LM4840MTX/NOPB [TI]
2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO28, TSSOP-28;
| 型号： | LM4840MTX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO28, TSSOP-28 光电二极管 商用集成电路 |
| 文件： | 总22页 (文件大小：829K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
December 2001
LM4840
Stereo 2W Audio Power Amplifiers
with Digital Volume Control and Input Mux
General Description
Key Specifications
n PO at 1% THD+N
The LM4840 is a monolithic integrated circuit that provides
digital volume control and stereo bridged audio power am-
plifiers capable of producing 2W into 4Ω (Note 1) with less
than 1.0% THD or 2.2W into 3Ω (Note 2) with less than 1.0%
THD.
n
n
n
into 3Ω (LM4840LQ, LM4840MH)
into 4Ω (LM4840LQ, LM4840MH)
into 8Ω (LM4840)
2.2W (typ)
2.0W (typ)
1.1W (typ)
n Single-ended mode - THD+N at 85mW into 32Ω
1.0%
Boomer® audio integrated circuits were designed specifically
to provide high quality audio while requiring a minimum
amount of external components. The LM4840 incorporates a
digital volume control, stereo bridged audio power amplifiers,
an input mux, and a last volume level memory function to
save the volume setting during shutdown. These features
make it optimally suited for multimedia monitors, portable
radios, desktop, and portable computer applications.
(typ)
n Shutdown current
0.2µA (typ)
Features
n PC98 and PC99 Compliant
n Digital Volume Control Interface
n System Beep Detect
n Stereo switchable bridged/single-ended power amplifiers
n “Click and pop” suppression circuitry
n Thermal shutdown protection circuitry
n Input Mux
n Capless headphone drivers
n Last volume memory from shutdown
The LM4840 features an externally controlled, low-power
consumption shutdown mode, and both a power amplifier
and headphone mute for maximum system flexibility and
performance.
Note 1: When properly mounted to the circuit board, the LM4840LQ and
LM4840MH will deliver 2W into 4Ω. The LM4840MT will deliver 1.1W into 8Ω.
See the Application Information section LM4840LQ and for LM4840MH us-
age information.
Note 2: An LM4840LQ and LM4840MH that have been properly mounted to
the circuit board and forced-air cooled will deliver 2.2W into 3Ω.
Applications
n Portable and Desktop Computers
n Multimedia Monitors
n Portable Radios, PDAs, and Portable TVs
Connection Diagram
LLP Package
DS200104-35
Top View
Order Number LM4840LQ
See NS Package Number LQA028A for Exposed-DAP LLP
Boomer® is a registered trademark of NationalSemiconductor Corporation.
© 2001 National Semiconductor Corporation
DS200104
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Connection Diagram (Continued)
TSSOP Package
DS200104-2
Top View
Order Number LM4840MT
See NS Package Number MTC28 for TSSOP
Order Number LM4840MH
See NS Package Number MXA28A for Exposed-DAP TSSOP
Block Diagram
DS200104-1
FIGURE 1. LM4840 Block Diagram
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2
Absolute Maximum Ratings (Note 10)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
θJC (typ)—LQA028A (Note
16)
3˚C/W
θJA (typ)—LQA028A (Note
16)
42˚C/W
θJC (typ)—MTC28
20˚C/W
80˚C/W
2˚C/W
Supply Voltage
6.0V
-65˚C to +150˚C
−0.3V to VDD +0.3V
Internally limited
2000V
θJA (typ)—MTC28
Storage Temperature
Input Voltage
θJC (typ)—MXA28A
θJA (typ)—MXA28A (Note 4)
θJA (typ)—MXA28A (Note 3)
θJA (typ)—MXA28A (Note 5)
θJA (typ)—MXA28A (Note 6)
41˚C/W
54˚C/W
59˚C/W
93˚C/W
Power Dissipation
ESD Susceptibility (Note 12)
ESD Susceptibility (Note 13)
Junction Temperature
200V
150˚C
Soldering Information
Small Outline Package
Vapor Phase (60 sec.)
Operating Ratings
215˚C
220˚C
Temperature Range
TMIN ≤ TA ≤TMAX
Infrared (15 sec.)
−40˚C ≤TA ≤ 85˚C
2.7V≤ VDD ≤ 5.5V
See AN-450 “Surface Mounting and their Effects on
Product Reliability” for other methods of soldering
surface mount devices.
Supply Voltage
See AN-1187 “Leadless Leadframe Package” for
detailed information on usage of LLP devices.
