LM5032MTCX/NOPB [TI]

高电压双路交错式电流模式控制器 | PW | 16 | -40 to 125;
LM5032MTCX/NOPB
型号: LM5032MTCX/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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高电压双路交错式电流模式控制器 | PW | 16 | -40 to 125

控制器 信息通信管理 开关 光电二极管
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LM5032  
SNVS344B MARCH 2005REVISED DECEMBER 2014  
LM5032 High-Voltage Dual Interleaved Current Mode Controller  
1 Features  
3 Description  
The LM5032 dual current mode PWM controller  
1
Two Independent PWM Current Mode Controllers  
Integrated High-Voltage Startup Regulator  
Compound 2.5-A Main Output Gate Drivers  
Single Resistor Oscillator Setting to 2 MHz  
Synchronizable Oscillator  
contains all the features needed to control either two  
independent forward dc/dc converters or a single high  
current converter comprised of two interleaved power  
stages. The two controller channels operate 180° out  
of phase thereby reducing input ripple current. The  
LM5032 includes a startup regulator that operates  
over a wide input range up to 100 V and compound  
(bipolar + CMOS) gate drivers that provide a robust  
2.5-A peak sink current. The adjustable maximum  
PWM duty cycle reduce stress on the primary side  
MOSFET switches. Additional features include  
programmable line undervoltage lockout, cycle-by-  
cycle current limit, hiccup mode fault operation with  
adjustable response time, PWM slope compensation,  
Programmable Maximum Duty Cycle  
Maximum Duty Cycle Fold-Back at High-Line  
Voltage  
Adjustable Timer for Hiccup Mode Current  
Limiting  
Integrated Slope Compensation  
Adjustable Line Undervoltage Lockout  
soft-start, and  
a 2-MHz capable oscillator with  
Independently Adjustable Soft-Start (Each  
Regulator)  
synchronization capability.  
Device Information(1)  
Direct Interface with Opto-Coupler Transistor  
Thermal Shutdown  
PART NUMBER  
LM5032  
PACKAGE  
BODY SIZE (NOM)  
TSSOP 16-Pin Package  
TSSOP (16)  
5.00 mm x 4.40 mm  
(1) For all available packages, see the orderable addendum at  
the end of the datasheet.  
2 Applications  
Telecommunication Power Converters  
Industrial Power Converters  
42-V Automotive Systems  
Typical Application Circuit  
VCC  
36V to 75V  
Input  
V
PWR  
3.3V  
VIN  
CS1  
LM5032  
UVLO  
RES  
OUT1  
ERROR AMP  
& ISOLATION  
RT  
Sync  
COMP1  
DCL  
2.5V  
CS2  
VCC  
OUT2  
ERROR AMP  
& ISOLATION  
SS2  
SS1  
COMP2  
GND1  
GND2  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
LM5032  
SNVS344B MARCH 2005REVISED DECEMBER 2014  
www.ti.com  
Table of Contents  
7.3 Feature Description................................................. 12  
7.4 Device Functional Modes........................................ 17  
Application and Implementation ........................ 18  
8.1 Application Information............................................ 18  
8.2 Typical Application ................................................. 23  
Power Supply Recommendations...................... 27  
1
2
3
4
5
6
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
6.1 Absolute Maximum Ratings ...................................... 4  
6.2 ESD Ratings ............................................................ 4  
6.3 Recommended Operating Conditions....................... 4  
6.4 Thermal Information.................................................. 5  
6.5 Electrical Characteristics........................................... 5  
6.6 Typical Characteristics.............................................. 8  
Detailed Description ............................................ 10  
7.1 Overview ................................................................. 10  
7.2 Functional Block Diagram ....................................... 11  
8
9
10 Layout................................................................... 27  
10.1 Layout Guidelines ................................................. 27  
10.2 Layout Example .................................................... 28  
11 Device and Documentation Support ................. 28  
11.1 Trademarks........................................................... 28  
11.2 Electrostatic Discharge Caution............................ 28  
11.3 Glossary................................................................ 28  
7
12 Mechanical, Packaging, and Orderable  
Information ........................................................... 28  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision A (April 2013) to Revision B  
Page  
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device  
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout  
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information  
section ................................................................................................................................................................................... 1  
Changes from Original (April 2013) to Revision A  
Page  
Changed layout of National Data Sheet to TI format ........................................................................................................... 27  
2
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SNVS344B MARCH 2005REVISED DECEMBER 2014  
5 Pin Configuration and Functions  
PW Package  
16-Pin TSSOP  
Top View  
16  
15  
14  
13  
12  
11  
10  
9
1
VIN  
RT/SYNC  
DCL  
2
3
4
5
6
7
8
COMP1  
CS1  
COMP2  
CS2  
SS1  
UVLO  
VCC  
SS2  
RES  
OUT1  
GND1  
OUT2  
GND2  
Pin Functions  
PIN  
NAME  
I/O  
DESCRIPTION  
Input Supply  
APPLICATIONS INFORMATION  
NO.  
1
VIN  
P
Input to the startup regulator. The operating input range is 13 V to  
100 V with transient capability to 105 V.  
2
COMP1  
I
I
PWM Control, Controller 1  
The COMP1 input provides voltage feedback to the PWM  
comparator inverting input of Controller 1 through a 3:1 divider. The  
OUT1 duty cycle increases as the COMP1 voltage increases. An  
internal 5-Kpull-up resistor to 5.0-V provides bias current to an  
opto-coupler transistor.  
3
CS1  
Current Sense Input, Controller 1  
Input for current mode control and the current limit sensing. If the  
CS1 pin exceeds 0.5V the OUT1 pulse is terminated producing  
cycle-by-cycle current limiting. External resistance connected to CS1  
will adjust (increase) PWM slope compensation. This pin's voltage  
must not exceed 1.25V.  
4
5
SS1  
I
I
Soft-start, Controller 1  
An internal 50-µA current source charges an external capacitor to  
set the soft-start rate. During a current limit restart sequence, the  
internal current source is reduced to 1 µA to increase the delay  
before retry. Forcing SS1 below 0.5 V shuts off Controller 1.  
UVLO  
VIN Under-Voltage Lockout  
An external resistor divider sets the input voltage threshold to enable  
the LM5032. The UVLO comparator reference voltage is 1.25 V. A  
switched 20-µA current source provides adjustable UVLO hysteresis.  
The UVLO pin voltage also controls the maximum duty cycle as  
described in the Feature Description section.  
6
7
VCC  
P
Start-up regulator output  
Output of the 7.7-V high-voltage start-up regulator. Current limit is a  
minimum of 19 mA.  
OUT1  
O
Main Gate Driver, Controller 1  
Gate driver output to the primary side switch for Controller 1. OUT1  
swings between VCC and GND1 at a frequency equal to half the  
oscillator frequency.  
8
9
GND1  
GND2  
OUT2  
G
G
O
Ground, Controller 1  
Ground connection for Controller 1 including gate driver, PWM  
controller, soft-start and support functions.  
Ground, Controller 2  
Ground connection for Controller 2 including the gate driver, PWM  
controller and soft-start.  
10  
Main Gate Driver, Controller 2  
Gate driver output to the primary side switch for Controller 2. OUT2  
swings between VCC and GND2 at a frequency equal to half the  
oscillator frequency.  
11  
RES  
I
Hiccup mode restart adjust  
An external capacitor sets the time delay before forced restart during  
a sustained period of cycle-by-cycle current limiting. The hiccup  
mode comparator threshold is 2.55 V.  
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Pin Functions (continued)  
PIN  
I/O  
DESCRIPTION  
APPLICATIONS INFORMATION  
NO.  
NAME  
12  
SS2  
I
Soft-start, Controller 2  
An internal 50-µA current source charges an external capacitor to  
set the soft-start rate. During a current limit restart sequence, the  
internal current source is reduced to 1 µA to increase the delay  
before retry. Forcing SS2 below 0.5 V shuts off Controller 2.  
13  
14  
CS2  
I
I
Current Sense Input, Controller 2  
Input for current mode control and the current limit sensing. If the  
CS2 pin exceeds 0.5 V the OUT2 pulse is terminated producing  
cycle-by-cycle current limiting. External resistance connected to CS2  
will adjust (increase) PWM slope compensation. This pin's voltage  
must not exceed 1.25V.  
COMP2  
PWM Control, Controller 2  
Duty Cycle Limit  
The COMP2 input provides voltage feedback to the PWM  
comparator inverting input of Controller 2 through a 3:1 divider. The  
OUT2 duty cycle increases as the COMP2 voltage increases. An  
internal 5kpull-up resistor to 5.0 V provides bias current to the  
opto-coupler transistor.  
