LM9822CCWM [TI]

3 Channel 42-Bit Color Scanner Analog Front End;
LM9822CCWM
型号: LM9822CCWM
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3 Channel 42-Bit Color Scanner Analog Front End

光电二极管
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中文:  中文翻译
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LM9822  
LM9822 3 Channel 42-Bit Color Scanner Analog Front End  
Literature Number: SNOS475  
May 1999  
N
LM9822 3 Channel 42-Bit Color Scanner Analog Front End  
General Description  
The LM9822 is a high performance Analog Front End (AFE) for  
Key Specifications  
image sensor processing systems. It performs all the analog and  
mixed signal functions (correlated double sampling, color spe-  
cific gain and offset correction, and analog to digital conversion)  
necessary to digitize the output of a wide variety of CIS and  
Output Data Resolution  
14 Bits  
6MHz  
5V±5%  
Pixel Conversion Rate  
Analog SupplyVoltage  
I/O Supply Voltage  
3.3V±10% or 5V±5%  
375mW  
CCD sensors. The LM9822 has a 14 bit 6MHz ADC.  
Power Dissipation (typical)  
Applications  
Features  
Color Flatbed Document Scanners  
Color Sheetfed Scanners  
Multifunction Imaging Products  
Digital Copiers  
6 million pixels/s conversion rate  
Digitally programmed gain and offset for red, green and blue  
color balancing  
Correlated Double Sampling for lowest noise from CCD  
sensors  
General Purpose Linear Array Imaging  
Compatible with CCD and CIS type image sensors  
InternalVoltage Reference Generation  
TTL/CMOS compatible input/output  
Connection Diagram  
D7  
28  
V
1
BANDGAP  
D6  
V
27  
2
REFMID  
D5  
26  
V
3
A
D4  
AGND  
4
25  
D3  
24  
OS  
5
R
LM9822  
28 pin  
SOIC  
D2  
D1  
V
6
23  
22  
21  
20  
REF+  
7
OS  
G
V
D0  
8
REF-  
OS  
B
VD  
9
V
A
19  
18  
17  
16  
DGND  
CLMP  
VSMP  
MCLK  
10  
11  
12  
13  
14  
AGND  
SEN  
SDI  
15  
SDO  
SCLK  
Ordering Information  
Temperature Range  
0°C TA +70°C  
NS Package  
Number  
Order Number  
Device Marking  
LM9822CCWM1  
LM9822CCWMX2  
LM9822CCWM  
LM9822CCWM  
M28B  
M28B  
1
2
Notes: - Rail transport media, 26 parts per rail, - Tape and reel transport media, 1000 parts per reel  
TRI-STATis a registered trademark of National Semiconductor Corporation.  
©1999 National Semiconductor Corporation  
www.national.com  
LM9822 Block Diagram  
VD  
VA  
AGND  
VA  
AGND  
DGND  
Gain  
Boost  
Static  
Offset  
DACs  
Coarse Color  
Balance PGAs  
OSR  
RED OS  
from CCD  
x0.93  
to x3  
+
+
x1or x3  
x1or x3  
CDS  
CDS  
CDS  
Offset  
DACR  
OSG  
GREEN OS  
14  
14 bits  
to 8 bit  
Bytes  
14-Bit  
ADC  
x0.93  
to x3  
+
+
D7 - D0  
from CCD  
Offset  
DACG  
OSB  
x0.93  
to x3  
BLUE OS  
from CCD  
+
+
x1or x3  
1
VREF+  
VREFMID  
VREF-  
Offset  
DACB  
5
Internal  
Bandgap  
Reference  
VClamp  
6
SCLK  
SDI  
VBANDGAP  
Serial  
Interface  
Timing and Control  
SDO  
SEN  
MCLK CLMP VSMP  
Absolute Maximum Ratings (Notes 1& 2)  
Operating Ratings (Notes 1& 2)  
Positive Supply Voltage (V+=VA=VD)  
OperatingTemperature Range  
VA Supply Voltage  
T
MIN=0°CTATMAX=+70°C  
+4.75V to +5.25V  
+3.0V to +5.25V  
100mV  
With Respect to GND=AGND=DGND  
Voltage On Any Input or Output Pin  
Input Current at any pin (Note 3)  
Package Input Current (Note 3)  
Package Dissipation at TA = 25°C  
ESD Susceptibility (Note 5)  
Human Body Model  
6.5V  
-0.3V to V++0.3V  
±25mA  
V
D SupplyVoltage  
VD-VA  
±50mA  
(Note 4)  
OSR, OSG, OSB  
InputVoltage Range  
-0.05V to A + 0.05V  
SCLK, SDI, SEN, MCLK, VSMP, CLMP  
InputVoltage Range  
7000V  
450V  
-0.05V to VD + 0.05V  
Machine Model  
Soldering Information  
Infrared, 10 seconds (Note 6)  
Storage Temperature  
235°C  
-65°C to +150°C  
Electrical Characteristics  
The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz. Boldface limits apply  
for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7, 8, 12 & 16)  
Typical  
(Note 9)  
Limits  
(Note 10)  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
CCD/CIS Source Requirements for Full Specified Accuracy and Dynamic Range  
(Note 12)  
Gain = 0.933  
Gain = 3.0  
Gain = 9.0  
2.1  
0.65  
0.21  
V
V
V
Sensor’s Maximum Peak Differential  
Signal Range  
VOS PEAK  
Full Channel Linearity (In units of 12 bit LSBs)  
(Note 14)  
+0.9  
-0.4  
+2  
-0.9  
DNL  
INL  
Differential Non-Linearity  
LSB(max)  
LSB(max)  
+5  
-7  
Integral Non-Linearity Error (Note 11)  
±2.2  
Analog Input Characteristics  
OS , OS , OSB Input Capacitance  
5
pF  
µA (max)  
nA  
R
G
Measured with OS = 3.5VDC  
CDS disabled  
20  
10  
25  
5
OS , OS , OSB Input Leakage Current  
R
G
CDS enabled  
Coarse Color Balance PGA Characteristics  
Monotonicity  
bits (min)  
.90  
.96  
V/V (min)  
V/V (max)  
G
G
0 (Minimum PGA Gain)  
31 (Maximum PGA Gain)  
PGA Setting = 0  
PGA Setting = 31  
0.93  
3.0  
2.95  
3.07  
V/V (min)  
V/V (max)  
x3 Boost Setting On  
(Bit 5 of Gain Register is set)  
2.86  
3.08  
V/V (min)  
V/V (max)  
x3 Boost Gain  
3.0  
Gain Error at any gain (Note 13)  
±0.3  
1.6  
% (max)  
Static OffsetDAC Characteristics (In units of 12 bit LSBs)  
Monotonicity  
6
bits (min)  
13  
24  
LSB (min)  
LSB (max)  
OffsetDAC LSB size  
PGA gain = 1  
18.9  
OffsetDAC Adjustment Range  
PGA gain = 1  
3
±585  
±570  
LSB (min)  
www.national.com  
Electrical Characteristics (Continued)  
The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz. Boldface limits apply  
for TA=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7, 8, 12 & 16)  
Typical  
(Note 9)  
Limits  
(Note 10)  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Internal Reference Characteristics  
V
Mid Reference Output Voltage  
Positive Reference Output Voltage  
Negative Reference OutputVoltage  
Differential Reference Voltage  
2.5  
3.5  
1.5  
V
V
V
REFMID  
V
REF+ OUT  
VREF- OUT  
VREF  
2.0  
V
V
REF+ OUT - VREF- OUT  
System Characteristics (In units of 12 bit LSBs) (see section 5.1, Internal Offsets)  
Analog Channel Gain Constant  
(ADC Codes/V)  
Includes voltage reference  
variation, gain setting = 1  
1934  
2281  
LSB (min)  
LSB (max)  
C
2107  
17.3  
27  
Pre-Boost Analog Channel Offset Error,  
CCD Mode  
-61  
+94  
LSB (min)  
LSB (max)  
VOS1  
VOS1  
VOS2  
VOS3  
