概述
数据手册LM809M3-308 概述
LM809/LM810 3-Pin Microprocessor Reset Circuits
LM809M3-308 数据手册
通过下载LM809M3-308数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载LM809, LM810
www.ti.com
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
LM809/LM810 3-Pin Microprocessor Reset Circuits
Check for Samples: LM809, LM810
1
FEATURES
DESCRIPTION
The LM809/810 microprocessor supervisory circuits
can be used to monitor the power supplies in
microprocessor and digital systems. They provide a
reset to the microprocessor during power-up, power-
down and brown-out conditions.
2
•
Precise Monitoring of 3V, 3.3V, and 5V Supply
Voltages
•
•
•
Superior Upgrade to MAX809/810
Fully Specified Over Temperature
140ms Min. Power-On Reset Pulse Width,
240ms Typical
The function of the LM809/810 is to monitor the VCC
supply voltage, and assert a reset signal whenever
this voltage declines below the factory-programmed
reset threshold. The reset signal remains asserted for
240ms after VCC rises above the threshold. The
LM809 has an active-low RESET output, while the
LM810 has an active-high RESET output.
–
–
Active-Low RESET Output (LM809)
Active-High RESET Output (LM810)
•
•
•
Ensured RESET Output Valid for VCC≥1V
Low Supply Current, 15µA Typ
Power Supply Transient Immunity
Seven standard reset voltage options are available,
suitable for monitoring 5V, 3.3V, and 3V supply
voltages.
APPLICATIONS
•
•
•
•
•
•
Microprocessor Systems
Computers
With
a low supply current of only 15µA, the
LM809/810 are ideal for use in portable equipment.
The LM809/LM810 are available in the 3-pin SOT-23
package and in the 6-Lead SON package.
Controllers
Intelligent Instruments
Portable/Battery-Powered Equipment
Automotive
Connection Diagrams
Typical Application Circuit
Top View
Top View
Figure 1. 3-Lead
SOT-23-3 Package
See Package Number
DBZ
Figure 2. 6-Lead
SON Package
See Package Number
NGB0006A
() are for LM810
( ) are for LM810
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM809, LM810
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
www.ti.com
Pin Descriptions
PIN
NAME
FUNCTION
SON
SOT-23
1
1
GND
Ground reference
Active-low output. RESET remains low while VCC is below the reset threshold, and for
240ms after VCC rises above the reset threshold.
RESET (LM809)
3
5
2
3
Active-high output. RESET remains high while VCC is below the reset threshold, and for
240ms after VCC rises above the reset threshold.
RESET (LM810)
VCC
Supply Voltage (+5V, +3.3V, or +3.0V)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
VCC
−0.3V to 6.0V
−0.3V to (VCC+ 0.3V)
20mA
RESET, RESET
Input Current, VCC Pin
Output Current, RESET, RESET Pin
Rate of Rise, VCC
20mA
100V/µs
ESD Rating(3)
2kV
Continuous Power Dissipation(4)
320mW
Thermal Resistance, θJA
SON-6
152°C/W
SOT-23-3
326°C/W
Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
−40°C to +105°C
125°C
−65°C to +160°C
+300°C
Lead Temperature (soldering, 10sec)
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which the
device operates correctly. Operating ratings do not imply ensured performance limits. For specified performance limits and associated
test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
(4) At elevated temperatures, devices must be derated based on package thermal resistance. The device in the SOT-23-3 package must be
derated at 4mW/°C at ambient temperatures above 70°C. The device has internal thermal protection.
2
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM809 LM810
LM809, LM810
www.ti.com
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
Electrical Characteristics
VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for
4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63/2.45 version(1)
.
