LM95213 [TI]
2-Diode Input and Local Digital Temperature Sensor with Two-Wire Interface and TCRIT Outputs;![LM95213](http://pdffile.icpdf.com/pdf2/p00344/img/icpdf/LM95213-15_2118408_icpdf.jpg)
型号: | LM95213 |
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描述: | 2-Diode Input and Local Digital Temperature Sensor with Two-Wire Interface and TCRIT Outputs |
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LM95213
www.ti.com
SNIS147A –MARCH 2007–REVISED MARCH 2013
2-Diode Input and Local Digital Temperature Sensor with Two-Wire Interface and TCRIT
Outputs
Check for Samples: LM95213
1
FEATURES
DESCRIPTION
The LM95213 is an 11-bit digital temperature sensor
with a 2-wire System Management Bus (SMBus)
interface that can monitor the temperature of two
remote diodes as well as its own temperature. The
LM95213 can be used to very accurately monitor the
temperature of up to two external devices such as
microprocessors, graphics processors or diode-
connected 2N3904s.
23
•
Accurately Senses Die Temperature of 2
Remote ICs or Diode Junctions and Local
Temperature
•
•
0.125°C LSb Temperature Resolution
0.03125°C LSb Remote Temperature
Resolution with Digital Filter Enabled
•
•
•
+127.875°C/–128°C and 0°C/255°C Remote
Ranges
The LM95213 reports temperature in two different
formats for +127.875°C/–128°C range and 0°C/255°C
range. The LM95213 TCRIT1, TCRIT2 and TCRIT3
outputs are triggered when any unmasked channel
exceeds its corresponding programmable limit and
can be used to shutdown the system, to turn on the
system fans or as a microcontroller interrupt function.
The current status of the TCRIT1, TCRIT2 and
TCRIT3 pins can be read back from the status
registers. Mask registers are available for further
control of the TCRIT outputs.
Programmable Digital Filters and Analog Front
End Filter
Remote Diode Fault Detection, Model
Selection and Offset Correction
•
•
Mask and Status Register Support
3 Programmable TCRIT Outputs with
Programmable Shared Hysteresis
•
•
Programmable Conversion Rate and Shutdown
Mode One-Shot Conversion Control
The LM95213's remote temperature channels have
programmable digital filters to minimize unwanted
TCRIT events when temperature spikes are
encountered.
SMBus 2.0 Compatible Interface, Supports
TIMEOUT
•
•
Three-Level Address Pin
14-Pin WSON Package
For optimum flexibility and accuracy each LM95213
channel includes offset correction registers for
targeting diodes other than the 2N3904. A three level
address pin allows connection of up to 3 LM95213s
to the same SMBus master. The LM95213 includes
power saving functions such as: programmable
conversion rate, shutdown mode, and turn off of
unused channels.
APPLICATIONS
•
Processor/Computer System Thermal
Management (e.g. Laptop, Desktop,
Workstations, Server)
•
•
Electronic Test Equipment
Office Electronics
Table 1. Key Specifications
VALUE
±2.0
UNIT
°C (max)
°C (max)
V
Local Temperature Accuracy
Remote Diode Temperature Accuracy
Supply Voltage
±1.1
3.0 to 3.6
0.57
Average Supply Current (1Hz conversion rate)
mA (typ)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TruTherm is a trademark of Texas Instruments.
2
3
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
LM95213
SNIS147A –MARCH 2007–REVISED MARCH 2013
www.ti.com
Connection Diagram
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
TCRIT3
SMBCLK
SMBDAT
TCRIT2
TCRIT1
A0
V
DD
NC
NC
D-
LM95213
D2+
D1+
8
GND
Figure 1. 14-Lead WSON - TOP VIEW
See NHL0014B Package
Simplified Block Diagram
3.0V-3.6V
LM95213
Local
Diode Selector
D-S Converter
11-Bit or
10-Bit Plus Sign
Remote
Diode1
Selector
Remote
10-bit Plus Sign
Local
Local
Temperature
Registers
D1+
D2+
TCRIT1
Remote 1
Temperature
Registers
Temperature
Sensor
Circuitry
T_CRIT
Control
Logic
Remote
Diode2
Selector
Remote 2
Temperature
Registers
TCRIT2
Remote 1
Digital Filter
D-
Limit, Status
and
Mask
Remote 1 Offset
Register
TCRIT3
Registers
Remote 2
Digital Filter
SMBDAT
Remote 2 Offset
Register
SMBus
Interface
SMBCLK
Conversion Rate
Rgister
Control Logic
Diode
Configuration
Registers
General
Configuration
Registers
2
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LM95213
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SNIS147A –MARCH 2007–REVISED MARCH 2013
PIN DESCRIPTIONS
Label
Pin #
Function
Typical Connection
NC
1
2
No Connect
Not connected. May be left floating, connected to GND or VDD.
VDD
Positive Supply Voltage Input
DC Voltage from 3.0 V to 3.6 V. VDD should be bypassed with
a 0.1µF capacitor in parallel with 100pF. The 100pF capacitor
should be placed as close as possible to the power supply pin.
Noise should be kept below 200 mVp-p, a 10 µF capacitor may
be required to achieve this.
NC
NC
D−
3
4
5
No Connect
Not connected. May be left floating, connected to GND or VDD
.
.
No Connect
Not connected. May be left floating, connected to GND or VDD
Diode Return Current Sink
To all Diode Cathodes. Common D- pin for all two remote
diodes.
D2+
6
Diode Current Source
To second Diode Anode. Connected to remote discrete diode-
connected transistor junction or to the diode-connected
transistor junction on a remote IC whose die temperature is
being sensed. A capacitor is not required between D2+ and D-.
A 100 pF capacitor between D2+ and D- can be added and
may improve perfomance in noisy systems. Float this pin if this
thermal diode is not used.
D1+
7
Diode Current Source
To first Diode Anode. Connected to remote discrete diode-
connected transistor junction or to the diode-connected
transistor junction on a remote IC whose die temperature is
being sensed. A capacitor is not required between D1+ and D-.
A 100 pF capacitor between D1+ and D- can be added and
may improve perfomance in noisy systems. Float this pin if this
thermal diode is not used.
GND
A0
8
9
Power Supply Ground
Dgital Input
System low noise ground.
SMBus slave address select pin. Selects one of three
addresses. Can be tied to VDD, GND, or to the middle of a
resistor divider connected between VDD and GND.
TCRIT1
TCRIT2
SMBDAT
10
11
12
Digital Output, Open-Drain
Digital Output, Open-Drain
Critical temperature output 1. Requires pull-up resistor. Active
"LOW".
Critical temperature output 2. Requires pull-up resistor. Active
"LOW".
SMBus Bi-Directional Data Line, From and to Controller; may require an external pull-up resistor
Open-Drain Output
SMBCLK
TCRIT3
13
14
SMBus Clock Input
From Controller; may require an external pull-up resistor
Digital Output, Open-Drain
Critical temperature output 3. Requires pull-up resistor. Active
"LOW".
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LM95213
SNIS147A –MARCH 2007–REVISED MARCH 2013
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Typical Application
+3.3V
Standby
C3
10 mF
C2
0.1 mF
C1*
100 pF
R1
10k
R2
R3 R4
R5
10k 10k 1.3k 1.3k
1
2
3
4
5
6
7
14
13
12
11
10
9
NC
V
TCRIT3
SMBCLK
SMBCLK
SMBDAT
DD
NC
NC
D-
SMBDAT
TCRIT2
TCRIT1
SO
DIMM
D2+
D1+
A0
C4**
100 pF
8
Q1
MMBT3904
GND
SMBus
Master
C5**
100 pF
LM95213
PROCESSOR
* Note, place close to LM95213 pins.
** Note, optional - place close to LM95213 pins.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)
Absolute Maximum Ratings
Supply Voltage
−0.3V to 6.0V
Voltage at SMBDAT, SMBCLK,
TCRIT1, TCRIT2, TCRIT3
−0.5V to 6.0V
−0.3V to (VDD + 0.3V)
±1 mA
Voltage at Other Pins
D− Input Current
(2)
Input Current at All Other Pins
±5 mA
(2)
Package Input Current
30 mA
SMBDAT, TCRIT1, TCRIT2,
TCRIT3 Output Sink Current
10 mA
−65°C to +150°C
2000V
Storage Temperature
(3)
ESD Susceptibility
Human Body Model
Machine Model
200V
Charge Device Model
1000V
(4)
Soldering process must comply with reflow temperature profile specifications. Refer to http://www.ti.com/packaging
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to
5 mA. Parasitic components and or ESD protection circuitry are shown in the table below for the LM95213's pins.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. Charged
Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated
assembler) then rapidly being discharged.
(4) Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.
4
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SNIS147A –MARCH 2007–REVISED MARCH 2013
Operating Ratings(1)(2)
Operating Temperature Range
Electrical Characteristics Temperature Range
LM95213CISD
−40°C to +140°C
TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ +125°C
Supply Voltage Range (VDD
)
+3.0V to +3.6V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) Thermal resistance junction-to-ambient when attached to a 4 layer printed circuit board per JEDEC standard JESD51-7:
14-lead WSON = 90°C/W (no thermal vias, no airflow)
14-lead WSON = 63°C/W (1 thermal via, no airflow)
14-lead WSON = 43°C/W (6 thermal vias, no airflow)
14-lead WSON = 31°C/W (6 thermal vias, 900 ln. ft. / min. airflow)
Note, all quoted values include +15% error factor from nominal value.
