LM4120IM5-3.3 [TI]
具有使能引脚的 1.2V 和可调节、0.2%、50ppm/°C 温漂、精密串联电压基准 | DBV | 5 | -40 to 85;型号: | LM4120IM5-3.3 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有使能引脚的 1.2V 和可调节、0.2%、50ppm/°C 温漂、精密串联电压基准 | DBV | 5 | -40 to 85 光电二极管 |
文件: | 总28页 (文件大小:1008K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LM4120
SNVS049F –FEBRUARY 2000–REVISED MARCH 2016
LM4120 Precision Micropower Low Dropout Voltage Reference
1 Features
3 Description
The LM4120 device is a precision low-power, low
dropout bandgap voltage reference with up to 5-mA
output current source and sink capability.
1
•
•
•
•
•
•
•
•
Small SOT23-5 Package
Low Dropout Voltage: 120 mV Typical at 1 mA
High Output Voltage Accuracy: 0.2%
Source and Sink Current Output: ±5 mA
Supply Current: 160 μA Typical
Low Temperature Coefficient: 50 ppm/°C
Enable Pin
This series reference operates with input voltages as
low as 2 V and up to 12 V, consuming 160-µA
(typical) supply current. In power-down mode, device
current drops to less than 2 μA.
The LM4120 comes in two grades (A and Standard)
and seven voltage options for greater flexibility. The
best grade devices (A) have an initial accuracy of
0.2%, while the standard have an initial accuracy of
0.5%, both with
50 ppm/°C ensured from −40°C to 125°C.
Fixed Output Voltages: 1.8, 2.048, 2.5, 3, 3.3,
4.096, and 5 V
•
•
Industrial Temperature Range: −40°C to 85°C
a
temperature coefficient of
(For Extended Temperature Range, −40°C to
125°C, Contact TI)
The very low dropout voltage, low supply current, and
power-down capability of the LM4120 make this
product an ideal choice for battery-powered and
portable applications.
2 Applications
•
•
•
•
•
•
•
•
•
•
Portable, Battery-Powered Equipment
Instrumentation and Process Control
Automotive and Industrial
Test Equipment
The device performance is ensured over the industrial
temperature range (−40°C to 85°C), while certain
specifications are ensured over the extended
temperature range (−40°C to 125°C). Contact TI for
full specifications over the extended temperature
range. The LM4120 is available in a standard 5-pin
SOT-23 package.
Data Acquisition Systems
Precision Regulators
Battery Chargers
Base Stations
Device Information(1)
Communications
PART NUMBER
LM4120
PACKAGE
BODY SIZE (NOM)
Medical Equipment
SOT-23 (5)
1.60 mm × 2.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM4120
SNVS049F –FEBRUARY 2000–REVISED MARCH 2016
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Table of Contents
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 10
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 14
Power Supply Recommendations...................... 15
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Typical Characteristics.............................................. 7
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
8
9
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example ................................................... 16
11 Device and Documentation Support ................. 17
11.1 Community Resources.......................................... 17
11.2 Trademarks........................................................... 17
11.3 Electrostatic Discharge Caution............................ 17
11.4 Glossary................................................................ 17
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (February 2016) to Revision F
Page
•
Added updated Layout Example ......................................................................................................................................... 16
Changes from Revision D (July 2015) to Revision E
Page
•
Added updated Layout Example .......................................................................................................................................... 16
Changes from Revision C (April 2013) to Revision D
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 14
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5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
Enable
GND
REF
NO.
3
I
Pulled to input for normal operation. Forcing this pin to ground will turn off the output.
Negative supply or ground connection
REF pin. This pin must be left unconnected.
Positive supply
2
—
—
I
1
VIN
4
VOUT
5
O
Reference output
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
14
UNIT
Maximum voltage on input or enable pins
Output short-circuit duraion
–0.3
V
Indefinite
350
(2)
Power dissipation (TA = 25°C)
mW
°C
Soldering, (10 sec.)
260
Lead temperature
Vapor Phase (60 sec.)
