LM78M12CT/NOPB [TI]
IC VREG 12 V FIXED POSITIVE REGULATOR, PSFM3, ROHS COMPLIANT, POWER, TO-220, 3 PIN, Fixed Positive Single Output Standard Regulator;
| 型号： | LM78M12CT/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | IC VREG 12 V FIXED POSITIVE REGULATOR, PSFM3, ROHS COMPLIANT, POWER, TO-220, 3 PIN, Fixed Positive Single Output Standard Regulator 局域网 输出元件 调节器 |
| 文件： | 总18页 (文件大小：2031K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM341/LM78MXX
www.ti.com
SNVS090E –MAY 2004–REVISED AUGUST 2005
LM341/LM78MXX Series 3-Terminal Positive Voltage Regulators
Check for Samples: LM341/LM78MXX
1
FEATURES
DESCRIPTION
The LM341 and LM78MXX series of three-terminal
positive voltage regulators employ built-in current
limiting, thermal shutdown, and safe-operating area
protection which makes them virtually immune to
damage from output overloads.
2
•
•
•
•
•
•
Output Current in Excess of 0.5A
No External Components
Internal Thermal Overload Protection
Internal Short Circuit Current-Limiting
Output Transistor Safe-Area Compensation
With adequate heatsinking, they can deliver in excess
of 0.5A output current. Typical applications would
include local (on-card) regulators which can eliminate
the noise and degraded performance associated with
single-point regulation.
Available in TO-220, TO, and PFM D-PAK
Packages
•
Output Voltages of 5V, 12V, and 15V
Connection Diagram
Figure 1. TO Metal Can Package (NDT) - Bottom View
See Package Number NDT0003A
Figure 2. TO-220 Power Package (NDE) - Top View
See Package Number NDE0003B
Figure 3. PFM - Top View
See Package Number NDP0003B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
LM341/LM78MXX
SNVS090E –MAY 2004–REVISED AUGUST 2005
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)(2)
Lead Temperature (Soldering, 10 seconds)
TO Package (NDT)
300°C
260°C
TO-220 Package (NDE)
Storage Temperature Range
Operating Junction Temperature Range
Power Dissipation(3)
−65°C to +150°C
−40°C to +125°C
Internally Limited
35V
Input Voltage 5V ≤ VO ≤ 15V
ESD Susceptibility
TBD
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply
when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The typical thermal resistance of the three package types is: NDE (TO-220) package: θ(JA) = 60 °C/W, θ(JC) = 5 °C/W NDT (TO)
package: θ(JA) = 120 °C/W, θ(JC) = 18 °C/W NDP (PFM) package: θ(JA) = 92 °C/W, θ(JC) = 10 °C/W
LM341-5.0, LM78M05C ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 10V, CIN = 0.33 μF, CO = 0.1 μF
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating
temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality
Control (SQC) methods.
Symbol
Parameter
Output Voltage
Conditions
Min
4.8
Typ
5.0
5.0
Max
5.2
Units
VO
IL= 500 mA
5 mA ≤ IL ≤ 500 mA
D ≤ 7.5W, 7.5V ≤ VIN ≤ 20V
V
4.75
5.25
P
VR LINE
Line Regulation
7.2V ≤ VIN ≤ 25V
IL = 100 mA
IL = 500 mA
50
100
100
10.0
0.5
mV
mA
VR LOAD
IQ
Load Regulation
5 mA ≤ IL ≤ 500 mA
IL = 500 mA
Quiescent Current
4
ΔIQ
Quiescent Current Change
5 mA ≤ IL ≤ 500 mA
7.5V ≤ VIN ≤ 25V, IL = 500 mA
f = 10 Hz to 100 kHz
1.0
Vn
Output Noise Voltage
Ripple Rejection
40
78
μV
ΔVIN/ΔVO
VIN
f = 120 Hz, IL = 500 mA
dB
Input Voltage Required to Maintain IL = 500 mA
Line Regulation
7.2
V
ΔVO
Long Term Stability
IL = 500 mA
20
mV/khrs
2
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LM341/LM78MXX
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SNVS090E –MAY 2004–REVISED AUGUST 2005
LM341-12, LM78M12C ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 19V, CIN = 0.33 μF, CO = 0.1 μF
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating
temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality
Control (SQC) methods.
