LMP90080QMH/NOPB [TI]
具有真正连续后台校准的汽车类多通道低功耗 16 位传感器 AFE | PWP | 28 | -40 to 150;
| 型号： | LMP90080QMH/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有真正连续后台校准的汽车类多通道低功耗 16 位传感器 AFE | PWP | 28 | -40 to 150 光电二极管 传感器 |
| 文件： | 总66页 (文件大小：1478K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
具有后台校准的 LMP90080-Q1 多通道 16 位传感器模拟前端 (AFE)
查询样片: LMP90080-Q1
1
特性
应用
23
•
16 位低功耗三角积分 (Σ-Δ) 模数转换器 (ADC)
所有增益上的真连续背景校准
•
•
•
温度和压力发送器
应变仪接口
•
•
•
•
•
•
•
•
•
•
•
使用期望值编程进行适当的系统校准
低噪声可编程增益 (1x - 128x)
工业过程控制
说明
连续后台开路/短路和范围外传感器诊断
单周期稳定的 8 个输出数据速率 (ODR)
源自 100µA 至 1000 µA 的 2 个已匹配激励电流
4 个差分 (DIFF) / 7 个单端 (SE) 输入
2 个 DIFF / 4 个 SE 输入
LMP90080-Q1 是一款高集成、多通道、低功耗 16 位
传感器 AFE。 此器件特有一个精密 16 位三角积分模
数转换器 (ADC)，此转换器具有一个低噪声可编程增
益放大器和一个完全差分高阻抗模拟输入复用器。 一
个真连续后台校准特性可在所有增益和输出数据速率上
实现校准而又不会中断信号路径。 后台校准特性在温
度和时间范围内从根本上消除了增益和偏移误差，从而
在不损失速度和功耗的情况下提供测量精度。
7 个通用输入/输出引脚
用于实现低偏移的斩波稳定缓冲器
支持循环冗余码校验 (CRC) 数据链接误差检测的
SPI 4/3 线制接口
•
ODR ≤ 13.42SPS 时的 50Hz 至 60Hz 线路扰动抑
制
LMP90080-Q1 的另外一个特性是其连续后台传感器诊
断，此诊断可在无需用户干预的情况下实现开路和短路
情况以及范围以外信号的检测，从而提高了系统可靠
性。
•
•
•
每通道独立增益和 ODR 选择
由 WEBENCH® 传感器 AFE 设计工具提供支持
自动通道排序器
两组独立外部基准引脚可实现多个比率测量。 此外，
在 LMP90080-Q1 上还提供两个已匹配的可编程电流
源来为诸如阻性温度检测器和桥式传感器等外部传感器
供电。 此外，还提供了 7 个 GPIO 引脚与外部发光二
极管 (LED) 和开关进行对接以简化绝缘格栅上的控
制。
主要技术规格
•
•
•
•
•
•
•
•
•
有效位数 (ENOB)/NFR：高达 16/16 位
偏移误差（典型值）：8.4nV
增益误差（典型值）：7ppm
总体噪声：< 10µV-rms
积分非线性（INL 最大值）：±1 最低有效位 (LSB)
输出数据速率 (ODR)：1.6775 - 214.65SPS
模拟电压，VA：+4.75V 至 +5.5V
工作温度范围：-40 至 +150°C
总的来说，这些特性使得 LMP90080-Q1 成为针对诸
如温度、压力、应变仪和工业过程控制等低功耗、精密
传感器应用的完整模拟前端。 LMP90080-Q1 可在 -
40°C 至 +150°C 的扩展温度范围内稳定工作并采用 28
引脚带外露焊盘封装。
封装：28 引脚带外露垫封装
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
版权 © 2013–2014, Texas Instruments Incorporated
English Data Sheet: SNIS186
LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
Typical Application
VA
VA
VIO
VREFP1 VREFN1
SCLK
CSB
IB1
IB2
Micro-
Controller
SDO/DRDYB
SDI
1
2
VIN0
...
LMP90080
+
-
VIN2
...
VIN4
...
3
4
D0
...
VIN6/VREFP2
LEDs/
Switches
D6/DRDYB
VIN7/
VREFN2
XOUT
CLK/XIN
GND
Block Diagram
Chip Configurable
Channel Configurable
Fixed
LMP90080
VIO
VA
VA
EXC.
CURRENT
EXC.
CURRENT
IB1
IB2
LMP90080/
Open/Short
LMP90078 only
POR
Sensor Diag.
SERIAL I/F
CONTROL
&
CALIBRATION
DATA PATH
VIN0
VIN1
VIN2
VIN3
SCLK
SDI
PGA
1x, 2x,
4x, 8x
BACKGROUND
CALIBRATION
SDO/DRDYB
CSB
FGA
16x
BUFF
LMP90080/
LMP90079 only
VIN4
VIN5
16 bit 6'
Module
DIGITAL
FILTER
VIN6/VREFP2
VIN7/VREFN2
CLK
MUX
Ext. Clk
Detect
Internal
CLK
VREF
MUX
GPIO
GND
VREFN1
XOUT
D6/
DRDYB
D0
CLK/
XIN
VREFP1
Figure 1. Block Diagram
2
Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
True Continuous Background Calibration
The LMP90080-Q1 features a 16 bit ΣΔ core with continuous background calibration to compensate for gain and
offset errors in the ADC, virtually eliminating any drift with time and temperature. The calibration is performed in
the background without user or ADC input interruption, making it unique in the industry and eliminating down time
associated with field calibration required with other solutions. Having this continuous calibration improves
performance over the entire life span of the end product.
Continuous Background Sensor Diagnostics
Sensor diagnostics are also performed in the background, without interfering with signal path performance,
allowing the detection of sensor shorts, opens, and out-of-range signals, which vastly improves system reliability.
In addition, the fully flexible input multiplexer described below allows any input pin to be connected to any ADC
input channel providing additional sensor path diagnostic capability.
Flexible Input MUX Channels
The flexible input MUX allows interfacing to a wide range of sensors such as thermocouples, RTDs, thermistors,
and bridge sensors. The LMP90080-Q1’s multiplexer supports 4 differential channels. Each effective input
voltage that is digitized is VIN = VINX – VINY, where x and y are any input. In addition, the input multiplexer of the
LMP90080-Q1 also supports 7 single-ended channels, where the common ground is any one of the inputs.
Programmable Gain Amplifiers (FGA & PGA)
The LMP90080-Q1 contains an internal 16x fixed gain amplifier (FGA) and a 1x, 2x, 4x, or 8x programmable gain
amplifier (PGA). This allows accurate gain settings of 1x, 2x, 4x, 8x, 16x, 32x, 64x, or 128x through configuration
of internal registers. Having an internal amplifier eliminates the need for external amplifiers that are costly, space
consuming, and difficult to calibrate.
Excitation Current Sources (IB1 & IB2)
Two matched internal excitation currents, IB1 and IB2, can be used for sourcing currents to a variety of sensors.
The current range is from 100 µA to 1000 µA in steps of 100 µA.
Connection Diagram
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VIO
1
2
3
4
5
6
7
8
9
VA
VIN0
D6 / DRDYB
D5
D4
D3
VIN1
VIN2
VIN3
VIN4
D2
D1
D0
VIN5
LMP90080
VREFP1
VREFN1
SDO/DRDYB
VIN6/VREFP2 10
VIN7/VREFN2 11
SDI
SCLK
CSB
12
13
14
IB2
IB1
GND
XIN/CLK
XOUT
Figure 2. 28-pin HTSSOP
Copyright © 2013–2014, Texas Instruments Incorporated
3
LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
Pin Descriptions
Pin #
1
Pin Name
VA
Type
Function
Analog Supply
Analog Input
Analog Input
Analog Input
Analog Input
Analog Input
Analog Input
Analog output
Analog output
Analog input
Ground
Analog power supply pin
2 - 4
5 - 7
8
VIN0 - VIN2
VIN3 - VIN5
VREFP1
VREFN1
VIN6 / VREFP2
VIN7 / VREFN2
IB2 & IB1
XOUT
Analog input pins
Analog input pins
Positive reference input
Negative reference input
9
10
Analog input pin or VREFP2 input
Analog input pin or VREFN2 input
Excitation current sources for external RTDs
External crystal oscillator connection
11
12 - 13
14
15
XIN / CLK
GND
External crystal oscillator connection or external clock input
Power supply ground
16
17
CSB
Digital Input
Digital Input
Digital Input
Digital Output
Digital IO
Chip select bar
18
SCLK
Serial clock
19
SDI
Serial data input
20
SDO / DRDYB
D0 - D5
Serial data output and data ready bar
General purpose input/output (GPIO) pins
General purpose input/output pin or data ready bar
Digtal input/output supply pin
Leave the thermal pad floating
21 - 26
27
D6 / DRDYB
VIO
Digital IO
28
Digital Supply
Thermal Pad
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)(3)(4)
Analog Supply Voltage, VA
-0.3V to 6.0V
-0.3V to 6.0V
-0.3V to VA+0.3V
-0.3V to VA+0.3V
-0.3V to VIO+0.3V
-0.3V to VIO + 0.3V
5mA
Digital I/O Supply Voltage, VIO
Reference Voltage, VREF
Voltage on Any Analog Input Pin to GND(5)
Voltage on Any Digital Input PIN to GND(5)
Voltage on SDO(5)
Input Current at Any Pin(5)
Output Current Source or Sink by SDO
Total Package Input and Output Current
3mA
20mA
Human Body Model (HBM)
Machine Model (MM)
2500V
ESD Susceptibility
200V
Charged Device Model (CDM)
1250V
Junction Temperature (TJMAX
)
+150°C
Storage Temperature Range
–65°C to +150°C
(1) All voltages are measured with respect to GND, unless otherwise specified
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) For soldering specifications see product folder at http://www.ti.com and http://www.ti.com/lit/SNOA549
(4) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(5) When the input voltage (VIN) exceeds the power supply (VIN < GND or VIN > VA), the current at that pin must be limited to 5mA and
VIN has to be within the Absolute Maximum Rating for that pin. The 20 mA package input current rating limits the number of pins that
can safely exceed the power supplies with current flow to four pins.