Pre-Boost Analog Channel Offset Error,  
CIS Mode  
-49  
+103  
LSB (min)  
LSB (max)  
-124  
+44  
LSB (min)  
LSB (max)  
Pre-PGA Analog Channel Offset Error  
Post-PGA Analog Channel Offset Error  
-40  
-130  
+55  
LSB (min)  
LSB (max)  
-38  
DC and Logic Electrical Characteristics  
The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz. Boldface limits apply  
for TA=TJ=TMIN to TMAX; all other limits A=TJ=25°C. (Notes 7& 8)  
Typical  
(Note 9)  
Limits  
(Note 10)  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
SCLK, SDI, SEN, MCLK, VSMP,CLMP Digital Input Characteristics  
VIN(1)  
VIN(0)  
Logical “1” Input Voltage  
Logical “0” Input Voltage  
VA=5.25V  
VA=4.75V  
2.0  
0.8  
V (max)  
V (min)  
V
IN=VA  
0.1  
-0.1  
µA(max)  
µA(max)  
IIN  
Input Leakage Current  
Input Capacitance  
VIN=DGND  
CIN  
5
pF  
D0-D7 Digital Output Characteristics  
VOUT(1)  
VOUT(0)  
Logical “1” Output Voltage  
Logical “0” Output Voltage  
IOUT=-360µA  
IOUT=1.6mA  
0.8*VD  
0.2*VD  
V (min)  
V (max)  
Power Supply Characteristics  
Operating  
75  
675  
210  
2
108  
900  
475  
25  
mA (max)  
µA (max)  
µA (max)  
µA (max)  
IA  
Analog Supply Current  
Power Down  
Operating  
ID  
Digital Supply Current (Note 15)  
Power Down  
4
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AC Electrical Characteristics  
The following specifications apply for AGND=DGND=0V, VA=+5.0VDC, VD=+3.0 or +5.0VDC, fMCLK=12MHz, except where noted  
otherwise. Boldface limits apply for A=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7& 8)  
Typical  
(Note 9)  
Limits  
(Note 10)  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
fMCLK  
Maximum MCLK frequency  
MCLK period  
12  
MHz (min)  
ns (min)  
tMCLK  
83  
40  
60  
%(min)  
%(max)  
MCLK duty cycle  
tSCLK  
tSEN  
tSSU  
tSH  
Serial Clock Period  
Serial Enable high time  
SDI setup time  
tMCLK(min)  
tMCLK(min)  
ns (min)  
1
3
1
SDI hold time  
3
ns (min)  
V
D = 5.0V  
8.5  
19  
20  
tSDDO  
SCLK edge to new valid data  
ns (max)  
VD = 3.3V  
tVSU  
tVH  
tCSU  
tCH  
VSMP setup time  
VSMP hold time  
CLMP setup time  
CLMP hold time  
1
3
ns (min)  
ns (min)  
ns (min)  
ns (min)  
1
3
V
D = 5.0V  
16  
25  
25  
ns (max)  
ns (max)  
tDDO  
MCLK edge to new valid data  
VD = 3.3V  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional,  
but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characte ristics. The guaranteed specifications apply  
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the list ed test conditions.  
Note 2: All voltages are measured with respect to GND=AGND=DGND=0V, unless otherwise specified.  
Note 3: When the input voltage (V ) at any pin exceeds the power supplies (V <GND or V >V or V ), the current at that pin should be limited to 25mA. The 50m  
IN  
IN  
IN  
A
D
maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25mA to two.  
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T max, Θ and the ambient temperature, T . The maximum allow-  
JA  
J
A
able power dissipation at any temperature is P = (T max - T ) / Θ . T max = 150°C for this device. The typical thermal resistance ( Θ ) of this part when board mounted  
JA JA  
D
J
A
J
is 69°C/W for the M28B SOIC package.  
Note 5: Human body model, 100pF capacitor discharged through a 1.5k resistor. Machine model, 200 pF capacitor discharged through a 0resistor.  
Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any National Semiconductor Linear  
Data Book for other methods of soldering surface mount devices.  
Note 7: Two diodes clamp the OS analog inputs to AGND and V as shown below. This input protection, in combination with the external clamp capacitor and the output  
A
impedance of the sensor, prevents damage to the LM9822 from transients during power-up.  
V
A
TO INTERNAL  
CIRCUITRY  
OS Input  
AGND  
Note 8: To guarantee accuracy, it is required that  
V and V be connected to clean, low noise power supplies, with separate bypass capacitors at each supply pin. When  
A D  
both V and V are operated at 5.0V, they must be powered by the same regulator, with separate power planes or traces and separate bypass capacitors at each supply pin.  
A
D
5
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Electrical Characteristics (Continued)  
Note 9: Typicals are at T =T =25°C, f  
= 12MHz, and represent most likely parametric norm.  
MCLK  
J
A
Note 10: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).  
Note 11: Full channel integral non-linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that best fits the actual transfer  
function of the AFE.  
Note 12: The sensor’s maximum peak differential signal range is defined as the peak sensor output voltage for a white (full scale) image, with respect to the dark reference  
level.  
CIS Output Signal  
CCD Output Signal  
VWHIT  
VRFT  
VWHITE  
Black Level  
VREF  
Note 13: PGA Gain Error is the maximum difference between the measured gain for any PGA code and the ideal gain calculated using:  
V
---  
PGA code  
32  
31  
Gain  
=
G
+ X---------------------------- where  
X
=
(
G
)
G
0
----- .  
PGA  
0
31  
V
32  
Note 14: Full Channel INL and DNL are tested with CDS disabled, negative signal polarity, DOE = 0, and a single OS input with a gain register setting of 1 (000001b) and  
an offset register setting of 0 (000000b).  
Note 15: The digital supply current (ID) does not include the load, data and switching frequency dependent current required to drive the digital output bus on pins (D7 - D0).  
The current required to switch the digital data bus can be calculated from: Isw = 2*Nd*Psw*CL*V /t  
MCLK  
where Nd is total number of data pins, Psw is the probability of  
is the period of the MCLK input. For most applications, Nd  
D
each data bit switching, CL is the capacitive loading on each data pin, V is the digital supply voltage and t  
D
MCLK  
is 8, Psw is 0.5, and V is 5V,and the switching current can be calculated from: Isw = 40*CL/tMCLK. (With  
at 3.3V, the equation becomes: Isw = 26.4*CL/t  
D
.) For  
MCLK  
D
example, if the capacitive load on each digital output pin (D7 - D0) is 20pF and the period of t  
is 1/12MHz or 83ns, then the digital switching current would be 9.6mA.  
