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LM4120AIM5-3.0/NOPB [TI]

具有使能引脚的 1.2V 和可调节、0.2%、50ppm/°C 温漂、精密串联电压基准 | DBV | 5 | -40 to 85;
LM4120AIM5-3.0/NOPB
型号： LM4120AIM5-3.0/NOPB
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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具有使能引脚的 1.2V 和可调节、0.2%、50ppm/°C 温漂、精密串联电压基准 | DBV | 5 | -40 to 85

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LM4120  
SNVS049F –FEBRUARY 2000–REVISED MARCH 2016  
LM4120 Precision Micropower Low Dropout Voltage Reference  
1 Features  
3 Description  
The LM4120 device is a precision low-power, low  
dropout bandgap voltage reference with up to 5-mA  
output current source and sink capability.  
1
•
•
•
•
•
•
•
•
Small SOT23-5 Package  
Low Dropout Voltage: 120 mV Typical at 1 mA  
High Output Voltage Accuracy: 0.2%  
Source and Sink Current Output: ±5 mA  
Supply Current: 160 μA Typical  
Low Temperature Coefficient: 50 ppm/°C  
Enable Pin  
This series reference operates with input voltages as  
low as 2 V and up to 12 V, consuming 160-µA  
(typical) supply current. In power-down mode, device  
current drops to less than 2 μA.  
The LM4120 comes in two grades (A and Standard)  
and seven voltage options for greater flexibility. The  
best grade devices (A) have an initial accuracy of  
0.2%, while the standard have an initial accuracy of  
0.5%, both with  
50 ppm/°C ensured from −40°C to 125°C.  
Fixed Output Voltages: 1.8, 2.048, 2.5, 3, 3.3,  
4.096, and 5 V  
•
•
Industrial Temperature Range: −40°C to 85°C  
a
temperature coefficient of  
(For Extended Temperature Range, −40°C to  
125°C, Contact TI)  
The very low dropout voltage, low supply current, and  
power-down capability of the LM4120 make this  
product an ideal choice for battery-powered and  
portable applications.  
2 Applications  
•
•
•
•
•
•
•
•
•
•
Portable, Battery-Powered Equipment  
Instrumentation and Process Control  
Automotive and Industrial  
Test Equipment  
The device performance is ensured over the industrial  
temperature range (−40°C to 85°C), while certain  
specifications are ensured over the extended  
temperature range (−40°C to 125°C). Contact TI for  
full specifications over the extended temperature  
range. The LM4120 is available in a standard 5-pin  
SOT-23 package.  
Data Acquisition Systems  
Precision Regulators  
Battery Chargers  
Base Stations  
Device Information(1)  
Communications  
PART NUMBER  
LM4120  
PACKAGE  
BODY SIZE (NOM)  
Medical Equipment  
SOT-23 (5)  
1.60 mm × 2.90 mm  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
Functional Block Diagram  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
LM4120  
SNVS049F –FEBRUARY 2000–REVISED MARCH 2016  
www.ti.com  
Table of Contents  
7.3 Feature Description................................................. 10  
7.4 Device Functional Modes........................................ 10  
Application and Implementation ........................ 11  
8.1 Application Information............................................ 11  
8.2 Typical Application .................................................. 14  
Power Supply Recommendations...................... 15  
1
2
3
4
5
6
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 3  
6.1 Absolute Maximum Ratings ...................................... 3  
6.2 ESD Ratings.............................................................. 3  
6.3 Recommended Operating Conditions ...................... 4  
6.4 Thermal Information.................................................. 4  
6.5 Electrical Characteristics........................................... 4  
6.6 Typical Characteristics.............................................. 7  
Detailed Description ............................................ 10  
7.1 Overview ................................................................. 10  
7.2 Functional Block Diagram ....................................... 10  
8
9
10 Layout................................................................... 16  
10.1 Layout Guidelines ................................................. 16  
10.2 Layout Example ................................................... 16  
11 Device and Documentation Support ................. 17  
11.1 Community Resources.......................................... 17  
11.2 Trademarks........................................................... 17  
11.3 Electrostatic Discharge Caution............................ 17  
11.4 Glossary................................................................ 17  
7
12 Mechanical, Packaging, and Orderable  
Information ........................................................... 17  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision E (February 2016) to Revision F  
Page  
•
Added updated Layout Example ......................................................................................................................................... 16  
Changes from Revision D (July 2015) to Revision E  
Page  
•
Added updated Layout Example .......................................................................................................................................... 16  
Changes from Revision C (April 2013) to Revision D  
Page  
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation  
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and  
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1  
Changes from Revision B (April 2013) to Revision C  
Page  
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 14  
2
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LM4120  
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SNVS049F –FEBRUARY 2000–REVISED MARCH 2016  
5 Pin Configuration and Functions  
DBV Package  
5-Pin SOT-23  
Top View  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NAME  
Enable  
GND  
REF  
NO.  
