LM4839MT/NOPB [TI]
2 CHANNEL(S), TONE CONTROL CIRCUIT, PDSO28, TSSOP-28;
| 型号： | LM4839MT/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2 CHANNEL(S), TONE CONTROL CIRCUIT, PDSO28, TSSOP-28 光电二极管 商用集成电路 |
| 文件： | 总36页 (文件大小：780K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM4839
LM4839
Stereo 2W Audio Power Amplifiers with DC Volume Control, Bass
Boost, and Input Mux
Literature Number: SNAS132D
OBSOLETE
LM4839
September 24, 2011
Stereo 2W Audio Power Amplifiers
with DC Volume Control, Bass Boost, and Input Mux
General Description
Key Specifications
The LM4839 is a monolithic integrated circuit that provides
DC volume control, and stereo bridged audio power amplifiers
capable of producing 2W into 4Ω (Note 1) with less than 1.0%
THD+N, or 2.2W into 3Ω (Note 2) with less than 1.0% THD
+N.
PO at 1% THD+N
■
into 3Ω (LQ & MTE)
into 4Ω (LQ & MTE)
2.2W(typ)
2.0W(typ)
1.1W(typ)
1.0%(typ)
■
■
■
■
into 8Ω (LM4839) (MT, MTE, & LQ)
Single-ended mode - THD+N at 85mW into
32Ω
Boomer® audio integrated circuits were designed specifically
to provide high quality audio while requiring a minimum
amount of external components. The LM4839 incorporates a
DC volume control, stereo bridged audio power amplifiers,
selectable gain or bass boost, and an input mux making it
optimally suited for multimedia monitors, portable radios,
desktop, and portable computer applications.
Shutdown curre
0.2µA(typ)
■
Features
DC VoluControl Inteace
■
■
■
Input x
The LM4839 features an externally controlled, low-power
consumption shutdown mode, and both a power amplifier and
headphone mute for maximum system flexibility and perfor-
mance.
Note 1: When properly mounted to the circuit board, the LM4839LQ and
LM4839MTE will deliver 2W into 4Ω. The LM4839MT will deliver 1.1W into
8Ω. See the Application Information section for LM4839LQ and LM4839MT
usage information.
Syem Beep Dt
reo witchable bridged/single-ended power amplifiers
ble inernal/external gain and bass boost
“Clid p” suppression circuitry
■
■
■
■
Thermal hutdown protection circuitry
ppcations
Note 2: An LM4839LQ and LM4839MTE that have been properly moud
to the circuit board and forced-air cooled will deliver 2.2W into 3Ω.
Ptable and Desktop Computers
■
Multimedia Monitors
Portable Radios, PDAs, and Portable TVs
Connection Diagrams
LLP Packa
TSSOP Package
20013402
Top View
Order Number LM4839MT
See NS Package Number MTC28 for TSSOP
Order Number LM4839MTE
See NS Package Number MXA28A for Exposed-DAP
TSSOP
20013483
Top View
Order Number LM4839LQ
See NS Package Number LQA028AA for Exposed-DAP LLP
Boomer® is a registered trademark of NationalSemiconductor Corporation.
© 2011 National Semiconductor Corporation
200134
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
42°C/W
20°C/W
θ
θ
θ
θ
θ
JA (typ)—LQA028AA
JC (typ)—MTC28
Absolute Maximum Ratings (Note 10)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
JA (typ)—MTC28
80°C/W
2°C/W
JC (typ)—MXA28A
JA (typ)—MXA28A (exposed
Supply Voltage
Storage Temperature
Input Voltage
6.0V
-65°C to +150°C
−0.3V to VDD +0.3V
Internally limited
2500V
41°C/W
54°C/W
59°C/W
93°C/W
DAP) (Note 4)
JA (typ)—MXA28A (exposed
DAP) (Note 3)
JA (typ)—MXA28A (exposed
DAP) (Note 5)
JA (typ)—MXA28A (exposed
θ
Power Dissipation
ESD Susceptibility (Note 12)
ESD Susceptibility (Note 13)
Junction Temperature
θ
250V
150°C
θ
Soldering Information
Vapor Phase (60 sec.)
DAP) (Note 6)
215°C
220°C
Infrared (15 sec.)
Operating Ratings
Temperature Rae
TMIN ≤ TA A
Supply Voltge
See AN-450 “Surface Mounting and their Effects on Product
Reliability” for other methods of soldering surface mount
devices.
−40°C ≤TA ≤ 85°C
2.7V≤ VDD ≤ 5.5V
3°C/W
θ
JC (typ)—LQA028AA
Electrical Characteristics for Entire IC
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless erwise noted.
Symbol Parameter Condit
VDD Supply Voltage
LM4839
Units
(Limits)
Typical
Limit
(Note 14)
(Note 15)
2.7
5.5
30
V (min)
V (max)
IDD
ISD
VIH
VIL
Quiescent Power Supply Current
Shutdown Current
VI0A
V
15
mA (max)
0.7
2.0
μA (max)
VIN High on all Logic Inputs
VIN Low on all Logic Inputs
0.8 x VDD V (min)
0.2 x VDD V (max)
Electrical Characteristics for Volme Attenuators
(Note 7, Note 10)
The following specifications apply foTA = 25°C unless otherwise noted.
LM4839
Units
(Limits)
Symbol
Para
Attenuator Range
Conditions
Typical
Limit
(Note 14)
(Note 15)
CRANGE
CRANGE
AM
Gain with VDCVol = 5.0V, No Load
Attenuation with VDCVol = 0V (BM & SE)
Vmute = 5V, Bridged Mode (BM)
±0.75
-75
dB (max)
dB (min)
dB (min)
dB (min)
Attenuator Range
Mute Attenuation
-78
Vmute = 5V, Single-Ended Mode (SE)
-78
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
Electrical Characteristics for Single-Ended Mode Operation
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless otherwise noted.