MCLK  
The calculated digital switching current will be drawn through the V pin and should be considered as part of the total power budget for the LM9822.  
D
Note 16: All specifications quoted in LSBs are based on 12 bit resolution.  
6
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Typical Performance Characteristics  
Full Channel DNL and INL  
(Divide by 2, Monochrome Mode, 6 MHz Pixel Rate)  
Typical 14 Bit DNL  
Typical 14 Bit INL  
10  
5
2
1.5  
1
0
LSB  
-5  
-10  
-15  
LSB  
0.5  
0
-0.5  
-1  
0
4096  
8192  
12288 16384  
0
4096  
8192  
12288  
16384  
OutputCode  
OutputCode  
Typical 12 Bit DNL  
Typical 12 Bit INL  
2
1.5  
1
1.5  
1
0.5  
0
LSB  
0.5  
0
LSB -0.5  
-1  
-1.5  
-2  
-2.5  
-0.5  
-1  
0
1024  
2048  
OutputCode  
3072  
4096  
0
1024  
2048  
OutputCode  
3072  
4096  
Note: The LM9822 provides 14-bit data for high resolution imaging applications. The typical full channel device performance is shown  
in the above graphs. In many applications, particularly those where high speed is important, or where lower cost CCD and CIS sensors  
are used, the signal source is only accurate to 12 bits. In these applications, only 12-bit of data may be used. 12-bit DNL and INL plots  
have also been provided to illustrate the performance of the LM9822 in these applications.  
7
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Pin Descriptions  
Analog Power  
Data Output  
V
The two A pins are the analog supply pins.  
They should be connected to a voltage  
source of +5V and bypassed to AGND with a  
0.1µF monolithic capacitor in parallel with a  
10µF tantalum capacitor.  
A
-
Data Output pins. The 14 bit conversion  
results of the ADC are multiplexed in 8 bit  
bytes to D7-D0 synchronous with MCLK.  
The MSB consists of data bits d13-d6 on  
pins D7-D0 and the LSB consists of d5-d0  
on pins D7-D3 with D1 and D0low.  
D7 D0  
AGND  
These two pins are the ground returns for  
the analog supplies.  
Serial Input/Output  
V
D
This is the positive supply pin for the digital  
I/O pins. It should be connected to a voltage  
source between +3.3V and +5.0V and be  
bypassed to DGND with a 0.1µF monolithic  
capacitor in parallel with a 10µF tantalum  
capacitor.  
SCLK  
SDO  
Serial Shift Clock. Input data on SDI is valid  
on the rising edge of SCLK. The minimum  
SCLK period is 1 tMCLK  
.
Serial Data Output. Data bits are shifted out  
of SDO on falling edges of SCLK. The first  
eight falling edges of SCLK after SEN goes  
low will shift out eight data bits (MSB first)  
from the configuration register addressed  
during the previous SEN low time.  
DGND  
This is the ground return for the digital sup-  
ply.  
Analog Input/Output  
SDI  
Serial Data Input. A read/write bit, followed  
by a four address bits and eight data bits is  
shifted into SDI, MSB first. Data should be  
valid on the rising edge of SCLK. If the  
read/write bit is a “0” (a write), then the  
shifted data bits will be stored. If the  
read/write bit is a “1” (a read), then the data  
bits will be ignored, and SDO will shift out  
the addressed register’s contents during the  
next SEN low time.  
OS , OS , OS  
Analog Inputs. These inputs (for Red,  
Green, and Blue) should be tied to the sen-  
sor’s OS (Output Signal) through DC block-  
ing capacitors.  
R
G
B
V
V
V
Voltage reference bypass pins. VREF+  
,
REF+  
REFMID  
,
,
VREFMID, and VREF- should each be  
REF-  
bypassed to AGND through a 0.1uF mono-  
lithic capacitor.  
Timing Control  
SEN  
Shift enable and load signal. When SEN is  
low, data is shifted into SDI. When SEN  
goes high, the last thirteen bits (one  
read/write, four address and eight data)  
shifted into SDI will be used to program the  
addressed configuration register. SEN must  
be high for at least 3 MCLK cycles between  
SEN low times.  
MCLK  
VSMP  
Master clock input. The ADC conversion  
rate will be 1/2 of MCLK. 12MHz is the max-  
imum frequency for MCLK.  
Sample timing input signal. If VSMP is high  
on the rising edge of MCLK, the input is  
sampled on the rising edge of the next  
MCLK. The reference signal for the next  
pixel will be sampled one to four MCLKs  
later, depending on the value in the  
CDSREF configuration bits. If CDS is not  
enabled, the internal reference will be sam-  
pled during the reference sample time.  
Connection Diagram  
The number of MCLK cycles between  
VSMP pulses determines the pixel rate.  
Timing Diagrams 1 through 6 illustrate the  
VSMP timings for all the valid pixel rates.  
D7  
D6  
D5  
V
28  
1
BANDGAP  
V
27  
26  
25  
24  
2
REFMID  
V
3
A
D4  
D3  
D2  
D1  
AGND  
4
OS  
R
5
6
7
8
Note: See the applications section of the  
datasheet for the proper timing relationships  
between VSMP and MCLK.  
LM9822  
28 pin  
SOIC  
V
23  
22  
21  
REF+  
OS  
G
V
D0  
REF-  
CLMP  
Clamp timing input. If CLMP and VSMP are  
high on the rising edge of MCLK, all three  
OS inputs will be internally connected to  
OS  
B
VD  
20  
19  
18  
17  
16  
15  
9
V
A
DGND  
CLMP  
VSMP  
MCLK  
10  
11  
12  
13  
14  
AGND  
SEN  
V
CLAMP during the nextpixel. VCLAMP is either  
VREF+ or VREF- depending on the state of  
the Signal Polarity bit in the Sample Mode  
register (Reg. 0, Bit 4).  