3
I
Pulled to input for normal operation. Forcing this pin to ground will turn off the output.  
Negative supply or ground connection  
REF pin. This pin must be left unconnected.  
Positive supply  
2
—
—
I
1
VIN  
4
VOUT  
5
O
Reference output  
6 Specifications  
6.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)  
(1)  
MIN  
MAX  
14  
UNIT  
Maximum voltage on input or enable pins  
Output short-circuit duraion  
–0.3  
V
Indefinite  
350  
(2)  
Power dissipation (TA = 25°C)  
mW  
°C  
Soldering, (10 sec.)  
260  
Lead temperature  
Vapor Phase (60 sec.)  
Infrared (15 sec.)  
215  
°C  
220  
°C  
Storage temperature, Tstg  
–65  
150  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) Without PCB copper enhancements. The maximum power dissipation must be derated at elevated temperatures and is limited by TJMAX  
(maximum junction temperature), RθJA (junction-to-ambient thermal resistance) and TA (ambient temperature). The maximum power  
dissipation at any temperature is: PDissMAX = (TJMAX – TA) / RθJA up to the value listed in the Absolute Maximum Ratings.  
6.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±2000  
Charged device model (CDM), per JEDEC specification JESD22-  
C101(2)  
V(ESD)  
Electrostatic discharge  
±750  
±200  
V
Machine Model  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
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SNVS049F –FEBRUARY 2000–REVISED MARCH 2016  
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6.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–40  
–40  
NOM  
MAX  
85  
UNIT  
°C  
Ambient temperature  
Junction temperature  
125  
°C  
6.4 Thermal Information  
LM4120  
THERMAL METRIC(1)  
DBV [SOT-23]  
5 PINS  
170.4  
UNIT  
RθJA  
RθJC(top)  
RθJB  
ψJT  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
123.9  
30.4  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
17.2  
ψJB  
29.9  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953.  
6.5 Electrical Characteristics  
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.  
(1)  
(2)  
(1)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
1.8 V, 2.048 V, AND 2.5 V  
Output voltage initial  
accuracy  
LM4120A-1.800  
LM4120A-2.048  
LM4120A-2.500  
±0.2%  
±0.5%  
VOUT  
LM4120-1.800  
LM4120-2.048  
LM4120-2.500  
TCVOUT/°C  
Temperature coefficient  
–40°C ≤ TA ≤ +125°C  
14  
50 ppm/°c  
0.0007  
0.008  
ΔVOUT/ΔVIN  
Line regulation  
3.3 V ≤ VIN ≤ 12 V  
0 mA ≤ ILOAD ≤ 1 mA  
1 mA ≤ ILOAD ≤ 5 mA  
%/V  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
0.01  
0.08  
0.17  
0.04  
0.1  
0.03  
0.01  
ΔVOUT/ΔILOAD Load regulation  
%/mA  
–1 mA ≤ ILOAD ≤ 0 mA  
–5 mA ≤ ILOAD ≤ −1 mA  
0.04  
0.01  
45  
0.12  
65  
80  
ILOAD = 0 mA  
ILOAD = 1 mA  
ILOAD = 5 mA  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
120  
180  
150  
180  
210  
250  
(3)  
VIN−VOUT  
Dropout voltage  
mV  
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical  
Quality Control (SQC) methods. The limits are used to calculate TI's Averaging Outgoing Quality Level (AOQL).  
(2) Typical numbers are at 25°C and represent the most likely parametric norm.  