Infrared (15 sec.)
215
°C
220
°C
Storage temperature, Tstg
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Without PCB copper enhancements. The maximum power dissipation must be derated at elevated temperatures and is limited by TJMAX
(maximum junction temperature), RθJA (junction-to-ambient thermal resistance) and TA (ambient temperature). The maximum power
dissipation at any temperature is: PDissMAX = (TJMAX – TA) / RθJA up to the value listed in the Absolute Maximum Ratings.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-
C101(2)
V(ESD)
Electrostatic discharge
±750
±200
V
Machine Model
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
–40
–40
NOM
MAX
85
UNIT
°C
Ambient temperature
Junction temperature
125
°C
6.4 Thermal Information
LM4120
THERMAL METRIC(1)
DBV [SOT-23]
5 PINS
170.4
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
123.9
30.4
Junction-to-top characterization parameter
Junction-to-board characterization parameter
17.2
ψJB
29.9
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.
(1)
(2)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1.8 V, 2.048 V, AND 2.5 V
Output voltage initial
accuracy
LM4120A-1.800
LM4120A-2.048
LM4120A-2.500
±0.2%
±0.5%
VOUT
LM4120-1.800
LM4120-2.048
LM4120-2.500
TCVOUT/°C
Temperature coefficient
–40°C ≤ TA ≤ +125°C
14
50 ppm/°c
0.0007
0.008
ΔVOUT/ΔVIN
Line regulation
3.3 V ≤ VIN ≤ 12 V
0 mA ≤ ILOAD ≤ 1 mA
1 mA ≤ ILOAD ≤ 5 mA
%/V
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
0.01
0.08
0.17
0.04
0.1
0.03
0.01
ΔVOUT/ΔILOAD Load regulation
%/mA
–1 mA ≤ ILOAD ≤ 0 mA
–5 mA ≤ ILOAD ≤ −1 mA
0.04
0.01
45
0.12
65
80
ILOAD = 0 mA
ILOAD = 1 mA
ILOAD = 5 mA
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
120
180
150
180
210
250
(3)
VIN−VOUT
Dropout voltage
mV
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical
Quality Control (SQC) methods. The limits are used to calculate TI's Averaging Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes ≤ 1% from VOUT at VIN = 3.3 V for 1.8 V, 2 V,
2.5 V, and VOUT + 1 V for others. For 1.8-V option, dropout voltage is not ensured over temperature. A parasitic diode exists between
input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN
.
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Electrical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.
(1)
(2)
(1)
PARAMETER
TEST CONDITIONS
0.1 Hz to 10 Hz
MIN
TYP
MAX
UNIT
20
36
VN
Output(4)
µVPP
10 Hz to 10 kHz
160
250
275
1
IS
Supply current
µA
µA
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
Enable = 0.4 V
–40°C ≤ TJ ≤ 85°C
Enable = 0.2 V
Power-down supply
current
ISS
2
2.4
0.4
7
VH
VL
Logic high input voltage
Logic low input voltage
V
V
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
2.4
0.2
15
IH
IL
Logic high input current
Logic low input current
µA
µA
0.1
15
VIN = 3.3 V, VOUT = 0
VIN = 12 V, VOUT = 0
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
6
6
30
30
ISC
Short circuit current
mA
17
(5)
Hyst
Thermal hysteresis
–40°C ≤ TA ≤ 125°C
0.5
mV/V
ppm
(6)
ΔVOUT
Long term stability
1000 hrs @ 25°C
100
3 V, 3.3 V, 4.096 V, AND 5 V
Output voltage initial
accuracy
LM4120A-3.000
LM4120A-3.300
LM4120A-4.096
LM4120A-5.000
±0.2%
±0.5%
VOUT
LM4120-3.000
LM4120-3.300
LM4120-4.096
LM4120-5.000
TCVOUT/°C
Temperature coefficient
–40°C ≤ TA ≤ 125°C
14
50 ppm/°c
0.0007
0.008
ΔVOUT/ΔVIN
Line regulation
(VOUT + 1 V) ≤ VIN ≤ 12 V
%/V
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
0.01
0.08
0.17
0.04
0.1
0.03
0.01
0 mA ≤ ILOAD ≤ 1 mA
1 mA ≤ ILOAD ≤ 5 mA
ΔVOUT/ΔILOAD Load regulation
%/mA
–1 mA ≤ ILOAD ≤ 0 mA
–5 mA ≤ ILOAD ≤ –1 mA
0.04
0.01
45
0.12
65
80
ILOAD = 0 mA
ILOAD = 1 mA
ILOAD = 5 mA
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
120
180
150
180
210
250
(3)
VIN−VOUT
Dropout voltage
mV
(4) Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8 V) / 1.8) × VOUT
.
