LMK04832-SEP [TI]
耐辐射且符合 JESD204C 标准的 30krad 超低噪声 3.2GHz、15 路输出时钟抖动清除器;型号: | LMK04832-SEP |
厂家: | TEXAS INSTRUMENTS |
描述: | 耐辐射且符合 JESD204C 标准的 30krad 超低噪声 3.2GHz、15 路输出时钟抖动清除器 时钟 |
文件: | 总103页 (文件大小:2944K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LMK04832-SEP
ZHCSPJ6A –OCTOBER 2022 –REVISED NOVEMBER 2022
LMK04832-SEP 符合JESD204B/C 标准的航天级、超低噪声、双环路时钟抖动
清除器
1 特性
3 说明
• VID#:V62/22612
LMK04832-SEP 是一款适用于航天应用、支持JEDEC
JESD204B/C 的高性能时钟调节器。
– 电离辐射总剂量30krad(无ELDRS)
– SEL 抗扰度> 43MeV × cm2/mg
– SEFI 抗扰度> 43MeV × cm2/mg
• 环境温度范围:-55°C 至125°C
• 最高时钟输出频率:3255MHz
• 多模式:双PLL、单PLL 和时钟分配
• 6GHz 外部VCO 或分配输入
PLL2 可以配置 14 个时钟输出以驱动 7 个
JESD204B/C 转换器或其他逻辑器件(使用器件和
SYSREF 时钟)。SYSREF 可以通过直流和交流耦合
提供。14 个输出中的每一个输出都可以单独配置为用
于传统时钟系统的高性能输出(不限于 JESD204B/C
应用)。
• 超低噪声(2500MHz 时):
无论有无 SYSREF 生成或重新计时,该器件都可以配
置为在双 PLL、单 PLL 或时钟分配模式下运行。PLL2
可以使用内部或外部VCO 工作。
– 54fs RMS 抖动(12kHz 至20MHz)
– 64fs RMS 抖动(100Hz 至20MHz)
– –157.6dBc/Hz 本底噪声
• 超低噪声(3200MHz 时):
– 61fs RMS 抖动(12kHz 至20MHz)
– 67fs RMS 抖动(100Hz 至100MHz)
– –156.5dBc/Hz 本底噪声
高性能与多种特性( 如功耗和性能权衡调节、双
VCO、动态数字延迟和保持)相结合,可提供灵活的
高性能时钟树。
封装信息
等级
• PLL2
封装(1)
器件型号
– –230dBc/Hz PLL FOM
– –128dBc/Hz PLL 1/f
– 相位检测器频率高达320MHz
– 两个集成VCO:2440MHz 至2600MHz
和2945MHz 至3255MHz
V62P22612-01XE
30krad
64 引脚
PAP0064E
10mm x 10mm
LMK04832MPAPSEP
LMK0483PAP/EM
工程样片(2)
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
(2) 这些器件不适用于飞行系统用途,仅用于工程评估。
• 多达14 个差分器件时钟
– CML、LVPECL、LCPECL、HSDS、LVDS 和
2xLVCMOS 可编程输出
CPOUT1
FIN1
Input Switching/Holdover
CLKIN0
• 最多1 个缓冲VCXO/XO 输出
FIN0
CLKIN1/
FIN1/
FPCLKIN
Phase
Switchable R Divider
÷2
Detector/
Charge
Pump
– LVPECL、LVDS、2xLVCMOS 可编程输出
• 1-1023 CLKOUT 分频器
• 1-8191 SYSREF 分频器
PLL1
CLKIN2/
OSCOUT
N Divider
CPOUT2
N Divider
• SYSREF 时钟25ps 阶跃模拟延迟
• 器件时钟和SYSREF 数字延迟和动态数字延迟
• PLL1 保持模式
• PLL1 或PLL2 0 延迟
• 高可靠性
– 受控基线
Phase
Detector/
Charge
Pump
OSCIN
CLKIN1
CLKOUT6
CLKOUT8
SYSREFDIV
PLL2
SCK
Control
Registers
SDIO
SPI
X2
R Divider
CS#
Clock Distribution Path
STATUS_LD1
CLKOUT0
CLKOUT1
÷1,÷2,..,÷1023
ꢀ
ꢀ
SYSREF/SYNC
STATUS_LD2
RESET/GPO
CLKIN_SEL0
CLKIN_SEL1
Device
Control
SYSREFDIV
Divider
14 Di eren al
– 一个组装/测试场所
– 一个制造场所
– 延长的产品生命周期
– 延长的产品变更通知
– 产品可追溯性
...
...
...
SYNC/SYSREF
Distribution Path
Outputs
SYNC
CLKOUT12
ꢀ
CLKIN0
Pulser
÷1,÷2,..,÷1023
ꢀ
CLKOUT13
方框图
2 应用
• 通信有效负载
• 雷达成像有效载荷
• 命令和数据处理
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNAS838
LMK04832-SEP
ZHCSPJ6A –OCTOBER 2022 –REVISED NOVEMBER 2022
www.ti.com.cn
Table of Contents
8.3 Feature Description...................................................25
8.4 Device Functional Modes..........................................36
8.5 Programming............................................................ 38
8.6 Register Maps...........................................................39
9 Application and Implementation..................................85
9.1 Application Information............................................. 85
9.2 Typical Application.................................................... 89
9.3 Power Supply Recommendations.............................92
9.4 Layout....................................................................... 93
10 Device and Documentation Support..........................96
10.1 Device Support....................................................... 96
10.2 Documentation Support.......................................... 96
10.3 接收文档更新通知................................................... 96
10.4 支持资源..................................................................96
10.5 Trademarks.............................................................96
10.6 Electrostatic Discharge Caution..............................96
10.7 术语表..................................................................... 96
11 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 6
6.1 Absolute Maximum Ratings........................................ 6
6.2 ESD Ratings............................................................... 6
6.3 Recommended Operating Conditions.........................6
6.4 Thermal Information....................................................6
6.5 Electrical Characteristics.............................................7
6.6 Timing Requirements................................................13
6.7 Timing Diagram.........................................................13
6.8 Typical Characteristics .............................................14
7 Parameter Measurement Information..........................15
7.1 Charge Pump Current Specification Definitions........15
7.2 Differential Voltage Measurement Terminology........ 16
8 Detailed Description......................................................17
8.1 Overview...................................................................17
8.2 Functional Block Diagram.........................................22
Information.................................................................... 97
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision * (October 2022) to Revision A (November 2022)
Page
• 将器件状态从“预告信息”更改为“量产数据”................................................................................................ 1
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5 Pin Configuration and Functions
VCC5_DIG
CLKIN1_P/FIN1_P/FBCLKIN_P
CLKIN1_N/FIN1_N/FBCLK_N
VCC6_PLL1
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
CLKOUT2_N
CLKOUT2_P
CLKOUT3_N
CLKOUT3_P
LDOBYP2
2
3
4
CLKIN0_P
5
CLKIN0_N
6
LDOBYP1
VCC7_OSCOUT
OSCOUT_P/CLKIN2_P
OSCOUT_N/CLKIN2_N
VCC8_OSCIN
7
VCC1_VCO
FIN0_N
8
DAP
9
FIN0_P
10
11
12
13
14
15
16
GND
OSCIN_P
SYNC/SYSREF_REQ
RESET/GPO
CLKOUT1_N
CLKOUT1_P
CLKOUT0_N
CLKOUT0_P
OSCIN_N
VCC9_CP2
CPOUT2
VCC10_PLL2
STATUS_LD2
Not to scale
图5-1. PAP Package 64-Pin HTQFP Top View
表5-1. Pin Functions
PIN
I/O
TYPE
DESCRIPTION
NO.
NAME
VCC5_DIG
1
PWR
Power supply for the digital circuitry.
–
CLKIN1_P: Reference Clock input port 1 for PLL1. FIN1_P: External
VCO input or clock distribution input. FBCLKIN_P: Feedback input for
external clock feedback input (0–delay mode).
CLKIN1_P/
FIN1_P/
FBCLKIN_P
2
I
ANLG
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表5-1. Pin Functions (continued)
PIN
I/O
TYPE
DESCRIPTION
NO.
NAME
CLKIN1_N
FIN1_N
Reference Clock input port 1 for PLL1.
External VCO input or clock distribution input.
3
I
ANLG
FBCLK_N
Feedback input for external clock feedback input (0–delay mode).
4
5
6
7
VCC6_PLL1
CLKIN0_P
PWR
ANLG
Power supply for PLL1, charge pump 1, holdover DAC
–
I
Reference Clock input port 0 for PLL1.
CLKIN0_N
VCC7_OSCOUT
OSCOUT_P
CLKIN2_P
PWR
Power supply for OSCOUT pins.
Buffered output of OSCIN pins
Reference Clock input port 2 for PLL1.
Buffered output of OSCIN pins
Reference Clock input port 2 for PLL1.
Power supply for OSCIN
–
8
9
I/O
Programmable
OSCOUT_N
CLKIN2_N
I/O
Programmable
PWR
10
11
12
13
14
15
16
17
VCC8_OSCIN
OSCIN_P
–
I
ANLG
Feedback to PLL1 and reference input to PLL2. AC-coupled.
OSCIN_N
VCC9_CP2
CPOUT2
PWR
ANLG
Power supply for PLL2 charge pump.
Charge pump 2 output.
–
O
VCC10_PLL2
STATUS_LD2
CLKOUT9_P
PWR
Power supply for PLL2.
–
I/O
Programmable
Programmable status pin.
Clock output 9. For JESD204B/C systems suggest SYSREF Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
O
Programmable
18
19
20
CLKOUT9_N
CLKOUT8_P
CLKOUT8_N
Clock output 8. For JESD204B/C systems suggest Device Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
Programmable
PWR
21
22
VCC11_CG3
Power supply for clock outputs 8, 9, 10, and 11.
–
CLKOUT10_P
Clock output 10. For JESD204B/C systems suggest Device Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
Programmable
23
24
25
CLKOUT10_N
CLKOUT11_P
CLKOUT11_N
Clock output 11. For JESD204B/C systems suggest SYSREF Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
Programmable
26
27
28
CLKin_SEL0
CLKIN_SEL1
CLKOUT13_P
I/O
I/O
Programmable
Programmable
Programmable status pin.
Programmable status pin.
Clock output 13. For JESD204B/C systems suggest SYSREF Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
O
Programmable
29
CLKOUT13_N
Clock output 12. For JESD204B/C systems suggest Device Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, or LVDS.
30
31
32
33
34
35
CLKOUT12_P
CLKOUT12_N
VCC12_CG0
CLKOUT0_P
CLKOUT0_N
CLKOUT1_P
Programmable
PWR
Power supply for clock outputs 0, 1, 12, and 13.
–
Clock output 0. For JESD204B/C systems suggest Device Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, or LVDS.
O
Programmable
Clock output 1. For JESD204B/C systems suggest SYSREF Clock.
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
Programmable
36
37
CLKOUT1_N
RESET/GPO
I
I
CMOS
CMOS
GND
Device reset input or GPO
SYNC/
SYSREF_REQ
Synchronization input or SYSREF_REQ for requesting continuous
SYSREF.
38
39
GND
This pin should be grounded.
–
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表5-1. Pin Functions (continued)
PIN
I/O
TYPE
DESCRIPTION
NO.
40
41
42
43
44
45
NAME
FIN0_P
FIN0_N
High-speed input for external VCO or clock distribution. Supports /2 for
frequency greater than 3250 MHz.
I
ANLG
VCC1_VCO
LDOBYP1
PWR
ANLG
ANLG
Power supply for VCO and clock distribution.
–
–
–
LDO Bypass, bypassed to ground with 10-µF capacitor.
LDO Bypass, bypassed to ground with a 0.1-µF capacitor.
LDOBYP2
CLKOUT3_P
Clock output 3. For JESD204B/C systems suggest SYSREF Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
O
Programmable
Programmable
46
CLKOUT3_N
47
48
49
50
51
52
53
54
CLKOUT2_P
CLKOUT2_N
VCC2_CG1
CS#
Clock output 2. For JESD204B/C systems suggest Device Clock.
Programmable formats: CML, LVPECL, LCPECL, or LVDS.
PWR
CMOS
CMOS
CMOS
PWR
Power supply for clock outputs 2 and 3.
–
I
Chip Select
SCK
I
SPI Clock
SDIO
I/O
SPI Data
VCC3_SYSREF
CLKOUT5_P
Power supply for SYSREF divider and SYNC.
–
Clock output 5. For JESD204B/C systems suggest SYSREF Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
Programmable
55
CLKOUT5_N
Clock output 4. For JESD204B/C systems suggest Device Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, or LVDS.
56
57
58
59
60
61
CLKOUT4_P
CLKOUT4_N
VCC4_CG2
CLKOUT6_P
CLKOUT6_N
CLKOUT7_P
O
Programmable
PWR
Power supply for clock outputs 4, 5, 6 and 7.
–
Clock output 6. For JESD204B/C systems suggest Device Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, or LVDS.
O
Programmable
Clock output 7. For JESD204B/C systems suggest SYSREF Clock.(1)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or
2xLVCMOS.
O
Programmable
62
CLKOUT7_N
63
STATUS_LD1
CPOUT1
DAP
I/O
O
Programmable
ANLG
Programmable status pin.
64
Charge pump 1 output.
DAP
GND
DIE ATTACH PAD, connect to GND.
–
(1) Actual best allocation of device clocks and SYSREF depends upon frequency planning to group common frequencies.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
SYMBOL
VDD, VDD_A
VIN
PARAMETER
MIN
–0.3
–0.3
MAX
3.6
UNIT
V
Power supply voltage
Input voltage
VDD + 0.3
V
Differential input current (CLKIN_P/N,
OSCIN_P/N,FIN0_P/N,FIN1_P/N
IIN
5
mA
TJ
Junction Temperature
Storage temperature
150
150
°C
°C
Tstg
–65
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
SYMBOL
PARAMETER
CONDITION
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per ANSI/ESDA/JEDEC
JS-002, all pins(2)
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over case temperature range (unless otherwise noted)
SYMBOL
PARAMETER
MIN
3.135
3.135
–55
NOM
3.3
MAX
3.465
3.465
125
UNIT
VDD
IO supply voltage
V
V
VDD_A
TA
Core supply voltage
Ambient Temperature
3.3
°C
6.4 Thermal Information
PAP (HTQFP)
SYMBOL
THERMAL METRIC(1)
UNIT
64 PINS
21.3
8.3
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-board thermal resistance
6.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.1
ΨJT
6.8
ΨJB
RθJC(bot)
0.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Current Consumption
Power Down Supply Current
Device Powered Down
3.3
5
4 CML 32 mA clocks in
bypass
3 LVDS clock /12
4 SYSREF as LCPECL
3 SYSREF as LVDS
980
850
700
4 CML 32 mA clocks in
bypass
3 LVDS clock /12
4 SYSREF as LCPECL
(low state)
PLL1 locked to
external VCXO and
PLL2 locked to
internal VCO
ICC
mA
Supply Current(1)
3 SYSREF as LVDS
(low state)
4 CML 32 mA clocks in
bypass
3 LVDS clock /12
7 SYSREF outputs
powered down
CLKIN Specifications
LOS Circuitry
LOS_EN = 1
0.001
0.001
125
250
CLKinX-
TYPE=1(MOS)
AC Coupled Input
AC Coupled Input
AC Coupled Input
AC Coupled Input
PLL1
PLL2
CLKinX-TYPE=0
(Bipolar)
0.001
0.001
0.001
750
MHz
500
fCLKINx
CLKinX_TYPE=0
(Bipolar)
0-delay with external
feedback (CLKIN1)
0-delay
750
Distribution Mode
CLKIN1/FIN1 Pin only AC Coupled Input
0.001
0.15
3250
V/ns
SLEWCLKIN Input Slew Rate(2)
VCLKINx/FIN1 Single-ended clock input voltage
VIDCLKINX/
0.5
Input pin AC coupled; complementary pin AC
coupled to GND
0.5
0.125
0.25
2.4 Vpp
1.55
|V|
FIN1
Differential clock input voltage(3)
VSSCLKINx/
AC coupled
3.1 Vpp
|mV|
FIN1
CLKIN0/1/2 (Bipolar)
CLKIN0/1 (MOS)
CLKIN2 (MOS)
0
55
20
|VCLKINX
offset|
-
DC offset voltage between CLKIN /
CLKINX* Each Pin AC Coupled
VCLKINVIH
VCLKINVIL
High Input Voltage
Low Input Voltage
VCLKIN-VIH
VCLKIN-VIL
DC Coupled Input
DC Coupled Input
2
0
Vcc
0.4
V
V
FIN0 Input Pin
fFIN0
FIN0_DIV2_EN=1
FIN0_DIV2_EN=2
1
1
3250 MHz
6400 MHz
1.55 Vpp
3.1 Vpp
AC Coupled Slew
Rate > 150 V/us
External Input Frequency
fFIN0
VIDFIN0
VSSFIN0
0.125
0.25
Differential Input Voltage
AC Coupled
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VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
PLL 1 Specifications
fPD1
Phase Detector Frequency
40 MHz
PLL1_CP_GAIN = 350 µA
–117
–118
–221.5
–223
50
PN10kHz
PLL Normalized 1/f Noise(4)
PLL1_CP_GAIN = 1550 µA
PLL1_CP_GAIN = 350 µA
PLL1_CP_GAIN = 1550 µA
dBc/Hz
PN FOM
PLL Figure of Merit(5)
PLL1_CP_GAIN=0
PLL1_CP_GAIN=1
PLL1_CP_GAIN=2
PLL1_CP_GAIN=4
PLL1_CP_GAIN=8
150
ICPOUT1
Charge Pump Current(6)
VCPout=Vcc/2
250
µA
450
850
ICPOUT1%MI Charge Pump Sink / Source
VCPout1 = Vcc/2, T =
25 °C
VCPout1 = Vcc/2, T = 25
°C
1
1
2
10
10
10
10
%
%
S
Mismatch
ICPOUT1VTUN Magnitude of Charge Pump Current 0.5 V < VCPout1 < VCC 0.5 V < VCPout1 < VCC
-
Variation vs. Charge Pump Voltage - 0.5 V TA = 25 °C
0.5 V TA = 25 °C
E
ICPOUT1%TE Charge Pump Current vs.
%
MP
Temperature Varation
Charge Pump TRI_STATE Leakage
Current
ICPOUT1TRI
OSCIN Input
nA
EN_PLL2_REF_2X=0
EN_PLL2_REF_2X=1
0.001
0.001
0.15
500
320
fOSCIN
MHz
V/ns
SLEWOSCIN Input Slew Rate
0.5
Input voltage for OSCIN_P or
OSCIN_N
AC coupled; single-ended; unused pin AC
coupled to GND
VOSCIN
0.2
2.4 Vpp
VIDOSCIN
VSSOSCIN
0.2
0.4
1.55
|V|
Differential voltage swing(3)
AC coupled
3.1 Vpp
DC offset voltage between
CLKINx_P/CLKINx_N. Each Pin AC
Coupled
VCLKINxOffse
t
20
mV
320 MHz
dBc/Hz
PLL 2 Specifications
fPD
Phase Detector Frequency
PLL2_CP_GAIN = 1600 uA
PLL2_CP_GAIN = 3200 uA
PLL2_CP_GAIN = 1600 uA
PLL2_CP_GAIN = 3200 uA
PLL2_CP_GAIN=2
–123
–128
–226.5
–230
1600
PN10kHz
PLL Normalized 1/f Noise(4)
PLL Figure of Merit(5)
PN FOM
ICPOUT
Charge Pump Current Magnitude(6) VCPOUT=Vcc/2
µA
PLL2_CP_GAIN=3
3200
ICPOUT1%MI Charge Pump Sink / Source
VCPOUT = Vcc/2, T =
25 °C
VCPOUT1 = Vcc/2, T = 25
°C
1
2
3
10
10
10
10
%
%
S
Mismatch
Magnitude of Charge Pump Current 0.5 V < VCPOUT1
Variation vs. Charge Pump Voltage VCC - 0.5 V TA = 25 °C 0.5 V TA = 25 °C
<
0.5 V < VCPOUT1 < VCC
-
ICPout1VTUNE
ICPOUT%TE Charge Pump Current vs.
%
MP
Temperature Variation
Charge Pump TRI_STATE Leakage
Current
ICPOUT1TRI
nA
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VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Internal VCO Specifications
VCO0
VCO1
VCO0
VCO1
VCO0
VCO1
10 kHz
100 kHz
2440
2945
2600
MHz
3255
fVCO
VCO Frequency Range
13
26
KVCO
|ΔTCL
VCO Tuning Sensitivity
MHz/V
Allowable temperature Drift for Continuous Lock(7)
Allowable temperature Drift for Continuous Lock(7)
150
180
oC
oC
|
–88.4
–117
VCO0 at 2440 MHz
800 kHz
1 MHz
–137.5
–139.7
–152.6
–85.7
10 MHz
10 kHz
100 kHz
800 kHz
1 MHz
L(f)VCO
Open Loop VCO Phase Noise
dBc/Hz
–115.8
–137
VCO0 at 2580 MHz
–138.6
–151.8
–82.6
10 MHz
10 kHz
100 kHz
800 kHz
1 MHz
–112.3
–134.9
–137.2
–151.1
–81
VCO1 at 2945 MHz
10 MHz
10 kHz
100 kHz
800 kHz
1 MHz
L(f)VCO
Open Loop VCO Phase Noise
dBc/Hz
–110.4
–134.3
–135.6
–149.3
VCO1 at 3250 MHz
10 MHz
Output Clock Skew and Timing
Same Pair of Device clocks and same format
Even to Even or Odd to Odd, Same Format
35
15
SKEWCLKOU
Output to Output Skew
ps
TX
Even clock to Odd
Clock
35
Additive Jitter in Distribution Mode from FIN Pin (note 6)
LVCMOS
LVDS
50
50
40
35
40
35
245.76 MHz Output
Additive jitter, Distribution mode with Frequency,
LVPECL
LCPECL
HSDS
L(f)CLKOUT
fs
no divide
12k-20MHz
integration bandwidth
CML
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VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
LVCMOS Outputs
fCLKOUT
Frequency
Noise Floor
5 pF Load
250 MHz
dBc/Hz
L(f)CLKOUT
245.76 MHz
1 mA load
20 MHz Offset
–160
Vcc–
VOH
Output High Voltage
V
0.1
VOL
IOH
Output Low Voltage
Output High Current
Output Low Current
Output Duty Cycle
1 mA load
FD=1.65V
Vd=1.65V
0.1
V
mA
mA
%
–28
28
IOL
ODC
50
LVDS Clock Outputs
L(f)CLKOUT
TR/TF
Noise Floor
245.76 MHz output
20 MHz Offset
dBc/Hz
ps
–159.5
175
20% to 80% Rise/Fall Time, fOUT≥1 GHz
VOD
Differential Output Voltage
350
mV
Change in VOD for complimentary
output states
60
1.375
35
mV
V
ΔVOD
VOS
–60
DC Measurement, AC coupled to receiver input
RL = 100 Ωdifferential
Output Offset Voltage
1.125
1.25
Change on VOS for complimentary
Output states
mV
mA
ΔVOS
ISHORT
Short circuit Output Current
24
–24
LCPECL Clock Outputs
L(f)CLKOUT
TR/TF
VOH
Noise Floor
245.76 MHz output
OUT ≥1 GHz
20 MHz Offset
dBc/Hz
–162.5
135
20% to 80% Rise/Fall Time
Output High Voltage
Output Low Voltage
ps
V
f
1.4
DC Measurement with
50-Ωto 0.5V
VOL
0.6
V
DC Measurement with
50-Ωto 0.5V
VOD
Differential Output Voltage
870
mV
LVPECL Clock Outputs
245.76 MHz output,
LVPECL 2.0 V
L(f)CLKOUT
TR/TF
Noise Floor
20 MHz Offset
dBc/Hz
ps
–163
20% to 80% Rise/Fall Time
135
f
OUT ≥1 GHz
LVPECL 1.6 V
LVPECL 2.0 V
Vcc–1
VOH
Output High Voltage
V
Vcc–
DC Measurement
termination 50 Ωto
Vcc-2 V
1.1
Vcc–
LVPECL 1.6 V
1.8
VOL
Output Low Voltage
V
V
LVPECL 2.0 V
LVPECL 1.6 V
Vcc–2
0.7
2.5 GHz, Em = 120 Ω
to GND, RL = AC
coupled 100 Ω
VOD
Differential Output Voltage
LVPECL 2.0 V
0.9
HSDS Clock Outputs
L(f)CLKOUT
TR/TF
Noise Floor
20% to 80% Rise/Fall Time
245.76 MHz output
20 MHz Offset
dBc/Hz
ps
–162
170
f
OUT ≥1 GHz
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VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Vcc–
HSDS 6 mA
0.9
VOH
Output High Voltage
V
Vcc–
HSDS 8 mA
1.0
DC Measurement with
50 Ωto 0.5V
Vcc–
HSDS 6 mA
HSDS 8 mA
1.5
VOL
Output Low Voltage
Output Voltage
V
V
Vcc–
1.7
HSDS 6 mA
HSDS 8 mA
HSDS 6 mA
HSDS 8 mA
0.5
VOD
0.75
DC Measurement with
50 Ωto 0.5V
80
mV
115
–80
Change on VOS for complimentary
Output states
ΔVOD
–115
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VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
CML Outputs
L(f)CLKOUT
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Noise Floor
20 MHz Offset
dBc/Hz
–163
140
CML 16 mA
TR/TF
VOH
20% to 80% Rise/Fall Time
Output High Voltage
CML 24 mA
CML 32 mA
140
ps
V
f
OUT ≥1.5 GHz
140
Vcc-0.1
50 Ωpull up to Vcc, DC Measurement
Vcc–
CML 16 mA
0.8
50 Ωpull up to Vcc,
CML 24 mA
Vcc–
VOL
Output Low Voltage
V
DC Measurement
1.1
Vcc–
CML 32 mA
CML 16 mA
1.4
680
1000
1300
550
50 Ωpull up to Vcc,
DC Measurement
CML 24 mA
mV
mV
CML 32 mA
VOD
Output Voltage
CML 16 mA
CML 24 mA
50 Ωpull up to Vcc,
DC Measurement, RL
= AC coupled 100 Ω,
250 MHz
815
CML 32 mA
1070
Digital Outputs (CLKin_SELX,STATUS_LDX, and RESET/GPO,SDIO)
Vcc–
VOH
Output High Voltage
Output Low Voltage
V
0.4
VOL
0.4
V
Digital Inputs
VIH
VIL
High-level input voltage
Low-level input voltage
1.2
V
V
0.5
80
25
RESET/GPO,SYNC,SCK,SDIO, CS#
IIH
High-level input current
uA
SYNC
VIH = VCC
CLKINX_SEL,RESET/GPO,SYNC,SCK,SDIO,
CS#
IIL
IIL
Low-level input current
Low-level input current
5
5
–5
–5
uA
SYNC
VIL = 0 V
(1) Use the TICS Pro tool to calculate Icc for a specific configuration
(2) Device will function with slew rate as low as 0.15 V/ns, however a slew rate of 0.5 V/ns or higher is recommended to get the best
phase noise performance.