(3) Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes ≤ 1% from VOUT at VIN = 3.3 V for 1.8 V, 2 V,  
2.5 V, and VOUT + 1 V for others. For 1.8-V option, dropout voltage is not ensured over temperature. A parasitic diode exists between  
input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN  
.
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Electrical Characteristics (continued)  
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.  
(1)  
(2)  
(1)  
PARAMETER  
TEST CONDITIONS  
0.1 Hz to 10 Hz  
MIN  
TYP  
MAX  
UNIT  
20  
36  
VN  
Output(4)  
µVPP  
10 Hz to 10 kHz  
160  
250  
275  
1
IS  
Supply current  
µA  
µA  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
Enable = 0.4 V  
–40°C ≤ TJ ≤ 85°C  
Enable = 0.2 V  
Power-down supply  
current  
ISS  
2
2.4  
0.4  
7
VH  
VL  
Logic high input voltage  
Logic low input voltage  
V
V
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
2.4  
0.2  
15  
IH  
IL  
Logic high input current  
Logic low input current  
µA  
µA  
0.1  
15  
VIN = 3.3 V, VOUT = 0  
VIN = 12 V, VOUT = 0  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
6
6
30  
30  
ISC  
Short circuit current  
mA  
17  
(5)  
Hyst  
Thermal hysteresis  
–40°C ≤ TA ≤ 125°C  
0.5  
mV/V  
ppm  
(6)  
ΔVOUT  
Long term stability  
1000 hrs @ 25°C  
100  
3 V, 3.3 V, 4.096 V, AND 5 V  
Output voltage initial  
accuracy  
LM4120A-3.000  
LM4120A-3.300  
LM4120A-4.096  
LM4120A-5.000  
±0.2%  
±0.5%  
VOUT  
LM4120-3.000  
LM4120-3.300  
LM4120-4.096  
LM4120-5.000  
TCVOUT/°C  
Temperature coefficient  
–40°C ≤ TA ≤ 125°C  
14  
50 ppm/°c  
0.0007  
0.008  
ΔVOUT/ΔVIN  
Line regulation  
(VOUT + 1 V) ≤ VIN ≤ 12 V  
%/V  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
0.01  
0.08  
0.17  
0.04  
0.1  
0.03  
0.01  
0 mA ≤ ILOAD ≤ 1 mA  
1 mA ≤ ILOAD ≤ 5 mA  
ΔVOUT/ΔILOAD Load regulation  
%/mA  
–1 mA ≤ ILOAD ≤ 0 mA  
–5 mA ≤ ILOAD ≤ –1 mA  
0.04  
0.01  
45  
0.12  
65  
80  
ILOAD = 0 mA  
ILOAD = 1 mA  
ILOAD = 5 mA  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
120  
180  
150  
180  
210  
250  
(3)  
VIN−VOUT  
Dropout voltage  
mV  
(4) Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8 V) / 1.8) × VOUT  
.
VN (2.5 V) = (36 μVPP / 1.8) × 2.5 = 46 μVPP  
.
(5) Thermal hysteresis is defined as the change in 25°C output voltage before and after exposing the device to temperature extremes.  
(6) Long term stability is change in VREF at 25°C measured continuously during 1000 hours.  
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Electrical Characteristics (continued)  
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.  