LM4839
Typical
Units
(Limits)
Symbol
PO
Parameter
Output Power
Conditions
Limit
(Note 14)
(Note 15)
85
mW
mW
%
THD+N = 1.0%; f = 1kHz; RL = 32Ω
THD+N = 10%; f = 1 kHz; RL = 32Ω
95
THD+N
PSRR
Total Harmonic Distortion+Noise
Power Supply Rejection Ratio
0.065
VOUT = 1VRMS, f=1kHz, RL = 10kΩ,
AVD = 1
58
dB
CB = 1.0 μF, f =120 Hz,
VRIPPLE = 200 mVrms
SNR
Xtalk
Signal to Noise Ratio
Channel Separation
102
65
dB
dB
POUT =75 mW, R L = 32Ω, A-Wtd Filte
f=1kHz, CB = 1.0 μF
Electrical Characteristics for Bridged Mode Opation
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless otherwise note
LM4839
Units
(Limits)
Symbol
VOS
Parameter
Conns
VIN = 0V, No Load
Typical
Limit
(Note 14)
(Note 15)
Output Offset Voltage
Output Power
±50
mV (max)
W
PO
2.2
2
THD + N = 1; f=1kHRL = 3Ω
(Note 8)
W
TH%; f=1kHz; RL = 4Ω
(N
THx);f = 1 kHz;
RL = 8Ω
1.1
1.0
W (min)
1.5
0.3
W
%
= 10%;f = 1 kHz; RL = 8Ω
PO = W, 20 Hz< f < 20 kHz,
RL 8Ω, AVD = 2
THD+N
Total Harmonic Distortion+Noise
1.0
74
%
PO = 340 mW, RL = 32Ω
CB = 1.0 µF, f = 120 Hz,
PSRR
SNR
Xtalk
Power Supply Rejection Rati
Signal to Noise
dB
VRIPPLE = 200 mVrms; RL = 8Ω
93
70
dB
dB
VDD = 5V, POUT = 1.1W, RL = 8Ω, A-
Wtd Filter
Channel Separation
f=1kHz, CB = 1.0 μF
3
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
Note 3: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 2in 2 piece of 1 ounce printed circuit board copper.
Note 4: The θJA given is for an MXA28A package whose exposed-DAP is soldered to a 2in2 piece of 1 ounce printed circuit board copper on a bottom side layer
through 21 8mil vias.
Note 5: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 1in 2 piece of 1 ounce printed circuit board copper.
Note 6: The θJA given is for an MXA28A package whose exposed-DAP is not soldered to any copper.
Note 7: All voltages are measured with respect to the ground pins, unless otherwise specified. All specifications are tested using the typical application as shown
in Figure 2.
Note 8: When driving 3Ω loads from a 5V supply the LM4839MTE exposed DAP must be soldered to the circuit board and forced-air cooled.
Note 9: When driving 4Ω loads from a 5V supply the LM4839MTE exposed DAP must be soldered to the circuit board.
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device
is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 11: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX − TA )/θJA. For the LM4839MT, TJMAX = 150°C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 80°C/W assuming the MTC28 package.
Note 12: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 13: Machine Model, 220 pF–240 pF discharged through all pins.
Note 14: Typicals are measured at 25°C and represent the parametric norm.
Note 15: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Lare aranteed to National's AOQL (Average
Outgoing Quality Level).
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Typical Application
5
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Truth Table for Logic Inputs (Note 16)
Single-Ended
Output
Mute
Mux Control
HP Sense
Inputs Selected
Bridged Output
0
0
0
0
1
0
0
1
1
X
0
1
0
1
X
Left In 1, Right In 1
Left In 1, Right In 1
Left In 2, Right In 2
Left In 2, Right In 2
-
Vol. Adjustable
Muted
-
Vol. Adjustable
-
Vol. Adjustable
Muted
Vol. Adjustable
Muted
Muted
Note 16: If system beep is detected on the Beep in pin (pin 11) and beep is fed to inputs, the system beep will be passed through the bridged amplifier regardless
of the logic of the Mute, HP sense, or DC Volume Control pins.
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Typical Performance Characteristics
MTE Specific Characteristics
LM4839MTE
THD+N vs Output Power
LM4839MTE
THD+N vs Frequency
20013470
20013471
LM4839MTE
THD+N vs Output Power
LM4839MTE
D+N vs Frequency
472
20013473
LM4839MTE
Power Dissipation vs OuPower
LM4839MTE (Note 17)
Power Derating Curve
20013465
20013464
Note 17: These curves show the thermal dissipation ability of the LM4839MTE at different ambient temperatures given these conditions:
ꢀꢀ500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
ꢀꢀ2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.
ꢀꢀ 2in2: The part is soldered to a 2in2, 1oz. copper plane.
ꢀꢀ1in2: The part is soldered to a 1in2, 1oz. copper plane.
ꢀꢀNot Attached: The part is not soldered down and is not forced-air cooled.
