LM4899ITL/NOPB [TI]
1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, MICRO SMD-9;
| 型号： | LM4899ITL/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, MICRO SMD-9 放大器 商用集成电路 |
| 文件： | 总18页 (文件大小：495K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM4899
LM4899 1 Watt Fully Differential Audio Power Amplifier With Shutdown
Select and Fixed 6dB Gain
Literature Number: SNAS206E
OBSOLETE
LM4899
October 5, 2011
1 Watt Fully Differential Audio Power Amplifier With
Shutdown Select and Fixed 6dB Gain
General Description
Key Specifications
The LM4899 is a fully differential audio power amplifier pri-
marily designed for demanding applications in mobile phones
and other portable communication device applications. It is
capable of delivering 1 watt of continuous average power to
an 8Ω load with less than 1% distortion (THD+N) from a
5VDC power supply.
■ꢀImproved PSRR at 217Hz
■ꢀPower Output at 5.0V & 1% THD
■ꢀPower Output at 3.3V & 1% THD
■ꢀShutdown Curren
83dB
1.0W(typ.)
400mW(typ.)
0.1µA(typ.)
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4899 does not require output
coupling capacitors or bootstrap capacitors, and therefore is
ideally suited for mobile phone and other low voltage appli-
cations where minimal power consumption is a primary re-
quirement.
Features
Fully diffetial amn
■
■
Internal-setting resitors
Availae in e-saving packages micro SMD, MSOP
anLLP
■
The LM4899 features a low-power consumption shutdown
mode. To facilitate this, Shutdown may be enabled by either
logic high or low depending on mode selection. Driving the
shutdown mode pin either high or low enables the shutdown
select pin to be driven in a likewise manner to enable Shut-
down. Additionally, the LM4899 features an internal therma
shutdown protection mechanism.
Ua low current shutdown mode
■
■
■
n de caacitive loads up to 500pF
Impd & click circuitry which virtually eliminates
noises ng turn-on and turn-off transitions
2.4 - 5.5V operation
■
No put coupling capacitors, snubber networks or
strap capacitors required
Shutdown high or low selectivity
The LM4899 contains advanced pop & click circuitry
virtually eliminates noises which would otherwise oc
ing turn-on and turn-off transitions.
■
Applications
The LM4899 has an internally fixed gain of 6dB.
Mobile phones
■
■
PDAs
Portable electronic devices
■
Connection Diagram
9 Bump miPackae
9 Bump micro SMD Marking
200645c7
X - Date Code
T - Die Run Traceability
G - Boomer Family
C1 - LM4899ITL
200645a0
Top View
Order Number LM4899ITL, LM4899ITLX
See NS Package Number TLA09AAA
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2011 National Semiconductor Corporation
200645
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
Mini Small Outline (MSOP) Package
MSOP Marking
200645c9
Z - Assembly Code
X - Date Code
TT - Die Run Traceability
G - Boomer Family
B1 - LM4899MM
20064523
Top View
Order Number LM4899MM
See NS Package Number MUB10A
LD Package
LD Marking
200645c8
Z - Assembly Code
XY - Date Code
TT - Die Run Traceability
L4899 - LM4899LD
20064535
Top View
Order Number LM4899LD
See NS Package Number LDA10B
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Typical Application
200645d0
FIGURE 1. Typicifier Application Circuit
3
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220°C/W
56°C/W
ꢁθJA (micro SMD)
ꢁθJC (MSOP)
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
190°C/W
ꢁθJA (MSOP)
Soldering Information
Supply Voltage
Storage Temperature
Input Voltage
6.0V
−65°C to +150°C
−0.3V to VDD +0.3V
Internally Limited
2000V
See AN-1112 "microSMD Wafers Level Chip Scale
Package".
Power Dissipation (Note 3)
ESD Susceptibility (Note 4)
ESD Susceptibility (Note 5)
Junction Temperature
Thermal Resistance
ꢁθJC (LD)
Operating Ratings
Temperature Range
200V
150°C
TMIN ≤ TA ≤ TMAX
Supply Voltage
−40°C ≤ TA ≤ +85°C
2.4V ≤ VDD ≤ 5.5V
12°C/W
63°C/W
ꢁθJA (LD)
Electrical Characteristics VDD = 5V (Note 1, Note 2, Note 8)
The following specifications apply for VDD = 5V and 8Ω load unless otherwise specifieits ay for TA = 25°C.