Symbol
Parameter
Output Voltage
Conditions
Min
11.5
11.4
Typ
12
Max
12.5
12.6
Units
VO
IL= 500 mA
5 mA ≤ IL ≤ 500 mA
D ≤ 7.5W, 14.8V ≤ VIN ≤ 27V
V
12
P
VR LINE
Line Regulation
14.5V ≤ VIN ≤ 30V
IL = 100 mA
IL = 500 mA
120
240
240
10.0
0.5
mV
mA
VR LOAD
IQ
Load Regulation
5 mA ≤ IL ≤ 500 mA
IL = 500 mA
Quiescent Current
4
ΔIQ
Quiescent Current Change
5 mA ≤ IL ≤ 500 mA
14.8V ≤ VIN ≤ 30V, IL = 500 mA
f = 10 Hz to 100 kHz
1.0
Vn
Output Noise Voltage
Ripple Rejection
75
71
μV
ΔVIN/ΔVO
VIN
f = 120 Hz, IL = 500 mA
dB
Input Voltage Required to Maintain IL = 500 mA
Line Regulation
14.5
V
ΔVO
Long Term Stability
IL = 500 mA
48
mV/khrs
LM341-15, LM78M15C ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 23V, CIN = 0.33 μF, CO = 0.1 μF
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating
temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality
Control (SQC) methods.
Symbol
Parameter
Output Voltage
Conditions
Min
14.4
Typ
15
Max
15.6
Units
VO
IL= 500 mA
5 mA ≤ IL ≤ 500 mA
D ≤ 7.5W, 18V ≤ VIN ≤ 30V
V
14.25
15
15.75
P
VR LINE
Line Regulation
17.6V ≤ VIN ≤ 30V
IL = 100 mA
IL = 500 mA
150
300
300
10.0
0.5
mV
mA
VR LOAD
IQ
Load Regulation
5 mA ≤ IL ≤ 500 mA
IL = 500 mA
Quiescent Current
4
ΔIQ
Quiescent Current Change
5 mA ≤ IL ≤ 500 mA
18V ≤ VIN ≤ 30V, IL = 500 mA
f = 10 Hz to 100 kHz
f = 120 Hz, IL = 500 mA
IL = 500 mA
1.0
Vn
Output Noise Voltage
Ripple Rejection
90
69
μV
ΔVIN/ΔVO
VIN
dB
Input Voltage Required to Maintain
Line Regulation
17.6
V
ΔVO
Long Term Stability
IL = 500 mA
60
mV/khrs
Copyright © 2004–2005, Texas Instruments Incorporated
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SNVS090E –MAY 2004–REVISED AUGUST 2005
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SCHEMATIC DIAGRAM
4
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Product Folder Links: LM341/LM78MXX
LM341/LM78MXX
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SNVS090E –MAY 2004–REVISED AUGUST 2005
TYPICAL PERFORMANCE CHARACTERISTICS
Peak Output Current
Ripple Rejection
Figure 4.
Figure 5.
Ripple Rejection
Dropout Voltage
Figure 6.
Figure 7.
Output Voltage (Normalized
to 1V at TJ = 25°C)
Quiescent Current
Figure 8.
Figure 9.
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SNVS090E –MAY 2004–REVISED AUGUST 2005
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Quiescent Current
Output Impedance
Figure 10.
Figure 11.
Line Transient Response
Load Transient Response
Figure 12.
Figure 13.
6
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LM341/LM78MXX
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SNVS090E –MAY 2004–REVISED AUGUST 2005
DESIGN CONSIDERATIONS
The LM78MXX/LM341XX fixed voltage regulator series has built-in thermal overload protection which prevents
the device from being damaged due to excessive junction temperature.
The regulators also contain internal short-circuit protection which limits the maximum output current, and safe-
area protection for the pass transistor which reduces the short-circuit current as the voltage across the pass
transistor is increased.
Although the internal power dissipation is automatically limited, the maximum junction temperature of the device
must be kept below +125°C in order to meet data sheet specifications. An adequate heatsink should be provided
to assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load
current) if reliable performance is to be obtained).
HEATSINK CONSIDERATIONS
When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important
to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by
summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the
operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in
Figure 14 The heat generated at the device junction flows through the die to the die attach pad, through the lead
frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment.
Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink.
RθJC (Component Variables)
RθCA (Application Variables)
Leadframe Size & Material
No. of Conduction Pins
Die Size
Mounting Pad Size, Material, & Location
Placement of Mounting Pad
PCB Size & Material
Traces Length & Width
Adjacent Heat Sources
Volume of Air
Die Attach Material
Molding Compound Size and Material
Air Flow
Ambient Temperature
Shape of Mounting Pad
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SNVS090E –MAY 2004–REVISED AUGUST 2005
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APPLICATION INFORMATION
Note that the case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 14. Cross-sectional view of Integrated Circuit Mounted on a printed circuit board.