(1)  
(2)  
(1)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
3 V, 3.3 V, 4.096 V, AND 5 V (continued)  
0.1 Hz to 10 Hz  
20  
36  
VN  
Output noise voltage(4)  
µVPP  
µA  
10 Hz to 10 kHz  
160  
250  
275  
1
IS  
Supply current  
–40°C ≤ TA ≤ 85°C  
Enable = 0.4 V  
–40°C ≤ TJ ≤ 85°C  
Enable = 0.2 V  
Power-down supply  
current  
ISS  
µA  
–40°C ≤ TA ≤ 85°C  
2
2.4  
0.4  
7
VH  
VL  
Logic high input voltage  
Logic low input voltage  
V
V
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
2.4  
0.2  
15  
IH  
IL  
Logic high input current  
Logic low input current  
µA  
µA  
0.1  
15  
VOUT = 0  
–40°C ≤ TA ≤ 85°C  
–40°C ≤ TA ≤ 85°C  
6
6
30  
30  
ISC  
Short circuit current  
mA  
17  
VIN = 12 V, VOUT = 0  
(5)  
Hyst  
Thermal hysteresis  
–40°C ≤ TA ≤ 125°C  
0.5  
mV/V  
ppm  
(6)  
ΔVOUT  
Long term stability  
1000 hours @ 25°C  
100  
6
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6.6 Typical Characteristics  
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN  
Figure 1. Long Term Drift  
Figure 2. Typical Temperature Drift  
Figure 3. Short Circuit Current vs Temperature  
Figure 4. Dropout Voltage vs Output Error  
Figure 5. Dropout Voltage vs Load Current  
Figure 6. Line Regulation  
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Typical Characteristics (continued)  
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN  
Figure 7. Load Regulation  
Figure 8. GND Pin Current  
Figure 10. GND Pin Current vs Load  
Figure 9. GND Pin Current at No Load vs Temperature  
Figure 11. 0.1-Hz to 10-Hz Output Noise  
Figure 12. Output Impedance vs Frequency  
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Typical Characteristics (continued)  
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN  
Figure 13. PSRR vs Frequency  
Figure 14. Enable Response  
Figure 15. Load Step Response  
Figure 16. Line Step Response  
Figure 18. Enable Pin Current  
Figure 17. Thermal Hysteresis  
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7 Detailed Description  
7.1 Overview  
The LM4120 device is a precision bandgap voltage reference available in seven different voltage options with up  
to 5-mA current source and sink capability. This series reference can operate with input voltages from 2 V to  
12 V while consuming 160-µA (typical) supply current. In power-down mode, device current drops to less than  
2 μA. The LM4120 is available in two grades, A and Standard.  
The best grade devices (A) have an initial accuracy of 0.2% with a TEMPCO of 50 ppm/°C ensured from −40°C  
to 125°C.  
7.2 Functional Block Diagram  
7.3 Feature Description  
7.3.1 Enable  
The ENABLE analog input pin with limited hysteresis generally requires 6 µA (typical) of current to start up the  
part. During normal operation, the Enable pin must be connected to the VIN pin. There is a minimum slew rate  
on this pin of about 0.003 V/μs to prevent glitches on the output. All of these conditions can easily be met with  
ordinary CMOS or TTL logic. The Enable pin can also be used to remotely operate the LM4120 by pulling up the  
Enable pin voltage to the input voltage level.  
When remotely shutting down the LM4120, the Enable pin must be pulled down to the ground. Floating this pin is  
not recommended.  
7.3.2 Reference  
The REF pin must remain unconnected in all cases. The reference pin is sensitive to noise, and capacitive  
loading. Therefore, during the PCB layout care must be taken to keep this pin isolated as much as possible.  
7.4 Device Functional Modes  
Table 1 describes the functional modes of the LM4120.  
Table 1. Enable Pin Mode Summary  
ENABLE PIN CONNECTION  
EN = VIN  
LOGIC STATE  
DESCRIPTION  
1
0
Normal Operation. LM4120 starts up.  
LM4120 in shutdown mode  
EN = GND  
10  
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8 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
The standard application circuit for the LM4120 is shown in Figure 29. The device is designed to be stable with  
ceramic output capacitors in the range of 0.022 µF to 0.047 µF. The minimum required output capacitor is  
0.022 µF. These capacitors typically have an ESR of about 0.1 Ω to 0.5 Ω. Smaller ESR can be tolerated, but  
larger ESR cannot be tolerated. The output capacitor can be increased to improve load transient response, up to  
about 1 µF. However, values above 0.047 µF must be tantalum. With tantalum capacitors in the 1-µF range, a  
small capacitor between the output and the reference pin is required. This capacitor will typically be in the 50-pF  
range. Care must be taken when using output capacitors of 1 µF or larger. These applications must be  
thoroughly tested over temperature, line, and load.  
An input capacitor is typically not required. However, a 0.1-µF ceramic can be used to help prevent line  
transients from entering the LM4120. Larger input capacitors must be tantalum or aluminum.  
The reference pin is sensitive to noise, and capacitive loading. Therefore, the PCB layout must isolate this pin as  
much as possible.  