7
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Typical Performance Characteristics
Non-MTE Specific Characteristics
THD+N vs Frequency
THD+N vs Frequency
HD+N vs Frequency
THD+N vs Frequency
20013457
20013458
20013415
20013417
THD+N vs Frequency
4
THD+N vs Freque
20013416
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THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
D+vs Frequency
THD+N vs Output Power
20013418
20013420
20013422
20013419
20013421
20013424
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THD+N vs Output Power
THD+N vs Output Power
20013425
20013426
THD+N vs Output Power
THN vs Output Power
20013427
20013428
THD+N vs Output Power
THD+N vs Output Power
20013430
20013429
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THD+N vs Output Power
THD+N vs Output Power
20013431
20013432
THD+N vs Output Power
TH+N vs Output Power
20013434
20013433
THD+N vs Output Voltage
Docking Station Pins
THD+N vs Output Voltage
Docking Station Pins
20013459
20013460
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Output Power vs
Load Resistance
Output Power vs
Load Resistance
20013462
20013406
Output Power vs
Load Resistance
weupply
Reon Ratio
20013435
01
Dropout Voltage
Output Power vs
Load Resistance
20013453
20013408
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Noise Floor
Noise Floor
20013441
20013442
Volume Control
Characteristics
wer Dissipation vs
Out Power
20013436
20013451
Power Dissipation vs
Output Power
External Gain/Bass Boost
Characteristics
20013452
20013461
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Power Derating Curve
Crosstalk
20013449
20013463
Crosstalk
Output Power
vs pply voltage
20013450
20013454
Output Power
vs Supply Voltage
Supply Current
vs Supply Voltage
20013456
20013409
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Typical Performance Characteristics
Output Power vs
Load Resistance
Output Power vs
Load Resistance
20013462
20013406
Output Power vs
Load Resistance
Power Supply
Rejection Ratio
20013435
20013407
Dropout Vol
Output Power vs
Load Resistance
20013453
20013408
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Noise Floor
Noise Floor
20013441
20013442
Volume Control
Characteristics
wer Dissipation vs
Out Power
20013436
20013451
Power Dissipation vs
Output Power
External Gain/
Bass Boost
Characteristics
20013452
20013461
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Power Derating Curve
Crosstalk
20013449
20013463
Crosstalk
Output Power
vs pply voltage
20013450
20013454
Output Power
vs Supply Voltage
Supply Current
vs Supply Voltage
20013456
20013409
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Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply's output voltage de-
creases with increasing load current. Reduced supply voltage
causes decreased headroom, output signal clipping, and re-
duced output power. Even with tightly regulated supplies,
trace resistance creates the same effects as poor supply reg-
ulation. Therefore, making the power supply traces as wide
as possible helps maintain full output voltage swing.
Application Information
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4839's exposed-DAP (die attach paddle) packages
(MTE, LQ) provide a low thermal resistance between the die
and the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding PCB
copper traces, ground plane and, finally, surrounding air. The
result is a low voltage audio power amplifier that produces
2.1W at ≤ 1% THD with a 4Ω load. This high power is
achieved through careful consideration of necessary thermal
design. Failing to optimize thermal design may compromise
the LM4839's high power performance and activate unwant-
ed, though necessary, thermal shutdown protection.
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4839 output stage consists of
two pairs of operational amplifiers, forming a two-channel
(channel A and channel B) stereo amplifier. (Though the fol-
lowing discusses channel A, it applies equally to channel B.)
Figure 1 shows that the first amplifier's negative (-) output
serves as the second amplifier's input. This results in both
amplifiers producing signals identical in magnitude, but 180°
out of phase. Takiadvantage of this phase difference, a
load is placed been OUTA and +OUTA and driven dif-
ferentially (comly eferrd to as “bridge mode”). This
results in a dferenain
The MTE and LQ packages must have their exposed DAPs
soldered to a grounded copper pad on the PCB. The DAP's
PCB copper pad is connected to a large plane of continuous
unbroken copper. This plane forms a thermal mass and heat
sink and radiation area. Place the heat sink area on either
outside plane in the case of a two-sided PCB, or on an inner
layer of a board with more than two layers. Connect the DAP
copper pad to the inner layer or backside copper heat sink
area with 32(4x8) (MTE) or 6(3x2) (LQ) vias. The via diameter
should be 0.012in–0.013in with a 1.27mm pitch. Ensure effi-
cient thermal conductivity by plating-through and solder-filling
the vias.
AVD = 2 * (Rf/R i)
(1)
Bge mde amplifiers are different from single-ended am-
rs t drive loads connected between a single amplifier's
outpd gund. For a given supply voltage, bridge mode
has a diadvantage over the single-ended configuration:
its differential output doubles the voltage swing across
the lo. This produces four times the output power when
red to a single-ended amplifier under the same condi-
tio. This increase in attainable output power assumes that
the amplifier is not current limited or that the output signal is
not clipped. To ensure minimum output signal clipping when
choosing an amplifier's closed-loop gain, refer to the Audio
Power Amplifier Design section.
Another advantage of the differential bridge output is no net
DC voltage across the load. This is accomplished by biasing
channel A's and channel B's outputs at half-supply. This elim-
inates the coupling capacitor that single supply, single-ended
amplifiers require. Eliminating an output coupling capacitor in
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier share
the same PCB layer, a nominal 2.5in2 (min) area is necessary
for 5V operation with a 4Ω load. Heatsink areas not placed on
the same PCB layer as the LM4839 should be 5in2 (min) for
the same supply voltage and load resistance. The last t
area recommendations apply for 25°C ambient temper
Increase the area to compensate for ambient tempe
above 25°C. In systems using cooling fans, the LM48
can take advantage of forced air cooling. With an air flow
of 450 linear-feet per minute and a 2.5in2 expod copper or
5.0in2 inner layer copper plane heatsink, the L839an
continuously drive a 3Ω load to full power. T483Q
achieves the same output power level without forced air ol-
ing. In all circumstances and conditionnction tper-
ature must be held below 150°C tating the
LM4839's thermal shutdown protectio9's power
de-rating curve in the Typical Performaracteris-
tics shows the maximum powtion vus tempera-
ture. Example PCB layouts fd-DAP TSSOP and
LQ packages are shown in ation Board Lay-
out section. Further detailec information con-
cerning PCB layout, fabricationounting an LQ (LLP)
package is available in National Semiconductor's AN1187.
a
single-ended configuration forces
a
single-supply
amplifier's half-supply bias voltage across the load. This in-
creases internal IC power dissipation and may permanently
damage loads such as speakers.
POWER DISSIPATION
Power dissipation is a major concern when designing a suc-
cessful single-ended or bridged amplifier. Equation (2) states
the maximum power dissipation point for a single-ended am-
plifier operating at a given supply voltage and driving a spec-
ified output load.
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load's impedance. As load impedance
decreases, load dissipation becomes increasingly dependent
on the interconnect (PCB trace and wire) resistance between
the amplifier output pins and the load's connections. Residual
trace resistance causes a voltage drop, which results in power
dissipated in the trace and not in the load as desired. For ex-
ample, 0.1Ω trace resistance reduces the output power dis-
sipated by a 4Ω load from 2.1W to 2.0W. This problem of
decreased load dissipation is exacerbated as load impedance
decreases. Therefore, to maintain the highest load dissipation
and widest output voltage swing, PCB traces that connect the
output pins to a load must be as wide as possible.
