LM63 [TI]

The LM63 is a remote diode temperature sensor with integrated fan control.; 该LM63是一个远程二极管温度传感器,集成风扇控制。
LM63
型号: LM63
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

The LM63 is a remote diode temperature sensor with integrated fan control.
该LM63是一个远程二极管温度传感器,集成风扇控制。

风扇 二极管 传感器 温度传感器
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LM63  
www.ti.com  
SNAS190E SEPTEMBER 2002REVISED MAY 2013  
LM63 ±1°C/±3°C Accurate Remote Diode Digital Temperature Sensor with Integrated Fan  
Control  
Check for Samples: LM63  
1
FEATURES  
DESCRIPTION  
The LM63 is a remote diode temperature sensor with  
integrated fan control. The LM63 accurately  
measures: (1) its own temperature and (2) the  
temperature of a diode-connected transistor, such as  
a 2N3904, or a thermal diode commonly found on  
Computer Processors, Graphics Processor Units  
(GPU) and other ASIC's. The LM63 remote  
temperature sensor's accuracy is factory trimmed for  
the series resistance and 1.0021 non-ideality of the  
Intel 0.13 µm Pentium 4 and Mobile Pentium 4  
Processor-M thermal diode. The LM63 has an offset  
register to correct for errors caused by different non-  
ideality factors of other thermal diodes.  
23  
Accurately Senses Diode-Connected 2N3904  
Transistors or Thermal Diodes On Board Large  
Processors or ASICs  
Accurately Senses its Own Temperature  
Factory Trimmed for Intel® Pentium® 4 and  
Mobile Pentium 4 Processor-M Thermal Diodes  
Integrated PWM Fan Speed Control Output  
Acoustic Fan Noise Reduction With User-  
Programmable 8-Step Lookup Table  
Multi-Function, User-Selectable Pin for Either  
ALERT Output, or Tachometer Input,  
Functions  
The LM63 also features an integrated, pulse-width-  
modulated (PWM), open-drain fan control output. Fan  
speed is a combination of the remote temperature  
reading, the lookup table and the register settings.  
The 8-step Lookup Table enables the user to  
program a non-linear fan speed vs. temperature  
transfer function often used to quiet acoustic fan  
noise.  
Tachometer Input for Measuring Fan RPM  
Smart-Tach Modes for Measuring RPM of Fans  
With Pulse-Width-Modulated Power as Shown  
in Typical Application  
Offset Register can Adjust for a Variety of  
Thermal Diodes  
10 Bit Plus Sign Remote Diode Temperature  
Data Format, With 0.125°C Resolution  
CONNECTION DIAGRAM  
SMBus 2.0 Compatible Interface, Supports  
TIMEOUT  
1
2
3
4
8
7
6
5
SMBCLK  
SMBDAT  
VDD  
LM86-Compatible Pinout  
LM86-Compatible Register Set  
8-Pin SOIC Package  
D+  
D-  
LM63  
ALERT / TACH  
GND  
PWM  
APPLICATIONS  
Figure 1. 8-Pin SOIC (D Package)  
Computer Processor Thermal Management  
(Laptop, Desktop, Workstations, Servers)  
Graphics Processor Thermal Management  
Electronic Test Equipment  
Projectors  
Office Equipment  
Industrial Controls  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
Intel, Pentium are registered trademarks of Intel Corporation.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2002–2013, Texas Instruments Incorporated  
LM63  
SNAS190E SEPTEMBER 2002REVISED MAY 2013  
www.ti.com  
KEY SPECIFICATIONS  
Remote Diode Temp Accuracy (with quantization error)  
Ambient Temp  
30 to 50°C  
30 to 50°C  
0 to 85°C  
Diode Temp  
60 to 100°C  
60 to 100°C  
25 to 125°C  
IPWML Max  
5 mA  
Version  
LM63C  
LM63D  
All  
Max Error  
±1.0°C  
±3.0°C  
±3.0°C  
5 mA  
8 mA  
Local Temp Accuracy (includes quantization error)  
Ambient Temp  
Max Error  
±3.0°C  
25°C to 125°C  
Supply Voltage: 3.0 V to 3.6 V  
Supply Current: 1.3 mA (typ)  
PIN DESCRIPTIONS  
PIN  
NAME  
INPUT/OUTPUT  
FUNCTION AND CONNECTION  
Connect to a low-noise +3.3 ± 0.3 VDC power supply, and bypass to GND with a  
0.1 µF ceramic capacitor in parallel with a 100 pF ceramic capacitor. A bulk  
capacitance of 10 µF needs to be in the vicinity of the LM63's VDD pin.  
1
VDD  
Power Supply Input  
Connect to the anode (positive side) of the remote diode. A 2.2 nF ceramic capacitor  
must be connected between pins 2 and 3.  
2
3
D+  
Analog Input  
Analog Input  
Connect to the cathode (negative side) of the remote diode. A 2.2 nF ceramic capacitor  
must be connected between pins 2 and 3.  
D  
Open-Drain  
Digital Output  
Open-Drain Digital Output. Connect to fan drive circuitry. The power-on default for this  
pin is low (pin 4 pulled to ground).  
4
5
PWM  
GND  
Ground  
This is the analog and digital ground return.  
Depending on how the LM63 is programmed, this pin is either an open-drain ALERT  
output or a tachometer input for measuring fan speed. The power-on default for this pin  
is the ALERT function.  
6
ALERT/TACH  
Digital I/O  
Digital Input/  
Open-Drain Output  
7
8
SMBDAT  
SMBCLK  
This is the bi-directional SMBus data line.  
Digital Input. This is the SMBus clock input.  
Digital Input  
2
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LM63  
www.ti.com  
SNAS190E SEPTEMBER 2002REVISED MAY 2013  
SIMPLIFIED BLOCK DIAGRAM  
Internal Diode  
LM63  
D+  
Diode  
Bias and  
DS ADC  
Control  
D-  
Tachometer  
Detection  
Temp Reading,  
Temp Limit,  
SMBDAT  
2 - Wire  
Serial  
Hysteresis, and  
Temp Sensor  
Filter Registers  
Comparators  
Interface  
SMBCLK  
Tach  
ALERT/Tach  
ALERT  
Status and Status  
Mask Registers  
PWM  
PWM Fan Control  
Registers  
PWM Fan  
Control  
Figure 2.  
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LM63  
SNAS190E SEPTEMBER 2002REVISED MAY 2013  
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TYPICAL APPLICATION  
+3.3 VDC from motherboard  
0.1  
10 mF  
These two capacitors  
are close to Pin 1  
ALERT to system  
shutdown circuitry  
100 pF  
Fan voltage  
+12 or +5 VDC  
DC brushless  
fan module with  
Tachometer  
LM63  
1
8
7
6
5
To SMBus  
interface  
control  
VDD  
SMBCLK  
SMBDAT  
Processor  
Fan V+  
2
1k  
0.2W  
D+  
circuitry  
2.2 nF  
3
13k  
Tach In  
D- ALERT / Tach  
Tach. input  
from Fan  
4
10k  
PWM  
GND  
+3.3 VDC  
Fan V-  
470  
Remote diode-  
connected transistor  
inside of an Intel®  
10  
PWM Output  
MMBT2222A  
Pentium® 4 Processor  
Figure 3.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
4
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LM63  
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SNAS190E SEPTEMBER 2002REVISED MAY 2013  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
Supply Voltage, VDD  
0.3 V to 6.0 V  
0.5 V to 6.0 V  
0.3 V to (VDD + 0. 3 V)  
±1 mA  
Voltage on SMBDAT, SMBCLK, ALERT/Tach, PWM Pins  
Voltage on Other Pins  
Input Current, DPin  
Input Current at All Other Pins(3)  
Package Input Current(3)  
5 mA  
30 mA  
Package Power Dissipation  
See(4)  
SMBDAT, ALERT, PWM pins  
Storage Temperature  
Output Sink Current  
10 mA  
65°C to +150°C  
2000 V  
Human Body Model  
Machine Model  
ESD Susceptibility(5)  
200 V  
Vapor Phase (60 seconds)  
Infrared (15 seconds)  
215°C  
Soldering Information, Lead Temperature  
SOIC-8 Package(6)  
220°C  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure performance limits. For ensured specifications and test conditions, see the Electrical  
Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade  
when the device is not operated under the listed test conditions.  
(2) All voltages are measured with respect to GND, unless otherwise noted.  
(3) When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > V+), the current at that pin should be limited to  
5 mA. Parasitic components and/or ESD protection circuitry for the LM63's pins are shown in Figure 4 and Table 1. The nominal  
breakdown voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins D+ and D. Doing  
so by more than 50 mV may corrupt temperature measurements. An "X" means it exists in the circuit.  
(4) Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil is 168°C/W.  
(5) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. See  
Figure 4 and Table 1 for the ESD Protection Input Structure.  
(6) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.  
V+  
D1  
D3  
D4  
R1  
D6  
I/O  
D2  
ESD  
SNP  
D5  
D7  
Clamp  
GND  
Figure 4. ESD Protection Input Structure  
Table 1. ESD Protection Input Structure  
PIN NAME  
VDD  
PIN #  
D1  
D2  
D3  
D4  
D5  
D6  
R1  
SNP  
ESD CLAMP  
1
2
3
4
6
7
8
X
X
X
X
D+  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D−  
X
PWM  
X
X
X
X
X
X
X
ALERT/Tach  
SMBDAT  
SMBCLK  
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LM63  
SNAS190E SEPTEMBER 2002REVISED MAY 2013  
www.ti.com  
OPERATING RATINGS(1)(2)  
Specified Temperature Range (TMIN TA TMAX  
Remote Diode Temperature Range  
)
LM63CIM, LM63DIM  
0°C TA +85°C  
0°C TA +125°C  
+3.0 V to +3.6 V  
Supply Voltage Range (VDD  
)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure performance limits. For ensured specifications and test conditions, see the Electrical  
Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade  
when the device is not operated under the listed test conditions.  
(2) All voltages are measured with respect to GND, unless otherwise noted.  
DC ELECTRICAL CHARACTERISTICS  
TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICS  
The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50unless  
otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA = +25°C.  