Temperature-to-Digital Converter Electrical Characteristics
Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMIN
TA ≤ TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
≤
Parameter
Conditions
Typical(1)
Limits(2)
Units
(Limit)
(3)
Temperature Error Using Local Diode
Temperature Error Using Remote Diode
TA = -40°C to +125°C,
±1
±2
°C (max)
°C (max)
(4)
TA = +25°C to +85°C
TD = +60°C to +100°C
MMBT3904
Transistor
±1.1
TA = +25°C to +85°C
TD = −40°C to +125°C
MMBT3904
Transistor
±1.3
±3.0
±3.3
°C (max)
°C (max)
°C (max)
TA = −40°C to +85°C
TD = −40°C to +125°C
MMBT3904
Transistor
TA = −40°C to +85°C
TD = 125°C to +140°C
MMBT3904
Transistor
Local Diode Measurement Resolution
Remote Diode Measurement Resolution
11
0.125
11
Bits
°C
Digital Filter Off
Bits
0.125
13
°C
Digital Filter On (Remote Diodes 1 and 2
only)
Bits
0.03125
1100
31
°C
Conversion Time of All Temperatures at the
All Channels are Enabled in Default State
1 External Channel
1210
34
ms (max)
ms (max)
ms (max)
µA (max)
(5)
Fastest Setting
Local only
30
33
(6)
Quiescent Current
SMBus Inactive, 1Hz Conversion Rate,
channels in default state
570
800
Shutdown
360
0.4
160
10
µA
V
D− Source Voltage
Remote Diode Source Current
High level
230
µA (max)
Low level
Power-On Reset Threshold
Measured on VDD input, falling edge
2.8
1.6
V (max)
V (min)
TCRIT1 Pin Temperature Threshold
TCRIT2 Pin Temperature Threshold
Default Diodes only
Default all channels
+110
+85
°C
°C
(1) Typicals are at TA = 25°C and represent most likely parametric norm.
(2) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the
internal power dissipation of the LM95213 and the thermal resistance. See Thermal Resistance note under Operating Ratings for the
thermal resistance to be used in the self-heating calculation.
(4) The accuracy of the LM95213CISD is guaranteed when using a typical thermal diode of an MMBT3904 diode-connected transistor. For
further information on other thermal diodes see applications DIODE NON-IDEALITY.
(5) This specification is provided only to indicate how often temperature data is updated. The LM95213 can be read at any time without
regard to conversion state (and will yield last conversion result).
(6) Quiescent current will not increase substantially with an SMBus communication.
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Logic Electrical Characteristics
DIGITAL DC CHARACTERISTICS
Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMIN to
TMAX; all other limits TA= TJ=+25°C, unless otherwise noted.
Symbol
Parameter
Conditions
Typical(1)
Limits(2)
Units
(Limit)
SMBDAT, SMBCLK INPUTS
VIN(1)
VIN(0)
VIN(HYST)
IIN(1)
Logical “1” Input Voltage
Logical “0”Input Voltage
2.1
0.8
V (min)
V (max)
mV
SMBDAT and SMBCLK Digital Input Hysteresis
Logical “1” Input Current
400
0.005
−0.005
5
VIN = VDD
10
µA (max)
µA (max)
pF
IIN(0)
Logical “0” Input Current
VIN = 0V
-10
CIN
Input Capacitance
A0 DIGITAL INPUT
VIH
VIM
Input High Voltage
0.90 × VDD
0.57 × VDD
0.43 × VDD
0.10 × VDD
−10
V (min)
V (max)
V (min)
V (max)
µA (min)
µA (max)
pF
Input Middle Voltage
VIL
IIN(1)
IIN(0)
CIN
Input Low Voltage
Logical "1" Input Current
Logical "0" Input Current
Input Capacitance
VIN = VDD
VIN = 0V
−0.005
0.005
5
10
SMBDAT, TCRIT1, TCRIT2, TCRIT3 DIGITAL OUTPUTS
IOH High Level Output Current
VOL(SMBDAT) SMBus Low Level Output Voltage
VOH = VDD
10
µA (max)
IOL = 4 mA
IOL = 6 mA
0.4
0.6
V (max)
V (max)
VOL(TCRIT)
COUT
TCRIT1, TCRIT2, TCRIT3 Low Level Output
Voltage
IOL= 6 mA
0.4
V (max)
Digital Output Capacitance
5
pF
(1) Typicals are at TA = 25°C and represent most likely parametric norm.
(2) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
SMBus DIGITAL SWITCHING CHARACTERISTICS
Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80
pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
The switching characteristics of the LM95213 fully meet or exceed the published specifications of the SMBus version 2.0. The
following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95213. They
adhere to but are not necessarily the SMBus bus specifications.
Symbol
Parameter
Conditions
Typical(1)
Limits(2)
Units
(Limit)
fSMB
SMBus Clock Frequency
100
10
kHz (max)
kHz (min)
tLOW
SMBus Clock Low Time
from VIN(0)max to VIN(0)max
from VIN(1)min to VIN(1)min
4.7
25
µs (min)
ms (max)
tHIGH
tR,SMB
tF,SMB
tOF
SMBus Clock High Time
SMBus Rise Time
SMBus Fall Time
4.0
µs (min)
µs (max)
µs (max)
ns (max)
(3)
See
1
(4)
See
0.3
Output Fall Time
CL = 400 pF,
250
(4)
IO = 3 mA,
(1) Typicals are at TA = 25°C and represent most likely parametric norm.
(2) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
(3) The output rise time is measured from (VIN(0)max − 0.15V) to (VIN(1)min + 0.15V).
(4) The output fall time is measured from (VIN(1)min + 0.15V) to (VIN(0)max − 0.15V).
6
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SMBus DIGITAL SWITCHING CHARACTERISTICS
Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80
pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
The switching characteristics of the LM95213 fully meet or exceed the published specifications of the SMBus version 2.0. The
following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95213. They
adhere to but are not necessarily the SMBus bus specifications.
Symbol
Parameter
Conditions
Typical(1)
Limits(2)
Units
(Limit)
tTIMEOUT SMBDAT and SMBCLK Time Low for Reset of
25
35
ms (min)
ms (max)
(5)
Serial Interface
tSU;DAT
tHD;DAT
Data In Setup Time to SMBCLK High
Data Out Stable after SMBCLK Low
250
ns (min)
300
1075
ns (min)
ns (max)
tHD;STA
Start Condition SMBDAT Low to SMBCLK Low
(Start condition hold before the first clock falling
edge)
100
ns (min)
tSU;STO
tSU;STA
tBUF
Stop Condition SMBCLK High to SMBDAT Low
(Stop Condition Setup)
100
0.6
1.3
ns (min)
µs (min)
µs (min)
SMBus Repeated Start-Condition Setup Time,
SMBCLK High to SMBDAT Low
SMBus Free Time Between Stop and Start
Conditions
(5) Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM95213's SMBus state machine,
therefore setting SMBDAT and SMBCLK pins to a high impedance state.
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tLOW
tR
tF
VIH
SMBCLK V
IL
tHD;STA
tHD;DAT
tSU;STA
tHIGH
tSU;STO
tBUF
tSU;DAT
VIH
VIL
SMBDAT
P
S
S
P
Figure 2. SMBus Communication
Pin #
1
Label
NC
Circuit
Circuits for Pin ESD Protection Structure
–
A
–
V+
2
VDD
NC
D2
3
PIN
ESD
CLAMP
4
NC
–
D3
D1
6.5V
5
D-
A
A
A
–
GND
6
D2+
D1+
GND
A0
Circuit A
7
8
9
B
B
B
B
B
B
PIN
D1
10
11
12
13
14
TCRIT1
TCRIT2
SMBDAT
SMBCLK
TCRIT2
SNP
GND
Circuit B
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Typical Performance Characteristics
Thermal Diode Capacitor or PCB
Leakage Current Effect on
Remote Diode Temperature Reading
Conversion Rate Effect on Average Power Supply Current
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
V
= +3.3V
= 25°C
DD
T
A
0.01
0.1
1
10
CONVERSION TIME (sec)
Figure 3.
Figure 4.
Remote Temperature Reading Sensitivity to
Thermal Diode Filter Capacitance,
Figure 5.
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FUNCTIONAL DESCRIPTION
LM95213 is an 11-bit digital temperature sensor with a 2-wire System Management Bus (SMBus) interface that
can monitor the temperature of two remote diodes as well as its own temperature. The LM95213 can be used to
very accurately monitor the temperature of up to two external devices such as microprocessors, graphics
processors or diode-connected 2N3904 transistor.
The LM95213 reports temperature in two different formats for +127.875°C/–128°C range and 0°C/255°C range.
The LM95213 has a Sigma-Delta ADC (Analog-to-Digital Converter) core which provides the first level of noise
imunity. For improved performance in a noisy environment the LM95213 includes programmable digital filters for
Remote Diode 1 and 2 temperature readings. When the digital filters are invoked the resolution for Remote Diode
1 and 2 readings increases to 0.03125°C. For maximum flexibility and best accuracy the LM95213 includes offset
registers that allow calibration of other diode types.
Diode fault detection circuitry in the LM95213 can detect the absence or fault state of a remote diode: whether
D+ is shorted to VDD, D- or ground, or whether D+ is floating.
The LM95213 TCRIT1, TCRIT2 and TCRIT3 active low outputs are triggered when any unmasked channel
exceeds its corresponding programmable limit and can be used to shutdown the system, to turn on the system
fans or as a microcontroller interrupt function. The current status of the TCRIT1, TCRIT2 and TCRIT3 pins can
be read back from the status registers via the SMBus interface. The remote channels have two separate limits
each that control the TCRIT1 and TCRIT2 pins. The TCRIT3 pin shares the limits of the TCRIT2 pin but allows
for different masking options. All limits have a shared programmable hysteresis register.