2
PDMAX = (VDD)2/(2π RL) Single-Ended
(2)
However, a direct consequence of the increased power de-
livered to the load by a bridge amplifier is higher internal
power dissipation for the same conditions.
The LM4839 has two operational amplifiers per channel. The
maximum internal power dissipation per channel operating in
the bridge mode is four times that of a single-ended amplifier.
From Equation (3), assuming a 5V power supply and a 4Ω
load, the maximum single channel power dissipation is 1.27W
or 2.54W for stereo operation.
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POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is crit-
ical for low noise performance and high power supply rejec-
tion. Applications that employ a 5V regulator typically use a
10 µF in parallel with a 0.1 µF filter capacitor to stabilize the
regulator's output, reduce noise on the supply line, and im-
prove the supply's transient response. However, their pres-
ence does not eliminate the need for a local 1.0 µF tantalum
bypass capacitance connected between the LM4839's supply
pins and ground. Do not substitute a ceramic capacitor for the
tantalum. Doing so may cause oscillation. Keep the length of
leads and traces that connect capacitors between the
LM4839's power supply pin and ground as short as possible.
Connecting a 1µF capacitor, CB, between the BYPASS pin
and ground improves the internal bias voltage's stability and
improves the amplifier's PSRR. The PSRR improvements in-
crease as the bypass pin capacitor value increases. Too large
a capacitor, howe, increases turn-on time and can com-
promise the amer's ick and pop performance. The se-
lection of bypasor vaes, especially CB, depends on
desired PSRrequenclick and pop performance (as
explained he sectionper Selection of External Com-
ponentem cost, and size constraints.
2
PDMAX = 4 * (VDD)2/(2π RL) Bridge Mode
(3)
The LM4839's power dissipation is twice that given by Equa-
tion (2) or Equation (3) when operating in the single-ended
mode or bridge mode, respectively. Twice the maximum pow-
er dissipation point given by Equation (3) must not exceed the
power dissipation given by Equation (4):
PDMAX′ = (TJMAX − TA)/θJA
(4)
The LM4839's TJMAX = 150°C. In the LQ package soldered to
a DAP pad that expands to a copper area of 5in2 on a PCB,
the LM4839's θJA is 20°C/W. In the MTE package soldered to
a DAP pad that expands to a copper area of 2in2 on a PCB,
the LM4839's θJA is 41°C/W. For the LM4839MT package,
θJA = 80°C/W. At any given ambient temperature TA, use
Equation (4) to find the maximum internal power dissipation
supported by the IC packaging. Rearranging Equation (4) and
substituting PDMAX for PDMAX′ results in Equation (5). This
equation gives the maximum ambient temperature that still
allows maximum stereo power dissipation without violating
the LM4839's maximum junction temperature.
PROPER SELEN OF EXTERNAL COMPONENTS
Omizing the LM4839's performance requires properly se-
ng ernal components. Though the LM4839 operates
wen usg external components with wide tolerances,
best pnce is achieved by optimizing component val-
ues.
TA = TJMAX – 2*PDMAX θJA
(5)
For a typical application with a 5V power supply and an 4Ω
load, the maximum ambient temperature that allows maxi-
mum stereo power dissipation without exceeding the m
mum junction temperature is approximately 99°C for t
package and 45°C for the MTE package.
The L839 is unity-gain stable, giving a designer maximum
siflexibility. The gain should be set to no more than a
giapplication requires. This allows the amplifier to achieve
minimum THD+N and maximum signal-to-noise ratio. These
parameters are compromised as the closed-loop gain in-
creases. However, low gain circuits demand input signals with
greater voltage swings to achieve maximum output power.
Fortunately, many signal sources such as audio CODECs
have outputs of 1VRMS (2.83VP-P). Please refer to the Audio
Power Amplifier Design section for more information on se-
lecting the proper gain.
TJMAX = PDMAX
θJA + TA
(6
Equation (6) gives the maximum junction mperae
TJMAX. If the result violates the LM4839's X150°C, ruce
the maximum junction temperature ing the power
supply voltage or increasing the loaurther al-
lowance should be made for increastempera-
tures.
Input Capacitor Value Selection
Amplifying the lowest audio frequencies requires a high value
input coupling capacitor (0.33µF in Figure 1). A high value
capacitor can be expensive and may compromise space ef-
ficiency in portable designs. In many cases, however, the
speakers used in portable systems, whether internal or ex-
ternal, have little ability to reproduce signals below 150Hz.
Applications using speakers with this limited frequency re-
sponse reap little improvement by using a large input capac-
itor.
The above examples assume e is a surface mount
part operating around the mr dissipation point.
Since internal power dissipan of output power,
higher ambient temperatures as output power or
duty cycle decreases.
If the result of Equation (2) is greater than that of Equation (3),
then decrease the supply voltage, increase the load
impedance, or reduce the ambient temperature. If these mea-
sures are insufficient, a heat sink can be added to reduce
Besides effecting system cost and size, the input coupling
capacitor has an affect on the LM4835's click and pop per-
formance. When the supply voltage is first applied, a transient
(pop) is created as the charge on the input capacitor changes
from zero to a quiescent state. The magnitude of the pop is
directly proportional to the input capacitor's size. Higher value
capacitors need more time to reach a quiescent DC voltage
(usually VDD/2) when charged with a fixed current. The
amplifier's output charges the input capacitor through the
feedback resistor, Rf. Thus, pops can be minimized by se-
lecting an input capacitor value that is no higher than neces-
sary to meet the desired −3dB frequency.