(3) See Differential Voltage Measurement Terminology for definition of VID and VOD voltages.
(4) The normalized PLL 1/f noise is a specification in modeling PLL in-band phase noise is that is close to the carrier and has a
characteristic 10 dB/decade slope. PN10 kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10 kHz =
LPLL_flicker(10 kHz) - 20 log(fOUT/ 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's
contribution to total noise, L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high
compare frequency and a clean crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can
be masked by the reference oscillator performance if a low-power or noisy source is used. The total PLL in-band phase noise
performance is the sum of LPLL_flicker(f) and LPLL_flat(f)
(5) The PLL figure of merit is a normalized metric used to quantify the flat portion of the in-band phase noise. It is calculated as PN_FOM
= LPLL_flat(f) - 20 log(N) - 10 log(fPDX). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz
bandwidth and fPDX is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f). This metric is
measured using a CLKIN input. If the OSCin input is used, the metric is about 2 dB worse.
(6) This parameter is programmable to more states than are shown in the electrical specifications
(7) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was
at the time that the 0x168 register was last programmed with PLL2_FCAL_DIS = 0, and still have the part stay in lock. The action of
programming the 0x168 register, even to the same value, activates a frequency calibration routine. This implies the part will work over
the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be
necessary to reload the appropriate register to ensure it stays in lock. This parameter is indirectly tested.
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6.6 Timing Requirements
VDD, VDD_A = 3.3 V ± 5 %, –55 °C ≤TA ≤125 °C. Typical values are at VDD = VDD_A = 3.3 V, 25 °C (unless otherwise
noted)
SYMBOL
PARAMETER
MIN
NOM
MAX UNIT
Timing Requirements
tdS
Setup time for SDI edge to SCK rising edge
Hold time for SDI edge to SCK rising edge
40
20
ns
ns
ns
ns
ns
ns
ns
tdH
tSCK
tHIGH
tLOW
tCS
Period of SCK
400
120
120
40
High width of SCK
Low width of SCK
Setup time for CS# falling edge to SCK rising edge
Hold time for CS# rising edge from SCK rising edge
SCK falling edge to valid read back data
tCH
40
tDV
120
ns
6.7 Timing Diagram
Register programming information on the SDIO pin is clocked into a shift register on each rising edge of the SCK
signal. On the rising edge of the CS* signal, the register is sent from the shift register to the register addressed.
A slew rate of at least 30 V/µs is recommended for these signals. After programming is complete the CS* signal
should be returned to a high state. If the SCK or SDIO lines are toggled while the VCO is in lock, as is
sometimes the case when these lines are shared with other parts, the phase noise may be degraded during this
programming.
4-wire mode read back has same timing as SDIO pin.
R/W bit = 0 is for SPI write. R/W bit = 1 is for SPI read.
SDIO
(WRITE)
A12 to A0,
D7 to D2
R/W
A14
A13
D1
D0
tdS
tdH
SCK
tcH
tcS
tHIGH
tLOW
tSCK
SDIO
(Read)
D7 to
D2
D1
D0
tdV
CS*
图6-1. SPI Timing Diagram
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6.8 Typical Characteristics
Jitter from 100 Hz to 100 MHz = 63.6 fs rms.
Output is CLKOUT4 as CML 32 mA with 68-nH to 20-ΩDC
bias.
Jitter from 100 Hz to 100 MHz = 67 fs rms.
Output is CLKOUT4 as CML 32 mA with 68-nH to 20-ΩDC
bias.
Other settings are CLKout4_5_IDL = 1
and CLKout4_5_BYP = 1.
Other settings are CLKout4_5_IDL = 1
and CLKout4_5_BYP = 1.
PLL2 Loop Filter R2 = 470 Ω, C2 = 150 nF,
Charge Pump = 3200 µA.
PLL2 Loop Filter R2 = 470 Ω, C2 = 150 nF,
Charge Pump = 3200 µA.
Reference is R&S SMA100B Signal Generator with option
SMAB - B711 through Prodyn BIB-100G Balun to OSCin.
Reference is R&S SMA100B Signal Generator with option
SMAB - B711 through Prodyn BIB-100G Balun to OSCin.
图6-2. PLL2 With VCO1 Performance at 2500 MHz
With 312.5-MHz OSCin/Phase Detector Frequency
图6-3. PLL2 With VCO1 Performance at 3200 MHz
With 320-MHz OSCin/Phase Detector Frequency
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7 Parameter Measurement Information
7.1 Charge Pump Current Specification Definitions
I1 = Charge Pump Sink Current at VCPout = VCC - ΔV
I2 = Charge Pump Sink Current at VCPout = VCC/2
I3 = Charge Pump Sink Current at VCPout = ΔV
I4 = Charge Pump Source Current at VCPout = VCC - ΔV
I5 = Charge Pump Source Current at VCPout = VCC/2
I6 = Charge Pump Source Current at VCPout = ΔV
ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.
7.1.1 Charge Pump Output Current Magnitude Variation vs Charge Pump Output Voltage
7.1.2 Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
7.1.3 Charge Pump Output Current Magnitude Variation vs Ambient Temperature
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7.2 Differential Voltage Measurement Terminology
The differential voltage of a differential signal can be described by two different definitions causing confusion
when reading data sheets or communicating with other engineers. This section will address the measurement
and description of a differential signal so that the reader will be able to understand and distinguish between the
two different definitions when used.
The first definition used to describe a differential signal is the absolute value of the voltage potential between the
inverting and noninverting signal. The symbol for this first measurement is typically VID or VOD depending on if
an input or output voltage is being described.
The second definition used to describe a differential signal is to measure the potential of the noninverting signal
with respect to the inverting signal. The symbol for this second measurement is VSS and is a calculated
parameter. Nowhere in the IC does this signal exist with respect to ground, it only exists in reference to its
differential pair. VSS can be measured directly by oscilloscopes with floating references, otherwise this value can
be calculated as twice the value of VOD as described in the first description.
图 7-1 shows the two different definitions side-by-side for inputs and 图 7-2 shows the two different definitions
side-by-side for outputs. The VID and VOD definitions show VA and VB DC levels that the noninverting and
inverting signals toggle between with respect to ground. VSS input and output definitions show that if the
inverting signal is considered the voltage potential reference, the noninverting signal voltage potential is now
increasing and decreasing above and below the noninverting reference. Thus the peak-to-peak voltage of the
differential signal can be measured.
VID and VOD are often defined as volts (V) and VSS is often defined as volts peak-to-peak (VPP).
VID Definition
VSS Definition for Input
Noninverting Clock
VA
VB
2 × VID
VID
Inverting Clock
VID = | VA VB
|
VSS = 2 × VID
GND
图7-1. Two Different Definitions for Differential Input Signals
VOD Definition
VSS Definition for Output
Non-Inverting Clock
VA
VB
2·VOD
VOD
Inverting Clock
VOD = | VA - VB
|
VSS = 2·VOD
GND
图7-2. Two Different Definitions for Differential Output Signals
Refer to application note AN-912 Common Data Transmission Parameters and their Definitions (SNLA036) for
more information.
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8 Detailed Description
8.1 Overview
This device is very flexible to meet many application requirements. Use cases include dual loop, dual loop 0-
delay nested, dual loop 0-delay cascaded, single loop, single loop 0-delay, and clock distribution.
The device may be used in JESD204B/C systems by providing a device clock and SYSREF to target devices,
however traditional (non-JESD204B/C) systems are possible by programming pairs of outputs to share the clock
divider or any mix of JESD204B/C and traditional outputs.
8.1.1 Differences from the LMK04832
The LMK04832 is a widely known device that is similar to this device. However, these devices are not the same
and there are some differences.
表8-1. Differences Between the LMK04832-SEP and LMK04832
Attribute
Radiation Hardened
Temperature
LMK04832
LMK04832-SEP
No
50 MeV
–40ºC to +85ºC
10 × 10 mm
n/a
–55ºC to +125ºC
10 × 10 mm
Package
Pin Rotation
Rotated 180° from LMK04832
Yes, Pins 40/41 are FIN0_P/FIN0_N
GND (Pin 39)
6.4 GHz CLK/VCO Input Pin
Pin After SYNC/SYSREFREQ Pin
Programming Speed
No, Pins 8/9 are NC
NC (Pin 7)
5 MHz
2.5 MHz
8.1.1.1 Jitter Cleaning
The dual loop PLL architecture provides the lowest jitter performance over a wide range of output frequencies
and phase noise integration bandwidths. The first stage PLL (PLL1) is driven by an external reference clock and
uses an external VCXO to provide a frequency accurate, low phase noise reference clock for the second stage
frequency multiplication PLL (PLL2).
PLL1 typically uses a narrow loop bandwidth (typically 10 Hz to 200 Hz) to retain the frequency accuracy of the
reference clock input signal while at the same time suppressing the higher offset frequency phase noise that the
reference clock may have accumulated along its path or from other circuits. This cleaned reference clock
provides the reference input to PLL2.
The low phase noise reference provided to PLL2 allows PLL2 to operate with a wide loop bandwidth (typically 50
kHz to 200 kHz). The loop bandwidth for PLL2 is chosen to take advantage of the superior high offset frequency
phase noise profile of the internal VCO and the good low offset frequency phase noise of the reference VCXO.
Ultra-low jitter is achieved by allowing the phase noise of the external VCXO to dominate the final output phase
noise at low offset frequencies and the phase noise of the internal VCO to dominate the final output phase noise
at high offset frequencies. This results in best overall phase noise and jitter performance.
8.1.1.2 JEDEC JESD204B/C Support
This device clocks up to seven JESD204B/C targets using seven device clocks and seven SYSREF clocks and
allows every clock output to be configured as a device clock or SYSREF clock.
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8.1.2 Clock Inputs
备注
CLKIN1 can be used as a reference for dual loop, single loop, or clock distribution mode, providing
flexibility configuring the device for different operation modes from one clock input.
8.1.2.1 Inputs for PLL1
CLKIN0, CLKIN1, and CLKIN2 are the three redundant inputs with their own PLL1 R dividers that can be used
as a reference input to PLL1. The switching between these inputs can either be automatic or manual. For
manual switching, CLKIN_SEL0 and CLKIN_SEL1 pins can be used for faster speed. These input pins are also
shared for other functions.
• CLKIN1 is shared for use as an external 0-delay feedback (FBCLKIN), or for use with an external VCO (FIN).
• CLKIN2 is shared for use as OSCout. To use CLKIN2 as an input power down OSCout, see the VCO_MUX,
OSCout_MUX, OSCout_FMT section.
8.1.2.2 Inputs for PLL2
In dual loop configurations, the PLL2 reference is from OSCin. However, in single PLL2 loop operation, it is also
possible to use any of the three CLKIN inputs of PLL1 as a reference to PLL2.
8.1.2.3 Inputs When Using Clock Distribution Mode
For clock distribution mode, a reference signal may be applied to the FIN0 or FIN1 pins. CLKIN0 can be used to
distribute a SYSREF signal through the device. In this use case, CLKIN0 is re-clocked by CLKIN1. The FIN0
pins are generally recommended over the FIN1 pins because they allow higher frequency, use a lower noise
path, and cannot be used for other functions (like redundant input).
8.1.3 PLL1
PLL1 allows low offset jitter cleaning as well as the use of redundant inputs and frequency holdover.
8.1.3.1 Frequency Holdover
Frequency holdover keeps the clock outputs on frequency with minimum drift when the reference is lost until a
valid reference clock signal is re-established. This can only be used if PLL1 is used.
8.1.3.2 External VCXO for PLL1
When PLL1 is used, an external VCXO is required. The close-in noise performance of this VCXO is critical for
good jitter cleaning performance. The OSCout pin is powered on by default and gives a buffered copy of the
PLL1 feedback and PLL2 reference input at OSCin. This reference input is typically a low noise VCXO or XO.
This output can be used to clock external devices such as microcontrollers, FPGAs, CPLDs, and so forth, before
the device is programmed.
• The OSCout buffer output type is programmable to LVDS, LVPECL, or LVCMOS.
• The VCXO buffered output can be synchronized to the VCO clock distribution outputs by using Cascaded 0-
Delay Mode.
8.1.4 PLL2
8.1.4.1 Internal VCOs for PLL2
PLL2 has two internal VCOs. The output of the selected VCO is routed to the Clock Distribution Path. This same
selection is also fed back to the PLL2 phase detector through a prescaler and N-divider.
8.1.4.2 External VCO Mode
An external VCO can be used with PLL2 with the input for the external VCO coming through FIN0 or FIN1,
although FIN0 is generally preferred.
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备注
The FIN0_P/FIN0_N input is generally recommended because it is lower noise, supports higher input
frequency (up to 6 GHz if the div2 is used), and it leaves CLKIN1 available for redundant inputs.
FIN1_P/FIN1_N inputs are generally NOT recommended, for the reasons stated above, although they
can be used.
8.1.5 Clock Distribution
There are a total of 14 PLL2 clock outputs driven from the internal or external VCO.
All clock outputs have programmable output types. They can be programmed to CML, LVPECL, LVDS, HSDS, or
LCPECL. All odd clock outputs plus CLKOUT8 and CLKOUT10 may be programmed to LVCMOS.
In addition to these 14 clocks, there is also an additional OSCout output for a total of 15 differential output
clocks. OSCout may be a buffered version of OSCIN, DCLKOUT6, DCLKOUT8, or SYSREF. Its output format is
programmable to LVDS, LVPECL, or LVCMOS.
The following sections discuss specific features of the clock distribution channels that allow the user to control
various aspects of the output clocks.
8.1.5.1 Clock Divider
There are seven clock dividers. In a traditional clocking system, each divider can drive two outputs. The divider
range is 1 to 1023. Duty cycle correction may be enabled for the output. When the divider is used even clocks
may not output CML.
In a JESD204B/C system, one clock output is a device clock driven from the clock divider and the other paired
clock is from the SYSREF divider. For connectivity flexibility, either the even or odd clock output may be driven
by the clock divider or be the SYSREF output.
8.1.5.2 High Performance Divider Bypass Mode
The even clock outputs (CLKOUT0/2/4/6/8/10/12) may bypass the clock divider to achieve the best possible
noise floor and output swing. In this mode, the only usable output format is CML.
8.1.5.3 SYSREF Clock Divider
The SYSREF divider supports a divide range of 8 to 8191 (even and odd). There is no duty cycle correction for
the SYSREF divider. The SYSREF output may be routed to all clock outputs.
8.1.5.4 Device Clock Delay
The device clocks support digital delay for phase adjustment of the clock outputs.
The digital delay allows outputs to be delayed from 8 to 1023 VCO cycles. The delay step can be as small as
half the period of the clock distribution path. For example, a 3.2-GHz VCO frequency results in 156.25-ps steps.
The digital delay value takes effect on the clock output phase after a SYNC event.
8.1.5.5 Dynamic Digital Delay
The device clock dividers support a dynamic digital delay feature which allows the clock to be delayed by one full
device clock cycle. With a single programming, an adjustment of up to 255 one cycle delays may occur. When
making a multi-step adjustment, the adjustments are periodically applied to reduce impact to the clock.
Dynamic phase adjustments of half a clock distribution cycle are possible by half step.
The SYSREF digital delay value is reused for dynamic digital delay. To achieve a one cycle delay program the
SYSREF digital delay value to one greater than half the SYSREF divide value.
8.1.5.6 SYSREF Delay: Global and Local
The SYSREF divider includes a digital delay block which allows a global phase shift with respect to the device
clocks.
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Each clock output pair includes a local SYSREF analog and digital delay for unique phase adjustment of each
SYSREF clock.
The local analog delay allows for approximately 21-ps steps. Turning-on analog delay adds an additional 124 ps
of delay in the clock path. The digital delay step can be as small as half the period of the clock distribution path.
For example, a 3.2-GHz VCO frequency results in 156.25-ps steps.
The local digital delay and half step allows a SYSREF output to be delayed from 1.5 to 11 clock distribution path
cycles.
8.1.5.7 Programmable Output Formats
All clock outputs can be programmed to an LVDS, HSDS, LVPECL, or LCPECL output type. Odd clock outputs
in addition to CLKOUT8 and CLKOUT10 may also be programmed to LVCMOS. All odd clock outputs can also
be programmed to CML. When in bypass mode the even clock output may only be CML.
The OSCout can be programmed to an LVDS, LVPECL, or LVCMOS output type.
Any HSDS output type can be programmed to 6-mA or 8-mA amplitude levels.
Any LVPECL output type can be programmed to 1600-mVpp or 2000-mVpp amplitude levels. The 2000-mVpp
LVPECL output type is a Texas Instruments proprietary configuration that produces a 2000-mVpp differential
swing for compatibility with many data converters and is also known as 2VPECL.
LCPECL allows for DC-coupling SYSREF to low voltage JESD204B/C targets.
8.1.5.8 Clock Output Synchronization
Using the SYNC input causes all active clock outputs to share a rising edge as programmed by fixed digital
delay.
The SYNC event must occur for digital delay values to take effect.
8.1.6 0-Delay
Two types of 0-delay mode are supported.
1. Cascaded 0-delay
2. Nested 0-delay
Cascaded 0-delay mode establishes a fixed deterministic phase relationship of the phase of the PLL2 input clock
(OSCIN) to the phase of a clock output selected by the feedback mux. The 0-delay feedback uses internal
feedback from the CLKOUT6, CLKOUT8, or SYSREF. The 0-delay feedback can also be from an external
feedback through the FBCLKIN pins. The FB_MUX selects the feedback source. The OSCIN has a fixed
deterministic phase relationship to the feedback clock, therefore OSCout will also have a fixed deterministic
phase relationship to the feedback clock. In this mode, PLL1 input clock (CLKINx) also has a fixed deterministic
phase relationship to PLL2 input clock (OSCIN); this results in a fixed deterministic phase relationship between
all clocks from CLKINx to the clock outputs.
Nested 0-delay mode establishes a fixed deterministic phase relationship of the phase of the PLL1 input clock
(CLKINx) to the phase of a clock output selected by the feedback mux. The 0-delay feedback uses internal
feedback from the CLKOUT6, CLKOUT8, or SYSREF. The 0-delay feedback can also be from an external
feedback through the FBCLKIN port. The FB_MUX selects the feedback source.
Without using 0-delay mode, there will be n possible fixed phase relationships from clock input to clock output
depending on the clock output divide value.
Using an external 0-delay feedback reduces the number of available clock inputs by one.
8.1.7 Status Pins
The status pins can be monitored for feedback or in some cases used for input depending upon device
programming. For example:
• The CLKin_SEL0 pin may indicate the LOS (loss-of-signal) for CLKIN0.
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• The CLKin_SEL1 pin may be an input for selecting the active clock input.
• The Status_LD1 pin may indicate if the device is locked.
• The Status_LD2 pin may indicate if PLL2 is locked.
The status pins can be programmed to a variety of other outputs including PLL divider outputs, combined PLL
lock detect signals, PLL1 Vtune railing, readback, and so forth. Refer to Register Maps for more information.
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8.2 Functional Block Diagram
图8-1 shows the high level block diagram.