UNITS  
(LIMITS)  
PARAMETER  
CONDITIONS  
VERSION TYPICAL(1) LIMITS(2)  
TD = +60 to +100°C  
TD = Remote Diode  
Junction Temperature  
LM63C  
LM63D  
±1  
°C (max)  
Temperature Error Using the  
Remote Thermal Diode of an Intel  
Pentium 4 or Mobile Pentium 4  
Processor-M with typical non-  
ideality of 1.0021.  
TA = +30 to +50°C  
PWML 5 mA  
I
±3  
°C (max)  
°C (max)  
TA = +0 to +85°C  
PWML 8 mA  
TD = +25 to +125°C  
All  
All  
±3  
±3  
I
Temperature Error Using the Local  
Diode  
TA = +25 to +125°C(3)(4)  
±1  
°C (max)  
11  
0.125  
8
Bits  
°C  
Remote Diode Resolution  
Local Diode Resolution  
All  
All  
Bits  
1
°C  
Conversion Time, All Temperatures Fastest Setting  
All  
All  
31.25  
0.7  
34.4  
ms (max)  
V
DSource Voltage  
315  
110  
20  
µA (max)  
µA (min)  
µA (max)  
µA (min)  
(VD+ VD) = +0.65 V; High Current  
All  
All  
160  
13  
Diode Source Current  
Low Current  
7
(1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical  
design calculations.  
(2) Limits are specified to AOQL (Average Outgoing Quality Level).  
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the  
internal power dissipation of the LM63 and the thermal resistance. For the thermal resistance to be used in the self-heating calculation,  
see the table footnote about Thermal resistance junction-to-ambient.  
(4) Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil is 168°C/W.  
OPERATING ELECTRICAL CHARACTERISTICS  
PARAMETER  
CONDITIONS  
ALERT  
TYPICAL(1)  
LIMITS(2)  
UNITS  
PWM  
5 mA  
ALERT and PWM Output Saturation Voltage  
IOUT  
IOUT  
4 mA  
6 mA  
0.4  
0.55  
2.4  
V (max)  
V (max)  
V (min)  
Power-On-Reset Threshold Voltage  
1.8  
SMBus Inactive, 16 Hz  
Conversion Rate  
1.1  
2.0  
mA (max)  
µA  
(3)  
Supply Current  
STANDBY Mode  
300  
(1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical  
design calculations.  
(2) Limits are specified to AOQL (Average Outgoing Quality Level).  
(3) The supply current will not increase substantially with an SMBus transaction.  
6
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AC ELECTRICAL CHARACTERISTICS  
The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50unless  
otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA= +25°C.  
UNITS  
(LIMIT)  
SYMBOL  
PARAMETER  
CONDITIONS  
TYPICAL(1)  
LIMITS(2)  
TACHOMETER ACCURACY  
Fan Control Accuracy  
±10  
% (max)  
(max)  
kHz  
Fan Full-Scale Count  
65535  
Fan Counter Clock Frequency  
Fan Count Update Frequency  
90  
1.0  
Hz  
FAN PWM OUTPUT  
Frequency Accuracy  
±10  
% (max)  
(1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical  
design calculations.  
(2) Limits are specified to AOQL (Average Outgoing Quality Level).  
DIGITAL ELECTRICAL CHARACTERISTICS  
UNITS  
SYMBOL  
PARAMETER  
CONDITIONS  
TYPICAL(1)  
LIMITS(2)  
(LIMIT)  
V (min)  
V (max)  
µA (max)  
µA (max)  
pF  
VIH  
VIL  
IIH  
Logical High Input Voltage  
Logical Low Input Voltage  
Logical High Input Current  
Logical Low Input Current  
Digital Input Capacitance  
2.1  
0.8  
VIN = VDD  
VIN = GND  
0.005  
0.005  
20  
+10  
10  
IIL  
CIN  
(1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical  
design calculations.  
(2) Limits are specified to AOQL (Average Outgoing Quality Level).  
SMBus LOGICAL ELECTRICAL CHARACTERISTICS  
The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50unless  
otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA = +25°C.  
UNITS  
(LIMIT)  
SYMBOL  
PARAMETER  
CONDITIONS  
TYPICAL(1)  
LIMITS(2)  
SMBDAT OPEN-DRAIN OUTPUT  
VOL  
IOH  
Logic Low Level Output Voltage  
High Level Output Current  
IOL = 4 mA  
VOUT = VDD  
0.4  
10  
V (max)  
0.03  
µA (max)  
SMBDAT, SMBCLK INPUTS  
VIH  
VIL  
Logical High Input Voltage  
2.1  
0.8  
V (min)  
V (max)  
mV  
Logical Low Input Voltage  
VHYST  
Logic Input Hysteresis Voltage  
320  
(1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical  
design calculations.  
(2) Limits are specified to AOQL (Average Outgoing Quality Level).  
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SMBus DIGITAL SWITCHING CHARACTERISTICS  
Unless otherwise noted, these specifications apply for VDD = +3.0 VDC to +3.6 VDC, CL (load capacitance) on output lines =  
80 pF. Boldface limits apply for TA = TJ; TMIN TA TMAX; all other limits TA = TJ = +25°C, unless otherwise noted. The  
switching characteristics of the LM63 fully meet or exceed the published specifications of the SMBus version 2.0. The  
following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM63. They adhere  
to, but are not necessarily the same as the SMBus bus specifications.  
UNITS  
(LIMIT)  
SYMBOL  
PARAMETER  
SMBus Clock Frequency  
CONDITIONS  
LIMITS(1)  
10  
100  
kHz (min)  
kHz (max)  
fSMB  
tLOW  
tHIGH  
SMBus Clock Low Time  
SMBus Clock High Time  
From VIN(0) max to VIN(0) max  
From VIN(1) min to VIN(1) min  
4.7  
µs (min)  
4.0  
50  
µs (min)  
µs (max)  
(2)  
tR  
SMBus Rise Time  
SMBus Fall Time  
Output Fall Time  
See  
1
µs (max)  
µs (max)  
ns (max)  
(3)  
tF  
See  
0.3  
250  
tOF  
CL = 400 pF, IO = 3 mA  
SMBData and SMBCLK Time Low for Reset of  
25  
35  
ms (min)  
ms (max)  
tTIMEOUT  
tSU:DAT  
tHD:DAT  
(4)  
Serial Interface. See  
.
Data In Setup Time to SMBCLK High  
250  
ns (min)  
300  
930  
ns (min)  
ns (max)  
Data Out Hold Time after SMBCLK Low  
Hold Time after (Repeated) Start Condition. After  
this period the first clock is generated.  
tHD:STA  
tSU:STO  
tSU:STA  
tBUF  
4.0  
100  
4.7  
4.7  
µs (min)  
ns (min)  
µs (min)  
µs (min)  
Stop Condition SMBCLK High to SMBDAT Low  
(Stop Condition Setup)  
SMBus Repeated Start-Condition Setup Time,  
SMBCLK High to SMBDAT Low  
SMBus Free Time between Stop and Start  
Conditions  
(1) Limits are specified to AOQL (Average Outgoing Quality Level).  
(2) The output rise time is measured from (VIL max - 0.15 V) to (VIH min + 0.15 V).  
(3) The output fall time is measured from (VIH min + 0.15 V) to (VIL min - 0.15 V).  
(4) Holding the SMBData and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM63’s SMBus state machine,  
therefore setting SMBDAT and SMBCLK pins to a high-impedance state.  
tLOW  
tR  
tF  
VIH  
VIL  
SMBCLK  
SMBDAT  
tHD;STA  
tSU;STA  
tHIGH  
tSU;STO  
tBUF  
tSU;DAT  
tHD;DAT  
VIH  
VIL  
P
S
P
Figure 5. SMBus Timing Diagram for SMBCLK and SMBDAT Signals  
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FUNCTIONAL DESCRIPTION  
The LM63 Remote Diode Temperature Sensor with Integrated Fan Control incorporates a ΔVBE-based  
temperature sensor using a Local or Remote diode and a 10-bit plus sign ΔΣ ADC (Delta-Sigma Analog-to-Digital  
Converter). The pulse-width modulated (PWM) open-drain output, with a pullup resistor, can drive a switching  
transistor to modulate fan speed. When the ALERT/Tach is programmed to the Tach mode the LM63 can  
measure the fan speed on the pulses from the fan’s tachometer output. The LM63 includes a smart-tach  
measurement mode to accommodate the corrupted tachometer pulses when using switching transistor drive.  
When the ALERT/Tach pin is programmed to the ALERT mode the ALERT open-drain output will be pulled low  
when the measured temperature exceeds certain programmed limits when enabled. Details are contained in the  
sections to follow.  
The LM63's two-wire interface is compatible with the SMBus Specification 2.0. For more information the reader is  
directed to www.smbus.org.  
In the LM63 digital comparators are used to compare the measured Local Temperature (LT) to the Local High  
Setpoint user-programmable temperature limit register. The measured Remote Temperature (RT) is digitally  
compared to the Remote High Setpoint (RHS), the Remote Low Setpoint (RLS), and the Remote T_CRIT  
Setpoint (RCS) user-programmable temperature limits. An ALERT output will occur when the measured  
temperature is: (1) higher than either the High Setpoint or the T_CRIT Setpoint, or (2) lower than the Low  
Setpoint. The ALERT Mask register allows the user to prevent the generation of these ALERT outputs.  
The temperature hysteresis is set by the value placed in the Hysteresis Register (TH).  
The LM63 may be placed in a low-power Standby mode by setting the Standby bit found in the Configuration  
Register. In the Standby mode continuous conversions are stopped. In Standby mode the user may choose to  
allow the PWM output signal to continue, or not, by programming the PWM Disable in Standby bit in the  
Configuration Register.  
The Local Temperature reading and setpoint data registers are 8-bits wide. The format of the 11-bit remote  
temperature data is a 16-bit left justified word. Two 8-bit registers, high and low bytes, are provided for each  
setpoint as well as the temperature reading. Two Remote Temperature Offset (RTO) Registers: High Byte and  
Low Byte (RTOHB and RTOLB) may be used to correct the temperature readings by adding or subtracting a  
fixed value based on a different non-ideality factor of the thermal diode if different from the 0.13 micron Intel  
Pentium 4 or Mobile Pentium 4 Processor-M processor’s thermal diode. See the DIODE NON-IDEALITY section.  