θ
JA. The heat sink can be created using additional copper
area around the package, with connections to the ground pin
(s), supply pin and amplifier output pins. External, solder at-
tached SMT heatsinks such as the Thermalloy 7106D can
also improve power dissipation. When adding a heat sink, the
θ
JA is the sum of θJC, θCS, and θSA. (θJC is the junction-to-case
thermal impedance, θCS is the case-to-sink thermal
impedance, and θSA is the sink-to-ambient thermal
impedance.) Refer to the Typical Performance Character-
istics curves for power dissipation information at lower output
power levels.
19
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
www.national.com
As shown in Figure 1, the input resistors (RIN = 20K) and the
input capacitosr (CIN = 0.33µF) produce a −6dB high pass
filter cutoff frequency that is found using Equation (7).
These 20K resistors are shown in Figure 1 (RIN, RF ) and
they set each input amplifier's gain to -1. Use Equation 8 to
determine the input and feedback resistor values for a desired
gain.
- Av = RF / Ri
(8)
(7)
Adjusting the input amplifier's gain sets the minimum gain for
that channel. Although the single ended outputs of the Bridge
Output Amplifiers can be used to drive line level outputs, it is
recommended that the R & L Dock Outputs simpler signal
path be used for better performance.
As an example when using a speaker with a low frequency
limit of 150Hz, the input coupling capacitor using Equation (7),
is 0.063µF. The 0.33µF input coupling capacitor shown in
Figure 1allows the LM4839 to drive high efficiency, full range
speaker whose response extends below 30Hz.
STEREO-INPUT MULTIPLEXER (STEREO MUX)
OPTIMIZING CLICK AND POP REDUCTION
PERFORMANCE
The LM4839 has two stereo inputs. The MUX CONTROL pin
controls which stereo input is active. Applying 0V to the MUX
CONTROL pin sets stereo input 1. Applying VDD to the
MUX CONTROL n sects stereo input 2.
The LM4839 contains circuitry that minimizes turn-on and
shutdown transients or “clicks and pops”. For this discussion,
turn-on refers to either applying the power supply voltage or
when the shutdown mode is deactivated. While the power
supply is ramping to its final value, the LM4839's internal am-
plifiers are configured as unity gain buffers. An internal current
source changes the voltage of the BYPASS pin in a con-
trolled, linear manner. Ideally, the input and outputs track the
voltage applied to the BYPASS pin. The gain of the internal
amplifiers remains unity until the voltage on the bypass pin
reaches 1/2 VDD . As soon as the voltage on the bypass pin
is stable, the device becomes fully operational. Although the
BYPASS pin current cannot be modified, changing the size of
CB alters the device's turn-on time and the magnitude of
“clicks and pops”. Increasing the value of CB reduces the
magnitude of turn-on pops. However, this presents a tradeoff:
as the size of CB increases, the turn-on time increases.
is a linear relationship between the size of CB and the
time. Here are some typical turn-on times for various
of CB:
BEEP DETECT FION
Computers nd notebproduce a system "beep" signal
that drivsmall speaker. The speaker's auditory output
signifiehat system requires user attention or input. To
accommodate thystem alert signal, the LM4839's beep
inppin is a mono input that accepts the beep signal. Internal
ll detion circuitry at this input monitors the beep signal's
me. Wn a signal level greater than VDD/2 is detected
on the N pin, the bridge output amplifiers are enabled.
The beep gnal is amplified and applied to the load connect-
ed to the output amplifiers. A valid beep signal will be applied
the ad even when MUTE is active. Use the input resistors
ccted between the BEEP IN pin and the stereo input pins
to accommodate different beep signal amplitudes. These re-
sistors are shown as 200kΩ devices in Figure 1. Use higher
value resistors to reduce the gain applied to the beep signal.
The resistors must be used to pass the beep signal to the
stereo inputs. The BEEP IN pin is used only to detect the beep
signal's magnitude: it does not pass the signal to the output
amplifiers. The LM4839's shutdown mode must be deactivat-
ed before a system alert signal is applied to the BEEP IN pin.
CB
0.01µF
TON
2ms
0.1µF
0.22µF
0.47µF
1.0µF
MICRO-POWER SHUTDOWN
The voltage applied to the SHUTDOWN pin controls the
LM4839's shutdown function. Activate micro-power shutdown
by applying VDD to the SHUTDOWN pin. When active, the
LM4839's micro-power shutdown feature turns off the
amplifier's bias circuitry, reducing the supply current. The log-
ic threshold is typically VDD/2. The low 0.7 µA typical shut-
down current is achieved by applying a voltage that is as near
as VDD as possible, to the SHUTDOWN pin. A voltage that is
less than VDD may increase the shutdown current. Logic Level
Truth Table shows the logic signal levels that activate and
deactivate micro-power shutdown and headphone amplifier
operation.
200m
DOCKING STATION
Applications such as notebook computers can take advan-
tage of a docking station to connect to external devices such
as monitors or audio/visual equipment that sends or receives
line level signals. The LM4839 has two outputs, Right Dock
and Left Dock which connect to outputs of the internal input
amplifiers that drive the volume control inputs. These input
amplifiers can drive loads of >1kΩ (such as powered speak-
ers) with a rail-to-rail signal. Since the output signal present
on the RIGHT DOCK and LEFT DOCK pins is biased to
VDD/2, coupling capacitors should be connected in series with
the load. Typical values for the coupling capacitors are 0.33µF
to 1.0µF. If polarized coupling capacitors are used, connect
their "+" terminals to the respective output pin.
There are a few ways to control the micro-power shutdown.
These include using a single-pole, single-throw switch, a mi-
croprocessor, or a microcontroller. When using a switch,
connect an external 10kΩ pull-up resistor between the SHUT-
DOWN pin and VDD. Connect the switch between the SHUT-
DOWN pin and ground. Select normal amplifier operation by
closing the switch. Opening the switch connects the SHUT-
DOWN pin to VDD through the pull-up resistor, activating
micro-power shutdown. The switch and resistor guarantee
that the SHUTDOWN pin will not float. This prevents unwant-
ed state changes. In a system with a microprocessor or a
microcontroller, use a digital output to apply the control volt-
Since the DOCK outputs precede the internal volume control,
the signal amplitude will be equal to the input signal's magni-
tude and cannot be adjusted. However, the input amplifier's
closed-loop gain can be adjusted using external resistors.
