LM95213 [TI]

2-Diode Input and Local Digital Temperature Sensor with Two-Wire Interface and TCRIT Outputs;
LM95213
型号: LM95213
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2-Diode Input and Local Digital Temperature Sensor with Two-Wire Interface and TCRIT Outputs

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LM95213  
www.ti.com  
SNIS147A MARCH 2007REVISED MARCH 2013  
2-Diode Input and Local Digital Temperature Sensor with Two-Wire Interface and TCRIT  
Outputs  
Check for Samples: LM95213  
1
FEATURES  
DESCRIPTION  
The LM95213 is an 11-bit digital temperature sensor  
with a 2-wire System Management Bus (SMBus)  
interface that can monitor the temperature of two  
remote diodes as well as its own temperature. The  
LM95213 can be used to very accurately monitor the  
temperature of up to two external devices such as  
microprocessors, graphics processors or diode-  
connected 2N3904s.  
23  
Accurately Senses Die Temperature of 2  
Remote ICs or Diode Junctions and Local  
Temperature  
0.125°C LSb Temperature Resolution  
0.03125°C LSb Remote Temperature  
Resolution with Digital Filter Enabled  
+127.875°C/–128°C and 0°C/255°C Remote  
Ranges  
The LM95213 reports temperature in two different  
formats for +127.875°C/–128°C range and 0°C/255°C  
range. The LM95213 TCRIT1, TCRIT2 and TCRIT3  
outputs are triggered when any unmasked channel  
exceeds its corresponding programmable limit and  
can be used to shutdown the system, to turn on the  
system fans or as a microcontroller interrupt function.  
The current status of the TCRIT1, TCRIT2 and  
TCRIT3 pins can be read back from the status  
registers. Mask registers are available for further  
control of the TCRIT outputs.  
Programmable Digital Filters and Analog Front  
End Filter  
Remote Diode Fault Detection, Model  
Selection and Offset Correction  
Mask and Status Register Support  
3 Programmable TCRIT Outputs with  
Programmable Shared Hysteresis  
Programmable Conversion Rate and Shutdown  
Mode One-Shot Conversion Control  
The LM95213's remote temperature channels have  
programmable digital filters to minimize unwanted  
TCRIT events when temperature spikes are  
encountered.  
SMBus 2.0 Compatible Interface, Supports  
TIMEOUT  
Three-Level Address Pin  
14-Pin WSON Package  
For optimum flexibility and accuracy each LM95213  
channel includes offset correction registers for  
targeting diodes other than the 2N3904. A three level  
address pin allows connection of up to 3 LM95213s  
to the same SMBus master. The LM95213 includes  
power saving functions such as: programmable  
conversion rate, shutdown mode, and turn off of  
unused channels.  
APPLICATIONS  
Processor/Computer System Thermal  
Management (e.g. Laptop, Desktop,  
Workstations, Server)  
Electronic Test Equipment  
Office Electronics  
Table 1. Key Specifications  
VALUE  
±2.0  
UNIT  
°C (max)  
°C (max)  
V
Local Temperature Accuracy  
Remote Diode Temperature Accuracy  
Supply Voltage  
±1.1  
3.0 to 3.6  
0.57  
Average Supply Current (1Hz conversion rate)  
mA (typ)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
TruTherm is a trademark of Texas Instruments.  
2
3
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2013, Texas Instruments Incorporated  
LM95213  
SNIS147A MARCH 2007REVISED MARCH 2013  
www.ti.com  
Connection Diagram  
NC  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
TCRIT3  
SMBCLK  
SMBDAT  
TCRIT2  
TCRIT1  
A0  
V
DD  
NC  
NC  
D-  
LM95213  
D2+  
D1+  
8
GND  
Figure 1. 14-Lead WSON - TOP VIEW  
See NHL0014B Package  
Simplified Block Diagram  
3.0V-3.6V  
LM95213  
Local  
Diode Selector  
D-S Converter  
11-Bit or  
10-Bit Plus Sign  
Remote  
Diode1  
Selector  
Remote  
10-bit Plus Sign  
Local  
Local  
Temperature  
Registers  
D1+  
D2+  
TCRIT1  
Remote 1  
Temperature  
Registers  
Temperature  
Sensor  
Circuitry  
T_CRIT  
Control  
Logic  
Remote  
Diode2  
Selector  
Remote 2  
Temperature  
Registers  
TCRIT2  
Remote 1  
Digital Filter  
D-  
Limit, Status  
and  
Mask  
Remote 1 Offset  
Register  
TCRIT3  
Registers  
Remote 2  
Digital Filter  
SMBDAT  
Remote 2 Offset  
Register  
SMBus  
Interface  
SMBCLK  
Conversion Rate  
Rgister  
Control Logic  
Diode  
Configuration  
Registers  
General  
Configuration  
Registers  
2
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LM95213  
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SNIS147A MARCH 2007REVISED MARCH 2013  
PIN DESCRIPTIONS  
Label  
Pin #  
Function  
Typical Connection  
NC  
1
2
No Connect  
Not connected. May be left floating, connected to GND or VDD.  
VDD  
Positive Supply Voltage Input  
DC Voltage from 3.0 V to 3.6 V. VDD should be bypassed with  
a 0.1µF capacitor in parallel with 100pF. The 100pF capacitor  
should be placed as close as possible to the power supply pin.  
Noise should be kept below 200 mVp-p, a 10 µF capacitor may  
be required to achieve this.  
NC  
NC  
D  
3
4
5
No Connect  
Not connected. May be left floating, connected to GND or VDD  
.
.
No Connect  
Not connected. May be left floating, connected to GND or VDD  
Diode Return Current Sink  
To all Diode Cathodes. Common D- pin for all two remote  
diodes.  
D2+  
6
Diode Current Source  
To second Diode Anode. Connected to remote discrete diode-  
connected transistor junction or to the diode-connected  
transistor junction on a remote IC whose die temperature is  
being sensed. A capacitor is not required between D2+ and D-.  
A 100 pF capacitor between D2+ and D- can be added and  
may improve perfomance in noisy systems. Float this pin if this  
thermal diode is not used.  
D1+  
7
Diode Current Source  
To first Diode Anode. Connected to remote discrete diode-  
connected transistor junction or to the diode-connected  
transistor junction on a remote IC whose die temperature is  
being sensed. A capacitor is not required between D1+ and D-.  
A 100 pF capacitor between D1+ and D- can be added and  
may improve perfomance in noisy systems. Float this pin if this  
thermal diode is not used.  
GND  
A0  
8
9
Power Supply Ground  
Dgital Input  
System low noise ground.  
SMBus slave address select pin. Selects one of three  
addresses. Can be tied to VDD, GND, or to the middle of a  
resistor divider connected between VDD and GND.  
TCRIT1  
TCRIT2  
SMBDAT  
10  
11  
12  
Digital Output, Open-Drain  
Digital Output, Open-Drain  
Critical temperature output 1. Requires pull-up resistor. Active  
"LOW".  
Critical temperature output 2. Requires pull-up resistor. Active  
"LOW".  
SMBus Bi-Directional Data Line, From and to Controller; may require an external pull-up resistor  
Open-Drain Output  
SMBCLK  
TCRIT3  
13  
14  
SMBus Clock Input  
From Controller; may require an external pull-up resistor  
Digital Output, Open-Drain  
Critical temperature output 3. Requires pull-up resistor. Active  
"LOW".  
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LM95213  
SNIS147A MARCH 2007REVISED MARCH 2013  
www.ti.com  
Typical Application  
+3.3V  
Standby  
C3  
10 mF  
C2  
0.1 mF  
C1*  
100 pF  
R1  
10k  
R2  
R3 R4  
R5  
10k 10k 1.3k 1.3k  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
NC  
V
TCRIT3  
SMBCLK  
SMBCLK  
SMBDAT  
DD  
NC  
NC  
D-  
SMBDAT  
TCRIT2  
TCRIT1  
SO  
DIMM  
D2+  
D1+  
A0  
C4**  
100 pF  
8
Q1  
MMBT3904  
GND  
SMBus  
Master  
C5**  
100 pF  
LM95213  
PROCESSOR  
* Note, place close to LM95213 pins.  
** Note, optional - place close to LM95213 pins.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)  
Absolute Maximum Ratings  
Supply Voltage  
0.3V to 6.0V  
Voltage at SMBDAT, SMBCLK,  
TCRIT1, TCRIT2, TCRIT3  
0.5V to 6.0V  
0.3V to (VDD + 0.3V)  
±1 mA  
Voltage at Other Pins  
DInput Current  
(2)  
Input Current at All Other Pins  
±5 mA  
(2)  
Package Input Current  
30 mA  
SMBDAT, TCRIT1, TCRIT2,  
TCRIT3 Output Sink Current  
10 mA  
65°C to +150°C  
2000V  
Storage Temperature  
(3)  
ESD Susceptibility  
Human Body Model  
Machine Model  
200V  
Charge Device Model  
1000V  
(4)  
Soldering process must comply with reflow temperature profile specifications. Refer to http://www.ti.com/packaging  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not  
apply when operating the device beyond its rated operating conditions.  
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to  
5 mA. Parasitic components and or ESD protection circuitry are shown in the table below for the LM95213's pins.  
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. Charged  
Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated  
assembler) then rapidly being discharged.  
(4) Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.  
4
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SNIS147A MARCH 2007REVISED MARCH 2013  
Operating Ratings(1)(2)  
Operating Temperature Range  
Electrical Characteristics Temperature Range  
LM95213CISD  
40°C to +140°C  
TMIN TA TMAX  
40°C TA +125°C  
Supply Voltage Range (VDD  
)
+3.0V to +3.6V  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not  
apply when operating the device beyond its rated operating conditions.  
(2) Thermal resistance junction-to-ambient when attached to a 4 layer printed circuit board per JEDEC standard JESD51-7:  
14-lead WSON = 90°C/W (no thermal vias, no airflow)  
14-lead WSON = 63°C/W (1 thermal via, no airflow)  
14-lead WSON = 43°C/W (6 thermal vias, no airflow)  
14-lead WSON = 31°C/W (6 thermal vias, 900 ln. ft. / min. airflow)  
Note, all quoted values include +15% error factor from nominal value.  
Temperature-to-Digital Converter Electrical Characteristics  
Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMIN  
TA TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.  