CONVERSION SEQUENCE  
The LM63 takes approximately 31.25 ms to convert the Local Temperature (LT), Remote Temperature (RT), and  
to update all of its registers. The Conversion Rate may be modified using the Conversion Rate Register. When  
the conversion rate is modified a delay is inserted between conversions, the actual conversion time remains at  
31.25 ms. Different Conversion Rates will cause the LM63 to draw different amounts of supply current as shown  
in Figure 6.  
2600  
2300  
2000  
1700  
1400  
1100  
800  
500  
200  
0.01  
0.1  
1.0  
10  
100  
CONVERSION RATE (Hz)  
Figure 6. Supply Current vs Conversion Rate  
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THE ALERT/TACH PIN AS ALERT OUTPUT  
The ALERT/Tach pin is a multi-use pin. In this section, we will address the ALERT active-low open-drain output  
function. When the ALERT/Tach Select bit is written as a zero in the Configuration Register the ALERT output is  
selected. Also, when the ALERT Mask bit in the Configuration register is written as zero the ALERT interrupts  
are enabled.  
The LM63's ALERT pin is versatile and can produce three different methods of use to best serve the system  
designer: (1) as a temperature comparator (2) as a temperature-based interrupt flag, and (3) as part of an  
SMBus ALERT System. The three methods of use are further described in the following sections: ALERT  
OUTPUT AS A TEMPERATURE COMPARATOR, ALERT OUTPUT AS AN INTERRUPT, and ALERT OUTPUT  
AS AN SMBus ALERT. The ALERT and interrupt methods are different only in how the user interacts with the  
LM63.  
The remote temperature (RT) reading is associated with a T_CRIT Setpoint Register, and both local and remote  
temperature (LT and RT) readings are associated with a HIGH setpoint register (LHS and RHS). The RT is also  
associated with a LOW setpoint register (RLS). At the end of every temperature reading a digital comparison  
determines whether that reading is above its HIGH or T_CRIT setpoint or below its LOW setpoint. If so, the  
corresponding bit in the ALERT Status Register is set. If the ALERT mask bit is low, any bit set in the ALERT  
Status Register, with the exception of Busy or Open, will cause the ALERT output to be pulled low. Any  
temperature conversion that is out of the limits defined in the temperature setpoint registers will trigger an  
ALERT. Additionally, the ALERT Mask Bit must be cleared to trigger an ALERT in all modes.  
The three different ALERT modes will be discussed in the following sections: ALERT OUTPUT AS A  
TEMPERATURE COMPARATOR, ALERT OUTPUT AS AN INTERRUPT, and ALERT OUTPUT AS AN SMBus  
ALERT.  
ALERT OUTPUT AS A TEMPERATURE COMPARATOR  
When the LM63 is used in a system in which does not require temperature-based interrupts, the ALERT output  
could be used as a temperature comparator. In this mode, once the condition that triggered the ALERT to go low  
is no longer present, the ALERT is negated (Figure 7). For example, if the ALERT output was activated by the  
comparison of LT > LHS, when this condition is no longer true, the ALERT will return HIGH. This mode allows  
operation without software intervention, once all registers are configured during set-up. In order for the ALERT to  
be used as a temperature comparator, the Comparator Mode bit in the Remote Diode Temperature Filter and  
Comparator Mode Register must be asserted. This is not the power-on default state.  
Remote High Limit  
RDTS Measurement  
LM63 ALERT Pin  
Status Register: RTDS High  
Time  
Figure 7. ALERT Output as Temperature Comparator Response Diagram  
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ALERT OUTPUT AS AN INTERRUPT  
The LM63's ALERT output can be implemented as a simple interrupt signal when it is used to trigger an interrupt  
service routine. In such systems it is desirable for the interrupt flag to repeatedly trigger during or before the  
interrupt service routine has been completed. Under this method of operation, during the read of the ALERT  
Status Register the LM63 will set the ALERT Mask bit in the Configuration Register if any bit in the ALERT  
Status Register is set, with the exception of Busy and Open. This prevents further ALERT triggering until the  
master has reset the ALERT Mask bit, at the end of the interrupt service routine. The ALERT Status Register bits  
are cleared only upon a read command from the master (see Figure 8 ) and will be re-asserted at the end of the  
next conversion if the triggering condition(s) persist(s). In order for the ALERT to be used as a dedicated  
interrupt signal, the Comparator Mode bit in the Remote Diode Temperature Filter and Comparator Mode  
Register must be set low. This is the power-on default state. The following sequence describes the response of a  
system that uses the ALERT output pin as an interrupt flag:  
1. Master senses ALERT low.  
2. Master reads the LM63 ALERT Status Register to determine what caused the ALERT.  
3. LM63 clears ALERT Status Register, resets the ALERT HIGH and sets the ALERT Mask bit in the  
Configuration Register.  
4. Master attends to conditions that caused the ALERT to be triggered. The fan is started, setpoint limits are  
adjusted, etc.  
5. Master resets the ALERT Mask bit in the Configuration Register.  
RDTS Measurement  
Remote High Limit  
ALERT mask set in  
LM63  
response to reading of  
ALERT pin  
status register by master  
End of Temperature  
conversion  
Status Register: RTDS High  
Time  
Figure 8. ALERT Output as an Interrupt Temperature Response Diagram  
ALERT OUTPUT AS AN SMBus ALERT  
An SMBus alert line is created when the ALERT output is connected to: (1) one or more ALERT outputs of other  
SMBus compatible devices, and (2) to a master. Under this implementation, the LM63's ALERT should be  
operated using the ARA (Alert Response Address) protocol. The SMBus 2.0 ARA protocol, defined in the SMBus  
specification 2.0, is a procedure designed to assist the master in determining which part generated an interrupt  
and to service that interrupt.  
The SMBus alert line is connected to the open-drain ports of all devices on the bus, thereby AND'ing them  
together. The ARA method allows the SMBus master, with one command, to identify which part is pulling the  
SMBus alert line LOW. It also prevents the part from pulling the line LOW again for the same triggering condition.  
When an ARA command is received by all devices on the bus, the devices pulling the SMBus alert line LOW:  
(1) send their address to the master and (2) release the SMBus alert line after acknowledgement of their  
address.  
The SMBus Specifications 1.1 and 2.0 state that in response to and ARA (Alert Response Address) “after  
acknowledging the slave address the device must disengage its ALERT pulldown”. Furthermore, “if the host still  
sees ALERT low when the message transfer is complete, it knows to read the ARA again.” This SMBus  
“disengaging ALERT requirement prevents locking up the SMBus alert line. Competitive parts may address the  
“disengaging of ALERT” differently than the LM63 or not at all. SMBus systems that implement the ARA protocol  
as suggested for the LM63 will be fully compatible with all competitive parts.  
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The LM63 fulfills “disengaging of ALERT” by setting the ALERT Mask Bit in the Configuration Register after  
sending out its address in response to an ARA and releasing the ALERT output pin. Once the ALERT Mask bit is  
activated, the ALERT output pin will be disabled until enabled by software. In order to enable the ALERT the  
master must read the ALERT Status Register, during the interrupt service routine and then reset the ALERT  
Mask bit in the Configuration Register to 0 at the end of the interrupt service routine.  
The following sequence describes the ARA response protocol.  
1. Master senses SMBus alert line low  
2. Master sends a START followed by the Alert Response Address (ARA) with a Read Command.  
3. Alerting Device(s) send ACK.  
4. Alerting Device(s) send their address. While transmitting their address, alerting devices sense whether their  
address has been transmitted correctly. (The LM63 will reset its ALERT output and set the ALERT Mask bit  
once its complete address has been transmitted successfully.)  
5. Master/slave NoACK  
6. Master sends STOP  
7. Master attends to conditions that caused the ALERT to be triggered. The ALERT Status Register is read and  
fan started, setpoints adjusted, etc.  
8. Master resets the ALERT Mask bit in the Configuration Register.  
The ARA, 000 1100, is a general call address. No device should ever be assigned to this address.  
The ALERT Configuration bit in the Remote Diode Temperature Filter and Comparator Mode Register must be  
set low in order for the LM63 to respond to the ARA command.  
The ALERT output can be disabled by setting the ALERT Mask bit in the Configuration Register. The power-on  
default is to have the ALERT Mask bit and the ALERT Configuration bit low.  
Remote High Limit  
RDTS Measurement  
LM63  
ALERT Pin  
ALERT mask set in  
response to ARA  
from master  
Status Register: Remote High  
Time  
Figure 9. ALERT Output as an SMBus ALERT Temperature Response Diagram  
SMBus INTERFACE  
Since the LM63 operates as a slave on the SMBus the SMBCLK line is an input and the SMBDAT line is bi-  
directional. The LM63 never drives the SMBCLK line and it does not support clock stretching. According to  
SMBus specifications, the LM63 has a 7-bit slave address. All bits, A6 through A0, are internally programmed  
and cannot be changed by software or hardware.  
The complete slave address is:  
A6  
1
A5  
0
A4  
0
A3  
1
A2  
1
A1  
0
A0  
0
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POWER-ON RESET (POR) DEFAULT STATES  
For information on the POR default states, see REGISTER MAP IN FUNCTIONAL ORDER.  
TEMPERATURE DATA FORMAT  
Temperature data can only be read from the Local and Remote Temperature registers. The High, Low and  
T_CRIT setpoint registers are Read/Write.  
