LM4125IM5-2.5 [TI]

Precision Micropower Low Dropout Voltage Reference;
LM4125IM5-2.5
型号: LM4125IM5-2.5
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Precision Micropower Low Dropout Voltage Reference

光电二极管
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LM4125  
www.ti.com  
SNVS238A MAY 2004REVISED APRIL 2013  
LM4125 Precision Micropower Low Dropout Voltage Reference  
Check for Samples: LM4125  
1
FEATURES  
DESCRIPTION  
The LM4125 is a precision low power low dropout  
bandgap voltage reference with up to 5 mA output  
current source and sink capability.  
2
Small SOT23-5 Package  
Low Dropout Voltage: 120 mV Typ @ 1 mA  
High Output Voltage Accuracy: 0.2%  
Source and Sink Current Output: ±5 mA  
Supply Current: 160 μA Typ.  
This series reference operates with input voltages as  
low as 2V and up to 6V consuming 160 µA (Typ.)  
supply current. In power down mode, device current  
drops to less than 2 μA.  
Low Temperature Coefficient: 50 ppm/°C  
Fixed Output Voltages: 2.048, 2.5,and 4.096  
Industrial Temperature Range: 40°C to +85°C  
The LM4125 comes in two grades (A and Standard)  
and three voltage options for greater flexibility. The  
best grade devices (A) have an initial accuracy of  
0.2%, while the standard have an initial accuracy of  
0.5%, both with a tempco of 50ppm/°C ensured from  
40°C to +125°C.  
(For Extended Temperature Range, 40°C to  
125°C, Contact TI)  
APPLICATIONS  
The very low dropout voltage, low supply current and  
power-down capability of the LM4125 makes this  
product an ideal choice for battery powered and  
portable applications.  
Portable, Battery Powered Equipment  
Instrumentation and Process Control  
Automotive & Industrial  
Test Equipment  
The device performance is ensured over the industrial  
temperature range (40°C to +85°C), while certain  
specs are ensured over the extended temperature  
range (40°C to +125°C). Please contact TI for full  
specifications over the extended temperature range.  
The LM4125 is available in a standard 5-pin SOT-23  
package.  
Data Acquisition Systems  
Precision Regulators  
Battery Chargers  
Base Stations  
Communications  
Medical Equipment  
Connection Diagram  
Figure 1. 5-Pin SOT-23 Surface Mount Package  
See Package Number DBV  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  
LM4125  
SNVS238A MAY 2004REVISED APRIL 2013  
www.ti.com  
Absolute Maximum Ratings(1)(2)  
Maximum Voltage on input or enable pins  
Output Short-Circuit Duration  
0.3V to 8V  
Indefinite  
280°C/W  
350 mW  
2 kV  
Power Dissipation (TA = 25°C)(3)  
DBV package − θJA  
Power Dissipation  
Human Body Model  
Machine Model  
ESD Susceptibility(4)  
Lead Temperature:  
200V  
Soldering, (10 sec.)  
Vapor Phase (60 sec.)  
Infrared (15 sec.)  
+260°C  
+215°C  
+220°C  
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test  
conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance  
characteristics may degrade when the device is not operated under the listed test conditions.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX  
(maximum junction temperature), θJ-A (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power  
dissipation at any temperature is: PDissMAX = (TJMAX TA)/θJ-A up to the value listed in the Absolute Maximum Ratings.  
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200 pF  
capacitor discharged directly into each pin.  
Operating Range(1)  
Storage Temperature Range  
Ambient Temperature Range  
Junction Temperature Range  
65°C to +150°C  
40°C to +85°C  
40°C to +125°C  
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test  
conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance  
characteristics may degrade when the device is not operated under the listed test conditions.  
2
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LM4125  
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SNVS238A MAY 2004REVISED APRIL 2013  
Electrical Characteristics — LM4125-2.048V and 2.5V  
Unless otherwise specified VIN = 3.3V, ILOAD = 0, COUT = 0.01µF, TA = Tj = 25°C. Limits with standard typeface are for Tj =  
25°C, and limits in boldface type apply over the 40°C TA +85°C temperature range.  
