LM4864N/NOPB
更新时间：2024-09-18 18:22:38
品牌：TI
描述：0.675W, 1 CHANNEL, AUDIO AMPLIFIER, PDIP8, 0.300 INCH, MDIP-8
概述
规格参数
数据手册LM4864N/NOPB 概述
0.675W, 1 CHANNEL, AUDIO AMPLIFIER, PDIP8, 0.300 INCH, MDIP-8 音频/视频放大器
LM4864N/NOPB 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Obsolete |
| 包装说明： | DIP, | Reach Compliance Code： | compliant |
| ECCN代码： | EAR99 | HTS代码： | 8542.33.00.01 |
| 风险等级： | 5.6 | 标称带宽： | 20 kHz |
| 商用集成电路类型： | AUDIO AMPLIFIER | 谐波失真： | 1% |
| JESD-30 代码： | R-PDIP-T8 | JESD-609代码： | e3 |
| 长度： | 9.817 mm | 湿度敏感等级： | 1 |
| 信道数量： | 1 | 功能数量： | 1 |
| 端子数量： | 8 | 最高工作温度： | 85 °C |
| 最低工作温度： | -40 °C | 标称输出功率： | 0.675 W |
| 封装主体材料： | PLASTIC/EPOXY | 封装代码： | DIP |
| 封装形状： | RECTANGULAR | 封装形式： | IN-LINE |
| 峰值回流温度（摄氏度）： | 260 | 认证状态： | Not Qualified |
| 座面最大高度： | 5.08 mm | 最大压摆率： | 6 mA |
| 最大供电电压 (Vsup)： | 5.5 V | 最小供电电压 (Vsup)： | 2.7 V |
| 表面贴装： | NO | 温度等级： | INDUSTRIAL |
| 端子面层： | TIN | 端子形式： | THROUGH-HOLE |
| 端子节距： | 2.54 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 宽度： | 7.62 mm |
| Base Number Matches： | 1 |
LM4864N/NOPB 数据手册
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September 2004
LM4864
725mW Audio Power Amplifier with Shutdown Mode
General Description
LM4864M & LM4864N*, 8Ω load
LM4864MM, 8Ω load (Note 10)
LM4864, 16Ω load
675mW (typ)
300mW (typ)
550mW (typ)
0.7µA (typ)
The LM4864 is a bridged audio power amplifier capable of
delivering 725mW of continuous average power into an 8Ω
load with 1% THD+N from a 5V power supply.
j
Shutdown current
Boomer® audio power amplifiers were designed specifically
to provide high quality output power from a low supply volt-
age while requiring a minimal amount of external compo-
nents. Since the LM4864 does not require output coupling
capacitors, bootstrap capacitors or snubber networks, it is
optimally suited for low-power portable applications.
* Not recommended for new designs. Contact NSC Audio
Marketing.
Features
n MSOP, SOP, DIP*, and LD packaging
n No output coupling capacitors, bootstrap capacitors, or
snubber circuits are necessary
The LM4864 features an externally controlled, low power
consumption shutdown mode, and thermal shutdown protec-
tion.
n Thermal shutdown protection circuitry
n Unity-gain stable
n External gain configuration capability
The closed loop response of the unity-gain stable LM4864
can be configured by external gain-setting resistors. The
device is available in multiple package types to suit various
applications.
* Not recommended for new designs. Contact NSC Audio
Marketing.