Remote temperature data is represented by an 11-bit, two's complement word with a Least Significant Bit (LSB)  
equal to 0.125°C. The data format is a left justified 16-bit word available in two 8-bit registers:  
DIGITAL OUTPUT  
TEMPERATURE  
BINARY  
HEX  
7D00  
1900  
0100  
0020  
0000  
FFE0  
FF00  
E700  
C900  
+125°C  
+25°C  
+1°C  
0111 1101 0000 0000  
0001 1001 0000 0000  
0000 0001 0000 0000  
0000 0000 0010 0000  
0000 0000 0000 0000  
1111 1111 1110 0000  
1111 1111 0000 0000  
1110 0111 0000 0000  
1100 1001 0000 0000  
+0.125°C  
0°C  
0.125°C  
1°C  
25°C  
55°C  
Local Temperature data is represented by an 8-bit, two's complement byte with an LSB equal to 1°C:  
DIGITAL OUTPUT  
TEMPERATURE  
BINARY  
0111 1101  
0001 1001  
0000 0001  
0000 0000  
1111 1111  
1110 0111  
1100 1001  
HEX  
7D  
19  
+125°C  
+25°C  
+1°C  
01  
0°C  
00  
1°C  
FF  
E7  
C9  
25°C  
55°C  
OPEN-DRAIN OUTPUTS  
The SMBDAT, ALERT, and PWM outputs are open-drain outputs and do not have internal pullups. A “High” level  
will not be observed on these pins until pullup current is provided by an internal source, typically through a pullup  
resistor. Choice of resistor value depends on several factors but, in general, the value should be as high as  
possible consistent with reliable operation. This will lower the power dissipation of the LM63 and avoid  
temperature errors caused by self-heating of the device. The maximum value of the pullup resistor to provide the  
2.1 V high level is 88.7 k.  
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DIODE FAULT DETECTION  
The LM63 can detect fault conditions caused by the remote diode. If the D+ pin is detected to be shorted to VDD  
,
or open: (1) the Remote Temperature High Byte (RTHB) register is loaded with 127°C, (2) the Remote  
Temperature Low Byte (RTLB) register is loaded with 0, and (3) the OPEN bit (D2) in the status register is set.  
Therefore, if the Remote T_CRIT setpoint register (RCS): (1) is set to a value less than +127°C and (2) the  
ALERT Mask is disabled, then the ALERT output pin will be pulled low. If the Remote High Setpoint High Byte  
(RHSHB) is set to a value less than +127°C and (2) the ALERT Mask is disabled, then the ALERT will be pulled  
low. The OPEN bit by itself will not trigger an ALERT.  
If the D+ pin is shorted to either ground or D, then the Remote Temperature High Byte (RTHB) register is  
loaded with 128°C (1000 0000) and the OPEN bit in the ALERT Status Register will not be set. A temperature  
reading of 128°C indicates that D+ is shorted to either ground or D-. If the value in the Remote Low Setpoint  
High Byte (RLSHB) Register is more than 128°C and the ALERT Mask is Disabled, ALERT will be pulled low.  
COMMUNICATING WITH THE LM63  
Each data register in the LM63 falls into one of four types of user accessibility:  
1. Read Only  
2. Write Only  
3. Read/Write same address  
4. Read/Write different address  
A Write to the LM63 is comprised of an address byte and a command byte. A write to any register requires one  
data byte.  
Reading the LM63 Registers can take place after the requisite register setup sequence takes place. See  
REQUIRED INITIAL FAN CONTROL REGISTER SEQUENCE.  
The data byte has the Most Significant Bit (MSB) first. At the end of a read, the LM63 can accept either  
Acknowledge or No-Acknowledge from the Master. Note that the No-Acknowledge is typically used as a signal  
for the slave indicating that the Master has read its last byte.  
DIGITAL FILTER  
The LM63 incorporates a user-configured digital filter to suppress erroneous Remote Temperature readings due  
to noise. The filter is accessed in the Remote Diode Temperature Filter and Comparator Mode Register. The  
filter can be set according to Table 2.  
Level 2 is maximum filtering.  
Table 2. Digital Filter Selection Table  
D2  
0
D1  
0
FILTER  
No Filter  
Level 1  
Level 1  
Level 2  
0
1
1
0
1
1
14  
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50  
45  
40  
35  
30  
25  
No Filter  
Filter Level 1  
Filter Level 2  
0
5
10  
15  
20  
25  
NUMBER OF SAMPLES  
Figure 10. Step Response of the Digital Filter  
50  
45  
No Filter  
40  
Filter Level 1  
35  
Filter Level 2  
30  
25  
0
5
10  
15  
20  
25  
NUMBER OF SAMPLES  
Figure 11. Impulse Response of the Digital Filter  
45  
LM63  
43  
41  
39  
37  
35  
33  
31  
29  
27  
25  
with  
Filter Off  
LM63  
with  
Filter On  
0
50  
100  
150  
200  
SAMPLE NUMBER  
Figure 12. Digital Filter Response in an Intel Pentium 4 processor System. The Filter on and off curves  
were purposely offset to better show noise performance.  
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FAULT QUEUE  
The LM63 incorporates a Fault Queue to suppress erroneous ALERT triggering. The Fault Queue prevents false  
triggering by requiring three consecutive out-of-limit HIGH, LOW, or T_CRIT temperature readings. See  
Figure 13. The Fault Queue defaults to OFF upon power-up and may be activated by setting the RDTS Fault  
Queue bit in the Configuration Register to a 1.  
RDTS Measurement  
Status Register: RTDS High  
n
n+1 n+2 n+3 n+4 n+5  
SAMPLE NUMBER  
Figure 13. Fault Queue Temperature Response Diagram  
ONE-SHOT REGISTER  
The One-Shot Register is used to initiate a single conversion and comparison cycle when the device is in  
standby mode, after which the data returns to standby. This is not a data register. A write operation causes the  
one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will always be read  
from this register.  
SERIAL INTERFACE RESET  
In the event that the SMBus Master is reset while the LM63 is transmitting on the SMBDAT line, the LM63 must  
be returned to a known state in the communication protocol. This may be done in one of two ways:  
1. When SMBDAT is Low, the LM63 SMBus state machine resets to the SMBus idle state if either SMBData or  
SMBCLK are held Low for more than 35 ms (tTIMEOUT). All devices are to timeout when either the SMBCLK or  
SMBDAT lines are held Low for 25 ms – 35 ms. Therefore, to insure a timeout of all devices on the bus,  
either the SMBCLK or the SMBData line must be held Low for at least 35 ms.  
2. With both SMBDAT and SMBCLK High, the master can initiate an SMBus start condition with a High to Low  
transition on the SMBDAT line. The LM63 will respond properly to an SMBus start condition at any point  
during the communication. After the start the LM63 will expect an SMBus Address address byte.  
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LM63 REGISTERS  
This section includes the following subsections: REGISTER MAP IN HEXADECIMAL ORDER, which shows a  
summary of all registers and their bit assignments; REGISTER MAP IN FUNCTIONAL ORDER; and REGISTER  
DESCRIPTIONS IN FUNCTIONAL ORDER, which provides a detailed explanation of each register. Do not  
address the unused or manufacturer’s test registers.  
REGISTER MAP IN HEXADECIMAL ORDER  
Table 3 is a Register Map grouped in hexadecimal address order. Some address locations have been left blank  
to maintain compatibility with LM86. Addresses in parenthesis are mirrors of “Same As” address for backwards  
compatibility with some older software. Reading or writing either address will access the same 8-bit register.  
Table 3. Register Map Grouped in Hexadecimal Address Order  
DATA BITS  
REGISTER  
0x[HEX]  
REGISTER  
NAME  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
00  
Local  
LT7  
LT6  
LT5  
LT4  
LT3  
LT2  
LT1  
LT0  
Temperature  
01  
02  
03  
04  
Rmt Temp MSB  
ALERT Status  
Configuration  
RTHB±  
BUSY  
ALTMSK  
0
RTHB14  
LHIGH  
STBY  
0
RTHB13  
RTHB12  
RTHB11  
RLOW  
0
RTHB10  
RDFA  
RTHB9  
RCRIT  
RTHB8  
TACH  
0
PWMDIS  
0
RHIGH  
0
0
ALT/TCH  
CONV2  
TCRITOV  
CONV1  
FLTQUE  
CONV0  
Conversion  
Rate  
CONV3  
05  
Local High  
Setpoint  
LHS7  
LHS6  
LHS5  
LHS4  
LHS3  
LHS2  
LHS1  
LHS0  
06  
07  
[Reserved]  
Not Used  
Rmt High  
Setpoint MSB  
RHSHB15  
RLSHB15  
RHSHB14  
RLSHB14  
RHHBS13  
RLSHB13  
RHSHB12  
RHSHB11  
RHSHB10  
RLSHB10  
RHSHB9  
RLSHB9  
RHSHB8  
RLSHB8  
08  
Rmt Low  
RLSHB12  
RLHBS11  
Setpoint MSB  
(09)  
(0A)  
(0B)  
0C  
Same as 03  
Same as 04  
Same as 05  
[Reserved]  
Not Used  
(0D)  
(0E)  
0F  
Same as 07  
Same as 08  
One Shot  
Write Only. Write command triggers one temperature conversion cycle.  