Parameter  
Conditions  
Typical(1)  
Limits(2)  
Units  
(Limit)  
(3)  
Temperature Error Using Local Diode  
Temperature Error Using Remote Diode  
TA = -40°C to +125°C,  
±1  
±2  
°C (max)  
°C (max)  
(4)  
TA = +25°C to +85°C  
TD = +60°C to +100°C  
MMBT3904  
Transistor  
±1.1  
TA = +25°C to +85°C  
TD = 40°C to +125°C  
MMBT3904  
Transistor  
±1.3  
±3.0  
±3.3  
°C (max)  
°C (max)  
°C (max)  
TA = 40°C to +85°C  
TD = 40°C to +125°C  
MMBT3904  
Transistor  
TA = 40°C to +85°C  
TD = 125°C to +140°C  
MMBT3904  
Transistor  
Local Diode Measurement Resolution  
Remote Diode Measurement Resolution  
11  
0.125  
11  
Bits  
°C  
Digital Filter Off  
Bits  
0.125  
13  
°C  
Digital Filter On (Remote Diodes 1 and 2  
only)  
Bits  
0.03125  
1100  
31  
°C  
Conversion Time of All Temperatures at the  
All Channels are Enabled in Default State  
1 External Channel  
1210  
34  
ms (max)  
ms (max)  
ms (max)  
µA (max)  
(5)  
Fastest Setting  
Local only  
30  
33  
(6)  
Quiescent Current  
SMBus Inactive, 1Hz Conversion Rate,  
channels in default state  
570  
800  
Shutdown  
360  
0.4  
160  
10  
µA  
V
DSource Voltage  
Remote Diode Source Current  
High level  
230  
µA (max)  
Low level  
Power-On Reset Threshold  
Measured on VDD input, falling edge  
2.8  
1.6  
V (max)  
V (min)  
TCRIT1 Pin Temperature Threshold  
TCRIT2 Pin Temperature Threshold  
Default Diodes only  
Default all channels  
+110  
+85  
°C  
°C  
(1) Typicals are at TA = 25°C and represent most likely parametric norm.  
(2) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).  
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the  
internal power dissipation of the LM95213 and the thermal resistance. See Thermal Resistance note under Operating Ratings for the  
thermal resistance to be used in the self-heating calculation.  
(4) The accuracy of the LM95213CISD is guaranteed when using a typical thermal diode of an MMBT3904 diode-connected transistor. For  
further information on other thermal diodes see applications DIODE NON-IDEALITY.  
(5) This specification is provided only to indicate how often temperature data is updated. The LM95213 can be read at any time without  
regard to conversion state (and will yield last conversion result).  
(6) Quiescent current will not increase substantially with an SMBus communication.  
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Logic Electrical Characteristics  
DIGITAL DC CHARACTERISTICS  
Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMIN to  
TMAX; all other limits TA= TJ=+25°C, unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Typical(1)  
Limits(2)  
Units  
(Limit)  
SMBDAT, SMBCLK INPUTS  
VIN(1)  
VIN(0)  
VIN(HYST)  
IIN(1)  
Logical “1” Input Voltage  
Logical “0”Input Voltage  
2.1  
0.8  
V (min)  
V (max)  
mV  
SMBDAT and SMBCLK Digital Input Hysteresis  
Logical “1” Input Current  
400  
0.005  
0.005  
5
VIN = VDD  
10  
µA (max)  
µA (max)  
pF  
IIN(0)  
Logical “0” Input Current  
VIN = 0V  
-10  
CIN  
Input Capacitance  
A0 DIGITAL INPUT  
VIH  
VIM  
Input High Voltage  
0.90 × VDD  
0.57 × VDD  
0.43 × VDD  
0.10 × VDD  
10  
V (min)  
V (max)  
V (min)  
V (max)  
µA (min)  
µA (max)  
pF  
Input Middle Voltage  
VIL  
IIN(1)  
IIN(0)  
CIN  
Input Low Voltage  
Logical "1" Input Current  
Logical "0" Input Current  
Input Capacitance  
VIN = VDD  
VIN = 0V  
0.005  
0.005  
5
10  
SMBDAT, TCRIT1, TCRIT2, TCRIT3 DIGITAL OUTPUTS  
IOH High Level Output Current  
VOL(SMBDAT) SMBus Low Level Output Voltage  
VOH = VDD  
10  
µA (max)  
IOL = 4 mA  
IOL = 6 mA  
0.4  
0.6  
V (max)  
V (max)  
VOL(TCRIT)  
COUT  
TCRIT1, TCRIT2, TCRIT3 Low Level Output  
Voltage  
IOL= 6 mA  
0.4  
V (max)  
Digital Output Capacitance  
5
pF  
(1) Typicals are at TA = 25°C and represent most likely parametric norm.  
(2) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).  
SMBus DIGITAL SWITCHING CHARACTERISTICS  
Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80  
pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.  
The switching characteristics of the LM95213 fully meet or exceed the published specifications of the SMBus version 2.0. The  
following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95213. They  
adhere to but are not necessarily the SMBus bus specifications.  
Symbol  
Parameter  
Conditions  
Typical(1)  
Limits(2)  
Units  
(Limit)  
fSMB  
SMBus Clock Frequency  
100  
10  
kHz (max)  
kHz (min)  
tLOW  
SMBus Clock Low Time  
from VIN(0)max to VIN(0)max  
from VIN(1)min to VIN(1)min  
4.7  
25  
µs (min)  
ms (max)  
tHIGH  
tR,SMB  
tF,SMB  
tOF  
SMBus Clock High Time  
SMBus Rise Time  
SMBus Fall Time  
4.0  
µs (min)  
µs (max)  
µs (max)  
ns (max)  
(3)  
See  
1
(4)  
See  
0.3  
Output Fall Time  
CL = 400 pF,  
250  
(4)  
IO = 3 mA,  
(1) Typicals are at TA = 25°C and represent most likely parametric norm.  
(2) Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).  
(3) The output rise time is measured from (VIN(0)max 0.15V) to (VIN(1)min + 0.15V).  
(4) The output fall time is measured from (VIN(1)min + 0.15V) to (VIN(0)max 0.15V).  
6
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LM95213  
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SMBus DIGITAL SWITCHING CHARACTERISTICS  
Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80  
pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.  
The switching characteristics of the LM95213 fully meet or exceed the published specifications of the SMBus version 2.0. The  
following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95213. They  
adhere to but are not necessarily the SMBus bus specifications.  
Symbol  
Parameter  
Conditions  
Typical(1)  
Limits(2)  
Units  
(Limit)  
tTIMEOUT SMBDAT and SMBCLK Time Low for Reset of  
25  
35  
ms (min)  
ms (max)  
(5)  
Serial Interface  
tSU;DAT  
tHD;DAT  
Data In Setup Time to SMBCLK High  
Data Out Stable after SMBCLK Low  
250  
ns (min)  
300  
1075  
ns (min)  
ns (max)  
tHD;STA  
Start Condition SMBDAT Low to SMBCLK Low  
(Start condition hold before the first clock falling  
edge)  
100  
ns (min)  
tSU;STO  
tSU;STA  
tBUF  
Stop Condition SMBCLK High to SMBDAT Low  
(Stop Condition Setup)  
100  
0.6  
1.3  
ns (min)  
µs (min)  
µs (min)  
SMBus Repeated Start-Condition Setup Time,  
SMBCLK High to SMBDAT Low  
SMBus Free Time Between Stop and Start  
Conditions  
(5) Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM95213's SMBus state machine,  
therefore setting SMBDAT and SMBCLK pins to a high impedance state.  
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tLOW  
tR  
tF  
VIH  
SMBCLK V  
IL  
tHD;STA  
tHD;DAT  
tSU;STA  
tHIGH  
tSU;STO  
tBUF  
tSU;DAT  
VIH  
VIL  
SMBDAT  
P
S
S
P
Figure 2. SMBus Communication  
Pin #  
1
Label  
NC  
Circuit  
Circuits for Pin ESD Protection Structure  
A
V+  
2
VDD  
NC  
D2  
3
PIN  
ESD  
CLAMP  
4
NC  
D3  
D1  
6.5V  
5
D-  
A
A
A
GND  
6
D2+  
D1+  
GND  
A0  
Circuit A  
7
8
9
B
B
B
B
B
B
PIN  
D1  
10  
11  
12  
13  
14  
TCRIT1  
TCRIT2  
SMBDAT  
SMBCLK  
TCRIT2  
SNP  
GND  
Circuit B  
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LM95213  
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Typical Performance Characteristics  
Thermal Diode Capacitor or PCB  
Leakage Current Effect on  
Remote Diode Temperature Reading  
Conversion Rate Effect on Average Power Supply Current  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
= +3.3V  
= 25°C  
DD  
T
A
0.01  
0.1  
1
10  
CONVERSION TIME (sec)  
Figure 3.  
Figure 4.  
Remote Temperature Reading Sensitivity to  
Thermal Diode Filter Capacitance,  
Figure 5.  
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FUNCTIONAL DESCRIPTION  
LM95213 is an 11-bit digital temperature sensor with a 2-wire System Management Bus (SMBus) interface that  
can monitor the temperature of two remote diodes as well as its own temperature. The LM95213 can be used to  
very accurately monitor the temperature of up to two external devices such as microprocessors, graphics  
processors or diode-connected 2N3904 transistor.  
The LM95213 reports temperature in two different formats for +127.875°C/–128°C range and 0°C/255°C range.  
The LM95213 has a Sigma-Delta ADC (Analog-to-Digital Converter) core which provides the first level of noise  
imunity. For improved performance in a noisy environment the LM95213 includes programmable digital filters for  
Remote Diode 1 and 2 temperature readings. When the digital filters are invoked the resolution for Remote Diode  
1 and 2 readings increases to 0.03125°C. For maximum flexibility and best accuracy the LM95213 includes offset  
registers that allow calibration of other diode types.  
Diode fault detection circuitry in the LM95213 can detect the absence or fault state of a remote diode: whether  
D+ is shorted to VDD, D- or ground, or whether D+ is floating.  
The LM95213 TCRIT1, TCRIT2 and TCRIT3 active low outputs are triggered when any unmasked channel  
exceeds its corresponding programmable limit and can be used to shutdown the system, to turn on the system  
fans or as a microcontroller interrupt function. The current status of the TCRIT1, TCRIT2 and TCRIT3 pins can  
be read back from the status registers via the SMBus interface. The remote channels have two separate limits  
each that control the TCRIT1 and TCRIT2 pins. The TCRIT3 pin shares the limits of the TCRIT2 pin but allows  
for different masking options. All limits have a shared programmable hysteresis register.  