The LM78MXX/LM341XX regulators have internal thermal shutdown to protect the device from over-heating.
Under all possible operating conditions, the junction temperature of the LM78MXX/LM341XX must be within the
range of 0°C to 125°C. A heatsink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the
regulator, PD, must be calculated:
IIN = IL + IG
(1)
(2)
PD = (VIN−VOUT) IL + VINIG
Figure 15 shows the voltages and currents which are present in the circuit.
Figure 15. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):
θJA = TR (max)/PD
(3)
If the maximum allowable value for θJA°C/w is found to be ≥60°C/W for TO-220 package or ≥92°C/W for PFM
package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these
requirements. If the calculated value for θJA fall below these limits, a heatsink is required.
As a design aid, Table 1 shows the value of the θJA of PFM for different heatsink area. The copper patterns that
we used to measure these θJA are shown at the end of the Application Note Section. Figure 16 reflects the same
test results as what are in the Table 1
Figure 17 shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device.
Figure 18 shows the maximum allowable power dissipation vs. copper area (in2) for the TO-252 device. Please
see AN-1028 (SNVA036) for power enhancement techniques to be used with TO-252 package.
8
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SNVS090E –MAY 2004–REVISED AUGUST 2005
Table 1. θJA Different Heatsink Area
Layout
Copper Area
Thermal Resistance
Top Sice (in2)(1)
Bottom Side (in2)
(θJA, °C/W) TO-252
1
2
0.0123
0.066
0.3
0
0
103
87
60
54
52
47
84
70
63
57
57
89
72
61
55
53
3
0
4
0.53
0.76
1
0
5
0
6
0
7
0
0.2
0.4
0.6
0.8
1
8
0
9
0
10
11
12
13
14
15
16
0
0
0.066
0.175
0.284
0.392
0.5
0.066
0.175
0.284
0.392
0.5
(1) Tab of device attached to topside copper
Figure 16. θJA vs. 2oz Copper Area for TO-252
Figure 17. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
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SNVS090E –MAY 2004–REVISED AUGUST 2005
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Figure 18. Maximum Allowable Power Dissipation vs. 2oz. Copper Area for TO-252
Typical Application
*Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).
**Optional for improved transient response.
Figure 19. Typical Application
10
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
LM341T-15
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
NRND
TO-220
TO-220
TO-220
TO-220
TO-252
TO-252
TO-252
TO-252
TO
NDE
3
3
3
3
3
3
3
3
3
3
3
3
45
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
AU
Call TI
Level-1-NA-UNLIM
Call TI
LM341T-15
LM78M15CT
LM341T-15/NOPB
LM341T-5.0
ACTIVE
NRND
NDE
NDE
NDE
NDP
NDP
NDP
NDP
NDT
NDT
NDE
NDE
45
45
Green (RoHS
& no Sb/Br)
LM341T-15
LM78M15CT
TBD
LM341T-5.0
LM78M05CT
LM341T-5.0/NOPB
LM78M05CDT
ACTIVE
NRND
45
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Call TI
LM341T-5.0
LM78M05CT
75
TBD
LM78M05
CDT
LM78M05CDT/NOPB
LM78M05CDTX
LM78M05CDTX/NOPB
LM78M05CH
ACTIVE
NRND
75
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Call TI
LM78M05
CDT
2500
2500
500
500
45
TBD
LM78M05
CDT
ACTIVE
ACTIVE
ACTIVE
NRND
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
LM78M05
CDT
Green (RoHS
& no Sb/Br)
LM78M05CH
LM78M05CH/NOPB
LM78M05CT
TO
Green (RoHS
& no Sb/Br)
AU
LM78M05CH
TO-220
TO-220
TBD
Call TI
CU SN
LM341T-5.0
LM78M05CT
LM78M05CT/NOPB
ACTIVE
45
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
LM341T-5.0
LM78M05CT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM78M05CDTX
TO-252
NDP
NDP
3
3
2500
2500
330.0
330.0
16.4
16.4
6.9
6.9
10.5
10.5
2.7
2.7
8.0
8.0
16.0
16.0
Q2
Q2
LM78M05CDTX/NOPB TO-252
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM78M05CDTX
TO-252
TO-252
NDP
NDP
3
3
2500
2500
367.0
367.0
367.0
367.0
35.0
38.0
LM78M05CDTX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
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