Min  
Typ  
Max  
Symbol  
Parameter  
Conditions  
Units  
(1)  
(2)  
(1)  
Output Voltage Initial Accuracy  
LM4125A-2.048  
±0.2  
%
LM4125A-2.500  
VOUT  
LM4125-2.048  
LM4125-2.500  
±0.5  
50  
%
TCVOUT/°C  
Temperature Coefficient  
Line Regulation  
40°C TA +125°C  
3.3V VIN 6V  
14  
ppm/°c  
%/V  
ΔVOUT/ΔVIN  
0.0007  
0.008  
0.01  
0 mA ILOAD 1 mA  
1 mA ILOAD 5 mA  
0.03  
0.01  
0.08  
0.17  
0.04  
0.1  
ΔVOUT/ΔILOAD  
Load Regulation  
%/mA  
1 mA ILOAD 0 mA  
5 mA ILOAD ≤ −1 mA  
ILOAD = 0 mA  
0.04  
0.01  
45  
0.12  
65  
100  
ILOAD = +1 mA  
ILOAD = +5 mA  
120  
180  
150  
200  
VINVOUT  
Dropout Voltage(3)  
mV  
210  
300  
VN  
Output Noise Voltage(4)  
Supply Current  
0.1 Hz to 10 Hz  
10 Hz to 10 kHz  
20  
36  
µVPP  
µVPP  
µA  
IS  
160  
257  
290  
VIN = 3.3V, VOUT = 0  
VIN = 6V, VOUT = 0  
15  
17  
6
6
30  
30  
ISC  
Short Circuit Current  
mA  
Hyst  
Thermal Hysteresis(5)  
Long Term Stability(6)  
40°C TA 125°C  
0.5  
mV/V  
ppm  
ΔVOUT  
1000 hrs. @ 25°C  
100  
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical  
Quality Control (SQC) methods. The limits are used to calculate Outgoing Quality Level (AOQL).  
(2) Typical numbers are at 25°C and represent the most likely parametric norm.  
(3) Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes 1% from VOUT at VIN = 3.3V for 2.0V, 2.5V  
and 5V for 4.1V. A parasitic diode exists between input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN  
.
(4) Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8V)/1.8) * VOUT. VN (2.5V) =  
(36µVPP/1.8) * 2.5 = 46µVPP  
.
(5) Thermal hysteresis is defined as the change in +25°C output voltage before and after exposing the device to temperature extremes.  
(6) Long term stability is change in VREF at 25°C measured continuously during 1000 hrs.  
Copyright © 2004–2013, Texas Instruments Incorporated  
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LM4125  
SNVS238A MAY 2004REVISED APRIL 2013  
www.ti.com  
Electrical Characteristics — LM4125-4.096V  
Unless otherwise specified VIN = 5V, ILOAD = 0, COUT = 0.01µF, TA = Tj = 25°C. Limits with standard typeface are for Tj = 25°C,  
and limits in boldface type apply over the 40°C TA +85°C temperature range.  
Min  
Typ  
Max  
Symbol  
Parameter  
Conditions  
Units  
(1)  
(2)  
(1)  
Output Voltage Initial  
Accuracy  
LM4125A-4.096  
±0.2  
%
VOUT  
LM4125-4.096  
±0.5  
50  
%
TCVOUT/°C  
Temperature Coefficient  
Line Regulation  
40°C TA +125°C  
5V VIN 6V  
14  
ppm/°c  
ΔVOUT/ΔVIN  
0.0007  
0.008  
0.01  
%/V  
0 mA ILOAD 1 mA  
1 mA ILOAD 5 mA  
0.03  
0.01  
0.08  
0.17  
0.04  
0.1  
ΔVOUT/ΔILOAD  
Load Regulation  
%/mA  
1 mA ILOAD 0 mA  
5 mA ILOAD ≤ −1 mA  
ILOAD = 0 mA  
0.04  
0.01  
45  
0.12  
65  
100  
ILOAD = +1 mA  
ILOAD = +5 mA  
120  
180  
150  
200  
VINVOUT  
Dropout Voltage(3)  
mV  
210  
300  
VN  
Output Noise Voltage(4)  
Supply Current  
0.1 Hz to 10 Hz  
10 Hz to 10 kHz  
20  
36  
µVPP  
µVPP  
µA  
IS  
160  
257  
290  
VOUT = 0  
15  
17  
6
6
30  
30  
ISC  
Short Circuit Current  
mA  
VIN = 6V, VOUT = 0  
Hyst  
Thermal Hysteresis(5)  
Long Term Stability(6)  
40°C TA 125°C  
0.5  
mV/V  
ppm  
ΔVOUT  
1000 hrs. @ 25°C  
100  
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical  
Quality Control (SQC) methods. The limits are used to calculate Outgoing Quality Level (AOQL).  
(2) Typical numbers are at 25°C and represent the most likely parametric norm.  
(3) Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes 1% from VOUT at VIN = 3.3V for 2.0V, 2.5V  
and 5V for 4.1V. A parasitic diode exists between input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN  
.
(4) Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8V)/1.8) * VOUT. VN (2.5V) =  
(36µVPP/1.8) * 2.5 = 46µVPP  
.
(5) Thermal hysteresis is defined as the change in +25°C output voltage before and after exposing the device to temperature extremes.  
(6) Long term stability is change in VREF at 25°C measured continuously during 1000 hrs.  
4
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LM4125  
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SNVS238A MAY 2004REVISED APRIL 2013  
LM4125 Typical Operating Characteristics  
Unless otherwise specified, VIN = 3.3V, VOUT = 2.5V, ILOAD = 0, COUT = 0.022µF and TA = 25°C.  
Long Term Drift  
Typical Temperature Drift  
Figure 2.  
Figure 3.  
Short Circuit Current  
vs  
Dropout Voltage  
vs  
Output Error  
Temperature  
Figure 4.  