4
Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Operating Ratings
Analog Supply Voltage, VA
Digital I/O Supply Voltage, VIO
Full Scale Input Range, VIN
Reference Voltage, VREF
+4.75V to 5.5V
+2.7V to 5.5V
±VREF / PGA
+0.5V to VA
TMIN = –40°C
Temperature Range for Electrical Characteristics
TMAX = +150°C
–40°C ≤ TA ≤ +150°C
41°C/W
Operating Temperature Range
(1)
Junction to Ambient Thermal Resistance (θJA
)
(1) The maximum power dissipation is a function of TJ(MAX) AND θJA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA) / θJA
.
Copyright © 2013–2014, Texas Instruments Incorporated
5
LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
Electrical Characteristics
Unless otherwise noted, the key for the condition is (VA = VIO = VREF) / ODR (SPS) / buffer / calibration / gain . Boldface
limits apply for TMIN ≤ TA ≤ TMAX; the typical values apply for TA = +25°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
n
Resolution
16
Bits
Effective Number
of Bits and Noise
Free Resolution
5V / all / ON / OFF / all. Shorted input.
ENOB /
NFR
See Table 1
Bits
ODR
Output Data Rates
Gain
1.6675
1
See
214.6
128
SPS
FGA × PGA
See Table 1
Integral Non-
Linearity(1)
5V / 214.65 / ON / ON / 1 - 128
INL
± 1
LSB
µV
Total Noise
5V / all / ON / OFF / all. Shorted input.
5V / all / ON or OFF / ON / all
See Table 2
Below Noise
Floor (rms)
µV
OE
Offset Error
5V / 214.65 / ON / ON / 1
1.79
0.0112
100
3
15
10
µV
5V / 214.65 / ON / ON / 128
5V / 214.65 / ON or OFF/OFF/1-8
5V / 214.65 / ON / ON / 1-8
5V / 214.65 / ON / OFF / 16
5V / 214.65 / ON / ON / 16
5V / 214.65 / ON / OFF / 128
5V / 214.65 / ON / ON / 128
µV
nV/°C
nV/°C
nV/°C
nV/°C
nV/°C
nV/°C
25
Offset Drift Over
Temp(1)
0.4
6
0.125
nV / 1000
hours
5V / 214.65 / ON / OFF / 1, TA = 150°C
5V / 214.65 / ON / ON / 1, TA = 150°C
2360
100
Offset Drift over
Time(1)
nV / 1000
hours
5V / 214.65 / ON / ON / 1
5V / 214.65 / ON / ON / 16
5V / 214.65 / ON / ON / 64
5V / 214.65 / ON / ON / 128
-80
7
80
ppm
ppm
ppm
ppm
50
GE
Gain Error(1)
50
100
Gain Drift over
Temp(1)
5V / 214.65 / ON / ON / all
0.5
5.9
1.6
ppm/°C
ppm / 1000
hours
5V / 214.65 / ON / OFF / 1, TA = 150°C
5V / 214.65 / ON / ON / 1, TA = 150°C
Gain Drift over
Time(1)
ppm / 1000
hours
CONVERTER'S CHARACTERISTIC
Input Common
Mode Rejection
Ratio
DC, 5V / 214.65 / ON / ON / 1
90
85
120
117
dB
dB
CMRR
50/60 Hz, 5V / 214.65 / OFF / OFF / 1
VREF = 2.5V
Reference
Common Mode
Rejection
101
112
dB
dB
Power Supply
Rejection Ratio
PSRR
NMRR
DC, 5V / 214.65 / ON / ON / 1
Normal Mode
47 Hz to 63 Hz, 5V / 13.42 / OFF / OFF
/ 1
78
95
dB
dB
Rejection Ratio(1)
Cross-talk(1)
5V / 214.65 / OFF / OFF / 1
143
POWER SUPPLY CHARACTERISTICS
Analog Supply
Voltage
VA
4.75
2.7
5.0
3.3
5.5
5.5
V
V
Digital Supply
Voltage
VIO
(1) This parameter is specified by design and/or characterization and is not tested in production.
6
Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Electrical Characteristics (continued)
Unless otherwise noted, the key for the condition is (VA = VIO = VREF) / ODR (SPS) / buffer / calibration / gain . Boldface
limits apply for TMIN ≤ TA ≤ TMAX; the typical values apply for TA = +25°C.
Symbol
Parameter
Conditions
Min
Typ
464
690
1760
941
5
Max
700
Units
µA
5V / 13.42 / OFF / OFF / 1, ext. CLK
5V / 13.42 / ON / OFF / 64, ext. CLK
5V / 214.65 / ON / OFF / 64, int. CLK
5V / 214.65 / OFF / OFF / 1, int. CLK
Standby, 5V, int. CLK
1000
2150
1250
40
µA
µA
Analog Supply
Current
IVA
µA
µA
Standby, 5V, ext. CLK
300
4.6
µA
Power-down, 5V, int/ext CLK
40
µA
REFERENCE INPUT
VREFP
Positive Reference
VREFN + 0.5
GND
VA
V
V
Negative
Reference
VREFN
VREFP - 0.5
Differential
Reference
VREF
ZREF
IREF
VREF = VREFP - VREFN
0.5
VA
V
MOhm
µA
Reference
Impedance
VREF = 3V / 13.42 / OFF / OFF / 1
10
±2
6
VREF = 3V / 13.42 / ON or OFF /ON or
OFF/all
Reference Input
Capacitance of the
Positive Reference
CREFP
gain = 1(2)
gain = 1(2)
Power-down
pF
Capacitance of the
CREFN Negative
Reference
6
1
pF
nA
Reference
ILREF
Leakage Current
ANALOG INPUT
Gain = 1-8, buffer ON
Gain = 16 - 128, buffer ON
Gain = 1-8, buffer OFF
Gain = 1-8, buffer ON
Gain = 16 - 128, buffer ON
Gain = 1-8, buffer OFF
VIN = VINP - VINN
GND + 0.1
GND + 0.4
GND
VA - 0.1
VA - 1.5
VA
V
V
V
V
V
V
VINP
VINN
Positive Input
GND + 0.1
GND + 0.4
GND
VA - 0.1
VA - 1.5
VA
Negative Input
VIN
ZIN
Differential Input
±VREF / PGA
15.4
Differential Input
Impedance
ODR = 13.42 SPS
MOhm
pF
Capacitance of the 5V / 214.65 / OFF / OFF / 1
Positive Input
CINP
CINN
4
4
Capacitance of the
5V / 214.65 / OFF / OFF / 1
Negative Input
pF
5V / 13.42 / ON / OFF / 1-8
500
100
pA
pA
Input Leakage
Current
IIN
5V / 13.42 / ON / OFF / 16 - 128
DIGITAL INPUT CHARACTERISTICS at VA = VIO = VREF = 3.0V
Logical "1" Input
Voltage
VIH
0.7 x VIO
-10
V
V
Logical "0" Input
Voltage
VIL
0.3 x VIO
+10
Digital Input
IIL
µA
V
Leakage Current
Digital Input
VHYST
0.1 x VIO
Hysteresis
(2) This parameter is specified by design and/or characterization and is not tested in production.
Copyright © 2013–2014, Texas Instruments Incorporated
7
LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
Electrical Characteristics (continued)
Unless otherwise noted, the key for the condition is (VA = VIO = VREF) / ODR (SPS) / buffer / calibration / gain . Boldface
limits apply for TMIN ≤ TA ≤ TMAX; the typical values apply for TA = +25°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DIGITAL OUTPUT CHARACTERISTICS at VA = VIO = VREF = 3.0V
Logical "1" Output
Voltage
VOH
VOL
Source 300 µA
Sink 300 µA
2.6
V
V
Logical "0" Output
Voltage
0.4
10
IOZH,
IOZL
TRI-STATE
Leakage Current
-10
µA
pF
TRI-STATE
Capacitance
COUT
See(2)
5
EXCITATION CURRENT SOURCES CHARACTERISTICS
0, 100, 200,
300, 400, 500,
600, 700, 800,
900, 1000
Excitation Current
IB1, IB2
µA
Source Output
IB1/IB2 Tolerance VA = VREF = 5V
-5
0.2
5
%
V
IB1/IB2 Output
VA = 5.0V, IB1/IB2 = 100 µA to 1000
VA - 0.8
Compliance Range µA
VA = 5.0V, IB1/IB2 = 100 µA to 1000
µA
IB1/IB2 Regulation
IB1/IB2 Drift
0.07
60
% / V
ppm/°C
%
IBTC
VA = 5.0V
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
100 µA
0.34
1.53
1
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
200 µA
0.22
0.2
%
%
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
300 µA
0.85
0.8
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
400 µA
0.15
0.14
0.13
0.075
0.085
0.11
0.11
2
%
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
500 µA
0.7
%
IBMT
IB1/IB2 Matching
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
600 µA
0.7
%
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
700 µA
0.65
0.6
%
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
800 µA
%
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
900 µA
0.55
0.45
%
5V / 214.65 / OFF / OFF / 1, IB1/IB2 =
1000 µA
%
IB1/IB2 Matching
Drfit
VA = 5.0V, IB1/IB2 = 100 µA to 1000
µA
IBMTC
ppm/°C
INTERNAL/EXTERNAL CLK
Internal Clock
CLKIN
893
kHz
Frequency
External Clock
CLKEXT
See(3)
1.8
1.8
3.5717
7.2
7.2
MHz
Frequency
Input Low Voltage
Input High Voltage
Frequency
0
V
V
1
3.5717
7
External Crystal
Frequency
MHz
ms
Start-up time
(3) This parameter is specified by design and/or characterization and is not tested in production.