Switching Control
Input clock switching
and Holdover
CLKin0
CLKIN0_P
_OUT
CLKIN0_N
_MUX
CLKin0
Switchable CLKIN0/1/2
R Divider (1 to 16,383)
CLKin
MUX
PLL 1
Phase
Detector/
Charge
Pump
CPOUT1
N1 Divider
(1 to 16,383)
CLKin1
_OUT
_MUX
CLKIN1_P/FIN_P/FBCLKIN_P
CLKIN1_N/FIN_N/FBCLKIN_N
Fin1
FB Mux
CLKOUT6
CLKOUT8
SYSREF Div
FB_
MUX
PLL1
_NCLK
_MUX
OSCOUT_P/CLKIN2_P
OSCOUT_N/CLKIN2_N
MUX
2X
Partially
Integrated
Loop Filter
PLL2
_REF
_2X_EN
R2 Divider
(1 to 4,095)
Internal Dual
Core VCO
PLL2
Phase
OSCIN_P
OSCIN_N
Detector/
Charge
Pump
PLL2
_NCLK
_MUX
N2 Divider
(1 to 262,143)
STATUS_LD1
STATUS_LD2
RESET/GPO
CLKIN_SEL0
CLKIN_SEL1
Device
Control
VCO0
VCO1
Clock Distribution Path
N2 Prescaler
(2 to 8)
VCO_
MUX
÷ 2
SCK
SDIO
CS#
MUX
FIN0_P
FIN0_N
Control
Registers
SPI
Fin1
SYSREF/SYNC Control
Divider
(8 to 8191)
CLKOUT12_P
CLKOUT12_N
Dig. Delay
Dig. Delay
Div (1 to 1023)
A. Delay
SYSREF/SYNC
Distribution Path
D
SYNC
D
CLKOUT13_P
CLKOUT13_N
CLKin0
Pulser
CLKOUT10_P
CLKOUT10_N
Dig. Delay
Dig. Delay
Div (1 to 1023)
A. Delay
CLKOUT0_P
CLKOUT0_N
Div (1 to 1023)
A. Delay
Dig. Delay
Dig. Delay
CLKOUT11_P
CLKOUT11_N
CLKOUT1_P
CLKOUT1_N
CLKOUT8_P
CLKOUT8_N
Dig. Delay
Dig. Delay
Div (1 to 1023)
A. Delay
CLKOUT2_P
CLKOUT2_N
Div (1 to 1023)
A. Delay
Dig. Delay
Dig. Delay
CLKOUT9_P
CLKOUT9_N
CLKOUT3_P
CLKOUT3_N
CLKOUT6_P
CLKOUT6_N
CLKOUT4_P
CLKOUT4_N
Div (1 to 1023)
A. Delay
Dig. Delay
Dig. Delay
Dig. Delay
Dig. Delay
Div (1 to 1023)
A. Delay
CLKOUT5_P
CLKOUT5_N
CLKOUT7_P
CLKOUT7_N
图8-1. High Level Block Diagram
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CLKout0, 2, 4, 6, 8, 10, 12
CLKoutX_
CLKoutX_Y_PD
Device Clock (DCLK)
FMT
DCLKX
_BYP
CML
DCLKX_Y
_POL
VCO
DCLKX_Y_ DCLKX_Y_
CLKoutX_
SRC_MUX
DCLKX_Y_
HS
DDLY
DIV
DCC
DCLKX_Y_
DCC
(8 to 1023)
(1 to 1023)
DDLYdX_Y_EN
DCLKout6/8 to FB_MUX
CLKoutX_Y_ODL
SYNC_
DISx
CLKoutX_Y_IDL
SYSREF_GBL_PD
SCLKX_Y_DIS_MODE
SYSREF Clock (SCLK)
SCLKX_Y
_ADLY_EN
SYSREF/SYNC
SCLKX_Y_
DDLY
SCLKX_Y
_HS
Analog
DLY
CLKoutY_
SRC_MUX
CLKoutY_
FMT
SYSREF_CLR
CLKout1, 3, 5, 7, 9, 11, 13
X = Even Numbers
Y = Odd Numbers
Legend
SPI Register
SYSREF/SYNC Clock
VCO/Distribution Clock
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图8-2. Device and SYSREF Clock Output Block
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SPI Register: SYNC_EN
Must Be Set To Enable Any
SYNC/SYSREF Functionality
CLKIN0
CLKin0_
DEMUX
PLL1
D
SYNC_PLL1_DLD
PLL1_DLD
SYNC_PLL2_DLD
PLL2_DLD
SYSREF_REQ_EN
SYNC
SYNC
_MODE
SYSREF_
MUX
SYNC
_POL
D
PULSER MODE
SYSREF_PULSE_CNT
One
Shot
Pulser
VCO0
VCO1
SYSREF_PLSR_PD
SYNC/SYSREF
VCO
_MUX
SYSREF
DDLY
SYSREF
Divider
SYSREF_
1SHOT_MUX
FIN0
External
VCO
SYSREF_PD
SYSREF_DDLY_PD
DCLKout6
DCLKout8
OSCin
OSCout
_MUX
SYNC_
DISSYSREF
FB_MUX
OSCout
CLKin1
CLKIN1
FB_MUX
PLL1
CLKin1_
DEMUX
DCLKout0, 2, 4, 6, 8, 10, 12
Clock
VCO Frequency
DDLY
(4 to 32)
Divider
(1 to 32)
Output
Buffer
Distribution Path
DCC
SYNC_
DISX
SYSREF/SYNC
Digital
DLY
Analog
DLY
Output
Buffer
Legend
SYSREF_CLR
SYSREF/SYNC Clock
VCO/Distribution Clock
SPI Register
SDCLKout1, 3, 5, 7, 9, 11, 13
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图8-3. SYNC/SYSREF Clocking Paths
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8.3 Feature Description
8.3.1 Synchronizing PLL R Dividers
In some cases, it is necessary to synchronize PLL R dividers to enable determinism of clocks outputs to inputs.
This typically is required when the fraction Total PLL N divide / Total PLL R divide does not reduce to N / 1.
8.3.1.1 PLL1 R Divider Synchronization
It is possible to use the CLKIN0 or SYNC pin to synchronize the PLL1 R divider. To do this, the device is set up
for synchronization, the PLL1 R divider is armed for synchronization, and then the rising sync edge arrives from
either the SYNC pin or CLKIN0. After the PLL1 R divider is armed, PLL1 is unlocked until the synchronization
edge arrives and allows the divider to operate and the PLL to lock. The procedure to synchronize PLL1 R is as
follows:
1. Setup device for synchronizing PLL1 R:
• PLL1R_SYNC_EN = 0x1
• PLL1R_SYNC_SRC = 0x1 (SYNC pin) or 0x2 (CLKIN0)
• CLKin0_DEMUX = 0x2 (PLL1)
• CLKin1_DEMUX = 0x2 (PLL1)
• CLKin0_TYPE = 0x1 (MOS) for DC-coupled or CLKin0_TYPE = 0x0 (Bipolar) for AC-coupled
2. Arm PLL1 R divider for synchronization
• PLL1R_RST = 1, then 0.
• PLL1 is unlocked.
3. Send rising edge on SYNC pin or CLKIN0.
• PLL1 R divider is released from reset and PLL1 relocks.
It is necessary to meet a setup and hold time when CLKIN0 or SYNC pin goes high to ensure deterministic reset
of the PLL1 R divider.
The SYNC_POL bit has no effect on SYNC polarity for PLL1 R synchronization.
8.3.1.2 PLL2 R Divider Synchronization
The SYNC pin must be used to synchronized the PLL2 R divider. When PLL2R_SYNC_EN = 1, as long as the
SYNC pin is held high, the PLL2 R divider is held in reset. When the SYNC pin is returned low, the divider is
allowed to continue dividing. While PLL2R_SYNC_EN = 1 and SYNC pin is high PLL2 is unlocked.
It is necessary to meet a setup and hold time when SYNC pin goes low to ensure deterministic reset of the PLL2
R divider.
The SYNC_POL bit has no effect on SYNC polarity for PLL2 R synchronization.
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8.3.2 SYNC/SYSREF
The SYNC and SYSREF signals share the same SYNC/SYSREF Clock Distribution path. To properly use SYNC
and/or SYSREF for JESD204B/C, it is important to understand the SYNC/SYSREF system. 图 8-2 shows the
detailed diagram of a clock output block with SYNC circuitry included. 图 8-3 shows the interconnects and
highlights some important registers used in controlling the device for SYNC/SYSREF purposes.
To reset or synchronize a divider, the following conditions must be met:
1. SYNC_EN must be set. This ensures proper operation of the SYNC circuitry.
2. SYSREF_MUX and SYNC_MODE must be set to a proper combination to provide a valid SYNC/SYSREF
signal.
• If SYSREF block is being used, the SYSREF_PD bit must be clear.
• If the SYSREF Pulser is being used, the SYSREF_PLSR_PD bit must be clear.
• For each CLKOUTx or CLKOUTy being used for SYSREF, the respective SCLKX_Y_PD bit must be
cleared.
3. DCLKX_Y_DDLY_PD and SYSREF_DDLY_PD bits must be clear to power up the digital delay circuitry used
during SYNC to cause deterministic phase between the device clock dividers and the global SYSREF
divider.
4. The SYNC_DISX bit must be clear to allow SYNC/SYSREF signal to divider circuit. The SYSREF_MUX
register selects the SYNC source which resets the SYSREF/CLKOUTx dividers, provided the corresponding
SYNC_DISX bit is clear.
5. Other bits which impact the operation of SYNC such as SYNC_1SHOT_EN may be set as desired.
6. After these dividers are synchronized, the DCLKX_Y_DDLY_PD and SYSREF_DDLY_PD bits may be set to
save current. Clearing them to power up may disrupt the output clock phase.
表8-2 shows the some possible combinations of SYSREF_MUX and SYNC_MODE.
表8-2. Some Possible SYNC Configurations
NAME
SYNC_MODE
SYSREF_MUX
OTHER
DESCRIPTION
No SYNC will occur.
SYNC Disabled
0
0
CLKin0_DEMUX ≠0
Basic SYNC functionality, SYNC pin polarity is
selected by SYNC_POL.
To achieve SYNC through SPI, toggle the SYNC_POL
bit.
Pin or SPI SYNC
1
0
CLKin0_DEMUX ≠0
Differential input
SYNC
X
2
0 or 1
2
CLKin0_DEMUX = 0
Differential CLKin0 now operates as SYNC input.
JESD204B/C
Pulser on pin
transition.
Produce SYSREF_PULSE_CNT programmed
number of pulses on pin transition. SYNC_POL can
be used to cause SYNC through SPI.
SYSREF_PULSE_CNT
sets pulse count
JESD204B/C
Pulser on SPI
programming.
SYSREF_PULSE_CNT
sets pulse count
Programming SYSREF_PULSE_CNT register starts
sending the number of pulses.
3
1
2
1
SYSREF operational,
SYSREF Divider as
required for training frame for non-JESD converters such as LM97600.
size.
Allows precise SYNC for n-bit frame training patterns
Re-clocked SYNC
When SYNC pin is asserted, continuous SYSREF
External SYSREF
request
SYSREF_REQ_EN = 1
Pulser powered up
pulses occur. Turning on and off of the pulses is
synchronized to prevent runt pulses from occurring on
SYSREF.
0
2
3
SYSREF_PD = 0
SYSREF_DDLY_PD = 0
Continuous
SYSREF
X
Continuous SYSREF signal.
SYSREF_PLSR_PD = 1
(1)
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NAME
表8-2. Some Possible SYNC Configurations (continued)
SYNC_MODE
SYSREF_MUX
OTHER
DESCRIPTION
Re-clocked
SYSREF
distribution
SYSREF_DDLY_PD = 1
SYSREF_PLSR_PD = 1
SYSREF_PD = 1.
Fan-out of CLKin0 reclocked to the clock distribution
path.
0
0
(1) SCLKX_Y_PD = 0 as required per SYSREF output. This applies to any SYNC or SYSREF output on SCLKX_Y when SCLKX_Y_MUX
= 1 (SYSREF output)
备注
The SYNC/SYSREF signal is reclocked by the Clock Distribution Path, therefore an active clock must
be present on the Clock Distribution Path (either from VCO or FIN0/FIN1 pins in distribution mode) for
SYNC to take effect.
备注
Any device clock divider or the SYSREF divider which does not have the SYNC_DISX bit or
SYNC_DISSYSREF bit set will reset while SYNC/SYSREF Distribution Path is high. This is especially
important for the SYSREF divider which has the ability to reset itself if the SYNC_DISSYSREF = 0! Be
sure to set SYNC_DISX/SYNC_DISSYSREF bits as required.
备注
While using Divide-by-2 or Divide-by-3 for DCLK_X_Y_DIV, SYNC procedure requires to first program
Divide-by-4 and then back to Divide-by-2 or Divide-by-3 before doing SYNC.
8.3.3 JEDEC JESD204B/C
8.3.3.1 How to Enable SYSREF
表8-3 summarizes the bits required to make the SYSREF functionality operational.
表8-3. SYSREF Bits
REGISTER
0x140
FIELD
VALUE
DESCRIPTION
SYSREF_PD
0
Must be clear, power-up SYSREF circuitry including the SYSREF divider.
SYSREF_DDLY
_PD
Must be clear to power-up digital delay circuitry. Must be powered up during initial SYNC
to ensure deterministic timing to other clock dividers.
0x140
0x143
0
1
SYNC_EN
Must be set, enable SYNC.
Do not hold local SYSREF DDLY block in reset except at start.
Anytime SYSREF_PD = 1, because of user programming or device RESET, it is
necessary to set SYSREF_CLR for 15 VCO clock cycles to clear the local SYSREF digital
delay. After the delay is cleared, SYSREF_CLR must be cleared to allow SYSREF to
operate.
0x143
SYSREF_CLR
1 →0
Enabling JESD204B/C operation involves synchronizing all the clock dividers with the SYSREF divider, then
configuring the actual SYSREF functionality.
8.3.3.1.1 Setup of SYSREF Example
The following procedure is a programming example for a system which is to operate with a 3000-MHz VCO
frequency. Use CLKOUT0 and CLKOUT2 to drive converters at 1500 MHz. Use CLKOUT4 to drive an FPGA at
150 MHz. Synchronize the converters and FPGA using a two SYSREF pulses at 10 MHz.
1. Program registers 0x000 to 0x555 (refer to Recommended Programming Sequence). Key to prepare for
SYSREF operations:
a. Prepare for manual SYNC: SYNC_POL = 0, SYNC_MODE = 1, SYSREF_MUX = 0
b. Setup output dividers as per example: DCLK0_1_DIV and DCLK2_3_DIV = 2 for frequency of 1500
MHz. DCLK4_5_DIV = 20 for frequency of 150 MHz.
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c. Setup output dividers as per example: SYSREF_DIV = 300 for 10-MHz SYSREF.
d. Setup SYSREF: SYSREF_PD = 0, SYSREF_DDLY_PD = 0, DCLK0_1_DDLY_PD = 0,
DCLK2_3_DDLY_PD = 0, DCLK4_5_DDLY_PD = 0, SYNC_EN = 1, SYSREF_PLSR_PD = 0,
SYSREF_PULSE_CNT = 1 (2 pulses). SCLK0_1_PD = 0, SCLK2_3_PD = 0, SCLK4_5_PD = 0.
e. Clear Local SYSREF DDLY: SYSREF_CLR = 1.
2. Establish deterministic phase relationships between SYSREF and Device Clock for JESD204B/C:
a. Set device clock and SYSREF divider digital delays: DCLK0_1_DDLY, DCLK2_3_DDLY,
DCLK4_5_DDLY, and SYSREF_DDLY.
b. Set device clock digital delay half steps: DCLK0_1_HS, DCLK2_3_HS, DCLK4_5_HS.
c. Set SYSREF clock digital delay as required to achieve known phase relationships: SCLK0_1_DDLY,
SCLK2_3_DDLY, and SCLK4_5_DDLY. If half step adjustments are required SCLK0_1_HS,
SCLK2_3_HS, and SCLK4_5_HS.
d. To allow SYNC to affect dividers: SYNC_DIS0 = 0, SYNC_DIS2 = 0, SYNC_DIS4 = 0,
SYNC_DISSYSREF = 0.
e. Perform SYNC by toggling SYNC_POL = 1 then SYNC_POL = 0.
3. Now that dividers are synchronized, disable SYNC from resetting these dividers. It is not desired for
SYSREF to reset it's own divider or the dividers of the output clocks.
a. Prevent SYNC (SYSREF) from affecting dividers: SYNC_DIS0 = 1, SYNC_DIS2 = 1, SYNC_DIS4 = 1,
SYNC_DISSYSREF = 1.
4. Release reset of local SYSREF digital delay.
a. SYSREF_CLR = 0. Note this bit needs to be set for only 15 clock distribution path clocks after
SYSREF_PD = 0.
5. Set SYSREF operation.
a. Allow pin SYNC event to start pulser: SYNC_MODE = 2.
b. Select pulser as SYSREF signal: SYSREF_MUX = 2.
6. Complete! Assert the SYNC pin or toggle the SYNC_POL to send a series of 2 SYSREF pulses.
8.3.3.1.2 SYSREF_CLR
The local digital delay of the SCLKX_Y_DDLY is implemented as a shift buffer. To ensure no unwanted pulses
occur at this SYSREF output at start-up, when using SYSREF, requires clearing the buffers by setting
SYSREF_CLR = 1 for 15 VCO clock cycles. After a reset, this bit is set, so it must be cleared before SYSREF
output is used.
If the SYSREF pulser is used. It is also required to set SYSREF_CLR = 1 for 15 VCO clock cycles after the
SYSREF pulser is powered up.
8.3.3.2 SYSREF Modes
8.3.3.2.1 SYSREF Pulser
This mode allows for the output of 1, 2, 4, or 8 SYSREF pulses for every SYNC pin event or SPI programming.
This implements the gapped periodic functionality of the JEDEC JESD204B/C specification.
When in SYSREF Pulser mode, the user can adjust the SYSREF_PULSE_CNT field in register 0x13E to
program the pulser to send out a set number of pulses.
8.3.3.2.2 Continuous SYSREF
This mode allows for continuous output of the SYSREF clock.
备注
TI does not recommend continuous operation of the SYSREF clock due to crosstalk from the SYSREF
clock to device clock. JESD204B/C is designed to operate with a single burst of pulses to initialize the
system at start-up, after which it is theoretically not required to send another SYSREF because the
system will continue to operate with deterministic phases.
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8.3.3.2.3 SYSREF Request
This mode allows an external source to synchronously turn on or off a continuous stream of SYSREF pulses
using the SYNC/SYSREF_REQ pin.
Setup the mode by programming SYSREF_REQ_EN = 1 and SYSREF_MUX = 2 (Pulser). The pulser does not
need to be powered for this mode of operation.
When the SYSREF_REQ pin is asserted, the SYSREF_MUX is synchronously set to continuous mode,
providing continuous pulses at the SYSREF frequency until the SYSREF_REQ pin is unasserted. When the
SYSREF_REQ pin is unasserted, the final SYSREF pulse completes sending synchronously.
8.3.4 Digital Delay
Digital (coarse) delay allows a group of outputs to be delayed by 8 to 1023 clock distribution path cycles. The
delay step can be as small as half the period of the clock distribution path cycle by using the DCLKX_Y_HS bit.
There are two different ways to use the digital delay:
1. Fixed digital delay
2. Dynamic digital delay
In both delay modes, the regular clock divider is substituted with an alternative divide value.
8.3.4.1 Fixed Digital Delay
Fixed digital delay value takes effect on the clock outputs after a SYNC event. As such, the outputs will be LOW
for a while during the SYNC event. Applications that cannot accept clock breakup when adjusting digital delay
during application run time should use dynamic digital delay to adjust phase.
8.3.4.1.1 Fixed Digital Delay Example
Assuming the device already has the following initial configurations and the application delays CLKOUT2 by one
VCO cycle compared to CLKOUT0:
• VCO frequency = 2949.12 MHz
• CLKOUT0 = 368.64 MHz (DCLK0_1_DIV = 8, CLKOUT0_SRC_MUX = 0 (Device Clock))
• CLKOUT2 = 368.64 MHz (DCLK2_3_DIV = 8, CLKOUT2_SRC_MUX = 0 (Device Clock))
The following steps should be followed:
1. Set DCLK0_1_DDLY = 8 and DCLK2_3_DDLY = 9. Static delay for each clock.
2. Set DCLK0_1_DDLY_PD = 0 and DCLK2_3_DDLY_PD = 0. Power up the digital delay circuit.
3. Set SYNC_DIS0 = 0 and SYNC_DIS2 = 0. Allow the outputs to be synchronized.
4. Perform SYNC by asserting, then unasserting SYNC. The can be done by either using the SYNC_POL bit or
the SYNC pin.
5. Now that the SYNC is complete, you can power down DCLK0_1_DDLY_PD = 1 and/or DCLK2_3_DDLY_PD
= 1 to save power.
6. Set SYNC_DIS0 = 1 and SYNC_DIS2 = 1. Prevent the output from being synchronized, as this is very
important for steady-state operation when using JESD204B/C.
No CLKout during SYNC
CLKout0
368.64 MHz
CLKout2
368.64 MHz
SYNC event
1 VCO cycle delay
图8-4. Fixed Digital Delay Example
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8.3.4.2 Dynamic Digital Delay
Dynamic digital delay allows the phase of clocks to be changed with respect to each other with little impact to the
clock signal.
For the device clock dividers this is accomplished by substituting the regular clock divider with an alternate divide
value of one larger than the regular divider for one cycle. This substitution will occur a number of times equal to
the value programmed into the DDLYd_STEP_CNT field for all outputs with DDLYdX_EN = 1.
For the SYSREF divider, an alternate divide value is substituted for the regular divide value. This substitution will
occur a number of times equal to the value programmed into the DDLYd_STEP_CNT if DDLYd_SYSREF_EN =
1. To achieve one cycle delay as is done for the device clock dividers, set the SYSREF_DDLY value to one
greater than SYSREF_DIV+SYSREF_DIV/2. For example, for a SYSREF divider of 100, to achieve 1 cycle
delay, SYSREF_DDLY = 100 + 50 + 1 = 151.
While using the Dynamic Digital Delay feature, CLKin_OVERRIDE must be set to 0.
• By programming a larger alternate divider (delay) value, the phase of the adjusted outputs are delayed with
respect to the other clocks.
• By programming a smaller alternate divider (delay) value, the phase of the adjusted outputs are advanced
with respect to the other clocks.
8.3.4.3 Single and Multiple Dynamic Digital Delay Example
In this example, two separate adjustments are made to the device clocks. In the first adjustment, a single delay
of one VCO cycle occurs between CLKOUT2 and CLKOUT0. In the second adjustment, two delays of one VCO
cycle occur between CLKOUT2 and CLKOUT0. At this point in the example, CLKOUT2 is delayed three VCO
cycles behind CLKOUT0.
Assuming the device already has the following initial configurations:
• VCO frequency: 2949.12 MHz
• CLKOUT0 = 368.64 MHz, DCLK0_1_DIV = 8
• CLKOUT2 = 368.64 MHz, DCLK2_3_DIV = 8
The following steps illustrate the example above:
1. Set DCLK2_3_DDLY = 4. First part of delay for CLKOUT2.
2. Set DCLK2_3_DDLY_PD = 0. Enable the digital delay for CLKOUT2.
3. Set DDLYd0_EN = 0 and DDLYd2_EN = 1. Enable dynamic digital delay for CLKOUT2 but not CLKOUT0.
4. Set DDLYd_STEP_CNT = 1. This begins the first adjustment.
Before step 4, CLKOUT2 clock edge is aligned with CLKOUT0.
After step 4, CLKOUT2 counts nine clock distribution path cycles to the next rising edge, one greater than the
divider value, effectively delaying CLKOUT2 by one VCO cycle with respect to CLKOUT0. This is the first
adjustment.
5. Set DDLYd_STEP_CNT = 2. This begins the second adjustment.
Before step 5, CLKOUT2 clock edge was delayed one clock distribution path cycle from DCLKOUT0.
After step 5, CLKOUT2 counts nine clock distribution path cycles twice, each time one greater than the divide
value, effectively delaying CLKOUT2 by two clock distribution path cycles with respect to CLKOUT0. This is the
second adjustment.
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VCO
2949.12 MHz
CLKout0
368.64 MHz
CLKout2
368.64 MHz
First
Adjustment
DCLK2_3_DIV + 1
CLKout2
368.64 MHz
Second
Adjustment
DCLK2_3_DIV + 1
DCLK2_3_DIV + 1
图8-5. Single and Multiple Adjustment Dynamic Digital Delay Example
8.3.5 SYSREF to Device Clock Alignment
To ensure proper JESD204B/C operation, the timing relationship between the SYSREF and the Device clock
must be adjusted for optimum setup and hold time as shown in 图 8-6. The global SYSREF digital delay
(SYSREF_DDLY), local SYSREF digital delay (SCLKX_Y_DDLY), local SYSREF half step (SCLKX_Y_HS), and
local SYSREF analog delay (SCLKX_Y_ADLY, SCLK2_3_ADLY_EN) can be adjusted to provide the required
setup and hold time between SYSREF and Device Clock. It is also possible to adjust the device clock digital
delay (DCLKX_Y_DDLY) and half step (DCLK0_1_HS, DCLK0_1_DCC) to adjust phase with respect to
SYSREF.
图8-6. SYSREF to Device Clock Timing alignment
Depending on the DCLKout_X path settings, local SCLK_X_Y_DDLY might need adjustment factor. Following
equation can be used to calculate the required Digital Delay Values to align SYSREF to the corresponding
DCLKOUT
SYSREF_DDLY = DCLKX_Y_DDLY –1 + DCLK_DIV_ADJUST + DCLK_HS_ADJUST –SCLK_X_Y_DDLY
(1)
SYSREF_DDLY > 7; SCLK_X_Y_DDLY > 1.
表8-4. DCLK_DIV_ADJUST
DCLKX_Y_DIV
DCLK_DIV_ADJUST
>6
6
0
–1
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表8-4. DCLK_DIV_ADJUST (continued)
DCLKX_Y_DIV
DCLK_DIV_ADJUST
5
3
4
0
3 (1)
2 (1)
–2
–2
(1) Refer to the SYNC requirement SYNC/SYSREF
表8-5. DCLK_HS_ADJUST
DCLK & HS
DCLK_HS_ADJUST
0
1
0
1
For example: DCLKX_Y_DIV = 32, DCLKX_Y_DDLY = 10, DCC&HS = 1;
SYSREF_DDLY=10 –1 + 0 + 1 –2 = 8
8.3.6 Input Clock Switching
Manual, pin select, and automatic are three different kinds clock input switching modes can be selected
according to the combination of bits as illustrated in 图8-7.
Input Clock Select
It is required for CLKin1
to be selected for
distribution mode.
