LM60BIM3 [TI]
2.7V, SOT-23 or TO-92 Temperature Sensor; 2.7V ， SOT- 23或TO- 92温度传感器
| 型号： | LM60BIM3 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2.7V, SOT-23 or TO-92 Temperature Sensor |
| 文件： | 总16页 (文件大小：1086K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
LM60/LM60-Q1 2.7V, SOT-23 or TO-92 Temperature Sensor
Check for Samples: LM60/LM60-Q1
1
FEATURES
DESCRIPTION
The LM60/LM60-Q1 is a precision integrated-circuit
temperature sensor that can sense a −40°C to
+125°C temperature range while operating from a
single +2.7V supply. The LM60/LM60-Q1's output
voltage is linearly proportional to Celsius (Centigrade)
temperature (+6.25 mV/°C) and has a DC offset of
+424 mV. The offset allows reading negative
temperatures without the need for a negative supply.
The nominal output voltage of the LM60/LM60-Q1
ranges from +174 mV to +1205 mV for a −40°C to
+125°C temperature range. The LM60/LM60-Q1 is
calibrated to provide accuracies of ±2.0°C at room
temperature and ±3°C over the full −25°C to +125°C
temperature range.
•
•
•
•
•
Calibrated linear scale factor of +6.25 mV/°C
Rated for full −40°C to +125°C range
Suitable for remote applications
Available in SOT-23 and TO-92 packages
LM60Q is AEC-Q100 Grade 1 qualified and is
manufactured on an Automotive Grade flow.
APPLICATIONS
•
•
•
•
•
•
•
Automotive
Cell Phones & Computers
Power Supply Modules
Battery Management
FAX Machines & Printers
HVAC & Disk Drives
Appliances
The LM60/LM60-Q1's linear output, +424 mV offset,
and factory calibration simplify external circuitry
required in a single supply environment where
reading negative temperatures is required. Because
the LM60/LM60-Q1's quiescent current is less than
110 μA, self-heating is limited to a very low 0.1°C in
still air in the SOT-23 package. Shutdown capability
for the LM60/LM60-Q1 is intrinsic because its
inherent low power consumption allows it to be
powered directly from the output of many logic gates.
KEY SPECIFICATIONS
•
•
•
•
•
•
•
•
Accuracy at 25°C: ±2.0°C and ±3.0°C (max)
Accuracy for −40°C to +125°C: ±4.0°C (max)
Accuracy for −25°C to +125°C: ±3.0°C (max)
Temperature Slope: +6.25mV/°C
TYPICAL APPLICATION
Power Supply Voltage Range: +2.7V to +10V
Current Drain at 25°C: 110μA (max)
Nonlinearity: ±0.8°C (max)
Output Impedance: 800Ω (max)
LM60/LM60-Q1
CONNECTION DIAGRAMS
SOT-23 (TOP VIEW)
SVA-1268102
VO = (+6.25 mV/°C × T°C) + 424 mV
Temperature (T)
+125°C
+100°C
+25°C
Typical VO
+1205 mV
+1049 mV
+580 mV
+424 mV
+268 mV
+174 mV
SVA-1268101
TO-92 (BOTTOM VIEW)
0°C
–25°C
–40°C
Figure 1. Full-Range Centigrade Temperature Sensor
(−40°C to 125°C) Operating from a Single Li-Ion
Battery Cell
SVA-1268123
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2012, Texas Instruments Incorporated
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
ACCURACY OVER SPECIFIED
TEMPERATURE RANGE
SPECIFIED
TEMPERATURE RANGE
ORDER NUMBER
DEVICE TOP MARK
LM60BIM3
LM60BIM3X
LM60CIM3
LM60CIM3X
LM60QIM3
LM60QIM3X
LM60BIZ
T6B
T6B
±3
±4
±4
–25°C ≤ TA ≤ +125°C
–40°C ≤ TA ≤ +125°C
–40°C ≤ TA ≤ +125°C
T6C
T6C
L60Q
L60Q
LM60BIZ
LM60CIZ
±3
±4
–25°C ≤ TA ≤ +125°C
–40°C ≤ TA ≤ +125°C
LM60CIZ
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
V
Supply voltage
Output voltage
Output current
+12 to −0.2
(+VS + 0.6) to −0.6
V
10
5
mA
mA
V
(2)
Input Current at any pin
Human Body Model
2500
250
ESD Susceptibility(3)
SOT-23
TO-92
V
Machine Model
200
V
Storage temperature
−65 to +150
125
°C
°C
Maximum junction temperature (TJMAX
)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
RECOMMENDED OPERATING CONDITIONS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TMIN ≤ TA ≤ TMAX
Specified Temperature Range:
Supply Voltage Range (+VS)
LM60B
–25 ≤ TA ≤ +125
°C
°C
LM60C/LM60-Q1
–40 ≤ TA ≤ +125
2.7
10
450
180
V
(2)
Thermal Resistance, θJA
SOT-23
TO-92
°C/W
°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
2
Submit Documentation Feedback
Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, these specifications apply for +VS = +3.0 VDC and ILOAD = 1 μA. Boldface limits apply for TA = TJ =
TMIN to TMAX; all other limits TA = TJ = 25°C.