Remote Diode temperature channels have programmable digital filters in order to avoid false triggering the  
TCRIT pins.  
LM95213 has a three-level address pin to connect up to 3 devices to the same SMBus master. LM95213 also  
has programmable conversion rate register as well as a shutdown mode for power savings. One round of  
conversions can be triggered in shutdown mode by writing to the one-shot register through the SMBus interface.  
LM95213 can be programmed to turn off unused channels for more power savings.  
The LM95213 register set has an 8-bit data structure and includes:  
1. Temperature Value Registers with signed format  
Most-Significant-Byte (MSB) and Least-Significant-Byte (LSB) Local Temperature  
MSB and LSB Remote Temperature 1  
MSB and LSB Remote Temperature 2  
2. Temperature Value Registers with unsigned format  
MSB and LSB Remote Temperature 1  
MSB and LSB Remote Temperature 2  
3. Diode Configuration Registers  
Remote 1 Offset  
Remote 2 Offset  
4. General Configuration Registers  
Configuration (Standby, Conversion Rate)  
Channel Conversion Enable  
Filter Setting for Remote 1 and 2  
1-Shot  
5. Status Registers  
Main Status Register (Busy bit, Not Ready, Status Register 1 to 4 Flags)  
Status 1 (diode fault)  
Status 2 (TCRIT1)  
Status 3 (TCRIT2)  
Status 4 (TCRIT3)  
6. Mask Registers  
TCRIT1 Mask  
TCRIT2 Mask  
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TCRIT3 Mask  
7. Limit Registers  
Local Tcrit Limit  
Remote 1 Tcrit-1 Limit  
Remote 2 Tcrit-1 Limit  
Remote 1 Tcrit-2 and Tcrit-3 Limit  
Remote 2 Tcrit-2 and Tcrit-3 Limit  
Common Tcrit Hysteresis  
8. Manufacturer ID Register  
9. Revision ID Register  
CONVERSION SEQUENCE  
The LM95213 takes approximately 92 ms to convert the Local Temperature, Remote Temperatures 1 and 2, and  
to update all of its registers. These conversions for each thermal diode are addressed in a round robin sequence.  
Only during the conversion process the busy bit (D7) in Status register (02h) is high. The conversion rate may be  
modified by the Conversion Rate bits found in the Configuration Register (03h). When the conversion rate is  
modified a delay is inserted between each round of conversions, the actual time for each round remains at 92 ms  
(typical all channels enabled). The time a round takes depends on the number of channels that are on. Different  
conversion rates will cause the LM95213 to draw different amounts of average supply current as shown in  
Figure 6. This curve assumes all the channels are on. If channels are turned off the average current will drop  
since the round robin time will decrease and the shutdown time will increase during each conversion interval.  
4.0  
V
= +3.3V  
= 25°C  
DD  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
T
A
0.01  
0.1  
1
10  
CONVERSION TIME (sec)  
Figure 6. Conversion Rate Effect on Power Supply Current  
POWER-ON-DEFAULT STATES  
LM95213 always powers up to these known default states. The LM95213 remains in these states until after the  
first conversion.  
1. All Temperature readings set to 0°C until the end of the first conversion  
2. Remote offset for all channels 0°C  
3. Configuration: Active converting  
4. Continuous conversion with all channels enabled, time = 1s  
5. Enhanced digital filter enabled for Remote 1 and 2  
6. Status Registers depends on state of thermal diode inputs  
7. Local and Remote Temperature Limits for TCRIT1, TCRIT2 and TCRIT3 outputs:  
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Output Pin  
Temperature Channel Limit  
Remote 2  
(°C)  
Remote 1  
(°C)  
Local  
(°C)  
TCRIT1  
110  
110  
Masked,  
85  
TCRIT2  
TCRIT3  
85  
85  
85  
Masked,  
85  
Masked,  
85  
Masked,  
85  
8. Manufacturers ID set to 01h  
9. Revision ID set to 7Bh  
SMBus INTERFACE  
The LM95213 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBDAT line is  
bidirectional. The LM95213 never drives the SMBCLK line and it does not support clock stretching. According to  
SMBus specifications, the LM95213 has a 7-bit slave address. Three SMBus device address can be selected by  
connecting A0 (pin 6) to either Low, Mid-Supply or High voltages. The LM95213 has the following SMBus slave  
address:  
A0 Pin State  
SMBus Device Address A[6:0]  
Hex  
18h  
2Ah  
2Bh  
Binary  
Low  
Mid-Supply  
High  
001 1000  
010 1010  
010 1011  
TEMPERATURE CONVERSION SEQUENCE  
Each of the 3 temperature channels of LM95213 can be turned OFF independent from each other via the  
Channel Enable Register. Turning off unused channels will increase the conversion speed in the fastest  
conversion speed mode. If the slower conversion speed settings are used, disabling unused channels will reduce  
the average power consumption of LM95213.  
DIGITAL FILTER  
In order to suppress erroneous remote temperature readings due to noise as well as increase the resolution of  
the temperature, the LM95213 incorporates a digital filter for Remote 1 and 2 Temperature Channels. When a  
filter is enabled the filtered readings are used for the TCRIT comparisons. There are two possible digital filter  
settings that are enabled through the Filter Setting Register at register address 0Fh. The filter for each channel  
can be set according to the following table:  
R1F[1:0] or R2F[1:0]  
Filter Setting  
No Filter  
0
0
1
1
0
1
0
1
Filter (equivalent to Level 2 filter of the LM86/LM89)  
Reserved  
Enhanced Filter (Filter with transient noise clipping)  
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Figure 7 describes the filter output in response to a step input and an impulse input.  
a) Seventeen and fifty degree step  
response  
b) Impulse response with input  
transients less than 4°C  
c) Impulse response with input  
transients great than 4°C  
Figure 7. Filter Impulse and Step Response Curves  
45  
LM95213 with  
Filter Off  
43  
41  
39  
37  
35  
33  
31  
29  
27  
25  
LM95213 with  
Filter On  
0
50  
100  
150  
200  
SAMPLE NUMBER  
Figure 8. Digital Filter Response in a typical processor system. The filter curves were purposely offset  
for clarity.  
Figure 8 shows the filter in use in a typical processor system. Note that the two curves have been purposely  
offset for clarity. Inserting the filter does not induce an offset as shown.  
TEMPERATURE DATA FORMAT  
Temperature data can only be read from the Local and Remote Temperature value registers. The data format for  
all temperature values is left justified 16-bit word available in two 8-bit registers. Unused bits will always report  
"0". All temperature data is clamped and will not roll over when a temperature exceeds full-scale value.  
Remote temperature data for all channels can be represented by an 11-bit, two's complement word or unsigned  
binary word with an LSb (Least Significant Bit) equal to 0.125°C.  
Table 2. 11-bit, 2's complement (10-bit plus sign)  
Temperature  
Digital Output  
Binary  
Hex  
+125°C  
+25°C  
0111 1101 0000 0000  
0001 1001 0000 0000  
0000 0001 0000 0000  
0000 0000 0010 0000  
7D00h  
1900h  
0100h  
0020h  
+1°C  
+0.125°C  
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Table 2. 11-bit, 2's complement (10-bit plus sign) (continued)  
Temperature  
Digital Output  
Binary  
Hex  
0°C  
0.125°C  
1°C  
0000 0000 0000 0000  
1111 1111 1110 0000  
1111 1111 0000 0000  
1110 0111 0000 0000  
1100 1001 0000 0000  
0000h  
FFE0h  
FF00h  
E700h  
C900h  
25°C  
55°C  
Table 3. 11-bit, unsigned binary  
Temperature  
Digital Output  
Binary  
Hex  
+255.875°C  
+255°C  
+201°C  
+125°C  
+25°C  
1111 1111 1110 0000  
1111 1111 0000 0000  
1100 1001 0000 0000  
0111 1101 0000 0000  
0001 1001 0000 0000  
0000 0001 0000 0000  
0000 0000 0010 0000  
0000 0000 0000 0000  
FFE0h  
FF00h  
C900h  
7D00h  
1900h  
0100h  
0020h  
0000h  
+1°C  
+0.125°C  
0°C  
When the digital filter is enabled on Remote 1 and 2 channels temperature data is represented by a 13-bit  
unsigned binary or 12-bit plus sign (two's complement) word with an LSb equal to 0.03125°C.  
Table 4. 13-bit, 2's complement (12-bit plus sign)  
Temperature  
Digital Output  
Binary  
Hex  
+125°C  
+25°C  
0111 1101 0000 0000  
0001 1001 0000 0000  
0000 0001 0000 0000  
0000 0000 0000 1000  
0000 0000 0000 0000  
1111 1111 1111 1000  
1111 1111 0000 0000  
1110 0111 0000 0000  
1100 1001 0000 0000  
7D00h  
1900h  
0100h  
0008h  
0000h  
FFF8h  
FF00h  
E700h  
C900h  
+1°C  
+0.03125°C  
0°C  
0.03125°C  
1°C  
25°C  
55°C  
Table 5. 13-bit, unsigned binary  
Temperature  
Digital Output  
Binary  
Hex  
+255.875°C  
+255°C  
+201°C  
+125°C  
+25°C  
1111 1111 1110 0000  
1111 1111 0000 0000  
1100 1001 0000 0000  
0111 1101 0000 0000  
0001 1001 0000 0000  
0000 0001 0000 0000  
0000 0000 0000 1000  
0000 0000 0000 0000  
FFE0h  
FF00h  
C900h  
7D00h  
1900h  
0100h  
0008h  
0000h  
+1°C  
+0.03125°C  
0°C  
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Local Temperature data is only represented by an 11-bit, two's complement, word with an LSb equal to 0.125°C.  