VN (2.5 V) = (36 μVPP / 1.8) × 2.5 = 46 μVPP
.
(5) Thermal hysteresis is defined as the change in 25°C output voltage before and after exposing the device to temperature extremes.
(6) Long term stability is change in VREF at 25°C measured continuously during 1000 hours.
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Electrical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, ILOAD = 0, COUT = 0.01 µF, TA = Tj = 25°C.
(1)
(2)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
3 V, 3.3 V, 4.096 V, AND 5 V (continued)
0.1 Hz to 10 Hz
20
36
VN
Output noise voltage(4)
µVPP
µA
10 Hz to 10 kHz
160
250
275
1
IS
Supply current
–40°C ≤ TA ≤ 85°C
Enable = 0.4 V
–40°C ≤ TJ ≤ 85°C
Enable = 0.2 V
Power-down supply
current
ISS
µA
–40°C ≤ TA ≤ 85°C
2
2.4
0.4
7
VH
VL
Logic high input voltage
Logic low input voltage
V
V
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
2.4
0.2
15
IH
IL
Logic high input current
Logic low input current
µA
µA
0.1
15
VOUT = 0
–40°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
6
6
30
30
ISC
Short circuit current
mA
17
VIN = 12 V, VOUT = 0
(5)
Hyst
Thermal hysteresis
–40°C ≤ TA ≤ 125°C
0.5
mV/V
ppm
(6)
ΔVOUT
Long term stability
1000 hours @ 25°C
100
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6.6 Typical Characteristics
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN
Figure 1. Long Term Drift
Figure 2. Typical Temperature Drift
Figure 3. Short Circuit Current vs Temperature
Figure 4. Dropout Voltage vs Output Error
Figure 5. Dropout Voltage vs Load Current
Figure 6. Line Regulation
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Typical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN
Figure 7. Load Regulation
Figure 8. GND Pin Current
Figure 10. GND Pin Current vs Load
Figure 9. GND Pin Current at No Load vs Temperature
Figure 11. 0.1-Hz to 10-Hz Output Noise
Figure 12. Output Impedance vs Frequency
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Typical Characteristics (continued)
unless otherwise specified, VIN = 3.3 V, VOUT = 2.5 V, ILOAD = 0, COUT = 0.022 µF, TA = 25°C, and VEN = VIN
Figure 13. PSRR vs Frequency
Figure 14. Enable Response
Figure 15. Load Step Response
Figure 16. Line Step Response
Figure 18. Enable Pin Current
Figure 17. Thermal Hysteresis
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7 Detailed Description
7.1 Overview
The LM4120 device is a precision bandgap voltage reference available in seven different voltage options with up
to 5-mA current source and sink capability. This series reference can operate with input voltages from 2 V to
12 V while consuming 160-µA (typical) supply current. In power-down mode, device current drops to less than
2 μA. The LM4120 is available in two grades, A and Standard.
The best grade devices (A) have an initial accuracy of 0.2% with a TEMPCO of 50 ppm/°C ensured from −40°C
to 125°C.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Enable
The ENABLE analog input pin with limited hysteresis generally requires 6 µA (typical) of current to start up the
part. During normal operation, the Enable pin must be connected to the VIN pin. There is a minimum slew rate
on this pin of about 0.003 V/μs to prevent glitches on the output. All of these conditions can easily be met with
ordinary CMOS or TTL logic. The Enable pin can also be used to remotely operate the LM4120 by pulling up the
Enable pin voltage to the input voltage level.