Key Specifications
Applications
n Cellular phones
j
PO at 1% THD+N with VDD = 5V, 1kHz
LM4864LD, 4Ω load
625mW (typ)
725mW (typ)
n Personal computers
n General purpose audio
LM4864LD, 8Ω load
Typical Application
01260701
FIGURE 1. Typical Audio Amplifier Application Circuit
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2004 National Semiconductor Corporation
DS012607
www.national.com
Connection Diagrams
MSOP, SOP, and DIP Package
01260702
Top View
Order Number LM4864MM,
LM4864M or LM4864N*
See NS Package Number MUA08A,
M08A or N08E*
* Not recommended for new designs. Contact NSC Audio Marketing
LD Package
01260730
Top View
Order Number LM4864LD,
See NS Package Number LDA10A
DIE LAYOUT (B-STEP)
01260740
LM4864 MDC MWC
725MW AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE
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2
Absolute Maximum Ratings (Note 2)
Thermal Resistance
θJC (MSOP)
56˚ C/W
210˚C/W
35˚C/W
170˚C/W
37˚C/W
107˚C/W
63˚C/W
12˚C/W
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
θJA (MSOP)
θJC (SOP)
Supply Voltage
Storage Temperature
Input Voltage
6.0V
θJA (SOP)
θJC (DIP)*
−65˚C to +150˚C
θJA (DIP)*
−0.3V to VDD
+
0.3V
Internally limited
2000V
θJA (LD) (Note 11)
θJC (LD) (Note 11)
Power Dissipation (Note 3)
ESD Susceptibility (Note 4)
ESD Susceptibility (Note 5)
Junction Temperature
Soldering Information
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
* Not recommended for new designs. Contact NSC Audio
Marketing.
200V
150˚C
Operating Ratings
Temperature Range
215˚C
220˚C
TMIN ≤ TA ≤ TMAX
−40˚C ≤ TA ≤
+85˚C
See AN-450 “Surface Mounting and their Effects on
Product Reliability” for other methods of soldering surface
mount devices.
Supply Voltage
2.7V ≤ VDD ≤ 5.5V
Electrical Characteristics VDD = 5V (Note 1) (Note 2)
The following specifications apply for VDD = 5V, for all available packages, unless otherwise specified. Limits apply for TA
=
25˚C
LM4864
Units
(Limits)
Limit
(Notes 7,
Symbol
Parameter
Conditions
Typical
(Note 6)
8)
6.0
5
IDD
Quiescent Power Supply Current
Shutdown Current
VIN = 0V, IO = 0A (Note 9)
VPIN1 = VDD
3.6
0.7
5
mA (max)
µA (max)
mV (max)
mW (min)
ISD
VOS
PO
Output Offset Voltage
Output Power
VIN = 0V
50
THD = 1% (max); f = 1 kHz; RL = 4Ω;
LM4864LD (Note 11)
625
THD = 1% (max); f = 1 kHz; RL = 8Ω;
LM4864LD (Note 11)
725
mW (min)
mW (min)
mW (min)
THD = 1% (max); f = 1 kHz; RL = 8Ω;
LM4864MM (Note 10)
300
300
THD = 1% (max); f = 1 kHz; RL = 8Ω;
LM4864M and LM4864N*
THD+N = 1%; f = 1 kHz; RL = 16Ω;
PO = 300 mWrms; AVD = 2; RL = 8Ω;
675
550
0.7
50
mW
%
THD+N
PSRR
Total Harmonic Distortion+Noise
Power Supply Rejection Ratio
<
20 Hz ≤ f ≤ 20 kHz, BW 80kHz
VDD = 4.9V–5.1V
dB
* Not recommended for new designs. Contact NSC Audio Marketing.
Electrical Characteristics VDD = 3V (Note 1) (Note 2)
The following specifications apply for VDD = 3V, for all available packages, unless otherwise specified. Limits apply for TA
25˚C
=
LM4864
Units
(Limits)
Limit
(Notes 7,
8)
Symbol
Parameter
Conditions
Typical
(Note 6)
IDD
ISD
Quiescent Power Supply Current
Shutdown Current
VIN = 0V, IO = 0A (Note 9)
VPIN1 = VDD
1.0
0.3
3.0
mA (max)
µA (max)
2.0
3
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Electrical Characteristics VDD = 3V (Note 1) (Note 2) (Continued)
The following specifications apply for VDD = 3V, for all available packages, unless otherwise specified. Limits apply for TA
25˚C
=
LM4864
Units
(Limits)
Limit
(Notes 7,
8)
Symbol
Parameter
Conditions
Typical
(Note 6)
VOS
PO
Output Offset Voltage
Output Power
VIN = 0V
5
mV
mW
mW
THD = 1% (max); f = 1 kHz; RL = 8Ω
THD = 1% (max); f = 1 kHz; RL = 16Ω
200
175
THD+N
PSRR
Total Harmonic Distortion+Noise PO = 100 mWrms; AVD = 2; RL = 8Ω;
1.5
50
%
<
20 Hz ≤ f ≤ 20 kHz, BW 80 kHz
Power Supply Rejection Ratio
VDD = 2.9V–3.1V
dB
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
, θ , and the ambient temperature T . The maximum
A
JMAX JA
allowable power dissipation is P
= (T
− T )/θ or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4864, T
= 150˚C.