Table 6. 11-bit, 2's complement (10-bit plus sign)  
Temperature  
Digital Output  
Binary  
Hex  
+125°C  
+25°C  
+1°C  
0111 1101 0000 0000  
0001 1001 0000 0000  
0000 0001 0000 0000  
0000 0000 0010 0000  
0000 0000 0000 0000  
1111 1111 1110 0000  
1111 1111 0000 0000  
1110 0111 0000 0000  
1100 1001 0000 0000  
7D00h  
1900h  
0100h  
0020h  
0000h  
FFE0h  
FF00h  
E700h  
C900h  
+0.125°C  
0°C  
0.125°C  
1°C  
25°C  
55°C  
SMBDAT OPEN-DRAIN OUTPUT  
The SMBDAT output is an open-drain output and does not have internal pull-ups. A “high” level will not be  
observed on this pin until pull-up current is provided by some external source, typically a pull-up resistor. Choice  
of resistor value depends on many system factors but, in general, the pull-up resistor should be as large as  
possible without effecting the SMBus desired data rate. This will minimize any internal temperature reading  
errors due to internal heating of the LM95213. The maximum resistance of the pull-up to provide a 2.1V high  
level, based on LM95213 specification for High Level Output Current with the supply voltage at 3.0V, is 82 kΩ  
(5%) or 88.7 kΩ (1%).  
TCRIT1, TCRIT2, AND TCRIT3 OUTPUTS  
The LM95213's TCRIT pins are active-low open-drain outputs and do not include internal pull-up resistors. A  
“high” level will not be observed on these pins until pull-up current is provided by some external source, typically  
a pull-up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor  
should be as large as possible without effecting the performance of the device receiving the signal. This will  
minimize any internal temperature reading errors due to internal heating of the LM95213. The maximum  
resistance of the pull-up to provide a 2.1V high level, based on LM95213 specification for High Level Output  
Current with the supply voltage at 3.0V, is 82 kΩ (5%) or 88.7 kΩ (1%). The three TCRIT pins can each sink 6  
mA of current and still guarantee a "Logic Low" output voltage of 0.4V. If all three pins are set at maximum  
current this will cause a power dissipation of 7.2 mW. This power dissipation combined with a thermal resistance  
of 77.8°C/W will cause the LM95213's junction temperature to rise approximately 0.6°C and thus cause the Local  
temperature reading to shift. This can only be cancelled out if the environment that the LM95213 is enclosed in  
has stable and controlled air flow over the LM95213, as airflow can cause the thermal resistance to change  
dramatically.  
TCRIT LIMITS AND TCRIT OUTPUTS  
Figure 9 describes a simplified diagram of the temperature comparison and status register logic. Figure 10  
describes a simplified logic diagram of the circuitry associated with the status registers, mask registers and the  
TCRIT output pins.  
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Status 2  
(TCRIT1)  
Remote Temp 2  
A
B
AíB  
A<B  
Q
Q
Q
R2T1  
R1T1  
LT1  
S
R
Remote 2 Tcrit-1 Limit  
A
B
+
+
+
-
Remote Temp 1  
A
B
AíB  
A<B  
S
R
Remote 1 Tcrit-1 Limit  
Status 3  
(TCRIT2)  
A
B
R2T2  
R1T2  
LT2  
-
A
B
AíB  
A<B  
S
R
Remote 2 Tcrit-2 & Tcrit-3  
Limit  
A
B
-
Status 4  
(TCRIT3)  
A
B
AíB  
A<B  
R2T3  
R1T3  
LT3  
Q
Remote 1 Tcrit2 & Tcrit-3  
Limit  
S
R
A
B
+
-
Local Temp  
A
B
AíB  
A<B  
Q
S
R
Local Tcrit Limit  
A
B
+
-
Common Tcrit Hysteresis  
Figure 9. Temperature Comparison Logic and Status Register Simplified Diagram  
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a) TCRIT1 Mask Register, Status Register 1 and 2, and TCRIT1 output logic diagram.  
Status 1  
(Diode Fault)  
R2DO  
R2DS  
R1DO  
R1DS  
Status 2  
(TCRIT1)  
R2T1  
R1T1  
LT1  
TCRIT1  
TCRIT1  
Mask  
R2T1M  
R1T1M  
LTM  
b) TCRIT2 Mask Register, Status Register 1 and 3, and TCRIT2 output logic diagram.  
Status 1  
(Diode Fault)  
R2DO  
R2DS  
R1DO  
R1DS  
Status 3  
(TCRIT2)  
R2T2  
TCRIT2  
R1T2  
LT2  
TCRIT2  
Mask  
R2T2M  
R1T2M  
LTM  
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c) TCRIT3 Mask Register, Status Register 1 and 4, and TCRIT3 output logic diagram.  
Status 1  
(Diode Fault)  
R2DO  
R2DS  
R1DO  
R1DS  
Status 4  
(TCRIT3)  
R2T3  
R1T3  
LT3  
TCRIT3  
TCRIT3  
Mask  
R2T2M  
R1T2M  
LTM  
Figure 10. Logic diagrams for the TCRIT1, TCRIT2, and TCRIT3 outputs.  
If enabled, local temperature is compared to the user programmable Local Tcrit Limit Register (Default Value =  
85°C). The result of this comparison is stored in Status Register 2, Status Register 3 and Status Register 4 (see  
Figure 9). The comparison result can trigger TCRIT1 pin, TCRIT2 pin or TCRIT3 pin depending on the settings in  
the TCRIT1 Mask, TCRIT2 Mask and TCRIT3 Mask Registers (see Figure 10). The comparison result can also  
be read back from the Status Register 2, Status Register 3 and Status Register 4.  
If enabled, remote temperature 1 is compared to the user programmable Remote 1 Tcrit-1 Limit Register (Default  
Value 110°C) and Remote 1 Tcrit-2 Limit Register (Default Value = 85°C). The result of this comparison is stored  
in Status Register 2, Status Register 3 and Status Register 4 (see Figure 9). The comparison result can trigger  
TCRIT1 pin, TCRIT2 pin or TCRIT3 pin depending on the settings in the TCRIT1 Mask, TCRIT2 Mask and  
TRCIT3 Mask Registers (see Figure 10). The comparison result can also be read back from the Status Register  
2, Status Register 3 and Status Register 4. The remote temperature 2 operates in a similar manner to remote  
temperature 1 using its associated user programmable limit registers: Remote 2 Tcrit-1 Limit Register (Default  
Value 110°C) and Remote 2 Tcrit-2 Limit Register (Default Value = 85°C).  
Table 7. Limit assignments for each TCRIT output pin:  
TCRIT1  
TCRIT2  
TCRIT3  
Remote 2  
Remote 1  
Local  
Remote 2  
Tcrit-1 Limit  
Remote 2  
Tcrit-2 Limit  
Remote 2  
Tcrit-2 Limit  
Remote 1  
Tcrit-1 Limit  
Remote 1  
Tcrit-2 Limit  
Remote 1  
Tcrit-2 Limit  
Local  
Local  
Local  
Tcrit Limit  
Tcrit Limit  
Tcrit Limit  
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Local Tcrit Limit  
Common  
Hysteresis  
Local  
Temperature  
Local Tcrit Limit -  
Common Hysteresis  
T_CRITn  
Output Pin  
Status bit LTn  
Figure 11. TCRIT response diagram (masking options not included)  
The TCRIT response diagram of Figure 11 shows the local temperature interaction with the Tcrit limit and  
hysteresis value. As can be seen in the diagram when the local temperature exceeds the Tcrit limit register value  
the LTn Status bit is set and the T_CRITn output(s) is/are activated. The Status bit(s) and outputs are not  
deactivated until the temperature goes below the value calculated by subtracting the Common Hysteresis value  
programmed from the limit. This diagram mainly shows an example function of the hysteresis and is not meant to  
show complete function of the possible settings and options of all the TCRIT outputs and limit values.  
DIODE FAULT DETECTION  
The LM95213 is equipped with operational circuitry designed to detect fault conditions concerning the remote  
diodes. In the event that the D+ pin is detected as shorted to GND, D, VDD or D+ is floating, the Remote  
Temperature reading is –128.000 °C if signed format is selected and 0 °C if unsigned format is selected. In  
addition, the appropriate status register bits RD1M or RD2M (D1 or D0) are set.  
COMMUNICATING WITH THE LM95213  
The data registers in the LM95213 are selected by the Command Register. At power-up the Command Register  
is set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last  
location it was set to. Each data register in the LM95213 falls into one of three types of user accessibility:  
1. Read only  
2. Write only  
3. Write/Read same address  
A Write to the LM95213 will always include the address byte and the command byte. A write to any register  
requires one data byte.  
Reading the LM95213 can take place either of two ways:  
1. If the location latched in the Command Register is correct (most of the time it is expected that the Command  
Register will point to one of the Read Temperature Registers because that will be the data most frequently  
read from the LM95213), then the read can simply consist of an address byte, followed by retrieving the data  
byte.  
2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another  
address byte will accomplish a read.  
The data byte has the most significant bit first. At the end of a read, the LM95213 can accept either acknowledge  
or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master  
has read its last byte). It takes the LM95213 95 ms (typical, all channels enabled) to measure the temperature of  
the remote diodes and internal diode. When retrieving all 11 bits from a previous remote diode temperature  
measurement, the master must insure that all 11 bits are from the same temperature conversion. This may be  
achieved by reading the MSB register first. The LSB will be locked after the MSB is read. The LSB will be  
unlocked after being read. If the user reads MSBs consecutively, each time the MSB is read, the LSB associated  
with that temperature will be locked in and override the previous LSB value locked-in.  
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SMBus Timing Diagrams  
1
9
1
9
SMBCLK  
R/W  
A2 A1 A0  
SMBDAT  
A6 A5  
A4 A3  
D7 D6 D5 D4 D3 D2 D1 D0  
Ack  
by  
LM95213  
Ack  
by  
LM95213  
Start by  
Master  
Frame 1  
Frame 2  
Serial Bus Address Byte  
Command Byte  
1
9
SMBCLK  
(Continued)  
SMBDAT  
(Continued)  
D7 D6 D5 D4 D3 D2 D1 D0  
Stop  
by  
Ack by  
LM95213  
Master  
Frame 3  
Data Byte  
Figure 12. Serial Bus Write to the internal Command Register followed by a the Data Byte  
1
9
1
9
SMBCLK  
SMBDAT  
A6 A5 A4 A3 A2 A1 A0  
R/W  
D7 D6 D5 D4 D3 D2 D1 D0  
Ack  
by  
LM95213  
Stop  
by  
Master  
Ack by  
LM95213  
Start by  
Master  
Frame 1  
Frame 2  
Serial Bus Address Byte  
Command Byte  
Figure 13. Serial Bus Write to the Internal Command Register  
1
9
1
9
SMBCLK  
SMBDAT  
A6 A5 A4 A3 A2 A1 A0  
D7 D6 D5 D4 D3 D2 D1 D0  
R/W  
Ack  
by  
LM95213  
NoAck Stop  
by by  
Master Master  
Start by  
Master  
Frame 1  
Frame 2  
Serial Bus Address Byte  
Data Byte from the LM95213  
Figure 14. Serial Bus Read from a Register with the Internal Command Register preset to desired value.  