8
Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
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ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Electrical Characteristics (continued)
Unless otherwise noted, the key for the condition is (VA = VIO = VREF) / ODR (SPS) / buffer / calibration / gain . Boldface
limits apply for TMIN ≤ TA ≤ TMAX; the typical values apply for TA = +25°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
SCLK
Serial Clock
10
MHz
Table 1. ENOB (Noise Free Resolution) vs. Sampling Rate and Gain at VA = VIO = VREF = 5V
Gain of the ADC
SPS
1
2
4
8
16
32
64
128
1.6775
3.355
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (16)
16 (15.5)
16 (16)
16 (16)
16 (15.5)
16 (15)
16 (16)
16 (15.5)
16 (15)
16 (15)
16 (15.5)
16 (15)
16 (14.5)
16 (14)
6.71
13.42
26.83125
53.6625
107.325
214.65
Table 2. RMS Noise (µV) vs. Sampling Rate and Gain at VA = VIO = VREF = 5V
Gain of the ADC
SPS
1
2
4
8
16
32
64
128
0.16
0.22
0.32
0.43
0.23
0.31
0.44
0.63
1.6775
3.355
2.68
3.86
5.23
7.94
2.90
4.11
5.74
8.25
1.65
2.36
3.49
5.01
1.86
2.60
3.72
5.31
1.24
1.78
2.47
3.74
1.34
1.90
2.72
3.82
1.00
1.47
2.09
2.94
1.08
1.50
2.11
2.97
0.22
0.34
0.44
0.61
0.29
0.39
0.56
0.79
0.19
0.27
0.34
0.50
0.24
0.35
0.48
0.68
0.17
0.22
0.30
0.45
0.23
0.32
0.46
0.64
6.71
13.42
26.83125
53.6625
107.325
214.65
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LMP90080-Q1
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Timing Diagrams
Unless otherwise noted, specified limits apply for VA = 5V, VIO = 3.0V. Boldface limits apply for TMIN ≤ TA ≤ TMAX
;
the typical values apply for TA = +25°C.
CSB
t
t
CL
1/f
SCLK
CH
4
1
2
3
5
6
7
8
9
10
11
12
13
14
15
16
17
n
SCLK
SDI
INST2
MSB
LSB
DRDYB is driving the pin
SDO is driving the pin
Data Byte (s)
MSB
LSB
SDO/
...
DRDYB
Figure 3. Timing Diagram
Symbol
fSCLK
tCH
Parameter
Conditions
Min
Typical
Max
Units
MHz
ns
10
SCLK High time
SCLK Low time
0.4 / fSCLK
0.4 / fSCLK
tCL
ns
CSB
CSB
0.3V
IO
t
t
CSSUmin
CSHmin
0.7V
IO
SCLK
0.7V
IO
SCLK
Symbol
tCSSU
Parameter
Conditions
Min
10
Typical
Max
Units
ns
CSB Setup time prior to an SCLK rising edge
CSB Hold time after the last rising edge of SCLK
tCSH
10
ns
0.9V
0.9V
IO
IO
0.7V
IO
SCLK
SCLK
0.1V
0.1V
t
IO
IO
t
t
DIH
t
DISU
CLKR
CLKF
0.7V
0.7V
IO
IO
SDI
DB
0.3V
0.3V
IO
IO
10
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LMP90080-Q1
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ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Symbol
tCLKR
tCLKF
tDISU
Parameter
Conditions
Min
Typical
1.15
Max
Units
ns
SCLK Rise time
SCLK Fall time
1.15
ns
SDI Setup time prior to an SCLK rising edge
SDI Hold time after an SCLK rising edge
10
10
ns
tDIH
ns
0.7V
IO
SCLK
0.3V
DOH
IO
CSB
t
t
DOD1
t
DOA
0.9V
IO
0.7V
0.3V
0.7V
IO
IO
SDO
DB0
DB
DB
SDO
0.3V
IO
0.1V
IO
IO
Symbol
Parameter
Conditions
Min
Typical
Max
Units
ns
tDOA
tDOH
SDO Access time after an SCLK falling edge
SDO Hold time after an SCLK falling edge
SDO Disable time after the rising edge of CSB
35
0
ns
tDOD1
5
ns
0.7V
IO
SCLK
SDO
SCLK
0.3 V
IO
t
(optional,
DOD2
SW_OFF_TRG = 1)
t
DOD2
0.9 V
0.1 V
IO
IO
0.9V
IO
DB0
SDO
DB0
0.1V
IO
Symbol
Parameter
SDO Disable time after either edge of SCLK
Conditions
Min
Typical
Max
Units
tDOD2
27
ns
0.9V
0.9V
IO
IO
8
9
SCLK
SDO
0.3V
IO
SDO
t
0.1V
0.1V
DOE
IO
IO
t
t
DOF
DOR
0.7V
IO
DB7
0.3V
IO
Symbol
Parameter
Conditions
Min
Typical
Max
Units
SDO Enable time from the falling
edge of the 8th SCLK
tDOE
35
ns
tDOR
tDOF
SDO Rise time
SDO Fall time
See(1)
See(1)
7
7
ns
ns
µs
µs
ODR ≤ 13.42 SPS
64
4
Data Ready Bar pulse at every
1/ODR second
tDRDYB
13.42 < ODR ≤ 214.65 SPS
(1) This parameter is specified by design and/or characterization and is not tested in production.
Copyright © 2013–2014, Texas Instruments Incorporated
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LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
Specific Definitions
COMMON MODE REJECTION RATIO is a measure of how well in-phase signals common to both input pins are
rejected. To calculate CMRR, the change in output offset is measured while the common mode input voltage is
changed.
CMRR = 20 LOG(ΔCommon Input / ΔOutput Offset)
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) – says that the converter is equivalent to a
perfect ADC of this (ENOB) number of bits. LMP90080-Q1’s ENOB is a DC ENOB spec, not the dynamic ENOB
that is measured using FFT and SINAD. Its equation is as follows:
§
·
2 x VREF/Gain
RMS Noise
ENOB =
¨
¨
¸
¸
log2
©
¹
(1)
GAIN ERROR is the deviation from the ideal slope of the transfer function.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line
through the input to output transfer function. The deviation of any given code from this straight line is measured
from the center of that code value. The end point fit method is used. INL for this product is specified over a
limited range, per the Electrical Tables.
NEGATIVE FULL-SCALE ERROR is the difference between the differential input voltage at which the output
code transitions to negative full scale and (-VREF + 1LSB).
NEGATIVE GAIN ERROR is the difference between the negative full-scale error and the offset error divided by
(VREF / Gain).
NOISE FREE RESOLUTION is a method of specifying the number of bits for a converter with noise.
§
·
2 x VREF/Gain
Peak-to-Peak Noise
¨
¨
¸
¸
log2
NFR =
©
¹
(2)
ODR Output Data Rate.
OFFSET ERROR is the difference between the differential input voltage at which the output code transitions from
code 0000h to 0001h and 1 LSB.
POSITIVE FULL-SCALE ERROR is the difference between the differential input voltage at which the output
code transitions to positive full scale and (VREF – 1LSB).
POSITIVE GAIN ERROR is the difference between the positive full-scale error and the offset error divided by
(VREF / Gain).
POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well a change in the analog supply voltage
is rejected. PSRR is calculated from the ratio of the change in offset error for a given change in supply voltage,
expressed in dB.
PSRR = 20 LOG (ΔVA / ΔOutput Offset)
12
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LMP90080-Q1
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ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Typical Performance Characteristics
Unless otherwise noted, specified limits apply for VA = 5V, VIO = VREF = 3.0V. The maximum and minimum values apply for
TA = TMIN to TMAX; the typical values apply for TA = +25°C.
Noise Measurement without Calibration at Gain = 1
Noise Measurement with Calibration at Gain = 1
300
275
250
225
200
175
150
60
40
20
0
-20
-40
-60
G=1, Calibration off
G=1, Calibration on
0
200
400
TIME (ms)
Figure 4.
600
800
1000
0
200
400
TIME (ms)
Figure 5.