The enable pin is an analog input with very little hysteresis. About 6 µA into this pin is required to turn the part  
on, and it must be taken close to GND to turn the part off (see Electrical Characteristics for thresholds). If the  
shutdown feature is not required, then this pin can safely be connected directly to the input supply.  
Figure 19. Voltage Reference With Negative Output Circuit  
Figure 20. Precision High-Current Low-Dropout Regulator Circuit  
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Application Information (continued)  
Figure 21. Precision High-Current Negative Voltage Regulator Circuit  
Figure 22. Voltage Reference With Complimentary Output Circuit  
Figure 23. Precision High-Current Low-Dropout Regulator Circuit  
12  
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Application Information (continued)  
Figure 24. Stacking Voltage References Circuit  
Figure 25. Precision Voltage Reference With Force and Sense Output Circuit  
Figure 26. Programmable Current Source Circuit  
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Application Information (continued)  
Figure 27. Precision Regulator With Current Limiting Circuit  
Figure 28. Power Supply Splitter Circuit  
8.2 Typical Application  
Figure 29. Standard Application Circuit  
8.2.1 Design Requirements  
For this design example, use the parameters listed in Table 2 as the input parameters.  
Table 2. Design Parameters  
PARAMETER  
Output Voltage VOUT  
Input Voltage Range VIN  
Load Current  
EXAMPLE VALUE  
1.8 V, 2.048 V, 2.5 V, 3 V, 3.3 V, 4.096 V, 5 V  
VOUT 120 mV to 12 V  
1 mA (typical)  
14  
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8.2.2 Detailed Design Procedure  
8.2.2.1 Input Capacitors  
Although not always required, an input capacitor is recommended. A supply bypass capacitor on the input  
assures that the reference is working from a source with low impedance, which improves stability. A bypass  
capacitor can also improve transient response by providing a reservoir of stored energy that the reference can  
utilize in case where the load current demand suddenly increases. The value used for CIN may be used without  
limit.  
8.2.2.2 Output Capacitors  
The LM4120 may require a 0.022-μF to 1-μF output capacitor for loop stability (compensation) as well as  
transient response. During the sudden changes in load current demand, the output capacitor must source or sink  
current during the time it takes the control loop of the LM4120 to respond.  
8.2.3 Application Curves  
Figure 30. Start-Up Response  
Figure 31. Load Step Response  
9 Power Supply Recommendations  
Noise on the power-supply input can effect the output noise, but can be reduced by using an optional bypass  
capacitor between the input pin and the ground. A ceramic input capacitor more than 0.1 µF or higher can be  
used for that purpose.  
Copyright © 2000–2016, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Links: LM4120  
LM4120  
SNVS049F –FEBRUARY 2000–REVISED MARCH 2016  
www.ti.com  
10 Layout  
10.1 Layout Guidelines  
The mechanical stress due to PC board mounting can cause the output voltage to shift from its initial value. The  
center of a PC board generally has the highest mechanical and thermal expansion stress. Mounting the device  
near the edges or the corners of the board where mechanical stress is at its minimum. References in SOT  
packages are generally less prone to assembly stress than devices in Small Outline (SOIC) package.  
A mechanical isolation of the device by creating an island by cutting a U shape slot (U - SLOT) on the PCB while  
mounting the device helps in reducing the impact of the PC board stresses on the output voltage of the  
reference. This approach would also provide some thermal isolation from the rest of the circuit.  
Figure 32 shows a recommended printed board layout for LM4120 along with an in-set diagram. The in-set  
diagram exhibits a slot cut on three sides of the reference IC, which provides a relief to the IC from external PCB  
stress.  