LM60B
Limits(2)
±2.0
LM60C/LM60-Q1
Limits(2)
±3.0
PARAMETER
CONDITIONS
TYPICAL(1)
UNITS (Limit)
°C (max)
°C (max)
mV
Accuracy(3)
±3.0
±4.0
Output Voltage at 0°C
Nonlinearity(4)
+424
±0.6
6.06
6.44
800
±0.3
±2.3
110
125
±0.8
6
°C (max)
mV/°C (min)
mV/°C (max)
Ω (max)
+6.25
Sensor Gain (Average Slope)
Output Impedance
6.5
800
±0.3
±2.3
110
125
+3.0 V ≤ +VS ≤ +10 V
+2.7 V ≤ +VS ≤ +3.3 V
+2.7 V ≤ +VS ≤ +10 V
mV/V (max)
mV (max)
μA (max)
μA (max)
μA (max)
μA/°C
Line Regulation(5)
82
Quiescent Current
Change of Quiescent Current
+2.7 V ≤ +VS ≤ +10 V
±5.0
0.2
Temperature Coefficient of Quiescent Current
TJ = TMAX = +125°C
for 1000 hours
Long Term Stability(6)
±0.2
°C
(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are specified to National's AOQL (Average Outgoing Quality Level).
(3) Accuracy is defined as the error between the output voltage and +6.25 mV/°C times the device's case temperature plus 424 mV, at
specified conditions of voltage, current, and temperature (expressed in °C).
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature
cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;
allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after
1000 hours will not continue at the first 1000 hour rate.
Copyright © 2004–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM60/LM60-Q1
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS
To generate these curves the LM60/LM60-Q1 was mounted to a printed circuit board as shown in Figure 13.
Thermal Resistance Junction to Air
Thermal Time Constant
SVA-1268104
SVA-1268103
Figure 2.
Figure 3.
Thermal Response in Still Air
with Heat Sink
Thermal Response in Stirred
Oil Bath with Heat Sink
SVA-1268106
SVA-1268105
Figure 4.
Figure 5.
Thermal Response in Still Air
without a Heat Sink
Start-Up Voltage vs Temperature
0
SVA-1268107
SVA-1268108
Figure 6.
Figure 7.
Quiescent Current vs Temperature
Accuracy vs Temperature
SVA-1268110
SVA-1268109
Figure 8.
Figure 9.
4
Submit Documentation Feedback
Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS (continued)
To generate these curves the LM60/LM60-Q1 was mounted to a printed circuit board as shown in Figure 13.
Noise Voltage
Supply Voltage vs Supply Current
SVA-1268111
SVA-1268112
Figure 10.
Figure 11.
Start-Up Response
SVA-1268122
Figure 12.
Copyright © 2004–2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM60/LM60-Q1
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
APPLICATION INFORMATION
SVA-1268114
NOTE: 1/2" Square Printed Circuit Board with 2 oz. Copper Foil or Similar.
Figure 13. Printed Circuit Board Used for Heat Sink to Generate All Curves
Mounting
The LM60/LM60-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It
can be glued or cemented to a surface. The temperature that the LM60/LM60-Q1 is sensing will be within about
+0.1°C of the surface temperature that LM60/LM60-Q1's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature of the LM60/LM60-
Q1 die would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM60/LM60-Q1 die is directly attached to the GND pin.
The lands and traces to the LM60/LM60-Q1 will, of course, be part of the printed circuit board, which is the object
whose temperature is being measured. These printed circuit board lands and traces will not cause the
LM60/LM60-Q1's temperature to deviate from the desired temperature.
Alternatively, the LM60/LM60-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a
bath or screwed into a threaded hole in a tank. As with any IC, the LM60/LM60-Q1 and accompanying wiring and
circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may
operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as
Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM60/LM60-Q1 or
its connections.
The thermal resistance junction to ambient (θJA ) is the parameter used to calculate the rise of a device junction
temperature due to the device power dissipation. For the LM60/LM60-Q1 the equation used to calculate the rise
in the die temperature is as follows:
TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL]
where IQ is the quiescent current and IL is the load current on the output.
Table 1 summarizes the rise in die temperature of the LM60/LM60-Q1 without any loading, and the thermal
resistance for different conditions.
6
Submit Documentation Feedback
Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
Table 1. Temperature Rise of LM60/LM60-Q1 Due to Self-Heating and Thermal Resistance (θJA
)
SOT-23(1)
no heat sink
SOT-23(2)
small heat fin
TO-92(1)
no heat fin
TO-92(3)
small heat fin
θJA
(°C/W)
T
J − TA
(°C)
θJA
(°C/W)
TJ − TA
(°C)
θJA
TJ − TA
θJA
TJ − TA
Still air
450
0.17
260
180
0.1
180
90
0.07
0.034
140
70
0.05
0.026
Moving air
0.07
(1) Part soldered to 30 gauge wire.
(2) Heat sink used is 1/2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 13.