10  
Rmt Temp LSB  
RTLB7  
RTLB6  
RTLB5  
0
0
0
0
0
11  
Rmt Temp  
Offset MSB  
RTOHB15  
RTOHB14  
RTOHB13  
RTOHB12  
RTOHB11  
RTOHB10  
RTOHB9  
RTOHB8  
12  
13  
14  
Rmt Temp  
Offset LSB  
RTOLB7  
RHSLB7  
RLSLB7  
RTOLB6  
RHSLB6  
RLSLB6  
RTOLB5  
RHSLB5  
RLSLB5  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Rmt High  
Setpoint LSB  
Rmt Low  
Setpoint LSB  
15  
16  
17  
18  
19  
[Reserved]  
ALERT Mask  
[Reserved]  
[Reserved]  
Not Used  
1
ALTMSK6  
RCS6  
1
ALTMSK4  
ALTMSK3  
1
ALTMSK1  
RCS1  
ALTMSK0  
RCS0  
Not Used  
Not Used  
Rmt TCRIT  
Setpoint  
RCS7  
RCS5  
RCS4  
RTH4  
RCS3  
RTH3  
RCS2  
1A–1F  
20  
[Reserved]  
[Reserved]  
Not Used  
Not Used  
21  
Rmt TCRIT  
Hysteresis  
RTH7  
RTH6  
RTH5  
RTH2  
RTH1  
RTH0  
22–2F  
30–3F  
40–45  
46  
[Reserved]  
[Reserved]  
Not Used  
Not Used  
Not Used  
[Reserved]  
Tach Count LSB  
TCLB5  
TCLB4  
TCLB3  
TCLB2  
TCLB1  
TCHB9  
TCLB0  
TCHB8  
TEDGE1  
TCHB7  
TEDGE0  
TCHB6  
47  
Tach Count  
MSB  
TCHB13  
TCHB12  
TCHB11  
TCHB10  
48  
Tach Limit LSB  
TLLB7  
TLLB6  
TLLB5  
TLLB4  
TLLB3  
TLLB2  
Not Used  
Not Used  
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Table 3. Register Map Grouped in Hexadecimal Address Order (continued)  
DATA BITS  
REGISTER  
0x[HEX]  
REGISTER  
NAME  
D7  
D6  
D5  
D4  
D3  
D2  
TLHB10  
0
D1  
D0  
49  
4A  
4B  
Tach Limit MSB  
PWM and RPM  
TLHB15  
TLHB14  
TLHB13  
PWPGM  
SPINUP  
TLHB12  
PWOUT±  
SPNDTY1  
TLHB11  
PWCKSL  
SPNDTY0  
TLHB9  
TLHB8  
0
0
0
0
TACH1  
SPNUPT1  
TACH0  
SPNUPT0  
Fan Spin-Up  
Config  
SPNUPT2  
4C  
4D  
PWM Value  
0
0
0
0
PWVAL5  
0
PWVAL4  
PWMF4  
PWVAL3  
PWMF3  
PWVAL2  
PWMF2  
PWVAL1  
PWMF1  
PWVAL0  
PWMF0  
PWM  
Frequency  
4E  
4F  
[Reserved]  
Not Used  
LOOKH3  
Lookup Table  
Hystersis  
0
0
0
0
0
LOOKH4  
LOOKH2  
LOOKH1  
RDTF0  
LOOKH0  
50–5F  
60–BE  
BF  
Lookup Table  
[Reserved]  
Lookup Table of up to 8 PWM and Temp Pairs in 8-bit Registers  
Not Used  
Rmt Diode  
Temp Filter  
0
0
0
RDTF1  
ALTCOMP  
C0–FD  
FE  
[Reserved]  
Not Used  
Manufacturer’s  
ID  
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
1
FF  
Stepping/Die  
Rev. ID  
18  
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REGISTER MAP IN FUNCTIONAL ORDER  
Table 4 is a Register Map grouped in Functional Order. Some address locations have been left blank to maintain  
compatibility with LM86. Addresses in parenthesis are mirrors of named address. Reading or writing either  
address will access the same 8-bit register. The Fan Control and Configuration Registers are listed first, as there  
is a required order to setup these registers first and then setup the others (see REQUIRED INITIAL FAN  
CONTROL REGISTER SEQUENCE). The detailed explanations of each register will follow the order shown in  
Table 4.  
Note: POR = Power-On-Reset.  
Table 4. Register Map Grouped in Functional Order  
REGISTER  
[HEX]  
POR DEFAULT  
[HEX]  
REGISTER NAME  
READ/WRITE  
FAN CONTROL REGISTERS  
4A  
4B  
4D  
PWM and RPM  
R/W  
R/W  
R/W  
20  
3F  
17  
Fan Spin-Up Configuration  
PWM Frequency  
Read Only  
(R/W if Override Bit is Set)  
4C  
PWM Value  
00  
50–5F  
4F  
Lookup Table  
R/W  
R/W  
See Table  
04  
Lookup Table Hysteresis  
CONFIGURATION REGISTER  
03 (09) Configuration  
TACHOMETER COUNT AND LIMIT REGISTERS  
R/W  
00  
46  
47  
48  
49  
Tach Count LSB  
Tach Count MSB  
Tach Limit LSB  
Tach Limit MSB  
Read Only  
Read Only  
R/W  
N/A  
N/A  
FF  
R/W  
FF  
LOCAL TEMPERATURE AND LOCAL SETPOINT REGISTERS  
00  
Local Temperature  
Local High Setpoint  
Read Only  
R/W  
N/A  
05 (0B)  
46 (70°)  
REMOTE DIODE TEMPERATURE AND SETPOINT REGISTERS  
01  
10  
Remote Temperature MSB  
Remote Temperature LSB  
Remote Temperature Offset MSB  
Remote Temperature Offset LSB  
Remote High Setpoint MSB  
Remote High Setpoint LSB  
Remote Low Setpoint MSB  
Remote Low Setpoint LSB  
Remote TCRIT Setpoint  
Read Only  
Read Only  
R/W  
N/A  
N/A  
11  
00  
12  
R/W  
00  
07 (0D)  
13  
R/W  
46 (70°C)  
00  
R/W  
08 (0E)  
14  
R/W  
00 (0°C)  
00  
R/W  
19  
R/W  
55 (85°C)  
0A (10°C)  
00  
21  
Remote TCRIT Hys  
R/W  
BF  
Remote Diode Temperature Filter  
R/W  
CONVERSION AND ONE-SHOT REGISTERS  
04 (0A)  
0F  
Conversion Rate  
One-Shot  
R/W  
08  
Write Only  
N/A  
ALERT STATUS AND MASK REGISTERS  
02  
16  
ALERT Status  
ALERT Mask  
Read Only  
R/W  
N/A  
A4  
ID AND TEST REGISTERS  
FF  
Stepping/Die Rev. ID  
Read Only  
41  
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Table 4. Register Map Grouped in Functional Order (continued)  
REGISTER  
[HEX]  
POR DEFAULT  
[HEX]  
REGISTER NAME  
READ/WRITE  
[RESERVED] REGISTERS—NOT USED  
06  
0C  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
Not Used  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
15  
17  
18  
1A–1F  
20  
22–2F  
30–3F  
40–45  
4E  
60–BE  
C0–FD  
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REGISTER DESCRIPTIONS IN FUNCTIONAL ORDER  
The REGISTER DESCRIPTIONS IN FUNCTIONAL ORDER section shows a Register Map grouped in functional  
order. Some address locations have been left blank to maintain compatibility with LM86. Addresses in  
parenthesis are mirrors of named address for backwards compatibility with some older software. Reading or  
writing either address will access the same 8-bit register.  
Table 5. Fan Control Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
4AHEX FAN PWM AND TACHOMETER CONFIGURATION REGISTER  
7:6  
00  
These bits are unused and always set to 0.  
0: the PWM Value (register 4C) and the Lookup Table (50–5F) are read-  
only. The PWM value (0 to 100%) is determined by the current remote  
diode temperature and the Lookup Table, and can be read from the  
PWM value register.  
1: the PWM value (register 4C) and the Lookup Table (Register 50–5F)  
are read/write enabled. Writing the PWM Value register will set the PWM  
output. This is also the state during which the Lookup Table can be  
written.  
PWM  
Program  
5
1
PWM  
Output  
Polarity  
0: the PWM output pin will be 0 V for fan OFF and open for fan ON.  
1: the PWM output pin will be open for fan OFF and 0 V for fan ON.  
4
0
PWM Clock  
Select  
if 0, the master PWM clock is 360 kHz  
if 1, the master PWM clock is 1.4 kHz.  
3
2
0
0
4A  
R/W  
[Reserved]  
Always write 0 to this bit.  
00: Traditional tach input monitor, false readings when under minimum  
detectable RPM.  
01: Traditional tach input monitor, FFFF reading when under minimum  
detectable RPM.  
10: Most accurate readings, FFFF reading when under minimum  
detectable RPM. Smart-tach mode enabled. Use with direct PWM drive  
of fan power.  
Tachometer  
Mode  
1:0  
00  
11: Least effort on programmed PWM of fan, FFFF reading when under  
minimum detectable RPM. Smart-tach mode enabled. Use with direct  
PWM drive of fan power.  
Note: If the PWM Clock is 360 kHz, mode 00 is used regardless of the  
setting of these two bits.  
4BHEX FAN PWM AND TACHOMETER CONFIGURATION REGISTER  
7:6  
0
These bits are unused and always set to 0  
If 0, the fan spin-up uses the duty cycle and spin-up time, bits 0–4.  
If 1, the LM63 sets the PWM output to 100% until the spin-up times out  
(per bits 0–2) or the minimum desired RPM has been reached (per the  
Tachometer Setpoint setting) using the tachometer input, whichever  
happens first. This bit overrides the PWM Spin-Up Duty Cycle register  
(bits 4:3)—PWM output is always 100%. Register x03, bit 2 = 1 for  
Tachometer mode.  
Fast  
Tachometer  
Spin-Up  
5
1
If PWM Spin-Up Time (bits 2:0) = 000, the Spin-Up cycle is bypassed,  
regardless of the state of this bit.  
00: Spin-Up cycle bypassed (no Spin-Up), unless Fast Tachometer  
Terminated Spin-Up (bit 5) is set.  
01: 50%  
10: 75%–81% Depends on PWM Frequency. See the APPLICATION  
NOTES section at the end of this datasheet.  
11: 100%  
4B  
R/W  
PWM  
Spin-Up  
Duty Cycle  
4:3  
2:0  
11  
000: Spin-Up cycle bypassed (No Spin-Up)  
001: 0.05 seconds  
010: 0.1 s  
011: 0.2 s  
100: 0.4 s  
PWM  
Spin-Up  
Time  
111  
101: 0.8 s  
110: 1.6 s  
111: 3.2 s  
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Table 5. Fan Control Registers (continued)  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
4DHEX FAN PWM FREQUENCY REGISTER  
7:5  
4:0  
000  
These bits are unused and always set to 0  
The PWM Frequency = PWM_Clock / 2n, where PWM_Clock = 360 kHz  
or 1.4 kHz (per the PWM Clock Select bit in Register 4A), and n = value  
of the register.  
PWM  
Frequency  
4D  
R/W  
10111  
Note: n = 0 is mapped to n = 1. See the APPLICATION NOTES section  
at the end of this datasheet.  
4CHEX PWM VALUE REGISTER  
7:6  
00  
These bits are unused and always set to 0  
If PWM Program (register 4A, bit 5) = 0 this register is read only and  
reflects the LM63’s current PWM value from the Lookup Table.  
If PWM Program (register 4A, bit 5) = 1, this register is read/write and the  
desired PWM value is written directly to this register, instead of from the  
Lookup Table, for direct fan speed control.  
Read  
(Write only  
if reg 4A  
bit 5 = 1.)  
PWM  
Value  
4C  
5:0  
000000  
This register will read 0 during the Spin-Up cycle.  
See the APPLICATION NOTES section at the end of this datasheet for  
more information regarding the PWM Value and Duty Cycle in %.  