LM4899
Units
(Limits)
Symbol
IDD
Parameter
Quiescent Power Supply Current
Standby Current
Conditions
VIN = 0V, no Load
Typical
Limit
(Note 6)
(Note 7)
3
5
6
10
mA (max)
µA (max)
VIN = 0V, RL = 8Ω
ISD
VSDMODE = VSHUTDOWN = G
THD = 1% (ma); f = 1 kHz
LM4899LD, RL Ω (No11)
0.1
1
1.4
1
Po
Output Power
W (min)
%
0.9
LM489= 8Ω
Po = 01kHz
Vripple p-p
f = 2179)
f = 1kHz (Note 9)
21z (Note 10)
f = 1(Note 10)
f = 217Hz, VCM = 200mVpp
= 0V
THD+N
Total Harmonic Distortion+Noise
0.05
83
90
83
83
50
2
PSRR
Power Supply Rejection Ratio
dB (min)
71
71
CMRR
VOS
Common-Mode Rejection R
Output Offset
dB
mV
V
VSDIH
VSDIL
VSDIH
VSDIL
Shutdown Voltage Input High
Shutdown Voltage
Shutdown Voltage
Shutdown Voltage I
D Mode = GND
SD Mode = GND
SD Mode = VDD
0.9
0.7
0.9
0.7
V
V
SD Mode = VDD
V
Electrical Characteristics VDD = 3V (Note 1, Note 2, Note 8)
The following specifications apply for VDD = 3V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4899
Units
(Limits)
Symbol
IDD
Parameter
Conditions
VIN = 0V, no Load
Typical
Limit
(Note 6)
(Note 7)
Quiescent Power Supply Current
2.5
4
5.5
9
mA (max)
µA (max)
W
VIN = 0V, RL = 8Ω
ISD
Standby Current
VSDMODE = VSHUTDOWN = GND
0.1
0.35
0.3
1
THD = 1% (max); f = 1kHz
Po
Output Power
LM4899, RL = 8Ω
THD+N
Total Harmonic Distortion+Noise
Po = 0.25Wrms; f = 1kHz
%
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LM4899
Typical
Units
(Limits)
Symbol
Parameter
Conditions
Limit
(Note 6)
(Note 7)
Vripple = 200mV sine p-p
f = 217Hz (Note 9)
f = 1kHz (Note 9)
f = 217Hz (Note 10)
f = 1kHz (Note 10)
f = 217Hz, VCM = 200mVpp
VIN = 0V
83
84
83
83
50
2
PSRR
Power Supply Rejection Ratio
dB
CMRR
VOS
Common-Mode Rejection Ratio
Offset Voltage
dB
mV
V
VSDIH
VSDIL
VSDIH
VSDIL
Shutdown Voltage Input High
Shutdown Voltage Input Low
Shutdown Voltage Input High
Shutdown Voltage Input Low
SD Mode = GND
SD Mode = GND
SD Mode = VDD
0.8
0.6
0.8
0.6
V
V
SD Mode = VDD
V
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. erating dicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC aC electrical sifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operags. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is tated by TJMAX, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Mmum Ratings, whichever is lower. For the LM4899, see power derating
currents for additional information.
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF–240pF discharged through all pins.
Note 6: Typicals are measured at 25°C and represent the parametric norm.
Note 7: Datasheet min/max specification limits are guaranteed by design, tesatistical lysis.
Note 8: For micro SMD only, shutdown current is measured in a Normal Room EneExposure to direct sunlight will increase ISD by a maximum of 2µA.
Note 9: Unterminated input.
Note 10: 10Ω terminated input.
Note 11: : When driving 4Ω loads from a 5V power supply, the LMmounted to a circuit board with the exposed-DAP area soldered down to a
1sq. in plane of 1oz. copper.
External Components Descpt
(Figure 1)
Components
Functional Description
1.