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1
9
1
9
SMBCLK  
SMBDAT  
A6 A5 A4 A3 A2 A1 A0 R/W  
D7 D6 D5 D4 D3 D2 D1 D0  
Ack  
by  
LM95213  
Ack Repeat  
by Start by  
LM95213 Master  
Start by  
Master  
Frame 1  
Frame 2  
Serial Bus Address Byte  
Command Byte  
1
9
1
9
SMBCLK  
(Continued)  
SMBDAT  
(Continued)  
A6 A5 A4 A3 A2 A1 A0  
D7 D6 D5 D4 D3 D2 D1 D0  
R/W  
Ack  
by  
No Ack Stop  
by  
by  
Master Master  
LM95213  
Frame 3  
Frame 4  
Serial Bus Address Byte  
Data Byte from the LM95213  
Figure 15. Serial Bus Write followed by a Repeat Start and Immediate Read  
SERIAL INTERFACE RESET  
In the event that the SMBus Master is RESET while the LM95213 is transmitting on the SMBDAT line, the  
LM95213 must be returned to a known state in the communication protocol. This may be done in one of two  
ways:  
1. When SMBDAT is LOW, the LM95213 SMBus state machine resets to the SMBus idle state if either  
SMBDAT or SMBCLK are held low for more than 35ms (tTIMEOUT). Note that according to SMBus  
specification 2.0 all devices are to timeout when either the SMBCLK or SMBDAT lines are held low for 25-  
35ms. Therefore, to insure a timeout of all devices on the bus the SMBCLK or SMBDAT lines must be held  
low for at least 35ms.  
2. When SMBDAT is HIGH, have the master initiate an SMBus start. The LM95213 will respond properly to an  
SMBus start condition at any point during the communication. After the start the LM95213 will expect an  
SMBus Address address byte.  
ONE-SHOT CONVERSION  
The One-Shot register is used to initiate a round of conversions and comparisons when the device is in standby  
mode, after which the device returns to standby. This is not a data register and it is the write operation that  
causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will  
always be read from this register. All the channels that are enabled in the Channel Enable Register will be  
converted once and the TCRIT1, TCRIT2 and TCRIT3 pins will reflect the comparison results based on this  
round of conversion results of the channels that are not masked.  
LM95213 Registers  
Command register selects which registers will be read from or written to. Data for this register should be  
transmitted during the Command Byte of the SMBus write communication.  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
P0  
Command Byte  
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P0-P7: Command  
Table 8. Register Summary  
Register Name  
Command  
Byte  
(Hex)  
Read/  
Write  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Local Temp MSB  
0x10  
0x20  
0x11  
RO  
RO  
RO  
SIGN  
1/2  
64  
1/4  
64  
32  
1/8  
32  
16  
0
8
0
4
0
4
2
0
2
1
0
1
Local Temp LSB  
Remote Temp 1 MSB – Signed  
SIGN  
16  
0
8
Remote Temp 1 LSB – Signed, Digital Filter Off  
Remote Temp 1 LSB – Signed, Digital Filter On  
Remote Temp 2 MSB – Signed  
0
0x21  
0x12  
0x22  
0x19  
RO  
RO  
RO  
RO  
1/2  
SIGN  
1/2  
1/4  
64  
1/8  
32  
0
4
0
4
0
2
0
2
0
1
0
1
1/16  
16  
0
1/32  
8
Remote Temp 2 LSB – Signed, Digital Filter Off  
Remote Temp 2 LSB – Signed, Digital Filter On  
Remote Temp 1 MSB – Unsigned  
0
1/4  
64  
1/8  
32  
1/16  
16  
1/32  
8
128  
Remote Temp 1 LSB – Unsigned, Digital Filter  
Off  
0
0
0x29  
0x1A  
0x2A  
RO  
RO  
RO  
1/2  
128  
1/2  
1/4  
64  
1/8  
32  
0
4
0
0
2
0
0
1
0
Remote Temp 1 LSB – Unsigned, Digital Filter  
On  
1/16  
16  
0
1/32  
8
Remote Temp 2 MSB – Unsigned  
Remote Temp 2 LSB – Unsigned, Digital Filter  
Off  
0
1/4  
1/8  
Remote Temp 2 LSB – Unsigned, Digital Filter  
On  
1/16  
1/32  
Remote 1 Offset  
0x31  
0x32  
0x03  
0x04  
0x05  
0x06  
0x0F  
0x02  
0x07  
0x08  
0x09  
0x0A  
0x0C  
0x0D  
0x0E  
0x40  
0x41  
0x42  
0x49  
0x4A  
0x5A  
0xFE  
0xFF  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
WO  
RO  
SIGN  
32  
32  
STBY  
16  
16  
8
8
4
2
1
1/2  
1/2  
0x00  
0x00  
0x00  
0x02  
0x1F  
0x0F  
Remote 2 Offset  
SIGN  
4
2
1
Configuration  
Conversion Rate  
R2CE  
R2F0  
CR1  
R1CE  
R1F1  
CR0  
LCE  
R1F0  
Channel Conversion Enable  
Filter Setting  
R2F1  
1-shot  
Common Status Register  
Status 1 (Diode Fault)  
Status 2 (TCRIT1)  
Status 3 (TCRIT2)  
Status 4 (TCRIT3)  
TCRIT1 Mask  
BUSY  
NR  
SR4F  
SR3F  
R2DS  
R2T1  
R2T2  
R2T3  
R2T1M  
R2T2M  
R2T2M  
4
SR2F  
R1DO  
R1T1  
R1T2  
R1T3  
R1T1M  
R1T2M  
R1T2M  
2
SR1F  
R1DS  
LT1  
LT2  
LT3  
LTM  
LTM  
LTM  
1
0x00  
RO  
R2DO  
RO  
8
8
8
8
8
8
0
1
RO  
RO  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
RO  
0x01  
0x00  
0x07  
0x55  
0x6E  
0x6E  
0x55  
0x55  
0x0A  
0x01  
0x8B  
TCRIT2 Mask  
TCRIT3 Mask  
Local Tcrit Limit  
0
64  
64  
64  
64  
64  
0
32  
32  
32  
32  
32  
0
16  
16  
16  
16  
16  
16  
0
Remote 1 Tcrit-1 Limit  
Remote 2 Tcrit-1 Limit  
Remote 1 Tcrit-2 and Tcrit-3 Limit  
Remote 2 Tcrit-2 and Tcrit-3 Limit  
Common Tcrit Hysteresis  
Manufacturer ID  
128  
128  
128  
128  
0
4
2
1
4
2
1
4
2
1
4
2
1
4
2
1
0
0
0
0
0
1
Revision ID  
RO  
1
0
0
0
0
1
1
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VALUE REGISTERS  
For data synchronization purposes, the MSB register should be read first if the user wants to read both MSB and  
LSB registers. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If the  
user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be  
locked in and override the previous LSB value locked-in.  
Local Value Registers  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Local Temp MSB  
Local Temp LSB  
0x10  
0x20  
RO  
RO  
SIGN  
1/2  
64  
32  
16  
0
8
0
4
0
2
0
1
0
1/4  
1/8  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
3
2
1
0
SIGN  
64  
32  
16  
8
RO  
RO  
RO  
RO  
RO  
RO  
RO  
RO  
Sign bit  
The Local temperature MSB value register  
range is +127°C to 128°C. The value  
programmed in this register is used to  
determine a local temperature error event.  
bit weight 64°C  
bit weight 32°C  
bit weight 16°C  
bit weight 8°C  
bit weight 4°C  
bit weight 2°C  
bit weight 1°C  
4
2
1
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
1/2  
1/4  
1/8  
0
RO  
RO  
RO  
RO  
bit weight 1/2°C (0.5°C)  
The Local Limit register range is 0°C to  
127°C. The value programmed in this  
register is used to determine a local  
temperature error event.  
6
bit weight 1/4°C (0.25°C)  
bit weight 1/8°C (0.125°C)  
5
4-0  
Reserved – will report "0" when read.  
Remote Temperature Value Registers with Signed Format  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Remote Temp 1 MSB – Signed  
0x11  
0x21  
0x12  
0x22  
RO  
SIGN  
1/2  
64  
1/8  
64  
32  
0
16  
0
8
0
8
0
4
0
4
0
2
0
2
0
1
0
1
0
Remote Temp 1 LSB – Signed, Digital  
Filter Off  
RO  
RO  
RO  
Remote Temp 1 LSB – Signed, Digital  
Filter On  
1/16  
32  
0
1/32  
16  
0
Remote Temp 2 MSB – Signed  
SIGN  
1/2  
Remote Temp 2 LSB – Signed, Digital  
Filter Off  
1/8  
Remote Temp 2 LSB – Signed, Digital  
Filter On  
1/16  
1/32  
The Local temperature MSB value register range is +127°C to 128°C. The value programmed in this register is  
used to determine a local temperature error event.  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
SIGN  
64  
RO  
RO  
Sign bit  
bit weight 64°C  
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Bit(s)  
Bit Name  
Read/  
Write  
Description  
5
4
3
2
1
0
32  
16  
8
RO  
RO  
RO  
RO  
RO  
RO  
bit weight 32°C  
bit weight 16°C  
bit weight 8°C  
bit weight 4°C  
bit weight 2°C  
bit weight 1°C  
4
2
1
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
1/2  
RO  
RO  
RO  
RO  
bit weight 1/2°C (0.5°C)  
bit weight 1/4°C (0.25°C)  
bit weight 1/8°C (0.125°C)  
1/4  
1/8  
0 or 1/16  
When the digital filter is disabled this bit will always read "0".  
When the digital filter is enabled this bit will report 1/16°C (0.0625°C) bit state.  
3
0 or 1/32  
0
RO  
RO  
When the digital filter is disabled this bit will always read "0".  
When the digital filter is enabled this bit will report 1/32°C (0.03125°C) bit state.  
2-0  
Reserved – will report "0" when read.  