600
800
1000
C001
C002
Histogram without Calibration at Gain = 1
Histogram with Calibration at Gain = 1
4500
4000
3500
3000
2500
2000
1500
1000
500
4500
4000
3500
3000
2500
2000
1500
1000
500
0
0
-50 -40 -30 -20 -10
0
10 20 30 40 50
VOUT (µV)
VOUT (µV)
C007
C008
Figure 6.
Figure 7.
Noise Measurement without Calibration at Gain = 8
Noise Measurement with Calibration at Gain = 8
35
30
25
20
15
10
5
15
10
5
0
-5
-10
-15
G=8, Calibration off
G=8, Calibration on
0
0
200
400
TIME (ms)
Figure 8.
600
800
1000
0
200
400
TIME (ms)
Figure 9.
600
800
1000
C003
C004
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www.ti.com.cn
Typical Performance Characteristics (continued)
Unless otherwise noted, specified limits apply for VA = 5V, VIO = VREF = 3.0V. The maximum and minimum values apply for
TA = TMIN to TMAX; the typical values apply for TA = +25°C.
Histogram without Calibration at Gain = 8
Histogram with Calibration at Gain = 8
6000
5000
4000
3000
2000
1000
0
6000
5000
4000
3000
2000
1000
0
4
6
8
10 12 14 16 18 20 22 24 26 28 30
VOUT (µV)
-10 -8
-6
-4
-2
0
2
4
6
8
10
VOUT (µV)
C009
C010
Figure 10.
Figure 11.
Noise Measurement without Calibration at Gain = 128
Noise Measurement with Calibration at Gain = 128
5
2
1.5
1
4.5
4
3.5
3
0.5
0
2.5
2
-0.5
-1
1.5
1
-1.5
-2
G=128, Calibration off
G=128, Calibration on
0
200
400
TIME (ms)
Figure 12.
600
800
1000
0
200
400
TIME (ms)
Figure 13.
600
800
1000
C005
C006
Histogram without Calibration at Gain = 128
Histogram with Calibration at Gain = 128
4500
4000
3500
3000
2500
2000
1500
1000
500
4000
3500
3000
2500
2000
1500
1000
500
0
0
-0.6 -0.5 -0.4 -0.3 -0.2 -0.1
0
0.1 0.2 0.3 0.4 0.5 0.6
VOUT (µV)
VOUT (µV)
C011
C012
Figure 14.
Figure 15.
14
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LMP90080-Q1
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ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Typical Performance Characteristics (continued)
Unless otherwise noted, specified limits apply for VA = 5V, VIO = VREF = 3.0V. The maximum and minimum values apply for
TA = TMIN to TMAX; the typical values apply for TA = +25°C.
Noise vs.
Noise vs.
Gain without Calibration at ODR = 13.42 SPS
Gain with Calibration at ODR = 13.42 SPS
12
12
VA = 5V
VA = 5V
10
10
8
6
4
2
0
8
6
4
2
0
1
2
4
8
16 32 64 128
1
2
4
8
16 32 64 128
GAIN
GAIN
Figure 16.
Noise vs.
Figure 17.
Noise vs.
Gain without Calibration at ODR = 214.65 SPS
Gain with Calibration at ODR = 214.65 SPS
12
12
VA = 5V
VA = 5V
10
10
8
6
4
2
0
8
6
4
2
0
1
2
4
8
16 32 64 128
1
2
4
8
16 32 64 128
GAIN
Figure 18.
GAIN
Figure 19.
Offset Error vs.
Offset Error vs.
Temperature with Calibration at Gain = 1
2.0
Temperature without Calibration at Gain = 1
300
250
200
1.5
1.0
0.5
0.0
VA = 5V
150
100
50
0
VA = 5V
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 20.
Figure 21.
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LMP90080-Q1
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www.ti.com.cn
Typical Performance Characteristics (continued)
Unless otherwise noted, specified limits apply for VA = 5V, VIO = VREF = 3.0V. The maximum and minimum values apply for
TA = TMIN to TMAX; the typical values apply for TA = +25°C.
Offset Error vs.
Offset Error vs.
Temperature without Calibration at Gain = 8
25
Temperature with Calibration at Gain = 8
0.4
20
0.2
0.0
VA = 5V
15
10
5
VA = 5V
-0.2
-0.4
0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 22.
Figure 23.
Gain Error vs.
Gain Error vs.
Temperature without Calibration at Gain = 1
160
Temperature with Calibration at Gain = 1
40
150
20
VA = 5V
VA = 5V
140
130
120
110
0
-20
-40
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 24.
Figure 25.
Gain Error vs.
Gain Error vs.
Temperature without Calibration at Gain = 8
Temperature with Calibration at Gain = 8
-100
-20
-110
-120
-130
-40
-60
-80
VA = 5V
-140
VA = 5V
-100
-120
-150
-160
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 26.
Figure 27.
16
Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
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ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Typical Performance Characteristics (continued)
Unless otherwise noted, specified limits apply for VA = 5V, VIO = VREF = 3.0V. The maximum and minimum values apply for
TA = TMIN to TMAX; the typical values apply for TA = +25°C.
Digital Filter Frequency Response
Digital Filter Frequency Response
0
-20
0
-20
-40
-40
-60
-60
-80
-80
1.7 SPS
3.4 SPS
6.7 SPS
13.4 SPS
26.83 SPS
53.66 SPS
107.33 SPS
214.65 SPS
-100
-120
-100
-120
1
10
100
10
100
1k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 28.
Figure 29.
INL at Gain = 1
10
5
0
-5
-10
VA = 5V, 13.4 SPS
-5 -4 -3 -2 -1
0
1
2
3
4
5
VIN (V)
Figure 30.
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LMP90080-Q1
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Functional Description
The LMP90080-Q1 is a low-power 16-Bit ΣΔ ADC with 4 fully differential / 7 single-ended analog channels. Its
serial data output is two’s complement format. The output data rate (ODR) ranges from 1.6775 SPS to 214.65
SPS.
The serial communication for LMP90080-Q1 is SPI, a synchronous serial interface that operates using 4 pins:
chip select bar (CSB), serial clock (SCLK), serial data in (SDI), and serial data out / data ready bar
(SDO/DRYDYB).
True continuous built-in offset and gain background calibration is also available to improve measurement
accuracy. Unlike other ADCs, the LMP90080-Q1’s background calibration can run without heavily impacting the
input signal. This unique technique allows for positive as well as negative gain calibration and is available at all
gain settings.
The registers can be found in Registers, and a detailed description of the LMP90080-Q1 are provided in the
following sections.
Signal Path
Reference Input (VREF
)
The differential reference voltage VREF (VREFP – VREFN) sets the range for VIN.
The muxed VREF allows the user to choose between VREF1 or VREF2 for each channel. This selection can be
made by programming the VREF_SEL bit in the CHx_INPUTCN registers (CHx_INPUTCN: VREF_SEL). The default
mode is VREF1. If VREF2 is used, then VIN6 and VIN7 cannot be used as inputs because they share the same pin.
Refer to VREF for VREF applications information.
Flexible Input MUX (VIN)
LMP90080-Q1 provides a flexible input MUX as shown in Figure 31. The input that is digitized is VIN = VINP
VINN; where VINP and VINN can be any availablie input.
–
The digitized input is also known as a channel, where CH = VIN = VINP – VINN. Thus, there are a maximum of 4
differential channels: CH0, CH1, CH2, and CH3.
LMP90080-Q1 can also be configured single-endedly, where the common ground is any one of the inputs. There
are a maximum of 7 single-ended channels: CH0, CH1, CH2, CH3, CH4, CH5, and CH6 for the LMP90080-Q1.
The input MUX can be programmed in the CHx_INPUTCN registers. For example, to program CH0 = VIN = VIN4
VIN1, go to the CH0_INPUTCN register and set:
–
1. VINP = 0x4
2. VINN = 0x1
18
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ZHCSC22A –MAY 2013–REVISED JANUARY 2014
VREFP1
VIN0
VIN1
VIN2
VIN3*
VINP
VINN
+
-
+
+
-
ADC
FGA
BUFF
-
VIN4*
VIN5*
VIN6/VREFP2
VIN7/VREFN2
VREFN1
* VIN3, VIN4, VIN5 are only available for LMP90080 and LMP90079
Figure 31. Simplified VIN Circuitry
Selectable Gains (FGA & PGA)
LMP90080-Q1 provides two types of gain amplifiers: a fixed gain amplifier (FGA) and a programmable gain
amplifier (PGA). FGA has a fixed gain of 16x or it can be bypassed, while the PGA has programmable gain
settings of 1x, 2x, 4x, or 8x.
Total gain is defined as FGA x PGA. Thus, the LMP90080-Q1 provides gain settings of 1x, 2x, 4x, 8x, 16x, 32x,
64x, or 128x with true continuous background calibration.
The gain is channel specific, which means that one channel can have one gain, while another channel can have
the same or a different gain.
The gain can be selected by programming the CHx_CONFIG: GAIN_SEL bits.
Buffer (BUFF)
There is an internal unity gain buffer that can be included or excluded from the signal path. Including the buffer
provides a high input impedance but increases the power consumption.
When gain ≥ 16, the buffer is automatically included in the signal path. When gain < 16, including or excluding
the buffer from the signal path can be done by programming the CHX_CONFIG: BUF_EN bit.