Recommend using
CLKin_SEL_MANUAL
CLKin_SEL_
AUTO_EN
Yes
No
Active CLKin is set Auto
Mode State Machine
CLKin_SEL_
PIN_EN
Yes
No
Active CLKin is set by
CLKin_SEL_MANUAL
CLKin_SEL_
PIN_POL
Yes
No
Active CLKin is set by
CLKin_SEL# and Status_LD1
pins, inverted.
Active CLKin is set by
CLKin_SEL# and Status_LD1
pins.
图8-7. CLKINx Input Reference
The following sections provide information about how the active input clock is selected and what causes a
switching event in the various clock input selection modes.
8.3.6.1 Input Clock Switching - Manual Mode
When CLKin_SEL_AUTO_EN = 0 and CLKin_SEL_PIN_EN = 0, the active CLKin is selected by
CLKin_SEL_MANUAL. Programming a value of 0, 1, or 2 to CLKin_SEL_MANUAL causes CLKin0, CLKin1, or
CLKin2, respectively, to be the selected active input clock. In this mode, the EN_CLKinX bits are overridden
such that the CLKinX buffer operates even if CLKinX is disabled with EN_CLKinX = 0.
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If holdover is entered in this mode by setting CLKin_SEL_MANUAL = 3, then the device will re-lock to the
selected CLKin upon holdover exit.
8.3.6.2 Input Clock Switching - Pin Select Mode
When CLKin_SEL_AUTO_EN = 0 and CLKin_SEL_PIN_EN = 1, the active CLKin is selected by the
CLKin_SEL# and Status_LD1 pins.
Configuring Pin Select Mode
The CLKin_SEL0_TYPE must be programmed to an input value for the CLKin_SEL0 pin to function as an input
for pin select mode.
The CLKin_SEL1_TYPE must be programmed to an input value for the CLKin_SEL1 pin to function as an input
for pin select mode.
The polarity of the clock input select pins can be inverted with the CLKin_SEL_PIN_POL bit.
The pin select mode overrides the EN_CLKinX bits such that the CLKinX buffer operates even if CLKinX is
disabled with EN_CLKinX = 0. To switch as fast as possible, keep the clock input buffers enabled (EN_CLKinX =
1) that could be switched to.
8.3.6.3 Input Clock Switching - Automatic Mode
When CLKin_SEL_AUTO_EN = 1, LOS_EN = 1, and HOLDOVER_EXIT_MODE = 0 (Exit based on LOS), the
active clock is selected in priority order with CLKin0 being the highest priority, CLKin1 second, and CLKin2 third.
For a clock input to be eligible to be switched to, it must be enabled using EN_CLKinX. The LOS_TIMEOUT
should also be set to a frequency below the input frequency.
To ensure LOS is valid for AC-coupled inputs, the MOS mode must be set for the CLKin and no termination is
allowed to be between the pins unless the pins are DC-blocked. For example, no 100-Ω termination across
CLKin0 and CLKin0* pins on IC side of AC-coupling capacitors.
8.3.7 Digital Lock Detect (DLD)
Both PLL1 and PLL2 support digital lock detect. Digital lock detect compares the phase between the reference
path (R) and the feedback path (N) of the PLL. When the time error, which is phase error, between the two
signals is less than a specified window size (ε) a lock detect count increments. When the lock detect count
reaches a user specified value, PLL1_DLD_CNT or PLL2_DLD_CNT, lock detect is asserted true. Once digital
lock detect is true, a single phase comparison outside the specified window will cause digital lock detect to be
asserted false. This is illustrated in 图8-8.
NO
NO
PLLX
Lock Detected = False
Lock Count = 0
YES
YES
Increment
PLLX Lock Count
PLLX
Lock Detected = True
PLLX Lock Count =
PLLX_DLD_CNT
START
Phase Error < g
Phase Error < g
YES
NO
图8-8. Digital Lock Detect Flowchart
This incremental lock detect count feature functions as a digital filter to ensure that lock detect is not asserted for
only a brief time when the phases of R and N are within the specified tolerance for only a brief time during initial
phase lock.
See Digital Lock Detect Frequency Accuracy for more detailed information on programming the registers to
achieve a specified frequency accuracy in ppm with lock detect.
The digital lock detect signal can be monitored on the Status_LD1 or Status_LD2 pin. The pin may be
programmed to output the status of lock detect for PLL1, PLL2, or both PLL1 and PLL2.
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8.3.7.1 Calculating Digital Lock Detect Frequency Accuracy
See Digital Lock Detect Frequency Accuracy for more detailed information on programming the registers to
achieve a specified frequency accuracy in ppm with lock detect.
The digital lock detect feature can also be used with holdover to automatically exit holdover mode. See Exiting
Holdover for more information.
8.3.8 Holdover
Holdover mode causes PLL2 to stay locked on frequency with minimal frequency drift when an input clock
reference to PLL1 becomes invalid. While in holdover mode, the PLL1 charge pump is TRI-STATED and a fixed
tuning voltage is set on CPout1 to operate PLL1 in open loop.
8.3.8.1 Enable Holdover
Program HOLDOVER_EN = 1 to enable holdover mode.
Holdover mode can be configured to set the CPout1 voltage upon holdover entry to a fixed user defined voltage
(EN_MAN_DAC = 1) or a tracked voltage (EN_MAN_DAC = 0).
8.3.8.1.1 Fixed (Manual) CPout1 Holdover Mode
By programming MAN_DAC_EN = 1, then the MAN_DAC value will be set on the CPout1 pin during holdover.
The user can optionally enable CPout1 voltage tracking (TRACK_EN = 1), read back the tracked DAC value,
then re-program MAN_DAC value to a user desired value based on information from previous DAC read backs.
This allows the most user control over the holdover CPout1 voltage, but also requires more user intervention.
8.3.8.1.2 Tracked CPout1 Holdover Mode
By programming MAN_DAC_EN = 0 and TRACK_EN = 1, the tracked voltage of CPout1 is set on the CPout1
pin during holdover. When the DAC has acquired the current CPout1 voltage, the DAC_Locked signal is set,
which may be observed on Status_LD1 or Status_LD2 pins by programming PLL1_LD_MUX or PLL2_LD_MUX,
respectively.
Updates to the DAC value for the Tracked CPout1 sub-mode occurs at the rate of the PLL1 phase detector
frequency divided by (DAC_CLK_MULT × DAC_CLK_CNTR).
The DAC update rate should be programmed for ≤100 kHz to ensure DAC holdover accuracy.
The ability to program slow DAC update rates, for example one DAC update per 4.08 seconds when using 1024-
kHz PLL1 phase detector frequency with DAC_CLK_MULT = 16,384 and DAC_CLK_CNTR = 255, allows the
device to look-back and set CPout1 at a previous good CPout1 tuning voltage values before the event which
caused holdover to occur.
The current voltage of DAC value can be read back using RB_DAC_VALUE, see the RB_DAC_VALUE section.
8.3.8.2 During Holdover
PLL1 is run in open-loop mode.
• PLL1 charge pump is set to TRI-STATE.
• PLL1 DLD is unasserted.
• The HOLDOVER status is asserted
• During holdover, if PLL2 was locked prior to entry of holdover mode, PLL2 DLD continues to be asserted.
• CPout1 voltage is set to:
– a voltage set in the MAN_DAC register (MAN_DAC_EN = 1).
– a voltage determined to be the last valid CPout1 voltage (MAN_DAC_EN = 0).
• PLL1 attempts to lock with the active clock input.
The HOLDOVER status signal can be monitored on the Status_LD1 or Status_LD2 pin by programming the
PLL1_DLD_MUX or PLL2_DLD_MUX register to Holdover Status.
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8.3.8.3 Exiting Holdover
Holdover mode can be exited in one of two ways.
• Manually, by programming the device from the host.
• Automatically, when the LOS signal unasserts for a clock that provides a valid input to PLL1.
8.3.8.4 Holdover Frequency Accuracy and DAC Performance
When in holdover mode, PLL1 runs in open loop and the DAC sets the CPout1 voltage. If fixed CPout1 mode is
used, then the output of the DAC is dependent upon the MAN_DAC register. If tracked CPout1 mode is used,
then the output of the DAC is approximately the same voltage at the CPout1 pin before holdover mode was
entered. When using Tracked mode and MAN_DAC_EN = 1, the DAC value during holdover is loaded with the
programmed value in MAN_DAC and not the tracked value.
When in Tracked CPout1 mode, the DAC has a worst-case tracking error of ±2 LSBs once PLL1 tuning voltage
is acquired. The step size is approximately 3.2 mV, therefore the VCXO frequency error during holdover mode
caused by the DAC tracking accuracy is ±6.4 mV × Kv, where Kv is the tuning sensitivity of the VCXO in use.
Therefore, the accuracy of the system when in holdover mode in ppm is:
6.4 mV × Kv × 1e6
Holdover accuracy (ppm) =
VCXO Frequency
(2)
As an example, consider a system with a 19.2-MHz clock input, a 153.6-MHz VCXO with a Kv of 17 kHz/V. The
accuracy of the system in holdover in ppm is:
±0.71 ppm = ±6.4 mV × 17 kHz/V × 1e6 / 153.6 MHz
(3)
It is important to account for this frequency error when determining the allowable frequency error window to
cause holdover mode to exit.
8.3.9 PLL2 Loop Filter
PLL2 has an integrated loop filter of C1i = 60 pF, R3 = 2400 Ω, C3 = 50 pF, R4 = 200 Ω and C4 = 10 pF as
shown in 图 8-9. Loop filter components C1, C2, and R2 can be solved using TI software. See Device Support
for more information.
图8-9. PLL2 On-Chip Loop Filter
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8.4 Device Functional Modes
This device can be configured for many different use cases. The following simplified block diagrams help show
the user the different use cases of the device.
8.4.1 DUAL PLL
8.4.1.1 Dual Loop
图 8-10 shows the typical use case of dual loop mode. In dual loop mode, the reference to PLL1 is from CLKin0,
CLKin1, or CLKin2. An external VCXO is used to provide feedback for the first PLL and a reference to the
second PLL. This first PLL cleans the jitter with the VCXO by using a narrow loop bandwidth. The VCXO may be
buffered through the OSCout port. The VCXO is used as the reference to PLL2 and may be doubled using the
frequency doubler. The internal VCO drives up to seven divide/delay blocks which drive up to 14 clock outputs.
Hitless switching and holdover functionality are optionally available when the input reference clock is lost.
Holdover works by forcing a DAC voltage to the tuning voltage of the VCXO.
It is also possible to use an external VCO in place of PLL2's internal VCO. In this case one less CLKin is
available as a reference as CLKin1 is used for external input.
External
Loop Filter
OSCOUT_P
OSCOUT_N
External
VCXO
CLKINx_P
CLKINx_N
PLL1
Phase
Detector/
Charge
Pump
R
CPOUT2
7 Blocks
External
Loop Filter
Up to 3
inputs
Device Clock
Divider
Digital Delay
R
N
PLL2
PLL2
CLKOUTx_P
CLKOUTx_N
Phase
Detector/
Charge
Pump
N
Up to 14 Clock or
SYSREF Outputs
PLL1
7 Blocks
SYSREF
CLKOUTy_P
CLKOUTy_N
Global SYSREF
Divider and Delay
Digital Delay
Analog Delay
图8-10. Simplified Functional Block Diagram for Dual Loop Mode
8.4.1.2 Dual Loop With Cascaded 0-Delay
图 8-11 shows the use case of cascaded 0-delay dual loop mode. This configuration differs from dual loop mode
图8-10 in that the feedback for PLL2 is driven by a clock output instead of the VCO output directly.
It is also possible to use an external VCO in place of the internal VCO of the PLL2, but one less CLKin is
available as a reference and the external 0-delay feedback is not available.
External
Loop Filter
OSCOUT_P
OSCOUT_N
External
VCXO
CLKINx_P
CLKINx_N
PLL1
Phase
Detector/
Charge
Pump
R
CPOUT2
7 Blocks
External
Loop Filter
Up to 3
inputs
Device Clock
Divider
Digital Delay
R
N
PLL2
PLL2
CLKOUTx_P
CLKOUTx_N
Phase
Detector/
Charge
Pump
N
Up to 14 Clock or
SYSREF Outputs
PLL1
7 Blocks
SYSREF
CLKOUTy_P
CLKOUTy_N
Global SYSREF
Divider and Delay
Digital Delay
Analog Delay
Internal or external loopback, user programmable
图8-11. Simplified Functional Block Diagram for Cascaded 0-Delay Dual Loop Mode
8.4.1.3 Dual Loop With Nested 0-Delay
图 8-12 shows the use case of nested 0-delay dual loop mode. This configuration is similar to the dual PLL in 图
8-10 except that the feedback to the first PLL is driven by a clock output. The PLL2 reference OSCIN is not
deterministic to the CLKIN or feedback clock.
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External
Loop Filter
OSCOUT_P
OSCOUT_N
External
VCXO
CLKINx_P
CLKINx_N
PLL1
Phase
Detector/
Charge
Pump
R
CPOUT2
7 Blocks
External
Loop Filter
Up to 3
inputs
Device Clock
Divider
Digital Delay
R
N
PLL2
PLL2
CLKOUTx_P
CLKOUTx_N
Phase
Detector/
Charge
Pump
N
Up to 14 Clock or
SYSREF Outputs
PLL1
7 Blocks
SYSREF
CLKOUTy_P
CLKOUTy_N
Global SYSREF
Divider and Delay
Digital Delay
Analog Delay
Internal or external loopback, user programmable
图8-12. Simplified Functional Block Diagram for Nested 0-Delay Dual Loop Mode
8.4.2 Single PLL
8.4.2.1 PLL2 Single Loop
图 8-13 shows the use case of PLL2 single loop mode. When used with a high-frequency clean reference
performance as good as dual loop mode may be achieved. Traditionally the OSCIN is used as a reference to
PLL2, but it is also possible to use CLKINx as a reference to PLL2.
External
Loop Filter
OSCOUT_P
OSCOUT_N
CPOUT2
7 Blocks
OSCIN_P
OSCIN_N
Device Clock
Divider
R
N
PLL2
PLL2
CLKOUTx_P
CLKOUTx_N
Phase
Detector/
Charge
Pump
Up to 4
Inputs
Digital Delay
CLKINx_P
CLKINx_N
Up to 14 Clock or
SYSREF Outputs
7 Blocks
SYSREF
CLKOUTy_P
CLKOUTy_N
Global SYSREF
Divider and Delay
Digital Delay
Analog Delay
图8-13. Simplified Functional Block Diagram for Single Loop Mode
8.4.2.2 PLL2 With External VCO
You can use the FIN0/FIN1 input pins to add an external VCO. The input may be single-ended or differential. At
high frequency, the input impedance to FIN0/FIN1 is low. A resistive pad is recommended for matching.
External Loop Filter
OSCOUT_P
FIN0_P
FIN0_N
7 Blocks
OSCOUT_N
CPOUT2
OSCIN_P
OSCIN_N
Device Clock
Divider
Digital Delay
R
N
PLL2
Phase
Detector/
Charge
Pump
CLKOUTx_P
CLKOUTx_N
Up to3
Inputs
PLL2
Up to 14 Clock or
SYSREF Outputs
CLKINx_P
CLKINx_N
7 Blocks
SYSREF
CLKOUTy_P
CLKOUTy_N
Global SYSREF
Divider and Delay
Digital Delay
Analog Delay
图8-14. Simplified Functional Block Diagram for Single Loop Mode With External VCO
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8.4.3 Distribution Mode
图8-15 shows the use case of distribution mode. As in all the other use cases, OSCIN to OSCOUT can be used
as a buffer to OSCIN or from clock distribution path through CLKOUT6, CLKOUT8, or the SYSREF divider.
At high frequency, the input impedance to FIN0/FIN1 is low and a resistive pad is recommended for matching.
OSCIN_P
OSCIN_N
OSCOUT_P
OSCOUT_N
CLKOUT6/8
FIN0_P
7 Blocks
FIN0_N
Device Clock
Divider
Digital Delay
Analog Delay
÷2
CLKOUTx_P
CLKOUTx_N
CLKIN1_P/FIN1_P
CLKIN1_N/FIN1_N
Up to 14 Clock or
SYSREF Outputs
7 Blocks
CLKOUTx_P
CLKOUTx_N
SYSREF
Global SYSREF
Divider and Delay
CLKIN1_P/FIN1_P
CLKIN1_N/FIN1_N
Digital Delay
Analog Delay
A
图8-15. Simplified Functional Block Diagram for Distribution Mode
8.5 Programming
The device is programmed using 24-bit registers. Each register consists of a 1-bit command field (R/W), a 15-bit
address field (A14 to A0) and a 8-bit data field (D7 to D0). The contents of each register is clocked in MSB first
(R/W), and the LSB (D0) last. During programming, the CS* signal is held low. The serial data is clocked in on
the rising edge of the SCK signal. After the LSB is clocked in, the CS* signal goes high to latch the contents into
the shift register. TI recommends to program registers in numeric order (for example, 0x000 to 0x555 with
exceptions noted in the Recommended Programming Sequence). Each register consists of one or more fields
which control the device functionality. See the Electrical Characteristics table and 图6-1 for timing details.
8.5.1 Recommended Programming Sequence
Registers are generally programmed in numeric order with 0x000 being the first and 0x555 being the last register
programmed. The recommended programming sequence from POR involves:
1. Program register 0x000 with RESET = 1.
2. Program defined registers from 0x000 to 0x165.
3. If PLL2 is used, program 0x173 with PLL2_PD and PLL2_PRE_PD clear to allow PLL2 to lock after PLL2_N
is programmed.
4. Continue programming defined registers from 0x166 to 0x555.
备注
When using the internal VCO, PLL2_N registers 0x166, 0x167, and 0x168 must be programmed after
other PLL2 dividers are programed to ensure proper VCO frequency calibration. This is also true for
PLL2_N_CAL registers 0x163, 0x164, 0x165 when PLL2_NCLK_MUX = 1. So if any divider such as
PLL2_R is altered to change the VCO frequency, the VCO calibration must be run again by
programming PLL2_N.
Power up PLL2 by setting PLL2_PRE_PD = 0 and PLL2_PD = 0 in register 0x173 before
programming PLL2_N.
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8.6 Register Maps
8.6.1 Register Map for Device Programming
表 8-6 provides the register map for device programming. Any register can be read from the same data address
it is written to.