SDI  
SDO  
SCLK  
8
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Timing Diagrams  
OS , OS  
R
,
G
OS  
B
MCLK  
VSMP  
ADC Clock  
(internal)  
N-1  
N
Sample Signal  
Level  
Sample Reference  
Level  
N
N+1  
BH  
D7 -D0  
GH  
GL  
BH  
BL  
RH  
RL  
GH  
GL  
BL  
RH  
N-5  
N-5  
N-4  
N-4  
N-4  
H = d13-d6  
L = d5-d0  
DOE (Register 0, Bit 4) = 0  
Divide by 6 Color Mode Sample and Data Output Timing  
Diagram 1:  
OS  
G
MCLK  
VSMP  
ADC Clock  
(internal)  
N-1  
N
Sample Signal  
Level  
Sample Reference  
Level  
N
XX  
DOE (Register 0, Bit 4) = 0  
N+1  
XX  
D7 -D0  
XX  
XX  
XX  
GH  
GL  
XX  
XX  
XX  
GH  
N-4  
H = d13-d6  
L = d5-d0  
Divide by 6 Monochrome Mode Sample and Data Output Timing (Green Input shown)  
Diagram 2:  
OS , OS  
,
G
R
OS  
B
MCLK  
VSMP  
ADC Clock  
(internal)  
Sample Signal  
Level  
Sample Reference  
Level  
N-1  
N
N
N+1  
D7 -D0  
XX  
RH  
RL  
GH  
GL  
BH  
BL  
XX  
XX  
RH  
RL  
GH  
N-4  
N-4  
N-4  
N-3  
H = d13-d6  
L = d5-d0  
DOE (Register 0, Bit 4) = 0  
Divide by 8 Color Mode Sample and Data Output Timing  
Diagram 3:  
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Timing Diagrams (Continued)  
OS  
G
MCLK  
VSMP  
ADC Clock  
(internal)  
N
Sample Signal  
Level  
Sample Reference  
Level  
N-1  
N
N+1  
XX  
D7 -D0  
XX  
GH  
GL  
XX  
XX  
XX  
XX  
XX  
XX  
GH  
GL  
N-4  
N-3  
H = d13-d6  
L = d5-d0  
DOE (Register 0, Bit 4) = 0  
Divide by 8 Monochrome Mode Sample and Data Output Timing (Green Input Shown)  
Diagram 4:  
OS  
G
MCLK  
VSMP  
ADC Clock  
(internal)  
N-1  
N+1  
N+2  
N
Sample Signal  
Level  
Sample Reference  
Level  
N
N+1  
N+2  
GL  
CDSREF = 00  
D7 -D0  
GH  
GL  
N-11  
DOE (Register 0, Bit 4) = 0  
GH  
GL  
N-10  
GH  
GH  
GL  
N-9  
H = d13-d6  
L = d5-d0  
Divide by 3 Monochrome Mode Sample and Data Output Timing (Green Input shown)  
Diagram 5:  
OS  
G
MCLK  
VSMP  
ADC Clock  
(internal)  
N-1  
N+2  
N+3  
N
N+1  
Sample Signal  
Level  
Sample Reference N-1  
N
N+1  
N+2  
GL  
N+3  
GL  
N+4  
GL  
Level  
CDSREF = 00  
D7 -D0  
GH  
GL  
GH  
GL  
N-10  
GH  
GH  
GH  
N-11  
N-9  
N-8  
N-7  
H = d13-d6  
L = d5-d0  
DOE (Register 0, Bit 4) = 0  
Divide by 2 Monochrome Mode Sample and Data Output Timing (Green Input shown)  
Diagram 6:  
10  
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Timing Diagrams (Continued)  
OS , OS  
R
,
G
OS  
B
MCLK  
VSMP  
Sample Signal  
Sample Reference  
D3 -D0  
CDSREF=00  
CDSREF=01  
CDSREF=10  
CDSREF=11  
Programmable Reference Sample Timing  
Diagram 7:  
OS  
MCLK  
VSMP  
CLMP  
N-1  
N+1  
N+2  
N
Sample Signal  
Sample Reference  
N
N+1  
N+2  
CDSREF = 00  
Clamp On  
(internal signal)  
Clamp Timing With SMPCL = 0  
Diagram 8:  
OS  
MCLK  
VSMP  
CLMP  
N-1  
N+1  
N+2  
N
Sample Signal  
Sample Reference  
N
N+1  
N+2  
CDSREF = 00  
Clamp On  
(internal signal)  
Clamp Timing With SMPCL = 1  
Diagram 9:  
SCLK  
SEN  
SDI  
XX  
0
A3  
A2  
A1  
A0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
XX  
R/W bit  
Configuration Register Serial Write Timing  
Diagram 10:  
SCLK  
SEN  
SDI  
XX  
1
A3 - A0  
XX  
1
A3 - A0  
b7 - b0  
SDO  
XX  
R/W bit  
Configuration Register Serial Read Timing  
Diagram 11:  
11  
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Timing Diagrams (Continued)  
t
SCLK  
1/2 t  
1/2 t  
SCLK  
SCLK  
SCLK  
t
SEN  
SEN  
SDI  
t
t
t
t
SH  
SSU  
SH  
SSU  
D2  
D1  
D0  
XX  
R/W  
D7  
A3  
D6  
A2  
A1  
D4  
A0  
D3  
D7  
D2  
t
SDDO  
SDO  
XX  
D5  
Serial Input and Output Timing  
Diagram 12:  
t
MCLK  
MCLK  
VSMP  
t
t
t
VSU  
VH  
t
CSU  
CH  
CLMP  
t
DDO  
DOE = 1  
DOE = 0  
D7 - D0  
t
DDO  
D7 - D0  
MCLK, VSMP and CLMP Input Timing and Data Output Timing  
Diagram 13:  
12  
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Table 1: Configuration Register Address Table  
Address  
(Binary)  
Register Name and Bit Definitions  
B5 B4 B3 B2  
Sample Mode (Power Up Default = 62h)  
CDS Polarity SMPCL CDSREF1 CDSREF0  
Red Offset Setting (Power Up Default = 00h)  
Polarity MSB  
Green Offset Setting (Power Up Default = 00h)  
Polarity MSB  
Blue Offset Setting (Power Up Default = 00h)  
Polarity MSB  
Red Gain Setting (Power Up Default = 00h)  
x3 MSB  
Green Gain Setting (Power Up Default = 00h)  
x3 MSB  
Blue Gain Setting (Power Up Default = 00h)  
x3 MSB  
Color Mode (Power Up Default = 00h)  
N/A N/A N/A N/A  
Test Register 0 (Power Up Default = 00h)  
A3  
0
A2  
A1  
0
A0  
0
B7  
I/O Mode  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
0
B6  
DOE  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
0
B1  
B0  
PD  
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
LSB  
LSB  
LSB  
LSB  
LSB  
LSB  
CM0  
0
CM1  
0
0
0
0
0
0
0
Test Register 1 (Power Up Default = 10h)  
0
0
0
1
0
0
0
Test Register 2 (Power Up Default = 00h)  
0
0
0
0
0
0
0
13  
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Table 2: Configuration Register Parameters  
Power-Up Default Register Settings are shown in Bold Italics  
Parameter  
Control Bits  
(Address)  
Result  
Sample Mode (0)  
B7  
0
1
I/O Mode  
Normal Output Driver Operation  
Reduced Slew Rate Output Driver Operation  
(0)  
B6  
0
DOE  
(Data Output Edge)  
(0)  
D7-D0 are clocked out (change) on the falling edge of MCLK - Recommended setting for  
lowest noise and best overall performance.  