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20
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
age to the SHUTDOWN pin. Driving the SHUTDOWN pin with
active circuitry eliminates the need for a pull up resistor.
TABLE 1. Logic Level Truth Table for SHUTDOWN, HP-IN, and MUX Operation
SHUTDOWN
PIN
MUX CHANNEL
SELECT PIN
OPERATIONAL MODE
(MUX INPUT CHANNEL #)
HP-IN PIN
Logic Low
Logic Low
Logic Low
Logic Low
Logic High
Logic Low
Logic Low
Logic High
Logic High
X
Logic Low
Logic High
Logic Low
Logic High
X
Bridged Amplifiers (1)
Bridged Amplifiers (2)
Single-Ended Amplifiers (1)
Single-Ended Amplifiers (2)
Micro-Power Shutdown
MUTE FUNCTION
The LM4839 mutes the amplifier and DOCK outputs when
VDD is applied to pin 5, the MUTE pin. Even while muted, the
LM4839 will amplify a system alert (beep) signal whose mag-
nitude satisfies the BEEP DETECT circuitry. Applying 0V to
the MUTE pin returns the LM4839 to normal, unmated oper-
ation. Prevent unanticipated mute behavior by connecting the
MUTE pin to VDD or ground. Do not let the mute pin float.
HP SENSE FUNCTION ( Head Phone In )
Applying a voltage between 4V and VDD to the LM4839's HP-
IN headphone control pin turns off the amps that drive the left
out "+" and right out "+" pins. ( Pins 15 and 20 on the MT/MTE
& 12 and 25 on the LQ ). This action mutes a bridged-con-
nected load. Quiescent current consumption is reduced when
the IC is in this single-ended mode.
Figure 2 shows the implementation of the LM4839's head-
phone control function. With no headphones connected to the
headphone jack, the R1-R2 voltage divider sets the volt
applied to the HP Sense pin at approximately 50mV
50mV puts the LM4839 into bridged mode operatio
output coupling capacitor blocks the amplifier's half sup
voltage, protecting the headphones.
20013404
FIGURE 2. Headphone Sensing Circuit (MT/MTE Pinout)
BASS BOOST FUNCTION
The HP-IN threshold is set at 4V. While the LM39 operates
in bridged mode, the DC potential across the d n-
tially 0V. Therefore, even in an ideal situation, the out
swing cannot cause a false single-endeger. Conning
headphones to the headphone jack ethe head-
phone jack contact pin from R2 and ll the HP
Sense pin up to VDD through R4. This eneadphone
function, turns off both of the "+" output amand mutes
the bridged speaker. The an drives the head-
phones, whose impedance ih resistors R2 and
R3. These resistors have non the LM4839's
output drive capability since tmpedance of head-
phones is 32Ω.
Figure 2 also shows the suggested headphone jack electrical
connections. The jack is designed to mate with a three-wire
plug. The plug's tip and ring should each carry one of the two
stereo output signals, whereas the sleeve should carry the
ground return. A headphone jack with one control pin contact
is sufficient to drive the HP-IN pin when connecting head-
phones.
The Bass Boost Function can be toggled by changing the
logic at the Bass Boost Select pin. A logic low will switch the
power amplifiers to bass boost mode. In bass boost mode,
the low frequency gain of the ampflifier is set by the external
CBS capacitor in Figure 1. Where as a logic high sets the
amplifiers to unity gain.
In some cases, a designer may want to improve the low fre-
quency response of the bridged amplifier or incorporate a
bass boost feature. This bass boost can be useful in systems
where speakers are housed in small enclosures. If the de-
signer wishes to dsiable the bass boost feature, pin 19 ( MT/
MTE packages ) can be tied to VDD
.
When the bass boost is enabled, the output amplifiers will be
internally set at a gain of 2 at low frequencies (gain of 4 in
bridged mode). As shown in Figure 1, CBS sets the cutoff
frequency for the bass boost. At low frequencies, the capac-
itor will be virtually an open circuit. At high frequencies, the
capacitor will be virtually a short circuit. As a result of this, the
gain of the bridge amplifier is increased as low frequencies.
A first order pole is formed with a corner frequency at:
A microprocessor or a switch can replace the headphone jack
contact pin. When a microprocessor or switch applies a volt-
age greater than 4V to the HP-IN pin, a bridge-connected
speaker is muted and the single ended output amplifiers A1
and A2 will drive a pair of headphones.
fc = 1/(2π10kΩCBS)
(9)
With CBS = 0.1uF, a first order pole is formed with a corner
frequency of 160Hz.
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
www.national.com
DC VOLUME CONTROL
of the step width, as shown in Volume Control Characteriza-
tion Graph (DS200133-40).
The LM4839 has an internal stereo volume control whose
setting is a function of the DC voltage applied to the DC VOL
CONTROL pin.
For highest accuracy, the voltage shown in the 'recommend-
ed voltage' column of the table is used to select a desired gain.
This recommended voltage is exactly halfway between the
two nearest transitions to the next highest or next lowest gain
levels.
The LM4839 volume control consists of 31 steps that are in-
dividually selected by a variable DC voltage level on the
volume control pin. The range of the steps, controlled by the
DC voltage, are from 0dB - 78dB. Each gain step corresponds
to a specific input voltage range, as shown in table 2.
The gain levels are 1dB/step from 0dB to -6dB, 2dB/step from
-6dB to -36dB, 3dB/step from -36dB to -47dB, 4dB/step from
-47db to -51dB, 5dB/step from -51dB to -66dB, and 12dB to
the last step at -78dB.