15  
16  
DCL  
I
I
An external resistor sets the maximum allowed duty cycle at OUT1  
and OUT2.  
RT/SYNC  
Oscillator Adjust and Synchronizing An external resistor sets the oscillator frequency. This pin also  
input accepts ac-coupled synchronization pulses from an external source.  
6 Specifications  
6.1 Absolute Maximum Ratings(1)(2)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
MAX  
105  
16  
UNIT  
V
VIN to GND  
VCC to GND  
V
RT/SYNC, RES and DCL to GND  
CS Pins to GND  
5.5  
V
1.25  
7
V
All other inputs to GND  
Junction temperature  
Lead Temperature (Soldering 4 sec),(3)  
Storage temperature, Tstg  
V
150  
260  
150  
°C  
°C  
°C  
–55  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are  
conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical  
Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) For detailed information on soldering plastic TSSOP packages, refer to the Packaging Data Book available from Texas Instruments.  
6.2 ESD Ratings  
VALUE  
UNIT  
V(ESD)  
Electrostatic discharge  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±2000  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
100  
15  
UNIT  
V
VIN Voltage  
13  
8
External Voltage Applied to VCC  
Operating Junction Temperature  
V
–40  
125  
°C  
4
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6.4 Thermal Information  
LM5032  
THERMAL METRIC(1)  
PW  
16 PINS  
96.8  
UNIT  
RθJA  
RθJC(top)  
RθJB  
ψJT  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
30.3  
42.4  
°C/W  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
1.7  
ψJB  
41.8  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
6.5 Electrical Characteristics  
MIN and MAX limits apply –40°C TJ 125°C. VIN = 48 V, VCC = 10 V externally applied, RT = RDCL = 42.2k, UVLO = 1.5  
V, TJ = 25°C, unless otherwise stated, see(1)and see(2)  
.
SYMBOL  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
STARTUP REGULATOR (VIN, VCC Pins)  
VCCReg  
ICC(Lim)  
VCC voltage  
Ext. supply disconnected.  
VCC = 0V.  
7.4  
19  
7.7  
22  
8
V
mA  
V
VCC current limit  
VCC UVT  
VCC Under-voltage threshold  
(VCC increasing)  
Ext. supply disconnected, VIN =11V.  
VCC -  
300 mV 100 mV  
VCC -  
VCC decreasing  
5.5  
6.2  
500  
4.3  
6.9  
600  
7
V
IIN  
Startup regulator current  
VIN = 90V, UVLO = 0V  
µA  
mA  
ICCIn  
Supply current into VCC from  
external source  
Output loads = open, VCC = 10V  
UVLO  
UVLO  
IHYST  
Under-voltage threshold  
Hysteresis current  
1.22  
16  
1.25  
20  
1.28  
24  
V
µA  
CURRENT SENSE INPUT (CS1, CS2 Pins)  
CS  
Current Limit Threshold  
CS delay to output  
0.45  
0.5  
40  
0.55  
V
CS1 (CS2) taken from zero to 1.0V. Time for  
OUT1 (OUT2) to fall to 90% of VCC. Output  
load = 0 pF.  
ns  
Leading edge blanking time at  
CS1 (CS2)  
50  
30  
42  
ns  
CS1 (CS2) sink impedance  
(clocked)  
Internal pull-down FET on.  
55  
RCS  
Equivalent input resistance at CS CS taken from 0.2V to 0.5V, internal FET off.  
kΩ  
CURRENT LIMIT RESTART (RES Pin)  
ResTh  
Threshold  
2.4  
15  
2.55  
20  
2.7  
25  
V
Charge source current  
Discharge sink current  
µA  
µA  
7.5  
10  
12.5  
SOFT-START (SS1, SS2 Pins)  
ISS  
Current source (normal  
operation)  
35  
50  
1
65  
µA  
µA  
V
Current source during a current  
limit restart  
0.7  
1.3  
VSS  
Open circuit voltage  
5
OSCILLATOR (RT/SYNC Pin)  
FS1  
FS2  
Frequency 1 (at OUT1, OUT2)  
Frequency 2 (at OUT1, OUT2)  
RT = 42.2 kΩ  
RT = 13.7 kΩ  
183  
530  
200  
600  
217  
670  
kHz  
kHz  
(1) All electrical characteristics having room temperature limits are tested during production with TA = 25°C. All hot and cold limits are  
specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.  
(2) Typical specifications represent the most likely parametric norm at 25°C operation  
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Electrical Characteristics (continued)  
MIN and MAX limits apply –40°C TJ 125°C. VIN = 48 V, VCC = 10 V externally applied, RT = RDCL = 42.2k, UVLO = 1.5  
V, TJ = 25°C, unless otherwise stated, see(1)and see(2)  
.
SYMBOL  
PARAMETER  
DC voltage  
Input Sync threshold  
PWM CONTROLLER (COMP1, COMP2, Duty Cycle Limit Pins)  
TEST CONDITIONS  
MIN  
TYP  
2
MAX  
UNIT  
V
2.6  
3.3  
3.7  
V
Delay to output  
COMP1 (COMP2) set to 2V. CS1 (CS2)  
stepped from 0 to 0.4V. Time for OUT1  
(OUT2) to fall to 90% of VCC. Output load = 0  
pF.  
50  
ns  
VCOMP  
ICOMP  
COMP1 (COMP2) open circuit  
voltage  
5
1
V
COMP1 (COMP2) short circuit  
current  
COMP1 (COMP2) = 0V  
0.6  
1.4  
0%  
mA  
V/V  
COMP1 (COMP2) to PWM1  
(PWM2) gain  
0.33  
Minimum duty cycle  
SS1 (SS2) = 0V  
Maximum duty cycle 1  
UVLO pin = 1.30V, RDCL = RT, COMP1  
(COMP2) = open  
76%  
20%  
20%  
50%  
40%  
90  
Maximum duty cycle 2  
Maximum duty cycle 3  
Maximum duty cycle 4  
Maximum duty cycle 5  
Slope compensation  
UVLO pin = 3.75V, RDCL = RT, COMP1  
(COMP2) = open  
UVLO pin = 1.30V, RDCL = RT/4, COMP1  
(COMP2) = open  
UVLO pin = 2.50V, RDCL = RT, COMP1  
(COMP2) = open  
UVLO pin = 1.30V, RDCL = RT/2, COMP1  
(COMP2) = open  
Delta increase at PWM comparator to CS1  
(CS2)  
mV  
Channel mismatch  
CS1 (CS2) = 0.25V  
SS1 (SS2) = 0.8V  
7%  
Soft-start to COMP offset  
0
V
V
MAIN OUTPUT DRIVERS (OUT1, OUT2)  
Output high voltage  
IOUT = 50mA (source)  
VCC-1  
VCC-  
0.2  
Output low voltage  
Rise time  
IOUT = 100 mA (sink)  
CLOAD = 1 nF  
0.3  
12  
1
V
ns  
ns  
A
Fall time  
CLOAD = 1 nF  
10  
Peak source current  
Peak sink current  
1.5  
2.5  
A
THERMAL SHUTDOWN  
TSD  
Shutdown temperature  
Hysteresis  
165  
20  
°C  
°C  
6
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UVLO  
VIN  
UVT  
VCC  
SS1  
t
VCC  
1.5V  
1.5V  
COMP1  
OUT1  
t
1
1.5V  
1.5V  
SS2  
COMP2  
OUT2  
Figure 1. Startup Sequence  
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6.6 Typical Characteristics  
600  
14  
12  
10  
VCC Pin = Open  
500  
400  
VCC pin = open,  
OUT1 & OUT2 load = 2200 pF  
8
6
4
Outputs frequency = 200 kHz  
UVLO > 1.25V  
300  
UVLO = 0V  
200  
VCC pin = open, Driver Outputs Open  
VCC Pin = 10V  
100  
2
0
VCC pin = 10V, Driver Outputs  
open or loaded  
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
VOLTAGE AT VIN (V)  
VOLTAGE AT V (V)  
IN  
Figure 2. IIN vs VIN  
Figure 3. IIN vs VIN  
100  
80  
8
7
6
5
4
3
2
1
0
Output Drivers @ 1 MHz  
UVLO > 1.25V  
VCC Pin Unloaded  
60  
40  
500 kHz  
1 MHz  
200 kHz  
50 kHz  
12  
20  
0
15  
8
9
10  
11  
13  
14  
APPLIED VCC VOLTAGE (V)  
OUT1, 2 = Open  
OUT1, 2 load = 2200 pF  
0
2
4
6
8
10  
12  
14  
VOLTAGE AT VIN (V)  
Figure 4. ICC vs Externally Applied VCC  
Figure 5. VCC vs VIN  
8
7
6
5
4
3
2
1
0
10  
1.0  
0.1  
0.01  
0
5
10  
15  
(mA)  
20  
25  
1
10  
100  
1000  
R
T
(k:)  
I
CC  
Figure 7. Oscillator Frequency vs RT Resistor  
Figure 6. VCC vs ICC (Externally Loaded)  
8
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Typical Characteristics (continued)  
100  
100  
80  
80  
60  
40  
20  
0
UVLO Pin = 1.26V  
60  
40  
20  
0
0
0.2  
0.4  
0.6  
/R  
0.8  
1.0  
0
1.0  
1.25V  
VOLTAGE AT UVLO PIN (V)  
2.0  
3.0  
4.0  
5.0  
R
DCL  
T
Figure 9. Maximum Duty Cycle vs. UVLO Voltage  
Figure 8. User Defined Maximum Duty Cycle vs RDCL  
Resistor  
100  
210  
208  
206  
204  
202  
200  
198  
196  
194  
R
R
= 150 k:  
= 10 k:  
1
80  
2
Figure 23  
60  
40  
20  
0
R
T
= 42.2k  
0
192  
190  
-50  
50  
100  
150  
0
20  
40  
60  
80  
TEMPERATURE (oC)  
VOLTAGE AT VIN (V)  
Figure 10. Maximum Duty Cycle vs. VIN (Figure 24)  
Figure 11. Frequency vs. Temperature  
510  
508  
506  
504  
502  
500  
498  
496  
494  
492  
490  
55  
50  
45  
|
|
1.10  
1.0  
0.9  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
TEMPERATURE (oC)  
TEMPERATURE (oC)  
Figure 12. Soft-Start Pin Current vs Temperature  
Figure 13. Current Limit Threshold at CS1, CS2 vs  
Temperature  
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7 Detailed Description  
7.1 Overview  
The LM5032 contains all the features necessary to implement two independently regulated current mode dc/dc  
converters, or a single high current converter comprised of two parallel interleaved channels using the Forward  
converter topology. The two controllers operate 180° out of phase from a common oscillator, thereby reducing  
input ripple current. Each regulator channel contains a complete PWM controller, current sense input, soft-start  
circuit, and gate driver output. Common to both channels are the startup and VCC regulator, line under-voltage  
lockout, 2 MHz capable oscillator, maximum duty cycle control, and the hiccup mode fault protection circuit.  