Remote Diode temperature channels have programmable digital filters in order to avoid false triggering the
TCRIT pins.
LM95213 has a three-level address pin to connect up to 3 devices to the same SMBus master. LM95213 also
has programmable conversion rate register as well as a shutdown mode for power savings. One round of
conversions can be triggered in shutdown mode by writing to the one-shot register through the SMBus interface.
LM95213 can be programmed to turn off unused channels for more power savings.
The LM95213 register set has an 8-bit data structure and includes:
1. Temperature Value Registers with signed format
–
–
–
Most-Significant-Byte (MSB) and Least-Significant-Byte (LSB) Local Temperature
MSB and LSB Remote Temperature 1
MSB and LSB Remote Temperature 2
2. Temperature Value Registers with unsigned format
–
–
MSB and LSB Remote Temperature 1
MSB and LSB Remote Temperature 2
3. Diode Configuration Registers
–
–
Remote 1 Offset
Remote 2 Offset
4. General Configuration Registers
–
–
–
–
Configuration (Standby, Conversion Rate)
Channel Conversion Enable
Filter Setting for Remote 1 and 2
1-Shot
5. Status Registers
–
–
–
–
–
Main Status Register (Busy bit, Not Ready, Status Register 1 to 4 Flags)
Status 1 (diode fault)
Status 2 (TCRIT1)
Status 3 (TCRIT2)
Status 4 (TCRIT3)
6. Mask Registers
–
–
TCRIT1 Mask
TCRIT2 Mask
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–
TCRIT3 Mask
7. Limit Registers
–
–
–
–
–
–
Local Tcrit Limit
Remote 1 Tcrit-1 Limit
Remote 2 Tcrit-1 Limit
Remote 1 Tcrit-2 and Tcrit-3 Limit
Remote 2 Tcrit-2 and Tcrit-3 Limit
Common Tcrit Hysteresis
8. Manufacturer ID Register
9. Revision ID Register
CONVERSION SEQUENCE
The LM95213 takes approximately 92 ms to convert the Local Temperature, Remote Temperatures 1 and 2, and
to update all of its registers. These conversions for each thermal diode are addressed in a round robin sequence.
Only during the conversion process the busy bit (D7) in Status register (02h) is high. The conversion rate may be
modified by the Conversion Rate bits found in the Configuration Register (03h). When the conversion rate is
modified a delay is inserted between each round of conversions, the actual time for each round remains at 92 ms
(typical all channels enabled). The time a round takes depends on the number of channels that are on. Different
conversion rates will cause the LM95213 to draw different amounts of average supply current as shown in
Figure 6. This curve assumes all the channels are on. If channels are turned off the average current will drop
since the round robin time will decrease and the shutdown time will increase during each conversion interval.
4.0
V
= +3.3V
= 25°C
DD
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
T
A
0.01
0.1
1
10
CONVERSION TIME (sec)
Figure 6. Conversion Rate Effect on Power Supply Current
POWER-ON-DEFAULT STATES
LM95213 always powers up to these known default states. The LM95213 remains in these states until after the
first conversion.
1. All Temperature readings set to 0°C until the end of the first conversion
2. Remote offset for all channels 0°C
3. Configuration: Active converting
4. Continuous conversion with all channels enabled, time = 1s
5. Enhanced digital filter enabled for Remote 1 and 2
6. Status Registers depends on state of thermal diode inputs
7. Local and Remote Temperature Limits for TCRIT1, TCRIT2 and TCRIT3 outputs:
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Output Pin
Temperature Channel Limit
Remote 2
(°C)
Remote 1
(°C)
Local
(°C)
TCRIT1
110
110
Masked,
85
TCRIT2
TCRIT3
85
85
85
Masked,
85
Masked,
85
Masked,
85
8. Manufacturers ID set to 01h
9. Revision ID set to 7Bh
SMBus INTERFACE
The LM95213 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBDAT line is
bidirectional. The LM95213 never drives the SMBCLK line and it does not support clock stretching. According to
SMBus specifications, the LM95213 has a 7-bit slave address. Three SMBus device address can be selected by
connecting A0 (pin 6) to either Low, Mid-Supply or High voltages. The LM95213 has the following SMBus slave
address:
A0 Pin State
SMBus Device Address A[6:0]
Hex
18h
2Ah
2Bh
Binary
Low
Mid-Supply
High
001 1000
010 1010
010 1011
TEMPERATURE CONVERSION SEQUENCE
Each of the 3 temperature channels of LM95213 can be turned OFF independent from each other via the
Channel Enable Register. Turning off unused channels will increase the conversion speed in the fastest
conversion speed mode. If the slower conversion speed settings are used, disabling unused channels will reduce
the average power consumption of LM95213.
DIGITAL FILTER
In order to suppress erroneous remote temperature readings due to noise as well as increase the resolution of
the temperature, the LM95213 incorporates a digital filter for Remote 1 and 2 Temperature Channels. When a
filter is enabled the filtered readings are used for the TCRIT comparisons. There are two possible digital filter
settings that are enabled through the Filter Setting Register at register address 0Fh. The filter for each channel
can be set according to the following table:
R1F[1:0] or R2F[1:0]
Filter Setting
No Filter
0
0
1
1
0
1
0
1
Filter (equivalent to Level 2 filter of the LM86/LM89)
Reserved
Enhanced Filter (Filter with transient noise clipping)
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Figure 7 describes the filter output in response to a step input and an impulse input.
a) Seventeen and fifty degree step
response
b) Impulse response with input
transients less than 4°C
c) Impulse response with input
transients great than 4°C
Figure 7. Filter Impulse and Step Response Curves
45
LM95213 with
Filter Off
43
41
39
37
35
33
31
29
27
25
LM95213 with
Filter On
0
50
100
150
200
SAMPLE NUMBER
Figure 8. Digital Filter Response in a typical processor system. The filter curves were purposely offset
for clarity.
Figure 8 shows the filter in use in a typical processor system. Note that the two curves have been purposely
offset for clarity. Inserting the filter does not induce an offset as shown.
TEMPERATURE DATA FORMAT
Temperature data can only be read from the Local and Remote Temperature value registers. The data format for
all temperature values is left justified 16-bit word available in two 8-bit registers. Unused bits will always report
"0". All temperature data is clamped and will not roll over when a temperature exceeds full-scale value.
Remote temperature data for all channels can be represented by an 11-bit, two's complement word or unsigned
binary word with an LSb (Least Significant Bit) equal to 0.125°C.
Table 2. 11-bit, 2's complement (10-bit plus sign)
Temperature
Digital Output
Binary
Hex
+125°C
+25°C
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0010 0000
7D00h
1900h
0100h
0020h
+1°C
+0.125°C
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Table 2. 11-bit, 2's complement (10-bit plus sign) (continued)
Temperature
Digital Output
Binary
Hex
0°C
−0.125°C
−1°C
0000 0000 0000 0000
1111 1111 1110 0000
1111 1111 0000 0000
1110 0111 0000 0000
1100 1001 0000 0000
0000h
FFE0h
FF00h
E700h
C900h
−25°C
−55°C
Table 3. 11-bit, unsigned binary
Temperature
Digital Output
Binary
Hex
+255.875°C
+255°C
+201°C
+125°C
+25°C
1111 1111 1110 0000
1111 1111 0000 0000
1100 1001 0000 0000
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0010 0000
0000 0000 0000 0000
FFE0h
FF00h
C900h
7D00h
1900h
0100h
0020h
0000h
+1°C
+0.125°C
0°C
When the digital filter is enabled on Remote 1 and 2 channels temperature data is represented by a 13-bit
unsigned binary or 12-bit plus sign (two's complement) word with an LSb equal to 0.03125°C.
Table 4. 13-bit, 2's complement (12-bit plus sign)
Temperature
Digital Output
Binary
Hex
+125°C
+25°C
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0000 1000
0000 0000 0000 0000
1111 1111 1111 1000
1111 1111 0000 0000
1110 0111 0000 0000
1100 1001 0000 0000
7D00h
1900h
0100h
0008h
0000h
FFF8h
FF00h
E700h
C900h
+1°C
+0.03125°C
0°C
−0.03125°C
−1°C
−25°C
−55°C
Table 5. 13-bit, unsigned binary
Temperature
Digital Output
Binary
Hex
+255.875°C
+255°C
+201°C
+125°C
+25°C
1111 1111 1110 0000
1111 1111 0000 0000
1100 1001 0000 0000
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0000 1000
0000 0000 0000 0000
FFE0h
FF00h
C900h
7D00h
1900h
0100h
0008h
0000h
+1°C
+0.03125°C
0°C
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Local Temperature data is only represented by an 11-bit, two's complement, word with an LSb equal to 0.125°C.
Table 6. 11-bit, 2's complement (10-bit plus sign)
Temperature
Digital Output
Binary
Hex
+125°C
+25°C
+1°C
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0010 0000
0000 0000 0000 0000
1111 1111 1110 0000
1111 1111 0000 0000
1110 0111 0000 0000
1100 1001 0000 0000
7D00h
1900h
0100h
0020h
0000h
FFE0h
FF00h
E700h
C900h
+0.125°C
0°C
−0.125°C
−1°C
−25°C
−55°C
SMBDAT OPEN-DRAIN OUTPUT
The SMBDAT output is an open-drain output and does not have internal pull-ups. A “high” level will not be
observed on this pin until pull-up current is provided by some external source, typically a pull-up resistor. Choice
of resistor value depends on many system factors but, in general, the pull-up resistor should be as large as
possible without effecting the SMBus desired data rate. This will minimize any internal temperature reading
errors due to internal heating of the LM95213. The maximum resistance of the pull-up to provide a 2.1V high
level, based on LM95213 specification for High Level Output Current with the supply voltage at 3.0V, is 82 kΩ
(5%) or 88.7 kΩ (1%).