1
D7-D0 are clocked out (change) on the rising edge of MCLK  
B5  
0
1
CDS (Enable)  
(0)  
CDS disabled (CIS)  
CDS Enabled (CCD)  
B4  
0
1
Signal Polarity  
(0)  
Negative Polarity (CCD) Clamping to VREF+  
Positive Polarity (CIS) Clamping to VREF-  
B3  
0
1
SMPCL  
(0)  
Clamp is on for 1 MCLK before reference sampled  
Clamp is on between the reference and the signal sample points  
B2  
0
0
1
1
B1  
0
1
0
1
Reference (for pixel N+1) sampled 1 MCLK cycle after signal (for pixel N) sampled  
Reference (for pixel N+1) sampled 2 MCLK cycle after signal (for pixel N) sampled  
Reference (for pixel N+1) sampled 3 MCLK cycle after signal (for pixel N) sampled  
Reference (for pixel N+1) sampled 4 MCLK cycle after signal (for pixel N) sampled  
CDSREF  
(0)  
PD  
(Power Down)  
(0)  
B0  
0
1
Operating  
Low Power Standby  
14  
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Table 2: Configuration Register Parameters (Continued)  
Power-Up Default Register Settings are shown in Bold Italics  
Parameter  
Control Bits  
(Address)  
Result  
Red, Green and Blue Offset DAC Settings (1, 2 & 3)  
B5  
0
1
Offset Polarity  
Offset Value  
Positive Offset  
Negative Offset  
B4(M  
SB)  
B3  
B2  
B3  
B1  
B2  
B0(LSB) Typical Offset = 20LSBs * Offset Value * PGA Gain  
Typical Offset (with PGA Gain = 1)  
B5  
(SIGN  
)
0
0
0
• • •  
0
0
1
1
1
• • •  
1
1
B4  
(MSB)  
0
0
0
• • •  
1
1
0
0
B1  
B0  
(LSB)  
0
1
0
• • •  
0
1
0
1
12 bit LSBs  
0.00  
+20  
0
0
0
• • •  
1
1
0
0
0
• • •  
1
0
0
0
• • •  
1
1
0
0
0
• • •  
1
0
0
1
• • •  
1
1
0
0
1
• • •  
1
+40  
• • •  
+600  
+620  
0
-20  
-40  
• • •  
-600  
-620  
Typical Offset  
Values  
0
• • •  
1
0
• • •  
0
1
1
1
1
1
Red, Green and Blue Gain Settings (4, 5 & 6)  
B5  
0
1
Boost Gain Enable  
Boost Gain = 1V/V  
Boost Gain = 3V/V  
B4(M  
SB)  
PGA Gain Value  
Gain  
B3  
PGA Gain (V/V) =.933 + 0.0667 * (PGA Gain Value)  
B2  
B1  
B0(LSB)  
Gain = Boost Gain * PGA Gain  
15  
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Table 2: Configuration Register Parameters (Continued)  
Power-Up Default Register Settings are shown in Bold Italics  
Parameter  
Control Bits  
(Address)  
Result  
B5  
B4  
(MSB)  
0
0
B3  
B2  
B1  
B0  
(LSB)  
0
1
Typical Gain  
(V/V)  
0.93  
x3)  
0
(
0
0
0
0
0
0
0
1.00  
0
0
0
0
1
0
1.07  
• • •  
0
• • •  
1
• • •  
1
• • •  
1
• • •  
0
• • •  
1
• • •  
2.87  
0
1
1
1
1
0
2.93  
Typical Gain Values  
0
• • •  
1
1
• • •  
0
1
• • •  
0
1
• • •  
0
1
• • •  
0
1
• • •  
0
3.00  
• • •  
2.79  
1
0
0
0
0
1
3.00  
1
0
0
0
1
0
3.20  
• • •  
1
• • •  
1
• • •  
1
• • •  
1
• • •  
0
• • •  
1
• • •  
8.60  
1
1
1
1
1
0
8.80  
1
1
1
1
1
1
9.00  
Color Mode (7)  
B1  
0
B0  
0
Color  
Color Mode  
0
1
1
1
0
1
Monochrome - Red  
Monochrome - Green  
Monochrome - Blue  
Reserved Register 0 (8)  
Register 0  
Register 1  
Register 2  
0 0 0 0 0 0 0 0  
Reserved  
Reserved  
Reserved  
Reserved, always set to 00h.  
Reserved, always set to 10h.  
Reserved, always set to 00h.  
Reserved Register 1 (9)  
0 0 0 1 0 0 0 0  
Reserved Register 2 (A)  
0 0 0 0 0 0 0 0  
16  
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of Q1, and other sources of error. When the shift register clock  
(Ø1) makes a low to high transition (period 4), the electrons from  
the next pixel flow into C1. The charge across C1 now contains  
the voltage proportional to the number of electrons plus VRESID-  
UAL, an error term. If OS is sampled at the end of period 3 and  
that voltage is subtracted from the OS at the end of period 4, the  
VRESIDUAL term is canceled and the noise on the signal is  
reduced ([VSIGNAL+VRESIDUAL]-VRESIDUAL = VSIGNAL). This is the  
principal of Correlated Double Sampling.  
Applications Information  
1.0 Introduction  
The LM9822 is a high performance scanner Analog Font End  
(AFE) for image sensor processing systems. It is designed to  
work with color CCD and CIS image sensors and provides a full 3  
channel sampling, gain and offset correction system, coupled  
with a 14 bit high speed analog to digital converter. A typical  
application of the LM9822 is in a color flatbed document scanner.  
The image sensing and processing portion of the system would  
be configured similar to that shown in Figure 1.  
3.0 CIS Mode (CDS Off, Selectable Signal Polarity)  
The also LM9822 supports CIS (Contact Image Sensor) devices.  
The output signal of a CIS sensor (Figure 3) differs from a CCD  
signal in two primary ways: its output usually increases with  
increasing signal strength, and it does not usually have a refer-  
ence level as an integral part of the output waveform of every  
pixel.  
To Host  
CCD Control  
ASIC  
OSR  
AFE Control  
OSG  
OSB  
8
8 Output Data  
OS (CIS)  
RAM  
Other scanner elements  
omitted for simplicity.  
Figure 1: LM9822 in Basic Color Scanner  
OS (CCD)  
2.0 CDS Correlated Double Sampler  
1
2
3
4
5
The LM9822 uses a high-performance CDS (Correlated Double  
Sampling) circuit to remove many sources of noise and error from  
the image sensor output signal. It also supports CIS image sen-  
sors with a single ended sampling mode.  
CIS  
Figure 3:  
When the LM9822 is in CIS (CDS off) mode (Register 0, B5=1), it  
uses either V or V as the reference (or black) voltage for  
REF+  
REF-  
each pixel (depending on the signal polarity setting (Register 0,  
Bit 4)). If the signal polarity is set to one, then VREF- will be sam-  
Figure 2 shows the output stage of a typical CCD and the result-  
ing output waveform:  
pled as the reference level. If it is set to zero, then V  
sampled as the reference level.  
will be  
REF+  
VDD  
Q1  
C1  
RS (RESET)  
4.0 Programmable Gain  
e-  
Q2  
The output of the Sampler drives the input of the x3 Boost gain  
stage. The gain of each x3 Boost gain is 3V/V if bit B5 of that  
color’s gain register (register 4,5, or 6) is set, or 1V/V if bit B5 is  
cleared. The output of each x3 gain stage is the input an offset  
DAC and the output of each offset DAC is the input to a PGA  
(Programmable Gain Amplifier). Each PGA provides 5 bits of gain  
correction over a 0.93V/V to 3V/V (-0.6 to 9.5dB) range. The x3  
Boost gain stage and the PGA can be combined for an overall  
gain range of 0.93V/V to 9.0V/V (-.6 to 19dB). The gain setting for  
each color (registers 4, 5 and 6) should be set during calibration  
to bring the maximum amplitude of the strongest pixel to a level  
just below the desired maximum output from the ADC. The PGA  
gain is determined by the following equation:  
OS  
(from shift register)  
VSS  
Ø1  
RS  
OS  
1
2
3
4
5
Figure 2: CDS  
V
V
---  
PGA Gain  
= 0.933 + .0667 (value in bits B4-B0)  
Capacitor C1 converts the electrons coming from the CCD’s shift  
register to an analog voltage. The source follower output stage  
(Q2) buffers this voltage before it leaves the CCD. Q1 resets the  
voltage across capacitor C1 between pixels at intervals 2 and 5.  
