LM4431M3-2.5 [TI]
微功耗并联电压基准 | DBZ | 3 | 0 to 70;
| 型号： | LM4431M3-2.5 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 微功耗并联电压基准 | DBZ | 3 | 0 to 70 光电二极管 |
| 文件： | 总16页 (文件大小：552K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM4431
www.ti.com
SNVS103C –JUNE 2000–REVISED APRIL 2013
LM4431 Micropower Shunt Voltage Reference
Check for Samples: LM4431
1
FEATURES
DESCRIPTION
Ideal for space critical applications, the LM4431
voltage reference is available in the sub-miniature
(3 mm x 1.3 mm) SOT-23 surface-mount package.
The LM4431's advanced design eliminates the need
for an external stabilizing capacitor while ensuring
stability with any capacitive load, thus making the
LM4431 easy to use. The operating current range is
100 μA to 15 mA.
2
•
•
•
•
Small Package: SOT-23
No Output Capacitor Required
Tolerates Capacitive Loads
Fixed Reverse Breakdown Voltage of 2.50V
APPLICATIONS
•
•
•
•
•
•
•
Portable, Battery-Powered Equipment
Data Acquisition Systems
Instrumentation
The LM4431 utilizes fuse and zener-zap reverse
breakdown voltage trim during wafer sort to ensure
that the parts have an accuracy of better than ±2.0%
at 25°C. Bandgap reference temperature drift
curvature correction and low dynamic impedance
ensure stable reverse breakdown voltage accuracy
over a wide range of operating temperatures and
currents.
Process Control
Energy Management
Product Testing
Power Supplies
KEY SPECIFICATIONS
•
•
Output Voltage Tolerance: 25°C: ±2.0% (Max)
Low Output Noise (10 Hz to 10 kHz): 35 μVrms
(Typ)
•
Wide Operating Current Range: 100 μA to 15
mA
•
•
Commercial Temperature Range: 0 to +70 °C
Low Temperature Coefficient: 30 ppm/°C (Typ)
Connection Diagram
Top View
* This pin must be left floating or connected to pin 2.
Figure 1. SOT-23 Package
See Package Number DBZ0003A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM4431
SNVS103C –JUNE 2000–REVISED APRIL 2013
www.ti.com
Absolute Maximum Ratings(1)(2)
Reverse Current
20 mA
10 mA
Forward Current
Power Dissipation (TA = 25°C)(3)
DBZ0003A Package
306 mW
Storage Temperature
−65°C to +150°C
+215°C
Vapor phase (60 seconds)
Infrared (15 seconds)
Human Body Model(4)
Machine Model(4)
Lead Temperature
ESD Susceptibility
DBZ0003A Package
+220°C
2 kV
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4431,
TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings(1)(2)
Temperature Range (Tmin ≤ TA ≤ Tmax
)
0°C ≤ TA ≤ +70°C
100 μA to 15 mA
Reverse Current
LM4431-2.5
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4431,
TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package.
2
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LM4431
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SNVS103C –JUNE 2000–REVISED APRIL 2013
LM4431-2.5 Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C.
LM4431M3
Limits(2)
Units
(Limit)
Symbol
VR
Parameter
Conditions
Typical(1)
Reverse Breakdown Voltage
IR = 100 μA
2.500
V
Reverse Breakdown VoltageTolerance
IR = 100 μA
±50
mV (max)
μA
IRMIN
45
Minimum Operating Current
100
μA (max)
ppm/°C
ppm/°C
ppm/°C
mV
ΔVR/ΔT
IR = 10 mA
IR = 1 mA
±30
±30
±30
0.4
Average Reverse Breakdown Voltage
Temperature Coefficient
IR = 100 μA
ΔVR/ΔIR
IRMIN ≤ IR ≤ 1 mA
1.0
mV (max)
mV (max)
mV
1.2
Reverse Breakdown Voltage Change
with Operating Current Change
1 mA ≤ IR ≤ 15 mA
2.5
8.0
mV (max)
mV (max)
25
ZR
IR = 1 mA, f = 120 Hz,
IAC = 0.1 IR
Reverse Dynamic Impedance
Wideband Noise
1.0
35
Ω
eN
IR = 100 μA,
10 Hz ≤ f ≤ 10 kHz
μVrms
ΔVR
t = 1000 hrs
Reverse Breakdown Voltage Long Term
Stability
T = 25°C ±0.1°C
IR = 100 μA
120
ppm
(1) Typicals are at TJ = 25°C and represent most likely parametric norm.