DMAX
JMAX
A
JA
JMAX
The typical junction-to-ambient thermal resistance, when board mounted, is 230˚C/W for package number MUA08A, 170˚C/W for package number M08A and is
*
107˚C/W for package number N08E .
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF – 240pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
Note 10: The MUA08BA package is thermally limited to 595 mW of power dissipation at room temperature. Refering to the Power Dissipation vs Output Power
graph in the Typical Performance Characteristics section, the power dissipation limitation for the package occurs at 300 mW of output power. This package
limitation is based on 25˚C ambient temperature and θ = 210˚C. For higher output power possibilities refer to the Power Dissipation Section.
JA
2
Note 11: The LDA10A package has its exposed-DAP soldered to an exposed 1.2in area of 1oz printed circuit board copper.
* Not recommended for new designs. Contact NSC Audio Marketing.
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4
External Components Description (Figure 1)
Components
Functional Description
1.
Ri
Ci
Inverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a
high pass filter with Ci at fc = 1/(2π RiCI).
2.
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of Ci.
3.
4.
RF
CS
Feedback resistance which sets the closed-loop gain in conjunction with Ri.
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
Bypass pin capacitor which provides half-supply filtering. Refer to the Proper Selection of External
Components for information concerning proper placement and selection of CB.
5.
CB
Typical Performance Characteristics
THD+N vs Frequency
THD+N vs Frequency
01260703
01260704
THD+N vs Frequency
THD+N vs Frequency
01260705
01260706
5
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Typical Performance Characteristics (Continued)
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Output Power
THD+N vs Output Power
01260707
01260708
01260710
01260712
THD+N vs Output Power
01260709
THD+N vs Output Power
01260711
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6
Typical Performance Characteristics (Continued)
THD+N vs Output Power
THD+N vs Output Power
01260713
01260714
01260716
01260718
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
01260715
Output Power vs
Supply Voltage
Output Power vs
Load Resistance
01260717
7
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Typical Performance Characteristics (Continued)
Power Dissipation vs
Output Power
Power Derating Curve
01260719
01260720
01260722
01260724
Dropout Voltage vs
Supply Voltage
Noise Floor
01260721
Frequency Response vs
Input Capacitor Size
Power Supply
Rejection Ratio
01260723
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8
Typical Performance Characteristics (Continued)
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
01260726
01260725
Typical Performance Characteristics for the LM4864LD (Note 11)
THD+N vs Frequency
THD+N vs Frequency
01260731
01260732
THD+N vs Power Out
THD+N vs Power Out
01260733
01260734
9
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Typical Performance Characteristics for the LM4864LD (Note 11) (Continued)
Output Power vs Supply Voltage
Power Dissipation vs Output Power
01260735
01260736
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10
For package MUA08A, θJA = 210˚C/W, for package M08A,
θJA = 170˚C/W, for package N08E, θJA = 107˚C/W, and for
package LDA10A, θJA = 63˚C/W. TJMAX = 150˚C for the
LM4864. Depending on the ambient temperature, TA, of the
system surroundings, Equation 3 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 2 is greater than that of
Equation 3, then either the supply voltage must be de-
creased, the load impedance increased, the ambient tem-
perature reduced, or the θJA reduced with heatsinking. In
many cases larger traces near the output, VDD, and GND
pins can be used to lower the θJA. The larger areas of copper
provide a form of heatsinking allowing a higher power dissi-
pation. For the typical application of a 5V power supply, with
an 8Ω load, the maximum ambient temperature possible
without violating the maximum junction temperature is ap-
proximately 44˚C provided that device operation is around
the maximum power dissipation point and assuming surface
mount packaging. Internal power dissipation is a function of
output power. If typical operation is not around the maximum
power dissipation point, the ambient temperature can be
increased. Refer to the Typical Performance Characteris-
tics curves for power dissipation information for lower output
powers.
Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4864 has two operational
amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier’s gain is externally config-
urable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of RF to Ri while
the second amplifier’s gain is fixed by the two internal 10kΩ
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase 180˚. Consequently, the differential gain for the IC
is
AVD = 2*(RF/Ri)
By driving the load differentially through outputs Vo1 and Vo2
,
an amplifier configuration commonly referred to as “bridged
mode” is established. Bridged mode operation is different
from the classical single-ended amplifier configuration where
one side of its load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same con-
ditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing ex-
cessive clipping, please refer to the Audio Power Amplifier
Design section.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
The LM4864’s exposed-dap (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air.
The LD package should have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad may be con-
nected to a large plane of continuous unbroken copper. This
plane forms a thermal mass, heat sink, and radiation area.
A bridge configuration, such as the one used in LM4864,
also creates a second advantage over single-ended amplifi-
ers. Since the differential outputs, Vo1 and Vo2, are biased at
half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configura-
tion. If an output coupling capacitor is not used in a single-
ended configuration, the half-supply bias across the load
would result in both increased internal lC power dissipation
as well as permanent loudspeaker damage.
Further detailed and specific information concerning PCB
layout, fabrication, and mounting an LD (LLP) package is
available from National Semiconductor’s Package Engineer-
ing Group under application note AN1187.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and
power supply pins should be as close to the device as
possible. The effect of a larger half supply bypass capacitor
is improved PSRR due to increased half-supply stability.
Typical applications employ a 5V regulator with 10 µF and a
0.1 µF bypass capacitors which aid in supply stability, but do
not eliminate the need for bypassing the supply nodes of the
LM4864. The selection of bypass capacitors, especially CB,
is thus dependent upon desired PSRR requirements, click
and pop performance as explained in the section, Proper
Selection of External Components, system cost, and size
constraints.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. Equation 1 states the maximum power dissi-
pation point for a bridge amplifier operating at a given supply
voltage and driving a specified output load.
PDMAX = (VDD)2/(2π2RL)
Single-Ended (1)
However, a direct consequence of the increased power de-
livered to the load by a bridge amplifier is an increase in
internal power dissipation point for a bridge amplifier oper-
ating at the same conditions.
PDMAX = 4(VDD)2/(2π2RL)
Bridge Mode (2)
Since the LM4864 has two operational amplifiers in one
package, the maximum internal power dissipation is 4 times
that of a single-ended amplifier. Even with this substantial
increase in power dissipation, the LM4864 does not require
heatsinking. From Equation 1, assuming a 5V power supply
and an 8Ω load, the maximum power dissipation point is
633 mW. The maximum power dissipation point obtained
from Equation 2 must not be greater than the power dissi-
pation that results from Equation 3:
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4864 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when a logic high is placed on the shutdown pin.
The trigger point between a logic low and logic high level is
typically half supply. It is best to switch between ground and
supply to provide maximum device performance. By switch-
ing the shutdown pin to VDD, the LM4864 supply current
PDMAX = (TJMAX − TA)/θJA
(3)
11
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less and popless shutdown function. While the device will
function properly, (no oscillations or motorboating), with CB
equal to 0.1 µF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of CB equal to 1.0 µF
or larger is recommended in all but the most cost sensitive
designs.
Application Information (Continued)
draw will be minimized in idle mode. While the device will be
disabled with shutdown pin voltages less than VDD, the idle
current may be greater than the typical value of 0.7 µA. In
either case, the shutdown pin should be tied to a definite
voltage to avoid unwanted state changes.
