LM8364BALMF20 [TI]
具有低静态电流和 2.5% 阈值精度的低电平有效电压监控器 | DBV | 5 | -40 to 85;
| 型号： | LM8364BALMF20 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有低静态电流和 2.5% 阈值精度的低电平有效电压监控器 | DBV | 5 | -40 to 85 监控 光电二极管 |
| 文件： | 总16页 (文件大小：534K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM8364
www.ti.com
SNVS232B –MARCH 2003–REVISED APRIL 2013
LM8364 Micropower Undervoltage Sensing Circuits
Check for Samples: LM8364
1
FEATURES
DESCRIPTION
The LM8364 series are micropower undervoltage
sensing circuits that are ideal for use in battery
powered microprocessor based systems, where
extended battery life is a key requirement.
2
•
Extremely Low Quiescent Current: 0.65μA, at
VIN = 2.87V
•
•
•
•
•
High Accuracy Threshold Voltage (±2.5%)
Open Drain Output
A range of threshold voltages from 2.0V to 4.5V are
available with an active low open drain output. These
devices feature a very low quiescent current of
0.65µA typical. The LM8364 series features a highly
accurate voltage reference, a comparator with precise
thresholds and built-in hysterisis to prevent erratic
reset operation, and ensured Reset operation down
to 1.0V with extremely low standby current.
Input Voltage Range: 1V to 6V
Surface Mount Package (5-Pin SOT-23)
Pin for Pin Compatible with MC33464
APPLICATIONS
•
•
•
•
Low Battery Detection
Microprocessor Reset Controller
Power Fail Indicator
These devices are available in the space saving
SOT-23 5-pin surface mount package. For other
undervoltage thresholds and output options, please
contact Texas Instruments.
Battery Backup Detection
Functional Block Diagram
Connection Diagram
INPUT
1
5
N/C
RESET
INPUT
GND
RESET
-
2
3
+
4
V
REF
N/C
Figure 1. 5-Pin SOT-23
Top View
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2013, Texas Instruments Incorporated
LM8364
SNVS232B –MARCH 2003–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
−0.3V to 6.5V
−0.3V to 6.5V
70mA
RESET Output Voltage
RESET Output Current
Storage Temperature Range
Mounting Temp.
−65°C to 150°C
260°C
Lead Temp (Soldering, 10 sec)
Junction Temperature
125°
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(1)
Operating Ratings
Temperature Range
Thermal Resistance to ambient (θJA
ESD Tolerance
−40°C to 85°C
)
265°C/W
Human Body Model
Machine Model
2000V
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
Electrical Characteristics
Unless otherwise specified, all limits ensured for TA = 25°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
(1)
(2)
(1)
VDET−
Detector Threshold Voltage
High to Low State Output
(VIN Decreasing)
20 Suffix
27 Suffix
30 Suffix
32 Suffix
45 Suffix
VIN Increasing
20 Suffix
27 Suffix
30 Suffix
32 Suffix
45 Suffix
1.950
2.633
2.925
3.120
4.388
2.0
2.7
3.0
3.2
4.5
2.050
2.767
3.075
3.280
4.613
V
VHYS
Detector Threshold Hysteresis
0.060
0.081
0.090
0.096
0.135
0.100
0.135
0.150
0.160
0.225
0.140
0.189
0.210
0.224
0.315
V
ΔVdet/ΔT Detector Threshold Voltage
±100
0.25
PPM/°C
V
Temperature Coefficient
VOL
RESET Output Voltage Low
State
(Open Drain Output: ISINK = 1mA)
VIN = 1.5V, VOL = 0.5V
0.5
6.0
IOL
RESET Output Sink Current
1.0
1.0
2.5
mA
V
VIN
Operating Input Voltage Range
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm
2
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Product Folder Links: LM8364
LM8364
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SNVS232B –MARCH 2003–REVISED APRIL 2013
Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TA = 25°C.
Symbol
IIN
Parameter
Conditions
Min
Typ
Max
Units
(1)
(2)
(1)
Quiescent Input Current
20 Suffix
VIN = 1.9V
VIN = 4.0V
27 Suffix
0.55
0.70
0.8
1.3
VIN = 2.6V
VIN = 4.7V
0.62
0.75
0.9
1.3
30 Suffix
VIN = 2.87V
VIN = 5.0V
0.65
0.77
0.9
1.3
μA
32 Suffix
VIN = 3.08V
VIN = 5.20V
0.66
0.79
0.9
1.3
45 Suffix
VIN = 4.34V
VIN = 6.0
0.70
0.85
60
1.0
1.4
300
tp
Propagation Delay Time Figure 7
μs
Copyright © 2003–2013, Texas Instruments Incorporated
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LM8364
SNVS232B –MARCH 2003–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
Input Current vs. Input Voltage
Reset Output Voltage vs. Input Voltage
LM8364BALMF45
LM8364BALMF45
6
5
4
3
2
1
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
R
L
= 470kW TO V
IN
80°C
25°C
-30°C
R
= 470kW to 5V
L
0
1
2
3
4
5
6
0
1
2
3
4
5
6
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 2.
Figure 3.
Reset Output Sink Current vs. Input Voltage
LM8364BALMF45
Reset Output Sink Current vs. Output Voltage
LM8364BALMF45
12
40
V
= 0.5V
R = 470kW TO 5V
L
OL
V
= 4.0V
= 3.5V
35
30
IN
R
= 470kW TO V
L
IN
10
8
V
IN
-30°C
25°C
25
20
15
V
IN
= 3.0V
6
V
IN
= 2.5V
4
80°C
10
V
= 2.0V
IN
2
5
0
V
= 1.5V
IN
2
0
0
1
2
3
4
5
6
0
1
3
4
5
INPUT VOLTAGE (V)
RESET OUTPUT VOLTAGE (V)
Figure 4.