(2) Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate AOQL.
Copyright © 2000–2013, Texas Instruments Incorporated
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LM4431
SNVS103C –JUNE 2000–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
Temperature Drift for Different
Average Temperature Coefficient
Output Impedance
vs Frequency
Figure 2.
Figure 3.
Reverse Characteristics and
Minimum Operating Current
Noise Voltage
Figure 4.
Figure 5.
Start-Up Characteristics
Figure 6. Test Circuit
Figure 7. LM4431-2.5, RS = 30k
4
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Product Folder Links: LM4431
LM4431
www.ti.com
SNVS103C –JUNE 2000–REVISED APRIL 2013
Functional Block Diagram
APPLICATIONS INFORMATION
The LM4431 is a micro-power curvature-corrected 2.5V bandgap shunt voltage reference. For space critical
applications, the LM4431 is available in the sub-miniature SOT-23 surface-mount package. The LM4431 has
been designed for stable operation without the need of an external capacitor connected between the “+” pin and
the “−” pin. If, however, a bypass capacitor is used, the LM4431 remains stable. The operating current range is
100 μA to 15 mA.
The LM4431's SOT-23 package has a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach interface
contact). Therefore, pin 3 of the SOT-23 package must be left floating or connected to pin 2.
In a conventional shunt regulator application (Figure 8), an external series resistor (RS) is connected between the
supply voltage and the LM4431. RS determines the current that flows through the load (IL) and the LM4431 (IQ).
Since load current and supply voltage may vary, RS should be small enough to supply at least the minimum
acceptable IQ to the LM4431 even when the supply voltage is at its minimum and the load current is at its
maximum value. When the supply voltage is at its maximum and IL is at its minimum, RS should be large enough
so that the current flowing through the LM4431 is less than 15 mA.
RS is determined by the supply voltage, (VS), the load and operating current, (IL and IQ), and the LM4431's
reverse breakdown voltage, VR.
(1)
Typical Applications
Figure 8. Shunt Regulator
Copyright © 2000–2013, Texas Instruments Incorporated
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LM4431
SNVS103C –JUNE 2000–REVISED APRIL 2013
www.ti.com
Figure 9. Bounded amplifier reduces saturation-induced delays
and can prevent succeeding stage damage.
Nominal clamping voltage is ±3.9V (LM4431’s reverse breakdown voltage +2 diode VF).
Figure 10. Protecting Op Amp input.
The bounding voltage is ±4V with the LM4431 (LM4431’s reverse breakdown voltage + 3 diode VF).
6
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Product Folder Links: LM4431
LM4431
www.ti.com
SNVS103C –JUNE 2000–REVISED APRIL 2013
Figure 11. Programmable Current Source
Figure 12. Precision 1 μA to 1 mA Current Sources
Copyright © 2000–2013, Texas Instruments Incorporated
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LM4431
SNVS103C –JUNE 2000–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM4431M3-2.5
NRND
SOT-23
DBZ
3
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
0 to 70
S2E
LM4431M3-2.5/NOPB
LM4431M3X-2.5/NOPB
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
1000 RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
S2E
S2E
3000 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4431M3-2.5
SOT-23
SOT-23
DBZ
DBZ
DBZ
3
3
3
1000
1000
3000
178.0
178.0
178.0
8.4
8.4
8.4
3.3
3.3
3.3
2.9
2.9
2.9
1.22
1.22
1.22
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
LM4431M3-2.5/NOPB
LM4431M3X-2.5/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM4431M3-2.5
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
3
3
3
1000
1000
3000
208.0
208.0
208.0
191.0
191.0
191.0
35.0
35.0
35.0
LM4431M3-2.5/NOPB
LM4431M3X-2.5/NOPB
Pack Materials-Page 2
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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