TCRIT1, TCRIT2, AND TCRIT3 OUTPUTS
The LM95213's TCRIT pins are active-low open-drain outputs and do not include internal pull-up resistors. A
“high” level will not be observed on these pins until pull-up current is provided by some external source, typically
a pull-up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor
should be as large as possible without effecting the performance of the device receiving the signal. This will
minimize any internal temperature reading errors due to internal heating of the LM95213. The maximum
resistance of the pull-up to provide a 2.1V high level, based on LM95213 specification for High Level Output
Current with the supply voltage at 3.0V, is 82 kΩ (5%) or 88.7 kΩ (1%). The three TCRIT pins can each sink 6
mA of current and still guarantee a "Logic Low" output voltage of 0.4V. If all three pins are set at maximum
current this will cause a power dissipation of 7.2 mW. This power dissipation combined with a thermal resistance
of 77.8°C/W will cause the LM95213's junction temperature to rise approximately 0.6°C and thus cause the Local
temperature reading to shift. This can only be cancelled out if the environment that the LM95213 is enclosed in
has stable and controlled air flow over the LM95213, as airflow can cause the thermal resistance to change
dramatically.
TCRIT LIMITS AND TCRIT OUTPUTS
Figure 9 describes a simplified diagram of the temperature comparison and status register logic. Figure 10
describes a simplified logic diagram of the circuitry associated with the status registers, mask registers and the
TCRIT output pins.
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Status 2
(TCRIT1)
Remote Temp 2
A
B
AíB
A<B
Q
Q
Q
R2T1
R1T1
LT1
S
R
Remote 2 Tcrit-1 Limit
A
B
+
+
+
-
Remote Temp 1
A
B
AíB
A<B
S
R
Remote 1 Tcrit-1 Limit
Status 3
(TCRIT2)
A
B
R2T2
R1T2
LT2
-
A
B
AíB
A<B
S
R
Remote 2 Tcrit-2 & Tcrit-3
Limit
A
B
-
Status 4
(TCRIT3)
A
B
AíB
A<B
R2T3
R1T3
LT3
Q
Remote 1 Tcrit2 & Tcrit-3
Limit
S
R
A
B
+
-
Local Temp
A
B
AíB
A<B
Q
S
R
Local Tcrit Limit
A
B
+
-
Common Tcrit Hysteresis
Figure 9. Temperature Comparison Logic and Status Register Simplified Diagram
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a) TCRIT1 Mask Register, Status Register 1 and 2, and TCRIT1 output logic diagram.
Status 1
(Diode Fault)
R2DO
R2DS
R1DO
R1DS
Status 2
(TCRIT1)
R2T1
R1T1
LT1
TCRIT1
TCRIT1
Mask
R2T1M
R1T1M
LTM
b) TCRIT2 Mask Register, Status Register 1 and 3, and TCRIT2 output logic diagram.
Status 1
(Diode Fault)
R2DO
R2DS
R1DO
R1DS
Status 3
(TCRIT2)
R2T2
TCRIT2
R1T2
LT2
TCRIT2
Mask
R2T2M
R1T2M
LTM
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c) TCRIT3 Mask Register, Status Register 1 and 4, and TCRIT3 output logic diagram.
Status 1
(Diode Fault)
R2DO
R2DS
R1DO
R1DS
Status 4
(TCRIT3)
R2T3
R1T3
LT3
TCRIT3
TCRIT3
Mask
R2T2M
R1T2M
LTM
Figure 10. Logic diagrams for the TCRIT1, TCRIT2, and TCRIT3 outputs.
If enabled, local temperature is compared to the user programmable Local Tcrit Limit Register (Default Value =
85°C). The result of this comparison is stored in Status Register 2, Status Register 3 and Status Register 4 (see
Figure 9). The comparison result can trigger TCRIT1 pin, TCRIT2 pin or TCRIT3 pin depending on the settings in
the TCRIT1 Mask, TCRIT2 Mask and TCRIT3 Mask Registers (see Figure 10). The comparison result can also
be read back from the Status Register 2, Status Register 3 and Status Register 4.
If enabled, remote temperature 1 is compared to the user programmable Remote 1 Tcrit-1 Limit Register (Default
Value 110°C) and Remote 1 Tcrit-2 Limit Register (Default Value = 85°C). The result of this comparison is stored
in Status Register 2, Status Register 3 and Status Register 4 (see Figure 9). The comparison result can trigger
TCRIT1 pin, TCRIT2 pin or TCRIT3 pin depending on the settings in the TCRIT1 Mask, TCRIT2 Mask and
TRCIT3 Mask Registers (see Figure 10). The comparison result can also be read back from the Status Register
2, Status Register 3 and Status Register 4. The remote temperature 2 operates in a similar manner to remote
temperature 1 using its associated user programmable limit registers: Remote 2 Tcrit-1 Limit Register (Default
Value 110°C) and Remote 2 Tcrit-2 Limit Register (Default Value = 85°C).
Table 7. Limit assignments for each TCRIT output pin:
TCRIT1
TCRIT2
TCRIT3
Remote 2
Remote 1
Local
Remote 2
Tcrit-1 Limit
Remote 2
Tcrit-2 Limit
Remote 2
Tcrit-2 Limit
Remote 1
Tcrit-1 Limit
Remote 1
Tcrit-2 Limit
Remote 1
Tcrit-2 Limit
Local
Local
Local
Tcrit Limit
Tcrit Limit
Tcrit Limit
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Local Tcrit Limit
Common
Hysteresis
Local
Temperature
Local Tcrit Limit -
Common Hysteresis
T_CRITn
Output Pin
Status bit LTn
Figure 11. TCRIT response diagram (masking options not included)
The TCRIT response diagram of Figure 11 shows the local temperature interaction with the Tcrit limit and
hysteresis value. As can be seen in the diagram when the local temperature exceeds the Tcrit limit register value
the LTn Status bit is set and the T_CRITn output(s) is/are activated. The Status bit(s) and outputs are not
deactivated until the temperature goes below the value calculated by subtracting the Common Hysteresis value
programmed from the limit. This diagram mainly shows an example function of the hysteresis and is not meant to
show complete function of the possible settings and options of all the TCRIT outputs and limit values.
DIODE FAULT DETECTION
The LM95213 is equipped with operational circuitry designed to detect fault conditions concerning the remote
diodes. In the event that the D+ pin is detected as shorted to GND, D−, VDD or D+ is floating, the Remote
Temperature reading is –128.000 °C if signed format is selected and 0 °C if unsigned format is selected. In
addition, the appropriate status register bits RD1M or RD2M (D1 or D0) are set.
COMMUNICATING WITH THE LM95213
The data registers in the LM95213 are selected by the Command Register. At power-up the Command Register
is set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last
location it was set to. Each data register in the LM95213 falls into one of three types of user accessibility:
1. Read only
2. Write only
3. Write/Read same address
A Write to the LM95213 will always include the address byte and the command byte. A write to any register
requires one data byte.
Reading the LM95213 can take place either of two ways:
1. If the location latched in the Command Register is correct (most of the time it is expected that the Command
Register will point to one of the Read Temperature Registers because that will be the data most frequently
read from the LM95213), then the read can simply consist of an address byte, followed by retrieving the data
byte.
2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another
address byte will accomplish a read.
The data byte has the most significant bit first. At the end of a read, the LM95213 can accept either acknowledge
or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master
has read its last byte). It takes the LM95213 95 ms (typical, all channels enabled) to measure the temperature of
the remote diodes and internal diode. When retrieving all 11 bits from a previous remote diode temperature
measurement, the master must insure that all 11 bits are from the same temperature conversion. This may be
achieved by reading the MSB register first. The LSB will be locked after the MSB is read. The LSB will be
unlocked after being read. If the user reads MSBs consecutively, each time the MSB is read, the LSB associated
with that temperature will be locked in and override the previous LSB value locked-in.
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SMBus Timing Diagrams
1
9
1
9
SMBCLK
R/W
A2 A1 A0
SMBDAT
A6 A5
A4 A3
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95213
Ack
by
LM95213
Start by
Master
Frame 1
Frame 2
Serial Bus Address Byte
Command Byte
1
9
SMBCLK
(Continued)
SMBDAT
(Continued)
D7 D6 D5 D4 D3 D2 D1 D0
Stop
by
Ack by
LM95213
Master
Frame 3
Data Byte
Figure 12. Serial Bus Write to the internal Command Register followed by a the Data Byte
1
9
1
9
SMBCLK
SMBDAT
A6 A5 A4 A3 A2 A1 A0
R/W
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95213
Stop
by
Master
Ack by
LM95213
Start by
Master
Frame 1
Frame 2
Serial Bus Address Byte
Command Byte
Figure 13. Serial Bus Write to the Internal Command Register
1
9
1
9
SMBCLK
SMBDAT
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Ack
by
LM95213
NoAck Stop
by by
Master Master
Start by
Master
Frame 1
Frame 2
Serial Bus Address Byte
Data Byte from the LM95213
Figure 14. Serial Bus Read from a Register with the Internal Command Register preset to desired value.