Electrical Characteristics for Entire IC
(Notes 7, 10)
The following specifications apply for VDD = 5V unless otherwise noted. Limits apply for TA = 25˚C.
LM4840
Units
(Limits)
Symbol
Parameter
Supply Voltage
Conditions
Typical
Limit
(Note 15)
(Note 14)
VDD
2.7
5.5
30
2.0
4
V (min)
V (max)
mA (max)
µA (max)
V (min)
IDD
ISD
VIH
VIL
Quiescent Power Supply Current
Shutdown Current
VIN = 0V, IO = 0A
VSHUTDOWN = VDD
12
0.7
Headphone Sense High Input Voltage
Headphone Sense Low Input Voltage
0.8
V (max)
Electrical Characteristics for Volume Attenuators
(Notes 7, 10)
The following specifications apply for VDD = 5V. Limits apply for TA = 25˚C.
LM4840
Units
(Limits)
Symbol
Parameter
Attenuator Range
Conditions
Typical
Limit
(Note 15)
(Note 14)
±
CRANGE
Gain with Digital Volume Max
Attenuation with Digital Volume Min
VMUTE = VDD, Bridged Mode
0
0.5
dB (max)
dB (min)
dB (min)
dB (min)
-81
-88
-88
-75
-78
-78
AM
Mute Attenuation
VMUTE = VDD, Single-Ended Mode
Electrical Characteristics for Single-Ended Mode Operation
(Notes 7, 10)
The following specifications apply for VDD = 5V. Limits apply for TA = 25˚C.
LM4840
Units
(Limits)
Symbol
PO
Parameter
Output Power
Conditions
Typical
Limit
(Note 14)
(Note 15)
THD = 1.0%; f = 1kHz; RL = 32Ω
THD = 10%; f = 1 kHz; RL = 32Ω
85
95
mW
mW
3
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Electrical Characteristics for Single-Ended Mode Operation (Continued)
(Notes 7, 10)
The following specifications apply for VDD = 5V. Limits apply for TA = 25˚C.
LM4840
Units
(Limits)
Symbol
THD+N
PSRR
SNR
Parameter
Total Harmonic Distortion+Noise
Power Supply Rejection Ratio
Signal to Noise Ratio
Conditions
Typical
Limit
(Note 14)
(Note 15)
VOUT = 1VRMS, f=1kHz, RL = 10kΩ,
0.065
58
%
AVD = 1
CB = 1.0 µF, f =120 Hz,
VRIPPLE = 200 mVrms
dB
dB
dB
POUT =75 mW, R = 32Ω, A-Wtd
102
65
L
Filter
Xtalk
Channel Separation
f=1kHz, CB = 1.0 µF
Electrical Characteristics for Bridged Mode Operation
(Notes 7, 10)
The following specifications apply for VDD = 5V, unless otherwise noted. Limits apply for TA = 25˚C.
LM4840
Units
(Limits)
Symbol
VOS
Parameter
Conditions
VIN = 0V, No Load
Typical
Limit
(Note 14)
(Note 15)
Output Offset Voltage
Output Power
5
50
mV (max)
W
PO
THD + N = 1.0%; f=1kHz; RL = 3Ω
2.2
(Note 8)
THD + N = 1.0%; f=1kHz; RL = 4Ω
2
W
(Note 9)
THD = 1.5% (max);f = 1 kHz;
1.1
1.0
W (min)
RL = 8Ω
THD+N = 10%;f = 1 kHz; RL = 8Ω
1.5
0.3
W
%
< <
20 kHz,
THD+N
Total Harmonic Distortion+Noise
PO = 1W, 20 Hz
f
RL = 8Ω, AVD = 2
PO = 340 mW, RL = 32Ω
1.0
74
%
PSRR
SNR
Xtalk
Power Supply Rejection Ratio
Signal to Noise Ratio
CB = 1.0 µF, f = 120 Hz,
dB
VRIPPLE = 200 mVrms; RL = 8Ω
VDD = 5V, POUT = 1.1W, RL = 8Ω,
A-Wtd Filter
93
70
dB
dB
Channel Separation
f=1kHz, CB = 1.0 µF
2
Note 3: The θ given is for an MXA28A package whose exposed-DAP is soldered to an exposed 2in piece of 1 ounce printed circuit board copper.
JA
2
Note 4: The θ given is for an MXA28A package whose exposed-DAP is soldered to a 2in piece of 1 ounce printed circuit board copper on a bottom side layer
JA
through 21 8mil vias.