Parameter
Test Conditions
TA = 0°C to +70°C
TA = −40°C to +105°C
Min
1.0
1.2
Typ
Max
5.5
5.5
60
Units
VCC Range
V
TA = −40°C to
VCC<5.5V, LM8_ _ -
18
15
+85°C
4.63/4.38/4.00
VCC<3.6V, LM8_ _ -
3.08/2.93/2.63/2.45
50
ICC
Supply Current
µA
TA = +85°C to
+105°C
VCC<5.5V, LM8_ _ -
4.63/4.38/4.00
100
100
VCC<3.6V, LM8_ _ -
3.08/2.93/2.63/2.45
TA = +25°C
4.56
4.50
4.40
4.31
4.25
4.16
3.93
3.89
3.80
3.04
3.00
2.92
2.89
2.85
2.78
2.59
2.55
2.50
2.41
2.38
2.33
4.63
4.38
4.00
3.08
2.93
2.63
2.45
4.70
4.75
4.86
4.45
4.50
4.56
4.06
4.10
4.20
3.11
3.15
3.23
2.96
3.00
3.08
2.66
2.70
2.76
2.49
2.52
2.57
LM8_ _ -4.63
LM8_ _ -4.38
LM8_ _ -4.00
LM8_ _ -3.08
LM8_ _ -2.93
LM8_ _ -2.63
LM8_ _ -2.45
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
VTH
Reset Threshold(2)
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
V
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
Reset Threshold Temperature
Coefficient
VCC to Reset Delay(2)
30
ppm/°C
µs
VCC = VTH to (VTH − 100mV)
TA = −40°C to +85°C
20
140
100
240
560
840
0.3
Reset Active Timeout Period
ms
TA = +85°C to +105°C
VCC = VTH min, ISINK = 1.2mA, LM809-
2.45/2.63/2.93/3.08
RESET Output Voltage Low
(LM809)
VOL
VCC = VTH min, ISINK = 3.2mA, LM809-
4.63/4.38/4.00
0.4
0.3
V
VCC > 1.0V, ISINK = 50µA
VCC > VTH max, ISOURCE = 500µA, LM809-
2.45/2.63/2.93/3.08
0.8VCC
RESET Output Voltage High
(LM809)
VOH
V
VCC > VTH max, ISOURCE = 800µA, LM809-
4.63/4.38/4.00
VCC−1.5
(1) Production testing done at TA = +25°C, over temperature limits specified by design only.
(2) RESET Output for LM809, RESET output for LM810.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM809 LM810
LM809, LM810
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
www.ti.com
Electrical Characteristics (continued)
VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for
4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63/2.45 version(1)
.
Parameter
Test Conditions
Min
Typ
Max
Units
VCC = VTH max, ISINK = 1.2mA, LM810-
2.63/2.93/3.08
0.3
RESET Output Voltage Low
(LM810)
VOL
V
V
VCC = VTH max, ISINK = 3.2mA, LM810-
4.63/4.38/4.00
0.4
VOH
RESET Output Voltage High
(LM810)
0.8VCC
1.8V < VCC < VTH min, ISOURCE = 150μA
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM809 LM810
LM809, LM810
www.ti.com
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
Typical Performance Characteristics
Supply Current vs Temperature
(No Load, LM8_ _-2.63/2.93/3.08)
Supply Current vs Temperature
(No Load, LM8_ _-4.63/4.38)
Figure 3.
Figure 4.
Power-Down Reset Delay vs Temp
(LM8_ _-2.63/2.93/3.08)
Power-Down Reset Delay vs Temperature
(LM8_ _-4.63/4.38)
Figure 5.
Figure 6.
Power-Up Reset Timeout vs Temperature
Normalized Reset Threshold vs Temperature
Figure 7.
Figure 8.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM809 LM810
LM809, LM810
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
www.ti.com
APPLICATIONS INFORMATION
Benefits of Precision Reset Thresholds
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage.
A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63V and 3.08V
options of the LM809/810 use highly accurate circuitry to ensure that the reset threshold occurs only within this
range (for 5V and 3.3V supplies). The other voltage options have the same tight tolerance to ensure a reset
signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds apply to
3V, 3.3V, and 5V nominal supply voltages.
Table 1. Reset Thresholds Related to Common Supply Voltages
Reset Threshold
4.63 ± 3%
4.38 ± 3%
4.00 ± 3%
3.08 ± 3%
2.93 ± 3%
2.63 ± 3%
2.45 ± 3%
3.0V
3.3V
5.0V
90 - 95%
85 - 90%
78 - 82%
90 - 95%
86 - 90%
77 - 81%
72 - 76%
85 - 90%
79 - 84%
Ensuring a Valid Reset Output Down to VCC = 0V
When VCC falls below 1V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic
input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100kΩ
resistor should be connected from the RESET output to ground, as shown in Figure 9.
A 100kΩ pull-up resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC
< 1V.
Figure 9. RESET Valid to VCC = Ground Circuit
Negative-Going VCC Transients
The LM809/810 are relatively immune to short negative-going transients or glitches on VCC. Figure 10 shows the
maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In general, as the
magnitude of the transient increases, going further below the threshold, the maximum allowable pulse width
decreases. Typically, for the 4.63V and 4.38V version of the LM809/810, a VCC transient that goes 100mV below
the reset threshold and lasts 20µs or less will not cause a reset pulse. A 0.1 µF bypass capacitor mounted as
close as possible to the VCC pin will provide additional transient rejection.
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM809 LM810
LM809, LM810
www.ti.com
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
Figure 10. Maximum Transient Duration without Causing a Reset Pulse vs. Reset Comparator Overdrive
Interfacing to µPs with Bidirectional Reset Pins
Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the
LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in
the opposite state, connect a 4.7kΩ resistor between the LM809 RESET output and the µP reset pin, as shown
in Figure 11. Buffer the LM809 RESET output to other system components.