When Q1 is on, the output signal (OS) is at its most positive volt-  
age. After Q1 turns off (period 3), the OS level represents the  
residual voltage across C1 (VRESIDUAL). VRESIDUAL includes  
charge injection from Q1, thermal noise from the ON resistance  
PGA Gain  
Equation 1:  
If the x3 Boost gain is enabled then the overall signal gain will be  
three times the PGA gain.  
17  
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Applications Information (Continued)  
5.0 Offset DAC  
6.0 Clamping  
The Offset DACs remove the DC offsets generated by the sensor  
and the LM9822’s analog signal chain (see section 5.1, Internal  
Offsets). The DAC value for each color (registers 1,2 and 3)  
should be set during calibration to the lowest value that still  
results in an ADC output code greater than zero for all the pixels  
when scanning a black line. With a PGA gain of 1V/V, each LSB  
of the offset DAC typically adds the equivalent of 20 ADC LSBs,  
providing a total offset adjustment range of ±590 ADC LSBs. The  
Offset DAC’s output voltage is given by:  
To perform a DC restore across the AC coupling capacitors at the  
beginning of every line, the LM9822 implements a clamping func-  
tion. The clamping function is initiated by asserting the CLMP  
input. If CLMP and VSMP are both high on a rising edge of  
MCLK, all three OS inputs will be internally connected to VREF+ or  
V
REF- during the next pixel, depending on bit 4 of register 0. If bit 4  
is set to one (positive signal polarity), then the OS input will be  
connected to VREF-. If bit 4 is set to zero (negative signal polarity),  
then it will be connected to V  
.
REF+  
6.1 Clamp Capacitor Selection  
V
= 9.75mV (value in B4 - B0)  
DAC  
Equation 2:  
Offset DAC OutputVoltage  
The output signal of many sensors rides on a DC offset (greater  
than 5V for many CCDs) which is incompatible with the LM9822’s  
5V operation. To eliminate this offset without resorting to addi-  
tional higher voltage components, the output of the sensor is AC  
In terms of 12 bit output codes, the offset is given by:  
Offse = t20L SBs(value in B4 - B0) PGA Gain  
coupled to the LM9822 through a DC blocking capacitor, CCLAMP  
.
Offset in ADC Output Codes  
Equation 3:  
The sensor’s DOS output, if available, is not used. The value of  
this capacitor is determined by the leakage current of the  
LM9822’s OS input and the output impedance of the sensor. The  
leakage through the OS input determines how quickly the capaci-  
tor value will drift from the clamp value of VREF+ or VREF-, which  
then determines how many pixels can be processed before the  
droop causes errors in the conversion (±0.1V is the recom-  
mended limit for CDS operation). The output impedance of the  
sensor determines how quickly the capacitor can be charged to  
the clamp value during the black reference period at the begin-  
ning of every line.  
The offset is positive if bit B5 is cleared and negative if B5 is set.  
Since the analog offset is added before the PGA gain, the value  
of the PGA gain must be considered when selecting the offset  
DAC values.  
5.1 Internal Offsets  
Figure 4 is a model of the LM9822’s internal offsets. Equation 4  
shows how to calculate the expected output code given the input  
voltage (VIN), the LM9822 internal offsets ( OS1, VOS2, VOS3),  
the programmed offset DAC voltage (V DAC), the programmed  
gains (GB, GPGA) and the analog channel gain constant C.  
The minimum clamp capacitor value is determined by the maxi-  
mum droop the LM9822 can tolerate while converting one sensor  
line. The minimum clamp capacitor valueis much smaller for CDS  
mode applications than it is for CIS mode applications.  
C is a constant that combines the gain error through the AFE, ref-  
erence voltage variance, and analog voltage to digital code con-  
version into one constant. Ideally, C = 2048 codes/V (4096  
codes/2V) in 12 bit LSBs. Manufacturing tolerances widen the  
range of C (see Electrical Specifications).  
Inside LM9822  
CI  
CS  
OS  
CCLAMP  
P2  
P1  
x3 Boost  
1V/V or  
3V/V  
PGA  
0.93V/V to  
3V/V  
VIN  
+
+
+
+
VOS2  
+
+
+
+
VOS1  
GPGA  
GB  
ADC  
VIN  
DOUT  
Σ
Σ
Σ
Σ
+
VOS3  
CDS Mode Input Circuitry  
VDAC  
Inside LM9822  
CI  
Offset  
DAC  
CS  
P1  
OS  
P2  
Internal Offset Model  
Figure 4:  
VIN  
CCLAMP  
D
= (((V + V )G + V  
+ V  
)G  
OS2 PGA  
+ V  
)C  
OS3  
OUT  
IN  
OS1  
B
DAC  
+
Vref  
Equation 4: Output code calculation with internal offsets  
Equation 5 is a simplification of the output code calculation,  
neglecting the LM9822’s internal offsets.  
CIS Mode Input Circuitry  
Input Circuitry  
Figure 5:  
The LM9822 input current is considerably less when the LM9822  
is operating in CDS mode. In CDS mode, the LM9822 average  
input current is no more than 25nA. With CDS disabled, which will  
likely be the case when CIS sensors are used, the LM9822 input  
impedance will be 1/(f Sample*CS). where fSample is the sample  
rate of the analog input and CS is 2pF.  
D
= (V  
G
+ V  
)G C  
PGA  
OUT  
IN  
B
DAC  
Equation 5: Simplified output code calculation  
18  
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Applications Information (Continued)  
6.1.1 CDS mode Minimum Clamp Capacitor Calculation:  
sample reference time, if SMPCL=1, the clamps are on immedi-  
ately after the sample reference time. If the LM9822 is operated  
in Divide By 2 mode, then the clamp is on 50% of the time when  
CLMP is high. In this case the available charge time per line can  
be calculated using:  
The following equation takes the maximum leakage current into  
the OS input, the maximum allowable droop, the number of pixels  
on the sensor, and the pixel conversion rate, fVSMP, and provides  
the minimum clamp capacitor value:  
Number of optical black pixels  
t
= -------------------------------------------------------------------------------  
CLAMP  
2f  
VSMP  
i
C
= --------dt  
CLAMP MIN  
Clamp Time Per Line Calculation  
dV  
Equation 12:  
leakage current (A)number of pixel  
For example, if a sensor has 18 black reference pixels and fVSMP  
is 2MHz with a 50% duty cycle, then tCLAMP is 4.5µs. Other  
“Divide By” modes will have lower or higher clamp duty cycles  
= ---------------------------------------------------------------------------------------------  
max droop(V)  
f
VSMP  
Calculation  
CDS mode C  
Equation 6:  
CLAMP MIN  
accordingly, depending on the SMPCL setting. See  
Diagram 8,  
For example, if the OS input leakage current is 25nA worst-case,  
the sensor has 2700 active pixels, the conversion rate is 2MHz  
(tVSMP = 500ns), and the max droop desired is 0.1V, the minimum  
clamp capacitor value is:  
and  
Clamp Timing With SMPCL = 0  
Diagram 9, Clamp Timing  
.
