LM9071 [TI]
具有复位延迟功能的 250mA、26V、低压降稳压器;
| 型号： | LM9071 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有复位延迟功能的 250mA、26V、低压降稳压器 稳压器 |
| 文件： | 总16页 (文件大小：568K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM9071
www.ti.com
SNVS131D –DECEMBER 1999–REVISED APRIL 2013
LM9071 Low-Dropout System Voltage Regulator with Delayed Reset
Check for Samples: LM9071
1
FEATURES
DESCRIPTION
The LM9071 is a 5V, 250 mA low-dropout voltage
regulator. The regulator features an active low
delayed reset output flag which can be used to reset
a microprocessor system on turn-ON and in the event
that the regulator output falls out of regulation for any
reason. An external capacitor programs a delay time
interval before the reset output can return high.
2
•
•
•
•
Automotive Application Reliability
3% Output Voltage Tolerance
Insensitive to Radiated RFI
Dropout Voltage Less than 800 mV with 250
mA Output Current
•
•
•
•
•
Externally Programmed Reset Delay Interval
Thermal Shutdown
Designed for automotive application the LM9071
contains a variety of protection features such as
reverse battery, over-voltage shutdown, thermal
shutdown, input transient protection and a wide
operating temperature range.
Short Circuit Protection
Reverse Battery Protection
Wide Operating Temperature Range −40°C to
+125°C
Design techniques have been employed to allow the
regulator to remain operational and not generate false
reset signals when subjected to high levels of RF
energy (300V/m from 2 MHz to 400 MHz).
•
•
TO-220 and TO-263 Power Surface Mount
Power Packages
Pin for Pin Compatible with the LM2927, L4947
and TLE4260
Typical Application and Connection Diagrams
(Top View)
Figure 1.
Figure 2. 5-Lead TO-220 Package
Package Number KC0005A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM9071
SNVS131D –DECEMBER 1999–REVISED APRIL 2013
www.ti.com
Tab and Backside metal on all packages internally connected to
ground.
Figure 3. 5-Lead TO-220 Package
Package Number NDH0005D
Figure 4. 5-Lead TO-263 Surface Mount Package
Package Number KTT0005B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)
Absolute Maximum Ratings
DC Input Voltage
−26V to +40V
60V
Positive Input Transient (t<100 ms)
Negative Input Transient (t<1 ms)
Reset Output Sink Current
Power Dissipation
−50V
5 mA
Internally Limited
150°C
Junction Temperature
(2)
ESD Susceptibility
12 kV, 2 kV
260°C
Lead Temperature (Soldering, 10 seconds)
Storage Temperature
−50°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) All pins will survive an ESD impulse of ±2000V using the human body model of 100 pF discharged through a 1.5 kΩ resistor. In addition
the input voltage pin will withstand ten pulses of ±12 kV from a 150 pF capacitor discharged through a 560Ω resistor when bypassed
with a 22 nF, 100V capacitor.
(1)
Operating Ratings
Input Voltage
6V to 26V
−40°C to +125°C
3°C/W
Ambient Temperature
TO-220 Thermal Resistance, θJ-C
TO-220 Thermal Resistance, θJ-A
TO-263 Thermal Resistance, θJ-C
TO-263 Thermal Resistance, θJ-A
(2)
(3)
73°C/W
3°C/W
80°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal
shutdown. The θJ-A value for the TO-220 package (still air, no additional heat sink) is 73°C/W. The effective θJ-A value of the TO-220
package can be reduced by using conventional heat sink methods.
(3) Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal
shutdown. The θJ-A value for the TO-263 package (still air, no additional heat sink) is 80°C/W. The effective θJ-A value of the TO-263
package can be reduced by increasing the printed circuit board area that is connected (soldered) to the package tab. Using 1 ounce (1.4
mils thick) copper clad with no solder mask, an area of 0.5 square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will
reduce θJ-Ato 37°C/W, ad an area of 1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the
copper clad area should be increased by at least 50% to maintain a similar θJ-A rating.
2
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9071
LM9071
www.ti.com
SNVS131D –DECEMBER 1999–REVISED APRIL 2013
(1)
Electrical Characteristics
The following specifications apply for VCC= 6V to 26V, −40°C ≤ TA≤+125°C, unless otherwise specified. COUT= 47µF with an
ESR < 3Ω. CIN=1µF.