The gate driver outputs (OUT1, OUT2) are designed to drive N-channel MOSFETs. Their compound  
configuration reduces the turn-off-time, thereby reducing switching losses. Additional features include thermal  
shutdown, slope compensation, and the oscillator synchronization capability.  
10  
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7.2 Functional Block Diagram  
7.7V SERIES  
REGULATOR  
VI  
N
VCC  
V
CC  
6
V
CC  
Disable  
THERMAL  
SHUTDOWN  
VCC  
BIAS VOLTAGE  
GENERATOR  
5.0V  
RT/  
SYNC  
V
UVT  
CC  
20 PA  
CLK1, 2  
UVLO  
OSCILLATOR  
& RAMP  
GENERATOR  
UserMaxDC1, 2  
Drivers Off  
RAMP1, 2  
UVLO  
1.25V  
SLOPE1, 2  
DCL  
5.0V  
MaxDC1  
MaxDC2  
Ramp1  
ILim1,2  
20 PA  
-V  
RES  
UVLO  
LOGIC  
Clk1,2  
DC1,2  
Vref  
10 PA  
R
S
Q
Ramp2  
Restart  
Latch  
2.55V  
Q
Support Functions  
Restart  
5.0V  
45 PA  
VCC  
SLOPE1  
Drivers Off  
OUT1  
GND1  
5k  
PWM  
Restart  
Comp 1  
PWM  
Latch  
Driver  
Logic  
10k  
COMP1  
CS1  
Driver Enable  
Q
R
S
CLK1  
Q
PWM1  
5k  
MaxDC1  
DC1  
UserMaxDC1  
ILim1  
Current  
Limit  
2k  
SS1  
CLK1  
OUT1+50 ns  
UVT  
42k  
0.5V  
V
CC  
Controller 1  
5.0V  
45 PA  
SLOPE2  
5k  
PWM  
Comp 2  
VCC  
PWM  
Latch  
Drivers Off  
Restart  
10k  
5k  
COMP2  
CS2  
OUT2  
GND2  
R
Q
PWM2  
Driver  
Logic  
Q
CLK2  
S
Driver Enable  
DC2  
MaxDC2  
UserMaxDC2  
Current  
Limit  
2k  
SS2  
CLK2  
ILim2  
42k  
OUT2+50 ns  
UVT  
0.5V  
V
CC  
Controller 2  
Driver Enable  
5.0V  
49 PA  
5.0V  
Restart  
Latch  
5.0V  
5.0V  
Restart  
Latch  
1 PA  
1 PA  
49 PA  
SS1  
SS2  
Logic  
Logic  
SS1  
SS2  
Restart  
1k  
Drivers Off  
1k  
Soft-start  
1
Soft-start  
2
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7.3 Feature Description  
7.3.1 Line Undervoltage Lock Out, UVLO, Shutdown  
The LM5032 contains a line under-voltage lockout circuit (UVLO) designed to enable the VCC regulator and  
output drivers when the system voltage (VPWR) exceeds the desired level (see Figure 14). VPWR is the voltage  
normally applied to the transformer primary, and usually connected to the VIN pin (see the schematic on Page  
1). The threshold at the UVLO comparator is 1.25V. An external resistor divider connected from VPWR to ground  
provides 1.25V at the UVLO pin when VPWR is increased to the desired turn-on threshold. When VPWR is below  
the threshold the VCC regulator and output drivers are disabled, and the internal 20 µA current source is off.  
When VPWR reaches the threshold, the comparator output switches low to enable the internal circuits and the 20  
µA current source. The 20 µA flows into the external divider’s junction, raising the voltage at UVLO, thereby  
providing hysteresis. Internally the voltage at UVLO also drives the Maximum Duty Cycle Limiter circuit  
(described below), which may influence the values chosen for the UVLO pin resistors. At maximum VPWR, the  
voltage at UVLO should not exceed 6V. Refer to the Applications Information section for a procedure to calculate  
the resistors values.  
The LM5032 controller can be shutdown by forcing the UVLO pin below 1.25V with an external switch. When the  
UVLO pin is low, the outputs and the VCC regulator are disabled, and the LM5032 enters a low power mode. If  
VCC pin is not powered from an external source, the current into VIN drops to a nominal 500 µA. If the VCC pin  
is powered from an external source, the current into VIN is nominally 50 µA, and the current into the VCC pin is  
approximately 4.3 mA. To disable one regulator without affecting the other, see the description of the Soft-start  
section.  
V
CC  
LM5032  
THERMAL  
SHUTDOWN  
7.6V/6.2V  
V
PWR  
V
CC  
Disable  
20PA  
R1  
UVLO  
Drivers Off  
UVLO  
1.25V  
R2  
Max . Duty  
Cycle Limiter  
Figure 14. Drivers Off and VCC Disable  
7.3.2 Startup Regulator, VIN, VCC  
The high voltage startup regulator is integral to the LM5032. The input pin VIN can be connected directly to a  
voltage between 13V and 100V, with transient capability to 105V. The startup regulator provides bias voltages to  
the series pass VCC regulator and the UVLO circuit. The VCC regulator is disabled until the voltage at the UVLO  
pin (described above) exceeds 1.25V. For applications where VPWR exceeds 100V the internal startup regulator  
can be powered from an external startup regulator or other available low voltage source. See the Applications  
Information section for details.  
The VCC under-voltage threshold circuit (UVT) monitors the VCC regulator output. When the series pass  
regulator is enabled and the internal VCC voltage increases to > 7.6V, the UVT comparator activates the PWM  
controller and output drivers via the Drivers Off signal. The UVT comparator has built-in hysteresis, with the lower  
threshold nominally set to 6.2V. See Figure 1 and Figure 14.  
When enabled, the VCC regulated output is 7.7V ±4% with current limited to a minimum of 19 mA (typically 22  
mA). The regulator’s output impedance is 6.  
The VCC pin requires a capacitor to ground for stability, as well as to provide the surge currents to the external  
MOSFETs via the gate driver outputs. The capacitor should be physically close to the VCC and GND pins.  