When remotely shutting down the LM4120, the Enable pin must be pulled down to the ground. Floating this pin is
not recommended.
7.3.2 Reference
The REF pin must remain unconnected in all cases. The reference pin is sensitive to noise, and capacitive
loading. Therefore, during the PCB layout care must be taken to keep this pin isolated as much as possible.
7.4 Device Functional Modes
Table 1 describes the functional modes of the LM4120.
Table 1. Enable Pin Mode Summary
ENABLE PIN CONNECTION
EN = VIN
LOGIC STATE
DESCRIPTION
1
0
Normal Operation. LM4120 starts up.
LM4120 in shutdown mode
EN = GND
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The standard application circuit for the LM4120 is shown in Figure 29. The device is designed to be stable with
ceramic output capacitors in the range of 0.022 µF to 0.047 µF. The minimum required output capacitor is
0.022 µF. These capacitors typically have an ESR of about 0.1 Ω to 0.5 Ω. Smaller ESR can be tolerated, but
larger ESR cannot be tolerated. The output capacitor can be increased to improve load transient response, up to
about 1 µF. However, values above 0.047 µF must be tantalum. With tantalum capacitors in the 1-µF range, a
small capacitor between the output and the reference pin is required. This capacitor will typically be in the 50-pF
range. Care must be taken when using output capacitors of 1 µF or larger. These applications must be
thoroughly tested over temperature, line, and load.
An input capacitor is typically not required. However, a 0.1-µF ceramic can be used to help prevent line
transients from entering the LM4120. Larger input capacitors must be tantalum or aluminum.
The reference pin is sensitive to noise, and capacitive loading. Therefore, the PCB layout must isolate this pin as
much as possible.
The enable pin is an analog input with very little hysteresis. About 6 µA into this pin is required to turn the part
on, and it must be taken close to GND to turn the part off (see Electrical Characteristics for thresholds). If the
shutdown feature is not required, then this pin can safely be connected directly to the input supply.
Figure 19. Voltage Reference With Negative Output Circuit
Figure 20. Precision High-Current Low-Dropout Regulator Circuit
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Application Information (continued)
Figure 21. Precision High-Current Negative Voltage Regulator Circuit
Figure 22. Voltage Reference With Complimentary Output Circuit
Figure 23. Precision High-Current Low-Dropout Regulator Circuit
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Application Information (continued)
Figure 24. Stacking Voltage References Circuit
Figure 25. Precision Voltage Reference With Force and Sense Output Circuit
Figure 26. Programmable Current Source Circuit
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Application Information (continued)
Figure 27. Precision Regulator With Current Limiting Circuit
Figure 28. Power Supply Splitter Circuit
8.2 Typical Application
Figure 29. Standard Application Circuit
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
PARAMETER
Output Voltage VOUT
Input Voltage Range VIN
Load Current
EXAMPLE VALUE
1.8 V, 2.048 V, 2.5 V, 3 V, 3.3 V, 4.096 V, 5 V
VOUT 120 mV to 12 V
1 mA (typical)
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8.2.2 Detailed Design Procedure
8.2.2.1 Input Capacitors
Although not always required, an input capacitor is recommended. A supply bypass capacitor on the input
assures that the reference is working from a source with low impedance, which improves stability. A bypass
capacitor can also improve transient response by providing a reservoir of stored energy that the reference can
utilize in case where the load current demand suddenly increases. The value used for CIN may be used without
limit.
8.2.2.2 Output Capacitors
The LM4120 may require a 0.022-μF to 1-μF output capacitor for loop stability (compensation) as well as
transient response. During the sudden changes in load current demand, the output capacitor must source or sink
current during the time it takes the control loop of the LM4120 to respond.