表8-6. Register Map
ADDRESS
DATA[7:0]
[14:0]
23:8
7
6
5
4
3
2
1
0
SPI_3WIRE
_DIS
0x000
RESET
0
0
0
0
0
0
POWER
DOWN
0x002
0
0
0
0
0
0
0
0x003
0x004
0x005
0x006
0x00C
0x00D
0x100
0x101
ID_DEVICE_TYPE
ID_PROD[7:0]
ID_PROD[15:8]
ID_MASKREV
ID_VNDR[15:8]
ID_VNDR[7:0]
DCLK0_1_DIV[7:0]
DCLK0_1_DDLY[7:0]
CLKout0_1_OD
L
DCLK0_1_DDLY
_PD
0x102
0x103
0x104
0x105
CLKout0_1_PD
CLKout0_1_IDL
DCLK0_1_DDLY[9:8]
DCLK0_1_BYP DCLK0_1_DCC DCLK0_1_POL
SCLK0_1_DIS_MODE SCLK0_1_POL
SCLK0_1_ADLY
SCLK0_1_DDLY
DCLK0_1_DIV[9:8]
CLKout0_SRC_
MUX
0
0
1
0
DCLK0_1_PD
SCLK0_1_PD
DCLK0_1_HS
SCLK0_1_HS
CLKout1_SRC_
MUX
SCLK0_1_ADLY
_EN
0
0
0
0
0x106
0x107
0x108
0x109
0
0
CLKout1_FMT
CLKout0_FMT
DCLK2_3_DIV[7:0]
DCLK2_3_DDLY[7:0]
DCLK2_3_DDLY
CLKout2_3_OD
L
0x10A
0x10B
0x10C
0x10D
CLKout2_3_PD
CLKout2_3_IDL
DCLK2_3_DDLY[9:8]
DCLK2_3_DIV[9:8]
_PD
CLKout2_SRC_
MUX
0
0
1
0
DCLK2_3_PD
DCLK2_3_BYP DCLK2_3_DCC DCLK2_3_POL
DCLK2_3_HS
SCLK2_3_HS
CLKout3_SRC_
MUX
SCLK2_3_PD
SCLK2_3_DIS_MODE
SCLK2_3_ADLY
SCLK2_3_DDLY
SCLK2_3_POL
SCLK2_3_ADLY
_EN
0
0
0
0
0x10E
0x10F
0x110
0x111
0
0
CLKout3_FMT
CLKout2_FMT
DCLK4_5_DIV[7:0]
DCLK4_5_DDLY[7:0]
DCLK4_5_DDLY
CLKout4_5_OD
L
0x112
0x113
0x114
0x115
CLKout4_5_PD
CLKout4_5_IDL
DCLK4_5_DDLY[9:8]
DCLK4_5_DIV[9:8]
_PD
CLKout4_SRC_
MUX
0
0
1
0
DCLK4_5_PD
DCLK4_5_BYP DCLK4_5_DCC DCLK4_5_POL
DCLK4_5_HS
SCLK4_5_HS
CLKout5_SRC_
MUX
SCLK4_5_PD
SCLK4_5_DIS_MODE
SCLK4_5_ADLY
SCLK4_5_POL
SCLK4_5_ADLY
_EN
0
0
0
0
0x116
0x117
0x118
0
0
SCLK4_5_DDLY
CLKout4_FMT
CLKout5_FMT
DCLK6_7_DIV[7:0]
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表8-6. Register Map (continued)
ADDRESS
[14:0]
DATA[7:0]
23:8
7
6
5
4
3
2
1
0
0x119
DCLK6_7_DDLY[7:0]
CLKout6_7_OD
L
DCLK6_7_DDLY
_PD
0x11A
0x11B
0x11C
0x11D
CLKout6_7_PD
CLKout6_7_IDL
DCLK6_7_DDLY[9:8]
DCLK6_7_BYP DCLK6_7_DCC DCLK6_7_POL
SCLK6_7_DIS_MODE SCLK6_7_POL
SCLK6_7_ADLY
SCLK6_7_DDLY
DCLK6_7_DIV[9:8]
CLKout6_SRC_
MUX
0
0
1
0
DCLK6_7_PD
SCLK6_7_PD
DCLK6_7_HS
SCLK6_7_HS
CLKout7_SRC_
MUX
SCLK6_7_ADLY
_EN
0
0
0
0
0x11E
0x11F
0x120
0x121
0
0
CLKout7_FMT
CLKout6_FMT
DCLK8_9_DIV[7:0]
DCLK8_9_DDLY[7:0]
DCLK8_9_DDLY
CLKout8_9_OD
L
0x122
0x123
0x124
0x125
CLKout8_9_PD
CLKout8_9_IDL
DCLK8_9_DDLY[9:8]
DCLK8_9_DIV[9:8]
_PD
CLKout8_SRC_
MUX
0
0
1
0
DCLK8_9_PD
DCLK8_9_BYP DCLK8_9_DCC DCLK8_9_POL
DCLK8_9_HS
SCLK8_9_HS
CLKout9_SRC_
MUX
SCLK8_9_PD
SCLK8_9_DIS_MODE
SCLK8_9_ADLY
SCLK8_9_POL
SCLK8_9_ADLY
_EN
0
0
0
0
0x126
0x127
0x128
0x129
0
0
SCLK8_9_DDLY
CLKout8_FMT
CLKout9_FMT
DCLK10_11_DIV[7:0]
DCLK10_11_DDLY[7:0]
CLKout10_11_P CLKout10_11_O CLKout10_11_I DCLK10_11_DD
0x12A
0x12B
0x12C
0x12D
DCLK10_11_DDLY[9:8]
DCLK10_11_DIV[9:8]
D
DL
DL
LY_PD
CLKout10_SRC
_MUX
DCLK10_11_BY DCLK10_11_DC DCLK10_11_PO
0
1
DCLK10_11_PD
DCLK10_11_HS
SCLK10_11_HS
P
C
L
CLKout11_SRC
_MUX
SCLK10_11_PO
L
0
0
SCLK10_11_PD
SCLK10_11_DIS_MODE
SCLK10_11_ADLY
SCLK10_11_AD
LY_EN
0
0
0
0
0x12E
0x12F
0x130
0x131
0
0
SCLK10_11_DDLY
CLKout10_FMT
CLKout11_FMT
DCLK12_13_DIV[7:0]
DCLK12_13_DDLY[7:0]
CLKout12_13_P CLKout12_13_O CLKout12_13_I DCLK12_13_DD
0x132
0x133
0x134
0x135
DCLK12_13_DDLY[9:8]
DCLK12_13_DIV[9:8]
D
DL
DL
LY_PD
CLKout12_SRC
_MUX
DCLK12_13_BY DCLK12_13_DC DCLK12_13_PO
0
1
DCLK12_13_PD
DCLK12_13_HS
SCLK12_13_HS
P
C
L
CLKout13_SRC
_MUX
SCLK12_13_PO
L
0
0
SCLK12_13_PD
SCLK12_13_DIS_MODE
SCLK12_13_ADLY
SCLK12_13_DDLY
SCLK12_13_AD
LY_EN
0
0
0
0
0x136
0x137
0x138
0
0
CLKout13_FMT
VCO_MUX
CLKout12_FMT
OSCout_FMT
0
0
0
OSCout_MUX
SYSREF_REQ_
EN
0x139
0
0
0
0
SYNC_BYPASS
0
SYSREF_MUX
0x13A
0x13B
0x13C
0x13D
SYSREF_DIV[12:8]
SYSREF_DIV[7:0]
0
0
0
SYSREF_DDLY[12:8]
SYSREF_DDLY[7:0]
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表8-6. Register Map (continued)
ADDRESS
[14:0]
DATA[7:0]
23:8
7
6
5
4
3
2
1
0
0x13E
0
0
0
0
0
SYSREF_PULSE_CNT
PLL2_RCLK_
MUX
PLL2_NCLK_
MUX
0x13F
0x140
0
PLL1_NCLK_MUX
FB_MUX
FB_MUX_EN
SYSREF_GBL_
SYSREF_DDLY SYSREF_PLSR
PLL1_PD
VCO_LDO_PD
DDLYd12_EN
VCO_PD
OSCin_PD
SYSREF_PD
DDLYd4_EN
PD
_PD
_PD
DDLYd_
SYSREF_EN
0x141
0x142
0x143
DDLYd10_EN
DDLYd8_EN
DDLYd6_EN
DDLYd2_EN
DDLYd0_EN
DDLYd_STEP_CNT
SYNC_1SHOT_
EN
SYNC_PLL2_
DLD
SYNC_PLL1_
DLD
SYSREF_CLR
SYNC_POL
SYNC_EN
SYNC_MODE
SYNC_DISSYS
REF
0x144
0x145
0x146
SYNC_DIS12
SYNC_DIS10
SYNC_DIS8
SYNC_DIS6
SYNC_DIS4
FIN0_DIV2_EN
CLKin2_TYPE
SYNC_DIS2
SYNC_DIS0
PLL1R_SYNC_
EN
PLL2R_SYNC_
EN
2
PLL1R_SYNC_SRC
FIN0_INPUT_TYPE
CLKin_SEL_PIN CLKin_SEL_PIN
CLKin2_EN
CLKin1_EN
CLKin0_EN
CLKin1_TYPE
CLKin0_TYPE
_EN
_POL
CLKin_SEL_
AUTO_
REVERT_EN
CLKin_SEL_
AUTO_EN
0x147
CLKin_SEL_MANUAL
CLKin1_DEMUX
CLKin0_DEMUX
0x148
0x149
0x14A
0x14B
0
0
0
0
CLKin_SEL0_MUX
CLKin_SEL1_MUX
RESET_MUX
CLKin_SEL0_TYPE
CLKin_SEL1_TYPE
RESET_TYPE
SDIO_RDBK_
TYPE
0
HOLDOVER_
FORCE
LOS_TIMEOUT
LOS_EN
TRACK_EN
MAN_DAC_EN
MAN_DAC[9:8]
0x14C
0x14D
0x14E
0x14F
MAN_DAC[7:0]
0
0
DAC_TRIP_LOW
DAC_TRIP_HIGH
DAC_CLK_MULT
DAC_CLK_CNTR
CLKin_OVERRI
DE
HOLDOVER_
EXIT_MODE
HOLDOVER_ LOS_EXTERNA HOLDOVER_ CLKin_SWITCH HOLDOVER_
0x150
0
0
PLL1_DET
L_INPUT
HOLDOVER_DLD_CNT[13:8]
HOLDOVER_DLD_CNT[7:0]
CLKin0_R[13:8]
VTUNE_DET
_CP_TRI
EN
0x151
0x152
0x153
0x154
0x155
0x156
0x157
0x158
0x159
0x15A
0x15B
0x15C
0x15D
0x15E
0x15F
0x160
0x161
0
0
0
0
0
0
0
0
0
CLKin0_R[7:0]
CLKin1_R[7:0]
CLKin2_R[7:0]
PLL1_N[7:0]
CLKin1_R[13:8]
CLKin2_R[13:8]
PLL1_N[13:8]
PLL1_WND_SIZE
PLL1_CP_TRI
PLL1_CP_POL
PLL1_CP_GAIN
PLL1_DLD_CNT[13:8]
0
0
0
0
0
0
PLL1_DLD_CNT[7:0]
0
HOLDOVER_EXIT_NADJ
PLL1_LD_TYPE
PLL2_R
PLL1_LD_MUX
0
0
PLL2_R
PLL2_REF_2X_
EN
0x162
PLL2_P
0
0
OSCin_FREQ
PLL2_XTAL_EN
0x163
0x164
0
0
0
0
0
PLL2_N_CAL[17:16]
PLL2_N_CAL[15:8]
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表8-6. Register Map (continued)
ADDRESS
[14:0]
DATA[7:0]
23:8
7
6
5
4
3
2
1
0
0x165
0x166
0x167
0x168
0x169
0x16A
0x16B
0x173
0x177
PLL2_N_CAL[7:0]
0
0
0
0
0
0
PLL2_N[17:16]
PLL2_N[15:8]
PLL2_N[7:0]
0
0
PLL2_WND_SIZE
PLL2_CP_GAIN
PLL2_CP_POL
PLL2_CP_TRI
PLL2_DLD_EN
0
PLL2_DLD_CNT[13:8]
PLL2_DLD_CNT[7:0]
0
PLL2_PRE_PD
PLL2_PD
FIN0_PD
0
0
0
0
PLL1R_RST
CLR_PLL1_LD_ CLR_PLL2_LD_
0x182
0x183
0
0
0
0
0
0
0
0
0
0
LOST
LOST
RB_PLL1_DLD_
LOST
RB_PLL2_DLD_
LOST
RB_PLL1_DLD
RB_PLL2_DLD
RB_CLKin2_
SEL
RB_CLKin1_
SEL
RB_CLKin0_
SEL
RB_CLKin2_
LOS
RB_CLKin1_
LOS
RB_CLKin0_
LOS
0x184
0x185
0x188
0x555
RB_DAC_VALUE[9:8]
RB_DAC_VALUE[7:0]
RB_
HOLDOVER
RB_DAC_
LOCKED
0
X
X
RB_DAC_RAIL RB_DAC_HIGH RB_DAC_LOW
SPI_LOCK
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8.6.2 Device Register Descriptions
The following section details the fields of each register, the Power-On-Reset Defaults, and specific descriptions
of each bit.
In some cases similar fields are located in multiple registers. In this case specific outputs may be designated as
X or Y. In these cases, the X represents even numbers from 0 to 12 and the Y represents odd numbers from 1 to
13. In the case where X and Y are both used in a bit name, then Y = X + 1.
8.6.2.1 System Functions
8.6.2.1.1 RESET, SPI_3WIRE_DIS
This register contains the RESET function and the ability to turn off 3-wire SPI mode. To use a 4-wire SPI mode,
selecting SPI Read back in one of the output MUX settings. For example CLKin0_SEL_MUX or RESET_MUX. It
is possible to have 3-wire and 4-wire readback at the same time.
表8-7. Register 0x000
BIT
7
NAME
RESET
NA
POR DEFAULT
DESCRIPTION
0: Normal operation
1: Reset (automatically cleared)
0
0
6:5
Reserved
Disable 3-wire SPI mode.
0: 3 Wire Mode enabled
1: 3 Wire Mode disabled
4
SPI_3WIRE_DIS
NA
0
3:0
NA
Reserved
8.6.2.1.2 POWERDOWN
This register contains the POWERDOWN function.
表8-8. Register 0x002
BIT
7:1
NAME
POR DEFAULT
DESCRIPTION
NA
POWERDOWN
0
Reserved
0: Normal operation
1: Power down device.
0
0
8.6.2.1.3 ID_DEVICE_TYPE
This register contains the product device type. This is read only register.
表8-9. Register 0x003
BIT
NAME
POR DEFAULT
DESCRIPTION
7:0
ID_DEVICE_TYPE
6
PLL product device type.
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8.6.2.1.4 ID_PROD
These registers contain the product identifier. This is a read only register.
表8-10. ID_PROD Field Registers
MSB
LSB
0x004[7:0] / ID_PROD[15:8]
0x005[7:0] / ID_PROD[7:0]
表8-11. Registers 0x004 and 0x005
REGISTER
0x004
BIT
7:0
7:0
FIELD NAME
ID_PROD[7:0]
ID_PROD[15:8]
POR DEFAULT
DESCRIPTION
LSB of the product identifier.
MSB of the product identifier.
99 (0x63)
0x005
209 (0xD1)
8.6.2.1.5 ID_MASKREV
This register contains the IC version identifier. This is a read only register.
表8-12. Register 0x006
BIT
NAME
POR DEFAULT
DESCRIPTION
7:0
ID_MASKREV
112 (0x70)
IC version identifier
8.6.2.1.6 ID_VNDR
These registers contain the vendor identifier. This is a read only register.
表8-13. ID_VNDR Field Registers
MSB
LSB
0x00C[7:0] / ID_VNDR[15:8]
0x00D[7:0] / ID_VNDR[7:0]
表8-14. Registers 0x00C, 0x00D
REGISTER BIT
NAME
POR DEFAULT
DESCRIPTION
0x00C
0x00D
7:0
7:0
ID_VNDR[15:8]
ID_VNDR[7:0]
81 (0x51)
MSB of the vendor identifier.
LSB of the vendor identifier.
4 (0x04)
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8.6.2.2 (0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
8.6.2.2.1 DCLKX_Y_DIV
The device clock divider can drive up to two outputs, an even (X) and an odd (Y) clock output. Divide is a 10 bit
number and split across two registers.
表8-15. DCLKX_Y_DIV Field Registers
MSB
LSB
0x0102[1:0] = DCLK0_1_DIV[9:8]
0x010A[1:0] = DCLK2_3_DIV[9:8]
0x0112[1:0] = DCLK4_5_DIV[9:8]
0x011A[1:0] = DCLK6_7_DIV[9:8]
0x0122[1:0] = DCLK8_9_DIV[9:8]
0x012A[1:0] = DCLK10_11_DIV[9:8]
0x0132[1:0] = DCLK12_13_DIV[9:8]
0x100[7:0] = DCLK0_1_DIV[7:0]
0x108[7:0] = DCLK2_3_DIV[7:0]
0x110[7:0] = DCLK4_5_DIV[7:0]
0x118[7:0] = DCLK6_7_DIV[7:0]
0x120[7:0] = DCLK8_9_DIV[7:0]
0x128[7:0] = DCLK10_11_DIV[7:0]
0x130[7:0] = DCLK12_13_DIV[7:0]
表8-16. Registers 0x100, 0x108, 0x110, 0x118, 0x120, 0x128, and 0x130
0x102, 0x10A, 0x112, 0x11A, 0x122, 0x12A, 0x132
REGISTER
BIT NAME
POR DEFAULT
DESCRIPTION
0x102,
0x10A,
0x112,
0x11A,
0x122,
DCLKX_Y_DIV sets the divide value for the clock output, the divide
may be even or odd. Both even or odd divides output a 50% duty
cycle clock if duty cycle correction (DCC) is enabled.
1:0
7:0
DCLKX_Y_DIV[9:8]
X_Y = 0_1 →2
X_Y = 2_3 →4
X_Y = 4_5 →8
X_Y = 6_7 →8
X_Y = 8_9 →8
X_Y = 10_11 →8
X_Y = 12_13 →2
Field Value
0 (0x00)
Divider Value
Reserved
1 (1)
0x12A, 0x132
1 (0x01)
0x100,
0x108,
0x110, 0x118,
0x120,
2 (0x02)
2
...
...
DCLKX_Y_DIV[7:0]
1022 (0x3FE)
1023 (0x3FF)
1022
1023
0x128, and
0x130
(1) Duty cycle correction must also be enabled, DCLKX_Y_DCC = 1.
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8.6.2.2.2 DCLKX_Y_DDLY
This register controls the digital delay for the device clock outputs.
表8-17. DCLKX_Y_DDLY Field Registers
MSB
LSB
0x0102[2:3] = DCLK0_1_DDLY[9:8]
0x010A[2:3] = DCLK2_3_DDLY[9:8]
0x0112[2:3] = DCLK4_5_DDLY[9:8]
0x011A[2:3] = DCLK6_7_DDLY[9:8]
0x0122[2:3] = DCLK8_9_DDLY[9:8]
0x012A[2:3] = DCLK10_11_DDLY[9:8]
0x0132[2:3] = DCLK12_13_DDLY[9:8]
0x101[7:0] = DCLK0_1_DDLY[7:0]
0x109[7:0] = DCLK2_3_DDLY[7:0]
0x111[7:0] = DCLK4_5_DDLY[7:0]
0x119[7:0] = DCLK6_7_DDLY[7:0]
0x121[7:0] = DCLK8_9_DDLY[7:0]
0x129[7:0] = DCLK10_11_DDLY[7:0]
0x131[7:0] = DCLK12_13_DDLY[7:0]
表8-18. Registers 0x101, 0x109, 0x111, 0x119, 0x121, 0x129, 0x131
0x102, 0x10A, 0x112, 0x11A, 0x122, 0x12A, 0x132
REGISTER
BIT NAME
POR DEFAULT
DESCRIPTION
0x102,
0x10A,
0x112,
0x11A,
0x122,
Static digital delay which takes effect after a SYNC.
Field Value
0 (0x00)
1 (0x01)
...
Delay Values
Reserved
2:3 DCLKX_Y_DDLY[9:8]
Reserved
0x12A, 0x132
...
10 (0x0A)
7 (0x07)
8 (0x08)
9 (0x09)
...
Reserved
0x101,
0x109, 0x111,
0x119,
8
9
7:0 DCLKX_Y_DDLY[7:0]
0x121,
...
0x129, 0x131
1022 (0x3FE)
1023 (0x3FF)
1022
1023
Depending on the DCLK divide value, there may be an adjustment in phase delay required. 表 8-19 illustrate the
impact of different divide values on the final digital delay.
表8-19. Digital Delay Adjustment based on Divide Values
DIVIDE VALUE
DIGITAL DELAY ADJUSTMENT
–2(1)
0
2, 3
4, 7 to 1023
5
6
+2
+1
(1) Before SYNC, program divider to Divide-by-4, then back to Divide-by-2 or Divide-by-3 to ensure '-2' delay relationship.
For example, 表 8-20 shows a system with clock outputs having divide values /2,/4,/5 and /6 to share a common
edge.
表8-20. Digital Delay Adjustment Illustration
DIVIDE VALUE
PROGRAMMED DDLY
ACTUAL DDLY
2
4
5
6
13
11
8
11
11
11
11
10
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8.6.2.2.3 CLKoutX_Y_PD, CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKX_Y_DDLY_PD, DCLKX_Y_DDLY[9:8],
DCLKX_Y_DIV[9:8]
表8-21. Registers 0x102, 0x10A, 0x112, 0x11A, 0x122, 0x12A, 0x132
BIT
NAME
POR DEFAULT
DESCRIPTION
Power down the clock group defined by X and Y.
0: Enabled
7
CLKoutX_Y_PD
1
1: Power down entire clock group including both CLKoutX and CLKoutY.
Sets output drive level for clocks. This has no impact for the even clock output
in bypass mode.
0: Normal operation
6
CLKoutX_Y_ODL
0
1: Higher current consumption and lower noise floor.
Sets input drive level for clocks.
0: Normal operation
1: Higher current consumption and lower noise floor.
5
4
CLKoutX_Y_IDL
0
0
Powerdown the device clock digital delay circuitry.
0: Enabled
DCLKX_Y_DDLY_PD
1: Power down static digital delay for device clock divider.
3:2
1:0
DCLKX_Y_DDLY[9:8]
DCLKX_Y_DIV[9:8]
0
0
MSB of static digital delay, see DCLKX_Y_DDLY.
MSB of device clock divide value, see 表8-16.
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8.6.2.2.4 CLKoutX_SRC_MUX, DCLKX_Y_PD, DCLKX_Y_BYP, DCLKX_Y_DCC, DCLKX_Y_POL, DCLKX_Y_HS
These registers control the analog delay properties for the device clocks.
表8-22. Registers 0x103, 0x10B, 0x113, 0x11B, 0x123, 0x12B, 0x133
BIT
7
NAME
NA
POR DEFAULT
DESCRIPTION
0
1
Reserved
Reserved
6
NA
Select CLKoutX clock source. Source must also be powered up.
5
4
CLKoutX_SRC_MUX
DCLKX_Y_PD
0
0
0: Device Clock
1: SYSREF
Power down the clock group defined by X and Y.
0: Enabled
1: Power down enter clock group X_Y.
Enable high performance bypass path for even clock outputs.
0: CLKoutX not in high performance bypass mode. CML is not valid for
CLKoutX_FMT.
3
2
DCLKX_BYP
0
0
1: CLKoutX in high performance bypass mode. Only CML clock format is valid.
Duty cycle correction for device clock divider. Required for half step.
0: No duty cycle correction.
DCLKX_Y_DCC
1: Duty cycle correction enabled.
Invert polarity of device clock output. This also applies to CLKoutX in high
performance bypass mode. Polarity invert is a method to get a half-step phase
adjustment in high performance bypass mode or /1 divide value.
0: Normal polarity
1
0
DCLKX_Y_POL
DCLKX_Y_HS
0
0
1: Invert polarity
Sets the device clock half step value. Must be set to zero (0) for a divide of 1.
No effect if DCLKX_Y_DCC = 0.
0: No phase adjustment
1: Adjust device clock phase –0.5 clock distribution path cycles.
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8.6.2.2.5 CLKoutY_SRC_MUX, SCLKX_Y_PD, SCLKX_Y_DIS_MODE, SCLKX_Y_POL, SCLKX_Y_HS
These registers set the half step for the device clock, the SYSREF output MUX, the SYSREF clock digital delay,
and half step.
表8-23. Registers 0x104, 0x10C, 0x114, 0x11C, 0x124, 0x12C, 0x134
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
NA
0
Reserved
Select CLKoutX clock source. Source must also be powered up.
5
4
CLKoutY_SRC_MUX
SCLKX_Y_PD
0
1
0: Device Clock
1: SYSREF
Power down the SYSREF clock output circuitry.
0: SYSREF enabled
1: Power down SYSREF path for clock pair.
Set disable mode for clock outputs controlled by SYSREF. Some cases will
assert when SYSREF_GBL_PD = 1.
Field Value
0 (0x00)
Disable Mode
Active in normal operation
1 (0x01)
If SYSREF_GBL_PD = 1, the output is
a logic low, otherwise it is active.
3:2
SCLKX_Y_DIS_MODE
0
2 (0x02)
If SYSREF_GBL_PD = 1, the output is
a nominal Vcm voltage for odd clock
channels(1) and low for even clocks.
Otherwise outputs are active.
3 (0x03)
Output is a nominal Vcm voltage(1)
Sets the polarity of clock on SCLKX_Y when SYSREF clock output is selected
with CLKoutX_MUX or CLKoutY_MUX.
0: Normal
1: Inverted
1
0
SCLKX_Y_POL
SCLKX_Y_HS
0
0
Sets the local SYSREF clock half step value.
0: No phase adjustment
1: Adjust device SYSREF phase -0.5 clock distribution path cycles.
(1) If LVPECL mode is used with emitter resistors to ground, the output Vcm will be approximately 0 V, each pin will be approximately 0 V.
If CML mode is used with pullups to VCC, the output VCM will be approximately VCC V, each pin will be approximately VCC V.
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8.6.2.2.6 SCLKX_Y_ADLY_EN, SCLKX_Y_ADLY
These registers set the analog delay parameters for the SYSREF outputs.
表8-24. Registers 0x105, 0x10D, 0x115, 0x11D, 0x125, 0x12D, 0x135
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
NA
0
Reserved
Enables analog delay for the SYSREF output.
0: Disabled
1: Enabled
SCLKX_Y
_ADLY_EN
5
0
SYSREF analog delay in approximately 21 ps steps. Selecting analog delay
adds an additional 125 ps in propagation delay. Range is 125 ps to 608 ps.
Field Value
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
...
Delay Value
125 ps
146 ps (+21 ps from 0x00)
167 ps (+42 ps from 0x00)
188 ps (+63 ps from 0x00)
...
SCLKX_Y
_ADLY
4:0
0
14 (0xE)
15 (0xF)
587 ps (+462 ps from 0x00)
608 ps (+483 ps from 0x00)
8.6.2.2.7 SCLKX_Y_DDLY
表8-25. Registers 0x106, 0x10E, 0x116, 0x11E, 0x126, 0x12E, 0x136
BIT
NAME
POR DEFAULT
DESCRIPTION
7:4
NA
0
Reserved
Sets the number of VCO cycles to delay SDCLKout by
Field Value
0 (0x00)
Delay Cycles
Bypass
1 (0x01)
2
3:0
SCLKX_Y_DDLY
0
2 (0x02)
3
...
...
10 (0x0A)
11 to 15 (0x0B to 0x0F)
11
Reserved
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8.6.2.2.8 CLKoutY_FMT, CLKoutX_FMT
The difference in the tables is that some of the clock outputs have inverted CMOS polarity settings.
表8-26. Registers 0x107 (CLKout0_1), 0x11F (CLKout6_7), 0x12F (CLKout10_11)
BIT
NAME
POR DEFAULT
DESCRIPTION
Set CLKoutY clock format
Field Value
0 (0x00)
Output Format
Powerdown
1 (0x01)
LVDS
2 (0x02)
HSDS 6 mA
3 (0x03)
HSDS 8 mA
4 (0x04)
LVPECL 1600 mV
LVPECL 2000 mV
LCPECL
5 (0x05)
6 (0x06)
7:4
CLKoutY_FMT
0
7 (0x07)
CML 16 mA
8 (0x08)
CML 24 mA
9 (0x09)
CML 32 mA
10 (0x0A)
CMOS (Off/Inv)
CMOS (Norm/Off)
CMOS (Inv/Inv)
CMOS (Inv/Norm)
CMOS (Norm/Inv)
11 (0x0B)
12 (0x0C)
13 (0x0D)
14 (0x0E)
15 (0x0F)
CMOS (Norm/Norm)
Set CLKoutX clock format
Output Format
DCLKX_BYP = 0
Output Format
DCLKX_BYP = 1
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
8 (0x08)
9 (0x09)
10 (0x0A)
11 (0x0B)
12 (0x0C)
13 (0x0D)
14 (0x0E)
15 (0x0F)
Powerdown
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
CML 16 mA
CML 24 mA
CML 32 mA
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
LVDS
HSDS 6 mA
HSDS 8 mA
LVPECL 1600 mV
LVPECL 2000 mV
LCPECL
3:0
CLKoutX_FMT
0
Reserved
Reserved
Reserved
CMOS (Off/Inv)(1)
CMOS (Norm/Off)(1)
CMOS (Inv/Inv)(1)
CMOS (Inv/Norm)(1)
CMOS (Norm/Inv)(1)
CMOS (Norm/Norm)(1)
(1) Only valid for CLKout10.