In most applications it is necessary to power VCC from an external source as the average current required at the  
output drivers may exceed the current capability of the internal regulator and/or the thermal capability of the  
LM5032 package (see Figure 4). Normally the external source is derived from the converter’s power stage once  
the LM5032 outputs are active. Refer to the Applications Information section for more information.  
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Feature Description (continued)  
7.3.3 Drivers Off, VCC Disable  
Referring to Figure 14, Drivers Off and VCC Disable are internal signals which, when active disable portions of the  
LM5032. If the UVLO pin is below 1.25V, or if the thermal shutdown activates, the VCC Disable line switches high  
to disable the VCC regulator. UVLO also activates the Drivers Off signal to disable the output drivers, connect the  
SS1, SS2, COMP1, COMP2 and RES pins to ground, and enable the 50 µA Soft-start current sources.  
If the VCC voltage falls below the under-voltage threshold of 6.2V , the UVT comparator activates only the Drivers  
Off signal. The output drivers are disabled but the VCC regulator is not disabled. Additionally, the CS1, CS2, SS1,  
SS2, COMP1, COMP2 and RES pins are internally grounded, and the 50 µA Soft-start current sources are  
enabled.  
7.3.4 Oscillator  
The oscillator frequency is set with an external resistor RT connected between the RT/SYNC and GND1 pins.  
The resistor value is calculated from:  
17100  
- 0.001(FS - 400)  
RT =  
FS  
(1)  
where FS is the desired oscillator frequency in kHz (maximum of 2 MHz), and RT is in k. See Figure 7. The two  
gate driver outputs (OUT1 and OUT2) switch at half the oscillator frequency and 180° out of phase with each  
other. The voltage at the RT/SYNC pin is internally regulated at 2.0V. The RT resistor should be located as close  
as possible to the LM5032 with short direct connections to the pins.  
The LM5032 can be synchronized to an external clock by applying a narrow clock pulse to the RT/SYNC pin. See  
the Applications Information section for details on this procedure. The RT resistor is always required, whether the  
oscillator is free running or externally synchronized.  
7.3.5 PWM Comparator/Slope Compensation  
The PWM comparator of each controller compares a slope compensated current ramp signal with the loop error  
voltage derived from the COMP pin. The COMP voltage is typically controlled by an external error  
amplifier/optocoupler feedback circuit to regulate the converter output voltage. Internally, the voltage at the  
COMP pin passes through two level shifting diodes and a gain reducing 3:1 resistor divider (see Figure 15). The  
compensated current ramp signal is a combination of the current waveform at the CS pin, and an internally  
generated ramp derived from the internal clock. At duty cycles greater than 50% current mode control circuits are  
prone to subharmonic oscillation. By adding a small fixed ramp to the external current sense signal oscillations  
can be avoided. The internal ramp has an amplitude of 45 µA and is sourced into an internal 2kresistor, and a  
42 kresistor in parallel with the external impedance at the CS pin. The ramp current also flows through the  
external impedance connected to the CS pin and thus, the amount of slope compensation can be adjusted by  
varying the external circuit at the CS pin.  
The output of the PWM comparator provides the pulse width information to the output drivers. This comparator is  
optimized for speed in order to achieve minimum controllable duty cycles. The comparator’s output duty cycle is  
0% for VCOMP 1.5V, and increases as VCOMP increases.  
If either Soft-start pin is pulled low (internally or externally) the corresponding COMP pin is pulled down with it,  
forcing the output duty cycle to zero. When the Soft-start pin voltage increases, the COMP pin is allowed to  
increase. An internal 5 kresistor connected from COMP to an internal 5.0V supply provides a pull-up for the  
COMP pin and bias current to the collector of the opto-coupler transistor.  
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Feature Description (continued)  
Power  
Transformer  
Current  
Sense  
V
OUT  
V
PWR  
Slope Comp.  
45 PA  
Load  
LM5032  
RF  
2k  
30  
RCS  
CS1  
PWM  
Comparator  
CF  
V
LEB  
10k  
42k  
REF  
Error  
Amplifier  
COMP1  
|
5.0V  
5k  
5k  
Figure 15. Typical Feedback Network  
7.3.6 Cycle-by-Cycle Current Limit  
Each CS pin is designed to accept a signal representative of its transformer primary current. If the voltage at CS  
exceeds 0.5V the current sense comparator terminates the present main output driver (OUT pin) pulse. If the  
high current fault persists, the controller operates with constant peak switch current in a cycle-by-cycle current  
limit mode, and a Hiccup Mode Current Limit Restart cycle begins (see below).  
Each CS pin is internally connect to ground through a 30resistor during the main output off time to discharge  
external filter capacitance. The discharge device remains on for an additional 50 ns after the main output driver  
switches high to blank leading edge transients in the current sensing circuit. Discharging the CS pin filter each  
cycle and blanking leading edge spikes reduces the filter requirement which improves the current sense  
response time.  
The current sense comparators are fast and respond to short duration noise pulses. The external circuitry at  
each CS pin should include an R-C filter to suppress noise. Layout considerations are critical for the current  
sense filter and the sense resistor. Refer to the Applications Information section for PC board layout guidelines.  
7.3.7 Hiccup Mode Current Limit Restart  
If cycle-by-cycle current limiting continues in either or both controllers for a sufficient period of time, the Current  
Limit Restart circuit disables both regulators and initiates a soft-start sequence after a programmable delay. The  
duration of cycle-by-cycle current limiting before turn-off occurs is programmed by the value of the external  
capacitor at the RES pin. The dwell time before output switching resumes is programmed by the value of the  
Soft-start capacitor(s). The circuit is detailed in Figure 16 and the timing is shown in Figure 17. A description of  
this circuit’s operation is as follows:  
a) No current limit detected:  
The 10 µA discharge current source at RES is enabled pulling the RES pin to ground.  
b) Current limit repeatedly detected at both CS inputs:  
The 20 µA current source at RES is enabled continuously to charge the RES pin capacitor as shown in  
Figure 17. The current limit comparators also terminate the PWM output pulses to provide a cycle-by-cycle  
current limiting. When the voltage on the RES capacitor reaches the 2.55V restart comparator threshold, the  
comparator sets the Restart Latch which produces the following restart sequence:  
The SS1 and SS2 pin charging currents are reduced from 50µA to 1 µA.  
An internal MOSFET is turned on to discharge the RES pin capacitor.  
The internal MOSFETs at SS1 and SS2 are turned on to discharge the Soft-start capacitors.  
COMP1 and COMP2 follow SS1 and SS2 respectively and reduce the PWM duty cycles to zero.  
When the voltages at the SS pins fall below 200mV, the internal MOSFETs at the SS pins are turned off  
allowing the SS pins to be charged by the 1µA current sources.  
When either SS pin reaches 1.5V its PWM controller produces the first pulse of a soft-start sequence which  
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Feature Description (continued)  
resets the Restart Latch. The SS charging currents are increased to 50 µA and the soft-start sequence  
continues at the normal rate.  
If the overload condition still exists, the voltage at RES begins to increase again and repeat the restart cycle as  
shown in Figure 17. If the overload condition has been cleared, the RES pin is held at ground by the 10 µA  
current source.  
c) Current limit repeatedly detected at one of the two CS inputs:  
In this condition the RES pin capacitor is charged by the 20 µA current source once each clock cycle of the  
current limited regulator, and discharged by the 10 µA current source once each clock cycle of the unaffected  
regulator. The voltage at the RES pin increases one fourth as fast as in case b) described above. The current  
limited regulator operates in a cycle-by-cycle current limit mode until the voltage at RES reaches the 2.55V  
threshold. When the Restart Comparator output switches high the Restart Latch is set, both SS pin capacitors  
are discharged to disable the regulator channels, and a restart sequence begins as described in case b) above.  
To determine the value of the RES pin capacitor, see the Applications Information section.  