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Table 5. Fan Control Registers (continued)  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
50HEX to 5FHEX LOOKUP TABLE (7 Bits for Temperature and 6 Bits for PWM for each Temperature/PWM Pair)  
7
0
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 1  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
5A  
5B  
5C  
5D  
5E  
5F  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 51.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 1  
The PWM value corresponding to the temperature limit in register 50.  
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 2  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 53.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 2  
The PWM value corresponding to the temperature limit in register 52.  
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 3  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 55.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 3  
The PWM value corresponding to the temperature limit in register 54.  
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 4  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 57.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 4  
Read.  
The PWM value corresponding to the temperature limit in register 56.  
This bit is unused and always set to 0.  
(Write only  
if reg 4A  
bit 5 = 1.)  
Lookup Table  
Temperature  
Entry 5  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 59.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 5  
The PWM value corresponding to the temperature limit in register 58.  
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 6  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 5B.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 6  
The PWM value corresponding to the temperature limit in register 5A.  
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 7  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 5D.  
6:0  
0x7F  
7:6  
5:0  
7
00  
0x3F  
0
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 7  
The PWM value corresponding to the temperature limit in register 5C.  
This bit is unused and always set to 0.  
Lookup Table  
Temperature  
Entry 8  
If the remote diode temperature exceeds this value, the PWM output will  
be the value in Register 5F.  
6:0  
0x7F  
7:6  
5:0  
00  
These bits are unused and always set to 0.  
Lookup Table  
PWM Entry 8  
0x3F  
The PWM value corresponding to the temperature limit in register 5E.  
4FHEX LOOKUP TABLE HYSTERESIS  
7:5  
000  
Lookup  
Table  
Hysteresis  
These bits are unused and always set to 0  
4F  
R/W  
4:0  
00100  
The amount of hysteresis applied to the Lookup Table. (1 LSB = 1°C).  
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Table 6. Configuration Register  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
03 (09)HEX CONFIGURATION REGISTER  
When this bit is a 0, ALERT interrupts are enabled.  
When this bit is set to a 1, ALERT interrupts are masked, and the  
ALERT pin is always in a high-impedance (open) state.  
ALERT  
Mask  
7
6
0
0
When this bit is a 0, the LM63 is in operational mode, converting,  
comparing, and updating the PWM output continuously.  
When this bit is a 1, the LM63 enters a low-power standby mode.  
In STANDBY, continuous conversions are stopped, but a  
conversion/comparison cycle may be initiated by writing any value to  
register 0x0F. Operation of the PWM output in STANDBY depends  
on the setting of bit 5 in this register.  
STANDBY  
When this bit is a 0, the LM63’s PWM output continues to output the  
current fan control signal while in STANDBY.  
When this bit is a 1, the PWM output is disabled (as defined by the  
PWM polarity bit) while in STANDBY.  
PWM Disable  
in STANDBY  
5
0
4:3  
00  
These bits are unused and always set to 0.  
When this bit is a 0, the ALERT/Tach pin is an open drain ALERT  
output.  
03 (09)  
R/W  
ALERT/Tach  
Select  
When this bit is a 1, the ALERT/Tach pin is a high-impedance  
Tachometer input.  
Note that if this bit is set, the function of the ALERT/Tach pin must be  
Tach input, so an external ALERT condition will not occur.  
2
1
0
0
0
0
The T_CRIT limit for the remote diode is nominally 85°C. This value  
can be changed once after power-up by first setting this bit to a 1,  
then programming a new T_CRIT value into the Remote Diode  
T_CRIT Limit (register 0x19). The T_CRIT value can not be changed  
again except by cycling power to the LM63.  
T_CRIT Limit  
Override  
0: an ALERT will be generated if any Remote Diode conversion result  
is above the Remote High Set Point or below the Remote Low  
Setpoint.  
1: an ALERT will be generated only if three consecutive Remote  
Diode conversions are above the Remote High Set Point or below  
the Remote Low Setpoint.  
RDTS Fault  
Queue  
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Table 7. Tachometer Count And Limit Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
47HEX TACHOMETER COUNT (MSB) and 46HEX TACHOMETER COUNT (LSB) REGISTERS (16 bits: Read LSB first to lock MSB and  
ensure MSB and LSB are from the same reading)  
Tachometer  
Count (MSB)  
These registers contain the current 16-bit Tachometer  
Count, representing the period of time between tach pulses.  
Note that the 16-bit tachometer MSB and LSB are reversed  
from the 16-bit temperature readings.  
47  
Read Only  
Read Only  
7:0  
7:2  
N/A  
N/A  
Tachometer  
Count (LSB)  
Bits  
00:  
01:  
10:  
11:  
Edges Used  
Tach_Count_Multiple  
Reserved - do not use  
2
3
5
4
2
1
Tachometer  
Edge Count  
46  
Read Only  
1:0  
00  
Note: If PWM_Clock_Select = 360 kHz, then  
Tach_Count_Multiple = 1 regardless of the setting of these  
bits.  
49HEX TACHOMETER LIMIT (MSB) and 48HEX TACHOMETER LIMIT (LSB) REGISTERS  
Tachometer  
Limit MSB)  
These registers contain the current 16-bit Tachometer  
49  
R/W  
7:0  
0xFF  
Count, representing the period of time between tach pulses.  
Fan RPM = (f * 5,400,000) / (Tachometer Count), where f =  
1 for 2 pulses/rev fan; f = 2 for 1 pulse/rev fan; and f = 2/3  
for 3 pulses/rev fan. See the APPLICATION NOTES section  
at the end of this datasheet for more tachometer  
Tachometer  
Limit (LSB)  
R/W  
R/W  
7:2  
1:0  
0xFF  
48  
information. Note that the 16-bit tachometer MSB and LSB  
are reversed from the 16 bit temperature readings.  
[Reserved]  
Not Used.  
Table 8. Local Temperature And Local High Setpoint Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
00HEX LOCAL TEMPERATURE REGISTER (8-bits)  
Local Temperature  
Reading (8-bit)  
00  
Read Only 7:0  
N/A  
8-bit integer representing the temperature of the LM63 die.  
05 (0B)HEX LOCAL HIGH SETPOINT REGISTER (8-bits)  
05 R/W 7:0 0x46 (70°) Local HIGH Setpoint High Setpoint for the internal diode.  
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Table 9. Remote Diode Temperature, Offset And Setpoint Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
This is the MSB of the 2’s complement value, representing the  
temperature of the remote diode connected to the LM63. Bit 7 is the  
sign bit, bit 6 has a weight of 0x40 (64°), and bit 0 has a weight of 1°C.  
This byte to be read first. The LM63C and LM63D will report the actual  
thermal diode temperature.  
Remote Diode  
Temperature  
Reading (MSB)  
01  
10  
Read Only 7:0  
N/A  
This is the LSB of the 2’s complement value, representing the  
temperature of the remote diode connected to the LM63. Bit 7 has a  
weight 0.5°C, bit 6 has a weight of 0.25°C, and bit 5 has a weight of  
0.125°C.  
Remote Diode  
Temperature  
Reading (MSB)  
7:5  
N/A  
Read Only  
4:0  
00  
00  
Always 00.  
Remote  
Temperature  
OFFSET (MSB)  
These registers contain the value added to or subtracted from the  
remote diode’s reading to compensate for the different non-ideality  
factors of different processors, diodes, etc. The 2’s complement value,  
in these registers is added to the output of the LM63’s ADC to form the  
temperature reading contained in registers 01 and 10.  
11  
12  
R/W  
R/W  
7:5  
Remote  
Temperature  
OFFSET (LSB)  
7:5  
4:0  
00  
00  
Always 00.  
0x46  
(70°C)  
Remote HIGH  
Setpoint (MSB)  
07 (0D)  
13  
R/W  
R/W  
R/W  
R/W  
7:0  
High setpoint temperature for remote diode. Same format as Remote  
Temperature Reading (registers 01 and 10).  
7:5  
4:0  
00  
00  
Remote HIGH  
Setpoint (LSB)  
Always 00.  
00  
(0°C)  
Remote LOW  
Setpoint (MSB)  
08 (0E)  
14  
7:0  
Low setpoint temperature for remote diode. Same format as Remote  
Temperature Reading (registers 01 and 10).  
7:5  
4:0  
00  
00  
Remote LOW  
Setpoint (LSB)  
Always 00.  
This 8-bit integer storing the T_CRIT limit is nominally 85°C. This value  
can be changed once after power-up by setting T_CRIT Limit Override  
(bit 1) in the Configuration register to a 1, then programming a new  
T_CRIT value into this register. The T_CRIT Limit can not be changed  
again except by cycling power to the LM63.  
0x55  
(85°C)  
Remote Diode  
T_CRIT Limit  
19  
21  
R/W  
R/W  
7:0  
Remote Diode  
T_CRIT  
Hysteresis  
8-bit integer storing T_CRIT hysteresis. T_CRIT stays activated until  
the remote diode temperature goes below [(T_CRIT Limit)—(T_CRIT  
Hysteresis)].  
0x0A  
(10°C)  
7:0  
7:3  
00000  
00  
These bits are unused and should always set to 0.  
00: Filter Disabled  
Remote Diode  
Temperature  
Filter  
01: Filter Level 1 (minimal filtering, same as 10)  
10: Filter Level 1 (minimal filtering, same as 01)  
11: Filter Level 2 (maximum filtering)  
2:1  
0
BF  
R/W  
0: the ALERT/Tach pin functions normally.  
Comparator  
Mode  
1: the ALERTTach pin behaves as a comparator, asserting itself when  
an ALERT condition exists, de-asserting itself when the ALERT  
condition goes away.  
0
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Table 10. ALERT Status and Mask Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
02HEX ALERT STATUS REGISTER (8-bits) (All Alarms are latched until read, then cleared if alarm condition was removed at the  
time of the read.)  
When this bit is a 0, the ADC is not converting.  
7
0
Busy  
When this bit is set to a 1, the ADC is performing a conversion. This bit  
does not affect ALERT status.  
When this bit is a 0, the internal temperature of the LM63 is at or below  
the Local High Setpoint.  
When this bit is a 1, the internal temperature of the LM63 is above the  
Local High Setpoint, and an ALERT is triggered.  
Local  
High Alarm  
6
5
4
0
0
0
This bit is unused and always read as 0.  