Remote Temperature Value Registers with Unsigned Format  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Remote Temp 1 MSB – Unsigned  
0x19  
0x29  
0x1A  
0x2A  
RO  
128  
1/2  
128  
1/2  
64  
1/8  
64  
32  
0
16  
0
8
0
8
0
4
0
4
0
2
0
2
0
1
0
1
0
Remote Temp 1 LSB – Unsigned,  
Digital Filter Off  
RO  
RO  
RO  
Remote Temp 1 LSB – Unsigned,  
Digital Filter On  
1/16  
32  
0
1/32  
16  
0
Remote Temp 2 MSB – Unsigned  
Remote Temp 2 LSB – Unsigned,  
Digital Filter Off  
1/8  
Remote Temp 2 LSB – Unsigned,  
Digital Filter On  
1/16  
1/32  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
3
2
1
0
SIGN  
64  
32  
16  
8
RO  
RO  
RO  
RO  
RO  
RO  
RO  
RO  
bit weight 128°C  
bit weight 64°C  
bit weight 32°C  
bit weight 16°C  
bit weight 8°C  
bit weight 4°C  
bit weight 2°C  
bit weight 1°C  
4
2
1
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
1/2  
RO  
RO  
RO  
RO  
bit weight 1/2°C (0.5°C)  
1/4  
bit weight 1/4°C (0.25°C)  
bit weight 1/8°C (0.125°C)  
1/8  
0 or 1/16  
When the digital filter is disabled this bit will always read "0".  
When the digital filter is enabled this bit will report 1/16°C (0.0625°C) bit state.  
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Bit(s)  
3
Bit Name  
Read/  
Write  
Description  
0 or 1/32  
0
RO  
When the digital filter is disabled this bit will always read "0".  
When the digital filter is enabled this bit will report 1/32°C (0.03125°C) bit state.  
2-0  
RO  
Reserved – will report "0" when read.  
DIODE CONFIGURATION REGISTERS  
Remote 1-2 Offset  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Remote 1 Offset  
Remote 2 Offset  
0x31  
0x32  
R/W  
R/W  
SIGN  
SIGN  
32  
32  
16  
16  
8
8
4
4
2
2
1
1
1/2  
1/2  
0x00  
0x00  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
3
2
1
0
SIGN  
32  
16  
8
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
Sign bit  
All registers have 2’s complement format.  
The offset range for each remote is  
+63.5°C/64°C. The value programmed in  
this register is directly added to the actual  
reading of the ADC and the modified number  
is reported in the remote value registers.  
bit weight 32°C  
bit weight 16°C  
bit weight 8°C  
4
bit weight 4°C  
2
bit weight 2°C  
1
bit weight 1°C  
1/2  
bit weight 1/2°C (0.5°C)  
CONFIGURATION REGISTERS  
Main Configuration Register  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Configuration  
0x03  
R/W  
STBY  
0x00  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
RO  
Reserved will report "0" when read.  
Software Standby  
STBY  
R/W  
1 – standby (when in this mode one conversion sequence can be initiated by writing to the  
one-shot register)  
0 – active/converting  
5–0  
RO  
Reserved – will report "0" when read.  
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Conversion Rate Register  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Conversion Rate  
0x04  
R/W  
CR1  
CR0  
0x02  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
Reserved – will report "0" when read.  
7-2  
1-0  
RO  
CR[1:0]  
R/W  
Conversion rate control bits modify the time interval for conversion of the channels enabled.  
The channels enabled are converted sequentially then standby mode enabled for the  
remainder of the time interval.  
CR[1:0]  
00  
Conversion Rate  
continuous (30 ms to 104 ms)  
01  
0.364 s  
1s  
10  
11  
2.5 s  
Channel Conversion Enable  
When a conversion is disabled for a particular channel it is skipped. The continuous conversion rate is effected  
all other conversion rates are not effected as extra standby time is inserted in order to compensate. See  
Conversion Rate Register description.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Channel Conversion Enable  
0x05  
R/W  
R2CE R1CE LCE  
0x1F  
Bit(s) Bit Name  
Read/ Description  
Write  
7–3  
2
RO  
Reserved – will report "0" when read.  
R2CE  
R/W  
Remote 2 Temperature Conversion Enable  
1– Remote 2 temp conversion enabled  
0– Remote 2 temp conversion disabled  
1
0
R1CE  
LCE  
R/W  
R/W  
Remote 1 Temperature Conversion Enable  
1– Remote 1 temp conversion enabled  
0– Remote 1 temp conversion disabled  
Local Temperature Conversion Enable  
1– Local temp conversion enabled  
0– Local temp conversion disabled  
Filter Setting  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Filter Setting  
0x06  
R/W  
R2F1 R2F0 R1F1 R1F0  
0x0F  
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Bit(s)  
Bit Name  
Read/  
Write  
Description  
7–4  
3–2  
RO  
Reserved – will report "0" when read.  
R2F[1:0]  
R/W  
Remote Channel 2 Filter Enable Bits  
R2F[1:0]  
Digital Filter State  
disable all digital filtering  
enable basic filter  
00  
01  
10  
reserved (do not use)  
enable enhanced filter  
11  
1–0  
R1F[1:0]  
R/W  
Remote Channel 1 Filter Enable  
R1F[1:0]  
Filter State  
00  
01  
10  
11  
disable all digital filtering  
enable basic filter  
reserved (do not use)  
enable enhanced filter  
1-Shot  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
1-Shot  
0x0F  
WO  
Bit(s) Bit Name  
Read/ Description  
Write  
7–0  
-
WO  
Writing to this register activates one conversion for all the enabled channels if  
the chip is in standby mode (i.e. standby bit = 1). The actual data written does  
not matter and is not stored.  
STATUS REGISTERS  
Common Status Register  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Common Status Register  
0x02  
RO  
BUSY  
NR  
SR4F SR3F SR2F SR1F  
0x00  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
Busy bit (device converting)  
7
BUSY  
NR  
RO  
RO  
RO  
RO  
6
Not Ready bit (30 ms), indicates power up initialization sequence is in progress  
Reserved – will report "0" when read.  
5–4  
3
SR4F  
Status Register 4 Flag:  
1 – indicates that Status Register 4 has at least one bit set  
0 – indicates that all of Status Register 4 bits are cleared  
2
1
0
SR3F  
SR2F  
SR1F  
RO  
RO  
RO  
Status Register 3 Flag:  
1 – indicates that Status Register 3 has at least one bit set  
0 – indicates that all of Status Register 3 bits are cleared  
Status Register 2 Flag:  
1 – indicates that Status Register 2 has at least one bit set  
0 – indicates that all of Status Register 2 bits are cleared  
Status Register 1 Flag:  
1 – indicates that Status Register 1 has at least one bit set  
0 – indicates that all of Status Register 1 bits are cleared  
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Status 1 Register (Diode Fault)  
Status fault bits for open or shorted diode (i.e. Short Fault: D+ shorted to Ground or D-; Open Fault: D+ shorted  
to VDD, or floating). During fault conditions the temperature reading is 0 °C if unsigned value registers are read or  
–128.000 °C if signed value registers are read.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Status 1 (Diode Fault)  
0x07  
RO  
0
0
0
0
R2DO R2DS R1DO R1DS  
Bit(s) Bit Name  
Read/ Description  
Write  
7-4  
3
RO  
RO  
Reserved – will report "0" when read.  
Remote 2 diode open fault status:  
R2DO  
1 – indicates that remote 2 diode has an "open" fault  
0 – indicates that remote 2 diode does not have an "open" fault  
2
1
0
R2DS  
R1DO  
R1DS  
RO  
RO  
RO  
Remote 2 diode short fault status:  
1 – indicates that remote 2 diode has a "short" fault  
0 – indicates that remote 2 diode does not have a "short" fault  
Remote 1 diode open fault status:  
1 – indicates that remote 1 diode has an "open" fault  
0 – indicates that remote 1 diode does not have an "open" fault  
Remote 1 diode short fault status:  
1 – indicates that remote 1 diode has a "short" fault  
0 – indicates that remote 1 diode does not have a "short" fault  
Status 2 (TCRIT1)  
Status bits for TCRIT1. When one or more of these bits are set and if not masked the TCRIT1 output will  
activate. TCRIT1 will deactivate when all these bits are cleared.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Status 2 (TCRIT1)  
0x08  
RO  
R2T1 R1T1  
LT1  
Bit(s) Bit Name  
Read/ Description  
Write  
7–3  
2
-
RO  
RO  
Reserved – will report "0" when read.  
R2T1  
Remote 2 Tcrit-1 Status:  
1 – indicates that remote 2 reading is greater than or equal to the value set in Remote 2 Tcrit-1  
Limit register  
0 – indicates that that remote 2 reading is less than the value set in Remote 2 Tcrit-1 Limit register  
minus the Common Hysteresis value  
1
0
R1T1  
LT1  
RO  
RO  
Remote 1 Tcrit-1 Status:  
1 – indicates that remote 1 reading is greater than or equal to the value set in Remote 1 Tcrit-1  
Limit register  
0 – indicates that that remote 1 reading is less than the value set in Remote 1 Tcrit-1 Limit register  
minus the Common Hysteresis value  
Local Tcrit Status:  
1 – indicates that local reading is greater than or equal to the value set in Local Tcrit Limit register  
0 – indicates that local reading is less than the value set in Local Tcrit Limit register minus the  
Common Hysteresis value  
Status 3 (TCRIT2)  
Status bits for TCRIT2. When one or more of these bits are set and if not masked the TCRIT2 output will  
activate. TCRIT2 will deactivate when all these bits are cleared.  
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Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Status 3 (TCRIT2)  
0x09  
RO  
R2T2 R1T2  
LT2  
Bit(s) Bit Name  
Read/ Description  
Write  
7–3  
2
-
RO  
RO  
Reserved – will report "0" when read.  