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1
9
1
9
SMBCLK
SMBDAT
A6 A5 A4 A3 A2 A1 A0 R/W
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95213
Ack Repeat
by Start by
LM95213 Master
Start by
Master
Frame 1
Frame 2
Serial Bus Address Byte
Command Byte
1
9
1
9
SMBCLK
(Continued)
SMBDAT
(Continued)
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Ack
by
No Ack Stop
by
by
Master Master
LM95213
Frame 3
Frame 4
Serial Bus Address Byte
Data Byte from the LM95213
Figure 15. Serial Bus Write followed by a Repeat Start and Immediate Read
SERIAL INTERFACE RESET
In the event that the SMBus Master is RESET while the LM95213 is transmitting on the SMBDAT line, the
LM95213 must be returned to a known state in the communication protocol. This may be done in one of two
ways:
1. When SMBDAT is LOW, the LM95213 SMBus state machine resets to the SMBus idle state if either
SMBDAT or SMBCLK are held low for more than 35ms (tTIMEOUT). Note that according to SMBus
specification 2.0 all devices are to timeout when either the SMBCLK or SMBDAT lines are held low for 25-
35ms. Therefore, to insure a timeout of all devices on the bus the SMBCLK or SMBDAT lines must be held
low for at least 35ms.
2. When SMBDAT is HIGH, have the master initiate an SMBus start. The LM95213 will respond properly to an
SMBus start condition at any point during the communication. After the start the LM95213 will expect an
SMBus Address address byte.
ONE-SHOT CONVERSION
The One-Shot register is used to initiate a round of conversions and comparisons when the device is in standby
mode, after which the device returns to standby. This is not a data register and it is the write operation that
causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will
always be read from this register. All the channels that are enabled in the Channel Enable Register will be
converted once and the TCRIT1, TCRIT2 and TCRIT3 pins will reflect the comparison results based on this
round of conversion results of the channels that are not masked.
LM95213 Registers
Command register selects which registers will be read from or written to. Data for this register should be
transmitted during the Command Byte of the SMBus write communication.
P7
P6
P5
P4
P3
P2
P1
P0
Command Byte
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P0-P7: Command
Table 8. Register Summary
Register Name
Command
Byte
(Hex)
Read/
Write
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Local Temp MSB
0x10
0x20
0x11
RO
RO
RO
SIGN
1/2
64
1/4
64
32
1/8
32
16
0
8
0
4
0
4
2
0
2
1
0
1
–
–
–
Local Temp LSB
Remote Temp 1 MSB – Signed
SIGN
16
0
8
Remote Temp 1 LSB – Signed, Digital Filter Off
Remote Temp 1 LSB – Signed, Digital Filter On
Remote Temp 2 MSB – Signed
0
0x21
0x12
0x22
0x19
RO
RO
RO
RO
1/2
SIGN
1/2
1/4
64
1/8
32
0
4
0
4
0
2
0
2
0
1
0
1
–
–
–
–
1/16
16
0
1/32
8
Remote Temp 2 LSB – Signed, Digital Filter Off
Remote Temp 2 LSB – Signed, Digital Filter On
Remote Temp 1 MSB – Unsigned
0
1/4
64
1/8
32
1/16
16
1/32
8
128
Remote Temp 1 LSB – Unsigned, Digital Filter
Off
0
0
0x29
0x1A
0x2A
RO
RO
RO
1/2
128
1/2
1/4
64
1/8
32
0
4
0
0
2
0
0
1
0
–
–
–
Remote Temp 1 LSB – Unsigned, Digital Filter
On
1/16
16
0
1/32
8
Remote Temp 2 MSB – Unsigned
Remote Temp 2 LSB – Unsigned, Digital Filter
Off
0
1/4
1/8
Remote Temp 2 LSB – Unsigned, Digital Filter
On
1/16
1/32
Remote 1 Offset
0x31
0x32
0x03
0x04
0x05
0x06
0x0F
0x02
0x07
0x08
0x09
0x0A
0x0C
0x0D
0x0E
0x40
0x41
0x42
0x49
0x4A
0x5A
0xFE
0xFF
R/W
R/W
R/W
R/W
R/W
R/W
WO
RO
SIGN
32
32
STBY
–
16
16
–
8
8
4
2
1
1/2
1/2
–
0x00
0x00
0x00
0x02
0x1F
0x0F
–
Remote 2 Offset
SIGN
4
2
1
–
Configuration
–
–
–
–
Conversion Rate
–
–
–
–
–
R2CE
R2F0
–
CR1
R1CE
R1F1
–
CR0
LCE
R1F0
–
Channel Conversion Enable
Filter Setting
–
–
–
–
–
–
–
–
–
R2F1
1-shot
–
–
–
–
–
Common Status Register
Status 1 (Diode Fault)
Status 2 (TCRIT1)
Status 3 (TCRIT2)
Status 4 (TCRIT3)
TCRIT1 Mask
BUSY
NR
–
–
–
SR4F
SR3F
R2DS
R2T1
R2T2
R2T3
R2T1M
R2T2M
R2T2M
4
SR2F
R1DO
R1T1
R1T2
R1T3
R1T1M
R1T2M
R1T2M
2
SR1F
R1DS
LT1
LT2
LT3
LTM
LTM
LTM
1
0x00
–
RO
–
–
–
–
R2DO
RO
–
–
–
–
–
–
–
–
–
8
8
8
8
8
8
0
1
–
RO
–
–
–
–
–
RO
–
–
–
–
–
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RO
–
–
–
–
0x01
0x00
0x07
0x55
0x6E
0x6E
0x55
0x55
0x0A
0x01
0x8B
TCRIT2 Mask
–
–
–
–
TCRIT3 Mask
–
–
–
–
Local Tcrit Limit
0
64
64
64
64
64
0
32
32
32
32
32
0
16
16
16
16
16
16
0
Remote 1 Tcrit-1 Limit
Remote 2 Tcrit-1 Limit
Remote 1 Tcrit-2 and Tcrit-3 Limit
Remote 2 Tcrit-2 and Tcrit-3 Limit
Common Tcrit Hysteresis
Manufacturer ID
128
128
128
128
0
4
2
1
4
2
1
4
2
1
4
2
1
4
2
1
0
0
0
0
0
1
Revision ID
RO
1
0
0
0
0
1
1
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VALUE REGISTERS
For data synchronization purposes, the MSB register should be read first if the user wants to read both MSB and
LSB registers. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If the
user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be
locked in and override the previous LSB value locked-in.
Local Value Registers
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Local Temp MSB
Local Temp LSB
0x10
0x20
RO
RO
SIGN
1/2
64
32
16
0
8
0
4
0
2
0
1
0
–
–
1/4
1/8
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
3
2
1
0
SIGN
64
32
16
8
RO
RO
RO
RO
RO
RO
RO
RO
Sign bit
The Local temperature MSB value register
range is +127°C to −128°C. The value
programmed in this register is used to
determine a local temperature error event.
bit weight 64°C
bit weight 32°C
bit weight 16°C
bit weight 8°C
bit weight 4°C
bit weight 2°C
bit weight 1°C
4
2
1
Bit(s)
Bit Name
Read/
Write
Description
7
1/2
1/4
1/8
0
RO
RO
RO
RO
bit weight 1/2°C (0.5°C)
The Local Limit register range is 0°C to
127°C. The value programmed in this
register is used to determine a local
temperature error event.
6
bit weight 1/4°C (0.25°C)
bit weight 1/8°C (0.125°C)
5
4-0
Reserved – will report "0" when read.
Remote Temperature Value Registers with Signed Format
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Remote Temp 1 MSB – Signed
0x11
0x21
0x12
0x22
RO
SIGN
1/2
64
1/8
64
32
0
16
0
8
0
8
0
4
0
4
0
2
0
2
0
1
0
1
0
–
–
–
–
Remote Temp 1 LSB – Signed, Digital
Filter Off
RO
RO
RO
Remote Temp 1 LSB – Signed, Digital
Filter On
1/16
32
0
1/32
16
0
Remote Temp 2 MSB – Signed
SIGN
1/2
Remote Temp 2 LSB – Signed, Digital
Filter Off
1/8
Remote Temp 2 LSB – Signed, Digital
Filter On
1/16
1/32
The Local temperature MSB value register range is +127°C to −128°C. The value programmed in this register is
used to determine a local temperature error event.
Bit(s)
Bit Name
Read/
Write
Description
7
6
SIGN
64
RO
RO
Sign bit
bit weight 64°C
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Bit(s)
Bit Name
Read/
Write
Description
5
4
3
2
1
0
32
16
8
RO
RO
RO
RO
RO
RO
bit weight 32°C
bit weight 16°C
bit weight 8°C
bit weight 4°C
bit weight 2°C
bit weight 1°C
4
2
1
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
1/2
RO
RO
RO
RO
bit weight 1/2°C (0.5°C)
bit weight 1/4°C (0.25°C)
bit weight 1/8°C (0.125°C)
1/4
1/8
0 or 1/16
When the digital filter is disabled this bit will always read "0".
When the digital filter is enabled this bit will report 1/16°C (0.0625°C) bit state.
3
0 or 1/32
0
RO
RO
When the digital filter is disabled this bit will always read "0".
When the digital filter is enabled this bit will report 1/32°C (0.03125°C) bit state.
2-0
Reserved – will report "0" when read.