Figure 5.  
Dropout Voltage  
vs  
Load Current  
Load Regulation  
Figure 6.  
Figure 7.  
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LM4125 Typical Operating Characteristics (continued)  
Unless otherwise specified, VIN = 3.3V, VOUT = 2.5V, ILOAD = 0, COUT = 0.022µF and TA = 25°C.  
GND Pin Current at No Load  
vs  
GND Pin Current  
Temperature  
Figure 8.  
Figure 9.  
GND Pin Current  
vs  
Load  
0.1Hz to 10Hz output Noise  
Figure 10.  
Figure 11.  
Output Impedance  
vs  
PSRR  
vs  
Frequency  
Frequency  
Figure 12.  
Figure 13.  
6
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LM4125  
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SNVS238A MAY 2004REVISED APRIL 2013  
LM4125 Typical Operating Characteristics (continued)  
Unless otherwise specified, VIN = 3.3V, VOUT = 2.5V, ILOAD = 0, COUT = 0.022µF and TA = 25°C.  
Start-Up Response  
Load Step Response  
Figure 14.  
Figure 15.  
Load Step Response  
Line Step Response  
Figure 16.  
Figure 17.  
Thermal Hysteresis  
Figure 18.  
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PIN FUNCTIONS  
Output (Pin 5): Reference Output.  
Input (Pin 4): Positive Supply.  
Ground (Pin 2): Negative Supply or Ground Connection.  
APPLICATION HINTS  
The standard application circuit for the LM4125 is shown in Figure 19. It is designed to be stable with ceramic  
output capacitors in the range of 0.022µF to 0.1µF. Note that 0.022µF is the minimum required output capacitor.  
These capacitors typically have an ESR of about 0.1 to 0.5. Smaller ESR can be tolerated, however larger ESR  
can not. The output capacitor can be increased to improve load transient response, up to about 1µF. However,  
values above 0.047µF must be tantalum. With tantalum capacitors, in the 1µF range, a small capacitor between  
the output and the reference pin is required. This capacitor will typically be in the 50pF range. Care must be  
taken when using output capacitors of 1µF or larger. These application must be thoroughly tested over  
temperature, line and load.  
An input capacitor is typically not required. However, a 0.1µF ceramic can be used to help prevent line transients  
from entering the LM4125. Larger input capacitors should be tantalum or aluminum.  
The typical thermal hysteresis specification is defined as the change in +25°C voltage measured after thermal  
cycling. The device is thermal cycled to temperature -40°C and then measured at 25°C. Next the device is  
thermal cycled to temperature +125°C and again measured at 25°C. The resulting VOUT delta shift between the  
25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced  
by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature  
and board mounting temperature are all factors that can contribute to thermal hysteresis.  
Figure 19. Standard Application Circuit  
INPUT CAPACITOR  
Noise on the power-supply input can effect the output noise, but can be reduced by using an optional bypass  
capacitor between the input pin and the ground.  
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATION  
The mechanical stress due to PC board mounting can cause the output voltage to shift from its initial value.  
References in SOT packages are generally less prone to assembly stress than devices in Small Outline (SOIC)  
package.  
To reduce the stress-related output voltage shifts, mount the reference on the low flex areas of the PC board  
such as near to the edge or the corner of the PC board.  
8
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LM4125  
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Typical Application Circuits  
Figure 20. Voltage Reference with Negative Output  
Figure 21. Precision High Current Low Dropout  
Regulator  
Figure 22. Precision High Current Negative Voltage Figure 23. Voltage Reference with Complimentary  
Regulator  
Output  
Figure 24. Precision High Current Low Droput  
Regulator  
Figure 25. Precision Voltage Reference with Force  
and Sense Output  
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Figure 26. Programmable Current Source  
Figure 27. Precision Regulator with Current  
Limiting Circuit  
Figure 28. Power Supply Splitter  
10  
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LM4125  
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SNVS238A MAY 2004REVISED APRIL 2013  
REVISION HISTORY  
Changes from Original (April 2013) to Revision A  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 10  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Oct-2015  
PACKAGING INFORMATION  
Orderable Device  
LM4125AIM5-2.5/NOPB  
LM4125IM5-2.0/NOPB  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOT-23  
SOT-23  
DBV  
5
5
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
R81A  
R80B  
ACTIVE  
DBV  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
LM4125IM5-2.5  
LIFEBUY  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
R81B  
R81B  
LM4125IM5-2.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Oct-2015  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM4125AIM5-2.5/NOPB SOT-23  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
1000  
1000  
1000  
1000  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
LM4125IM5-2.0/NOPB  
LM4125IM5-2.5  
SOT-23  
SOT-23  
SOT-23  
LM4125IM5-2.5/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM4125AIM5-2.5/NOPB  
LM4125IM5-2.0/NOPB  
LM4125IM5-2.5  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
1000  
1000  
1000  
1000  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
LM4125IM5-2.5/NOPB  
Pack Materials-Page 2  
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