With SMPCL = 1  
The following equation takes the number of optical black pixels,  
the amount of time (per pixel) that the clamp is closed, the sen-  
sor’s output impedance, and the desired accuracy of the final  
clamp voltage and provides the maximum clamp capacitor value  
that allows the clamp capacitor to settle to the desired accuracy  
within a single line:  
25n 270  
C
= ----------------------------  
0.1V 2MHz  
CLAMP MIN  
= 340p  
CDS mode CCLAMP MIN Example  
Equation 7:  
t
1
C
= -------------------------------------  
Rln(accuracy)  
6.1.2 CIS mode Minimum Clamp Capacitor Calculation:  
CLAMP MAX  
t
If CDS is disabled, then the maximum LM9822 OS input leakage  
current can be calculated from:  
CLAMP  
1
= -------------------------- --------------------------------  
R
ln(accuracy)  
CLAMP  
I
= V  
f
C
leakage  
SAT SampCLK SAMP  
Equation 13: CCLAMP MAX for a single line of charge time  
CIS mode Input Leakage Current Calculation  
Equation 8:  
Where tCLAMP is the amount of time (per line) that the clamp is  
on, RCLAMP is the output impedance of the CCD plus 50for the  
LM9822 internal clamp switch, and accuracy is the ratio of the  
worst-case initial capacitor voltage to the desired final capacitor  
voltage. If tCLAMP is 4.5µs, the output impedance of the sensor is  
1500, the worst case voltage change required across the capac-  
itor (before the first line) is 5V, and the desired accuracy after  
clamping is to within 0.1V (accuracy = 5/0.1 = 50), then:  
where VSAT is the peak pixel signal swing of the CIS OS output  
and CSAMP is the capacitance of the LM9822 internal sampling  
capacitor (2pF). Inserting this into Equation 6 results in:  
i
C
= --------dt  
dV  
CLAMP MIN  
V
t
SAT  
SampCLK  
-----------------------------------num pixel  
= --------------------------- C  
SAMP  
t
max droop(V)  
SampCLK  
4.5µs  
1
C
= -------------------------------  
CLAMP MAX  
CIS mode CCLAMP MIN Calculation  
Equation 9:  
155 ln(50)  
= 728p  
with CSAMP equal to 2pF and V SAT equal to 2V (the LM9822  
maximum input signal), then Equation 9 reduces to:  
C
Example  
Equation 14:  
The final value for C  
CLAMP MAX  
should be less than or equal to  
CCLAMP MAX, but no less than CCLAMP MIN.  
CLAMP  
4p(F)(V)  
-----------------------------------  
C
=
num pixels  
CLAMP MIN  
max droop(V)  
CIS mode CCLAMP MIN Calculation  
Equation 10:  
In some cases, depending primarily on the choice of sensor,  
CCLAMP MAX may actually be less than CCLAMP MIN, meaning that  
the capacitor can not be charged to its final voltage during the  
black pixels at the beginning of a line and hold it’s voltage without  
drooping for the duration of that line. This is usually not a problem  
because in most applications the sensor is clocked continuously  
as soon as power is applied. In this case, a larger capacitor can  
be used (guaranteeing that the CCLAMP MIN requirement is met),  
and the final clamp voltage is forced across the capacitor over  
multiple lines. This equation calculates how many lines are  
required before the capacitor settles to the desired accuracy:  
C
In CIS mode (CDS disabled), the max droop limit must be much  
more carefully chosen, since any change in the clamp capacitor’s  
DC value will affect the LM9822 conversion results. If a droop of  
one 10 bit LSB across a line is considered acceptable, then the  
allowed droop voltage is calculated as: 2V/1024, or approximately  
2mV. If there are 2700 active pixels on a line then:  
4p(F)(V)  
2mV  
---------------------  
270  
C
=
CLAMP MIN  
= 5.4uF  
CIS mode C  
Calculation Example  
Equation 11:  
Initial Error Voltag  
Final Error Voltag  
CLAMP  
CLAMP MIN  
----------------------------------------------------  
line = sR  
------------------------ ln  
CLAMP  
t
CLAMP  
Number of Lines Required for Clamping  
Equation 15:  
6.1.3 Maximum Clamp Capacitor Calculation:  
Using the values shown before and a clamp capacitor value of  
0.01µF, this works out to be:  
The maximum size of the clamp capacitor is determined by the  
amount of time available to charge it to the desired value during  
the optical black portion of the sensor output. The internal clamp  
occurs when CLMP and VSMP are both high on a rising edge of  
MCLK. If SMPCL=0, the clamps are on immediately before the  
5V  
0.1V  
0.01µF  
lines = 155 ------------------- ln  
4.5µs  
-----------  
= 13.5 lines  
Clamping Lines Required Example  
Equation 16:  
19  
www.national.com  
Applications Information (Continued)  
In this example, a 0.01µF capacitor takes 14 lines after power-up  
to charge to its final value. On subsequent lines, the only error will  
be the droop across a single line which should be significantly  
less than the initial error. If the LM9822 is operating in CDS  
mode and multiple lines are used to charge up the clamping  
capacitors after power-up, then a clamp capacitor value of  
0.01µF should be significantly greater than the calculated  
9.1 Output Driver Mode  
The Output Driver Mode bit is normal set to 0. This bit can be set  
to 1 to reduce the slew rate of the output drivers.  
9.2 DOE (Data Output Edge) Setting  
The Data Output Edge bit selects which edge of MCLK is used to  
clock output data onto the output pins. For lowest noise perfor-  
mance, this bit should be set to 0. With this setting, new data is  
placed on the D7-D0 pins on every falling edge of MCLK. See  
Diagrams 1 through 6 and Diagram 13 for more information on  
data output timing for the different Divide By modes, and detailed  
timing of the output data signals.  
C
CLAMP MIN value and can virtually always be used.  
If the LM9822 is operating in CIS mode, then significantly larger  
clamp capacitors must be used. Fortunately, the output imped-  
ance of most CIS sensors is significantly smaller than the output  
impedance of CCD sensors, and R CLAMP will be dominated by  
the 50from the LM9822 internal clamp switch. With a smaller  
R
CLAMP value, the clamp capacitors will chargefaster.  
The bit can be set to 1 to adjust the data output timing for some  
applications, but the noise performance of the LM9822 may be  
somewhat degraded.  
7.0 Power Supply Considerations  
The LM9822 analog supplies ( A) should be powered by a single  
+5V source. The two analog supplies are brought out individually  
to allow separate bypassing for each supply input. They should  
not be powered by two or more different supplies.  
9.3 CDS Enable  
The CDS Enable bit determines whether the sampling section of  
the LM9822 operates in Correlated Double Sampling mode or in  
Single Ended Sampling mode. CDS mode is normally used with  
Each supply input should be bypassed to its respective ground CCD type sensors, while Single Ended mode is normally used  
with a 0.1µF capacitor located as close as possible to the supply  
input pin. A single 10µF tantalum capacitor should be placed near  
the VA supply pins to provide low frequency bypassing.  
with CIS type sensors.  
9.4 Signal Polarity  
Whether the LM9822 is operating in Correlated Double Sampling  
Mode, or Single Ended Sampling mode, the basic sampling oper-  
ation is the same. First a reference level is sampled, then a signal  
level is sampled. For CDS mode operation, if the signal level is  
lower in voltage than the reference level, the Signal Polarity bit  
should be set to 0. This is the normal setting for CCD type sen-  
sors. If the signal level is more positive than the reference level,  
the Signal Polarity bit would be set to 1 for Positive Polarity mode.  