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表8-27. Registers 0x10F (CLKout2_3), 0x117 (CLKout4_5), 0x127 (CLKout8_9), 0x137 (CLKout12_13)
BIT
NAME
POR DEFAULT
DESCRIPTION
Set CLKoutY clock format
Field Value
0 (0x00)
Output Format
Powerdown
1 (0x01)
LVDS
2 (0x02)
HSDS 6 mA
HSDS 8 mA
LVPECL 1600 mV
LVPECL 2000 mV
LCPECL
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
7:4
CLKoutY_FMT
0
7 (0x07)
CML 16 mA
8 (0x08)
CML 24 mA
9 (0x09)
CML 32 mA
10 (0x0A)
CMOS (Off/Norm)
CMOS (Inv/Off)
11 (0x0B)
12 (0x0C)
13 (0x0D)
14 (0x0E)
CMOS (Norm/Norm)
CMOS (Norm/Inv)
CMOS (Inv/Norm)
CMOS (Inv/Inv)
15 (0x0F)
Set CLKoutX clock format
Output Format
DCLKX_BYP = 0
Output Format
DCLKX_BYP = 1
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
8 (0x08)
9 (0x09)
10 (0x0A)
11 (0x0B)
12 (0x0C)
13 (0x0D)
14 (0x0E)
15 (0x0F)
Powerdown
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
CML 16 mA
CML 24 mA
CML 32 mA
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
LVDS
HSDS 6 mA
HSDS 8 mA
LVPECL 1600 mV
LVPECL 2000 mV
LCPECL
3:0
CLKoutX_FMT
0
Reserved
Reserved
Reserved
CMOS (Off/Norm)(1)
CMOS (Inv/Off)(1)
CMOS (Norm/Norm)(1)
CMOS (Norm/Inv)(1)
CMOS (Inv/Norm)(1)
CMOS (Inv/Inv)(1)
(1) Only valid for CLKout8.
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8.6.2.3 SYSREF, SYNC, and Device Config
8.6.2.3.1 VCO_MUX, OSCout_MUX, OSCout_FMT
表8-28. Register 0x138
BIT
NAME
POR DEFAULT
DESCRIPTION
7
NA
0
Reserved
Selects clock distribution path source from VCO0, VCO1, or CLKIN (external
VCO)
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
VCO Selected
VCO 0
6:5
VCO_MUX
2
0
VCO 1
FIN1 / CLKIN1 (external VCO)
FIN0
Select the source for OSCout:
0: Buffered OSCIN
4
OSCout_MUX
1: Feedback Mux
Selects the output format of OSCout. When powered down, these pins may be
used as CLKIN2.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
8 (0x08)
9 (0x09)
10 (0x0A)
11 (0x0B)
12 (0x0C)
13 (0x0D)
14 (0x0E)
OSCOUT Format
Power down (CLKIN2)
LVDS
Reserved
Reserved
LVPECL 1600 mVpp
LVPECL 2000 mVpp
LVCMOS (Norm / Inv)
LVCMOS (Inv / Norm)
LVCMOS (Norm / Norm)
LVCMOS (Inv / Inv)
LVCMOS (Off / Norm)
LVCMOS (Off / Inv)
LVCMOS (Norm / Off)
LVCMOS (Inv / Off)
LVCMOS (Off / Off)
3:0
OSCout_FMT
4
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8.6.2.3.2 SYSREF_REQ_EN, SYNC_BYPASS, SYSREF_MUX
This register sets the source for the SYSREF outputs. Refer to 图8-3 and SYNC/SYSREF.
表8-29. Register 0x139
BIT
7:6
5
NAME
POR DEFAULT
DESCRIPTION
NA
0
0
Reserved
Reserved
NA
Enables the SYNC/SYSREF_REQ pin to force the SYSREF_MUX = 3 for
continuous pulses. When using this feature enable pulser and set
SYSREF_MUX = 2 (Pulser).
4
SYSREF_REQ_EN
0
Bypass SYNC polarity invert and other circuitry.
0: Normal
1: SYNC signal is bypassed
3
2
SYNC_BYPASS
NA
0
0
Reserved
Selects the SYSREF source.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
SYSREF Source
Normal SYNC
1:0
SYSREF_MUX
0
Re-clocked
SYSREF Pulser
SYSREF Continuous
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8.6.2.3.3 SYSREF_DIV
These registers set the value of the SYSREF output divider.
表8-30. SYSREF_DIV[12:0]
MSB
LSB
0x13A[4:0] = SYSREF_DIV[12:8]
0x13B[7:0] = SYSREF_DIV[7:0]
表8-31. Registers 0x13A and 0x13B
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x13A
7:5
NA
0
Reserved
Divide value for the SYSREF outputs.
Field Value
0 to 7 (0x00 to 0x07)
8 (0x08)
Divide Value
0x13A
0x13B
4:0
7:0
SYSREF_DIV[12:8]
SYSREF_DIV[7:0]
12
0
Reserved
8
9
9 (0x09)
...
...
8190 (0x1FFE)
8191 (0X1FFF)
8190
8191
8.6.2.3.4 SYSREF_DDLY
These registers set the delay of the SYSREF digital delay value.
表8-32. SYSREF Digital Delay Register Configuration, SYSREF_DDLY[12:0]
MSB
LSB
0x13C[4:0] / SYSREF_DDLY[12:8]
0x13D[7:0] / SYSREF_DDLY[7:0]
表8-33. Registers 0X13C and 0X13D
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x13C
7:5
NA
0
Reserved
Sets the value of the SYSREF digital delay.
Field Value
0x00 to 0x07
8 (0x08)
Delay Value
0x13C
0x13D
4:0
7:0
SYSREF_DDLY[12:8]
SYSREF_DDLY[7:0]
0
8
Reserved
8
9
9 (0x09)
...
...
8190 (0x1FFE)
8191 (0X1FFF)
8190
8191
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8.6.2.3.5 SYSREF_PULSE_CNT
This register sets the number of SYSREF pulses if SYSREF is not in continuous mode. See SYSREF_REQ_EN,
SYNC_BYPASS, SYSREF_MUX for further description of SYSREF's outputs.
Programming the register causes the specified number of pulses to be output if "SYSREF Pulses" is selected by
SYSREF_MUX and SYSREF functionality is powered up.
表8-34. Register 0x13E
BIT
NAME
POR DEFAULT
DESCRIPTION
7:2
NA
0
Reserved
Sets the number of SYSREF pulses generated when not in continuous mode.
See SYSREF_REQ_EN, SYNC_BYPASS, SYSREF_MUX for more
information on SYSREF modes.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Number of Pulses
1 pulse
1:0
SYSREF_PULSE_CNT
3
2 pulses
4 pulses
8 pulses
8.6.2.3.6 PLL2_RCLK_MUX, PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
This register controls the feedback feature.
表8-35. Register 0x13F
BIT
7
NAME
PLL2_RCLK_MUX
NA
POR DEFAULT
DESCRIPTION
Selects the source for PLL2 reference.
0
0
0
0: OSCIN
1: Currently selected CLKIN.
6
Reserved
Selects the input to the PLL2 N Divider
0: PLL2 Prescaler
5
PLL2_NCLK_MUX
1: Feedback Mux
Selects the input to the PLL1 N Divider.
0: OSCIN
1: Feedback Mux
4:3
2:1
0
PLL1_NCLK_MUX
0
0
0
2: PLL2 Prescaler
When in 0-delay mode, the feedback mux selects the clock output to be fed
back into the PLL1 N Divider.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Source
CLKOUT6
FB_MUX
CLKOUT8
SYSREF Divider
External
When using 0-delay, FB_MUX_EN must be set to 1 power up the feedback
mux.
0: Feedback mux powered down
1: Feedback mux enabled
FB_MUX_EN
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8.6.2.3.7 PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD,
SYSREF_PLSR_PD
This register contains power-down controls for OSCIN and SYSREF functions.
表8-36. Register 0x140
BIT
NAME
POR DEFAULT
DESCRIPTION
Power down PLL1
0: Normal operation
1: Power down
7
PLL1_PD
1
Power down VCO_LDO
0: Normal operation
1: Power down
6
5
4
VCO_LDO_PD
VCO_PD
1
1
0
Power down VCO
0: Normal operation
1: Power down
Power down the OSCIN port.
0: Normal operation
1: Power down
OSCin_PD
Power down individual SYSREF outputs depending on the setting of
SCLKX_Y_DIS_MODE for each SYSREF output. SYSREF_GBL_PD allows
many SYSREF outputs to be controlled through a single bit.
0: Normal operation
3
2
SYSREF_GBL_PD
SYSREF_PD
0
0
1: Activate Power down Mode
Power down the SYSREF circuitry and divider. If powered down, SYSREF
output mode cannot be used. SYNC cannot be provided either.
0: SYSREF can be used as programmed by individual SYSREF output
registers.
1: Power down
Power down the SYSREF digital delay circuitry.
0: Normal operation, SYSREF digital delay may be used. Must be powered up
during SYNC for deterministic phase relationship with other clocks.
1: Power down
1
0
SYSREF_DDLY_PD
SYSREF_PLSR_PD
0
0
Power down the SYSREF pulse generator.
0: Normal operation
1: Power down
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8.6.2.3.8 DDLYdSYSREF_EN, DDLYdX_EN
This register enables dynamic digital delay for enabled device clocks and SYSREF when DDLYd_STEP_CNT is
programmed.
表8-37. Register 0x141
BIT
NAME
POR DEFAULT
DESCRIPTION
Enables dynamic digital delay on
SYSREF outputs
7
DDLYd _SYSREF_EN
0
Enables dynamic digital delay on
DCLKout12
6
5
4
3
2
1
0
DDLYd12_EN
DDLYd10_EN
DDLYd8_EN
DDLYd6_EN
DDLYd4_EN
DDLYd2_EN
DDLYd0_EN
0
0
0
0
0
0
0
Enables dynamic digital delay on
DCLKout10
Enables dynamic digital delay on
DCLKout8
0: Disabled
1: Enabled
Enables dynamic digital delay on
DCLKout6
Enables dynamic digital delay on
DCLKout4
Enables dynamic digital delay on
DCLKout2
Enables dynamic digital delay on
DCLKout0
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8.6.2.3.9 DDLYd_STEP_CNT
This register sets the number of dynamic digital delay adjustments that will occur. Upon programming, the
dynamic digital delay adjustment begins for each clock output with dynamic digital delay enabled. Dynamic
digital delay can only be started by SPI.
Other registers must be set: SYNC_MODE = 3
表8-38. Register 0x142
BIT
NAME
POR DEFAULT
DESCRIPTION
Sets the number of dynamic digital delay adjustments that will occur.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
...
Dynamic Digital Delay Adjustments
No Adjust
1 step
7:0
DDLYd_STEP_CNT
0
2 steps
3 steps
...
254 (0xFE)
255 (0xFF)
254 steps
255 steps
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8.6.2.3.10 SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD,
SYNC_MODE
This register sets general SYNC parameters such as polarization, and mode. Refer to 图 8-3 for block diagram.
Refer to 表8-2 for using SYNC_MODE for specific SYNC use cases.
表8-39. Register 0x143
BIT
NAME
POR DEFAULT
DESCRIPTION
Except during SYSREF Setup Procedure (see SYNC/SYSREF), this bit should
always be programmed to 0. While this bit is set, extra current is used.
7
SYSREF_CLR
0
SYNC one shot enables edge sensitive SYNC.
0: SYNC is level sensitive and outputs will be held in SYNC as long as SYNC
is asserted.
6
SYNC_1SHOT_EN
0
1: SYNC is edge sensitive, outputs will be SYNCed on rising edge of SYNC.
This results in the clock being held in SYNC for a minimum amount of time.
Sets the polarity of the SYNC pin.
0: Normal
1: Inverted
5
4
SYNC_POL
SYNC_EN
0
0
Enables the SYNC functionality.
0: Disabled
1: Enabled
0: Off
3
2
SYNC_PLL2_DLD
SYNC_PLL1_DLD
0
0
1: Assert SYNC until PLL2 DLD = 1
0: Off
1: Assert SYNC until PLL1 DLD = 1
Sets the method of generating a SYNC event.
Field Value
SYNC Generation
Prevent SYNC Pin, SYNC_PLL1_DLD
flag, or SYNC_PLL2_DLD flag from
generating a SYNC event.
0 (0x00)
SYNC event generated from SYNC
pin or if enabled the
SYNC_PLL1_DLD flag or
SYNC_PLL2_DLD flag.
1 (0x01)
2 (0x02)
1:0
SYNC_MODE
1
For use with pulser - SYNC/SYSREF
pulses are generated by pulser block
via SYNC Pin or if enabled
SYNC_PLL1_DLD flag or
SYNC_PLL2_DLD flag.
For use with pulser - SYNC/SYSREF
pulses are generated by pulser block
when programming register 0x13E
(SYSREF_PULSE_CNT) is written to
(see SYSREF_PULSE_CNT).
3 (0x03)
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8.6.2.3.11 SYNC_DISSYSREF, SYNC_DISX
SYNC_DISX will prevent a clock output from being synchronized or interrupted by a SYNC event or when
outputting SYSREF.
表8-40. Register 0x144
BIT
NAME
POR DEFAULT
DESCRIPTION
Prevent the SYSREF clocks from becoming synchronized during a SYNC
event. If SYNC_DISSYSREF is enabled, the device will continue to operate
normally during a SYNC event.
7
SYNC_DISSYSREF
0
6
5
4
3
2
1
0
SYNC_DIS12
SYNC_DIS10
SYNC_DIS8
SYNC_DIS6
SYNC_DIS4
SYNC_DIS2
SYNC_DIS0
0
0
0
0
0
0
0
Prevent the device clock output from becoming synchronized during a SYNC
event or SYSREF clock. If SYNC_DIS bit for a particular output is enabled,
then the device will continue to operate normally during a SYNC event or
SYSREF clock.
8.6.2.3.12 PLL1R_SYNC_EN, PLL1R_SYNC_SRC, PLL2R_SYNC_EN, FIN0_DIV2_EN, FIN0_INPUT_TYPE
These bits are used when synchronizing PLL1 and PLL2 R dividers.
表8-41. Register 0x145
BIT
NAME
POR DEFAULT
DESCRIPTION
7
NA
0
Reserved
Enable synchronization for PLL1 R divider
0: Not enabled
1: Enabled
6
PLL1R_SYNC_EN
PLL1R_SYNC_SRC
0
0
Select the source for PLL1 R divider synchronization
Field Value
Definition
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Reserved
SYNC Pin
CLKIN0
5:4
Reserved
Enable synchronization for PLL2 R divider. Synchronization for PLL2 R always
comes from the SYNC pin.
0: Not enabled
1: Enabled
3
2
PLL2R_SYNC_EN
FIN0_DIV2_EN
0
0
Sets the input path to use or bypass the divide-by-2.
0: Bypassed (÷1)
1: Divided (÷2)
Program input type to hardware interface used.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Definition
Differential Input
1:0
FIN0_INPUT_TYPE
0
Single Ended Input (FIN0_P)
Single Ended Input (FIN0_N)
Reserved
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8.6.2.4 (0x146 - 0x149) CLKIN Control
8.6.2.4.1 CLKin_SEL_PIN_EN, CLKin_SEL_PIN_POL, CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE,
CLKin1_TYPE, CLKin0_TYPE
This register has CLKin enable and type controls. See Input Clock Switching for more info on how clock input
selection works.
表8-42. Register 0x146
BIT
NAME
POR DEFAULT
DESCRIPTION
7
CLKin_SEL_PIN_EN
0
Enables pin control according to Input Clock Switching.
Inverts the CLKin polarity for use in pin select mode.
6
5
4
3
CLKin_SEL_PIN_POL
CLKin2_EN
0
0
1
1
0: Active High
1: Active Low
Enable CLKin2 to be used during auto-switching.
0: Not enabled for auto mode
1: Enabled for auto clock switching mode
Enable CLKin1 to be used during auto-switching.
0: Not enabled for auto mode
1: Enabled for auto clock switching mode
CLKin1_EN
Enable CLKin0 to be used during auto-switching.
0: Not enabled for auto mode
CLKin0_EN
1: Enabled for auto clock switching mode
2
1
CLKin2_TYPE
CLKin1_TYPE
0
0
There are two buffer types for CLKin0,
1, and 2: bipolar and CMOS. Bipolar is
recommended for differential inputs
like LVDS or LVPECL. CMOS is
recommended for DC-coupled single
ended inputs.
When using bipolar, CLKinX and
CLKinX* must be AC-coupled.
When using CMOS, CLKinX and
CLKinX* may be AC or DC-coupled if
the input signal is differential. If the
input signal is single-ended the used
input may be either AC or DC-coupled
and the unused input must AC
grounded.
0: Bipolar
1: MOS
0
CLKin0_TYPE
0
8.6.2.4.2 CLKin_SEL_AUTO_REVERT_EN, CLKin_SEL_AUTO_EN, CLKin_SEL_MANUAL, CLKin1_DEMUX,
CLKin0_DEMUX
表8-43. Register 0x147
BIT
7
NAME
POR DEFAULT
DESCRIPTION
If the active clock is detected on a higher priority clock while the device is in
auto clock switching mode, the clock input is immediately switched. Highest
priority input is lowest numbered active clock input.
CLKin_SEL_
AUTO_REVERT_EN
0
0
6
CLKin_SEL_AUTO_EN
CLKin_SEL_MANUAL
Enables pin control according to 图8-7.
Selects the clock input when in manual mode according to 图8-7.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Definition
CLKIN0
CLKIN1
CLKIN2
Holdover
5:4
1
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BIT
表8-43. Register 0x147 (continued)
NAME
POR DEFAULT
DESCRIPTION
Selects where the output of the CLKin1 buffer is directed.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
CLKin1 Destination
FIN
3:2
CLKin1_DEMUX
0
Feedback Mux (0-delay mode)
PLL1
Off
Selects where the output of the CLKin0 buffer is directed.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
CLKin0 Destination
SYSREF Mux
Reserved
PLL1
1:0
CLKin0_DEMUX
3
Off
8.6.2.4.3 CLKin_SEL0_MUX, CLKin_SEL0_TYPE
This register has CLKin_SEL0 controls.
表8-44. Register 0x148
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
NA
0
Reserved
This set the output value of the CLKin_SEL0 pin. This register only applies if
CLKin_SEL0_TYPE is set to an output mode
Field Value
Output Format
Logic Low
0 (0x00)
1 (0x01)
CLKin0 LOS
CLKin0 Selected
DAC Locked
DAC Low
2 (0x02)
5:3
CLKin_SEL0_MUX
0
3 (0x03)
4 (0x04)
5 (0x05)
DAC High
6 (0x06)
SPI Readback
Reserved
7 (0x07)
This sets the IO type of the CLKin_SEL0 pin.
Field Value
0 (0x00)
Configuration
Function
Input
Input mode, see Input
Clock Switching - Pin
Select Mode for
description of input
mode.
1 (0x01)
Input with pullup resistor
Input with pulldown
resistor
2 (0x02)
3 (0x03)
4 (0x04)
2:0
CLKin_SEL0_TYPE
2
Output (push-pull)
Output modes; the
CLKin_SEL0_MUX
register for description of
outputs.
Output inverted (push-
pull)
5 (0x05)
6 (0x06)
Reserved
Output (open-drain)
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8.6.2.4.4 SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
This register has CLKin_SEL1 controls and register readback SDIO pin type.
表8-45. Register 0x149
BIT
NAME
POR DEFAULT
DESCRIPTION
7
NA
0
Reserved
Sets the SDIO pin to open drain when during SPI readback in 3 wire mode.
6
SDIO_RDBK_TYPE
1
0: Output, push-pull
1: Output, open drain.
This set the output value of the CLKin_SEL1 pin. This register only applies if
CLKin_SEL1_TYPE is set to an output mode.
Field Value
Output Format
Logic Low
0 (0x00)
1 (0x01)
CLKin1 LOS
CLKin1 Selected
DAC Locked
DAC Low
2 (0x02)
5:3
CLKin_SEL1_MUX
0
3 (0x03)
4 (0x04)
5 (0x05)
DAC High
6 (0x06)
SPI Readback
Reserved
7 (0x07)
This sets the IO type of the CLKin_SEL1 pin.
Field Value
0 (0x00)
Configuration
Function
Input
Input mode, see Input
Clock Switching - Pin
Select Mode for
description of input
mode.
1 (0x01)
Input with pullup resistor
Input with pulldown
resistor
2 (0x02)
3 (0x03)
4 (0x04)
2:0
CLKin_SEL1_TYPE
2
Output (push-pull)
Output modes; see the
CLKin_SEL1_MUX
register for description of
outputs.
Output inverted (push-
pull)
5 (0x05)
6 (0x06)
Reserved
Output (open-drain)
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8.6.2.5 RESET_MUX, RESET_TYPE
This register contains control of the RESET pin.
表8-46. Register 0x14A
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
NA
0
Reserved
This sets the output value of the RESET pin. This register only applies if
RESET_TYPE is set to an output mode.
Field Value
Output Format
Logic Low
0 (0x00)
1 (0x01)
Reserved
5:3
RESET_MUX
0
2 (0x02)
CLKin2 Selected
DAC Locked
DAC Low
3 (0x03)
4 (0x04)
5 (0x05)
DAC High
6 (0x06)
SPI Readback
This sets the IO type of the RESET pin.
Field Value
0 (0x00)
Configuration
Function
Input
1 (0x01)
Input with pullup resistor
Reset Mode
Reset pin high = Reset
Input with pulldown
resistor
2 (0x02)
3 (0x03)
4 (0x04)
2:0
RESET_TYPE
2
Output (push-pull)
Output inverted (push-
pull)
Output modes; see the
RESET_MUX register for
description of outputs.
5 (0x05)
6 (0x06)
Reserved
Output (open-drain)
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8.6.2.6 (0x14B - 0x152) Holdover
8.6.2.6.1 LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
This register contains the holdover functions.
表8-47. Register 0x14B
BIT
NAME
POR DEFAULT
DESCRIPTION
This controls the amount of time in which no activity on a CLKin forces a clock
switch event.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Timeout
5 MHz typical
25 MHz typical
100 MHz typical
200 MHz typical
7:6
LOS_TIMEOUT
0
Enables the LOS (Loss-of-Signal) timeout control. Valid for MOS clock inputs.
5
4
LOS_EN
0
0
0: Disabled
1: Enabled
Enable the DAC to track the PLL1 tuning voltage, optionally for use in holdover
mode. After device reset, tracking starts at DAC code = 512.
Tracking can be used to monitor PLL1 voltage in any mode.
0: Disabled
TRACK_EN
1: Enabled, will only track when PLL1 is locked.
This bit forces holdover mode. When holdover mode is forced, if
MAN_DAC_EN = 1, then the DAC will set the programmed MAN_DAC value.
Otherwise, the tracked DAC value will set the DAC voltage.
0: Disabled
HOLDOVER
_FORCE
3
0
1: Enabled.
This bit enables the manual DAC mode.
2
MAN_DAC_EN
MAN_DAC[9:8]
1
2
0: Automatic
1: Manual
1:0
See MAN_DAC for more information on the MAN_DAC settings.
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8.6.2.6.2 MAN_DAC
These registers set the value of the DAC in holdover mode when used manually.
表8-48. MAN_DAC[9:0]
MSB
LSB
0x14B[1:0]
0x14C[7:0]
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
See LOS_TIMEOUT, LOS_EN, TRACK_EN,
HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8] for
information on these bits.
0x14B
7:2
Sets the value of the manual DAC when in manual DAC
mode.
Field Value
0 (0x00)
DAC Value
0x14B
0x14C
1:0
7:0
MAN_DAC[9:8]
MAN_DAC[7:0]
2
0
0
1
1 (0x01)
2 (0x02)
2
...
...
1022 (0x3FE)
1023 (0x3FF)
1022
1023
8.6.2.6.3 DAC_TRIP_LOW
This register contains the high value at which holdover mode is entered.
表8-49. Register 0x14D
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
NA
0
Reserved
Voltage from GND at which holdover is entered if HOLDOVER_VTUNE_DET
is enabled.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
...
DAC Trip Value
1 x Vcc / 64
2 x Vcc / 64
3 x Vcc / 64
4 x Vcc / 64
...
5:0
DAC_TRIP_LOW
0
61 (0x17)
62 (0x18)
63 (0x19)
62 x Vcc / 64
63 x Vcc / 64
64 x Vcc / 64
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8.6.2.6.4 DAC_CLK_MULT, DAC_TRIP_HIGH
This register contains the multiplier for the DAC clock counter and the low value at which holdover mode is
entered.
表8-50. Register 0x14E
BIT
NAME
POR DEFAULT
DESCRIPTION
This is the multiplier for the DAC_CLK_CNTR which sets the rate at which the
DAC value is tracked.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
DAC Multiplier Value
4
7:6
DAC_CLK_MULT
0
64
1024
16384
Voltage from Vcc at which holdover is entered if HOLDOVER_VTUNE_DET is
enabled.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
...
DAC Trip Value
1 x Vcc / 64
2 x Vcc / 64
3 x Vcc / 64
4 x Vcc / 64
...