Symbol
Parameter
Conditions
Min
Max
Units
REGULATOR OUTPUT
VOUT
Output Voltage
Line Regulation
5 mA ≤ IOUT ≤ 250 mA
4.85
5.15
25
V
ΔVOUT Line
IOUT = 5 mA, 9V ≤ VIN ≤ 16.5V
IOUT = 250 mA
mV
mV
mV
mA
mA
mA
mA
mV
mV
A
50
ΔVOUT Load
Load Regulation
VIN = 14.4V, 5 mA ≤ IOUT ≤ 250 mA
IOUT = 5 mA
60
Iq
Quiescent Current
4
IOUT = 250 mA, VIN ≥ 8V
IOUT = 5 mA, VIN = 5V
IOUT = 250 mA, VIN = 6V
IOUT = 5 mA
25
10
50
Vdo
Dropout Voltage
300
800
1.5
IOUT = 250 mA
Isc
Short Circuit Current
Ripple Rejection
RL = 1Ω
0.35
60
PSRR
VIN = (14VDC) + (1VRMS @ 120Hz)
IOUT = 50 mA
dB
OVthr
Overvoltage Shutdown Threshold
VOUT during Transients
27
V
V
VO Transient
VO Rev Batt
RESET OUTPUT
Vth
VIN Peak ≤ 60V, RL = 100Ω, τ = 100 ms
VIN = −15V
7
VOUT during Reverse Battery
−0.8
0.0
V
Threshold Voltage
ΔVOUT Required to Generate a Reset Output
4.8V ≤ VOUT ≤ 5.2V
−300
−500
mV
Vlow
Reset Output Low Voltage
Isink = 1.6 mA, VOUT > 3.2V
0.4
0.8
V
V
1.4V ≤ VOUT ≤ 3.2V
Vhigh
tDELAY
IDELAY
Rpu
Reset Output High Voltage
Delay Time
0.8 VOUT
7.6
V
CDELAY = 0.1µF
35
30
80
ms
µA
kΩ
Charging Current for CDELAY
Internal Pull-up Resistance
10
12
(1) Datasheet min/max specifications are ensured by design, test, and/or statistical analysis.
Copyright © 1999–2013, Texas Instruments Incorporated
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SNVS131D –DECEMBER 1999–REVISED APRIL 2013
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Typical Performance Characteristics
(TA = 25°C unless indicated otherwise)
Turn ON Characteristics
Turn OFF Characteristics
Figure 5.
Figure 6.
Normalized Output Voltage
vs Temperature
Output Voltage at
Input Voltage Extremes
Figure 7.
Figure 8.
Quiescent Current vs
Input Voltage
Short Circuit Current
vs Temperature
Figure 9.
Figure 10.
4
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Product Folder Links: LM9071
LM9071
www.ti.com
SNVS131D –DECEMBER 1999–REVISED APRIL 2013
Typical Performance Characteristics (continued)
(TA = 25°C unless indicated otherwise)
Dropout Voltage vs
Reset Delay Time
vs Temperature
Temperature
Figure 11.
Figure 12.
Maximum Power Dissipation
(TO-220 Package)
Output Capacitor ESR
Figure 13.
Figure 14.
Maximum Power Dissipation
(TO-263 Package)
Figure 15.
Copyright © 1999–2013, Texas Instruments Incorporated
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SNVS131D –DECEMBER 1999–REVISED APRIL 2013
www.ti.com
Reset Operation and Protection Features
Block Diagram
APPLICATION HINTS
The LM9071 voltage regulator has been optimized for use in microprocessor based automotive systems. Several
unique design features have been incorporated to address many FMEA (Failure Mode Effects Analysis) concerns
for fail-safe system performance.
FAULT TOLERANT FEATURES
While not specifically ensured due to production testing limitations, the LM9071 has been tested and shown to
continue to provide a regulated output and, not generate an erroneous system reset signal while subjected to
high levels of RF electric field energy (up to 300 V/m signal strength over a 2 MHz to 400 MHz frequency range).
This is very important in vehicle safety related applications where the system must continue to operate normally.
To maintain this immunity to RFI the output bypass capacitor is important (47 μF is recommended).