CS1  
Current  
Limit  
5.0V  
Current  
Sense Circuit  
Restart  
Current  
Source  
Logic  
0.5V  
0.5V  
20 PA  
RES  
Clk1, Clk2  
Current  
Limit  
Current  
Sense Circuit  
C
RES  
10 PA  
CS2  
SS1  
To Output  
Drivers  
COMP1  
Voltage  
2.55V  
DC1  
DC2  
PWM #1  
Feedback  
S
R
Restart  
Comparator  
Voltage  
Feedback  
Q
PWM #2  
Restart  
Latch  
COMP2  
Drivers Off  
SS2  
49 PA  
1PA  
SS1  
SS1  
SS  
Drivers Off  
C
200 mV  
Logic  
SS1  
Soft-start #1  
1PA 49PA  
SS2  
SS2  
SS  
C
Logic  
SS2  
200 mV  
Soft-start #2  
LM5032  
Figure 16. Current Limit Restart Circuit  
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Feature Description (continued)  
2.55V  
Current Limit Detected at  
CS1 and/or CS2  
RES  
0V  
5.0V  
50PA  
SS1  
and  
SS2  
1PA  
#1.5V  
OUT1  
OUT2  
t1  
t2  
t3  
Figure 17. Current Limit Restart Timing  
7.3.8 Soft-Start  
Each soft-start circuit allows the corresponding regulator to gradually reach a steady state operating point,  
thereby reducing startup current surges and output overshoot. Upon turn-on, both SS pins are internally held at  
ground. When VCC increases past its under-voltage threshold (UVT), the SS pins are released and internal 50  
µA current sources charge the external capacitors. The voltage at each COMP pin follows the SS pin, and when  
COMP reaches 1.5V, the output pulses commence at a low duty cycle. The voltage at the SS pins continues to  
increase and saturates at 5.0V, The voltage at each COMP pin increases to the value required for regulation  
where it is controlled by its voltage feedback loop (see Figure 1).  
If the internal Drivers Off line is activated (see Drivers Off, VCC Disable), both SS pins are internally grounded.  
The SS pins pull the COMP pins to ground while the Driver Off signal disables the output drivers. When the  
event which activated the Drivers Off line is cleared and Vcc exceeds its under-voltage threshold, the SS pins  
are released. The internal 50 µA current sources then charge the external soft-start capacitors allowing each  
regulator’s output duty cycle to increase.  
If the Current Limit Restart threshold is reached due to repeated over-current detections, both SS pins (and the  
COMP pins) are pulled to ground. The output drivers are disabled, and the 50 µA SS pin current sources are  
reduced to 1 µA. After a short propagation delay the SS pins and the COMP pins are released, and the external  
capacitors are charged up at a slow rate. When the COMP voltage reaches 1.5V, the output drivers are  
enabled, and the current sources at the SS pins are increased to 50 µA. The output duty cycle then increases to  
the value required for regulation.  
To shutdown one regulator without affecting the other, ground the appropriate SS pin. This forces the COMP pin  
to ground, reducing the output duty cycle to zero for that regulator. Releasing the SS pin allows normal operation  
to resume.  
7.3.9 Output Duty Cycle  
The output driver’s duty cycle for each controller is normally controlled by comparing the voltage provided to the  
COMP input by the external voltage feedback circuit with the current information at the CS pin. However, the  
maximum duty cycle during transient or fault conditions may be intentionally limited by two other circuits, both of  
which are common to the two controller channels.  
User Defined Maximum Duty Cycle. The maximum allowed duty cycle can be set with the RDCL resistor  
connected from the DCL pin to GND1, according to the following equation:  
Maximum User Duty Cycle = 80% x RDCL/RT  
(2)  
RT is the oscillator frequency programming resistor connected to the RT/SYNC pin. The value of the RDCL resistor  
must be calculated after the RT resistor is selected. See Figure 8. Referring to the block diagram of the voltage at  
the DCL pin is compared to the Ramp1 and Ramp2 signals, creating the UserMaxDC1 and UserMaxDC2 timing  
signals. These signal are provided to the two 4-input AND gates to limit the PWM duty cycle of both channels.  
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Feature Description (continued)  
Line Voltage Maximum Duty Cycle. The voltage at the UVLO pin, normally proportional to the voltage at VPWR  
,
further limits the maximum duty cycle at high input voltages. Referring to Figure 10, when the UVLO pin is below  
1.25V, the outputs are disabled. At UVLO = 1.25V the maximum allowed duty cycle is 80% (or less if limited by  
the DCL resistor). As the UVLO pin voltage increases with VPWR, the maximum duty cycle decreases, reaching a  
minimum of 10% at 4.5V. Referring to the UVLO voltage, after passing through an inverting gain stage, is  
compared to the Ramp1 and Ramp2 signals generated by the oscillator. The output of these comparators are the  
MaxDC1 and MaxDC2 timing signals. These signals are provided to the two 4-input AND gates which limit the  
PWM pulses delivered to the output drivers.  
Resulting Output Duty Cycle. The controller duty cycle is determined by the four signals into the 4-input AND  
gates in (UserMaxDC, MaxDC, PWM and CLK). The output driver pulsewidth is equal to the least of these four  
pulses. Whichever input of the AND gate transitions high-to-low first terminates the output driver’s on-time.  
7.3.10 Driver Outputs  
OUT1, the primary switch driver for Controller 1 is designed to drive the gate of an N-channel MOSFET with 1.5A  
sourcing current and 2.5A sinking current. The peak output levels are VCC and GND1. The ground return path  
for Controller 1 is GND1. The corresponding pins for Controller 2 are OUT2 and GND2.  
OUT1 and OUT2 are compound gate drivers with CMOS and Bipolar output transistors as shown in Figure 18.  
The parallel MOS and Bipolar devices provide a faster turn-off of the primary switch thereby reducing switching  
losses. The outputs switch at one-half the oscillator frequency with the rising edges at OUT1 and OUT2 180° out  
of phase with each other. The on-time of OUT1 and OUT2 is determined by their respective duty cycle control.  
LM5032  
VCC  
OUT  
GND  
PWM  
Figure 18. Compound Gate Driver  
7.3.11 Thermal Shutdown  
The LM5032 should be operated so the junction temperature does not exceed 125°C. If a junction temperature  
transient reaches 165°C (typical), the Thermal Shutdown circuit activates the VCC Disable and Drivers Off lines  
(see Figure 14). The VCC regulator and the four output drivers are disabled, the SS1, SS2, and RES pins are  
grounded, and the soft-start current is set to 50 µA. This puts the LM5032 in a low power state helping to prevent  
catastrophic failures from accidental device overheating. When the junction temperature reduces below 145°C  
(typical hysteresis = 20°C), the VCC regulator is enabled and a startup sequence is initiated (Figure 1).  
7.4 Device Functional Modes  
Normal device operating mode is described above in sections Line Undervoltage Lock Out, UVLO, Shutdown  
through Cycle-by-Cycle Current Limit, and sections Soft-Start to Thermal Shutdown. Under overcurrent fault  
conditions, the device operate in Hiccup Mode, as detailed above in the Hiccup Mode Current Limit Restart  
section.  
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8 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
8.1.1 VIN  
The voltage applied to the VIN pin, normally the same as the system voltage applied to the power transformer’s  
primary (VPWR), can vary in the range of 13 to 100V with transient capability to 105V. The current into VIN  
depends primarily on the output driver capacitive loads, the switching frequency, and any external load at VCC. If  
the power dissipation associated with the VIN current exceeds the package capability, an external voltage should  
be applied to VCC (see Figure 2 & Figure 3) to reduce power in the internal start-up regulator. It is recommended  
the circuit of Figure 19 be used to suppress transients which may occur at the input supply, in particular where  
VIN is operated close to the maximum operating rating of the LM5032.  
When all internal bias currents for the LM5032 and output driver currents are supplied through VIN and the  
internal VCC regulator, the required input current (IIN) is shown in Figure 2 & Figure 3. In most applications, upon  
turn-on, IIN increases with VIN as shown in Figure 2 until the UVLO threshold is reached. After the outputs are  
enabled and the external VCC supply voltage is active, the current into VIN then drops to a nominal 120 µA.  
V
PWR  
50  
VIN  
0.1 PF  
LM5032  
Figure 19. Input Transient Protection  
8.1.2 For Applications > 100 V  
For applications where the system input voltage (VPWR) exceeds 100V, VIN can be powered from an external  
start-up regulator as shown in Figure 20, or from any other low voltage source as shown in Figure 21.  
Connecting VIN and VCC together allows the LM5032 to be operated with VIN below 13V. The voltage at VCC  
must not exceed 15V. The voltage source at the right side of Figure 20 is typically derived from the power stage,  
and becomes active once the LM5032’s outputs are active.  
V
PWR  
C1  
8V - 15V (from  
power stage)  
VIN  
VCC  
9V  
0.1  
LM5032  
Figure 20. Start-up Regulator for VPWR >100V  
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Application Information (continued)  
8V-15V  
Start-up  
Voltage  
VIN  
VCC  
8V - 15V  
C1  
LM5032  
Figure 21. Bypassing the Internal Start-up Regulator  
8.1.3 UVLO  
The under-voltage lockout threshold (UVLO) is internally set at 1.25V at the UVLO pin. With two external  
resistors as shown in Figure 22, the LM5032 is enabled when VPWR exceeds the programmed threshold voltage.  