5:0
DAC_TRIP_HIGH
0
61 (0x17)
62 (0x18)
63 (0x19)
62 x Vcc / 64
63 x Vcc / 64
64 x Vcc / 64
8.6.2.6.5 DAC_CLK_CNTR
This register contains the value of the DAC when in tracked mode.
表8-51. Register 0x14F
BIT
NAME
POR DEFAULT
DESCRIPTION
This with DAC_CLK_MULT set the rate at which the DAC is updated. The
update rate is = DAC_CLK_MULT * DAC_CLK_CNTR / PLL1 PDF
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
...
DAC Value
0
1
2
7:0
DAC_CLK_CNTR
127
3
...
253 (0xFD)
254 (0xFE)
255 (0xFF)
253
254
255
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8.6.2.6.6 CLKin_OVERRIDE, HOLDOVER_EXIT_MODE, HOLDOVER_PLL1_DET, LOS_EXTERNAL_INPUT,
HOLDOVER_VTUNE_DET, CLKin_SWITCH_CP_TRI, HOLDOVER_EN
This register has controls for enabling clock in switch events.
表8-52. Register 0x150
BIT
NAME
POR DEFAULT
DESCRIPTION
7
NA
0
Reserved
When manual clock select is enabled, then CLKin_SEL_MANUAL = 0/1/2
selects a manual clock input. CLKin_OVERRIDE = 1 will force that clock input.
CLKin_OVERRIDE = 1 is used with clock distribution mode for best
performance.
CLKin
_OVERRIDE
6
0
0: Normal, no override.
1: Force select of only CLKin0/1/2 as specified by CLKin_SEL_MANUAL in
manual mode. Dynamic digital delay will not operate.
0: Exit based on LOS status. If clock is active by LOS, then begin exit.
1: Exit based on PLL1 DLD. When the PLL1 phase detector confirming valid
clock.
HOLDOVER_
EXIT_MODE
5
4
0
0
This enables the HOLDOVER when PLL1 lock detect signal transitions from
high to low.
0: PLL1 DLD does not cause a clock switch event
1: PLL1 DLD causes a clock switch event
HOLDOVER
_PLL1_DET
Use external signals for LOS status instead of internal LOS circuitry.
CLKin_SEL0 pin is used for CLKin0 LOS, CLKin_SEL1 pin is used for CLKin1
LOS, and Status_LD1 is used for CLKin2 LOS. For any of these pins to be
valid, the corresponding _TYPE register must be programmed as an input.
0: Disabled
3
2
LOS_EXTERNAL_INPUT
0
0
1: Enabled
Enables the DAC Vtune rail detector. When the DAC achieves a specified
Vtune, if this bit is enabled, the current clock input is considered invalid and an
input clock switch event is generated.
0: Disabled
HOLDOVER_
VTUNE_DET
1: Enabled
Enable clock switching with tri-stated charge pump.
0: Not enabled.
1: PLL1 charge pump tri-states during clock switching.
1
0
CLKin_SWITCH_CP_TRI
HOLDOVER_EN
0
0
Sets whether holdover mode is active or not.
0: Disabled
1: Enabled
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8.6.2.6.7 HOLDOVER_DLD_CNT
表8-53. HOLDOVER_DLD_CNT[13:0]
MSB
LSB
0x151[5:0] / HOLDOVER_DLD_CNT[13:8]
0x152[7:0] / HOLDOVER_DLD_CNT[7:0]
This register has the number of valid clocks of PLL1 PDF before holdover is exited.
表8-54. Registers 0x151 and 0x152
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x151
7:6
NA
0
Reserved
The number of valid clocks of PLL1 PDF before holdover
mode is exited.
HOLDOVER
_DLD_CNT[13:8]
Field Value
0 (0x00)
Count Value
0x151
0x152
5:0
7:0
2
0
0
1
1 (0x01)
2 (0x02)
2
...
...
HOLDOVER
_DLD_CNT[7:0]
16382 (0x3FFE)
16383 (0x3FFF)
16382
16383
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8.6.2.7 (0x153 - 0x15F) PLL1 Configuration
8.6.2.7.1 CLKin0_R
表8-55. CLKin0_R[13:0]
MSB
LSB
0x153[5:0] / CLKin0_R[13:8]
0x154[7:0] / CLKin0_R[7:0]
These registers contain the value of the CLKin0 divider.
表8-56. Registers 0x153 and 0x154
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x153
7:6
NA
0
Reserved
The value of PLL1 N counter when CLKin0 is selected.
Field Value
0 (0x00)
Divide Value
0x153
0x154
5:0
7:0
CLKin0_R[13:8]
CLKin0_R[7:0]
0
Reserved
1 (0x01)
1
2
2 (0x02)
...
...
120
16382 (0x3FFE)
16383 (0x3FFF)
16382
16383
8.6.2.7.2 CLKin1_R
MSB
表8-57. CLKin1_R[13:0]
LSB
0x155[5:0] / CLKin1_R[13:8]
0x156[7:0] / CLKin1_R[7:0]
These registers contain the value of the CLKin1 R divider.
表8-58. Registers 0x155 and 0x156
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x155
7:6
NA
0
Reserved
The value of PLL1 R counter when CLKin1 is selected.
Field Value
0 (0x00)
Divide Value
0x155
0x156
5:0
7:0
CLKin1_R[13:8]
CLKin1_R[7:0]
0
Reserved
1 (0x01)
1
2
2 (0x02)
...
...
150
16382 (0x3FFE)
16383 (0x3FFF)
16382
16383
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8.6.2.7.3 CLKin2_R
表8-59. CLKin2_R[13:0]
MSB
LSB
0x157[5:0] / CLKin2_R[13:8]
0x158[7:0] / CLKin2_R[7:0]
表8-60. Registers 0x157 and 0x158
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x157
7:6
NA
0
Reserved
The value of PLL1 R counter when CLKin2 is selected.
Field Value
0 (0x00)
Divide Value
0x157
0x158
5:0
7:0
CLKin2_R[13:8]
CLKin2_R[7:0]
0
Reserved
1 (0x01)
1
2
2 (0x02)
...
...
150
16382 (0x3FFE)
16383 (0x3FFF)
16382
16383
8.6.2.7.4 PLL1_N
表8-61. PLL1_N[13:0]
MSB
LSB
0x159[5:0] / PLL1_N[13:8]
0x15A[7:0] / PLL1_N[7:0]
These registers contain the N divider value for PLL1.
表8-62. Registers 0x159 and 0x15A
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x159
7:6
NA
0
Reserved
The value of PLL1 N counter.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
...
Divide Value
0x159
0x15A
5:0
7:0
PLL1_N[13:8]
PLL1_N[7:0]
0
Not Valid
1
2
120
...
4,095 (0xFFF)
4,095
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8.6.2.7.5 PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
This register controls the PLL1 phase detector.
表8-63. Register 0x15B
BIT
NAME
POR DEFAULT
DESCRIPTION
PLL1_WND_SIZE sets the window size used for digital lock detect for PLL1. If
the phase error between the reference and feedback of PLL1 is less than
specified time, then the PLL1 lock counter increments.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Definition
4 ns
7:6
PLL1_WND_SIZE
3
9 ns
19 ns
43 ns
This bit allows for the PLL1 charge pump output pin, CPout1, to be placed into
TRI-STATE.
0: PLL1 CPout1 is active
1: PLL1 CPout1 is at TRI-STATE
5
4
PLL1_CP_TRI
PLL1_CP_POL
0
1
PLL1_CP_POL sets the charge pump polarity for PLL1. Many VCXOs use
positive slope.
A positive slope VCXO increases output frequency with increasing voltage. A
negative slope VCXO decreases output frequency with increasing voltage.
0: Negative Slope VCO/VCXO
1: Positive Slope VCO/VCXO
This bit programs the PLL1 charge pump output current level.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
4 (0x04)
...
Gain
50 µA
150 µA
250 µA
350 µA
450 µA
...
3:0
PLL1_CP_GAIN
4
14 (0x0E)
15 (0x0F)
1450 µA
1550 µA
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8.6.2.7.6 PLL1_DLD_CNT
表8-64. PLL1_DLD_CNT[13:0]
MSB
LSB
0x15C[5:0] / PLL1_DLD_CNT[13:8]
0x15D[7:0] / PLL1_DLD_CNT[7:0]
This register contains the value of the PLL1 DLD counter.
表8-65. Registers 0x15C and 0x15D
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x15C
7:6
NA
0
Reserved
The reference and feedback of PLL1 must be within the
window of phase error as specified by PLL1_WND_SIZE for
this many phase detector cycles before PLL1 digital lock
detect is asserted.
PLL1_DLD
_CNT[13:8]
0x15C
0x15D
5:0
7:0
32
Field Value
0 (0x00)
Delay Value
Reserved
1 (0x01)
1
2 (0x02)
2
3
3 (0x03)
PLL1_DLD
_CNT[7:0]
0
...
...
16,382 (0x3FFE)
16,383 (0x3FFF)
16,382
16,383
8.6.2.7.7 HOLDOVER_EXIT_NADJ
表8-66. Register 0x15E
BIT
NAME
POR DEFAULT
DESCRIPTION
7:5
NA
0
Reserved
When holdover exists, PLL1 R counter and PLL1 N
counter are reset. HOLDOVER_EXIT_NADJ is a 2s
complement number which provides a relative timing
offset between PLL1 R and PLL1 N divider.
4:0
HOLDOVER_EXIT_NADJ
30
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8.6.2.7.8 PLL1_LD_MUX, PLL1_LD_TYPE
This register configures the PLL1 LD pin.
表8-67. Register 0x15F
BIT
NAME
POR DEFAULT
DESCRIPTION
This sets the output value of the Status_LD1 pin.
Field Value
0 (0x00)
MUX Value
Logic Low
1 (0x01)
PLL1 DLD
2 (0x02)
PLL2 DLD
3 (0x03)
PLL1 & PLL2 DLD
Holdover Status
DAC Locked
Reserved
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
SPI Readback
DAC Rail
7:3
PLL1_LD_MUX
1
8 (0x08)
9 (0x09)
DAC Low
10 (0x0A)
DAC High
11 (0x0B)
PLL1_N /2
12 (0x0C)
PLL1_N / 4
PLL2_N / 2
PLL2_N / 4
PLL1_R / 2
PLL1_R / 4
PLL2_R(1) / 2
PLL2_R / 4(1)
13 (0x0D)
14 (0x0E)
15 (0x0F)
16 (0x10)
17 (0x11)
18 (0x12)
Sets the IO type of the Status_LD1 pin.
Field Value
TYPE
0 (0x00)
1 (0x01)
Input for External CLKin2 LOS
Input for External CLKin2 LOS (pullup)
Input for External CLKin2 LOS
(pulldown)
2:0
PLL1_LD_TYPE
6
2 (0x02)
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
Output (push-pull)
Output inverted (push-pull)
Reserved
Output (open-drain)
(1) Only valid when PLL2_LD_MUX is not set to 2 (PLL2_DLD) or 3 (PLL1 & PLL2 DLD).
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8.6.2.8 (0x160 - 0x16E) PLL2 Configuration
8.6.2.8.1 PLL2_R
表8-68. PLL2_R[11:0]
MSB
LSB
0x160[3:0] / PLL2_R[11:8]
0x161[7:0] / PLL2_R[7:0]
This register contains the value of the PLL2 R divider.
表8-69. Registers 0x160 and 0x161
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x160
7:4
NA
0
Reserved
Valid values for the PLL2 R divider.
Field Value
0 (0x00)
Divide Value
0x160
0x161
3:0
7:0
PLL2_R[11:8]
PLL2_R[7:0]
0
2
Not Valid
1 (0x01)
1
2
2 (0x02)
3 (0x03)
3
...
...
4,094 (0xFFE)
4,095 (0xFFF)
4,094
4,095
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8.6.2.8.2 PLL2_P, OSCin_FREQ, PLL2_REF_2X_EN
This register sets other PLL2 functions.
表8-70. Register 0x162
BIT
NAME
POR DEFAULT
DESCRIPTION
The PLL2 N Prescaler divides the output of the VCO as selected by
Mode_MUX1 and is connected to the PLL2 N divider.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
Value
8
2
2
3
4
5
6
7
7:5
PLL2_P
2
The frequency of the PLL2 reference input to the PLL2 Phase Detector
(OSCIN_P/OSCIN_N pins) must be programmed to support proper operation
of the frequency calibration routine which locks the internal VCO to the target
frequency.
Field Value
0 (0x00)
OSCIN Frequency
0 to 63 MHz
4:2
OSCin_FREQ
3
1 (0x01)
>63 MHz to 127 MHz
>127 MHz to 255 MHz
Reserved
2 (0x02)
3 (0x03)
4 (0x04)
>255 MHz to 500 MHz
Reserved
5 (0x05) to 7(0x07)
1
0
NA
0
1
Reserved
Enabling the PLL2 reference frequency doubler allows for higher phase
detector frequencies on PLL2 than would normally be allowed with the given
VCXO frequency.
Higher phase detector frequencies reduces the PLL2 N values which makes
the design of wider loop bandwidth filters possible.
0: Doubler Disabled
PLL2_REF_2X_EN
1: Doubler Enabled
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8.6.2.8.3 PLL2_N_CAL
PLL2_N_CAL[17:0]
PLL2 never uses 0-delay during frequency calibration. These registers contain the value of the PLL2 N divider
used with PLL2 pre-scaler during calibration for cascaded 0-delay mode. Once calibration is complete, PLL2 will
use the PLL2_N value. Cascaded 0-delay mode occurs when PLL2_NCLK_MUX = 1.
表8-71. PLL2_N_CAL[17:0]
—
MSB
LSB
0x163[1:0] / PLL2_N_CAL[17:16]
0x164[7:0] / PLL2_N_CAL[15:8]
0x165[7:0] / PLL2_N_CAL[7:0]
表8-72. Registers 0x163, 0x164, and 0x165
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x163
7:2
NA
0
Reserved
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
...
Divide Value
0x163
0x164
0x165
1:0
7:0
7:0
PLL2_N _CAL[17:16]
PLL2_N_CAL[15:8]
PLL2_N_CAL[7:0]
0
Not Valid
1
2
0
...
12
262,143 (0x3FFFF)
262,143
8.6.2.8.4 PLL2_N
This register disables frequency calibration and sets the PLL2 N divider value. Programming register 0x168
starts a VCO calibration routine if PLL2_FCAL_DIS = 0.
表8-73. PLL2_N[17:0]
—
MSB
LSB
0x166[1:0] / PLL2_N[17:16]
0x167[7:0] / PLL2_N[15:8]
0x168[7:0] / PLL2_N[7:0]
表8-74. Registers 0x166, 0x167, and 0x168
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x166
0x166
7:3
NA
0
0
Reserved
Setting this to 1 disables PLL2 frequency calibration on
programming of register 0x168
2
PLL2_FCAL_DIS
Field Value
0 (0x00)
Divide Value
0x166
0x167
0x168
1:0
PLL2_N[17:16]
PLL2_N[15:8]
PLL2_N[7:0]
0
0
Not Valid
1 (0x01)
1
7:0
7:0
2 (0x02)
2
...
...
12
262,143 (0x3FFFF)
262,143
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8.6.2.8.5 PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
This register controls the PLL2 phase detector.
表8-75. Register 0x169
BIT
NAME
POR DEFAULT
DESCRIPTION
7
NA
0
Reserved
PLL2_WND_SIZE sets the window size used for digital lock detect for PLL2. If
the phase error between the reference and feedback of PLL2 is less than
specified time, then the PLL2 lock counter increments.
Maximum Phase Detector
Field Value
Frequency / Window Size
6:5
PLL2_WND_SIZE
2
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Reserved
320 MHz / 1 ns
240 MHz / 1.8 ns
160 MHz / 2.6 ns
This bit programs the PLL2 charge pump output current level. The table below
also shows the impact of the PLL2 TRISTATE bit in conjunction with
PLL2_CP_GAIN.
Field Value
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
Definition
Reserved
Reserved
1600 µA
4:3
PLL2_CP_GAIN
3
3200 µA
PLL2_CP_POL sets the charge pump polarity for PLL2. The internal VCO
requires the negative charge pump polarity to be selected. Many VCOs use
positive slope.
A positive slope VCO increases output frequency with increasing voltage. A
negative slope VCO decreases output frequency with increasing voltage.
2
PLL2_CP_POL
0
Field Value
Description
0
1
Negative Slope VCO/VCXO
Positive Slope VCO/VCXO
PLL2_CP_TRI TRI-STATEs the output of the PLL2 charge pump.
1
0
PLL2_CP_TRI
PLL2_DLD_EN
0
0
0: Disabled
1: TRI-STATE
PLL2 DLD circuitry is enabled when the PLL2 DLD is used to provide an output
to a lock detect status pin. PLL2_DLD_EN allows enabling the PLL2 DLD
circuitry without needing to provide PLL2 DLD to a status pin. This enables
PLL2 DLD status to be read back using SPI while allowing the Status pins to
be used for other purposes.
0: PLL2 DLD circuitry is on only of PLL2 DLD or PLL1 + PLL2 DLD signal is
output from a Status_LD_MUX.
1: PLL2 DLD circuitry is forced on.
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8.6.2.8.6 PLL2_DLD_CNT
表8-76. PLL2_DLD_CNT[13:0]
MSB
LSB
0x16A[5:0] / PLL2_DLD_CNT[13:8]
0x16B[7:0] / PLL2_DLD_CNT[7:0]
This register has the value of the PLL2 DLD counter.
表8-77. Registers 0x16A and 0x16B
REGISTER
BIT
NAME
POR DEFAULT
DESCRIPTION
0x16A
7
NA
0
Reserved
The reference and feedback of PLL2 must be within the
window of phase error as specified by PLL2_WND_SIZE for
PLL2_DLD_CNT cycles before PLL2 digital lock detect is
asserted.
PLL2_DLD
_CNT[13:8]
0x16A
0x16B
5:0
7:0
32
Field Value
0 (0x00)
Divide Value
Not Valid
1 (0x01)
1
2 (0x02)
2
3
3 (0x03)
PLL2_DLD_CNT
0
...
...
16,382 (0x3FFE)
16,383 (0x3FFF)
16,382
16,383
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8.6.2.8.7 PLL2_LD_MUX, PLL2_LD_TYPE
This register sets the output value of the Status_LD2 pin.
表8-78. Register 0x16E
BIT
NAME
POR DEFAULT
DESCRIPTION
This sets the output value of the Status_LD2 pin.
Field Value
0 (0x00)
MUX Value
Logic Low
1 (0x01)
PLL1 DLD
2 (0x02)
PLL2 DLD
3 (0x03)
PLL1 & PLL2 DLD
Holdover Status
DAC Locked
Reserved
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
SPI Readback
DAC Rail
7:3
PLL2_LD_MUX
0
8 (0x08)
9 (0x09)
DAC Low
10 (0x0A)
11 (0x0B)
DAC High
PLL1_N / 2
PLL1_N / 4
PLL2_N / 2
PLL2_N / 4
PLL1_R / 2
PLL1_R / 4
PLL2_R / 2(1)
PLL2_R / 4(1)
12 (0x0C)
13 (0x0D)
14 (0x0E)
15 (0x0F)
16 (0x10)
17 (0x11)
18 (0x12)
Sets the IO type of the Status_LD2 pin.
Field Value
0 (0x00)
TYPE
Reserved
1 (0x01)
Reserved
2:0
PLL2_LD_TYPE
6
2 (0x02)
Reserved
3 (0x03)
Output (push-pull)
4 (0x04)
5 (0x05)
6 (0x06)
Output inverted (push-pull)
Reserved
Output (open drain)
(1) Only valid when PLL1_LD_MUX is not set to 2 (PLL2_DLD) or 3 (PLL1 & PLL2 DLD).
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8.6.2.9 (0x16F - 0x555) Misc Registers
8.6.2.9.1 PLL2_PRE_PD, PLL2_PD, FIN0_PD
表8-79. Register 0x173
BIT
NAME
POR DEFAULT
DESCRIPTION
7
N/A
0
Reserved
Powerdown PLL2 prescaler
0: Normal Operation
1: Powerdown
6
5
PLL2_PRE_PD
PLL2_PD
1
1
Powerdown PLL2
0: Normal Operation
1: Powerdown
Powerdown FIN0
0: Normal Operation
1: Powerdown
4
FIN0_PD
N/A
1
0
3:0
Reserved
8.6.2.9.2 PLL1R_RST
Refer to PLL1 R Divider Synchronization for more information on synchronizing PLL1 R divider.
表8-80. Register 0x177
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
NA
0
Reserved
When set, PLL1 R divider will be held in reset. PLL1 will never lock with
PLL1R_RST = 1. This bit is used in when synchronizing the PLL1 R divider.
0: PLL1 R divider normal operation.
5
PLL1R_RST
NA
0
0
1: PLL1 R divider held in reset.
4:0
Reserved
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8.6.2.9.3 CLR_PLL1_LD_LOST, CLR_PLL2_LD_LOST
表8-81. Register 0x182
BIT
NAME
POR DEFAULT
DESCRIPTION
7:2
NA
0
Reserved
To reset RB_PLL1_LD_LOST, write CLR_PLL1_LD_LOST with 1 and then 0.
0: RB_PLL1_LD_LOST will be set on next falling PLL1 DLD edge.
1: RB_PLL1_LD_LOST is held clear (0). User must clear this bit to allow
RB_PLL1_LD_LOST to become set again.
1
0
CLR_PLL1_LD_LOST
CLR_PLL2_LD_LOST
0
0
To reset RB_PLL2_LD_LOST, write CLR_PLL2_LD_LOST with 1 and then 0.
0: RB_PLL2_LD_LOST will be set on next falling PLL2 DLD edge.
1: RB_PLL2_LD_LOST is held clear (0). User must clear this bit to allow
RB_PLL2_LD_LOST to become set again.
8.6.2.9.4 RB_PLL1_LD_LOST, RB_PLL1_LD, RB_PLL2_LD_LOST, RB_PLL2_LD
For PLL2 DLD read back to be valid, either PLL2 DLD or PLL1 + PLL2 DLD signal must be output from the
status pins, or PLL2_DLD_EN bit must be set = 1.
表8-82. Register 0x183
BIT
NAME
POR DEFAULT
DESCRIPTION
7:4
N/A
0
Reserved
This is set when PLL1 DLD edge falls. Does not set if cleared while PLL1 DLD
is low.
3
2
1
RB_PLL1_LD_LOST
RB_PLL1_LD
0
0
0
Read back 0: PLL1 DLD is low.
Read back 1: PLL1 DLD is high.
This is set when PLL2 DLD edge falls. Does not set if cleared while PLL2 DLD
is low.
RB_PLL2_LD_LOST
PLL1_LD_MUX or PLL2_LD_MUX must select setting 2 (PLL2 DLD) for valid
reading of this bit.
Read back 0: PLL2 DLD is low.
0
RB_PLL2_LD
0
Read back 1: PLL2 DLD is high.
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8.6.2.9.5 RB_DAC_VALUE (MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
This register provides read back access to CLKinX selection indicator and CLKinX LOS indicator. The 2 MSBs
are shared with the RB_DAC_VALUE. See the RB_DAC_VALUE section for more information.
表8-83. Register 0x184
BIT
NAME
POR DEFAULT
DESCRIPTION
7:6
RB_DAC_VALUE[9:8]
See the RB_DAC_VALUE section.
Read back 0: CLKin2 is not selected for input to PLL1.
Read back 1: CLKin2 is selected for input to PLL1.
5
4
RB_CLKin2_SEL
RB_CLKin1_SEL
Read back 0: CLKin1 is not selected for input to PLL1.
Read back 1: CLKin1 is selected for input to PLL1.
Read back 0: CLKin0 is not selected for input to PLL1.
Read back 1: CLKin0 is selected for input to PLL1.
3
2
1
RB_CLKin0_SEL
N/A
Read back 1: CLKin1 LOS is active.
Read back 0: CLKin1 LOS is not active.
RB_CLKin1_LOS
Read back 1: CLKin0 LOS is active.
Read back 0: CLKin0 LOS is not active.
0
RB_CLKin0_LOS
8.6.2.9.6 RB_DAC_VALUE
Contains the value of the DAC for user readback.