The VD input can be powered at 3.3Vor 5.0V. Power should be  
supplied by a clean, low noise linear power supply, with a 0.1 µF  
ceramic capacitor and a 10 µF tantalum capacitor placed near the  
VD and DGND pins. If possible, a separate power and ground  
plane should be provided to isolate the noisy digital output signals  
from the sensitive analog supply pins. If the V voltage is lower  
D
than VA, a separate linear regulator should be used. If VD and  
A
are both at 5.0V, then they should be supplied by a common lin-  
ear regulator, with separate analog and digital power and ground  
planes.  
When Single Ended Mode is selected, the Signal Polarity bit  
determines which internal reference voltage is used to compare  
with the input signal. Most CIS type sensors have a positive polar-  
ity type output, and in this case the Signal Polarity Bit should be  
set to 1. In this case, the internal VREF- is used as the reference  
level during the Reference Sampling period.  
To minimize noise, keep the LM9822 and all analog components  
as far as possible from noise generators, such as switchingpower  
supplies and high frequency digital busses. If possible, isolate all  
the analog components and signals (OS, reference inputs and  
outputs, A, AGND) on an analog ground plane, separate from  
the digital ground plane. The two ground planes should be tied  
together at a single point, preferably the point where the power  
supply enters the PCB.  
In addition, the Signal Polarity bit determines which internal refer-  
ence voltage is used during the Clamping interval. If Signal Polar-  
ity = 0, VREF+ is used for clamping, if Signal Polarity = 1, V REF- is  
used.  
8.0 Serial Interface and Configuration Registers  
9.5 SMPCL  
The serial interface is used to program the configuration registers  
which control the operation of the LM9822. The SEN, SCLK, SDI  
and SDO signals are used to set and verify configuration register  
settings. In addition, MCLK must be active during all serial inter-  
face activity. MCLK is used to register the level of the SEN input  
and drives the logic that process information input on the SDI line.  
The SMPCL setting controls when the clamping action occurs  
during the acquisition cycle. If SMPCL is set to 0, the Clamp will  
be on for 1 MCLK before the reference sampling point. If SMPCL  
is set to 1, clamping will occur in the interval after the reference  
sampling point, and before the signal sampling point. In this case,  
the clamping time is dependent on the present “Divide By” mode,  
and the settings of the CDSREF bits.  
9.0 Sample Mode Register Settings  
A brief overview of the sample mode register and the bit locations  
9.6 CDSREF  
is give in  
on page  
Table 2: Configuration Register Parameters  
The CDSREF setting is provided to allow adjustable sampling  
points for the reference sample at the higher “Divide By” modes.  
This may be useful to optimize the timing of the Reference Sam-  
14. The function of each bit is summarized in the following sec-  
tions.  
20  
www.national.com  
Applications Information (Continued)  
pling point for particular CCD sensors. Diagram 7 shows how the  
various settings of CDSREF can be used to delay the Reference  
Sampling point. Care must be taken to avoid setting CDSREF to  
an inappropriate value when operating in the lower “Divide By”  
modes.  
MCLK before the reference is sampled. If SMPCL = 1 then the  
clamp is on between the reference and the signal sample points.  
Please see Diagram 8 and Diagram 9 for a graphic example of  
this timing.  
Valid CDSREF settings are:  
To clamp across multiple pixels in a row, CLMP can be set high  
and remain there for the entire number of pixels to be clamped,  
then returned to the low state for normal (signal) operation. This  
may simplify the timing required to generate the CLMP signal.  
“Divide By” Mode  
Valid CDSREF  
00,01,10,11  
00,01,10,11  
00,01  
/8  
/6  
/3  
/2  
10.2 MCLK and VSMP Timing  
The relationship between VSMP and MCLK is used to determine  
the 'Divide By' mode that is presently being used with the part.  
Valid 'Divide By' settings are:  
00  
Color - /8, /6  
Monochrome - /8, /6, /3, /2  
9.7 PD (Power Down) Mode  
When entering a new mode, it is important to provide consistent  
MCLK/VSMP timing signals that meet the following condition.  
When switching to a new 'Divide By' mode, VSMP should be held  
low for a minimum of 3 MCLK cycles, then valid timing according  
to the datasheet diagrams for the particular mode should be  
started. This ensures that all internal circuitry is properly synchro-  
nized to the new conversion 'Divide By' mode being used. If the  
timing relationship between VSMP and MCLK is disturbed for any  
reason, the same procedure should be used before restarting  
operation in the chosen 'Divide By' mode.  
A Power Down bit is provided to configure the LM9822 in a lower  
power “StandBy” mode. In this mode, typical power consumption  
is reduced to less than 1% of normal operating power. The serial  
interface is still active, but the majority of the analog and digital  
circuitry is powered down.  
10.0 LM9822 Basic Operation  
The normal operational sequence when using the LM9822 is as  
follows:  
Immediately after applying power, all configuration registers are  
reset to default settings. MCLK should be applied, and the appro-  
priate values written to the registers using the procedure dis-  
cussed in section 8.0 Serial Interface and Configuration Registers  
on page 20 and detailed in Diagrams 10, 11 and 12. Once the  
configuration registers are loaded, the timing control signals can  
be applied at the proper rates for the mode of conversion desired.  
MCLK is applied initially with VSMP and CLMPlow. After at least  
3 MCLKS, VSMP and CLMP signals can begin. The Divide By  
mode is determined by the ratio of MCLK to VSMP frequency as  
described in section 10.2.  
For example: To change from monochrome Divide By 3 mode to  
monochrome Divide By 2 mode, VSMP should be held low for at  
least 3 MCLK cycles, then VSMP can be brought high using  
"Divide By 2" timing. If VSMP is not low for at least 3 MCLKs, the  
LM9822 may enter an unknown mode.  
MCLK  
VSMP  
Divide by 3  
Transition  
(3 MCLK)  
Divide by 2  
14-Bit conversion results are placed on the data output pins as  
follows: The upper 8 bits are output first with bit 13 of the ADC on  
D7 and the bit 6 of the ADC on D0. The lower 6 bits are then out-  
put with bit 5 of the ADC on D7 and bit 0 of the ADC on D2. D0  
and D1 are always 0 when the lower 6 bits of data are being out-  
put. The exact timing and conversion latency of the output data is  
affected by the settings of the DOE variable in the Sample Mode  
register, and the Divide By mode of operation. If DOE = 0 (recom-  
mended setting for best performance), output data will change on  
the falling edge of MCLK. If DOE = 1, output data is updated on  
the rising edge of MCLK. See Diagrams 1 through 6 and Diagram  
13 for more information on data output timing.  
Figure 6: Timing of Transitions between ‘Divide By’ Modes  
10.1 CLMP Operation  
The CLMP signal is used to engage the LM9822 internal clamp  
circuits at the proper time during the CCD or CIS data output  
cycle. If both CLMP and VSMP are high on a rising edge of  
MCLK, then CLMP will be applied during the next pixel. The exact  
timing of the internal Clamp signal is determined by the Divide By  
mode of operation and the setting of the SMPCL variable in the  
Sample Mode register. If SMPCL = 0, then the Clamp is on for 1  
21  
www.national.com  
inches (millimeters) unless otherwise noted  
Physical Dimension  
28-Lead (0.300" wide) Molded Small Outline Package (JEDEC)  
Order Number LM9822CCWM  
NS Package Number M28B  
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