Internal/External CLK Selection
The LMP90080-Q1 allows two clock options: internal CLK or external CLK (crystal (XTAL) or clock source).
There is an “External Clock Detection” mode, which detects the external XTAL if it is connected to XOUT and
XIN. When operating in this mode, the LMP90080-Q1 shuts off the internal clock to reduce power consumption.
Below is a flow chart to help set the appropriate clock registers.
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Clock
Options
Internal CLK
External CLK Source
External
XTAL
Is there a XTAL
connected to XIN and
XOUT?
LMP900xx will use the
No
internal clock
Connect an external
CLK source to the
XIN/CLK pin
Connect a XTAL
to XIN and XOUT
Yes
LMP900xx will
automatically use the
external CLK source
Set CLK_EXT_DET = 1 to
E\SDVVꢀWKHꢀ³([WHUQDO-Clock
'HWHFWLRQ´ꢀPRGH
LMP900xx will
automatically detect
and use the XTAL if
CLK_EXT_DET = 0
(default)
Set CLK_SEL = 0 to select
the internal clock
Figure 32. CLK Register Settings
The recommended value for the external CLK is discussed in the next sections.
Programmable ODRs
If using the internal CLK or external CLK of 3.5717 MHz, then the output date rates (ODR) can be selected
(using the ODR_SEL bit) as:
1. 13.42/8 = 1.6775 SPS
2. 13.42/4 = 3.355 SPS
3. 13.42/2 = 6.71SPS
4. 13.42 SPS
5. 214.65/8 = 26.83125 SPS
6. 214.65/4 = 53.6625 SPS
7. 214.65/2 = 107.325 SPS
8. 214.65 SPS (default)
If the internal CLK is not being used and the external CLK is not 3.5717 MHz, then the ODR will be different. If
this is the case, use the equation below to calculate the new ODR values.
ODR_Base1 = (CLKEXT) / (266,240)
(3)
(4)
(5)
(6)
ODR_Base2 = (CLKEXT) / (16,640)
ODR1 = (ODR_Base1) / n, where n = 1,2,4,8
ODR2 = (ODR_Base2) / n, where n = 1,2,4,8
For example, a 3.6864 MHz XTAL or external clock has the following ODR values:
ODR_Base1 = (3.6864 MHz) / (266,240) = 13.85 SPS
(7)
(8)
ODR_Base2 = (3.6864 MHz) / (16,640) = 221.54 SPS
ODR1 = (13.85 SPS) / n = 13.85, 6.92, 3.46, 1.73 SPS
(9)
ODR2 = (221.54 SPS) / n = 221.54, 110.77, 55.38, 27.69 SPS
(10)
The ODR is channel specific, which means that one channel can have one ODR, while another channel can
have the same or a different ODR.
20
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Note that these ODRs are meant for a single channel conversion; the ODR needs to be divided by n for n
channels scanning. For example, if the ADC were running at 214.65 SPS and four channels are being scanned,
then the ODR per channel would be 214.65/4 = 53.6625 SPS.
Digital Filter
The LMP90080-Q1 has a fourth order rotated sinc filter that is used to configure various ODRs and to reject
power supply frequencies of 50Hz and 60Hz. The 50/60 Hz rejection is only effective when the device is
operating at ODR ≤ 13.42 SPS. If the internal CLK or the external CLK of 3.5717 MHz is used, then the
LMP90080-Q1 will have the frequency response shown in Figure 33 through Figure 37.
0
1.6775 SPS
3.355 SPS
-20
-40
-60
-80
-100
-120
0
12
24
36
48
60
72
84
96
108
120
FREQUENCY (Hz)
Figure 33. Digital Filter Response, 1.6775 SPS and 3.355 SPS
0
-20
6.71 SPS
13.42 SPS
-40
-60
-80
-100
-120
0
12
24
36
48
60
72
84
96
108
120
FREQUENCY (Hz)
Figure 34. Digital Filter Response, 6.71 SPS and 13.42 SPS
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-60
13.42 SPS
-70
-80
-90
-100
-110
-120
45
47
49
51
53
55
57
59
61
63
65
FREQUENCY (Hz)
Figure 35. Digital Filter Response at 13.42 SPS
0
26.83125 SPS
53.6625 SPS
-40
-80
-120
0
200
400
600
800
1000
1200
1400
1600
1800
2000
FREQUENCY (Hz)
Figure 36. Digital Filter Response, 26.83125 SPS and 53.6625 SPS
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0
107.325 SPS
214.65 SPS
-40
-80
-120
0
200
400
600
800
1000
1200
1400
1600
1800
2000
FREQUENCY (Hz)
Figure 37. Digital Filter Response 107.325 SPS and 214.65 SPS
If the internal CLK is not being used and the external CLK is not 3.5717 MHz, then the filter response would be
the same as the response shown above, but the frequency will change according to the equation:
fNEW = [(CLKEXT) / 256 ] x (fOLD / 13.952k)
(11)
Using the equation above, an example of the filter response for a 3.5717 MHz XTAL versus a 3.6864 MHz XTAL
can be seen in Figure 38.
0
Crystal = 3.5717 MHz
Crystal = 3.6864 MHz
-20
-40
-60
-80
-100
-120
-140
40
45
50
55
60
65
70
FREQUENCY (Hz)
Figure 38. Digital Filter Response for a 3.5717MHz versus 3.6864 MHz XTAL
GPIO (D0–D6)
Pins D0-D6 are general purpose input/output (GPIO) pins that can be used to control external LEDs or switches.
Only a high or low value can be sourced to or read from each pin.
Figure 39 shows a flowchart how these GPIOs can be programmed.
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inputs
outputs
Pins
D0 ± D6 =
Set
Set
GPIO_DIRCNx = 0
GPIO_DIRCNx = 1
Read the
GPIO_DAT: Dx bit to
determine if Dx is
high or low, where
0 7 x 7 6.
Write to GPIO_DAT: Dx bit
to drive Dx high or low,
where 0 7 x 7 6.
Figure 39. GPIO Register Settings
Calibration
As seen in Figure 40, there are two types of calibration: background calibration and system calibration. These
calibrations are further described in the next sections.
Calibration
Background
calibration
System
calibration
Correction
Estimation
Offset
Gain
Figure 40. Types of Calibration
Background Calibration
Background calibration is the process of continuously determining and applying the offset and gain calibration
coefficients to the output codes to minimize the LMP90080-Q1’s offset and gain errors. Background calibration is
a feature built into the LMP90080-Q1 and is automatically done by the hardware without interrupting the input
signal.
Four differential channels, CH0-CH3, each with its own gain and ODRs, can be calibrated to improve the
accuracy.
Types of Background Calibration:
Figure 40 also shows that there are two types of background calibration:
1. Type 1: Correction - the process of continuously determining and applying the offset and gain calibration
coefficients to the output codes to minimize the LMP90080-Q1’s offset and gain errors.
This method keeps track of changes in the LMP90080-Q1's gain and offset errors due to changes in the
operating condition such as voltage, temperature, or time.
2. Type 2: Estimation - the process of determining and continuously applying the last known offset and gain
calibration coefficients to the output codes to minimize the LMP90080-Q1’s offset and gain errors.
The last known offset or gain calibration coefficients can come from two sources. The first source is the
default coefficient which is pre-determined and burnt in the device’s non-volatile memory. The second source
is from a previous calibration run of Type 1: Correction.
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The benefits of using type 2 calibration is a higher throughput, lower power consumption, and slightly better
noise. The exact savings would depend on the number of channels being scanned, and the ODR and gain of
each channel.
Using Background Calibration:
There are four modes of background calibration, which can be programmed using the BGCALCN bits. They are
as follows:
1. BgcalMode0: Background Calibration OFF
2. BgcalMode1: Offset Correction / Gain Estimation
3. BgcalMode2: Offset Correction / Gain Correction. Follow Figure 41 to set other appropriate registers when
using this mode.
4. BgcalMode3: Offset Estimation / Gain Estimation
Set
No
BGCALCN = 10b to
operate the device in
BgcalMode2
Is the channel
gain 8 16x?
Yes
Set CH_SCAN_SEL = 10b to
operate the device in
ScanMode2. Set FIRST_CH &
LAST_CH accordingly.
Set
FGA_BGCAL = 1 to
correct for FGA error
using the last known
coefficients.
No
Correct FGA
error?
Yes
Set FGA_BGCAL = 0 (default)
Figure 41. BgcalMode2 Register Settings
If operating in BgcalMode2, four channels (with the same ODR) are being converted, and FGA_BGCAL = 0
(default), then the ODR is reduced by:
1. 0.19% of 1.6775 SPS
2. 0.39% of 3.355 SPS
3. 0.78% of 6.71 SPS
4. 1.54% of 13.42 SPS
5. 3.03% of 26.83125 SPS
6. 5.88% of 53.6625 SPS
7. 11.11% of 107.325 SPS
8. 20% of 214.65 SPS
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System Calibration
The LMP90080-Q1 provides some unique features to support easy system offset and system gain calibrations.
The System Calibration Offset Registers (CHx_SCAL_OFFSET) hold the System Calibration Offset Coefficients
in 16-bit, two's complement binary format. The System Calibration Gain Registers (CHx_SCAL_GAIN) hold the
System Calibration Gain Coefficient in 16-bit, 1.15, unsigned, fixed-point binary format. For each channel, the
System Calibration Offset coefficient is subtracted from the conversion result prior to the division by the System
Calibration Gain coefficient.