AUDIO POWER AMPLIFIER DESIGN
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry which pro-
vides a quick, smooth transition into shutdown. Another so-
lution is to use a single-pole, single-throw switch in conjunc-
tion with an external pull-up resistor. When the switch is
closed, the shutdown pin is connected to ground and en-
ables the amplifier. If the switch is open, then the external
pull-up resistor will disable the LM4864. This scheme guar-
antees that the shutdown pin will not float, thus preventing
unwanted state changes.
Design a 300 mW/8Ω Audio Amplifier
Given:
Power Output
Load Impedance
Input Level
300 mWrms
8Ω
1 Vrms
Input Impedance
Bandwidth
20 kΩ
100 Hz–20 kHz 0.25 dB
PROPER SELECTION OF EXTERNAL COMPONENTS
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-
formance Characteristics section, the supply rail can be
easily found. A second way to determine the minimum sup-
ply rail is to calculate the required Vopeak using Equation 4
and add the dropout voltage. Using this method, the mini-
mum supply voltage would be (Vopeak + (2*VOD)), where VOD
is extrapolated from the Dropout Voltage vs Supply Voltage
curve in the Typical Performance Characteristics section.
Proper selection of external components in applications us-
ing integrated power amplifiers is critical to optimize device
and system performance. While the LM4864 is tolerant to a
variety of external component combinations, consideration
to component values must be used to maximize overall
system quality.
The LM4864 is unity-gain stable, giving a designer maximum
system flexibility. The LM4864 should be used in low gain
configurations to minimize THD+N values, and maximize the
signal to noise ratio. Low gain configurations require large
input signals to obtain a given output power. Input signals
equal to or greater than 1 Vrms are available from sources
such as audio codecs. Please refer to the section, Audio
Power Amplifier Design, for a more complete explanation
of proper gain selection.
(4)
Using the Output Power vs Supply Voltage graph for an 8Ω
load, the minimum supply rail is 3.5V. But since 5V is a
standard supply voltage in most applications, it is chosen for
the supply rail. Extra supply voltage creates headroom that
allows the LM4864 to reproduce peaks in excess of 500 mW
without producing audible distortion. At this time, the de-
signer must make sure that the power supply choice along
with the output impedance does not violate the conditions
explained in the Power Dissipation section.
Besides gain, one of the major considerations is the closed-
loop bandwidth of the amplifier. To a large extent, the band-
width is dictated by the choice of external components
shown in Figure 1. The input coupling capacitor, Ci, forms a
first order high pass filter which limits low frequency re-
sponse. This value should be chosen based on needed
frequency response for a few distinct reasons.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equa-
tion 5.
Selection of Input Capacitor Size
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenu-
ation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 150 Hz. In this case using a large
input capacitor may not increase system performance.
(5)
RF/Ri = AVD/2
(6)
From Equation 5, the minimum AVD is 1.55; use AVD = 2.
Since the desired input impedance was 20 kΩ, and with a
AVD of 2, a ratio of 1:1 of RF to Ri results in an allocation of
Ri = RF = 20 kΩ. The final design step is to address the
bandwidth requirements which must be stated as a pair of
−3 dB frequency points. Five times away from a pole gives
0.17 dB down from passband response which is better than
the required 0.25 dB specified.
In addition to system cost and size, click and pop perfor-
mance is effected by the size of the input coupling capacitor,
Ci. A larger input coupling capacitor requires more charge to
1
reach its quiescent DC voltage (nominally
⁄2 VDD). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
fL = 100 Hz/5 = 20 Hz
fH = 20 kHz x 5 = 100 kHz
Besides minimizing the input capacitor size, careful consid-
eration should be paid to the bypass capacitor value. Bypass
capacitor, CB, is the most critical component to minimize
turn-on pops since it determines how fast the LM4864 turns
As stated in the External Components section, Ri in con-
junction with Ci create a highpass filter.
on. The slower the LM4864’s outputs ramp to their quiescent
1
DC voltage (nominally ⁄
2
VDD), the smaller the turn-on pop.