Remote Temperature Value Registers with Unsigned Format
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Remote Temp 1 MSB – Unsigned
0x19
0x29
0x1A
0x2A
RO
128
1/2
128
1/2
64
1/8
64
32
0
16
0
8
0
8
0
4
0
4
0
2
0
2
0
1
0
1
0
–
–
–
–
Remote Temp 1 LSB – Unsigned,
Digital Filter Off
RO
RO
RO
Remote Temp 1 LSB – Unsigned,
Digital Filter On
1/16
32
0
1/32
16
0
Remote Temp 2 MSB – Unsigned
Remote Temp 2 LSB – Unsigned,
Digital Filter Off
1/8
Remote Temp 2 LSB – Unsigned,
Digital Filter On
1/16
1/32
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
3
2
1
0
SIGN
64
32
16
8
RO
RO
RO
RO
RO
RO
RO
RO
bit weight 128°C
bit weight 64°C
bit weight 32°C
bit weight 16°C
bit weight 8°C
bit weight 4°C
bit weight 2°C
bit weight 1°C
4
2
1
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
1/2
RO
RO
RO
RO
bit weight 1/2°C (0.5°C)
1/4
bit weight 1/4°C (0.25°C)
bit weight 1/8°C (0.125°C)
1/8
0 or 1/16
When the digital filter is disabled this bit will always read "0".
When the digital filter is enabled this bit will report 1/16°C (0.0625°C) bit state.
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Bit(s)
3
Bit Name
Read/
Write
Description
0 or 1/32
0
RO
When the digital filter is disabled this bit will always read "0".
When the digital filter is enabled this bit will report 1/32°C (0.03125°C) bit state.
2-0
RO
Reserved – will report "0" when read.
DIODE CONFIGURATION REGISTERS
Remote 1-2 Offset
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Remote 1 Offset
Remote 2 Offset
0x31
0x32
R/W
R/W
SIGN
SIGN
32
32
16
16
8
8
4
4
2
2
1
1
1/2
1/2
0x00
0x00
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
3
2
1
0
SIGN
32
16
8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Sign bit
All registers have 2’s complement format.
The offset range for each remote is
+63.5°C/−64°C. The value programmed in
this register is directly added to the actual
reading of the ADC and the modified number
is reported in the remote value registers.
bit weight 32°C
bit weight 16°C
bit weight 8°C
4
bit weight 4°C
2
bit weight 2°C
1
bit weight 1°C
1/2
bit weight 1/2°C (0.5°C)
CONFIGURATION REGISTERS
Main Configuration Register
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Configuration
0x03
R/W
–
STBY
–
–
–
–
–
–
0x00
Bit(s)
Bit Name
Read/
Write
Description
7
6
–
RO
Reserved will report "0" when read.
Software Standby
STBY
R/W
1 – standby (when in this mode one conversion sequence can be initiated by writing to the
one-shot register)
0 – active/converting
5–0
–
RO
Reserved – will report "0" when read.
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Conversion Rate Register
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Conversion Rate
0x04
R/W
–
–
–
–
–
–
CR1
CR0
0x02
Bit(s)
Bit Name
Read/
Write
Description
Reserved – will report "0" when read.
7-2
1-0
–
RO
CR[1:0]
R/W
Conversion rate control bits modify the time interval for conversion of the channels enabled.
The channels enabled are converted sequentially then standby mode enabled for the
remainder of the time interval.
CR[1:0]
00
Conversion Rate
continuous (30 ms to 104 ms)
01
0.364 s
1s
10
11
2.5 s
Channel Conversion Enable
When a conversion is disabled for a particular channel it is skipped. The continuous conversion rate is effected
all other conversion rates are not effected as extra standby time is inserted in order to compensate. See
Conversion Rate Register description.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Channel Conversion Enable
0x05
R/W
–
–
–
–
–
R2CE R1CE LCE
0x1F
Bit(s) Bit Name
Read/ Description
Write
7–3
2
–
RO
Reserved – will report "0" when read.
R2CE
R/W
Remote 2 Temperature Conversion Enable
1– Remote 2 temp conversion enabled
0– Remote 2 temp conversion disabled
1
0
R1CE
LCE
R/W
R/W
Remote 1 Temperature Conversion Enable
1– Remote 1 temp conversion enabled
0– Remote 1 temp conversion disabled
Local Temperature Conversion Enable
1– Local temp conversion enabled
0– Local temp conversion disabled
Filter Setting
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Filter Setting
0x06
R/W
–
–
–
–
R2F1 R2F0 R1F1 R1F0
0x0F
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Bit(s)
Bit Name
Read/
Write
Description
7–4
3–2
–
RO
Reserved – will report "0" when read.
R2F[1:0]
R/W
Remote Channel 2 Filter Enable Bits
R2F[1:0]
Digital Filter State
disable all digital filtering
enable basic filter
00
01
10
reserved (do not use)
enable enhanced filter
11
1–0
R1F[1:0]
R/W
Remote Channel 1 Filter Enable
R1F[1:0]
Filter State
00
01
10
11
disable all digital filtering
enable basic filter
reserved (do not use)
enable enhanced filter
1-Shot
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
1-Shot
0x0F
WO
–
–
–
–
–
–
–
–
–
Bit(s) Bit Name
Read/ Description
Write
7–0
-
WO
Writing to this register activates one conversion for all the enabled channels if
the chip is in standby mode (i.e. standby bit = 1). The actual data written does
not matter and is not stored.
STATUS REGISTERS
Common Status Register
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Common Status Register
0x02
RO
BUSY
NR
–
–
SR4F SR3F SR2F SR1F
0x00
Bit(s)
Bit Name
Read/
Write
Description
Busy bit (device converting)
7
BUSY
NR
RO
RO
RO
RO
6
Not Ready bit (30 ms), indicates power up initialization sequence is in progress
Reserved – will report "0" when read.
5–4
3
–
SR4F
Status Register 4 Flag:
1 – indicates that Status Register 4 has at least one bit set
0 – indicates that all of Status Register 4 bits are cleared
2
1
0
SR3F
SR2F
SR1F
RO
RO
RO
Status Register 3 Flag:
1 – indicates that Status Register 3 has at least one bit set
0 – indicates that all of Status Register 3 bits are cleared
Status Register 2 Flag:
1 – indicates that Status Register 2 has at least one bit set
0 – indicates that all of Status Register 2 bits are cleared
Status Register 1 Flag:
1 – indicates that Status Register 1 has at least one bit set
0 – indicates that all of Status Register 1 bits are cleared
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Status 1 Register (Diode Fault)
Status fault bits for open or shorted diode (i.e. Short Fault: D+ shorted to Ground or D-; Open Fault: D+ shorted
to VDD, or floating). During fault conditions the temperature reading is 0 °C if unsigned value registers are read or
–128.000 °C if signed value registers are read.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Status 1 (Diode Fault)
0x07
RO
0
0
0
0
R2DO R2DS R1DO R1DS
–
Bit(s) Bit Name
Read/ Description
Write
7-4
3
–
RO
RO
Reserved – will report "0" when read.
Remote 2 diode open fault status:
R2DO
1 – indicates that remote 2 diode has an "open" fault
0 – indicates that remote 2 diode does not have an "open" fault
2
1
0
R2DS
R1DO
R1DS
RO
RO
RO
Remote 2 diode short fault status:
1 – indicates that remote 2 diode has a "short" fault
0 – indicates that remote 2 diode does not have a "short" fault
Remote 1 diode open fault status:
1 – indicates that remote 1 diode has an "open" fault
0 – indicates that remote 1 diode does not have an "open" fault
Remote 1 diode short fault status:
1 – indicates that remote 1 diode has a "short" fault
0 – indicates that remote 1 diode does not have a "short" fault
Status 2 (TCRIT1)
Status bits for TCRIT1. When one or more of these bits are set and if not masked the TCRIT1 output will
activate. TCRIT1 will deactivate when all these bits are cleared.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Status 2 (TCRIT1)
0x08
RO
–
–
–
–
–
R2T1 R1T1
LT1
–
Bit(s) Bit Name
Read/ Description
Write
7–3
2
-
RO
RO
Reserved – will report "0" when read.
R2T1
Remote 2 Tcrit-1 Status:
1 – indicates that remote 2 reading is greater than or equal to the value set in Remote 2 Tcrit-1
Limit register
0 – indicates that that remote 2 reading is less than the value set in Remote 2 Tcrit-1 Limit register
minus the Common Hysteresis value
1
0
R1T1
LT1
RO
RO
Remote 1 Tcrit-1 Status:
1 – indicates that remote 1 reading is greater than or equal to the value set in Remote 1 Tcrit-1
Limit register
0 – indicates that that remote 1 reading is less than the value set in Remote 1 Tcrit-1 Limit register
minus the Common Hysteresis value
Local Tcrit Status:
1 – indicates that local reading is greater than or equal to the value set in Local Tcrit Limit register
0 – indicates that local reading is less than the value set in Local Tcrit Limit register minus the
Common Hysteresis value
Status 3 (TCRIT2)
Status bits for TCRIT2. When one or more of these bits are set and if not masked the TCRIT2 output will
activate. TCRIT2 will deactivate when all these bits are cleared.
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Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Status 3 (TCRIT2)
0x09
RO
–
–
–
–
–
R2T2 R1T2
LT2
–
Bit(s) Bit Name
Read/ Description
Write
7–3
2
-
RO
RO
Reserved – will report "0" when read.
Remote 2 Tcrit-2 Status:
R2T2
1 – indicates that remote 2 reading is greater than or equal to the value set in Remote 2 Tcrit-2
Limit register
0 – indicates that that remote 2 reading is less than the value set in Remote 2 Tcrit-2 Limit register
minus the Common Hysteresis value
1
0
R1T2
LT2
RO
RO
Remote 1 Tcrit-2 Status:
1 – indicates that remote 1 reading is greater than or equal to the value set in Remote 1 Tcrit-2
Limit register
0 – indicates that that remote 1 reading is less than the value set in Remote 1 Tcrit-2 Limit register
minus the Common Hysteresis value
Local Tcrit Status:
1 – indicates that local reading is greater than or equal to the value set in Local Tcrit Limit register
0 – indicates that local reading is less than the value set in Local Tcrit Limit register minus the
Common Hysteresis value
Status 4 (TCRIT3)
Status bits for TCRIT3. When one or more of these bits are set and if not masked the TCRIT3 output will
activate. TCRIT3 will deactivate when all these bits are cleared.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Status 4 (TCRIT3)
0x0A
RO
–
–
–
–
–
R2T3 R1T3
LT3
–
Bit(s) Bit Name
Read/ Description
Write
7–3
2
-
RO
RO
Reserved – will report "0" when read.