When VPWR is above the threshold, the internal 20 µA current source is enabled to raise the voltage at the UVLO  
pin, providing hysteresis. R1 and R2 are determined from the following equations:  
R1 = VHYS/20 µA  
(3)  
1.25 x R1  
R2 =  
VPWR - 1.25  
(4)  
where VHYS is the desired UVLO hysteresis at VPWR, and VPWR in the second equation is the turn-on voltage. For  
example, if the LM5032 is to be enabled when VPWR reaches 20V, and disabled when VPWR is decreased to 17V,  
R1 calculates to 150 k, and R2 calculates to 10 k. The voltage at UVLO should not exceed 6V at any time.  
V
PWR  
LM5032  
20 PA  
R1  
R2  
UVLO  
Enable V  
Regulator  
CC  
and Output Drivers  
1.25V  
Max. Duty  
Cycle Limiter  
Figure 22. UVLO Circuit  
The LM5032 can be remotely shutdown by taking the UVLO pin below 1.25V with an external open collector or  
open drain device, as shown in Figure 23. The outputs, and the VCC regulator, are disabled, and the LM5032  
enters a low power mode. To shut down one regulator without affecting the other, see the Soft-start section.  
V
PWR  
LM5032  
20 PA  
R1  
R2  
UVLO  
Shutdown  
Control  
1.25V  
Max. Duty  
Cycle Limiter  
Figure 23. Shutdown Control  
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Application Information (continued)  
8.1.4 VCC  
The capacitor at VCC provides not only regulator noise filtering and stability, but also prevents VCC from  
dropping to the lower under-voltage threshold level (UVT = 6.2V) when the output drivers source current surges  
to the external MOSFET gates. Additionally, the capacitor provides a necessary time delay during startup. The  
time delay allows the internal circuitry of the LM5032 and associated external circuitry to stabilize before VCC  
reaches the upper UVT threshold level (7.6V), at which time the outputs are enabled and the soft-start sequence  
begins. VCC is nominally regulated at 7.7V. The delay to the UVT level (Figure 1) is calculated from the  
following:  
C1 x 7.6V  
ICC(Lim)  
tVCC  
=
(5)  
where C1 is the capacitor at VCC and ICC(Lim) is the VCC regulator’s current limit. If the capacitor is 0.1 µF, the  
nominal ICC(Lim) of 22 mA provides a delay of approximately 35 µs. The capacitor value should range between 0.1  
µF and 25 µF. Experimentation with the final design may be necessary to determine the optimum value for the  
VCC capacitor.  
The average VCC regulator current required to drive the external MOSFETs is a function of the MOSFET gate  
capacitance and the switching frequency (see Figure 4). To ensure VCC does not droop below the lower UVT  
threshold, an external supply should be diode connected to VCC to provide the required current, as shown in  
Figure 24. The applied VCC voltage must be between 8V and 15V. Providing the VCC voltage higher than the  
7.7V regulation level with an external supply shuts off the internal regulator, reducing power dissipation within the  
IC. Internally there is a diode from the VCC regulator output to VIN. Typically the applied voltage is derived from  
an auxiliary winding on the power transformer, or on the output inductor.  
V
PWR  
VIN  
VCC  
8V - 15V (from  
external source)  
LM5032  
C1  
GND1  
GND2  
Figure 24. External Power to VCC  
8.1.5 Oscillator, Sync Input  
The oscillator frequency is generally selected in conjunction with the system magnetic components, and any  
other aspects of the system which may be affected by the frequency. The RT resistor at the RT/SYNC pin sets  
the frequency according to Equation 1. Each output (OUT1 and OUT2) switches at one-half the oscillator  
frequency. If the required frequency tolerance is critical in a particular application, the tolerance of the external  
resistor and the frequency tolerance specified in the Electrical Characteristics table must be considered when  
selecting the RT resistor.  
If the LM5032 is to be synchronized to an external clock, that signal must be coupled into the RT/SYNC pin  
through a 100 pF capacitor. The external synchronizing frequency must be at least 4% higher than the free  
running frequency set by the RT resistor and no higher than twice the free running frequency. The RT/SYNC pin  
voltage is nominally regulated at 2.0V and the external pulse amplitude should lift the pin to between 3.8V and  
5.0V on the low-to-high transition. The synchronization pulse width should be between 15 and 150 ns. The RT  
resistor is always required, whether the oscillator is free running or externally synchronized.  
8.1.6 Voltage Feedback, COMP1, COMP2  
Each COMP pin is designed to accept a voltage feedback signal from the respective regulated output via an  
error amplifier and (typically) an opto-coupler. A typical configuration is shown in Figure 15. VOUT is compared to  
a reference by the error amplifier which has an appropriate frequency compensation network. The amplifier’s  
output drives the opto-coupler, which in turn drives the COMP pin.  
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Application Information (continued)  
When the LM5032’s two controller channels are configured to provide a single high current output, COMP1 and  
COMP2 are typically connected together, and to the feedback signal from the optocoupler.  
8.1.7 Current Sense, CS1, CS2  
Each CS pin receives an input signal representative of its transformer’s primary current, either from a current  
sense transformer or from a resistor in series with the source of the primary switch, as shown in Figure 25 and  
Figure 26. In both cases the sensed current creates a ramping voltage across R1, and the RF/CF filter  
suppresses noise and transients. R1, RF and CF should be as physically close to the LM5032 as possible, and  
the ground connection from the current sense transformer, or R1, should be a dedicated track to the appropriate  
GND pin. The current sense components must provide >0.5V at the CS pin when an over-current condition  
exists.  
Power  
Transformer  
Current  
Sense  
V
PWR  
VIN  
CS1  
R
F
C
LM5032  
R1  
F
GND1  
Q1  
OUT1  
Figure 25. Current Sense Using a Current Sense Transformer  
Power  
Transformer  
V
PWR  
VIN  
Q1  
OUT1  
R
F
LM5032  
CS1  
C
R1  
F
GND1  
Figure 26. Current Sense Using a Source Sense Resistor (R1)  
8.1.8 Hiccup Mode Current Limit Restart  
This circuit’s operation is described in the Functional Description. Also see Figure 16 and Figure 17. In the case  
of continuous current limit detection at both CS pins, the time required to reach the 2.55V RES pin threshold is:  
CRES x 2.55V  
t1 =  
= 1.275 x 105 x CRES  
20 PA  
(6)  
For example, if CRES = 0.1 µF the time t1 in Figure 18 is approximately 12.75 ms.  
In the case of continuous current limit detection at one CS pin only, the time to reach the 2.55V threshold is  
increased by a factor of four, or:  
t1 = 5.1 x 105 x CRES  
(7)  
The time t2 in Figure 17 is set by the capacitor at each SS pin and the internal 1 µA current source, and is equal  
to:  
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Application Information (continued)  
CSS x 1.5V  
t2 =  
= 1.5 x 106 x CSS  
1 PA  
(8)  
(9)  
If CSS = 0.1 µF t2 is 150 ms. Time t3 is set by the internal 50 µA current source, and is equal to:  
CSS x 3.5V  
= 7 x 104 x CSS  
t3 =  
50 PA  
The time t2 provides a periodic dwell time for the converter in the event of a sustained overload or short circuit.  
This results in lower average input current and lower power dissipated within the circuit components. It is  
recommended that the ratio of t2/(t1 + t3) be in the range of 5 to 10 to make good use of this feature.  
If the application requires no delay from the first detection of a current limit condition, so that t1 is effectively  
zero, the RES pin can be left open (no external capacitor). If it is desired to disable the hiccup mode current limit  
operation then the RES pin should be connected to ground.  
8.1.9 Soft-Start  
The capacitors at SS1 and SS2 determine the time required for each regulator’s output duty cycle to increase  
from zero to its final value for regulation. The minimum acceptable time is dependent on the output capacitance  
and the response of each feedback loop to the COMP pin. If the Soft-start time is too quick, the output could  
significantly overshoot its intended voltage before the feedback loop has a chance to regulate the PWM  
controller.  
After power is applied and VCC has passed its upper UVT threshold (7.6V), the voltage at each SS pin ramps up  
as its external capacitor is charged up by an internal 50 µA current source (see Figure 1). The voltage at the  
COMP pins follow the SS pins. When both have reached 1.5V, PWM pulses appear at the driver outputs with  
very low duty cycle. The voltage at each SS pin continues to increase to 5.0V. The voltage at each COMP pin,  
and the PWM duty cycle, increase to the value required for regulation as determined by its feedback loop. The  
time t1 in Figure 1 is calculated from:  
CSS x 1.5V  
= 3 x 104 x CSS  
t1 =  
50 PA  
(10)  
With a 0.1 µF capacitor at SS, t1 is 3 ms.  