2
Note 5: The θ given is for an MXA28A package whose exposed-DAP is soldered to an exposed 1in piece of 1 ounce printed circuit board copper.
JA
Note 6: The θ given is for an MXA28A package whose exposed-DAP is not soldered to any copper.
JA
Note 7: All voltages are measured with respect to the ground pins, unless otherwise specified. All specifications are tested using the typical application as shown
in Figure 1.
Note 8: When driving 3Ω loads from a 5V supply the LM4840LQ and LM4840MH must be mounted to the circuit board and forced-air cooled.
Note 9: When driving 4Ω loads from a 5V supply the LM4840LQ and LM4840MH must be mounted to the circuit board.
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Marshall Chiu feels there are better ways to obtain ’More
Wattage in the Cottage.’ Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device
performance.
Note 11: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
, θ , and the ambient temperature T . The maximum
JA A
JMAX
allowable power dissipation is P
= (T
− T )/θ . For the LM4840LQ and LM4840MT, T
= 150˚C, and the typical junction-to-ambient thermal
JMAX
DMAX
JMAX
A
JA
resistance, when board mounted, is 80˚C/W for the MTC28 package and 42˚C/W for the LM4840LQ package.
Note 12: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 13: Machine Model, 220 pF–240 pF discharged through all pins.
Note 14: Typicals are specified at 25˚C and represent the parametric norm.
Note 15: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
2
Note 16: Number given is for an LQA028A package whose exposed-DAP is soldered to an exposed 2.5in piece of 1 ounce PCB copper.
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4
MH and LQ Specific Characteristics
LM4840MH, LM4840LQ
THD+N vs Output Power
LM4840MH, LM4840LQ
THD+N vs Frequency
LM4840MH, LM4840LQ
THD+N vs Output Power
DS200104-70
DS200104-71
DS200104-72
LM4840MH, LM4840LQ
THD+N vs Frequency
LM4840MH, LM4840LQ
Power Dissipation vs Output Power
LM4840MH(Note 17)
Power Derating Curve
DS200104-65
DS200104-73
DS200104-64
Note 17: These curves show the thermal dissipation ability of the LM4840MH at different ambient temperatures given these conditions:
2
2
500LFPM + 2in : The part is soldered to a 2in , 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2
2
2in on bottom: The part is soldered to a 2in , 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.
2
2
2in : The part is soldered to a 2in , 1oz. copper plane.
2
2
1in : The part is soldered to a 1in , 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air cooled.
Typical Performance Characteristics
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
DS200104-57
DS200104-58
DS200104-14
5
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Typical Performance Characteristics (Continued)
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Output Power
DS200104-15
DS200104-18
DS200104-21
DS200104-16
DS200104-19
DS200104-22
DS200104-17
DS200104-20
DS200104-24
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Typical Performance Characteristics (Continued)
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
DS200104-25
DS200104-26
DS200104-27
DS200104-29
DS200104-30
DS200104-28
DS200104-31
DS200104-32
DS200104-33
7
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Typical Performance Characteristics (Continued)
THD+N vs Output Power
Output Power vs
Load Resistance
Output Power vs
Load Resistance
DS200104-6
DS200104-62
DS200104-38
DS200104-41
DS200104-34
Output Power vs
Load Resistance
Power Supply
Rejection Ratio
Dropout Voltage
DS200104-7
DS200104-53
Output Power vs
Load Resistance
Noise Floor
Noise Floor
DS200104-8
DS200104-42
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Typical Performance Characteristics (Continued)
Power Dissipation vs
Output Power
Power Dissipation vs
Output Power
Power Derating Curve
DS200104-63
DS200104-51
DS200104-52
Crosstalk
Crosstalk
Output Power
vs Supply voltage
DS200104-49
DS200104-50
DS200104-54
Output Power
vs Supply Voltage
DS200104-56
9
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couples the audio signal to the headphones. The signal
return to circuit ground is through the headphone jack’s
sleeve.
Application Information
DIGITAL VOLUME CONTROL
The LM4840 eliminates these coupling capacitors. Amp2A is
internally configured to apply VDD/2 to a stereo headphone
jack’s sleeve. This voltage matches the quiescent voltage
present on the Amp1A and Amp1B outputs that drive the
headphones. The headphones operate in a manner very
similar to a bridge-tied-load (BTL). The same DC voltage is
applied to both headphone speaker terminals. This results in
no net DC current flow through the speaker. AC current flows
through a headphone speaker as an audio signal’s output
amplitude increases on the speaker’s terminal.