Choosing CB equal to 1.0 µF along with a small value of Ci
(in the range of 0.1 µF to 0.39 µF), should produce a click-
Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
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12
= 100 kHz which is much smaller than the LM4864 GBWP of
18 MHz. This figure displays that if a designer has a need to
design an amplifier with a higher differential gain, the
LM4864 can still be used without running into bandwidth
problems.
Application Information (Continued)
The high frequency pole is determined by the product of the
desired high frequency pole, fH, and the differential gain,
AVD. With a AVD = 2 and fH = 100 kHz, the resulting GBWP
LM4864LD DEMO BOARD ARTWORK
01260737
01260738
Silk Screen View of LM4864LD
Top Layer of LM4864LD
01260739
Bottom Layer of LM4864LD
13
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LM4864 MDC MWC
725MW Audio Power Amplifier With Shutdown Mode
01260740
Die Layout (B - Step)
DIE/WAFER CHARACTERISTICS
Fabrication Attributes
Physical Die Identification
General Die Information
LM4862B
B
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
86µm x 86µm
ALUMINUM
NITRIDE
Die Step
Physical Attributes
Wafer Diameter
150mm
Back Side Metal
Bare Back
GND
Dise Size (Drawn)
1283µm x 952µm
51mils x 37mils
406µm Nominal
117µm Nominal
Back Side Connection
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (B - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
X/Y COORDINATES
PAD SIZE
SIGNAL NAME
PAD# NUMBER
X
Y
X
Y
86
BYPASS
GND
1
2
-322
-359
-359
-359
-323
-109
8
523
259
5
86
86
86
86
86
86
86
86
86
86
86
86
86
x
x
x
x
x
x
x
x
x
x
x
x
x
188
86
INPUT +
GND
3
4
-259
-523
-523
-523
-78
188
86
NC
5
INPUT -
VOUT 1
VDD
6
86
7
86
8
358
358
359
323
8
188
188
86
GND
9
141
406
523
523
523
NC
10
11
12
13
NC
86
VOUT 2
SHUTDOWN
86
-109
86
www.national.com
14
LM4864 MDC MWC
725MW Audio Power Amplifier With Shutdown Mode (Continued)
IN U.S.A
Tel #:
Fax:
1 877 Dial Die 1 877 342 5343
1 207 541 6140
IN EUROPE
Tel:
49 (0) 8141 351492 / 1495
49 (0) 8141 351470
Fax:
IN ASIA PACIFIC
Tel:
(852) 27371701
81 043 299 2308
IN JAPAN
Tel:
15
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number LM4864M
NS Package Number M08A
www.national.com
16
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Lead (0.300" Wide) Molded Dual-In-Line Package
Order Number LM4864N*
NS Package Number N08E*
* Not recommended for new designs. Contact NSC Audio Marketing.
8-Lead (0.118" Wide) Molded Mini Small Outline Package
Order Number LM4864MM
NS Package Number MUA08A
17
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number LM4864LD
NS Package Number LDA10A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
National Semiconductor
Asia Pacific Customer
Support Center
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
Email: ap.support@nsc.com
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
LM4864N/NOPB 相关器件
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| LM4865 | TI | 具有直流音量控制和耳机放大器的 750mW、立体声、模拟输入、AB 类音频放大器 | 获取价格 |
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| LM4865ITPX/NOPB | NSC | IC,AUDIO AMPLIFIER,SINGLE,BGA,8PIN,PLASTIC | 获取价格 |
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| LM4865M | NSC | 750 mW Audio Power Amplifier with DC Volume Control and Headphone Switch | 获取价格 |
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| LM4865M/NOPB | TI | LM4865 750 mW Audio Power Amplifier with DC Volume Control and Headphone Switch | 获取价格 |
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| LM4865MDC | NSC | IC 1 CHANNEL(S), VOLUME CONTROL CIRCUIT, UUC, DIE, Audio Control IC | 获取价格 |
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