If the Hiccup Mode Current Limit Restart circuit activates due to repeated current limit detections at CS1 and/or  
CS2, both SS1 and SS2 are internally grounded (see the section on Hiccup Mode Current Limit Restart). After a  
short propagation delay, the SS pins are released and the external SS pin capacitors are charged by internal 1  
µA current sources. The slow charge rate provides a rest or dwell time for the converter power stage (t2 in  
Figure 17), reducing the average input current and component temperature rise while in an overload condition.  
When the voltage at the SS and COMP pins reach 1.5V, the first pulse out of either PWM comparator switches  
the internal SS pin current sources to 50 µA. The voltages at the SS and COMP pins then increase more quickly,  
increasing the duty cycle at the output drivers. The rest time t2 is the time required for SS to reach 1.5V:  
CSS x 1.5V  
t2 =  
= 1.5 x 106 x CSS  
1 PA  
(11)  
With a 0.1 µF capacitor at SS, t2 is 150 ms.  
Experimentation with the startup sequence and over-current restart condition is usually necessary to determine  
the appropriate value for the SS capacitors.  
To shutdown one regulator without affecting the other, ground the appropriate SS pin with an open collector or  
open drain device as shown in Figure 27. The SS pin forces the COMP pin to ground which reduces the PWM  
duty cycle to zero for that regulator. Releasing the SS pin allows normal operation to resume.  
When the LM5032’s two controller channels are configured to provide a single high current output, SS1 and SS2  
are typically connected together, requiring a single capacitor for the two pins.  
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Application Information (continued)  
To Output  
Drivers  
LM5032  
COMP1  
PWM  
Controller #1  
Opto-  
Coupler  
PWM  
Controller #2  
COMP2  
SS2  
Opto-  
Coupler  
SS1  
Softstart  
#2  
Softstart  
#1  
Shutdown  
Control  
C
C
SS2  
SS1  
Figure 27. Shutting Down One Regulator Channel  
8.1.10 Line Voltage Dependent Maximum Duty Cycle  
As VPWR increases and the voltage at UVLO follows, the maximum allowed duty cycle decreases according to  
the graph of Figure 9. Using values from the example above (R1 = 150 k, R2 = 10 kin Figure 22), the  
maximum duty cycle varies as shown in Figure 10. If it is desired to increase the slope of the ramp in Figure 10,  
Figure 28 shows a suggested configuration. After the LM5032 is enabled, Z1 clamps the voltage across R1B,  
and UVLO increases with VPWR at a rate determined by the ratio R2/(R1A + R2).  
V
PWR  
R1A  
LM5032  
20 PA  
R1B  
Z1  
UVLO  
1.25V  
R2  
Max. Duty  
Cycle Limiter  
Figure 28. Altering the Slope of Duty Cycle vs. VPWR  
8.1.11 User Defined Max Duty Cycle  
The maximum allowed duty cycle at OUT1 and OUT2 can be set with a resistor from DCL to GND1. See  
Figure 8 and Equation 2. The default maximum duty cycle (80%) determined by the internal clock signals can be  
selected by setting RDCL = RT. The oscillator frequency setting resistor (RT) must be determined before RDCL is  
selected. The DCL pin should not be left open.  
8.2 Typical Application  
Figure 29 shows an example of an LM5032-controlled 200-W interleaved regulator which provides a single  
regulated 48-V output. The interleaving of two power stages to a single output reduces the ripple voltage across  
both input and output capacitors, and improves the power stage efficiency compared to a single-stage design.  
Since the two interleaved control blocks are used to regulate a single combined output, the two soft-start pins  
SS1 and SS2 are connected to a single soft-start capacitor, and the two COMP1 and COMP2 pins are  
connected together to a single error amplifier.  
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Typical Application (continued)  
Figure 29. Evaluation Module Schematic  
8.2.1 Design Requirements  
DESIGN PARAMETERS  
Input voltage range, VIN  
Output voltage, VOUT  
Output current, IOUT  
VALUE  
18 V to 45 V  
48 V  
4 A  
Output ripple voltage, VRIPPLE(OUT)  
< 2% (960 mVpp)  
Switching frequency, FSW (per  
phase)  
123 kHz  
8.2.2 Detailed Design Procedure  
8.2.2.1 Oscillator Frequency and Maximum Duty Cycle  
The LM5032 oscillator frequency should be set at twice the target switching frequency of each interleaved power  
stage, for example, Fosc = 2 x Fsw.  
From Equation 1, the required value of resistor on the RT pin (R9 in Figure 29) is calculated as follows:  
17100  
17100  
RT  
=
- 0.001´(F - 400) =  
- 0.001´(246 - 400) = 69.67k W  
osc  
F
246  
osc  
(12)  
The nearest E96 value of 69.8 kΩ is used.  
The maximum duty cycle is set to 80% (see the Output Duty Cycle section) by choosing the same value resistor  
on the DCL pin, so R30 is also set to 69.8 kΩ.  
8.2.2.2 Power Stage Design  
8.2.2.2.1 Boost Inductor Selection  
Maximum and minimum operating duty cycles are calculated at maximum and minimum input voltage, where Vd  
is the boost diode forward voltage drop, and Vsw(on) is the voltage drop across the boost MOSFET plus current  
sense element:  
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VOUT + Vd - V  
48 + 0.7 -18  
IN(MIN)  
Dmax  
=
=
VOUT + Vd - Vsw(on) 48 + 0.7 - 0.5  
VOUT + Vd - V  
= 63.7%  
= 7.7%  
(13)  
(14)  
48 + 0.7 - 45  
IN(max)  
=
Dmin  
=
VOUT + Vd - Vsw(on) 48 + 0.7 - 0.5  
The highest average inductor current in each phase is calculated at highest load and minimum input voltage,  
where each phase is assumed to carry 50% of the total load current:  
50%´Iout  
0.5´ 4  
=
=
= 5.51A  
L(avg)  
1- Dmax  
1- 0.637  
(15)  
(16)  
Allowing the peak-to-peak inductor current ripple to be 100% of the average:  
DIL(pk-pk) = IL(avg) = 5.51A  
And the peak inductor current IL(peak) will be:  
DIL(pk-pk)  
IL(peak) = IL(avg)  
+
= 8.26A  
2
(17)  
Knowing the switching frequency, maximum duty cycle and target peak-peak ripple current, the required  
inductance can be calculated:  
(V  
- VSW(on) ´Dmax  
(18 - 0.5)´ 0.637  
IN(min)  
Lmin  
=
=
= 16.4mH  
fSW ´ DIL(pk-pk)  
123kHz ´ 5.51  
(18)  
Off-the-shelf available inductors of 15 µH were used, resulting in slightly higher peak-peak inductor ripple current,  
and slightly higher inductor peak current.  
8.2.2.2.2 Output Capacitor Selection  
The output ripple across the boost output capacitor can be approximated from the following equation, where  
COUT is the value of output capacitance, and ESR is the equivalent-series-resistance of the output capacitance.  
For this design, the chosen electrolytic output capacitors are 150 μF with 160-mΩ ESR, so the net capacitance is  
300 μF and net ESR is 80 mΩ.  
I
´(1- Dmin )  
é OUT(max)  
ù
ú
û
é 4´(1- 0.077) ù  
é
ù
=
DVOUT  
=
+ IL(peak) ´ESR  
+ 8.26´0.08 = 711mV  
ú
[
]
ê
ê
ë
û
2´ fSW ´ COUT  
2´123k ´300m  
û
ë
ë
(19)  
This meets the target 2% specification. However, the extra ceramic output capacitors will also absorb a  
significant percentage of the switching frequency ripple, so the resulting output peak-to-peak ripple voltage  
should be lower than the value calculated above, and should be comfortably less than the 2% specification.  
8.2.2.2.3 Boost MOSFET Selection  
The boost MOSFET should be rated for at least the rated output voltage plus some margin for voltage ringing. A  
60-V device was selected. Since the boost inductor value was chosen to achieve peak-to-peak ripple current  
equal to 100% of the average current, the RMS MOSFET current at maximum load and minimum Vin is:  
Dmax  
0.637  
2
2
DIL(pk-pk) + 3´Ipeak - 3´Ipeak ´ DIL(pk-pk)  
ISW(rms)  
=
´
=
´
5.512 + 3´ 8.262 - 3´8.26´5.51 = 4.57A  
3
3
(20)  
The chosen 60-V rated MOSFET SUD50N06-9L has 9.3-mΩ Rds(on), resulting in approximately 200-mW  
conduction loss.  