To minimize the effect of noise on the volume control pin,
which can affect the selected gain level, hysteresis has been
implemented. The amount of hysteresis corresponds to half
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22
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
Volume Control Table ( Table 2 )
Gain
Voltage Range (% of Vdd)
(dB)
Voltage Range (Vdd = 5)
Voltage Range (Vdd = 3)
Low
High
Recommended Low
High
Recommended Low
High
Recommended
0
77.5%
75.0%
72.5%
70.0%
67.5%
65.0%
62.5%
60.0%
57.5%
55.0%
52.5%
50.0%
47.5%
45.0%
42.5%
40.0%
37.5%
35.0%
32.5%
30.0%
27.5%
25.0%
22.5%
20.0%
17.5%
15.0%
12.5%
10.0%
7.5%
100.00% 100.000%
3.875
3.750
3.625
3.500
3.375
3.250
3.125
3.000
2.875
2.750
2.625
2.500
2.375
2.250
2.125
2.000
1.875
1.750
1.625
1.500
1.37
1.
1.1
1.000
0.
.75
0.6
0.500
0.375
0.250
0.000
5.000
3.938
3.813
3.688
3.563
3.438
3.313
3.188
3.063
2.938
2.813
2.688
2.563
2.438
2.313
2.188
2.063
1.938
3
1.68
63
88
1.063
0.937
0.812
0.687
0.562
0.437
0.312
5.000
3.844
3.719
3.594
3.469
3.344
3.219
3.094
2.969
2.844
2.719
2.594
2.46
2.34
219
2.0
9
1.8
1.719
94
1.469
1.344
1.219
1.094
0.969
0.844
0.719
0.594
0.469
0.344
0.000
2.325
2.250
2.175
2.100
2.025
1.950
1.875
1.800
1.725
1.50
575
1.425
1.350
1.275
1.200
1.125
1.050
0.975
0.900
0.825
0.750
0.675
0.600
0.525
0.450
0.375
0.300
0.225
0.150
0.000
3.000
2.363
2.288
2.213
2.138
2.063
1.988
1.913
1.838
1.763
1.688
1.613
1.538
1.463
1.388
1.313
1.238
1.163
1.088
1.013
0.937
0.862
0.787
0.712
0.637
0.562
0.487
0.412
0.337
0.262
0.187
3.000
2.306
2.231
2.156
2.081
2.006
1.931
1.856
1.781
1.706
1.631
1.556
1.481
1.406
1.331
1.256
1.181
1.106
1.031
0.956
0.881
0.806
0.731
0.656
0.581
0.506
0.431
0.356
0.281
0.206
0.000
-1
78.5%
76.875%
74.375%
71.875%
69.375%
66.875%
64.375%
61.875%
59.375%
56.875%
54.375%
51.875%
49.375%
46.875%
44.375%
41.875%
39.375%
36.875%
34.375%
31.875%
29.375%
26.875%
24.375%
21.875%
19.375%
16.875%
14.375
11.
9.37
-2
76.25%
73.75%
71.25%
68.75%
66.25%
63.75%
61.25%
58.75%
56.25%
53.75%
51.25%
48.75%
46.25%
43.75%
41.25%
38.75%
36.25%
33.75%
31.25%
28.75%
26.25%
23.75%
21.25%
18.75%
16.25%
13.75%
11.25%
8.75%
-3
-4
-5
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
-32
-34
-36
-39
-42
-45
-47
-51
-56
-61
-66
-78
5.0%
6.875%
0.0%
6.25%
23
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
pass band magnitude variation limit, the low frequency re-
sponse must extend to at least one-fifth the lower bandwidth
limit and the high frequency response must extend to at least
five times the upper bandwidth limit. The gain variation for
both response limits is 0.17dB, well within the ±0.25dB de-
sired limit. The results are an
Audio Power Amplifier Design
Audio Amplifier Design: Driving 1W into an 8Ω Load
The following are the desired operational parameters:
Power Output:
Load Impedance:
Input Level:
1 WRMS
8Ω
fL = 100Hz/5 = 20Hz
(13)
1 VRMS
Input Impedance:
Bandwidth:
20 kΩ
and an
100 Hz−20 kHz ± 0.25 dB
fH = 20kHz x 5 = 100kHz
(14)
The design begins by specifying the minimum supply voltage
necessary to obtain the specified output power. One way to
find the minimum supply voltage is to use the Output Power
vs Supply Voltage curve in the Typical Performance Char-
acteristics section. Another way, using Equation (11), is to
calculate the peak output voltage necessary to achieve the
desired output power for a given load impedance. To account
for the amplifier's dropout voltage, two additional voltages,
based on the Dropout Voltage vs Supply Voltage in the Typ-
ical Performance Characteristics curves, must be added to
the result obtained by Equation (11). The result is Equation
(12).
As mentioned in the Selecting Proper External Compo-
nents section, Ri (Rght & Left) and Ci (Right & Left) create a
highpass filter thsets the amplifier's lower bandpass fre-
quency limit. Fihe cpling capacitor's value using Equa-
tion (17).
Ci≥ 1/(2πR ifL)
(15)
Thesult is
1/(2π*20kΩ*20Hz) = 0.397μF
(16)
(10)
se a 39μF capacitor, the closest standard value.
VDD ≥ (VOUTPEAK+ (VOD + VOD ))
(11)
TOP
BOT
The product of the desired high frequency cutoff (100kHz in
this example) and the differential gain AVD, determines the
upper passband response limit. With AVD = 3 and fH = 100kHz,
the closed-loop gain bandwidth product (GBWP) is 300kHz.
This is less than the LM4839's 3.5MHz GBWP. With this mar-
gin, the amplifier can be used in designs that require more
differential gain while avoiding performance,restricting band-
width limitations.
The Output Power vs Supply Voltage graph for an 8
indicates a minimum supply voltage of 4.6V. This is eas
by the commonly used 5V supply voltage. The aditional
age creates the benefit of headroom, allowing LM4839 to
produce peak output power in excess of 1W hout ng
or other audible distortion. The choice of supplge st
also not create a situation that violates omaximum per
dissipation as explained above in ther Dissition
section.