8.2.3 Application Curves
Figure 30. Start-Up Response
Figure 31. Load Step Response
9 Power Supply Recommendations
Noise on the power-supply input can effect the output noise, but can be reduced by using an optional bypass
capacitor between the input pin and the ground. A ceramic input capacitor more than 0.1 µF or higher can be
used for that purpose.
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10 Layout
10.1 Layout Guidelines
The mechanical stress due to PC board mounting can cause the output voltage to shift from its initial value. The
center of a PC board generally has the highest mechanical and thermal expansion stress. Mounting the device
near the edges or the corners of the board where mechanical stress is at its minimum. References in SOT
packages are generally less prone to assembly stress than devices in Small Outline (SOIC) package.
A mechanical isolation of the device by creating an island by cutting a U shape slot (U - SLOT) on the PCB while
mounting the device helps in reducing the impact of the PC board stresses on the output voltage of the
reference. This approach would also provide some thermal isolation from the rest of the circuit.
Figure 32 shows a recommended printed board layout for LM4120 along with an in-set diagram. The in-set
diagram exhibits a slot cut on three sides of the reference IC, which provides a relief to the IC from external PCB
stress.
10.2 Layout Example
PCB Top View
VIN
VOUT
PCB Length
LM4120
PCB Side View
STRESS
STRESS
REF
U - SLOT
REF GND EN
LM4120
VOUT
U - SLOT
PCB Length
GND
Set COUT
close to VOUT
and GND
EN
REF
Set CIN
close to VIN
and GND
CIN
COUT
LM4120
VOUT
VIN
Figure 32. Typical Layout Example With LM4120
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2000–2016, Texas Instruments Incorporated
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17
Product Folder Links: LM4120
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM4120AIM5-1.8/NOPB
LM4120AIM5-2.0/NOPB
LM4120AIM5-2.5
ACTIVE
ACTIVE
NRND
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
1000 RoHS & Green
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
R21A
R14A
R08A
SN
1000
Non-RoHS
& Green
Call TI
LM4120AIM5-2.5/NOPB
LM4120AIM5-3.0
ACTIVE
NRND
SOT-23
SOT-23
DBV
DBV
5
5
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
R08A
R15A
1000
Non-RoHS
& Green
Call TI
LM4120AIM5-3.0/NOPB
LM4120AIM5-3.3
ACTIVE
NRND
SOT-23
SOT-23
DBV
DBV
5
5
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
R15A
R16A
1000
Non-RoHS
& Green
Call TI
LM4120AIM5-3.3/NOPB
LM4120AIM5-4.1/NOPB
LM4120AIM5-5.0
ACTIVE
ACTIVE
NRND
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
1000 RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
R16A
R17A
R18A
1000 RoHS & Green
1000
Non-RoHS
& Green
Call TI
LM4120AIM5-5.0/NOPB
LM4120AIM5X-1.8/NOPB
LM4120AIM5X-2.0/NOPB
LM4120AIM5X-2.5/NOPB
LM4120AIM5X-3.0/NOPB
LM4120AIM5X-3.3/NOPB
LM4120AIM5X-4.1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
1000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
R18A
R21A
R14A
R08A
R15A
R16A
R17A
SN
SN
SN
SN
3000
Non-RoHS
& Green
Call TI
LM4120AIM5X-4.1/NOPB
LM4120AIM5X-5.0/NOPB
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
3000 RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
R17A
R18A
3000 RoHS & Green