(3) Part glued or leads soldered to 1” square of 1/16” printed circuit board with 2 oz. foil or similar.
Capacitive Loads
The LM60/LM60-Q1 handles capacitive loading well. Without any special precautions, the LM60/LM60-Q1 can
drive any capacitive load as shown in Figure 14. Over the specified temperature range the LM60/LM60-Q1 has a
maximum output impedance of 800Ω. In an extremely noisy environment it may be necessary to add some
filtering to minimize noise pickup. It is recommended that 0.1 μF be added from +V S to GND to bypass the
power supply voltage, as shown in Figure 15. In a noisy environment it may be necessary to add a capacitor
from the output to ground. A 1 μF output capacitor with the 800Ω output impedance will form a 199 Hz lowpass
filter. Since the thermal time constant of the LM60/LM60-Q1 is much slower than the 6.3 ms time constant
formed by the RC, the overall response time of the LM60/LM60-Q1 will not be significantly affected. For much
larger capacitors this additional time lag will increase the overall response time of the LM60/LM60-Q1.
LM60/LM60-Q1
LM60/LM60-Q1
SVA-1268115
SVA-1268116
Figure 14. LM60/LM60-Q1 No Decoupling Required
for Capacitive Load
Figure 15. LM60/LM60-Q1 with Filter for Noisy
Environment
SVA-1268117
Figure 16. Simplified Schematic
Copyright © 2004–2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM60/LM60-Q1
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
Applications Circuits
V
TEMP
V+
R3
V
V
T1
R4
T2
R1
V
T
(Low = overtemp alarm)
4.1V
V
OUT
+
V
OUT
U1
LM4040
U3
0.1
F
-
R2
LM7211
(4.1)R2
V
V
=
=
T1
R2 + R1||R3
LM60/LM60-Q1
V+
V
Temp
(4.1)R2||R3
R1 + R2||R3
T2
U2
SVA-1268118
Figure 17. Centigrade Thermostat
LM60/LM60-Q1
SVA-1268119
Figure 18. Conserving Power Dissipation with Shutdown
8
Submit Documentation Feedback
Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
LM60BIM3
ACTIVE
SOT-23
SOT-23
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
-25 to 125 T6B
-25 to 125 T6B
LM60BIM3/NOPB
ACTIVE
DBZ
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM60BIM3X
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
TBD
Call TI
CU SN
Call TI
-25 to 125 T6B
-25 to 125 T6B
LM60BIM3X/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM60BIZ/LFT3
LM60BIZ/NOPB
ACTIVE
ACTIVE
TO-92
TO-92
LP
LP
3
3
2000
1800
TBD
Call TI
SNCU
Call TI
LM60
BIZ
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
-25 to 125 LM60
BIZ
LM60CIM3
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 125 T6C
LM60CIM3/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 125 T6C
LM60CIM3X
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 125 T6C
-40 to 125 T6C
LM60CIM3X/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM60CIZ/NOPB
LM60QIM3/NOPB
LM60QIM3X/NOPB
ACTIVE
ACTIVE
ACTIVE
TO-92
SOT-23
SOT-23
LP
3
3
3
1800
1000
3000
Green (RoHS
& no Sb/Br)
SNCU
CU SN
CU SN
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125 LM60
CIZ
DBZ
DBZ
Green (RoHS
& no Sb/Br)
-40 to 125
Green (RoHS
& no Sb/Br)
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM60, LM60-Q1 :
Catalog: LM60
•
Automotive: LM60-Q1
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM60BIM3
LM60BIM3/NOPB
LM60BIM3X
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
1000
1000
3000
3000
1000
1000
3000
3000
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
LM60BIM3X/NOPB
LM60CIM3
LM60CIM3/NOPB
LM60CIM3X
LM60CIM3X/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM60BIM3
LM60BIM3/NOPB
LM60BIM3X
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
1000
1000
3000
3000
1000
1000
3000
3000
203.0
203.0
206.0
206.0
203.0
203.0
206.0
206.0
190.0
190.0
191.0
191.0
190.0
190.0
191.0
191.0
41.0
41.0
90.0
90.0
41.0
41.0
90.0
90.0
LM60BIM3X/NOPB
LM60CIM3
LM60CIM3/NOPB
LM60CIM3X
LM60CIM3X/NOPB
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
LM60BIM3/NOPB
Analog Temperature Sensor, ANALOG TEMP SENSOR-VOLTAGE, 3Cel, RECTANGULAR, SURFACE MOUNT, PLASTIC, SOT-23, 3 PIN
NSC
LM60BIM3X/NOPB
Analog Temperature Sensor, ANALOG TEMP SENSOR-VOLTAGE, 3Cel, RECTANGULAR, SURFACE MOUNT, PLASTIC, SOT-23, 3 PIN
NSC
LM60BIZ/NOPB
Analog Temperature Sensor, ANALOG TEMP SENSOR-VOLTAGE, 3Cel, ROUND, THROUGH HOLE MOUNT, PLASTIC, TO-92, 3 PIN
NSC
©2020 ICPDF网 联系我们和版权申明