Remote 2 Tcrit-2 Status:  
R2T2  
1 – indicates that remote 2 reading is greater than or equal to the value set in Remote 2 Tcrit-2  
Limit register  
0 – indicates that that remote 2 reading is less than the value set in Remote 2 Tcrit-2 Limit register  
minus the Common Hysteresis value  
1
0
R1T2  
LT2  
RO  
RO  
Remote 1 Tcrit-2 Status:  
1 – indicates that remote 1 reading is greater than or equal to the value set in Remote 1 Tcrit-2  
Limit register  
0 – indicates that that remote 1 reading is less than the value set in Remote 1 Tcrit-2 Limit register  
minus the Common Hysteresis value  
Local Tcrit Status:  
1 – indicates that local reading is greater than or equal to the value set in Local Tcrit Limit register  
0 – indicates that local reading is less than the value set in Local Tcrit Limit register minus the  
Common Hysteresis value  
Status 4 (TCRIT3)  
Status bits for TCRIT3. When one or more of these bits are set and if not masked the TCRIT3 output will  
activate. TCRIT3 will deactivate when all these bits are cleared.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Status 4 (TCRIT3)  
0x0A  
RO  
R2T3 R1T3  
LT3  
Bit(s) Bit Name  
Read/ Description  
Write  
7–3  
2
-
RO  
RO  
Reserved – will report "0" when read.  
Remote 2 Tcrit-2 Status:  
R2T3  
1 – indicates that remote 2 reading is greater than or equal to the value set in Remote 2 Tcrit-2  
Limit register  
0 – indicates that that remote 2 reading is less than the value set in Remote 2 Tcrit-2 Limit register  
minus the Common Hysteresis value  
1
0
R1T3  
LT3  
RO  
RO  
Remote 1 Tcrit-2 Status:  
1 – indicates that remote 1 reading is greater than or equal to the value set in Remote 1 Tcrit-2  
Limit register  
0 – indicates that that remote 1 reading is less than the value set in Remote 1 Tcrit-2 Limit register  
minus the Common Hysteresis value  
Local Tcrit Status:  
1 – indicates that local reading is greater than or equal to the value set in Local Tcrit Limit register  
0 – indicates that local reading is less than the value set in Local Tcrit Limit register minus the  
Common Hysteresis value  
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MASK REGISTERS  
TCRIT1 Mask Register  
The mask bits in this register allow control over which error events propagate to the TCRIT1 pin.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
TCRIT1 Mask  
0x0C  
R/W  
R2T1 R1T1  
LTM  
0x01  
M
M
Bit(s) Bit Name  
Read/ Description  
Write  
7-3  
2
RO  
Reserved – will report "0" when read.  
Remote 2 Tcrit-1 Mask:  
R2T1M  
R/W  
1 – prevents the remote 2 temperature error event from propagating to the TCRIT1 pin  
0 – allows the remote 2 temperature error event to propagate to the TCRIT1 pin  
1
0
R1T1M  
LTM  
R/W  
R/W  
Remote 1 Tcrit-1 Mask:  
1 – prevents the remote 1 temperature error event from propagating to the TCRIT1 pin  
0 – allows the remote 1 temperature error event to propagate to the TCRIT1 pin  
Local Tcrit Mask:  
1 – prevents the local temperature error event from propagating to the TCRIT1 pin  
0 – allows the local temperature error event to propagate to the TCRIT1 pin  
TCRIT2 Mask Registers  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
TCRIT2 Mask  
0x0D  
R/W  
R2T2 R1T2  
LTM  
0x00  
M
M
Bit(s) Bit Name  
Read/ Description  
Write  
7-3  
2
RO  
Reserved – will report "0" when read.  
Remote 2 Tcrit-2 Mask:  
R2T2M  
R/W  
1 – prevents the remote 2 temperature error event from propagating to the TCRIT2 pin  
0 – allows the remote 2 temperature error event to propagate to the TCRIT2 pin  
1
0
R1T2M  
LTM  
R/W  
R/W  
Remote 1 Tcrit-2 Mask:  
1 – prevents the remote 1 temperature error event from propagating to the TCRIT2 pin  
0 – allows the remote 1 temperature error event to propagate to the TCRIT2 pin  
Local Tcrit Mask:  
1 – prevents the local temperature error event from propagating to the TCRIT2 pin  
0 – allows the local temperature error event to propagate to the TCRIT2 pin  
TCRIT3 Mask Register  
The mask bits in this register allow control over which error events propagate to the TCRIT3 pin.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
TCRIT3 Mask  
0x0E  
R/W  
R2T2 R1T2  
LTM  
0x07  
M
M
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Bit(s) Bit Name  
Read/ Description  
Write  
7-3  
2
RO  
Reserved – will report "0" when read.  
Remote 2 Tcrit-2 Mask:  
R2T2M  
R/W  
1 – prevents the remote 2 temperature error event from propagating to the TCRIT3 pin  
0 – allows the remote 2 temperature error event to propagate to the TCRIT3 pin  
1
0
R1T2M  
LTM  
R/W  
R/W  
Remote 1 Tcrit-2 Mask:  
1 – prevents the remote 1 temperature error event from propagating to the TCRIT3 pin  
0 – allows the remote 1 temperature error event to propagate to the TCRIT3 pin  
Local Tcrit Mask:  
1 – prevents the local temperature error event from propagating to the TCRIT3 pin  
0 – allows the local temperature error event to propagate to the TCRIT3 pin  
LIMIT REGISTERS  
Local Limit Register  
The Local Limit register range is 0°C to 127°C. The value programmed in this register is used to determine a  
local temperature error event.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Local Tcrit Limit  
0x40  
R/W  
0
64  
32  
16  
8
4
2
1
0x55  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
3
2
1
0
0
R0  
Read only bit will always report "0".  
bit weight 64°C  
64  
32  
16  
8
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
bit weight 32°C  
bit weight 16°C  
bit weight 8°C  
4
bit weight 4°C  
2
bit weight 2°C  
1
bit weight 1°C  
Remote Limit Registers  
The range for these registers is 0°C to 255°C.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
R/W  
R/W  
R/W  
R/W  
(Hex)  
Remote 1 Tcrit-1 Limit (used by  
TCRIT1 error events)  
0x41  
0x42  
0x49  
0x4A  
128  
128  
128  
128  
64  
64  
64  
64  
32  
32  
32  
32  
16  
16  
16  
16  
8
8
8
8
4
4
4
4
2
2
2
2
1
1
1
1
0x6E  
0x6E  
0x55  
0x55  
Remote 2 Tcrit-1 Limit (used by  
TCRIT1 error events)  
Remote 1 Tcrit-2 and Tcrit3 Limit (used  
by TCRIT2 and TCRIT3 error events)  
Remote 2 Tcrit-2 and Tcrit3 Limit (used  
by TCRIT2 and TCRIT3 error events)  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
128  
64  
R/W  
R/W  
R/W  
bit weight 128°C  
bit weight 64°C  
bit weight 32°C  
32  
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Bit(s)  
Bit Name  
Read/  
Write  
Description  
4
3
2
1
0
16  
8
R/W  
R/W  
R/W  
R/W  
R/W  
bit weight 16°C  
bit weight 8°C  
bit weight 4°C  
bit weight 2°C  
bit weight 1°C  
4
2
1
Table 9.  
Output Pin  
TCRIT1  
Remote 2  
Remote 1  
Local  
Remote 2 Tcrit-1 Limit  
Remote 2 Tcrit-2 Limit  
Remote 2 Tcrit-2 Limit  
Remote 1 Tcrit-1 Limit  
Remote 1 Tcrit-2 Limit  
Remote 1 Tcrit-2 Limit  
Local Tcrit Limit  
Local Tcrit Limit  
Local Tcrit Limit  
TCRIT2  
TCRIT3  
Common Tcrit Hysteresis Register  
The hysteresis register range is 0°C to 32°C. The value programmed in this register is used to modify all the limit  
values for decreasing temperature.  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Common Tcrit Hysteresis  
0x5A  
R/W  
0
0
0
16  
8
4
2
1
0x0A  
Bit(s)  
Bit Name  
Read/  
Write  
Description  
7
6
5
4
3
2
1
0
0
RO  
Read only bit will always report "0".  
Read only bit will always report "0".  
Read only bit will always report "0".  
bit weight 16°C  
0
RO  
0
RO  
16  
8
R/W  
R/W  
R/W  
R/W  
R/W  
bit weight 8°C  
4
bit weight 4°C  
2
bit weight 2°C  
1
bit weight 1°C  
IDENTIFICATION REGISTERS  
Register Name  
Command Read/  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
POR  
Default  
(Hex)  
Byte  
Write  
(Hex)  
Manufacturer ID  
Revision ID  
0xFE  
0xFF  
RO  
RO  
0
1
0
0
0
0
0
0
0
1
0
0
0
1
1
1
0x01  
0x8B  
Applications Hints  
The LM95213 can be applied easily in the same way as other integrated-circuit temperature sensors, and its  
remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit  
board, and because the path of best thermal conductivity is between the die and the pins, its temperature will  
effectively be that of the printed circuit board lands and traces soldered to the LM95213's pins. This presumes  
that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the  
air temperature is much higher or lower than the surface temperature, the actual temperature of the LM95213 die  
will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal  
conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much  
more strongly than will the air temperature.  
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To measure temperature external to the LM95213's die, incorporates remote diode sensing technology. This  
diode can be located on the die of a target IC, allowing measurement of the IC's temperature, independent of the  
LM95213's temperature. A discrete diode can also be used to sense the temperature of external objects or  
ambient air. Remember that a discrete diode's temperature will be affected, and often dominated, by the  
temperature of its leads. Most silicon diodes do not lend themselves well to this application. It is recommended  
that an MMBT3904 transistor base emitter junction be used with the collector tied to the base.  
The LM95213 can measure a diode-connected transistor such as the MMBT3904 or the thermal diode found in  
an AMD processor or FPGA. The LM95213 has been optimized to measure the remote thermal diode integrated  
in a typical MMBT3904 transistor. The offset register can be used to calibrate for other thermal diodes easily.  
The LM9513 deos not include TruTherm™ technology that allows sensing of sub-micron geometry process  
thermal diodes. For this applicaiton the LM95233 would be better suitted.  
The LM95233 has been specifically optimized to measure the remote thermal diode integrated in a typical Intel  
processor on 65nm or 90 nm process or an MMBT3904 transistor. Using the Remote Diode Model Select  
register found in the LM95233 any of the two remote inputs can be optimized for a typical Intel processor on  
65nm or 90nm process or an MMBT3904.  