表8-84. RB_DAC_VALUE[9:0]
MSB
LSB
0x184 [7:6] / RB_DAC_VALUE[9:8]
0x185 [7:0] / RB_DAC_VALUE[7:0]
表8-85. Registers 0x184 and 0x185
REGISTER
BIT
NAME
POR DEFAULT
RB_DAC_
VALUE[9:8]
0x184
7:6
2
DAC value is 512 on power on reset, if PLL1 locks upon
power-up the DAC value will change.
RB_DAC_
VALUE[7:0]
0x185
7:0
0
8.6.2.9.7 RB_HOLDOVER
表8-86. Register 0x188
BIT
NAME
POR DEFAULT
DESCRIPTION
7:5
N/A
Reserved
Read back 0: Not in HOLDOVER.
Read back 1: In HOLDOVER.
4
RB_HOLDOVER
N/A
3:0
Reserved
8.6.2.9.8 SPI_LOCK
Prevents SPI registers from being written to, except for 0x555.
This register cannot be read back.
表8-87. Register 0x555
BIT
NAME
POR DEFAULT
DESCRIPTION
0: Registers unlocked.
1 to 255: Registers locked.
7:0
SPI_LOCK
0
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9 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
Texas Instruments provides the TICSPRO software to assist with device setup, frequency divider calculations,
and general device programming as well as the PLLatinum™ simulation software for loop filter design and phase
noise/jitter simulation on ti.com.
9.1.1 Treatment of Unused Pins
Not all pins are needed for every application. In general, power down the unused feature in software. The
unused pin may be left floating or grounded through a 1-kΩ resistor.
表9-1. Treatment of Unused Pins
PINS
TREATMENT IF UNUSED
1 kΩto GND or float pin
1 kΩto GND or float pin
1 kΩto GND or float pin
1 kΩto GND or float pin
1 kΩto GND or float pin
1 kΩto GND or float pin
1 kΩto GND or float pin
1 kΩto GND or float pin
CLKOUTx_P/CLKOUTx_N
RESET/GPO
SYNC/SYSREF_REQ
FIN0_P/FIN0_N
STATUS_LD1,STATUS_LD2
CPOUT1,CPOUT2
OSCOUT_P/CLKIN2_P
OSCOUT_N/CLKIN2_N
9.1.2 Frequency Planning and Spur Minimization
Frequency planning refers to strategically assigning frequencies to outputs for the purposes of spur minimization.
Spurs vary as a function of output frequency, output format, and output assignments. Spurs can be directly
coupling from one output to the next or be caused by a mixing product. For instance, if one output is at 3 GHz
and another output is at 750 MHz, one can see a 750 MHz-spur coupling through the 3-GHz output. In some
situations, it is also possible to have a spur that occurs at the greatest common divisor of the two frequencies
(250 MHz in this case). In either case, the choice of which outputs the 3-GHz and 750-MHz frequencies are
assigned to can have an impact on spurs.
表9-2. Factors Impacting Spurs
Factor
General Guidelines and Tips
Output Frequency
To a point, higher frequencies tend to couple stronger to other outputs, but bypassing impacts this.
Stronger signals and single-ended signals tend to couple stronger to other outputs. LVDS tends to couple
less than LVPECL as well. For LVCMOS, consider using both sides of the output with one side inverted to
the other (Norm/Inv) to minimize crosstalk.
Output Format
Outputs that are physically closer and that share the same power supply tend to have stronger crosstalk.
Outputs are grouped by supply in the following manner: Clock Group 0: (CLK0,CLK1,CLK12,CLK13),
Clock Group 1: (CLK2, CLK3), Clock Group 2 (CLK4, CLK5, CLK6, CLK7), Clock Group 3 (CLK8, CLK9,
CLK10, CLK11). Use frequency planning to minimize spur levels to the most critical outputs.
Frequency Assignment to
Output
(Frequency Planning)
Frequency planning involves trial and error, but there is some strategy in planning. Try to ensure that the same
frequencies are placed on outputs that have the strongest crosstalk and that different frequencies are placed on
outputs that have weaker crosstalk
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表9-3. Crosstalk Matrix
CLK0,CLK1
n/a
CLK2,CLK3
M
CLK4,CLK5
CLK6,CLK7
CLK8,CLK9
L
CLK10,CLK11
M
CLK12,CLK13
CLK0,
CLK1
L
M
n/a
H
L
H
CLK2,
CLK3
M
L
n/a
M
L
L
H
L
L
M
M
M
M
CLK4,
CLK5
CLK6,
CLK7
L
n/a
L
L
M
M
CLK8,
CLK9
L
L
L
n/a
H
H
M
CLK10,
CLK11
M
H
M
M
M
M
M
M
n/a
H
H
CLK12,
CLK13
M
n/a
L = Low Crosstalk, M = Medium Crosstalk, H = High Crosstalk
9.1.3 Digital Lock Detect Frequency Accuracy
The digital lock detect circuit is used to determine PLL1 locked, PLL2 locked, and holdover exit events. A
window size and lock count register are programmed to set a ppm frequency accuracy of reference to feedback
signals of the PLL for each event to occur. When a PLL digital lock event occurs, the digital lock detect of the
PLL is asserted true. When the holdover exit event occurs, the device will exit holdover mode when
HOLDOVER_EXIT_MODE = 1 (Exit based on DLD).
表9-4. Digital Lock Detect Related Fields
EVENT
PLL
PLL1
WINDOW SIZE
LOCK COUNT
PLL1 Locked
PLL2 Locked
Holdover exit
PLL1_WND_SIZE
PLL2_WND_SIZE
PLL1_WND_SIZE
PLL1_DLD_CNT
PLL2_DLD_CNT
PLL2
PLL1
HOLDOVER_DLD_CNT
For a digital lock detect event to occur, there must be a lock count number of phase detector cycles of PLLX
during which the time and phase error of the PLLX_R reference and PLLX_N feedback signal edges are within
the user programmable window size. There must be at least one lock count phase detector event before a lock
event occurs, therefore a minimum digital lock event time can be calculated as lock count / fPDX where X = 1 for
PLL1 or 2 for PLL2.
By using 方程式 4, values for a lock count and window size can be chosen to set the frequency accuracy
required by the system in ppm before the digital lock detect event occurs:
1e6 × PLLX_WND_SIZE × fPDX
ppm =
PLLX_DLD_CNT
(4)
The effect of the lock count value is that it shortens the effective lock window size by dividing the window size by
lock count.
If at any time the PLLX_R reference and PLLX_N feedback signals are outside the time window set by window
size, then the lock count value is reset to 0.
9.1.3.1 Minimum Lock Time Calculation Example
To calculate the minimum PLL2 digital lock time given a PLL2 phase detector frequency of 40 MHz and
PLL2_DLD_CNT = 10,000. Then, the minimum lock time of PLL2 will be 10,000 / 40 MHz = 250 µs.
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9.1.4 Driving CLKIN AND OSCIN Inputs
9.1.4.1 Driving CLKIN and OSCIN PINS With a Differential Source
CLKin and OSCin pins can be driven by differential signals. TI recommends setting the input mode to bipolar
(CLKinX_BUF_TYPE = 0) when using differential reference clocks. The device internally biases the input pins so
the differential interface should be AC-coupled. The recommended circuits for driving the CLKin pins with either
LVDS or LVPECL are shown in 图9-1 and 图9-2.
CLKINx_P
0.1 µF
LVDS
Output
100 Trace
(Di eren al)
Input
CLKINx_N
0.1 µF
图9-1. CLKINx_P/CLKINx_N or OSCIN Termination for an LVDS Reference Clock Source
CLKINx_P
0.1 µF
LVPECL
Output
100 Trace
(Di eren al)
Input
CLKINx_N
0.1 µF
图9-2. CLKINx_P/CLKINx_N or OSCIN Termination for an LVPECL Reference Clock Source
Finally, a reference clock source that produces a differential sine wave output can drive the CLKIN pins using the
following circuit. Note: the signal level must conform to the requirements for the CLKIN pins listed in the
Electrical Characteristics table.
CLKINx_P
0.1 µF
100 Trace
(Di eren al)
Input
CLKINx_N
Di eren al
Sinewave Clock
0.1 µ F
图9-3. CLKINx_P/CLKINx_N or OSCIN Termination for a Differential Sinewave Reference Clock Source
9.1.4.2 Driving CLKIN Pins With a Single-Ended Source
The CLKIN and OSCIN pins can be driven using a single-ended reference clock source, for example, either a
sine wave source or an LVCMOS/LVTTL source. CLKIN supports both AC coupling or DC coupling. OSCin must
use AC coupling. In the case of the sine wave source that is expecting a 50-Ω load, TI recommends using AC
coupling as shown in 图9-4 with a 50-Ωtermination.
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备注
The signal level must conform to the requirements for the CLKin or OSCin pins listed in the Electrical
Characteristics table.
To support LOS functionality, CLKinX_BUF_TYPE must be set to MOS mode (CLKinX_BUF_TYPE =
1) when AC-coupled. When AC coupling, if the 100-Ω termination is placed on the IC side of the
blocking capacitors, then the LOS functionality will not be valid.
CLKINx_P
50
0.1 µF
Input
Clock Source
CLKINx_N
0.1 µ F
图9-4. CLKINx_P/CLKINx_N Single-Ended Termination
If the CLKin pins are being driven with a single-ended LVCMOS/LVTTL source, either DC coupling or AC
coupling may be used. If DC coupling is used, the CLKinX_BUF_TYPE should be set to MOS buffer mode
(CLKinX_BUF_TYPE = 1) and the voltage swing of the source must meet the specifications for DC-coupled,
MOS-mode clock inputs given in the Electrical Characteristics table. If AC coupling is used, the
CLKinX_BUF_TYPE should be set to the bipolar buffer mode (CLKinX_BUF_TYPE = 0). The voltage swing at
the input pins must meet the specifications for AC-coupled, bipolar mode clock inputs given in the Electrical
Characteristics table. In this case, some attenuation of the clock input level may be required. A simple resistive
divider circuit before the AC-coupling capacitor is sufficient.
CLKINx_P
50
0.1 µF
Input
LVCMOS/LVTTL
Clock Source
CLKINx_N
0.1 µF
图9-5. DC-Coupled LVCMOS/LVTTL Reference Clock
9.1.5 OSCin Doubler for Best Phase Noise Performance
PLL2 OSCin input path includes an on-chip Frequency Doubler. To have the best phase noise performance, TI
recommends to maximize the PLL2 phase detector frequency. For example, using 122.88-MHz VCXO, PLL2
phase detector frequency can be increased to 245.76 MHz by setting PLL2_REF_2X_EN. Doubler path is a high
performance path for OSCin clock. For configuration where doubler cannot be used, TI recommends to use
Doubler and PLL2_RDIV = 2. To have deterministic phase relationship between input clock and output clocks, 0-
delay modes should be used (nested 0-delay mode for dual loop configuration instead of cascaded 0-delay
mode).
9.1.6 Radiation Environments
9.1.6.1 Total Ionizing Dose
Radiation Hardness assured (RHA) products are those part numbers with a total ionizing dose (TID) level
specified in the ordering information. Testing and qualification of these product is done according to MIL-
STD-883, test method 1019.
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9.1.6.2 Single Event Effect
One-time single event effect (SEE), including single event latch-up (SEL) and single event functional interrupt
(SEFI) testing was performed according to EIA/JEDEC Standard, EIA/JEDEC57. A test report is available upon
request.
9.2 Typical Application
This design example highlights the available tools used to design loop filters and create a programming map.
CLKOUT10
VCXO
Mul ple “clean” clocks
at di erent and much
higher frequencies
LMX2615-SP
Recovered
CLKOUT11
PLL+VCO
“dirty” clock
or clean clock
CLKIN0
OSCOUT
CLKOUT8
CLKOUT9
FPGA
Backup
Reference
Clock
LMK04832-SEP
CLKIN1
CLKOUT4 &
CLKOUT6
CLKOUT5 &
CLKOUT7
CLKOUT0 &
CLKOUT2
CLKOUT12,
CLKOUT13
DAC
ADC12DJ3200
QML-SP
CLKOUT1 &
CLKOUT3
Serializer/
Deserializer
图9-6. Typical Application
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9.2.1 Design Requirements
Clocks outputs:
• 1x 122.88 MHz LVCMOS
• 1x 122.88 MHz HSDS
• 1x 245.76 MHz LVPECL
• 1x 983.04 MHz LVDS
• 1x 2949.12 MHz CML
For best performance, the highest possible phase detector frequency is used at PLL2. As such, a 122.88-MHz
VCXO is used. Assume that the 2949.12-MHz CML clock is the most performance critical one.
9.2.2 Detailed Design Procedure
TI has the TICSPRO and PLLatinum™ simulation tools that can be used to determine register values and design
the loop filter. CML and LVPECL output formats have the best noise floor, but consume more current, therefore it
is best to use these formats when noise floor matters. As for frequency planning, CLKOUT4 has the most critical
output, and this output has a strong interaction with the CLKOUT6. To avoid a strong interaction, the CLKOUT6
was not used in this example and a spur was added to the CLKOUT4. The 122.88-MHz HSDS clock could
potentially generate a lot of spurs and mixing products, so this HSDS clock was placed on the CLKOUT8 that
has the weakest interaction with the other channels.
9.2.2.1 Device Selection
Enter the required frequencies into the tools. In this design, VCO0 and VCO1 both meet the design
requirements. VCO0 offers a relatively improved VCO performance over VCO1. In this case, choose VCO0 for
improved RMS jitter in the 12-kHz to 20-MHz integration range.
9.2.2.1.1 Clock Architect
Under the advanced tab of the Clock Architect, filtering of specific parts can be done using regular expressions
in the Part Filter box. [LMK04832.*] will filter for only the LMK04832 device (without brackets). More detailed
filters can be given such as the entire part name LMK04832_VCO0 to force an LMK04832 using VCO0 solution
if one is available.
9.2.2.2 Device Configuration and Simulation
The tools automatically configure the simulation to meet the input and output frequency requirements given, and
make assumptions about other parameters to give some default simulations. However, the user may chose to
make adjustments for more accurate simulations to their application. For example:
• Entering the VCO Gain of the external VCXO or possible external VCO used device.
• Adjust the charge pump current to help with loop filter component selection. Lower charge pump currents
result in smaller components but may increase impacts of leakage and at the lowest values reduce PLL
phase noise performance.
• Clock Architect allows loading a custom phase noise plot for reference or VCXO block. Typically, a custom
phase noise plot is entered for CLKin to match the reference phase noise to device; a phase noise plot for the
VCXO can additionally be provided to match the performance of VCXO used. For improved accuracy in
simulation and optimum loop filter design, be sure to load these custom noise profiles for use in application.
• The PLLatinum™ Simulation tool can also be used to design and simulate a loop filter.
9.2.2.3 Device Setup
Frequency Planning
• Even clock outputs have the simplest output path and lowest noise floor, so they were chosen.
• CLKOUT4 is used so therefore CLKOUT6 & CLKOUT7 should either not be used or at least be assigned the
same frequency as CLKOUT4.
• CLKOUT8 is used, so therefore CLKOUT10 & CLKOUT11 should either not be used or at least be assigned
the same frequency as CLKOUT8.
Output Formats
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• CML and LVPECL are chosen for the 983.04 and 2949.12 MHz clocks for the lower noise floor
• CMOS is chosen for the 122.88 MHz clock for lower current consumption
Programming
• Using the clock design tools configuration the TICS Pro software is manually updated with this information to
meet the required application.
• For best performance the input and output drive level bits may be set. Best noise floor performance is
achieved with CLKout2_3_IDL = 1 and CLKout2_3_ODL = 1.
• The CLKoutX_Y_ODL bit has no impact on even clock outputs in high performance bypass mode.
9.2.3 Application Curve
-80
OSCOUT
CLKOUT8
CLKOUT0
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
-155
-160
-165
-170
CLKOUT2
CLKOUT4
1x102
1x103
1x104
1x105
1x106
1x107
1x108
Offset (Hz)
图9-7. Offset vs Phase Noise
表9-5. Offset vs Phase Noise
Phase Noise (dBc/Hz)
Frequency
(MHz)
Jitter
(fs)
Output
Format
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
10 MHz
Floor
OSCOUT
CLKOUT8
122.88
LVCMOS
132.2
87.7
-111.8
-137.3
-148.3
-144.4
-154.0
-155.4
-157.2
-155.9
-156.0
HSDS
(8 mA)
122.88
245.76
983.04
2949.12
-111.7
-98.0
-92.7
-81.4
-134.7
-127.6
-115.9
-106.5
-146.4
-139.1
-128.2
-118.8
-162.7
-161.9
-157.4
-154.7
-162.8
-162.6
-159.4
-158.0
LVPECL
(2 Vpp)
CLKOUT0
CLKOUT2
CLKOUT4
70.0
67.1
65.4
-137.2
-125.7
-116.3
-154.1
-141.4
-132.0
LVPECL
(1.6 Vpp)
CML
(32 mA)
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9.3 Power Supply Recommendations
9.3.1 Current Consumption
Current consumption varies considerably with the number of outputs and output formats. This can be calculated
the TI TICSPro software.
9.3.2 Cold Sparing Considerations
图9-8 below demonstrates how this part can be used for cold sparing
VCC1 = 3.3V ± 0.3V
VCC2 = 0V
+
–
+
–
Output of LMK
Device configured
as CMOS
220 ꢀ
Unpowered LMK
Device
(acting as cold spare)
CLKINX or SYNC
Powered
LMK Device
CLKinX
Copyright © 2022, Texas Instruments Incorporated
图9-8. Cold Sparing Devices Setup
9.3.2.1 Damage Prevention Details to Unpowered Device
Setting two devices in a cold sparing setup leads to the unpowered device receiving DC-coupled LVCMOS
pulses on the CLKIN0 or SYNC inputs periodically throughout the lifetime of the unpowered device. The
cumulative lifetime limit for the unpowered device DC input current is 10 hours at maximum junction
temperature. Also, the device can remain within specifications for much longer than this limit if the typical cold-
spare junction temperature is lower than maximum junction temperature. However, by placing a 220-Ω in series
between the output of the poweredde to the inputs of the unpowered devP, even when connected to a 3.3-V or
3.6-V powered system, DC pulses from the powered device do not damage the unpowered device. DC-coupling
3.3V or 3.6-V I/O can occur without the transmitter for the SYNC signal failing high and destroying the receiver,
or any other circuitry within the unpowered device. Also, the 220-Ωresistor limits the current to about 7 mA, with
less than 12 mW dissipated onto the unpowered device.
Additionally, if CLKIN is damaged or fails short in one of the CLKIN paths with the 220-Ω resistor in series to
ground on the fault path, the current is limited. The initial damage won't short to the outputs of the transmitter
powered device, and therefore, no damage occurs to the rest of the system. The inputs and outputs of each
device have separate power supply pins that are not connected internally; therefore, if the unpowered device is
powered, no issues can occur to the outputs, even if one of the inputs is damaged over the lifetime of the
unpowered device.
When driving the CLKINx or OSCin inputs of an unpowered device, signal levels up to ± 400 mV can be AC-
coupled through 0.01 µF across the operating frequency range. Under these constraints, the magnitude of the
RMS currents injected into the CLKinX ESD structures is within acceptable power and current limits across the
full junction temperature range and won't cause long-term degradation of function. Larger amplitudes, higher
frequencies, or different coupling capacitors can be acceptable as long as the signal is AC-coupled and the
unpowered current limit of 7 mA going into or coming out of the CLKIN or OSCIN pins is observed.
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CLKIN or OSCIN
0.01 ꢀF
Unpowered
Device
± 400 mV square
wave source
Copyright © 2022, Texas Instruments Incorporated
图9-9. AC-Coupled ± 400 mV Signal Inputted to Unpowered Device
9.4 Layout
9.4.1 Layout Guidelines
In general, the following general guidelines are useful to keep in mind.
• GND pins on the outer perimeter of the package may be routed on the package back to the DAP
• Ensure the DAP on device is well-grounded with many vias.
• Use a low loss dielectric material, such as Rogers 4350B, for optimal output power.
• For power supply bypassing, isolate each clock group .
In addition to this, there are special considerations for the routing of the outputs. The outputs are divided in to
several output groups.
• Clock Group 0: CLKOUT0, CLKOUT1, CLKOUT12, CLKOUT13
• Clock Group 1: CLKOUT2, CLKOUT3
• Clock Group 2: CLKOUT4, CLKOUT5, CLKOUT6, CLKOUT7
• Clock Group 3: CLKOUT8, CLKOUT9, CLKOUT10, CLKOUT11
It is optimal to isolate the power supply pins for these clock group pins with a ferrite bead to crosstalk between
the outputs, especially if the output groups have different frequencies. If there is flexibility in planning which
frequencies go to which outputs, crosstalk can be minimized by putting different frequencies in different output
groups (as opposed to putting them in the same output group).
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9.4.2 Layout Example
图9-10. Top Layer
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Emi er resistors for
LVPECL can be put on
back side of the board.
Resistors, Ferrite
Beads, and
Capacitors on back
side of board
provide power
supply ltering
图9-11. Bottom Layer
9.4.3 Thermal Management
Power consumption can be high enough to require attention from thermal management. For reliability and
performance reasons, the die temperature should be limited to a maximum of 125°C. That is, as an estimate, TA
(ambient temperature) plus device power consumption times RθJA should not exceed 125°C.
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10 Device and Documentation Support
10.1 Device Support
10.1.1 Development Support
10.1.1.1 Clock Architect
Part selection, loop filter design, simulation.
To run the online Clock Architect tool, go to www.ti.com/clockarchitect.
10.1.1.2 PLLatinum Simulation
Supports loop filter design and simulation. All simulation is for a single loop, to perform dual loop simulations, the
result of the first PLL simulation must be loaded as a reference to the second PLL simulation.
To download the PLLatinum™ simulation tool, go to www.ti.com/tool/PLLATINUMSIM-SW
10.1.1.3 TICS Pro
EVM programming software. Can also be used to generate register map for programming and calculate current
consumption estimate.
For TICS Pro, go to www.ti.com/tool/TICSPRO-SW
10.2 Documentation Support
10.2.1 Related Documentation
For related documentation, see the following:
• AN-912 Common Data Transmission Parameters and their Definitions (SNLA036)
10.3 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
10.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
10.5 Trademarks
PLLatinum™ and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
10.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This data is subject to change
without notice and revision of this document.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
250
160
250
(1)
(2)
(3)
(4/5)
(6)
LMK04832MPAPSEP
LMK04832PAP/EM
V62P22612-01XE
ACTIVE
HTQFP
HTQFP
HTQFP
PAP
64
64
64
RoHS & Green
RoHS & Green
RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-55 to 125
25 to 25
LMK04832
MPAPSEP
Samples
Samples
Samples
ACTIVE
ACTIVE
PAP
NIPDAU
NIPDAU
LMK04832
PAP/EM
PAP
LMK04832
MPAPSEP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2023
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMK04832-SEP :
Space : LMK04832-SP
•
NOTE: Qualified Version Definitions:
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 2
PACKAGE OUTLINE
TM
PAP0064E
PowerPAD TQFP - 1.2 mm max height
SCALE 1.300
PLASTIC QUAD FLATPACK
10.2
9.8
B
NOTE 3
64
49
PIN 1 ID
1
48
10.2
9.8
12.2
TYP
11.8
NOTE 3
16
33
17
32
A
0.27
64X
60X 0.5
0.17
0.08
C A B
4X 7.5
C
SEATING PLANE
1.2 MAX
(0.127)
TYP
SEE DETAIL A
17
32
0.25
GAGE PLANE
(1)
33
16
0.15
0.05
0.08 C
0 -7
0.75
0.45
65
6.08
4.67
DETAIL A
A
17
TYPICAL
1
48
49
64
4228332/A 01/2022
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features may not be present.
5. Reference JEDEC registration MS-026.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
PAP0064E
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
8)
NOTE 8
(
6.08)
SYMM
SOLDER MASK
49
64
DEFINED PAD
64X (1.5)
(R0.05)
TYP
1
48
64X (0.3)
65
(11.4)
SYMM
(1.3 TYP)
60X (0.5)
33
16
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
17
32
SEE DETAILS
(1.3 TYP)
(11.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4228332/A 01/2022
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
PAP0064E
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
6.08)
BASED ON 0.125
THICK STENCIL
SYMM
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
64
49
64X (1.5)
1
48
64X (0.3)
(R0.05) TYP
SYMM
65
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
32
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
6.80 X 6.80
6.08 X 6.08 (SHOWN)
5.55 X 5.55
0.125
0.15
0.175
5.14 X 5.14
4228332/A 01/2022
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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