Figure 11. Interfacing to Microprocessors with Bidirectional Reset I/O
SON Mounting
The SON package requires special mounting techniques which are detailed in Texas Instruments Application
Note AN-1187. Referring to the section PCB Design Recommendations, it should be noted that the pad style
which should be used with the SON package is the NSMD (non-solder mask defined) type.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM809 LM810
LM809, LM810
SNVS052D –SEPTEMBER 1999–REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (May 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM809 LM810
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
1000
1000
(1)
(2)
(6)
(3)
(4/5)
LM809M3-2.63
NRND
ACTIVE
SOT-23
SOT-23
DBZ
3
3
TBD
Call TI
CU SN
Call TI
-40 to 105
-40 to 105
S3B
S3B
LM809M3-2.63/NOPB
DBZ
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM809M3-2.93
NRND
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 105
-40 to 105
S4B
S4B
LM809M3-2.93/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM809M3-3.08
NRND
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 105
-40 to 105
S5B
S5B
LM809M3-3.08/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM809M3-4.38/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
S7B
LM809M3-4.63
NRND
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 105
-40 to 105
S8B
S8B
LM809M3-4.63/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM809M3X-2.63/NOPB
LM809M3X-2.93/NOPB
LM809M3X-3.08/NOPB
LM809M3X-4.38/NOPB
LM809M3X-4.63/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3000
3000
3000
3000
3000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 105
-40 to 105
-40 to 105
S3B
S4B
S5B
S7B
S8B
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
-40 to 105
LM810M3-4.63
NRND
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 105
-40 to 105
SEB
SEB
LM810M3-4.63/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM810M3X-4.63/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
SEB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM809M3-2.63
LM809M3-2.63/NOPB
LM809M3-2.93
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
3000
1000
1000
3000
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
LM809M3-2.93/NOPB
LM809M3-3.08
LM809M3-3.08/NOPB
LM809M3-4.38/NOPB
LM809M3-4.63
LM809M3-4.63/NOPB
LM809M3X-2.63/NOPB SOT-23
LM809M3X-2.93/NOPB SOT-23
LM809M3X-3.08/NOPB SOT-23
LM809M3X-4.38/NOPB SOT-23
LM809M3X-4.63/NOPB SOT-23
LM810M3-4.63
SOT-23
SOT-23
LM810M3-4.63/NOPB
LM810M3X-4.63/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM809M3-2.63
LM809M3-2.63/NOPB
LM809M3-2.93
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
3000
1000
1000
3000
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM809M3-2.93/NOPB
LM809M3-3.08
LM809M3-3.08/NOPB
LM809M3-4.38/NOPB
LM809M3-4.63
LM809M3-4.63/NOPB
LM809M3X-2.63/NOPB
LM809M3X-2.93/NOPB
LM809M3X-3.08/NOPB
LM809M3X-4.38/NOPB
LM809M3X-4.63/NOPB
LM810M3-4.63
LM810M3-4.63/NOPB
LM810M3X-4.63/NOPB
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
LM809M3-308 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| LM809M3-4.00 | NSC | 3-Pin Microprocessor Reset Circuits | 获取价格 |
|
| LM809M3-4.00/NOPB | NSC | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, SOT-23, 3 PIN | 获取价格 |
|
| LM809M3-4.38 | NSC | 3-Pin Microprocessor Reset Circuits | 获取价格 |
|
| LM809M3-4.38 | ROCHESTER | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, SOT-23, 3 PIN | 获取价格 |
|
| LM809M3-4.38 | TI | LM809/LM810 3-Pin Microprocessor Reset Circuits | 获取价格 |
|
| LM809M3-4.38/NOPB | TI | 具有低电平有效推挽复位功能、用于监控电源的 3 引脚电压监控器（复位 IC） | DBZ | 3 | -40 to 105 | 获取价格 |
|
| LM809M3-4.63 | NSC | 3-Pin Microprocessor Reset Circuits | 获取价格 |
|
| LM809M3-4.63 | TI | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, SOT-23, 3 PIN | 获取价格 |
|
| LM809M3-4.63/NOPB | TI | 具有低电平有效推挽复位功能、用于监控电源的 3 引脚电压监控器（复位 IC） | DBZ | 3 | -40 to 105 | 获取价格 |
|
| LM809M3X-2.45 | NSC | 3-Pin Microprocessor Reset Circuits | 获取价格 |
|
LM809M3-308 相关文章
强制中企出售股权，英国半导体领域渐成中企投资禁区
- 2024-11-08
- 22
台积电拟对大陆AI公司禁运7nm及以下工艺，引发业界关注
- 2024-11-08
- 15
锐成芯微推出基于8nm工艺的PVT Sensor IP，引领芯片技术创新
- 2024-11-08
- 16
苹果与富士康接洽，商讨在中国台湾生产AI服务器
- 2024-11-08
- 14
