LM4040C25-EP [TI]
PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE; 精密微功耗并联型电压基准
| 型号： | LM4040C25-EP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE |
| 文件： | 总12页 (文件大小：569K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM4040-EP
www.ti.com
SLOS746A –SEPTEMBER 2011–REVISED SEPTEMBER 2011
PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
Check for Samples: LM4040-EP
1
FEATURES
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
Fixed Output Voltage of 2.5 V
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Tight Output Tolerances and Low Temperature
Coefficient
–
Max 0.65%, 100 ppm/°C
•
•
Low Output Noise: 35 μVRMS Typ
Available in Military (–55°C/125°C)
Temperature Range(1)
Wide Operating Current Range: 45 μA Typ to
15 mA
•
•
•
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
•
Stable With All Capacitive Loads; No Output
Capacitor Required
DBZ (SOT-23) PACKAGE
(TOP VIEW)
APPLICATIONS
•
•
•
•
•
•
•
•
Data-Acquisition Systems
Power Supplies and Power-Supply Monitors
Instrumentation and Test Equipment
Process Controls
1
CATHODE
3*
2
ANODE
Precision Audio
* Pin 3 is attached to substrate and must be
connected to ANODE or left open.
Automotive Electronics
Energy Management
Battery-Powered Equipment
(1) Custom temperature ranges available
DESCRIPTION/ORDERING INFORMATION
The LM4040 series of shunt voltage references are versatile, easy-to-use references that cater to a vast array of
applications. The 2-pin fixed-output device requires no external capacitors for operation and is stable with all
capacitive loads. Additionally, the reference offers low dynamic impedance, low noise, and low temperature
coefficient to ensure a stable output voltage over a wide range of operating currents and temperatures. The
LM4040 uses fuse and Zener-zap reverse breakdown voltage trim during wafer sort to offer an output voltage
tolerance of 0.65%.
Packaged in a space-saving SOT-23-3 package and requiring a minimum current of 45 μA (typ), the LM4040
also is ideal for portable applications. The LM4040C25 is characterized for operation over an ambient
temperature range of –55°C to 125°C.
ORDERING INFORMATION(1)
DEVICE
GRADE
ORDERABLE
PART NUMBER
TOP-SIDE
TA
VKA
PACKAGE
MARKING(2)
0.65% initial
accuracy
and
100 ppm/°C
temperature
coefficient
–55°C to 125°C
2.5 V
SOT-23-3 (DBZ)
Reel of 250
LM4040C25MDBZTEP
SAGU
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4040-EP
SLOS746A –SEPTEMBER 2011–REVISED SEPTEMBER 2011
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
CATHODE
+
_
ANODE
Absolute Maximum Ratings(1)
over free-air temperature range (unless otherwise noted)
MIN
MAX
25
UNIT
mA
°C
IZ
Continuous cathode current
–10
TJ
Operating virtual junction temperature
Storage temperature range
150
150
Tstg
–65
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
LM4040
THERMAL METRIC(1)
DBZ
3 PINS
320.8
98.2
UNITS
θJA
θJC
θJB
ψJT
ψJB
Junction-to-ambient thermal resistance(2)
Junction-to-case thermal resistance
Junction-to-board thermal resistance(3)
Junction-to-top characterization parameter(4)
Junction-to-board characterization parameter(5)
53.3
°C/W
3.3
51.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
2
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Copyright © 2011, Texas Instruments Incorporated
LM4040-EP
www.ti.com
SLOS746A –SEPTEMBER 2011–REVISED SEPTEMBER 2011
Recommended Operating Conditions
MIN
MAX
15
UNIT
mA
(1)
IZ
Cathode current
See
TA
Free-air temperature
–55
125
°C
(1) See parametric tables
Electrical Characteristics
at extended temperature range, full-range TA = –55°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IZ = 100 μA
TA
25°C
MIN
TYP
MAX
UNIT
VZ
Reverse breakdown voltage
2.5
V
25°C
–16
–42
16
42
75
82
Reverse breakdown voltage
tolerance
ΔVZ
IZ = 100 μA
mV
Full range
25°C
45
IZ,min
Minimum cathode current
μA
Full range
25°C
IZ = 10 mA
IZ = 1 mA
±20
±15
25°C
Average temperature coefficient of
reverse breakdown voltage
αVZ
ppm/°C
Full range
25°C
±100
IZ = 100 μA
±15
25°C
0.3
0.8
1.1
6
I
Z,min < IZ < 1 mA
DVZ
DIZ
Full range
25°C
Reverse breakdown voltage change
with cathode current change
mV
2.5
1 mA < IZ < 15 mA
Full range
9
IZ = 1 mA, f = 120 Hz,
IAC = 0.1 IZ
ZZ
eN
Reverse dynamic impedance
Wideband noise
25°C
25°C
0.3
35
Ω
IZ = 100 μA,
10 Hz ≤ f ≤ 10 kHz
μVRMS
t = 1000 h,
TA = 25°C ± 0.1°C,
IZ = 100 μA
Long-term stability of reverse
breakdown voltage
120
ppm
%
VHYST
Thermal hysteresis(1)
ΔTA = –55°C to 125°C
0.08
(1) Thermal hysteresis is defined as VZ,25°C (after cycling to –55°C) – VZ,25°C (after cycling to 125°C).