The LM4840 features a digital volume control which consists
of the CLOCK, UP, and DOWN pins. An external clock may
be fed to the CLOCK pin, or, by connecting a capacitor from
the CLOCK pin to ground, the internal clock may be used.
The internal clock frequency with respect to this capacitor
value is determined from the following formula:
fCLK = (7.338 x 10-7 ) / C
When using an external clock, the clock is buffered and the
internal clock frequency is that of the external clock divided
by 2. Also, the maximum frequency should be kept below
100kHz.
When operating as a headphone amplifier, the headphone
jack sleeve is not connected to circuit ground. Using the
headphone output jack as a line-level output will place the
LM4840’s one-half supply voltage on a plug’s sleeve con-
Volume changes are then effected by toggling either the UP
or DOWN pins with a logic high. After a period of 4 clock
pulses with either the UP or DOWN pins held high, the
volume will change to the next specified step, either up or
down. Volume levels for each step vary and are specified in
Table 2. If either the UP or DOWN pin remains high after the
first volume transition the volume will change again, but this
time after 40 clock pulses. The next transition occurs at 20
clock pulses, then 12, then 8, and from then on 4 clock
pulses for each volume transtition. This cycle is shown in the
timing diagram shown in Figure 3. Releasing the held UP or
DOWN pin to ground at any time re-starts the cycle. This is
intended to provide the user with a volume control that
pauses briefly after initial application, then slowly increases
the rate of volume change as it is continuously applied.
nection. Driving
a
portable notebook computer or
audio-visual display equipment is possible. This presents no
difficulty when the external equipment uses capacitively
coupled inputs. For the very small minority of equipment that
is DC-coupled, the LM4840 monitors the current supplied by
the amplifier that drives the headphone jack’s sleeve. If this
current exceeds 500mAPK, the amplifier is shutdown, pro-
tecting the LM4840 and the external equipment. For more
information, see the section titled ’Single-Ended Output
Power Performance and Measurement Considerations’.
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4840’s exposed-DAP (die attach paddle) packages
(MH, LQ) provide a low thermal resistance between the die
and the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane and, finally, surrounding
air. The result is a low voltage audio power amplifier that
produces 2W at ≤ 1% THD with a 4Ω load. This high power
is achieved through careful consideration of necessary ther-
mal design. Failing to optimize thermal design may compro-
mise the LM4840’s high power performance and activate
unwanted, though necessary, thermal shutdown protection.
If both the UP and DOWN pins are held high, no volume
change will occur. Trigger points for the UP and DOWN pins
are at 60% of VDD minimum for a logic high, and 20% of VDD
maximum for a logic low. It is recommended, however, to
toggle UP and DOWN between VDD and GND for best
performance. When using an external clock, clock pulses
should be a minimum 0f 3V for a high and maximum of 0.9V
for a low when using a 5V supply. Again, pulsing an external
clock from VDD to GND ensures reliable performance. Fol-
lowing these guidelines the volume may then be changed
with a microcontroller or manually using switches.
The MH and LQ packages must have their exposed DAPs
soldered to a grounded copper pad on the PCB. The DAP’s
PCB copper pad is connected to a large plane of continuous
unbroken copper. This plane forms a thermal mass and heat
sink and radiation area. Place the heat sink area on either
outside plane in the case of a two-sided PCB, or on an inner
layer of a board with more than two layers. Connect the DAP
copper pad to the inner layer or backside copper heat sink
area with 32(4x8) (MH ) or 6(3x2) (LQ) vias. The via diam-
eter should be 0.012in–0.013in with a 1.27mm pitch. Ensure
efficient thermal conductivity by plating-through and solder-
filling the vias.
MEMORY FUNCTION
The LM4840 features a volume memory that saves the last
volume setting when power is turned off. This requires that
an auxiliary power source be connected to VAUX through a
diode as shown in Figure 1. Connecting the circuit as shown
also provides that power to the VAUX pin is being drawn from
VDD when VDD is on and is greater than VAUX. VAUX must be
at a voltage of 2.3V or greater to maintain volume memory
when VDD is absent. This feature is intended for such appli-
cations as laptop computers, where VDD is the system power
and VAUX is connected to the real time clock battery. The
default volume setting for the LM4840 is -10dB in BTL mode,
and -16dB in single-ended mode. This default setting is only
achieved on power up when both VDD and VAUX had both
been turned off, and the circuit had sufficient time to dis-
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in2 (min) area is
necessary for 5V operation with a 4Ω load. Heatsink areas
not placed on the same PCB layer as the should be 5in2
(min) for the same supply voltage and load resistance. The
last two area recommendations apply for 25˚C ambient tem-
perature. Increase the area to compensate for ambient tem-
peratures above 25˚C. In systems using cooling fans, the
LM4840MH can take advantage of forced air cooling. With
an air flow rate of 450 linear-feet per minute and a 2.5in2
exposed copper or 5.0in2 inner layer copper plane heatsink,
the LM4840MH can continuously drive a 3Ω load to full
power. The LM4840LQ achieves the same output power
<
charge ( 500ms depending on capacitor value at VAUX).