A data-flow diagram of these coefficients can be seen in Figure 42.
Uncalibrated
VIN
Calibrated
ADC_DOUT
±
y
OFFSET
[CHx_SCAL_
OFFSET]
GAIN
[CHx_SCAL_
GAIN]
Figure 42. System Calibration Data-Flow Diagram
There are four distinct sets of System Calibration Offset and System Calibration Gain Registers for use with
CH0-CH3. CH4-CH6 reuse the registers of CH0-CH2, respectively.
The LMP90080-Q1 provides two system calibration modes that automatically fill the Offset and Gain coefficients
for each channel. These modes are the System Calibration Offset Coefficient Determination mode and the
System Calibration Gain Coefficient Determination mode. The System Calibration Offset Coefficient
Determination mode must be entered prior to the System Calibration Gain Coefficient Determination mode, for
each channel.
The system zero-scale condition is a system input condition (sensor loading) for which zero (0x0000) system-
calibrated output code is desired. It may not, however, cause a zero input voltage at the input of the ADC.
The system reference-scale condition is usually the system full-scale condition in which the system's input (or
sensor's loading) would be full-scale and the desired system-calibrated output code would be 0x8000 (unsigned
16-bit binary). However, system full-scale condition need not cause full-scale input voltage at the input of the
ADC.
The system reference-scale condition is not restricted to just the system full-scale condition. In fact, it can be any
arbitrary fraction of full-scale (up to 1.25 times) and the desired system-calibrated output code can be any
appropriate value (up to 0xA000). The CHx_SCAL_GAIN register must be written with the desired system-
calibrated output code (default:0x8000) before entering the System Calibration Gain Coefficient Determination
mode. This helps in in-place system calibration.
Below are the detailed procedures for using the System Calibration Offset Coefficient Determination and System
Calibration Gain Coefficient Determination modes.
System Calibration Offset Coefficient Determination mode
1. Apply system zero-scale condition to the channel (CH0/CH1/CH2/CH3).
2. Enter the System Calibration Offset Coefficient Determination mode by programming 0x1 in the SCALCN
register.
3. The LMP90080-Q1 starts a fresh conversion at the selected output data rate for the selected channel. At the
end of the conversion, the CHx_SCAL_OFFSET register is filled-in with the System Calibration Offset
coefficient.
4. The System Calibration Offset Coefficient Determination mode is automatically exited.
5. The computed calibration coefficient is accurate only to the effective resolution of the device and will
probably contain some noise. The noise factor can be minimized by computing over many times, averaging
(externally) and putting the resultant value back into the register. Alternatively, select the output data rate to
be 26.83 sps or 1.67 sps.
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System Calibration Gain Coefficient Determination mode
1. Repeat the System Calibration Offset Coefficient Determination to calibrate the System offset for the
channel.
2. Apply the system reference-scale condition to the channel CH0/CH1/CH2/CH3.
3. In the CHx_SCAL_GAIN register, program the expected (desired) system-calibrated output code for this
condition in 16-bit unsigned format.
4. Enter the System Calibration Gain Coefficient Determination mode by programming 0x3 in the SCALCN
register.
5. The LMP90080-Q1 starts a fresh conversion at the selected output data rate for the channel. At the end of
the conversion, the CHx_SCAL_GAIN is filled-in (or overwritten) with the System Calibration Gain coefficient.
6. The System Calibration Gain Coefficient Determination mode is automatically exited.
7. The computed calibration coefficient is accurate only to the effective resolution of the device and will
probably contain some noise. The noise factor can be minimized by computing over many times, averaging
(externally) and putting the resultant value back into the register. Alternatively, select the output data rate to
be 26.83 sps or 1.67 sps.
Post-calibration Scaling
The LMP90080-Q1 allows scaling (multiplication and shifting) for the System Calibrated result. This eases
downstream processing, if any. Multiplication is done using the System Calibration Scaling Coefficient in the
CHx_SCAL_SCALING register and shifting is done using the System Calibration Bits Selector in the
CHx_SCAL_BITS_SELECTOR register.
The System Calibration Bits Selector value should ideally be the logarithm (to the base 2) of the System
Calibration Scaling Coefficient value.
There are four distinct sets of System Calibration Scaling and System Calibration Bits Selector Registers for use
with CH0-CH3. CH4-CH6 reuse the registers of CH0-CH2, respectively.
A data-flow diagram of these coefficients can be seen in Figure 43.
System Calibrated
Code[15:0]
Scaled and Calibrated
ADC_DOUT
X
[20:0]
SCALING
[CHx_SCAL_
SCALING]
BITS SELECTOR
[CHx_SCAL_
BITS_SELECTOR]
Figure 43. Post-calibration Scaling Data-Flow Diagram
Channels Scan Mode
There are four scan modes. These scan modes are selected using the CH_SCAN: CH_SCAN_SEL bit. The first
scanned channel is FIRST_CH, and the last scanned channel is LAST_CH; they are both located in the
CH_SCAN register.
The CH_SCAN register is double buffered. That is, user inputs are stored in a slave buffer until the start of the
next conversion during which time they are transferred to the master buffer. Once the slave buffer is written,
subsequent updates are disregarded until a transfer to the master buffer happens. Hence, it may be appropriate
to check the CH_SCAN_NRDY bit before programming the CH_SCAN register.
ScanMode0: Single-Channel Continuous Conversion
The LMP90080-Q1 continuously converts the selected FIRST_CH.
Do not operate in this scan mode if gain ≥ 16 and the LMP90080-Q1 is running in background calibration modes
BgcalMode1 or BgcalMode2. If this is the case, then it is more suitable to operate the device in ScanMode2
instead.
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ScanMode1: Multiple-Channels Single Scan
The LMP90080-Q1 converts one or more channels starting from FIRST_CH to LAST_CH, and then enters the
stand-by state.
ScanMode2: Multiple-Channels Continuous Scan
The LMP90080-Q1 continuously converts one or more channels starting from FIRST_CH to LAST_CH, and then
it repeats this process.
ScanMode3: Multiple-Channels Continuous Scan with Burnout Currents
This mode is the same as ScanMode2 except that the burnout current is provided in a serially scanned fashion
(injected in a channel after it has undergone a conversion). Thus it avoids burnout current injection from
interfering with the conversion result for the channel.
The sensor diagnostic burnout currents are available for all four scan modes. The burnout current is further gated
by the BURNOUT_EN bit for each channel. ScanMode3 is the only mode that scans multiple channels while
injecting burnout currents without interfering with the signal. This is described in details in Burnout Currents.
Sensor Interface
The LMP90080-Q1 contains two excitation currents (IB1 & IB2) for sourcing external sensors, and two burnout
currents for sensor diagnostics. They are described in the next sections.
IB1 & IB2 - Excitation Currents
IB1 and IB2 can be used for providing currents to external sensors, such as RTDs or bridge sensors. 100µA to
1000µA, in steps of 100µA, can be sourced by programming the ADC_AUXCN: RTD_CUR_SEL bits.
Refer to 3–Wire RTD to see how IB1 and IB2 can be used to source a 3-wire RTD.
Burnout Currents
As shown in Figure 44, the LMP90080-Q1 contains two internal 10 µA burnout current sources, one sourcing
current from VA to VINP, and the other sinking current from VINN to ground. These currents are used for sensor
diagnostics and can be enabled for each channel using the CHx_INPUTCN: BURNOUT_EN bit.
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Burnout
Current = 10 PA
VIN0
VIN1
VIN2
VIN3
VINP
VINN
VIN4
VIN5
VIN6/VREFP2
VIN7/VREFN2
Burnout
Current = 10 PA
* VIN3, VIN4, VIN5 are only available for LMP90080 and LMP90079
Figure 44. Burnout Currents
Burnout Current Injection:
Burnout currents are injected differently depending on the channel scan mode selected.
When BURNOUT_EN = 1 and the device is operating in ScanMode0, 1, or 2, the burnout currents are injected
into all the channels for which the BURNOUT_EN bit is selected. This will cause problems and hence in this
mode, more than one channel should not have its BURNOUT_EN bit selected. Also, the burnout current will
interfere with the signal and introduce a fixed error depending on the particular external sensor.
When BURNOUT_EN = 1 and the device is operating in ScanMode3, burnout currents are injected into the last
sampled channel on a cyclical basis (Figure 45). In this mode, burnout currents injection is truly done in the
background without affecting the accuracy of the on-going conversion. Operating in this mode is recommended.
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Burnout Currents
BURNOUT_EN
CH0 is being sampled
CH0
CH0
CH1
CH1
CH2
CH3
BURNOUT_EN
CH2
CH3
CH1 is being sampled
BURNOUT_EN
CH0
CH0
CH1
CH1
CH2
CH2
CH3
CH2 is being sampled
CH3 is being sampled
BURNOUT_EN
CH3
Figure 45. Burnout Currents Injection for ScanMode3
Sensor Diagnostic Flags
Burnout currents can be used to verify that an external sensor is still operational before attempting to make
measurements on that channel. A non-operational sensor means that there is a possibility the connection
between the sensor and the LMP90080-Q1 is open circuited, short circuited, shorted to VA or GND, overloaded,
or the reference may be absent. The sensor diagnostic flags diagram can be seen in Figure 46.
