LM385BYZ/NOPB [TI]
Adjustable Micropower Voltage References;
| 型号： | LM385BYZ/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Adjustable Micropower Voltage References |
| 文件： | 总23页 (文件大小：1146K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
LM185/LM285/LM385 Adjustable Micropower Voltage References
Check for Samples: LM185-ADJ, LM285-ADJ, LM385-ADJ
Careful design of the LM185 has made the device
1
FEATURES
tolerant of capacitive loading, making it easy to use in
almost any reference application. The wide dynamic
operating range allows its use with widely varying
supplies with excellent regulation.
2
•
•
•
•
•
Adjustable from 1.24V to 5.30V
Operating Current of 10μA to 20mA
1% and 2% Initial Tolerance
1Ω Dynamic Impedance
The extremely low power drain of the LM185 makes it
useful for micropower circuitry. This voltage reference
can be used to make portable meters, regulators or
general purpose analog circuitry with battery life
approaching shelf life. Further, the wide operating
current allows it to replace older references with a
tighter tolerance part.
Low Temperature Coefficient
DESCRIPTION
The LM185/LM285/LM385 are micropower 3-terminal
adjustable band-gap voltage reference diodes.
Operating from 1.24 to 5.3V and over a 10μA to
20mA current range, they feature exceptionally low
dynamic impedance and good temperature stability.
On-chip trimming is used to provide tight voltage
tolerance. Since the LM185 band-gap reference uses
only transistors and resistors, low noise and good
long-term stability result.
The LM185 is rated for operation over a −55°C to
125°C temperature range, while the LM285 is rated
−40°C to 85°C and the LM385 0°C to 70°C. The
LM185 is available in a hermetic TO package and a
LCCC package, while the LM285/LM385 are
available in a low-cost TO-92 package, as well as
SOIC.
Connection Diagram
Figure 1. TO-92 Package
Bottom View
Figure 2. TO Package
Bottom View
Figure 3. SOIC Package
Top View
Figure 4. 20-LCCC
Top View
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Block Diagram
Typical Applications
Figure 5. 1.2V Reference
Figure 6. 5.0V Reference
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)(3)
Reverse Current
30mA
10mA
Forward Current
(4)
Operating Temperature Range
LM185 Series
LM285 Series
LM385 Series
−55°C to 125°C
−40°C to 85°C
0°C to 70°C
2kV
(5)
ESD Susceptibility
Storage Temperature
Soldering Information
TO-92 Package (10 sec.)
TO Package (10 sec.)
SOIC Package
−55°C to 150°C
260°C
300°C
Vapor Phase (60 sec.)
Infrared (15 sec.)
215°C
220°C
See An-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
(2) Refer to RETS185H for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, see Table 1 and Thermal Characteristics.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Table 1. TJ(max) for Elevated Temperature Operation
DEVICE
LM185
LM285
LM385
TJ(max) (°C)
150
125
100
Thermal Characteristics
Over operating free-air temperature range (unless otherwise noted)
Thermal Resistance
TO-92
180°C/W (0.4″ leads)
170°C/W (0.125″ leads)
N/A
TO-46
440°C/W
80°C/W
SOIC
165°C/W
N/A
θJA (Junction to Ambient)
θJC (Junction to Case)
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LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Electrical Characteristics(1)
LM185, LM285
LM185BX,
LM385
LM285
LM385
LM185BY
LM185B,
LM285BX,
LM285BY
LM385BX,
LM385BY
Units
(Limit)
Parameter
Conditions
Typ
Typ
Tested Design Tested Design
Tested Design Tested Design
Limit
Limit
Limit
Limit
Limit
Limit
Limit
Limit
(2)
(3)
(2)
(3)
(2)
(3)
(2)
(3)
Reference
Voltage
IR = 100μA
1.240 1.252
1.255
1.265
1.215
1.270 1.240 1.252
1.255
1.215
1.265
1.215
1.270
1.205
V (max)
V (min)
1.228
1.205
1.228
1.215
Reference
Voltage
Change with
Current
IMIN< IR < 1mA
0.2
4
1
1.5
20
1
1.5
20
0.2
5
1
1.5
25
1
1.5
25
mV
(max)
1mA < IR < 20mA
10
10
15
15
Dynamic
Output
IR = 100μA, f =
100Hz
Impedance
IAC = 0.1 IR VOUT
VREF
=
0.3
0.7
0.4
1
Ω
VOUT
5.3V
=
Reference
Voltage
Change with
Output
IR = 100μA
mV
(max)
1
3
6
3
6
2
5
10
35
5
10
35
Voltage
Feedback
Current
13
20
25
20
25
16
30
30
nA (max)
Minimum
Operating
Current (see
curve)
VOUT = VREF
VOUT = 5.3V
6
9
10
50
9
10
50
7
11
55
13
60
11
55
13
60
μA
(max)
30
45
45
35
Output
IR = 100μA, 10Hz < f
μVrms
Wideband
Noise
< 10kHz
VOUT = VREF
VOUT = 5.3V
IR = 100μA X Suffix
Y Suffix
50
50
170
170
Average
Temperature
30
50
30
50
ppm/°c
(max)
Coefficient
(4)
All
150
150
150
150
Others
Long Term
Stability
IR = 100μA, T = 1000
Hr,
20
20
ppm
TA = 25°C ± 0.1°C
(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C. Unless otherwise
specified, all parameters apply for VREF < VOUT < 5.3V.
(2) Production tested.