ELIMINATING OUTPUT COUPLING CAPACITORS
Typical single-supply audio amplifiers that can switch be-
tween driving bridge-tied-load (BTL) speakers and
single-ended (SE) headphones use a coupling capacitor on
each SE output. This capacitor blocks the half-supply volt-
age to which the output amplifiers are typically biased and
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10
the load or load connectors should be as wide as practical.
Any resistance in the output traces will reduce the power
delivered to the load. For example, with a 4Ω load and 0.1Ω
of trace resistance in each output, output power at the load
drops from 2W to 1.8W.
Application Information (Continued)
level without forced air cooling. In all circumstances and
conditions, the junction temperature must be held below
150˚C to prevent activating the LM4840’s thermal shutdown
protection. The LM4840’s power derating curve in the Typi-
cal Performance Characteristics shows the maximum
power dissipation versus temperature. Further detailed and
specific information concerning PCB layout, fabrication, and
mounting an LQ (LLP) package is available in National
Semiconductor’s AN1187.
Output power is also dependent on supply regulation. To
keep the supply voltage from sagging under full output con-
ditions, the supply traces should be as wide as practical.
Grounding
In order to achieve the best possible performance, there are
certain grounding techniques to be followed. All input refer-
ence grounds should be tied with their respective source
grounds and brought back to the power supply ground sepa-
rately from the output load ground returns. Bringing the
ground returns for the output loads back to the supply sepa-
rately will keep large signal currents from interfering with the
stable AC input ground references. The exposed-DAP of the
LM4840MH package must be tied to ground.
POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a
successful design. Equation 1 states the maximum power
dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified load.
PDMAX = (VDD)2/(2π 2RL) (1)
However, a direct consequence of the increased power de-
livered to the load by a bridged amplifier is an increase in
internal power dissipation. Equation 2 states the maximum
power dissipation point for a bridged amplifier operating at a
given supply voltage and driving a specified load.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and
power supply pins should be as close to the device as
possible. The effect of a larger half supply bypass capacitor
is improved PSRR due to increased half-supply stability.
Typical applications employ a 5 volt regulator with 10 µF and
a 0.1 µF bypass capacitors which aid in supply stability, but
do not eliminate the need for bypassing the supply nodes of
the LM4840. The selection of bypass capacitors, especially
PDMAX = 4(VDD)2/(2π 2RL) (2)
Since theLM4840 is a stereo power amplifier, the maximum
internal power dissipation is two times that of Equation 1 or
Equation 2 depending on the mode of operation. Even with
the power dissipation of the stereo amplifiers, the LM4840
does not require heatsinking. The power dissipation from the
amplifiers, must not be greater than the package power
dissipation that results from Equation 3:
C
B, is thus dependant upon desired PSRR requirements,
click and pop performance as explained in the section,
Proper Selection of External Components, system cost,
and size constraints. It is also recommended to decouple
each of the VDD pins with a 0.1µF capacitor to ground.
PDMAX = (TJMAX − TA)/ θ
(3)
JA
For the LM4840 TSSOP package, θJA = 80˚C/W and TJMAX
= 150˚C. Depending on the ambient temperature, T A, of the
system surroundings, Equation 3 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 1 and 2 is greater than
that of Equation 3, then either the supply voltage must be
decreased, the load impedance increased, or the ambient
temperature reduced. For the typical application of a 5V
power supply, with an 8Ω bridged loads, the maximum am-
bient temperature possible without violating the maximum
junction temperature is approximately 48˚C provided that
device operation is around the maximum power dissipation
points. Power dissipation is a function of output power and
thus, if typical operation is not around the maximum power
dissipation point, the ambient temperature can be increased.
Refer to the Typical Performance Characteristics curves
for power dissipation information for different output powers.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications us-
ing integrated power amplifiers is critical to optimize device
and system performance. While the LM4840 is tolerant of
external component combinations, consideration to compo-
nent values must be used to maximize overall system qual-
ity.