RAILS_FLAG
Generator
RAILS_FLAG
OFLO_FLAGS
Overflow detection
Filter
VINP
VINN
ADC_DOUT
Modulator
FGA
BUFF
RAILS_FLAG
Generator
RAILS_FLAG
SENDIAG_THLDH
and SENDIAG_THLDL
SHORT_THLD_
FLAG
Figure 46. Sensor Diagnostic Flags Diagram
The sensor diagnostic flags are located in the SENDIAG_FLAGS register and are described in further details
below.
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SHORT_THLD_FLAG:
The short circuit threshold flag is used to report a short-circuit condition. It is set when the output voltage (VOUT
)
is within the absolute Vthreshold. Vthreshold can be programmed using the 8-bit SENDIAG_THLDH register.
For example, assume VREF = 5V, gain = 1, SENDIAG_THLD = 0xDA (218d). In this case, Vthreshold can be
calculated as:
Vthreshold = [(SENDIAG_THLD)(2)(VREF)] / [(Gain)(216)]
Vthreshold = [(218)(2)(5V)] / [(1)(216)]
Vthreshold = 33.3 mV
(12)
(13)
(14)
When (-33.3mV) ≤ VOUT ≤ (33.3mV), then SHORT_THLD_FLAG = 1; otherwise, SHORT_THLD_FLAG = 0.
RAILS_FLAG:
The rails flag is used to detect if one of the sampled channels is within 50mV of the rails potential (VA or VSS).
This can be further investigated to detect an open-circuit or short-circuit condition. If the sampled channel is near
a rail, then RAILS_FLAG = 1; otherwise, RAILS_FLAG = 0.
POR_AFT_LST_RD:
If POR_AFT_LST_READ = 1, then there was a power-on reset since the last time the SENDIAG_FLAGS register
was read. This flag's status is cleared when this bit is read, unless this bit is set again on account of another
power-on-reset event in the intervening period.
OFLO_FLAGS:
OFLO_FLAGS is used to indicate whether the modulator is over-ranged or under-ranged. The following
conditions are possible:
1. OFLO_FLAGS = 0x0: Normal Operation
2. OFLO_FLAGS = 0x1: The differential input is more than (±VREF/Gain) but is not more than ±(1.3*VREF/Gain)
to cause a modulator over-range.
3. OFLO_FLAGS = 0x2: The modulator was over-ranged towards +VREF/Gain.
4. OFLO_FLAGS = 0x3: The modulator was over-ranged towards −VREF/Gain.
The condition of OFLO_FLAGS = 10b or 11b can be used in conjunction with the RAILS_FLAG to determine the
fault condition.
SAMPLED_CH:
These three bits show the channel number for which the ADC_DOUT and SENDIAG_FLAGS are available. This
does not necessarily indicate the current channel under conversion because the conversion frame and
computation of results from the channels are pipelined. That is, while the conversion is going on for a particular
channel, the results for the previous conversion (of the same or a different channel) are available.
Serial Digital Interface
A synchronous 4-wire serial peripheral interface (SPI) provides access to the internal registers of LMP90080-Q1
via CSB, SCLK, SDI, SDO/DRDYB.
Register Address (ADDR)
All registers are memory-mapped. A register address (ADDR) is composed of an upper register address (URA)
and lower register address (LRA) as shown in Table 3. For example, ADDR 0x3A has URA=0x3 and LRA=0xA.
Table 3. ADDR Map
Bit
[6:4]
[3:0]
Name
URA
LRA
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Register Read/Write Protocol
Figure 47 shows the protocol how to write to or read from a register.
Transaction 1 sets up the upper register address (URA) where the user wants to start the register-write or
register-read.
Transaction 2 sets the lower register address (LRA) and includes the Data Byte(s), which contains the incoming
data from the master or outgoing data from the LMP90080-Q1.
Examples of register-reads or register-writes can be found in Register Read/Write Examples.
Transaction 1 ± URA Setup ± necessary only when the previous URA is different than the desired URA.
Upper Address Byte (UAB)
Instruction Byte 1 (INST1)
[7:0]
[7:3]
[2:0]
Upper Register
Address (URA)
0x0
RA/WAB
R/WB = Read/Write Address
0x10: Write Address
0x90: Read Address
Transaction 2 ± Data Access
Instruction Byte 2 (INST2)
Data Byte (s)
7
[6:5]
4
[3:0]
[N:0]
Lower Register
Address (LRA)
R/WB
SZ
0
Data Byte (s)
R/WB = Read/Write Data
0: Write Data
1: Read Data
SZ = Size
0x0: 1 byte
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 47. Register Read/Write Protocol
Streaming
When writing/reading 3+ bytes, the user must operate the device in Normal Streaming mode or Controlled
Streaming mode. In the Normal Streaming mode, which is the default mode, data runs continuously starting from
ADDR until CSB deasserts. This mode is especially useful when programming all the configuration registers in a
single transaction. See Normal Streaming Example for an example of the Normal Streaming mode.
In the Controlled Streaming mode, data runs continuously starting from ADDR until the data has run through all
(STRM_RANGE + 1) registers. For example, if the starting ADDR is 0x1C, STRM_RANGE = 5, then data will be
written to or read from the following ADDRs: 0x1C, 0x1D, 0x1E, 0x1F, 0x20, 0x21. Once the data reaches ADDR
0x21, LMP90080-Q1 will wrap back to ADDR 0x1C and repeat this process until CSB deasserts. See Controlled
Streaming Example for an example of the Controlled Streaming mode.
If streaming reaches ADDR 0x7F, then it will wrap back to ADDR 0x00. Furthermore, reading back the Upper
Register Address after streaming will report the Upper Register Address at the start of streaming, not the Upper
Register Address at the end of streaming.
To stream, write 0x3 to INST2’s SZ bits as seen in Figure 47. To select the stream type, program the
SPI_STREAMCN: STRM_TYPE bit. The STRM_RANGE can also be programmed in the same register.
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CSB - Chip Select Bar
An SPI transaction begins when the master asserts (active low) CSB and ends when the master deasserts
(active high) CSB. Each transaction might be separated by a subsequent one with a CSB deassertion, but this is
optional. Once CSB is asserted, it must not pulse (deassert and assert again) during a (desired) transaction.
CSB can be grounded in systems where the LMP90080-Q1 is the only SPI slave. This frees the software from
handling the CSB. Care has to be taken to avoid any false edge on SCLK, and while operating in this mode, the
streaming transaction should not be used because exiting from this mode can only be done through a CSB
deassertion.
SPI Reset
SPI Reset resets the SPI-Protocol State Machine by monitoring the SDI for at least 73 consecutive 1's at each
SCLK rising edge. After an SPI Reset, SDI is monitored for a possible Write Instruction at each SCLK rising
edge.
SPI Reset will reset the Upper Address Register (URA) to 0, but the register contents are not reset.
By default, SPI reset is disabled, but it can be enabled by writing 0x01 to SPI Reset Register (ADDR 0x02).
DRDYB - Data Ready Bar
DRDYB is a signal generated by the LMP90080-Q1 that indicates a fresh conversion data is available in the
ADC_DOUT registers.
DRDYB is automatically asserted every (1/ODR) second as seen in Figure 48. Before the next assertion, DRDYB
will pulse for tDRDYB second. The value for tDRDYB can be found in Timing Diagrams.
1/ODR
DRDYB:
t
DRDYB
. . .
SDO:
Figure 48. DRDYB Behavior
If ADC_DOUT is being read while a new ADC_DOUT becomes available, then the ADC_DOUT that is being
read is still valid (Figure 49). DRDYB will still be deasserted every 1/ODR second, but a consecutive read on the
ADC_DOUT register will fetch the newly converted data available.
1/ODR
1/ODR
ADC
Data 1
ADC
Data 2
D6 = drdyb
Valid
Valid
ADC_DOUT
(ADC Data 2)
ADC_DOUT
(ADC Data 1)
LSB
MSB
LSB
MSB
SDO
Figure 49. DRDYB Behavior for an Incomplete ADC_DOUT Reading
DRDYB can also be accessed via registers using the DT_AVAIL_B bit. This bit indicates when fresh conversion
data is available in the ADC_DOUT registers. If new conversion data is available, then DT_AVAIL_B = 0;
otherwise, DT_AVAIL_B = 1.
A complete reading for DT_AVAIL_B occurs when the MSB of ADC_DOUTH is read out. This bit cannot be reset
even if REG_AND_CNV_RST = 0xC3.
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DrdybCase1: Combining SDO/DRDYB with SDO_DRDYB_DRIVER = 0x00
uC
LMP900xx
SCLK
CSB
SDI
SCLK
CSB
MOSI
MISO
INT
SDO/
DRDYB
Figure 50. DrdybCase1 Connection Diagram
As shown in Figure 50, the drdyb signal and SDO can be multiplexed on the same pin as their functions are
mostly complementary. In fact, this is the default mode for the SDO/DRDYB pin.
Figure 51 shows a timing protocol for DrdybCase1. In this case, start by asserting CSB first to monitor a drdyb
assertion. When the drdyb signal asserts, begin writing the Instruction Bytes (INST1, UAB, INST2) to read from
or write to registers. Note that INST1 and UAB are omitted from the figure below because this transaction is only
required if a new UAB needs to be implemented.