(3) Not production tested. These limits are not to be used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures from TMIN
to TMAX, divided by TMAX − TMIN. The measured temperatures are −55, −40, 0, 25, 70, 85, 125°C.
4
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LM185-ADJ, LM285-ADJ, LM385-ADJ
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Typical Performance Characteristics
Temperature Drift of 3
Representative Units
Feedback Current
Figure 7.
Figure 8.
Minimum Operating Current
Reverse Characteristics
Figure 9.
Figure 10.
Reverse Characteristics
Forward Characteristics
Figure 11.
Figure 12.
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Output Noise Voltage
Dynamic Output Impedance
Figure 13.
Figure 14.
Response Time
Figure 15.
Temperature Coefficient Typical
LM185 (left),
LM285 (center),
LM385 (right)
Figure 16.
6
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LM185-ADJ, LM285-ADJ, LM385-ADJ
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
TYPICAL APPLICATIONS
Figure 17. Precision 10V Reference
Figure 18. Low AC Noise Reference
Figure 19. 25V Low Current Shunt Regulator
Figure 20. 200 mA Shunt Regulator
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Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Figure 21. Series-Shunt 20 mA Regulator
Figure 22. High Efficiency Low Power Regulator
Figure 23. Voltage Level Detector
Figure 24. Voltage Level Detector
Figure 25. Fast Positive Clamp
Figure 26. Bidirectional Clamp
±2.4V
2.4V + ΔVD1
8
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LM185-ADJ, LM285-ADJ, LM385-ADJ
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Figure 27. Bidirectional Adjustable Clamp
±1.8V to ±2.4V
Figure 28. Bidirectional Adjustable Clamp
±2.4V to ±6V
Figure 29. Simple Floating Current Detector
Figure 30. Current Source
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LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
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*D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the
threshold current, except with I=O.
Figure 31. Precision Floating Current Detector
Figure 32. Centigrade Thermometer, 10mV/°C
Figure 33. Freezer Alarm
10
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LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Schematic Diagram
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LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision E (April 2013) to Revision F
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12
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Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
LM185BH
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
TO
NDV
3
3
2
2
3
8
8
3
8
8
3
8
8
8
3
3
3
1000
TBD
Call TI
Call TI
( LM185BH ~
LM185BH)
LM185BH/NOPB
LM185H-2.5
ACTIVE
LIFEBUY
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
TO
NDV
NDU
NDU
LP
D
1000
1000
1000
1800
95
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
Call TI
( LM185BH ~
LM185BH)
TO
TBD
Call TI
( LM185H2.5 ~
LM185H2.5)
LM185H-2.5/NOPB
LM285BXZ/NOPB
LM285BYM/NOPB
LM285BYMX/NOPB
LM285BYZ/NOPB
LM285M/NOPB
LM285MX/NOPB
LM285Z/NOPB
LM385BM
TO
Green (RoHS
& no Sb/Br)
POST-PLATE
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
Level-1-NA-UNLIM
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Call TI
( LM185H2.5 ~
LM185H2.5)
TO-92
SOIC
SOIC
TO-92
SOIC
SOIC
TO-92
SOIC
SOIC
SOIC
TO-92
TO-92
TO-92
Green (RoHS
& no Sb/Br)
LM285
BXZ
Green (RoHS
& no Sb/Br)
LM285
BYM
D
2500
1800
95
Green (RoHS
& no Sb/Br)
LM285
BYM
LP
D
Green (RoHS
& no Sb/Br)
LM285
BYZ
Green (RoHS
& no Sb/Br)
LM285
M
D
2500
1800
95
Green (RoHS
& no Sb/Br)
LM285
M
LP
D
Green (RoHS
& no Sb/Br)
LM285
Z
TBD
LM385
BM
LM385BM/NOPB
LM385BMX/NOPB
LM385BXZ/NOPB
LM385BYZ/NOPB
LM385BZ/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
0 to 70
LM385
BM
D
2500
1800
1800
1800
Green (RoHS
& no Sb/Br)
0 to 70
LM385
BM
LP
LP
LP
Green (RoHS
& no Sb/Br)
0 to 70
LM385
BXZ
Green (RoHS
& no Sb/Br)
0 to 70
LM385
BYZ
Green (RoHS
& no Sb/Br)
0 to 70
LM385
BZ
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM385M
NRND
SOIC
SOIC
SOIC
SOIC
TO-92
D
8
8
8
8
3
95
TBD
Call TI
CU SN
Call TI
CU SN
CU SN
Call TI
LM385
M
LM385M/NOPB
LM385MX
ACTIVE
NRND
D
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
0 to 70
LM385
M
2500
2500
1800
TBD
0 to 70
LM385
M
LM385MX/NOPB
LM385Z/NOPB
ACTIVE
ACTIVE
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
LM385
M
LP
Green (RoHS
& no Sb/Br)
0 to 70
LM385
Z
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM285BYMX/NOPB
LM285MX/NOPB
LM385BMX/NOPB
LM385MX
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
8
8
8
8
8
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
6.5
6.5
6.5
6.5
6.5
5.4
5.4
5.4
5.4
5.4
2.0
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
LM385MX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM285BYMX/NOPB
LM285MX/NOPB
LM385BMX/NOPB
LM385MX
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
8
8
8
8
8
2500
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
LM385MX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NDU0002A
H02A (Rev F)
www.ti.com
MECHANICAL DATA
NDV0003H
H03H (Rev F)
www.ti.com
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