When this bit is a 0, the temperature of the Remote Diode is at or  
below the Remote High Setpoint.  
When this bit is a 1, the temperature of the Remote Diode is above the  
Remote High Setpoint, and an ALERT is triggered.  
Remote  
High Alarm  
When this bit is a 0, the temperature of the Remote Diode is at or  
above the Remote Low Setpoint.  
When this bit is a 1, the temperature of the Remote Diode is below the  
Remote Low Setpoint, and an ALERT is triggered.  
Remote  
Low Alarm  
3
2
1
0
0
0
0x02  
Read Only  
When this bit is a 0, the Remote Diode appears to be correctly  
connected.  
When this bit is a 1, the Remote Diode may be disconnected or  
shorted. This Alarm does not trigger an ALERT.  
Remote Diode  
Fault Alarm  
When this bit is a 0, the temperature of the Remote Diode is at or  
below the T_CRIT Limit.  
When this bit is a 1, the temperature of the Remote Diode is above the  
T_CRIT Limit, and an ALERT is triggered..  
Remote  
T_CRIT Alarm  
When this bit is a 0, the Tachometer count is lower than or equal to the  
Tachometer Limit (the RPM of the fan is greater than or equal to the  
minimum desired RPM).  
When this bit is a 1, the Tachometer count is higher than the  
Tachometer Limit (the RPM of the fan is less than the minimum  
desired RPM), and an ALERT is triggered. Note that if this bit is set,  
the function of the ALERT/Tach pin must be Tach input, so an external  
ALERT condition will not be generated. The user may read the status  
register periodically to find out if and ALERT condition has occurred.  
0
0
Tach Alarm  
16HEX ALERT MASK REGISTER (8-bits)  
7
6
5
1
0
1
This bit is unused and always read as 1.  
Local High  
Alarm Mask  
When this bit is a 0, a Local High Alarm event will generate an ALERT.  
When this bit is a 1, a Local High Alarm will not generate an ALERT  
This bit is unused and always read as 1.  
When this bit is a 0, Remote High Alarm event will generate an  
Remote  
High Alarm Mask  
ALERT.  
4
3
0
0
When this bit is a 1, a Remote High Alarm event will not generate an  
ALERT.  
When this bit is a 0, a Remote Low Alarm event will generate an  
ALERT.  
When this bit is a 1, a Remote Low Alarm event will not generate an  
ALERT.  
16  
R/W  
Remote  
Low Alarm  
Mask  
2
1
1
0
This bit is unused and always read as 1.  
Remote  
T_CRIT  
Alarm Mask  
When this bit is a 0, a Remote T_CRIT event will generate an ALERT.  
When this bit is a 1, a Remote T_CRIT event will not generate an  
ALERT.  
Tach  
Alarm Mask  
When this bit is a 0, a Tach Alarm event will generate an ALERT.  
When this bit is a 1, a Tach Alarm event will not generate an ALERT.  
0
0
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Table 11. Conversion Rate And One-Shot Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
04 (0A)HEX CONVERSION RATE REGISTER (8-bits)  
Sets the conversion rate of the LM63.  
00000000 = 0.0625 Hz  
00000001 = 0.125 Hz  
00000010 = 0.25 Hz  
00000011 = 0.5 Hz  
00000100 = 1 Hz  
Conversion  
Rate  
04 (0A)  
R/W  
7:0  
0x08  
00000101 = 2 Hz  
00000110 = 4 Hz  
00000111 = 8 Hz  
00001000 = 16 Hz  
00001001 = 32 Hz  
All other values = 32 Hz  
04 (0A)HEX ONE-SHOT REGISTER (8-bits)  
Write  
Only  
One Shot  
Trigger  
With the LM63 in the STANDBY mode a single write to this register will  
initiate one complete temperature conversion cycle.  
0F  
7:0  
N/A  
Table 12. ID Registers  
ADDRESS  
HEX  
READ/  
WRITE  
POR  
VALUE  
BITS  
NAME  
DESCRIPTION  
FFHEX STEPPING / DIE REVISION ID REGISTER (8-bits)  
Read  
Only  
Stepping/Die  
Revision ID  
FF  
7:0  
0x41  
Version of LM63  
FEHEX MANUFACTURER’S ID REGISTER (8-bits)  
Read  
Only  
FE  
7:0  
0x01  
Manufacturer’s ID 0x01 = Texas Instruments  
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APPLICATION NOTES  
FAN CONTROL DUTY CYCLE VS. REGISTER SETTINGS AND FREQUENCY  
ACTUAL  
DUTY  
CYCLE, %  
WHEN  
75% IS  
SELECTED  
PWM  
FREQ AT  
360 kHz  
INTERNAL  
CLOCK, kHz  
PWM  
FREQ AT  
1.4 kHz  
INTERNAL  
CLOCK, Hz  
PWM  
VALUE  
4D [5:0]  
FOR 100%  
PWM  
VALUE  
4C [5:0] FOR  
ABOUT 75%  
PWM  
VALUE  
4C [5:0]  
FOR 50%  
PWM  
FREQ  
4D [4:0]  
STEP  
RESOLUTION,  
%
0
Address 0 is mapped to Address 1  
1
50  
2
1
1
180.0  
703.1  
351.6  
234.4  
175.8  
140.6  
117.2  
100.4  
87.9  
78.1  
70.3  
63.9  
58.6  
54.1  
50.2  
46.9  
43.9  
41.4  
39.1  
37.0  
35.2  
33.5  
32.0  
30.6  
29.3  
28.1  
27.0  
26.0  
25.1  
24.2  
23.4  
22.7  
50.0  
75.0  
2
25  
4
3
2
90.00  
60.00  
45.00  
36.00  
30.00  
25.71  
22.50  
20.00  
18.00  
16.36  
15.00  
13.85  
12.86  
12.00  
11.25  
10.59  
10.00  
9.47  
3
16.7  
12.5  
10.0  
8.33  
7.14  
6.25  
5.56  
5.00  
4.54  
4.16  
3.85  
3.57  
3.33  
3.13  
2.94  
2.78  
2.63  
2.50  
2.38  
2.27  
2.17  
2.08  
2.00  
1.92  
1.85  
1.79  
1.72  
1.67  
1.61  
6
5
3
83.3  
4
8
6
4
75.0  
5
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
50  
52  
54  
56  
58  
60  
62  
8
5
80.0  
6
9
6
75.0  
7
11  
12  
14  
15  
17  
18  
20  
21  
23  
24  
26  
27  
29  
30  
32  
33  
35  
36  
38  
39  
41  
42  
44  
45  
47  
7
78.6  
8
8
75.0  
9
9
77.8  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
75.0  
77.27  
75.00  
76.92  
75.00  
76.67  
75.00  
76.47  
75.00  
76.32  
75.00  
76.19  
75.00  
76.09  
75.00  
76.00  
75.00  
75.93  
75.00  
75.86  
75.00  
75.81  
9.00  
8.57  
8.18  
7.82  
7.50  
7.20  
6.92  
6.67  
6.42  
6.21  
6.00  
5.81  
COMPUTING DUTY CYCLES FOR A GIVEN FREQUENCY  
Select a PWM Frequency from the first column corresponding to the desired actual frequency in columns 6 or 7.  
Note the PWM Value for 100% Duty Cycle.  
Find the Duty Cycle by taking the PWM Value of Register 4C and computing:  
PWM _Value  
DutyCycle _(%) =  
ì100%  
PWM _Value _ for _ 100%  
(1)  
Example: For a PWM Frequency of 24, a PWM Value at 100% = 48 and PWM Value actual = 28, then the Duty  
Cycle is (28/48) × 100% = 58.3%.  
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REQUIRED INITIAL FAN CONTROL REGISTER SEQUENCE  
Important! The BIOS must follow the sequence listed in Table 13 to configure the following Fan Registers for the  
LM63 before using any of the Fan or Tachometer or PWM registers.  
Table 13. [Register]HEX and Setup Instructions  
STEP  
[Register]HEX AND SETUP INSTRUCTIONS(1)  
[4A] Write bits 0 and 1; 3 and 4. This includes tach settings if used, PWM internal clock select (1.4 kHz or 360 kHz) and PWM  
Output Polarity.  
1
2
3
[4B] Write bits 0 through 5 to program the spin-up settings.  
[4D] Write bits 0 through 4 to set the frequency settings. This works with the PWM internal clock select.  
Choose, then write, only one of the following:  
A. [4F–5F] the Lookup Table, or  
B. [4C] the PWM value bits 0 through 5.  
4
5
If Step 4A, Lookup Table, was chosen and written then write [4A] bit 5 = 0.  
(1) All other registers can be written at any time after the above sequence.  
COMPUTING RPM OF THE FAN FROM THE TACH COUNT  
The Tach Count Registers 46HEX and 47HEX count the number of periods of the 90 kHz tachometer clock in the  
LM63 for the tachometer input from the fan assuming a 2 pulse per revolution fan tachometer, such as the fans  
supplied with the Pentium 4 boxed processors. The RPM of the fan can be computed from the Tach Count  
Registers 46HEX and 47HEX. This can best be shown through an example.  
EXAMPLE:  
Given: the fan used has a tachometer output with 2 per revolution.  
Let:  
Register 46 (LSB) is BFHEX = Decimal (11 x 16) + 15 = 191 and  
Register 47 (MSB) is 7HEX = Decimal (7 x 256) = 1792.  
The total Tach Count, in decimal, is 191 + 1792 = 1983.  
The RPM is computed using the formula  
f ì 5,400,000  
Fan _ RPM =  
,
Total _ Tach _ Count _( Decimal )  
where  
f = 1 for 2 pulses/rev fan tachometer output;  
f = 2 for 1 pulse/rev fan tachometer output, and  
f = 2 / 3 for 3 pulses/rev fan tachometer output  
(2)  
(3)  
For our example  
1ì 5,400,000  
Fan _ RPM =  
= 2723 _ RPM  
1983  
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USE OF THE LOOKUP TABLE FOR NON-LINEAR PWM VALUES VS TEMPERATURE  
The Lookup Table, Registers 50 through 5F, can be used to create a non-linear PWM vs Temperature curve that  
could be used to reduce the acoustic noise from processor fan due to linear or step transfer functions. An  
example is given below.  