Recommended Printed Circuit
Board Layout
Figures 4 through 8 show the recommended four-layer PC
board layout that is optimized for the 8-pin LQ-packaged
LM4839 and associated external components. This circuit is
designed for use with an external 5V supply and 4Ω speakers.
After satisfying the LM4839's power disirements,
the minimum differential gain needed to acW dissipa-
tion in an 8Ω load is found usion (13
(12)
This circuit board is easy to use. Apply 5V and ground to the
board's VDD and GND pads, respectively. Connect 4Ω speak-
ers between the board's −OUTA and +OUTA and OUTB and
+OUTB pads.
Thus, a minimum overall gain of 2.83 allows the LM4839's to
reach full output swing and maintain low noise and THD+N
performance.
The last step in this design example is setting the amplifier's
−3dB frequency bandwidth. To achieve the desired ±0.25dB
www.national.com
24
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
20013478
FIGURE 3. Recommended LQ PC BLayout:Component-Side Silkscreen
20013479
FIGURE 4. Recommended LQ PC Board Layout:Component-Side Layout
25
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
20013480
FIGURE 5. Recommended LQ PC Layout:
Upper Inne-Layer Layout
20013481
FIGURE 6. Recommended LQ PC Board Layout:
Lower Inner-Layer Layout
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26
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
20013482
FIGURE 7. Recommended LQ PC Layout:
Bottom-Side Layout
27
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
Analog Audio LM4839 LLP28 Eval Board (LQ Package)
Assembly Part Number: 980011368-100
Revision: A1
Bill of Material
Item Part Number
Part Description
Qty Ref Designator
Remark
1
551011368-001 LM4838 Eval Board PCB etch 1
001
10
20
482911368-001 LM4838 28L LLP
1
2
U4
151911368-001 Cer Cap 0.068µF 50V 10%
1206
CBB1, CBB2
25
26
152911368-001 Tant Cap 0.1µF 10V 10% Size 3
= A 3216
CS1, CS2, CV
152911368-002 Tant Cap 0.33µF 10V 10%
Size = A 3216
5
Cin1, Cin2, Cin3, Cin4, (Cin5 -
CBEEPIN- not en on Fig 1,
only exists oQ Dmo
Board)
27
28
29
152911368-003 Tant Cap 1µF 16V 10% Size = 3
A 3216
CB, C01, 02
152911368-004 Tant Cap 10µF 10V 10% Size
= C 6032
1
CS3
152911368-005 Tant Cap 220µF 16V 10% Size 2
= D 7343
out1Cout2
RL
30
31
472911368-001 Res 150Ohm 1/8W 1% 1206
2
472911368-002 Res 20k Ohm 1/8W 1% 1206 10 Rin1, 2, RF1, RF2
Rl1l2, RBS1, RBS2
ck1, Rdock2
32
33
40
472911368-003 Res 100k Ohm 1/8W
472911368-004 Res 200k Ohm 1/16W
RS, RPU
Rbeep1, Rbeep2
U2
131911368-001 Stereo Headphone J
Switch
4
1
3
3
3
Mouser #
161-3500
41
42
43
44
45
131911368-002 Slide Switch
131911368-003 Potentiter
131911368-004 RC
Mode, Mute, Gain, SD
U1
Mouser #
10SP003
Mouser #
317-290-100K
RightIn, BeepIn, LeftIn
GND, Right Out-, Left Out-
Vdd, Right Out+, Left Out+
Mouser #
16PJ097
131911368-005 a JacBlack
131911368-00ack, Red
Mouser #
ME164-6219
Mouser #
ME164-6218
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28
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
Recommended Printed Circuit
Board Layout - MT/MTE Packages
20013484
Top Layer SilPad - Not to Scale )
20013485
Top Layer - ( Not to Scale )
29
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
20013486
Layer 2 - ( Not to Scale )
20013487
Layer 3 - ( Not to scale )
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30
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
20013488
Bottom Laye( Not to scale )
Analog Audi39 MSEval Board
Assembly r: 980011373-100
A
erial
Item Part Number
Part Description
Qty Ref Designator (on PCB) Remark
1
551011373-001 LM4839 Eval Board B 1
482911373-001 LM4839 MSOP
1
1
10
20
25
26
27
28
29
30
31
32
33
40
41
42
43
44
45
151911368-001 Cer Cap 0.068V 10% 16
152911368-001 Tant Cap 0.Size = A 3216
2
2
CBB (2)
CS (2)
152911368-002 Tant Cap 0.33Size = A 3216 4
CIN (4)
152911368-003 Tant C16V Size = A 3216
152911368-004 Tan0V 10% Size = C 6032
152911368-005 Tan6V 10% Size = D 7343
1
1
2
2
8
2
4
1
4
1
5
3
3
CBYPASS
CS1
COUT R, COUT L
RL (2)
472911368-001
Res 11% 1206
472911368-002 Res 20K Ohm 1/8W 1% 1206
472911368-003 Res 100K Ohm 1/8W 1% 1206
472911368-004 Res 200K Ohm 1/16W 1% 0603
131911368-001 Stereo Headphone Jack W/ Switch
131911368-002 Slide Switch
RIN, RF
R5, RPU
RBEEP (R)
Mouser # 161-3500
mute, max,SD, BASS
Volume Control
Mouser # 10SP003
131911368-003 Potentiometer
Mouser # 317-2090-100K
Mouser # 16PJ097
131911368-004 RCA Jack
131911368-005 Banana Jack, Black
131911368-006 Banana Jack, Red
Mouser # ME164-6219
Mouser # ME164-6218
31
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
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Physical Dimensions inches (millimeters) unless otherwise noted
age
OrM4839LQ
NS Package NumbeAA For Exposed-DAP LLP
www.national.com
32
200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
TSSOP Pack
Order Number LM48T
NS Package Number MTC28 fSOP
Exposed-DAP TSSOP Package
Order Number LM4839MTE
NS Package Number MXA28A for Exposed-DAP TSSOP
33
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200134 Version 5 Revision 5 Print Date/Time: 2011/09/24 09:56:40
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