Remote 2 Tcrit-2 Status:
R2T3
1 – indicates that remote 2 reading is greater than or equal to the value set in Remote 2 Tcrit-2
Limit register
0 – indicates that that remote 2 reading is less than the value set in Remote 2 Tcrit-2 Limit register
minus the Common Hysteresis value
1
0
R1T3
LT3
RO
RO
Remote 1 Tcrit-2 Status:
1 – indicates that remote 1 reading is greater than or equal to the value set in Remote 1 Tcrit-2
Limit register
0 – indicates that that remote 1 reading is less than the value set in Remote 1 Tcrit-2 Limit register
minus the Common Hysteresis value
Local Tcrit Status:
1 – indicates that local reading is greater than or equal to the value set in Local Tcrit Limit register
0 – indicates that local reading is less than the value set in Local Tcrit Limit register minus the
Common Hysteresis value
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MASK REGISTERS
TCRIT1 Mask Register
The mask bits in this register allow control over which error events propagate to the TCRIT1 pin.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
TCRIT1 Mask
0x0C
R/W
–
–
–
–
–
R2T1 R1T1
LTM
0x01
M
M
Bit(s) Bit Name
Read/ Description
Write
7-3
2
–
RO
Reserved – will report "0" when read.
Remote 2 Tcrit-1 Mask:
R2T1M
R/W
1 – prevents the remote 2 temperature error event from propagating to the TCRIT1 pin
0 – allows the remote 2 temperature error event to propagate to the TCRIT1 pin
1
0
R1T1M
LTM
R/W
R/W
Remote 1 Tcrit-1 Mask:
1 – prevents the remote 1 temperature error event from propagating to the TCRIT1 pin
0 – allows the remote 1 temperature error event to propagate to the TCRIT1 pin
Local Tcrit Mask:
1 – prevents the local temperature error event from propagating to the TCRIT1 pin
0 – allows the local temperature error event to propagate to the TCRIT1 pin
TCRIT2 Mask Registers
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
TCRIT2 Mask
0x0D
R/W
–
–
–
–
–
R2T2 R1T2
LTM
0x00
M
M
Bit(s) Bit Name
Read/ Description
Write
7-3
2
–
RO
Reserved – will report "0" when read.
Remote 2 Tcrit-2 Mask:
R2T2M
R/W
1 – prevents the remote 2 temperature error event from propagating to the TCRIT2 pin
0 – allows the remote 2 temperature error event to propagate to the TCRIT2 pin
1
0
R1T2M
LTM
R/W
R/W
Remote 1 Tcrit-2 Mask:
1 – prevents the remote 1 temperature error event from propagating to the TCRIT2 pin
0 – allows the remote 1 temperature error event to propagate to the TCRIT2 pin
Local Tcrit Mask:
1 – prevents the local temperature error event from propagating to the TCRIT2 pin
0 – allows the local temperature error event to propagate to the TCRIT2 pin
TCRIT3 Mask Register
The mask bits in this register allow control over which error events propagate to the TCRIT3 pin.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
TCRIT3 Mask
0x0E
R/W
–
–
–
–
–
R2T2 R1T2
LTM
0x07
M
M
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Bit(s) Bit Name
Read/ Description
Write
7-3
2
–
RO
Reserved – will report "0" when read.
Remote 2 Tcrit-2 Mask:
R2T2M
R/W
1 – prevents the remote 2 temperature error event from propagating to the TCRIT3 pin
0 – allows the remote 2 temperature error event to propagate to the TCRIT3 pin
1
0
R1T2M
LTM
R/W
R/W
Remote 1 Tcrit-2 Mask:
1 – prevents the remote 1 temperature error event from propagating to the TCRIT3 pin
0 – allows the remote 1 temperature error event to propagate to the TCRIT3 pin
Local Tcrit Mask:
1 – prevents the local temperature error event from propagating to the TCRIT3 pin
0 – allows the local temperature error event to propagate to the TCRIT3 pin
LIMIT REGISTERS
Local Limit Register
The Local Limit register range is 0°C to 127°C. The value programmed in this register is used to determine a
local temperature error event.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Local Tcrit Limit
0x40
R/W
0
64
32
16
8
4
2
1
0x55
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
3
2
1
0
0
R0
Read only bit will always report "0".
bit weight 64°C
64
32
16
8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
bit weight 32°C
bit weight 16°C
bit weight 8°C
4
bit weight 4°C
2
bit weight 2°C
1
bit weight 1°C
Remote Limit Registers
The range for these registers is 0°C to 255°C.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
R/W
R/W
R/W
R/W
(Hex)
Remote 1 Tcrit-1 Limit (used by
TCRIT1 error events)
0x41
0x42
0x49
0x4A
128
128
128
128
64
64
64
64
32
32
32
32
16
16
16
16
8
8
8
8
4
4
4
4
2
2
2
2
1
1
1
1
0x6E
0x6E
0x55
0x55
Remote 2 Tcrit-1 Limit (used by
TCRIT1 error events)
Remote 1 Tcrit-2 and Tcrit3 Limit (used
by TCRIT2 and TCRIT3 error events)
Remote 2 Tcrit-2 and Tcrit3 Limit (used
by TCRIT2 and TCRIT3 error events)
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
128
64
R/W
R/W
R/W
bit weight 128°C
bit weight 64°C
bit weight 32°C
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Bit(s)
Bit Name
Read/
Write
Description
4
3
2
1
0
16
8
R/W
R/W
R/W
R/W
R/W
bit weight 16°C
bit weight 8°C
bit weight 4°C
bit weight 2°C
bit weight 1°C
4
2
1
Table 9.
Output Pin
TCRIT1
Remote 2
Remote 1
Local
Remote 2 Tcrit-1 Limit
Remote 2 Tcrit-2 Limit
Remote 2 Tcrit-2 Limit
Remote 1 Tcrit-1 Limit
Remote 1 Tcrit-2 Limit
Remote 1 Tcrit-2 Limit
Local Tcrit Limit
Local Tcrit Limit
Local Tcrit Limit
TCRIT2
TCRIT3
Common Tcrit Hysteresis Register
The hysteresis register range is 0°C to 32°C. The value programmed in this register is used to modify all the limit
values for decreasing temperature.
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Common Tcrit Hysteresis
0x5A
R/W
0
0
0
16
8
4
2
1
0x0A
Bit(s)
Bit Name
Read/
Write
Description
7
6
5
4
3
2
1
0
0
RO
Read only bit will always report "0".
Read only bit will always report "0".
Read only bit will always report "0".
bit weight 16°C
0
RO
0
RO
16
8
R/W
R/W
R/W
R/W
R/W
bit weight 8°C
4
bit weight 4°C
2
bit weight 2°C
1
bit weight 1°C
IDENTIFICATION REGISTERS
Register Name
Command Read/
D7
D6
D5
D4
D3
D2
D1
D0
POR
Default
(Hex)
Byte
Write
(Hex)
Manufacturer ID
Revision ID
0xFE
0xFF
RO
RO
0
1
0
0
0
0
0
0
0
1
0
0
0
1
1
1
0x01
0x8B
Applications Hints
The LM95213 can be applied easily in the same way as other integrated-circuit temperature sensors, and its
remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit
board, and because the path of best thermal conductivity is between the die and the pins, its temperature will
effectively be that of the printed circuit board lands and traces soldered to the LM95213's pins. This presumes
that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the
air temperature is much higher or lower than the surface temperature, the actual temperature of the LM95213 die
will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal
conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much
more strongly than will the air temperature.
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To measure temperature external to the LM95213's die, incorporates remote diode sensing technology. This
diode can be located on the die of a target IC, allowing measurement of the IC's temperature, independent of the
LM95213's temperature. A discrete diode can also be used to sense the temperature of external objects or
ambient air. Remember that a discrete diode's temperature will be affected, and often dominated, by the
temperature of its leads. Most silicon diodes do not lend themselves well to this application. It is recommended
that an MMBT3904 transistor base emitter junction be used with the collector tied to the base.
The LM95213 can measure a diode-connected transistor such as the MMBT3904 or the thermal diode found in
an AMD processor or FPGA. The LM95213 has been optimized to measure the remote thermal diode integrated
in a typical MMBT3904 transistor. The offset register can be used to calibrate for other thermal diodes easily.
The LM9513 deos not include TruTherm™ technology that allows sensing of sub-micron geometry process
thermal diodes. For this applicaiton the LM95233 would be better suitted.
The LM95233 has been specifically optimized to measure the remote thermal diode integrated in a typical Intel
processor on 65nm or 90 nm process or an MMBT3904 transistor. Using the Remote Diode Model Select
register found in the LM95233 any of the two remote inputs can be optimized for a typical Intel processor on
65nm or 90nm process or an MMBT3904.