EXAMPLE:  
In a particular system it was found that the best acoustic fan noise performance was found to occur when the  
PWM vs Temperature transfer function curve was parabolic in shape.  
From 25°C to 105°C the fan is to go from 20% to 100%. Since there are 8 steps to the Lookup Table we will  
break up the Temperature range into 8 separate temperatures. For the 80°C over 8-steps = 10°C per step. This  
takes care of the x-axis.  
For the PWM Value, we first select the PWM Frequency. In this example, we will make the PWM Frequency  
(Register 4C) 20.  
For 100% Duty Cycle then, the PWM value is 40. For 20%, the minimum is 40 x (0.2) = 8.  
We can then arrange the PWM, Temperature pairs in a parabolic fashion in the form of y = 0.005 • (x 25)2 + 8  
PWM VALUE  
CALCULATED  
CLOSEST PWM  
VALUE  
TEMPERATURE  
25  
35  
45  
55  
65  
75  
85  
95  
105  
8.0  
8
8.5  
9
10.0  
12.5  
16.0  
20.5  
26.0  
32.5  
40.0  
10  
13  
16  
21  
26  
33  
40  
We can then program the Lookup Table with the temperature and Closest PWM Values required for the curve  
required in our example.  
NON-IDEALITY FACTOR AND TEMPERATURE ACCURACY  
The LM63 can be applied to remote diode sensing in the same way as other integrated-circuit temperature  
sensors. It can be soldered to a printed-circuit board, and because the path of best thermal conductivity is  
between the die and the pins, its temperature will effectively be that of the printed-circuit board lands and traces  
soldered to its pins. This presumes that the ambient air temperature is nearly the same as the surface  
temperature of the printed-circuit board. If the air temperature is much higher or lower than the surface  
temperature, the actual temperature of the LM63 die will be an intermediate temperature between the surface  
and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board  
surface temperature will contribute to the die temperature much more than the air temperature.  
To measure the temperature external to the die use a remote diode. This diode can be located on the die of the  
target IC, such as a CPU processor chip as shown in Figure 14, allowing measurement of the IC’s temperature,  
independent of the LM63’s temperature. The LM63 has been optimized for use with the thermal diode on the die  
of an Intel Pentium 4 or a Mobile Pentium 4 Processor-M processor.  
2
D+  
I
E
= I  
F
2.2 nF  
3
PROCESSOR  
D-  
I
R
LM63  
I
C
Figure 14. Processor Connection to LM63  
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A discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a  
discrete diode’s temperature will be affected, and often dominated by, the temperature of its leads.  
Most silicon diodes do not lend themselves well to this application. It is recommended that a diode-connected  
2N3904 transistor be used, as shown in Figure 15. The base of the transistor is connected to the collector and  
becomes the anode. The emitter is the cathode.  
I
F
2
3
D+  
D-  
MMBT3904  
2.2 nF  
I
R
LM63  
Figure 15. Processor Connection to LM63  
A LM63 with a diode-connected 2N3904 transistor approximates the temperature reading of the LM63 with the  
Pentium 4 processor by 1°C.  
T2N3904 = TPENTIUM 4 1°C  
(4)  
DIODE NON-IDEALITY  
When a transistor is connected to a diode the following relationship holds for Vbe, T, and IF:  
Vbe  
»
ÿ
Ÿ
÷
÷
hVT ◊  
«
IF = IS  
- 1  
e
Ÿ
where  
(5)  
kT  
q
V =  
T
q = 1.6x1019 Coulombs (the electron charge)  
T = Absolute Temperature in Kelvin  
k = 1.38x1023 joules/K (Boltzmann’s constant)  
η is the non-ideality factor of the manufacturing process used to make the thermal diode  
Is = Saturation Current and is process dependent  
If = Forward Current through the base emitter junction  
Vbe = Base Emitter Voltage Drop  
(6)  
(7)  
In the active region, the 1 term is negligible and may be eliminated, yielding the following equation  
Vbe  
»
÷ÿ  
hVT ◊  
«
Ÿ
IF = IS  
e
Ÿ
In Equation 7, η and Is are dependent upon the process that was used in the fabrication of the particular diode.  
By forcing two currents with a very controlled ratio (N) and measuring the resulting voltage difference, it is  
possible to eliminate the Is term. Solving for the forward voltage difference yields the relationship:  
kT  
q
( )  
ln N  
DVbe = h  
÷
÷
«
(8)  
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The voltage seen by the LM63 also includes the IF×RS voltage drop across the internal series resistance of the  
Pentium 4 processor’s thermal diode. The non-ideality factor, η, is the only other parameter not accounted for  
and depends on the diode that is used for measurement. Since ΔVbe is proportional to both η and T, the  
variations in η cannot be distinguished from variations in temperature. Since the temperature sensor does not  
control the non-ideality factor, it will directly add to the inaccuracy of the sensor.  
For the Intel Pentium 4 and Mobile Pentium 4 Processor-M processors Intel specifies a ±0.1% variation in η from  
part to part. As an example, assume that a temperature sensor has an accuracy specification of ±1%°C at room  
temperature of 25°C and process used to manufacture the diode has a non-ideality variation of ±0.1%. The  
resulting accuracy will be:  
TACC = ±1°C + (±0.1% of 298°K) = ±1.3°C  
(9)  
The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature  
sensor is calibrated with the remote diode that it will be paired with. Refer to the processor datasheet for the non-  
ideality factor.  
COMPENSATING FOR DIODE NON-IDEALITY  
In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a  
particular processor. Texas Instruments temperature sensors are always calibrated to the typical non-ideality of a  
particular processor type.  
The LM63 is calibrated for the non-ideality of the 0.13 micron Intel Pentium 4 and Mobile Pentium 4 Processor-M  
processors.  
When a temperature sensor, calibrated for a specific type of processor is used with a different processor type or  
a given processor type has a non-ideality that strays form the typical value, errors are introduced.  
Temperature errors associated with non-ideality may be introduced in a specific temperature range of concern  
through the use of the Temperature Offset Registers 11HEX and 12HEX  
.
The user is encouraged to send an e-mail to hardware.monitor.team@ti.com to further request information on  
our recommended setting of the offset register for different processor types.  
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PCB LAYOUT FOR MINIMIZING NOISE  
Figure 16. Ideal Diode Trace Layout  
In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced  
on traces running between the remote temperature diode sensor and the LM63 can cause temperature  
conversion errors. Keep in mind that the signal level the LM63 is trying to measure is in microvolts. The following  
guidelines should be followed:  
1. Use a low-noise +3.3VDC power supply, and bypass to GND with a 0.1 µF ceramic capacitor in parallel with  
a 100 pF ceramic capacitor. A bulk capacitance of 10 µF needs to be in the vicinity of the LM63's VDD pin.  
2. Place the100 pF power supply bypass capacitor as close as possible to the VDD pin and the recommended  
2.2 nF diode capacitor as close as possible to the LM63's D+ and Dpins. Make sure the traces to the  
2.2 nF capacitor are matched.  
3. Ideally, the LM63 should be placed within 10 cm of the Processor diode pins with the traces being as  
straight, short and identical as possible. Trace resistance of 1 Ω can cause as much as 1°C of error. This  
error can be compensated by using the Remote Temperature Offset Registers, since the value placed in  
these registers will automatically be subtracted from or added to the remote temperature reading.  
4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This  
GND guard should not be between the D+ and Dlines. In the event that noise does couple to the diode  
lines it would be ideal if it is coupled common mode. That is equally to the D+ and Dlines.  
5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.  
6. Avoid running diode traces close to or parallel to high-speed digital and bus lines. Diode traces should be  
kept at least 2 cm apart from the high-speed digital traces.  
7. If it is necessary to cross high-speed digital traces, the diode traces and the high-speed digital traces should  
cross at a 90 degree angle.  
8. The ideal place to connect the LM63's GND pin is as close as possible to the Processor's GND associated  
with the sense diode.  
9. Leakage current between D+ and GND should be kept to a minimum. One nano-ampere of leakage can  
cause as much as 1°C of error in the diode temperature reading. Keeping the printed circuit board as clean  
as possible will minimize leakage current.  
Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV  
below GND, may prevent successful SMBus communication with the LM63. SMBus no acknowledge is the most  
common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of  
communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a  
system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3 dB  
corner frequency of about 40 MHz is included on the LM63's SMBCLK input. Additional resistance can be added  
in series with the SMBData and SMBCLK lines to further help filter noise and ringing. Minimize noise coupling by  
keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high-  
speed data communications cross at right angles to the SMBData and SMBCLK lines.  
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SNAS190E SEPTEMBER 2002REVISED MAY 2013  
REVISION HISTORY  
Changes from Revision D (May 2013) to Revision E  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 34  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
3-May-2013  
PACKAGING INFORMATION  
Orderable Device  
LM63CIMA  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 125  
0 to 125  
0 to 125  
0 to 125  
0 to 125  
0 to 125  
0 to 125  
0 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
8
8
8
8
8
8
8
8
95  
TBD  
Call TI  
CU SN  
Call TI  
CU SN  
Call TI  
CU SN  
Call TI  
CU SN  
Call TI  
Level-1-260C-UNLIM  
Call TI  
LM63  
CIMA  
LM63CIMA/NOPB  
LM63CIMAX  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
D
D
D
D
95  
2500  
2500  
95  
Green (RoHS  
& no Sb/Br)  
LM63  
CIMA  
TBD  
LM63  
CIMA  
LM63CIMAX/NOPB  
LM63DIMA  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
LM63  
CIMA  
TBD  
LM63  
DIMA  
LM63DIMA/NOPB  
LM63DIMAX  
95  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
LM63  
DIMA  
2500  
2500  
TBD  
LM63  
DIMA  
LM63DIMAX/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM63  
DIMA  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-May-2013  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM63CIMAX  
LM63CIMAX/NOPB  
LM63DIMAX  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
8
8
8
8
2500  
2500  
2500  
2500  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
6.5  
6.5  
6.5  
6.5  
5.4  
5.4  
5.4  
5.4  
2.0  
2.0  
2.0  
2.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
LM63DIMAX/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM63CIMAX  
LM63CIMAX/NOPB  
LM63DIMAX  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
8
8
8
8
2500  
2500  
2500  
2500  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
LM63DIMAX/NOPB  
Pack Materials-Page 2  
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