8.2.2.2.4 Boost Diode Selection  
The boost diode must have a reverse voltage rating of at least VOUT, plus some margin for ringing. Thus a 60-V  
rated part was selected. Since fast reverse recovery is important, a Schottky device can be used at this voltage  
rating. A common-cathode dual-diode MBR1560 was selected, with each diode connected to one or other of the  
interleaved phases.  
8.2.2.3 UVLO Setting  
To ensure start-up below the required minimum system input voltage of 18 V, the UVLO divider resistors R6 and  
R8 are set to 17.4 kΩ and 2 kΩ, respectively. This sets the input UVLO turn-on level to:  
R6 + R8  
17.4 + 2  
V
=
´ VUVLO  
=
´1.25 = 12.125V  
in(on)  
R8  
2
(21)  
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This gives plenty margin to the required 16-V minimum. Resistor R7 in series with the UVLO pin increases the  
effective UVLO hysteresis.  
8.2.2.4 VIN, VCC, Startup  
To reduce the power dissipation in the internal startup regulator on the VIN pin, a separate external switching  
regulator is used. This consists of U2 (LM5009) plus associated circuitry C5, C6, R1, R2, C7, D1, L1, R3 and R4.  
This buck regulator is designed to generate a 10-V regulated supply voltage for the VCC of U1 LM5032. See the  
LM5009 device datasheet, SNVS402, for detailed design information.  
Since the LM5032 internal VIN regulator is not used in this design, the LM5032 VIN and VCC pins are shorted  
together.  
8.2.2.5 Soft-Start and Overload  
Since the two soft-start pins SS1 and SS2 are connected to a single soft-start capacitor, C12, the combined  
charging current of both soft-start pins charges the single soft-start capacitor. The soft-start delay to  
commencement of first PWM switching can be calculated from:  
1.5V ´CSS  
1.5´ 0.1mF  
tss _ delay  
=
=
= 1.5ms  
100mA  
100mA  
(22)  
Thereafter, the soft-start ramp time will depend on the power stage design and the operating conditions (input  
voltage and output load).  
8.2.2.6 Current Sense  
In order to improve the efficiency, a lower value current sense shunt resistance is used. To enable this lower  
value, the normal operating range of the CS1/CS2 pins is reduced by adding an external DC offset to the  
CS1/CS2 pins, as shown in Figure 30.  
U3 VREF  
2.0V  
R23  
10k  
Q1  
U1  
1k  
CS1  
R10  
R12-R16  
0.022  
Figure 30. Current Sense DC Offset Circuit  
This circuit uses the 2.048-V reference U3 to add a typical offset of 185 mV to both current-sense pins. This  
reduces the active range of the internal cycle-by-cycle current-limit comparator to 315 mV, allowing the current-  
sense shunt to be decreased to 66% of the value that would be otherwise required.  
From the power stage design calculations, the peak inductor current in each power stage was approximately 9 A  
at max load and minimum Vin. Allowing for tolerances, and providing some margin for output overload, the  
current-sense shunt resistors are chosen for a peak current limit of approximately 15 A:  
(0.5 - 0.185)V  
R12 / R13 =  
= 21mW  
15A  
(23)  
A standard value of 20 mΩ was used.  
8.2.3 Application Curves  
Figure 31 shows the measured efficiency as a function of load current and input voltage.  
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Figure 32 illustrates the switching nodes of the two interleaved phases, and the resulting output ripple at twice  
the switching frequency. This was measured at Vin of 24 V, where duty cycle is approx. 50% and maximum  
ripple-cancellation occurs.  
Figure 31. Efficiency vs. Load and Vin  
Figure 32. Output Ripple at 24-V Vin  
9 Power Supply Recommendations  
The VCC pin requires a local decoupling capacitor to ground for stability of the internal regulator from the VIN  
pin. This decoupling capacitor also provides the current pulses to drive the gates of the external MOSFETs  
through the driver output pins. The decoupling capacitor should be placed close to the VCC and GND1/GNS2  
pins, and should be tracked directly to the pins.  
The two ground pins (GND1 and GND2) must be connected together with a short direct connection.  
10 Layout  
10.1 Layout Guidelines  
The LM5032 Current Sense and PWM comparators are very fast, and respond to short duration noise pulses.  
The components at the CS, COMP, SS, DCL, UVLO, and the RT/SYNC pins should be as physically close as  
possible to the IC, thereby minimizing noise pickup in the PC board tracks.  
Layout considerations are critical for the current sense filter. If current sense transformers are used, both leads of  
each transformer secondary should be routed to the sense filter components and to the IC pins. The ground side  
of each transformer should be connected via a dedicated PC board track to its appropriate GND pin, rather than  
through the ground plane.  
If the current sense circuits employ sense resistors in the drive transistor sources, low inductance resistors  
should be used. In this case, all the noise sensitive low current ground tracks should be connected in common  
near the IC, and then a single connection made to the power ground (sense resistor ground point). The outputs  
of the LM5032 should have short direct paths to the power MOSFETs in order to minimize inductance in the PC  
board traces.  
The two ground pins (GND1, GND2) must be connected together with a short direct connection to avoid jitter due  
to relative ground bounce in the operation of the two regulators.  
If the internal dissipation of the LM5032 produces high junction temperatures during normal operation, the use of  
wide PC board traces can help conduct heat away from the IC. Judicious positioning of the PC board within the  
end product, along with use of any available air flow (forced or natural convection) can help reduce the junction  
temperatures.  
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10.2 Layout Example  
From EA2  
From CS2  
RT/SYNC  
From VIN  
VIN  
From EA1  
From CS1  
COMP1  
DCL  
COMP2  
CS2  
CS1  
SS1  
LM5032  
SS2  
UVLO  
VCC  
RES  
OUT2  
GND2  
To GD2  
To GD1  
OUT1  
GND1  
Top-side copper  
Bottom-side copper  
Figure 33. Layout Example  
11 Device and Documentation Support  
11.1 Trademarks  
All trademarks are the property of their respective owners.  
11.2 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
11.3 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
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PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM5032MTC/NOPB  
LM5032MTCX/NOPB  
ACTIVE  
TSSOP  
TSSOP  
PW  
16  
16  
92  
RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
LM5032  
MTC  
ACTIVE  
PW  
2500 RoHS & Green  
SN  
LM5032  
MTC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
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Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
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5-Jan-2022  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM5032MTCX/NOPB  
TSSOP  
PW  
16  
2500  
330.0  
12.4  
6.95  
5.6  
1.6  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP PW 16  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
LM5032MTCX/NOPB  
2500  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
TUBE  
*All dimensions are nominal  
Device  
Package Name Package Type  
PW TSSOP  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
LM5032MTC/NOPB  
16  
92  
495  
8
2514.6  
4.06  
Pack Materials-Page 3  
PACKAGE OUTLINE  
PW0016A  
TSSOP - 1.2 mm max height  
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE  
SEATING  
PLANE  
C
6.6  
6.2  
TYP  
A
0.1 C  
PIN 1 INDEX AREA  
14X 0.65  
16  
1
2X  
5.1  
4.9  
4.55  
NOTE 3  
8
9
0.30  
16X  
4.5  
4.3  
NOTE 4  
1.2 MAX  
0.19  
B
0.1  
C A B  
(0.15) TYP  
SEE DETAIL A  
0.25  
GAGE PLANE  
0.15  
0.05  
0.75  
0.50  
A
20  
0 -8  
DETAIL A  
TYPICAL  
4220204/A 02/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed 0.15 mm per side.  
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.  
5. Reference JEDEC registration MO-153.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
PW0016A  
TSSOP - 1.2 mm max height  
SMALL OUTLINE PACKAGE  
SYMM  
16X (1.5)  
(R0.05) TYP  
16  
1
16X (0.45)  
SYMM  
14X (0.65)  
8
9
(5.8)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 10X  
METAL UNDER  
SOLDER MASK  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL  
EXPOSED METAL  
EXPOSED METAL  
0.05 MAX  
ALL AROUND  
0.05 MIN  
ALL AROUND  
NON-SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
15.000  
(PREFERRED)  
SOLDER MASK DETAILS  
4220204/A 02/2017  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
PW0016A  
TSSOP - 1.2 mm max height  
SMALL OUTLINE PACKAGE  
16X (1.5)  
SYMM  
(R0.05) TYP  
16  
1
16X (0.45)  
SYMM  
14X (0.65)  
8
9
(5.8)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE: 10X  
4220204/A 02/2017  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
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