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
LM4040-EP
SLOS746A –SEPTEMBER 2011–REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
1000
100
10
0.2
0.15
0.1
IZ = 150 µA
VZ = 2.5 V
No Capacitor
0.05
0
1 µF
Tantanlum
Capacitor
-0.05
-0.1
-0.15
-0.2
V
= 2.5 V
= 150 µA
Z
1
I
Z
T = 25°C
J
I
= 0.1 I
Z,AC
Z
X
C
0.1
100
-55 -35 -15
5
25 45 65 85 105 125
1k
10k
100k
1M
Temperature (°C)
Frequency (Hz)
Figure 1. Change in VZ vs Change in Temperature
1000
Figure 2. Output Impedance vs Frequency
120
100
80
60
40
20
0
V
Z
= 2.5 V
No Capacitor
T = 25°C
J
100
10
1
V
= 2.5 V
= 1 mA
Z
1-µF
Tantanlum
Capacitor
I
Z
T = 25°C
J
I
= 0.1 I
Z
Z,AC
X
C
0.1
0.0
0
1.0
1
1.5
1.5
2.0
2
3.0
3
0.5
2.5
100
1k
10k
100k
1M
Frequency (Hz)
V , Reverse Voltage (V)
Z
Figure 3. Output Impedance vs Frequency
Figure 4. Cathode Current vs Reverse Voltage
10
6
4
6
5
V
= 2.5 V
= 200 µA
Z
I
Z
V
= 2.5 V
Z
T = 25°C
J
2
V
V
IN
T = 25°C
J
4
R
= 30 kΩ
0
S
3
−2
−4
1
2
Z
−6
1
−8
0
−10
−1
−10
−12
0.1
0
10 20 30 40 50 60 70 80 90
Response Time (µs)
1
10
100
1k
10k
100k
Frequency (Hz)
Figure 5. Noise Voltage vs Frequency
Figure 6. Start-Up Characteristics
4
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Copyright © 2011, Texas Instruments Incorporated
LM4040-EP
www.ti.com
SLOS746A –SEPTEMBER 2011–REVISED SEPTEMBER 2011
APPLICATION INFORMATION
Start-Up Characteristics
R
S
V
IN
LM4040
V
Z
1-Hz Rate
Figure 7. Test Circuit
Output Capacitor
The LM4040 does not require an output capacitor across cathode and anode for stability. However, if an output
bypass capacitor is desired, the LM4040 is designed to be stable with all capacitive loads.
SOT-23 Connections
There is a parasitic Schottky diode connected between pins 2 and 3 of the SOT-23 packaged device. Thus, pin 3
of the SOT-23 package must be left floating or connected to pin 2.
Cathode and Load Currents
In a typical shunt-regulator configuration (see Figure 8), an external resistor, RS, is connected between the
supply and the cathode of the LM4040. RS must be set properly, as it sets the total current available to supply
the load (IL) and bias the LM4040 (IZ). In all cases, IZ must stay within a specified range for proper operation of
the reference. Taking into consideration one extreme in the variation of the load and supply voltage (maximum IL
and minimum VS), RS must be small enough to supply the minimum IZ required for operation of the regulator, as
given by data-sheet parameters. At the other extreme, maximum VS and minimum IL, RS must be large enough
to limit IZ to less than its maximum-rated value of 15 mA.
RS is calculated according to Equation 1:
ǒ
Ǔ
VS * VZ
RS +
(
)
IL ) IZ
(1)
V
S
R
S
I + I
Z L
I
L
V
Z
I
Z
LM4040
Figure 8. Shunt Regulator
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
LM4040C25MDBZTEP
V62/11615-01XB
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
250
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM4040C25-EP :
Catalog: LM4040C25
•
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2011
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Sep-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4040C25MDBZTEP SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Sep-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBZ
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
LM4040C25MDBZTEP
3
250
Pack Materials-Page 2
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