DIODE NON-IDEALITY
Diode Non-Ideality Factor Effect on Accuracy
When a transistor is connected as a diode, the following relationship holds for variables VBE, T and IF:
V
h xV
BE
≈
’
◊
»
ÿ
Ÿ
⁄
t
«
…
IF = IS x e
-1
…
Ÿ
where
kT
q
Vt =
•
•
•
•
•
•
•
•
q = 1.6×10−19 Coulombs (the electron charge),
T = Absolute Temperature in Kelvin
k = 1.38×10−23 joules/K (Boltzmann's constant),
η is the non-ideality factor of the process the diode is manufactured on,
IS = Saturation Current and is process dependent,
If = Forward Current through the base-emitter junction
VBE = Base-Emitter Voltage drop
In the active region, the -1 term is negligible and may be eliminated, yielding the following equation
V
h xV
BE
≈
’
»
ÿ
t
◊Ÿ
«
…
IF = IS x e
…
Ÿ
⁄
(2)
In Equation 2, η and IS are dependant upon the process that was used in the fabrication of the particular diode.
By forcing two currents with a very controlled ratio(IF2 / IF1) and measuring the resulting voltage difference, it is
possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship:
≈IF2’
kT
≈ ’ x ln
DVBE = h x
q
«IF1◊
« ◊
(3)
Solving Equation 3 for temperature yields:
q x DVBE
T =
IF2
≈
’
h x k x ln
∆
∆
÷
÷
IF1
«
◊
(4)
33
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Equation 4 holds true when a diode connected transistor such as the MMBT3904 is used. When this “diode”
equation is applied to an integrated diode such as a processor transistor with its collector tied to GND as shown
in Figure 16 it will yield a wide non-ideality spread. This wide non-ideality spread is not due to true process
variation but due to the fact that Equation 4 is an approximation.
National invented TruTherm beta cancellation technology uses the transistor equation, Equation 5, which is a
more accurate representation of the topology of the thermal diode found in some sub-micron FPGAs or
processors.
q x DVBE
T =
I
≈
’
C2
h x k x ln∆
÷
÷
∆
IC1
«
◊
(5)
7
5
D1+
I
= I
F
E
100 pF
PROCESSOR
I
R
D-
I
MMBT3904
R
100 pF
6
D2+
I
F
LM95213
Figure 16. Thermal Diode Current Paths
TruTherm technology can be found in the LM95233 two channel remote diode sensor that is pin and register
compatible with the LM95213. The LM95213 does not support this technology.
Calculating Total System Accuracy
The voltage seen by the LM95213 also includes the IFRS voltage drop of the series resistance. The non-ideality
factor, η, is the only other parameter not accounted for and depends on the diode that is used for measurement.
Since ΔVBE is proportional to both η and T, the variations in η cannot be distinguished from variations in
temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly add to the
inaccuracy of the sensor. For the for Intel processor on 65 nm process, Intel specifies a +4.06%/−0.897%
variation in η from part to part when the processor diode is measured by a circuit that assumes diode equation,
Equation 4, as true. As an example, assume a temperature sensor has an accuracy specification of ±1.0°C at a
temperature of 80°C (353 Kelvin) and the processor diode has a non-ideality variation of +1.19%/−0.27%. The
resulting system accuracy of the processor temperature being sensed will be:
TACC = + 1.0°C + (+4.06% of 353 K) = +15.3 °C
and
TACC = - 1.0°C + (−0.89% of 353 K) = −4.1 °C
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The next error term to be discussed is that due to the series resistance of the thermal diode and printed circuit
board traces. The thermal diode series resistance is specified on most processor data sheets. For Intel
processors in 65 nm process, this is specified at 4.52Ω typical. The LM95213 accommodates the typical series
resistance of Intel Processor on 65 nm process. The error that is not accounted for is the spread of the
processor's series resistance, that is 2.79Ω to 6.24Ω or ±1.73Ω. The equation to calculate the temperature error
due to series resistance (TER) for the LM95213 is simply:
º
W
≈
’
÷
C
TER = 0.62
x R
PCB
∆
«
◊
(6)
Solving Equation 6 for RPCB equal to ±1.73Ω results in the additional error due to the spread in the series
resistance of ±1.07°C. The spread in error cannot be canceled out, as it would require measuring each individual
thermal diode device. This is quite difficult and impractical in a large volume production environment.
Equation 6 can also be used to calculate the additional error caused by series resistance on the printed circuit
board. Since the variation of the PCB series resistance is minimal, the bulk of the error term is always positive
and can simply be cancelled out by subtracting it from the output readings of the LM95213.
Processor Family
Diode Equation ηD, non-ideality
Series R,Ω
min
typ
max
Pentium III CPUID 67h
1
1.0065
1.0125
Pentium III CPUID 68h/PGA370Socket/
Celeron
1.0057
1.008
1.0125
Pentium 4, 423 pin
Pentium 4, 478 pin
0.9933
0.9933
1.0045
1.0045
1.0368
1.0368
Pentium 4 on 0.13 micron process, 2 - 3.06
GHz
1.0011
1.0021
1.0030
3.64
Pentium 4 on 90 nm process
Intel Processor on 65 nm process
Pentium M (Centrino)
MMBT3904
1.0083
1.000
1.011
1.009
1.023
1.050
3.33
4.52
3.06
1.00151
1.00220
1.003
1.00289
AMD Athlon MP model 6
AMD Athlon 64
1.002
1.008
1.008
1.008
1.016
1.096
1.096
1.008
AMD Opteron
1.008
AMD Sempron
1.00261
0.93
Compensating for Different Non-Ideality
In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a
particular processor. National Semiconductor temperature sensors are always calibrated to the typical non-
ideality and series resistance of a given processor type. The LM95213 is calibrated for non-ideality factor and
series resistance values supporting the MMBT3904 transistor without the requirement for additional trims. When
a temperature sensor calibrated for a particular processor type is used with a different processor type, additional
errors are introduced.
Temperature errors associated with non-ideality of different processor types may be reduced in a specific
temperature range of concern through use of software calibration. Typical Non-ideality specification differences
cause a gain variation of the transfer function, therefore the center of the temperature range of interest should be
the target temperature for calibration purposes. The following equation can be used to calculate the temperature
correction factor (TCF) required to compensate for a target non-ideality differing from that supported by the
LM95213.
hS - hPROCESSOR
≈
«
’
◊
x
(TCR + 273K)
TCF
=
hS
where
•
•
ηS = LM95213 non-ideality for accuracy specification
ηPROCESSOR = Processor thermal diode typical non-ideality
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•
TCR = center of the temperature range of interest in °C
(7)
The correction factor should be directly added to the temperature reading produced by the LM95213. For
example when using the LM95213 to measure a AMD Athlon processor, with a typical non-ideality of 1.008, for a
temperature range of 60 °C to 100 °C the correction factor would calculate to:
1.003 - 1.008
(80 + 273) = -1.75oC
≈
«
’
◊
TCF
=
∂
1.003
(8)
Therefore, 1.75°C should be subtracted from the temperature readings of the LM95213 to compensate for the
differing typical non-ideality target.
PCB LAYOUT FOR MINIMIZING NOISE
Figure 17. Ideal Diode Trace Layout
In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced
on traces running between the remote temperature diode sensor and the LM95213 can cause temperature
conversion errors. Keep in mind that the signal level the LM95213 is trying to measure is in microvolts. The
following guidelines should be followed:
1. VDD should be bypassed with a 0.1 µF capacitor in parallel with 100 pF. The 100 pF capacitor should be
placed as close as possible to the power supply pin. A bulk capacitance of approximately 10 µF needs to be
in the near vicinity of the LM95213.
2. A 100 pF diode bypass capacitor is recommended to filter high frequency noise but may not be necessary.
Make sure the traces to the 100 pF capacitor are matched. Place the filter capacitors close to the LM95213
pins.
3. Ideally, the LM95213 should be placed within 10 cm of the Processor diode pins with the traces being as
straight, short and identical as possible. Trace resistance of 1Ω can cause as much as 0.62°C of error. This
error can be compensated by using simple software offset compensation.
4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This
GND guard should not be between the D+ and D− lines. In the event that noise does couple to the diode
lines it would be ideal if it is coupled common mode. That is equally to the D+ and D− lines.
5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.
6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be
kept at least 2 cm apart from the high speed digital traces.
7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should
cross at a 90 degree angle.
8. The ideal place to connect the LM95213's GND pin is as close as possible to the Processors GND
associated with the sense diode.
9. Leakage current between D+ and GND and between D+ and D− should be kept to a minimum. Thirteen
nano-amperes of leakage can cause as much as 0.2°C of error in the diode temperature reading. Keeping
the printed circuit board as clean as possible will minimize leakage current.
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Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV
below GND, may prevent successful SMBus communication with the LM95213. SMBus no acknowledge is the
most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of
communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a
system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3 dB
corner frequency of about 40 MHz is included on the LM95213's SMBCLK input. Additional resistance can be
added in series with the SMBDAT and SMBCLK lines to further help filter noise and ringing. Minimize noise
coupling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines
containing high speed data communications cross at right angles to the SMBDAT and SMBCLK lines.
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REVISION HISTORY
Changes from Original (March 2013) to Revision A
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 37
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PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
PACKAGING INFORMATION
Orderable Device
LM95213CISD/NOPB
LM95213CISDX/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 140
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
WSON
WSON
NHL
14
14
1000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-1-260C-UNLIM
95213CI
95213CI
ACTIVE
NHL
4500
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 140
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM95213CISD/NOPB
LM95213CISDX/NOPB
WSON
WSON
NHL
NHL
14
14
1000
4500
178.0
330.0
12.4
12.4
4.3
4.3
4.3
4.3
1.3
1.3
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM95213CISD/NOPB
LM95213CISDX/NOPB
WSON
WSON
NHL
NHL
14
14
1000
4500
210.0
367.0
185.0
367.0
35.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NHL0014B
SDA14B (Rev A)
www.ti.com
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