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM4120IM5-1.8/NOPB
LM4120IM5-2.0/NOPB
LM4120IM5-2.5/NOPB
LM4120IM5-3.0
ACTIVE
ACTIVE
ACTIVE
NRND
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
5
5
5
5
1000 RoHS & Green
1000 RoHS & Green
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
R21B
R14B
R08B
R15B
SN
SN
1000
Non-RoHS
& Green
Call TI
LM4120IM5-3.0/NOPB
LM4120IM5-3.3
ACTIVE
NRND
SOT-23
SOT-23
DBV
DBV
5
5
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
R15B
R16B
1000
Non-RoHS
& Green
Call TI
LM4120IM5-3.3/NOPB
LM4120IM5-4.1/NOPB
LM4120IM5-5.0/NOPB
LM4120IM5X-1.8/NOPB
LM4120IM5X-2.0/NOPB
LM4120IM5X-2.5/NOPB
LM4120IM5X-3.0/NOPB
LM4120IM5X-3.3/NOPB
LM4120IM5X-4.1/NOPB
LM4120IM5X-5.0/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
1000 RoHS & Green
1000 RoHS & Green
1000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
R16B
R17B
R18B
R21B
R14B
R08B
R15B
R16B
R17B
R18B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4120AIM5-1.8/NOPB SOT-23
LM4120AIM5-2.0/NOPB SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
LM4120AIM5-2.5
LM4120AIM5-2.5/NOPB SOT-23
LM4120AIM5-3.0 SOT-23
LM4120AIM5-3.0/NOPB SOT-23
LM4120AIM5-3.3 SOT-23
SOT-23
LM4120AIM5-3.3/NOPB SOT-23
LM4120AIM5-4.1/NOPB SOT-23
LM4120AIM5-5.0
SOT-23
LM4120AIM5-5.0/NOPB SOT-23
LM4120AIM5X-1.8/NOPB SOT-23
LM4120AIM5X-2.0/NOPB SOT-23
LM4120AIM5X-2.5/NOPB SOT-23
LM4120AIM5X-3.0/NOPB SOT-23
LM4120AIM5X-3.3/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4120AIM5X-4.1
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
3000
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
LM4120AIM5X-4.1/NOPB SOT-23
LM4120AIM5X-5.0/NOPB SOT-23
LM4120IM5-1.8/NOPB
LM4120IM5-2.0/NOPB
LM4120IM5-2.5/NOPB
LM4120IM5-3.0
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
LM4120IM5-3.0/NOPB
LM4120IM5-3.3
LM4120IM5-3.3/NOPB
LM4120IM5-4.1/NOPB
LM4120IM5-5.0/NOPB
LM4120IM5X-1.8/NOPB SOT-23
LM4120IM5X-2.0/NOPB SOT-23
LM4120IM5X-2.5/NOPB SOT-23
LM4120IM5X-3.0/NOPB SOT-23
LM4120IM5X-3.3/NOPB SOT-23
LM4120IM5X-4.1/NOPB SOT-23
LM4120IM5X-5.0/NOPB SOT-23
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM4120AIM5-1.8/NOPB
LM4120AIM5-2.0/NOPB
LM4120AIM5-2.5
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
3000
3000
3000
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM4120AIM5-2.5/NOPB
LM4120AIM5-3.0
LM4120AIM5-3.0/NOPB
LM4120AIM5-3.3
LM4120AIM5-3.3/NOPB
LM4120AIM5-4.1/NOPB
LM4120AIM5-5.0
LM4120AIM5-5.0/NOPB
LM4120AIM5X-1.8/NOPB
LM4120AIM5X-2.0/NOPB
LM4120AIM5X-2.5/NOPB
LM4120AIM5X-3.0/NOPB
LM4120AIM5X-3.3/NOPB
LM4120AIM5X-4.1
LM4120AIM5X-4.1/NOPB
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM4120AIM5X-5.0/NOPB
LM4120IM5-1.8/NOPB
LM4120IM5-2.0/NOPB
LM4120IM5-2.5/NOPB
LM4120IM5-3.0
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
3000
3000
3000
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM4120IM5-3.0/NOPB
LM4120IM5-3.3
LM4120IM5-3.3/NOPB
LM4120IM5-4.1/NOPB
LM4120IM5-5.0/NOPB
LM4120IM5X-1.8/NOPB
LM4120IM5X-2.0/NOPB
LM4120IM5X-2.5/NOPB
LM4120IM5X-3.0/NOPB
LM4120IM5X-3.3/NOPB
LM4120IM5X-4.1/NOPB
LM4120IM5X-5.0/NOPB
Pack Materials-Page 4
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
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EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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