The LM4840’s bridged amplifier should be used in low gain
configurations to minimize THD+N values, and maximize the
signal to noise ratio. Low gain configurations require large
input signals to obtain a given output power. Input signals
equal to or greater than 1Vrms are available from sources
such as audio codecs.
Besides gain, one of the major considerations is the closed-
loop bandwidth of the amplifier. To a large extent, the band-
width is dictated by the choice of external components. Both
the input coupling capacitor, CI, and the output coupling
capacitor form first order high pass filters which limit low
frequency response given in Equations 4 and 5.
LAYOUT
As stated in the Grounding section, placement of ground
return lines is imperative in maintaining the highest level of
system performance. It is not only important to route the
correct ground return lines together, but also to be aware of
where the ground return lines are routed with respect to each
other. The output load ground returns should be physically
located as far as possible from low signal level lines and their
ground return lines.
fIC = 1/(2πRiCi) (4)
fOC = 1/(2πRLCO) (5)
These values should be chosen based on required fre-
quency response.
3Ω and 4Ω Layout Considerations
Selection of Input and Output Capacitor Size
With low impedance loads, the output power at the loads is
heavily dependent on trace resistance from the output pins
of the LM4840. Traces from the output of the LM4840MH to
Large input and output capacitors are both expensive and
space hungry for portable designs. Clearly, a certain sized
capacitor is needed to couple in low frequencies without
11
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outputs can be configured by adjusting the feedback and
input resistors for the input op-amp. The input op-amp is in
an inverting configuration where the gain is:
Application Information (Continued)
severe attenuation. In many cases the speakers used in
portable systems, whether internal or external, have little
ability to reproduce signals below 100 Hz–150 Hz. In this
case, usinga large input or output capacitor may not in-
crease system performance.
RF / Ri = - Av
Note that by adjusting the gain of the input op-amp the
overall gain of the output amplifiers are also affected. Al-
though the single ended outputs of the output amplifiers can
be used to drive line level outputs, it is recommended to use
Pins 9 and 13 to achieve better performance.
In addition to system cost and size, click and pop perfor-
mance is effected by the size of the input coupling capacitor,
Ci. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally 1/2 VDD.) This
charge comes from the output through the feedback and is
apt to create pops once the device is enabled. By minimizing
the capacitor size based on necessary low frequency re-
sponse, turn-on pops can be minimized.
BEEP DETECT FUNCTION
The Beep Detect pin (Beep In) is a mono input that detects
the presence of a beep signal. When a signal greater than
2.5VP-P (or 1/2 VDD) is present at Beep In, the Beep Detect
circuitry will enable the bridged amplifiers. Beep In signals
less than 2.5VP-P (or 1/2 VDD) will not trigger the Beep
Detect circuitry. When triggered, the Beep Detect circuitry
will enable the bridged amplifiers regardless of the state of
the mute, mode, or HP sense pins. As shown in the Fig. 1, a
200kΩ resistor is placed in series with the input capacitor.
This 200kΩ resistor can be changed to vary the amplitude of
the beep in signal. Higher values of the resistor will reduce
the amplifier gain and attenuate the beep in signal. These
resistors are required in order for the beep signal to pass to
the output. The Beep Detect pin will not pass the beep signal
to the output. In cases where system beeps are required
when the system is in a suspended mode, the LM4840 must
be brought out of shutdown before the beep in signal is input.
CLICK AND POP CIRCUITRY
The LM4840 contains circuitry to minimize turn-on transients
or “click and pops”. In this case, turn-on refers to either
power supply turn-on or the device coming out of shutdown
mode. When the device is turning on, the amplifiers are
internally muted. An internal current source ramps up the
voltage of the bypass pin. Both the inputs and outputs ideally
track the voltage at the bypass pin. The device will remain in
mute mode until the bypass pin has reached its half supply
voltage, 1/2 VDD. As soon as the bypass node is stable, the
device will become fully operational.
Although the bypass pin current source cannot be modified,
the size of the bypass capacitor, CB, can be changed to alter
the device turn-on time and the amount of “click and pop”. By
increasing CB, the amount of turn-on pop can be reduced.
However, the trade-off for using a larger bypass capacitor is
an increase in the turn-on time for the device. Reducing CB
will decrease turn-on time and increase “click and pop”.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4840 contains a shutdown pin to externally turn off the
bias circuitry. The LM4840 will shutdown when a logic high is
placed on the shutdown pin. The trigger point between a
logic low and logic high level is typically half supply. It is best
to switch between ground and the supply VDD to provide
maximum device performance. By switching the shutdown
pin to VDD, the LM4840 supply current draw will be mini-
mized. While the device will be disabled with shutdown pin
voltages less than VDD, the idle current may be greater than
the typical value of 0.7 µA.The shutdown pin should not be
floated, since this may result in an unwanted shutdown
condition.