CS
Supply bypass capaovides power supply filtering. Refer to the Power Supply Bypassing section for
information concerning placement and selection of the supply bypass capacitor.
2.
CB
Bypass pin hich provides half-supply filtering. Refer to the section, Proper Selection of External
Componeation concerning proper placement and selection of CB.
5
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
Typical Performance Characteristics
LD Specific Characteristics
THD+N vs Output Power
THD+N vs Frequency
VDD = 5V, RL = 4Ω, PO = 1W
VDD = 5V, RL = 4Ω
200645c1
200645b5
LM4899LD
Power Dissipation vs Output Power
LM4899LD
Power Derating Curve
20064511
20064512
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Typical Performance Characteristics
Non-LD Specific Characteristics
THD+N vs Frequency
VDD = 5V, RL = 8Ω, PO = 400mW
THD+N vs Frequency
VDD = 3V, RL = 8Ω, PO = 275mW
200645b6
200645b4
THD+N vs Frequency
VDD = 3V, RL = 4Ω, PO = 225mW
THD+N vs Frequency
V= 2.6V, RL = 8Ω, PO = 150mW
200645b2
200645b3
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
THD+N vs Frequency
VDD = 2.6V, RL = 4Ω, PO = 150mW
THD+N vs Output Power
VDD = 5V, RL = 8Ω
200645b1
200645c2
THD+N vs Output Power
THD+N utput Power
VDD = 3V, RL = 8Ω
VDD = V, RL = 4Ω
200645c0
200645b9
THD+N vs Outpu
THD+N vs Output Power
VDD = 2.6V, R
VDD = 2.6V, RL = 4Ω
200645b8
200645b7
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
PSRR vs Frequency
VDD = 5V, RL = 8Ω, Input 10Ω Terminated
PSRR vs Frequency
VDD = 3V, RL = 8Ω, Input 10Ω Terminated
200645b0
200645a9
Output Power vs Supply Voltage
tput Powevs Supply Voltage
RL = 8Ω
RL = 4Ω
200645a6
200645a5
Power Dissipati
Output Power
Power Dissipation vs
Output Power
20064581
20064582
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
Power Dissipation vs
Output Power
Output Power vs
Load Resistance
20064583
20064584
Supply Current vs Shutdown Voltage
Shutdown Low
Suply Ct vs hutdown Voltage
Swn High
2006
20064586
Clipping (Dropout) Voltage vs
Supply Voltag
Open Loop Frequency Response
20064588
20064587
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Power Derating Curve
Noise Floor
20064589
200645a4
CMRR vs Frequency
VDD = 5V, RL = 8Ω, 200mVpp
CMrequency
VDD = 3V, L = 8Ω, 200mVpp
20064
200645a2
PSRR vs Common M
VDD = 5V
PSRR vs Common Mode Voltage
VDD = 3V, RL = 8Ω, 217Hz, 200mVpp
200645a8
200645a7
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cient thermal conductivity by plating-through and solder-filling
the vias.
Application Information
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier share
the same PCB layer, a nominal 2.5in2 (min) area is necessary
for 5V operation with a 4Ω load. Heatsink areas not placed on
the same PCB layer as the LM4899 should be 5in2 (min) for
the same supply voltage and load resistance. The last two
area recommendations apply for 25°C ambient temperature.
In all circumstances and conditions, the junction temperature
must be held below 150°C to prevent activating the LM4899's
thermal shutdown protection. The LM4899's power de-rating
curve in the Typical Performance Characteristics shows the
maximum power dissipation versus temperature. Example
PCB layouts for the exposed-DAP TSSOP and LLP packages
are shown in the Demonstration Board Layout section. Fur-
ther detailed and specific information concerning PCB layout,
fabrication, and mnting an LLP package is available from
National Semicouctopackage Engineering Group under
application note 17.
DIFFERENTIAL AMPLIFIER EXPLANATION
The LM4899 is a fully differential audio amplifier that features
differential input and output stages. Internally this is accom-
plished by two circuits: a differential amplifier and a common
mode feedback amplifier that adjusts the output voltages so
that the average value remains VDD/2. The LM4899 features
precisely matched internal gain-setting resistors, thus elimi-
nating the need for external resistors and fixing the differential
gain at AVD = 6dB.