6
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LM9071
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SNVS131D –DECEMBER 1999–REVISED APRIL 2013
An output bypass capacitor of at least 10 μF is required for stability (47 μF is recommended). The ESR of this
capacitor should be less than 3Ω. An input capacitor of 1 μF or larger is recommended to improve line transient
and noise performance.
Conventional load dump protection is built in to withstand up to +60V and −50V transients. Protection against
reverse polarity battery connections is also built in. With a reversed battery connection the output of the LM9071
will not go more negative than one diode drop below ground. This will prevent damage to any of the 5V load
circuits.
RESET FLAG
Excessive loading of the output to the point where the output voltage drops by 300 mV to 500 mV will signal a
reset flag to the micro. This will warn of a VCC supply that may produce unpredictable operation of the system.
On power-up and recovery from a fault condition the delay capacitor is used to hold the micro in a reset condition
for a programmable time interval to allow the system operating voltages and clock to stabilize before executing
code. The delay time interval can be estimated by the following equation:
(1)
INPUT STABILITY
Low dropout voltage regulators which utilize a PNP power transistor usually exhibit a large increase in current
when in dropout (VIN < 5.5V). This increase is caused by the saturation characteristics (β reduction) of the PNP
transistor. To significantly minimize this increase in current the LM9071 detects when the PNP enters saturation
and reduces the operating current.
This reduction in input current can create a stability problem in applications with higher load current (> 100 mA)
where the input voltage is applied through a long length of wire, which in effect adds a significant amount of
inductance in series with the input. The drop in input current may create a positive input voltage transient which
may take the PNP out of saturation. If the input voltage is held constant at the threshold where the PNP is going
in and out of saturation, an oscillation may be created.
This is only observed where a large series inductance is present in the input supply line and when the rise and
fall time of the input supply is very slow. If the application and removal of the input voltage changes at a rate
greater than 500 mV/μs it will move through the dropout region of the regulator (VIN of 3V to 5.5V) too quickly for
an oscillation to be established.
THERMAL MANAGEMENT
The LM9071 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220
package. To obtain operation over the highest possible load current and input voltage ranges, care must be
taken to control the operating temperature of the device. Thermal shutdown protection is built in, with a threshold
above 150°C. Conventional heat-sinking techniques can be used with the TO-220 package. When applying the
TO-263 package, on board heat-sinking is important to prevent premature thermal shutdown. More copper foil
area under the tab of the device will directly improve the operating θJ-A of the TO-263 package, which will reduce
the junction temperature of the device.
The θJ-A value for the TO-263 package (still air, no additional heat sink) is rated at 80°C/W. The effective θJ-A
value of the TO-263 package can be reduced by increasing the printed circuit board area that is connected
(soldered) to the package tab. Using 1 ounce (1.4 mils thick) copper clad with no solder mask, an area of 0.5
square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will reduce θJ-Ato 37°C/W, and an area of
1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the copper clad area
under the solder mask should be increased by at least 50% to maintain a similar θJ-A rating.
The use of a double sided PC board with soldered filled vias between two planes of copper, as shown in
Figure 16, will improve thermal performance while optimizing the PC board surface area required. Using the
double sided PC board arrangement shown in Figure 16, with 1 ounce (1.4 mils thick) copper clad with no solder
mask and solder filled vias, an area of 0.5 square inches on both sides will reduce θJ-A to 43°C/W.
Copyright © 1999–2013, Texas Instruments Incorporated
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SNVS131D –DECEMBER 1999–REVISED APRIL 2013
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Figure 16. Typical TO-263 PC Board Heatsinking
8
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Product Folder Links: LM9071
LM9071
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SNVS131D –DECEMBER 1999–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM9071S/NOPB
LM9071SX/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
5
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
Level-3-245C-168 HR
-40 to 125
-40 to 125
LM9071S
LM9071S
ACTIVE
DDPAK/
TO-263
KTT
500
RoHS-Exempt
& Green
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM9071SX/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75 14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
DDPAK/TO-263 KTT
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 45.0
LM9071SX/NOPB
5
500
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
KTT TO-263
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM9071S/NOPB
5
45
502
25
8204.2
9.19
Pack Materials-Page 3
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
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