There is a linear relationship between the size of CB and the
turn-on time. Here are some typical turn-on times for differ-
ent values of CB:
CB
TON
0.01 µF
0.1 µF
0.22 µF
0.47 µF
1.0 µF
4.7 µF
2 ms
20 ms
42 ms
84 ms
200 ms
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry which pro-
vides a quick, smooth transition into shutdown. Another so-
lution is to use a single-pole, single-throw switch in conjuc-
tion with an external pull-up resistor. When the switch is
closed,the shutdown pin is connected to ground and enables
the amplifier. If the switch is open, then the external pull-up
resistor will shutdown the LM4840. This scheme prevents
the shutdown pin from floating.
1sec
In order to eliminate “click and pop”, all capacitors must be
discharged before turn-on. Rapid on/off switching of the
device or shutdown function may cause the “click and pop”
circuitry to not operate fully, resulting in increased “click and
pop” noise.
DOCKING STATION
HP-IN FUNCTION
In an application such as a notebook computer, docking
station or line level outputs may be required. Pin 9 and Pin
13 can drive loads greater than 1kΩ rail to rail. These pins
are tied to the output of the input op-amp to drive powered
speakers and other high impedance loads. Output coupling
capacitors need to be placed in series with the load. The
recommended values of the capacitors are between 0.33µF
to 1.0µF with the positive side of the capacitors toward the
IC. The outputs of the docking station pins cannot be attenu-
ated with the DC volume control. However the gain of the
An internal pull−up circuit is connected to the HP−Sense
headphone amplifier control pin. When this pin is left uncon-
nected, VDD is applied to the HP−Sense. This turns off
Amp2B and switches Amp2A’s input signal from an audio
signal to the VDD/2 voltage present on Bypass. The result is
muted bridge-connected loads. Quiescent current consump-
tion is reduced when the IC is in this single−ended mode.
Figure 2 shows the implementation of the LM4840’s head-
phone control function. An internal comparator with a nomi-
nal 400mV offset monitors the signal present at the −OUTB
output. It compares this signal against the signal applied to
the HP−Sense pin. When these signals are equal, as is the
www.national.com
12
three−wire plug. The plug’s tip and ring should each carry
one of the two stereo output signals, whereas the sleeve
provides the return to Amp2A. A headphone jack with one
control pin contact is sufficient to drive the HP−Sense pin
when connecting headphones.
Application Information (Continued)
case when a BTL is connected to the amplifier, the compara-
tor forces the LM4840 to maintain bridged−amplifier opera-
tion. When the HP−Sense pin is externally floated, such as
when headphones are connected to the jack shown in Figure
2, and internal pull−up forces VDD on the internal compara-
tor’s HP−Sense inputs. This changes the comparator’s out-
put state and enables the headphone function: it turns off
Amp2B, switches Amp2A’s input signal from an audio signal
to the VDD/2 voltage present on pin 14, and mutes the
bridge-connected loads. Amp1A and Amp1B drive the head-
phones.
A switch can replace the headphone jack contact pin. When
a switch shorts the HP−Sense pin to VDD, bridge−connected
speakers are muted and Amp1A and Amp2A drive a pair of
headphones. When a switch shorts the HP−Sense pin to
GND, the LM4840 operates in bridge mode. If headphone
drive is not needed, short the HP−Sense pin to the −OUTB
pin.
Figure 2 also shows the suggested headphone jack electri-
cal connections. The jack is designed to mate with a
DS200104-74
FIGURE 2. The ESDAxxxL provides additional ESD protection beyond the 8000V shown in the Absolute Maximum
Ratings for the AMP2A output
DS200104-75
FIGURE 3. Volume Control Timing Diagram
13
www.national.com
Application Information (Continued)
Table 1: Logic Level Truth Table
SD
BEEP
MUTE
HP
MODE
R-
R+
L-
L+
DETECT
SENSE
L
L
L
L
L
L
L
L
L
L
L
H
L
BTL SPK
HP
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
OFF
ON
ON (buffer)
ON
H
H
BTLSPK
HP
*Amps are muted
*Amps are muted
H
ON (buffer)
OFF
*Next four conditions, beep is detected; beep signal added to audio signal and bypasses volume control (unity)
L
L
L
L
H
H
H
H
L
L
L
H
L
BTL SPK
HP
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON (buffer)
ON
H
H
BTL SPK
HP
*Dual Mode
*Dual Mode
H
ON (buffer)
*Next eight conditions turns off all amps
H
H
H
H
H
H
H
H
L
L
L
L
L
H
L
BTL SPK
HP
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
L
H
H
L
BTL SPK
HP
L
H
L
H
H
H
H
BTL SPK
HP
L
H
L
H
H
BTL SPK
HP
H
*Beepdetect signal overrides any mute. For example, if amp is muted and bpdetect is HIGH, then amp is no longer muted.