A differential amplifier works in a manner where the difference
between the two input signals is amplified. In most applica-
tions, this would require input signals that are 180° out of
phase with each other.
The LM4899 provides what is known as a "bridged mode"
output (bridge-tied-load, BTL). This results in output signals
at Vo1 and Vo2 that are 180° out of phase with respect to each
other. Bridged mode operation is different from the single-
ended amplifier configuration that connects the load between
the amplifier output and ground. A bridged amplifier design
has distinct advantages over the single-ended configuration:
it provides differential drive to the load, thus doubling maxi-
mum possible output swing for a specific supply voltage. Four
times the output power is possible compared with a single-
ended amplifier under the same conditions. This increase in
attainable output power assumes that the amplifier is not cur-
rent limited or clipped.
PCB LAYT AND SY REGULATION
CONSIDTIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power ssipaby a load is a function of the voltage swing
acros the load ane load's impedance. As load impedance
deases, load dissipation becomes increasingly dependent
he irconnect (PCB trace and wire) resistance between
the fier put pins and the load's connections. Residual
trace rce causes a voltage drop, which results in power
dissipated n the trace and not in the load as desired. For ex-
ample, .1Ω trace resistance reduces the output power dis-
atby a 4Ω load from 1.4W to 1.37W. This problem of
dased load dissipation is exacerbated as load impedance
decreases. Therefore, to maintain the highest load dissipation
and widest output voltage swing, PCB traces that connect the
output pins to a load must be as wide as possible.
A bridged configuration, such as the one used in the LM4899,
also creates a second advantage over single-ended ampli-
fiers. Since the differential outputs, Vo1 and Vo2, are biased at
half-supply, no net DC voltage exists across the load.
configuration eliminates the output coupling capaci
quired in single-supply, single-ended amplifier configu
If an output coupling capacitor is not used in a single-
output configuration, the half-supply bias acros the
would result in both increased internal IC podissipation
as well as permanent loudspeaker damage. rthn-
tages of bridged mode operation specific to fuiffereal
amplifiers like the LM4899 include incred power sply
rejection ratio, common-mode noise r, and clik and
pop reduction.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply's output voltage de-
creases with increasing load current. Reduced supply voltage
causes decreased headroom, output signal clipping, and re-
duced output power. Even with tightly regulated supplies,
trace resistance creates the same effects as poor supply reg-
ulation. Therefore, making the power supply traces as wide
as possible helps maintain full output voltage swing.
EXPOSED-DAP PACKAGE PCB MOUN
CONSIDERATIONS
POWER DISSIPATION
The LM4899's exposed-DApaddle) package
(LD) provide a low thermal ween the die and
the PCB to which the part is soldered. This al-
lows rapid heat transfer from ththe surrounding PCB
copper traces, ground plane and, finally, surrounding air. The
result is a low voltage audio power amplifier that produces
1.4W at ≤ 1% THD with a 4Ω load. This high power is
achieved through careful consideration of necessary thermal
design. Failing to optimize thermal design may compromise
the LM4899's high power performance and activate unwant-
ed, though necessary, thermal shutdown protection. The LD
package must have its DAP soldered to a copper pad on the
PCB. The DAP's PCB copper pad is connected to a large
plane of continuous unbroken copper. This plane forms a
thermal mass and heat sink and radiation area. Place the heat
sink area on either outside plane in the case of a two-sided
PCB, or on an inner layer of a board with more than two layers.
Connect the DAP copper pad to the inner layer or backside
copper heat sink area with 4 (2x2) vias. The via diameter
should be 0.012in - 0.013in with a 0.050in pitch. Ensure effi-
Power dissipation is a major concern when designing a suc-
cessful amplifer, whether the amplifier is bridged or single-
ended. Equation 2 states the maximum power dissipation
point for a single-ended amplifier operating at a given supply
voltage and driving a specified output load.
2
PDMAX = (VDD)2 / (2π RL) Single-Ended
(1)
However, a direct consequence of the increased power de-
livered to the load by a bridge amplifier is an increase in
internal power dissipation versus a single-ended amplifier op-
erating at the same conditions.
