limits  
Units  
LM161  
LM361  
Typ  
1
Min  
Typ  
1
Max  
Min  
Max  
Input Offset Voltage  
3
5
mV  
μA  
5
10  
Input Bias Current  
Input Offset Current  
TA=25°C  
20  
3
30  
5
μA  
2
2
μA  
TA=25°C  
μA  
Voltage Gain  
TA=25°C  
3
3
V/mV  
kΩ  
Input Resistance  
TA=25°C, f=1 kHz  
20  
20  
VCC=4.75V,  
ISOURCE=0.5 mA  
Logical “1” Output Voltage  
Logical “0” Output Voltage  
2.4  
3.3  
2.4  
3.3  
V
V
VCC=4.75V,  
ISINK=6.4 mA  
0.4  
0.4  
Strobe Input “1” Current  
(Output Enabled)  
VCC=5.25V,  
VSTROBE=2.4V  
200  
200  
μA  
mA  
Strobe Input “0” Current  
(Output Disabled)  
VCC=5.25V,  
VSTROBE=0.4V  
1.6  
1.6  
Strobe Input “0” Voltage  
Strobe Input “1” Voltage  
Output Short Circuit Current  
Supply Current I+  
VCC=4.75V  
0.8  
0.8  
V
V
VCC=4.75V  
2
2
VCC=5.25V, VOUT=0V  
V+=10V, V=10V,  
VCC=5.25V,  
18  
55  
18  
55  
mA  
mA  
4.5  
55°CTA125°C  
Supply Current I+  
Supply Current I−  
Supply Current I−  
Supply Current ICC  
Supply Current ICC  
V+=10V, V=10V,  
VCC=5.25V,  
0°CTA70°C  
V+=10V, V=10V,  
VCC=5.25V,  
55°CTA125°C  
5
mA  
mA  
mA  
mA  
mA  
10  
18  
V+=10V,  
10  
20  
V=10V,VCC=5.25V,  
0°CTA70°C  
V+=10V, V=10V,  
VCC=5.25V,  
55°CTA125°C  
V+=10V, V=10V,  
VCC=5.25V,  
0°CTA70°C  
(3)  
Transient Response  
VIN = 50 mV overdrive  
TA=25°C  
Propagation Delay Time (tpd(0)  
)
)
14  
14  
2
20  
20  
5
14  
14  
2
20  
20  
5
ns  
ns  
ns  
ns  
ns  
Propagation Delay Time (tpd(1)  
TA=25°C  
Delay Between Output A and B  
TA=25°C  
Strobe Delay Time (tpd(0)  
)
)
TA=25°C  
8
8
Strobe Delay Time (tpd(1)  
TA=25°C  
8
8
(1) Typical thermal impedances are as follows:  
(2) Refer to RETS161X for LM161H and LM161J military specifications.  
(3) Measurements using AC Test circuit, Fanout = 1. The devices are faster at low supply voltages.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: LM161 LM361  
LM161, LM361  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
www.ti.com  
Typical Performance Characteristics  
Input Currents  
vs  
Ambient  
Temperature  
Offset Voltage  
Figure 3.  
Figure 4.  
Supply Current vs  
Ambient Temperature  
Input Characteristics  
Figure 5.  
Figure 6.  
Supply Current vs  
Supply Voltage  
Propagation Delay vs  
Ambient Temperature  
Figure 7.  
Figure 8.  
4
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM161 LM361  
LM161, LM361  
www.ti.com  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
Typical Performance Characteristics (continued)  
Strobe Delay  
vs  
Ambient  
Temperature  
Delay of Output 1 With  
Respect to Output 2 vs  
Ambient Temperature  
Figure 9.  
Figure 10.  
Common-Mode  
Pulse Response  
Propagation Delay vs  
Supply Voltage  
Figure 11.  
Figure 12.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: LM161 LM361  
LM161, LM361  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
www.ti.com  
AC TEST CIRCUIT  
VIN = ±50 mV  
V+ = +10V  
FANOUT = 1  
R = 2.4k  
FANOUT = 4  
R = 680Ω  
V= 10V  
C=15 pF  
C = 30 pF  
VCC = 5.25V  
6
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM161 LM361  
LM161, LM361  
www.ti.com  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
SCHEMATIC DIAGRAM  
LM161  
R10, R16: 85  
R11, R17: 205  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Links: LM161 LM361  
 
LM161, LM361  
SNOSBJ5C MAY 1999REVISED MARCH 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision B (March 2013) to Revision C  
Page  
Changed layout of National Data Sheet to TI format ............................................................................................................ 7  
8
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM161 LM361  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-May-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM361H/NOPB  
LM361M  
ACTIVE  
ACTIVE  
TO-100  
SOIC  
LME  
D
10  
14  
500  
55  
RoHS & Green  
Call TI  
Level-1-NA-UNLIM  
0 to 70  
0 to 70  
( LM361H, LM361H)  
LM361M  
Samples  
Samples  
Non-RoHS  
& Green  
Call TI  
Level-1-235C-UNLIM  
LM361M/NOPB  
LM361MX/NOPB  
LM361N/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
PDIP  
D
D
N
14  
14  
14  
55  
RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-NA-UNLIM  
0 to 70  
0 to 70  
0 to 70  
LM361M  
LM361M  
LM361N  
Samples  
Samples  
Samples  
2500 RoHS & Green  
25 RoHS & Green  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-May-2023  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Mar-2022  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM361MX/NOPB  
SOIC  
D
14  
2500  
330.0  
16.4  
6.5  
9.35  
2.3  
8.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Mar-2022  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC 14  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
LM361MX/NOPB  
D
2500  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Mar-2022  
TUBE  
*All dimensions are nominal  
Device  
Package Name Package Type  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
LM361M  
LM361M  
D
D
D
N
SOIC  
SOIC  
SOIC  
PDIP  
14  
14  
14  
14  
55  
55  
55  
25  
495  
495  
495  
502  
8
8
4064  
4064  
4064  
11938  
3.05  
3.05  
3.05  
4.32  
LM361M/NOPB  
LM361N/NOPB  
8
14  
Pack Materials-Page 3  
PACKAGE OUTLINE  
LME0010A  
TO-CAN - 5.72 mm max height  
S
C
A
L
E
0
.
8
0
0
METAL CYLINDRICAL PACKAGE  
8.51  
7.75  
4.70  
4.19  
1.02 MAX  
5.72 MAX  
C
1.02  
0.25  
STAND-OFF  
SEATING PLANE  
10X 12.7 MIN  
0.53  
0.41  
10X  
0.25  
C A  
(
3.56)  
STAND-OFF  
5
4
6
9.40  
8.51  
2.92  
A
7
8
3
2
5.84  
9
1
10  
1.14  
0.74  
0.86  
0.71  
36 TYP  
4220604/A 05/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Reference JEDEC registration MO-006/TO-100.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
LME0010A  
TO-CAN - 5.72 mm max height  
METAL CYLINDRICAL PACKAGE  
SOLDER MASK  
OPENING  
10  
(
1.4)  
1
9
0.07 MAX  
ALL AROUND  
9X ( 1.4)  
METAL  
METAL  
10X ( 0.8)  
VIA  
(R0.05)  
TYP  
2
8
9X SOLDER MASK  
OPENING  
7
3
9X 0.07 MAX  
ALL AROUND  
4
6
(
5.84)  
5
(36 ) TYP  
LAND PATTERN EXAMPLE  
NON-SOLDER MASK DEFINED  
SCALE: 12X  
4220604/A 05/2017  
www.ti.com  
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