**Dual mode: When HP jack is inserted, load A (speaker corresponding to outputs A- and A+) is physically disconnected. Load
B remains connected; however, amp B+ is off and differentially there is no voltage across it. If a beep is detected (i.e. beepdetect
= HIGH), then summed signal (audio + beep signals) is heard in the headphones and on speaker B.
www.national.com
14
Application Information (Continued)
Table 2: LM4840 Volume Control Steps
Volume Step
BTL (dB)
SE (dB)
0.00
1
6.00
2
5.00
-1.00
3
4.00
-2.00
4
3.00
-3.00
5
2.00
-4.00
6
1.00
-5.00
7
0.00
-6.00
8
-2.00
-8.00
9
-4.00
-10.00
-12.00
-14.00
-16.00
-18.00
-20.00
-22.00
-24.00
-26.00
-27.90
-30.00
-32.10
-34.10
-35.90
-38.70
-42.00
-44.80
-47.30
-50.90
-56.90
-62.90
-68.90
-76.90
-76.90
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
-6.00
-8.00
-10.00
-12.00
-14.00
-16.00
-18.00
-20.00
-21.90
-24.00
-26.10
-28.10
-29.90
-32.70
-36.00
-38.80
-41.30
-44.90
-50.90
-56.90
-62.90
-70.90
-70.90
15
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted
LLP Package
Order Number LM4840LQ
NS Package Number LQA028A for Exposed-DAP LLP
www.national.com
16
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
TSSOP Package
Order Number LM4840MT
NS Package Number MTC28 for TSSOP
17
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Exposed-DAP TSSOP Package
Order Number LM4840MH
NS Package Number MXA28A for Exposed-DAP TSSOP
www.national.com
18
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
National Semiconductor
Europe
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
Fax: +49 (0) 180-530 85 86
Email: support@nsc.com
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
Email: ap.support@nsc.com
www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
See Enhanced Solutions
Products
LM4840 Product Folder
Stereo 2W Audio Power Amplifiers with Digital Volume Control and Input Mux
Generic P/N 4840
General
Description
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& Models
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LM4840 BOOMER™ Stereo 2W
Audio Power Amplifierswith Digital 786 Kbytes
Volume Control and Input Mux
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General Description
The LM4840 is a monolithic integrated circuit that provides digital volume control and stereo bridged audio
power amplifiers capable of producing 2W into 4 with less than 1.0% THD or 2.2W into 3 with less than
1.0% THD.
Boomer® audio integrated circuits were designed specifically to provide high quality audio while requiring a
minimum amount of external components. The LM4840 incorporates a digital volume control, stereo bridged
audio power amplifiers, an input mux, and a last volume level memory function to save the volume setting
during shutdown. These features make it optimally suited for multimedia monitors, portable radios, desktop,
and portable computer applications.
The LM4840 features an externally controlled, low-power consumption shutdown mode, and both a power
amplifier and headphone mute for maximum system flexibility and performance.
Features
●
●
●
●
●
●
●
●
●
PC98 and PC99 Compliant
Digital Volume Control Interface
System Beep Detect
Stereo switchable bridged/single-ended power amplifiers
"Click and pop" suppression circuitry
Thermal shutdown protection circuitry
Input Mux
Capless headphone drivers
Last volume memory from shutdown
Key Specification
PO at 1% THD+N
into 3 (LM4840LQ, LM4840MH) 2.2W (typ)
into 4 (LM4840LQ, LM4840MH) 2.0W (typ)
into 8 (LM4840) 1.1W (typ)
Single-ended mode - THD+N at 85mW into 32
Shutdown current 0.2µA (typ)
1.0% (typ)
Applications
●
●
●
Portable and Desktop Computers
Multimedia Monitors
Portable Radios, PDAs, and Portable TVs
[Information as of 5-Aug-2002]
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