DIODE NON-IDEALITY  
Diode Non-Ideality Factor Effect on Accuracy  
When a transistor is connected as a diode, the following relationship holds for variables VBE, T and IF:  
V
h xV  
BE  
»
ÿ
Ÿ
t
«
IF = IS x e  
-1  
Ÿ
where  
kT  
q
Vt =  
q = 1.6×1019 Coulombs (the electron charge),  
T = Absolute Temperature in Kelvin  
k = 1.38×1023 joules/K (Boltzmann's constant),  
η is the non-ideality factor of the process the diode is manufactured on,  
IS = Saturation Current and is process dependent,  
If = Forward Current through the base-emitter junction  
VBE = Base-Emitter Voltage drop  
In the active region, the -1 term is negligible and may be eliminated, yielding the following equation  
V
h xV  
BE  
»
ÿ
t
Ÿ  
«
IF = IS x e  
Ÿ
(2)  
In Equation 2, η and IS are dependant upon the process that was used in the fabrication of the particular diode.  
By forcing two currents with a very controlled ratio(IF2 / IF1) and measuring the resulting voltage difference, it is  
possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship:  
IF2’  
kT  
≈ ’ x ln  
DVBE = h x  
q
«IF1◊  
« ◊  
(3)  
Solving Equation 3 for temperature yields:  
q x DVBE  
T =  
IF2  
h x k x ln  
÷
÷
IF1  
«
(4)  
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Equation 4 holds true when a diode connected transistor such as the MMBT3904 is used. When this “diode”  
equation is applied to an integrated diode such as a processor transistor with its collector tied to GND as shown  
in Figure 16 it will yield a wide non-ideality spread. This wide non-ideality spread is not due to true process  
variation but due to the fact that Equation 4 is an approximation.  
National invented TruTherm beta cancellation technology uses the transistor equation, Equation 5, which is a  
more accurate representation of the topology of the thermal diode found in some sub-micron FPGAs or  
processors.  
q x DVBE  
T =  
I
C2  
h x k x ln∆  
÷
÷
IC1  
«
(5)  
7
5
D1+  
I
= I  
F
E
100 pF  
PROCESSOR  
I
R
D-  
I
MMBT3904  
R
100 pF  
6
D2+  
I
F
LM95213  
Figure 16. Thermal Diode Current Paths  
TruTherm technology can be found in the LM95233 two channel remote diode sensor that is pin and register  
compatible with the LM95213. The LM95213 does not support this technology.  
Calculating Total System Accuracy  
The voltage seen by the LM95213 also includes the IFRS voltage drop of the series resistance. The non-ideality  
factor, η, is the only other parameter not accounted for and depends on the diode that is used for measurement.  
Since ΔVBE is proportional to both η and T, the variations in η cannot be distinguished from variations in  
temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly add to the  
inaccuracy of the sensor. For the for Intel processor on 65 nm process, Intel specifies a +4.06%/0.897%  
variation in η from part to part when the processor diode is measured by a circuit that assumes diode equation,  
Equation 4, as true. As an example, assume a temperature sensor has an accuracy specification of ±1.0°C at a  
temperature of 80°C (353 Kelvin) and the processor diode has a non-ideality variation of +1.19%/0.27%. The  
resulting system accuracy of the processor temperature being sensed will be:  
TACC = + 1.0°C + (+4.06% of 353 K) = +15.3 °C  
and  
TACC = - 1.0°C + (0.89% of 353 K) = 4.1 °C  
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The next error term to be discussed is that due to the series resistance of the thermal diode and printed circuit  
board traces. The thermal diode series resistance is specified on most processor data sheets. For Intel  
processors in 65 nm process, this is specified at 4.52typical. The LM95213 accommodates the typical series  
resistance of Intel Processor on 65 nm process. The error that is not accounted for is the spread of the  
processor's series resistance, that is 2.79to 6.24or ±1.73. The equation to calculate the temperature error  
due to series resistance (TER) for the LM95213 is simply:  
º
W
÷
C
TER = 0.62  
x R  
PCB  
«
(6)  
Solving Equation 6 for RPCB equal to ±1.73results in the additional error due to the spread in the series  
resistance of ±1.07°C. The spread in error cannot be canceled out, as it would require measuring each individual  
thermal diode device. This is quite difficult and impractical in a large volume production environment.  
Equation 6 can also be used to calculate the additional error caused by series resistance on the printed circuit  
board. Since the variation of the PCB series resistance is minimal, the bulk of the error term is always positive  
and can simply be cancelled out by subtracting it from the output readings of the LM95213.  
Processor Family  
Diode Equation ηD, non-ideality  
Series R,Ω  
min  
typ  
max  
Pentium III CPUID 67h  
1
1.0065  
1.0125  
Pentium III CPUID 68h/PGA370Socket/  
Celeron  
1.0057  
1.008  
1.0125  
Pentium 4, 423 pin  
Pentium 4, 478 pin  
0.9933  
0.9933  
1.0045  
1.0045  
1.0368  
1.0368  
Pentium 4 on 0.13 micron process, 2 - 3.06  
GHz  
1.0011  
1.0021  
1.0030  
3.64  
Pentium 4 on 90 nm process  
Intel Processor on 65 nm process  
Pentium M (Centrino)  
MMBT3904  
1.0083  
1.000  
1.011  
1.009  
1.023  
1.050  
3.33  
4.52  
3.06  
1.00151  
1.00220  
1.003  
1.00289  
AMD Athlon MP model 6  
AMD Athlon 64  
1.002  
1.008  
1.008  
1.008  
1.016  
1.096  
1.096  
1.008  
AMD Opteron  
1.008  
AMD Sempron  
1.00261  
0.93  
Compensating for Different Non-Ideality  
In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a  
particular processor. National Semiconductor temperature sensors are always calibrated to the typical non-  
ideality and series resistance of a given processor type. The LM95213 is calibrated for non-ideality factor and  
series resistance values supporting the MMBT3904 transistor without the requirement for additional trims. When  
a temperature sensor calibrated for a particular processor type is used with a different processor type, additional  
errors are introduced.  
Temperature errors associated with non-ideality of different processor types may be reduced in a specific  
temperature range of concern through use of software calibration. Typical Non-ideality specification differences  
cause a gain variation of the transfer function, therefore the center of the temperature range of interest should be  
the target temperature for calibration purposes. The following equation can be used to calculate the temperature  
correction factor (TCF) required to compensate for a target non-ideality differing from that supported by the  
LM95213.  
hS - hPROCESSOR  
«
x
(TCR + 273K)  
TCF  
=
hS  
where  
ηS = LM95213 non-ideality for accuracy specification  
ηPROCESSOR = Processor thermal diode typical non-ideality  
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TCR = center of the temperature range of interest in °C  
(7)  
The correction factor should be directly added to the temperature reading produced by the LM95213. For  
example when using the LM95213 to measure a AMD Athlon processor, with a typical non-ideality of 1.008, for a  
temperature range of 60 °C to 100 °C the correction factor would calculate to:  
1.003 - 1.008  
(80 + 273) = -1.75oC  
«
TCF  
=
1.003  
(8)  
Therefore, 1.75°C should be subtracted from the temperature readings of the LM95213 to compensate for the  
differing typical non-ideality target.  
PCB LAYOUT FOR MINIMIZING NOISE  
Figure 17. Ideal Diode Trace Layout  
In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced  
on traces running between the remote temperature diode sensor and the LM95213 can cause temperature  
conversion errors. Keep in mind that the signal level the LM95213 is trying to measure is in microvolts. The  
following guidelines should be followed:  
1. VDD should be bypassed with a 0.1 µF capacitor in parallel with 100 pF. The 100 pF capacitor should be  
placed as close as possible to the power supply pin. A bulk capacitance of approximately 10 µF needs to be  
in the near vicinity of the LM95213.  
2. A 100 pF diode bypass capacitor is recommended to filter high frequency noise but may not be necessary.  
Make sure the traces to the 100 pF capacitor are matched. Place the filter capacitors close to the LM95213  
pins.  
3. Ideally, the LM95213 should be placed within 10 cm of the Processor diode pins with the traces being as  
straight, short and identical as possible. Trace resistance of 1Ω can cause as much as 0.62°C of error. This  
error can be compensated by using simple software offset compensation.  
4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This  
GND guard should not be between the D+ and Dlines. In the event that noise does couple to the diode  
lines it would be ideal if it is coupled common mode. That is equally to the D+ and Dlines.  
5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.  
6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be  
kept at least 2 cm apart from the high speed digital traces.  
7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should  
cross at a 90 degree angle.  
8. The ideal place to connect the LM95213's GND pin is as close as possible to the Processors GND  
associated with the sense diode.  
9. Leakage current between D+ and GND and between D+ and Dshould be kept to a minimum. Thirteen  
nano-amperes of leakage can cause as much as 0.2°C of error in the diode temperature reading. Keeping  
the printed circuit board as clean as possible will minimize leakage current.  
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Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV  
below GND, may prevent successful SMBus communication with the LM95213. SMBus no acknowledge is the  
most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of  
communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a  
system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3 dB  
corner frequency of about 40 MHz is included on the LM95213's SMBCLK input. Additional resistance can be  
added in series with the SMBDAT and SMBCLK lines to further help filter noise and ringing. Minimize noise  
coupling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines  
containing high speed data communications cross at right angles to the SMBDAT and SMBCLK lines.  
Copyright © 2007–2013, Texas Instruments Incorporated  
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37  
Product Folder Links: LM95213  
 
LM95213  
SNIS147A MARCH 2007REVISED MARCH 2013  
www.ti.com  
REVISION HISTORY  
Changes from Original (March 2013) to Revision A  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 37  
38  
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Copyright © 2007–2013, Texas Instruments Incorporated  
Product Folder Links: LM95213  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Oct-2013  
PACKAGING INFORMATION  
Orderable Device  
LM95213CISD/NOPB  
LM95213CISDX/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 140  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
WSON  
WSON  
NHL  
14  
14  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
Level-1-260C-UNLIM  
95213CI  
95213CI  
ACTIVE  
NHL  
4500  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
-40 to 140  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM95213CISD/NOPB  
LM95213CISDX/NOPB  
WSON  
WSON  
NHL  
NHL  
14  
14  
1000  
4500  
178.0  
330.0  
12.4  
12.4  
4.3  
4.3  
4.3  
4.3  
1.3  
1.3  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM95213CISD/NOPB  
LM95213CISDX/NOPB  
WSON  
WSON  
NHL  
NHL  
14  
14  
1000  
4500  
210.0  
367.0  
185.0  
367.0  
35.0  
35.0  
Pack Materials-Page 2  
MECHANICAL DATA  
NHL0014B  
SDA14B (Rev A)  
www.ti.com  
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