2
PDMAX = 4*(VDD)2 / (2π RL) Bridge Mode
(2)
Since the LM4899 has bridged outputs, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
Even with this substantial increase in power dissipation, the
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
LM4899 does not require additional heatsinking under most
operating conditions and output loading. From Equation 3,
assuming a 5V power supply and an 8Ω load, the maximum
power dissipation point is 625mW. The maximum power dis-
sipation point obtained from Equation 3 must not be greater
than the power dissipation results from Equation 4:
not eliminate the need for bypassing the supply nodes of the
LM4899. Although the LM4899 will operate without the by-
pass capacitor CB, although the PSRR may decrease. A 1µF
capacitor is recommended for CB. This value maximizes
PSRR performance. Lesser values may be used, but PSRR
decreases at frequencies below 1kHz. The issue of CB se-
lection is thus dependant upon desired PSRR and click and
pop performance.
PDMAX = (TJMAX - TA) / θJA
(3)
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4899 contains shutdown circuitry that is used to turn off the
amplifier's bias circuitry. In addition, the LM4899 contains a
Shutdown Mode pin, allowing the designer to designate
whether the part will be driven into shutdown with a high level
logic signal or a low level logic signal. This allows the designer
maximum flexibility in device use, as the Shutdown Mode pin
may simply be tied ermanently to either VDD or GND to set
the LM4899 as er a "shutdown-high" device or a "shut-
down-low" devreectively. The device may then be
placed into shutdoode toggling the Shutdown Select
pin to the ame stathe Shutdown Mode pin. For
simplicityke, this is called "shutdown same", as the
LM489nteutdown mode whenever the two pins are in
the same logic . The trigger point for either shutdown
higr shutdown low is shown as a typical value in the Supply
ent Shutdown Voltage graphs in the Typical Perfor-
mhareristics section. It is best to switch between
ground pply for maximum performance. While the de-
vice may e disabled with shutdown voltages in between
ground and supply, the idle current may be greater than the
picalue of 0.1µA. In either case, the shutdown pin should
bd to a definite voltage to avoid unwanted state changes.
The LM4899's θJA in an MUA10A package is 190°C/W. De-
pending on the ambient temperature, TA, of the system sur-
roundings, Equation 4 can be used to find the maximum
internal power dissipation supported by the IC packaging. If
the result of Equation 3 is greater than that of Equation 4, then
either the supply voltage must be decreased, the load
impedance increased, the ambient temperature reduced, or
the θJA reduced with heatsinking. In many cases, larger traces
near the output, VDD, and GND pins can be used to lower the
θ
JA. The larger areas of copper provide a form of heatsinking
allowing higher power dissipation. For the typical application
of a 5V power supply, with an 8Ω load, the maximum ambient
temperature possible without violating the maximum junction
temperature is approximately 30°C provided that device op-
eration is around the maximum power dissipation point. Re-
call that internal power dissipation is a function of output
power. If typical operation is not around the maximum power
dissipation point, the LM4899 can operate at higher ambient
temperatures. Refer to the Typical Performance Charac-
teristics curves for power dissipation information.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
ical for low noise performance and high power supply
tion ratio (PSRR). The capacitor location on both the
and power supply pins should be as close to the dev
possible. A larger half-supply bypass capacitimpr
PSRR because it increases half-supply stabiliTypical ap-
plications employ a 5V regulator with 10µF an.1µss
capacitors that increase supply stability. This, hver, s
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry, which pro-
vides a quick, smooth transition to shutdown. Another solution
is to use a single-throw switch in conjunction with an external
pull-up resistor (or pull-down, depending on shutdown high or
low application). This scheme guarantees that the shutdown
pin will not float, thus preventing unwanted state changes.
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Physical Dimensions inches (millimeters) unless otherwise noted
9-Bumcro SMD
Order NumbM489L
NS Package Numb9AAA
X1 = 1.514±0.03 4±0.0X3 = 0.600±0.075
LLP
Order Number LM4899LD
NSPackage Number LDA10B
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
Mini Small Outline P)
Order Number LM489M
NSPackage Number MUB
15
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
Notes
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
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