Figure 5.
Detector Threshold Voltage vs. Temperature
LM8364BALMF45
4.8
V
DET+
4.7
4.6
4.5
4.4
V
HYS
V
DET-
-25
0
25
50
75
100
-50
AMBIENT TEMPERATURE (°C)
Figure 6.
4
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Product Folder Links: LM8364
LM8364
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SNVS232B –MARCH 2003–REVISED APRIL 2013
APPLICATION NOTES
The propagation delay time for the LM8364 is measured using a 470kΩ pull-up resistor connected to from the
RESET output pin to 5V in addition to a 10pF capacitive load connected from the same pin to GND. Figure 7
shows the timing diagram for the measurement for the propagation delay. VDET+ is equal to the sum of the
detector threshold, VDET−, and the built in hysteresis, VHYS
.
V
DET+
+2
INPUT VOLTAGE, PIN 2
1V
0V
5V
0V
RESET OUTPUT (ACTIVE LOW), PIN 1
2.5V
0.5V
t
t
PHL
PLH
Figure 7. Propagation Delay Timing Diagrams
The LM8364 ultra-low current voltage detector was designed to monitor voltages and to provide an indication
when the monitored voltage, VIN, dropped below a precisely trimmed threshold voltage. This characteristic is
displayed in the typical operating timing diagram below. VIN is the voltage that is being monitored and a pull up
resistor is connected from the RESET output pin to VIN. VIN is at some value above VDET+ and then begins to
decrease. Since this is an Active Low device the RESET output is pulled High through the pull-up resistor and
tracks VIN until VIN crosses the trimmed threshold VDET−. At this point the LM8364 recognizes that VIN is now in a
fault condition and the output immediately changes to the Logic Low State. The RESET output will remain in this
low state until VIN increases above the threshold VDET− + VHYS. This point is also known as VDET+ as indicated
earlier. This built-in hysteresis has been added to the design to help prevent erratic reset operation when the
input voltage crosses the threshold.
The LM8364 has a wide variety of applications that can take advantage of its precision and low current
consumption to monitor Input voltages even though it was designed as a reset controller in portable
microprocessor based systems. It is a very cost effective and space saving device that will protect your more
expensive investments of microprocessors and other devices that need a specified supply voltage for proper
operation.
V
IN
V
DET+
INPUT VOLTAGE, PIN 2
V
DET-
V
IN
V
DET+
RESET OUTPUT (ACTIVE LOW), PIN 1
V
DET-
0V
Figure 8. Timing Waveforms
Copyright © 2003–2013, Texas Instruments Incorporated
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LM8364
SNVS232B –MARCH 2003–REVISED APRIL 2013
www.ti.com
Typical Applications
V
IN
V
SUPPLY
5.0V
INPUT
V
CC
470kW
2
DET-
3
INPUT
mP
RESET
1
RESET
V
= 4.5V
RESET OUTPUT
GND
GND
GND
3.3V
2
INPUT
1
V
= 3.0V
DET-
RESET OUTPUT
3
GND
Figure 9. Microprocessor Reset Circuit
Figure 10. Dual Power Supply Undervoltage
Supervision
V
SUPPLY
V
DD
R
SENSE
2
INPUT
470kW
1
MICROCONTROLLER
V
= 2.0V
DET-
RESET OUTPUT
GND
GND
3
THIS CIRCUIT MONITORS THE CURRENT AT THE LOAD. AS CURRENT FLOW
THROUGH THE LOAD, A VOLTAGE DROP WITH RESPECT TO GROUND
APPEARS ACROSS R
SENSE
WHERE V
= I
* R
LOAD
. THE
SENSE
SENSE
FOLLOWING CONDITIONS APPLY:
IF:
THEN:
I
< V
/R
DET-
RESET OUTPUT = 0V
RESET OUTPUT = V
LOAD
LOAD
DET- SENSE
I
í (V +V )/R
HYS SENSE
DD
Figure 11. Microcontroller System Load Sensing
6
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Product Folder Links: LM8364
LM8364
www.ti.com
SNVS232B –MARCH 2003–REVISED APRIL 2013
V
SUPPLY
2
DET-
3
INPUT
V
= 4.5V
RESET
OUTPUT
GND
2
INPUT
V
DET-
= 3.0V
RESET
OUTPUT
3
GND
V
IN
= 1.0V TO 6V
2
DET-
3
INPUT
V
= 2.0V
RESET
OUTPUT
GND
EACH LED WILL SEQUENTIALLY TURN ON WHEN THE RESPECTIVE VOLTAGE DETECTOR
THRESHOLD (V +V ) IS EXCEEDED.
DET-
HYS
Figure 12. LED Bar Graph Voltage Monitor
Copyright © 2003–2013, Texas Instruments Incorporated
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LM8364
SNVS232B –MARCH 2003–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (April 2013) to Revision B
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: LM8364
PACKAGE OPTION ADDENDUM
www.ti.com
6-Nov-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM8364BALMF20
NRND
SOT-23
DBV
5
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
F01A
LM8364BALMF20/NOPB
LM8364BALMFX20/NOPB
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
1000 RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
F01A
F01A
3000 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Nov-2021
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM8364BALMF20
SOT-23
DBV
DBV
DBV
5
5
5
1000
1000
3000
178.0
178.0
178.0
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
LM8364BALMF20/NOPB SOT-23
LM8364BALMFX20/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM8364BALMF20
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
1000
1000
3000
208.0
208.0
208.0
191.0
191.0
191.0
35.0
35.0
35.0
LM8364BALMF20/NOPB
LM8364BALMFX20/NOPB
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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