10.2 Layout Example  
PCB Top View  
VIN  
VOUT  
PCB Length  
LM4120  
PCB Side View  
STRESS  
STRESS  
REF  
U - SLOT  
REF GND EN  
LM4120  
VOUT  
U - SLOT  
PCB Length  
GND  
Set COUT  
close to VOUT  
and GND  
EN  
REF  
Set CIN  
close to VIN  
and GND  
CIN  
COUT  
LM4120  
VOUT  
VIN  
Figure 32. Typical Layout Example With LM4120  
16  
Submit Documentation Feedback  
Copyright © 2000–2016, Texas Instruments Incorporated  
Product Folder Links: LM4120  
 
LM4120  
www.ti.com  
SNVS049F –FEBRUARY 2000–REVISED MARCH 2016  
11 Device and Documentation Support  
11.1 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
11.2 Trademarks  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
11.3 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
11.4 Glossary  
SLYZ022 — TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
Copyright © 2000–2016, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
Product Folder Links: LM4120  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM4120AIM5-1.8/NOPB  
LM4120AIM5-2.0/NOPB  
LM4120AIM5-2.5  
ACTIVE  
ACTIVE  
NRND  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
5
5
5
1000 RoHS & Green  
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
R21A  
R14A  
R08A  
SN  
1000  
Non-RoHS  
& Green  
Call TI  
LM4120AIM5-2.5/NOPB  
LM4120AIM5-3.0  
ACTIVE  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
R08A  
R15A  
1000  
Non-RoHS  
& Green  
Call TI  
LM4120AIM5-3.0/NOPB  
LM4120AIM5-3.3  
ACTIVE  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
R15A  
R16A  
1000  
Non-RoHS  
& Green  
Call TI  
LM4120AIM5-3.3/NOPB  
LM4120AIM5-4.1/NOPB  
LM4120AIM5-5.0  
ACTIVE  
ACTIVE  
NRND  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
5
5
5
1000 RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
R16A  
R17A  
R18A  
1000 RoHS & Green  
1000  
Non-RoHS  
& Green  
Call TI  
LM4120AIM5-5.0/NOPB  
LM4120AIM5X-1.8/NOPB  
LM4120AIM5X-2.0/NOPB  
LM4120AIM5X-2.5/NOPB  
LM4120AIM5X-3.0/NOPB  
LM4120AIM5X-3.3/NOPB  
LM4120AIM5X-4.1  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
1000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
R18A  
R21A  
R14A  
R08A  
R15A  
R16A  
R17A  
SN  
SN  
SN  
SN  
3000  
Non-RoHS  
& Green  
Call TI  
LM4120AIM5X-4.1/NOPB  
LM4120AIM5X-5.0/NOPB  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000 RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
R17A  
R18A  
3000 RoHS & Green  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2022  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM4120IM5-1.8/NOPB  
LM4120IM5-2.0/NOPB  
LM4120IM5-2.5/NOPB  
LM4120IM5-3.0  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
1000 RoHS & Green  
1000 RoHS & Green  
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
R21B  
R14B  
R08B  
R15B  
SN  
SN  
1000  
Non-RoHS  
& Green  
Call TI  
LM4120IM5-3.0/NOPB  
LM4120IM5-3.3  
ACTIVE  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
R15B  
R16B  
1000  
Non-RoHS  
& Green  
Call TI  
LM4120IM5-3.3/NOPB  
LM4120IM5-4.1/NOPB  
LM4120IM5-5.0/NOPB  
LM4120IM5X-1.8/NOPB  
LM4120IM5X-2.0/NOPB  
LM4120IM5X-2.5/NOPB  
LM4120IM5X-3.0/NOPB  
LM4120IM5X-3.3/NOPB  
LM4120IM5X-4.1/NOPB  
LM4120IM5X-5.0/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
1000 RoHS & Green  
1000 RoHS & Green  
1000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
R16B  
R17B  
R18B  
R21B  
R14B  
R08B  
R15B  
R16B  
R17B  
R18B  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2022  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM4120AIM5-1.8/NOPB SOT-23  
LM4120AIM5-2.0/NOPB SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LM4120AIM5-2.5  
LM4120AIM5-2.5/NOPB SOT-23  
LM4120AIM5-3.0 SOT-23  
LM4120AIM5-3.0/NOPB SOT-23  
LM4120AIM5-3.3 SOT-23  
SOT-23  
LM4120AIM5-3.3/NOPB SOT-23  
LM4120AIM5-4.1/NOPB SOT-23  
LM4120AIM5-5.0  
SOT-23  
LM4120AIM5-5.0/NOPB SOT-23  
LM4120AIM5X-1.8/NOPB SOT-23  
LM4120AIM5X-2.0/NOPB SOT-23  
LM4120AIM5X-2.5/NOPB SOT-23  
LM4120AIM5X-3.0/NOPB SOT-23  
LM4120AIM5X-3.3/NOPB SOT-23  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM4120AIM5X-4.1  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000  
3000  
3000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LM4120AIM5X-4.1/NOPB SOT-23  
LM4120AIM5X-5.0/NOPB SOT-23  
LM4120IM5-1.8/NOPB  
LM4120IM5-2.0/NOPB  
LM4120IM5-2.5/NOPB  
LM4120IM5-3.0  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
LM4120IM5-3.0/NOPB  
LM4120IM5-3.3  
LM4120IM5-3.3/NOPB  
LM4120IM5-4.1/NOPB  
LM4120IM5-5.0/NOPB  
LM4120IM5X-1.8/NOPB SOT-23  
LM4120IM5X-2.0/NOPB SOT-23  
LM4120IM5X-2.5/NOPB SOT-23  
LM4120IM5X-3.0/NOPB SOT-23  
LM4120IM5X-3.3/NOPB SOT-23  
LM4120IM5X-4.1/NOPB SOT-23  
LM4120IM5X-5.0/NOPB SOT-23  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM4120AIM5-1.8/NOPB  
LM4120AIM5-2.0/NOPB  
LM4120AIM5-2.5  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LM4120AIM5-2.5/NOPB  
LM4120AIM5-3.0  
LM4120AIM5-3.0/NOPB  
LM4120AIM5-3.3  
LM4120AIM5-3.3/NOPB  
LM4120AIM5-4.1/NOPB  
LM4120AIM5-5.0  
LM4120AIM5-5.0/NOPB  
LM4120AIM5X-1.8/NOPB  
LM4120AIM5X-2.0/NOPB  
LM4120AIM5X-2.5/NOPB  
LM4120AIM5X-3.0/NOPB  
LM4120AIM5X-3.3/NOPB  
LM4120AIM5X-4.1  
LM4120AIM5X-4.1/NOPB  
Pack Materials-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM4120AIM5X-5.0/NOPB  
LM4120IM5-1.8/NOPB  
LM4120IM5-2.0/NOPB  
LM4120IM5-2.5/NOPB  
LM4120IM5-3.0  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LM4120IM5-3.0/NOPB  
LM4120IM5-3.3  
LM4120IM5-3.3/NOPB  
LM4120IM5-4.1/NOPB  
LM4120IM5-5.0/NOPB  
LM4120IM5X-1.8/NOPB  
LM4120IM5X-2.0/NOPB  
LM4120IM5X-2.5/NOPB  
LM4120IM5X-3.0/NOPB  
LM4120IM5X-3.3/NOPB  
LM4120IM5X-4.1/NOPB  
LM4120IM5X-5.0/NOPB  
Pack Materials-Page 4  
PACKAGE OUTLINE  
DBV0005A  
SOT-23 - 1.45 mm max height  
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR  
C
3.0  
2.6  
0.1 C  
1.75  
1.45  
1.45  
0.90  
B
A
PIN 1  
INDEX AREA  
1
2
5
(0.1)  
2X 0.95  
1.9  
3.05  
2.75  
1.9  
(0.15)  
4
3
0.5  
5X  
0.3  
0.15  
0.00  
(1.1)  
TYP  
0.2  
C A B  
NOTE 5  
0.25  
GAGE PLANE  
0.22  
0.08  
TYP  
8
0
TYP  
0.6  
0.3  
TYP  
SEATING PLANE  
4214839/G 03/2023  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Refernce JEDEC MO-178.  
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed 0.25 mm per side.  
5. Support pin may differ or may not be present.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DBV0005A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
5X (1.1)  
1
5
5X (0.6)  
SYMM  
(1.9)  
2
3
2X (0.95)  
4
(R0.05) TYP  
(2.6)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED METAL  
EXPOSED METAL  
0.07 MIN  
ARROUND  
0.07 MAX  
ARROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214839/G 03/2023  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DBV0005A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
5X (1.1)  
1
5
5X (0.6)  
SYMM  
(1.9)  
2
3
2X(0.95)  
4
(R0.05) TYP  
(2.6)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE:15X  
4214839/G 03/2023  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
TI products.  
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2023, Texas Instruments Incorporated  

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