While the CSB is asserted, DRDYB is driving the SDO/DRDYB pin unless the device is reading data, in which
case, SDO will be driving the pin. If CSB is deasserted, then the SDO/DRDYB pin is High-Z.
CSB
t
t
CL
1/f
SCLK
CH
4
1
2
3
5
6
7
8
9
10
11
12
13
14
15
16
17
n
SCLK
SDI
INST2
MSB
LSB
DRDYB is driving the pin
SDO is driving the pin
Data Byte (s)
MSB
LSB
SDO/
...
DRDYB
Figure 51. Timing Protocol for DrdybCase1
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DrdybCase2: Combining SDO/DRDYB with SDO_DRDYB_DRIVER = 0x03
SDO/DRDYB can be made independent of CSB by setting SDO_DRDYB_DRIVER = 0x03 in the SPI Handshake
Control register. In this case, DRDYB will drive the pin unless the device is reading data, independent of the
state of CSB. SDO will drive the pin when CSB is asserted and the device is reading data.
With this scheme, one can use SDO/DRDYB as a true interrupt source, independent of the state of CSB. But this
scheme can only be used when the LMP90080-Q1 is the only device connected to the master's SPI bus because
the SDO/DRDYB pin will be DRDYB even when CSB is deasserted.
The timing protocol for this case can be seen in Figure 52. When drdyb asserts, assert CSB to start the SPI
transaction and begin writing the Instruction Bytes (INST1, UAB, INST2) to read from or write to registers.
CSB
t
t
1/f
SCLK
CH
CL
1
4
5
6
7
8
9
10
11
12
13
14
15
16
17
n
SCLK
SDI
INST2
MSB
LSB
DRDYB is driving the pin
SDO is driving the pin
Data Byte (s)
SDO/
DRDYB
MSB
LSB
...
Figure 52. Timing Protocol for DrdybCase2
DrdybCase3: Routing DRDYB to D6
LMP900xx
uC
SCLK
CSB
SCLK
CSB
SDI
MOSI
MISO
SDO
D6 = DRDYB
Interrupt
Figure 53. DrdybCase3 Connection Diagram
The drdyb signal can be routed to pin D6 by setting SPI_DRDYB_D6 high and SDO_DRDYB_DRIVER to 0x4.
This is the behavior for DrdybCase3 as shown in Figure 53.
The timing protocol for this case can be seen in Figure 54. Since DRDYB is separated from SDO, it can be
monitored using the interrupt or polling method. If polled, the drdyb signal needs to be polled faster than tDRDYB to
detect a drdyb assertion. When drdyb asserts, assert CSB to start the SPI transaction and begin writing the
Instruction Bytes (INST1, UAB, INST2) to read from or write to registers.
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CSB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
n
SCLK
INST2
MSB
LSB
SDI
Drdyb = D6
...
Data Byte (s)
High-Z
SDO
MSB
LSB
Figure 54. Timing Protocol for DrdybCase3
Data Only Read Transaction
In a data only read transaction, one can directly access the data byte(s) as soon as the CSB is asserted without
having to send any instruction byte. This is useful as it brings down the latency as well as the overhead
associated with the instruction byte (as well as the Upper Address Byte, if any).
In order to use the data only transaction, the device must be placed in the data first mode. The following table
lists transaction formats for placing the device in and out of the data first mode and reading the mode status.
Table 4. Data First Mode Transactions
Bit[7]
Bits[6:5]
Bit[4]
Bits[3:0]
1010
Data Bytes
None
Enable Data First Mode Instruction
Disable Data First Mode Instruction
Read Mode Status Transaction
1
1
1
11
11
00
1
1
1
1011
None
1111
One
Note that while being in the data first mode, once the data bytes in the data only read transaction are sent out,
the device is ready to start on any normal (non-data-only) transaction including the Disable Data First Mode
Instruction. The current status of the data first mode (enabled/disabled status) can be read back using the Read
Mode Status Transaction. This transaction consists of the Read Mode Status Instruction followed by a single
data byte (driven by the device). The data first mode status is available on bit [1] of this data byte.
The data only read transaction allows reading up to eight consecutive registers, starting from any start address.
Usually, the start address will be the address of the most significant byte of conversion data, but it could just as
well be any other address. The start address and number of bytes to be read during the data only read
transaction can be programmed using the DATA_ONLY_1 AND DATA_ONLY_2 registers respectively.
The upper register address is unaffected by a data only read transaction. That is, it retains its setting even after
encountering a data only transaction. The data only transaction uses its own address (including the upper
address) from the DATA_ONLY_1 register. When in the data first mode, the SCLK must stop high before
entering the Data Only Read Transaction; this transaction should be completed before the next scheduled
DRDYB deassertion.
36
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Cyclic Redundancy Check (CRC)
CRC can be used to ensure integrity of data read from LMP90080-Q1. To enable CRC, set EN_CRC high. Once
CRC is enabled, the CRC value is calculated and stored in SPI_CRC_DAT so that the master device can
periodically read for data comparison. The CRC is automatically reset when CSB or DRDYB is deasserted.
The CRC polynomial is x8 + x5 + x4 + 1. The reset value of the SPI_CRC_DAT register is zero, and the final
value is ones-complemented before it is sent out. Note that CRC computation only includes the bits sent out on
SDO and does not include the bits of the SPI_CRC_DAT itself; thus it is okay to read SPI_CRC_DAT repeatedly.
The drdyb signal normally deasserts (active high) every 1/ODR second. However, this behavior can be changed
so that drdyb deassertion can occur after SPI_CRC_DAT is read, but not later than normal DRDYB deassertion
which occurs at every 1/ODR seconds. This is done by setting bit DRDYB_AFT_CRC high.
The timing protocol for CRC can be found in Figure 55.
1/ODR
1/ODR
Sampling CH0
Sampling CH1
D6 = drdyb
Reading
SPI_CRC_DAT
Reading
ADC_DOUT of CH1
Reading
SPI_CRC_DAT
Reading
ADC_DOUT of CH0
MSB
MSB
MSB
LSB
LSB
LSB
LSB
MSB
SDO
Figure 55. Timing Protocol for Reading SPI_CRC_DAT
If SPI_CRC_DAT read extends beyond the normal DRDYB deassertion at every 1/ODR seconds, then
CRC_RST has to be set in the SPI Data Ready Bar Control Register. This is done to avoid a CRC reset at the
DRDYB deassertion.Timing protocol for reading CRC with CRC_RST set is shown in Figure 56.
1/ODR
CH0
1/ODR
CH1
D6 = drdyb
Reading
SPI_CRC_DAT
Reading
ADC_DOUT of CH1
Reading
SPI_CRC_DAT
Reading
ADC_DOUT of CH0
MSB
LSB
LSB
MSB
LSB
MSB
LSB
MSB
SDO
Figure 56. Timing Protocol for Reading SPI_CRC_DAT beyond normal DRDYB deassertion at every
1/ODR seconds
Follow the steps below to enable CRC:
1. Set SPI_CRC_CN = 1 (register 0x13, bit 4) to enable CRC.
2. Set DRDYB_AFT_CRC = 1 (register 0x13, bit 2) to dessert the DRDYB after CRC.
3. Compute the CRC externally, which should include ADC_DOUTH and ADC_DOUTL.
4. Collect the data and verify the reported CRC matches with the computed CRC (step above).
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Power Management
The device can be placed in Active, Power-Down, or Stand-By state.
In Power-Down, the ADC is not converting data, contents of the registers are unaffected, and there is a drastic
power reduction. In Stand-By, the ADC is not converting data, but the power is only slightly reduced so that the
device can quickly transition into the active state if desired.
These states can be selected using the PWRCN register. When written, PWRCN brings the device into the
Active, Power-Down, or Stand-By state. When read, PWRCN indicates the state of the device.
The read value would confirm the write value after a small latency (approximately 15 µs with the internal CLK). It
may be appropriate to wait for this latency to confirm the state change. Requests not adhering to this latency
requirement may be rejected.
It is not possible to make a direct transition from the power-down state to the stand-by state. This state diagram
is shown below.
PWRCN
= 01b
PWRCN
= 11b
Active
PWRCN
= 00b
PWRCN
= 00b
Stand-by
Power-down
Figure 57. Active, Power-Down, Stand-by State Diagram
Reset and Restart
Writing 0xC3 to the REG_AND_CNV_RST field will reset the conversion and most of the programmable registers
to their default values. The only registers that will not be reset are the System Calibration Registers
(CHx_SCAL_OFFSET, CHx_SCAL_GAIN) and the DT_AVAIL_B bit.
If it is desirable to reset the System Calibration Coefficient Registers, then set RESET_SYSCAL = 1 before
writing 0xC3 to REG_AND_CNV_RST. If the device is operating in the “System Calibration Offset/Gain
Coefficient Determination” mode (SCALCN register), then write REG_AND_CNV_RST = 0xC3 twice to get out of
this mode.
After a register reset, any on-going conversions will be aborted and restarted. If the device is in the power-down
state, then a register reset will bring it out of the power-down state.
To restart a conversion, write 1 to the RESTART bit. This bit can be used to synchronize the conversion to an
external event.
After a restart conversion, the first sample is not valid. To restart with a valid first sample, issue a stand-by
command followed by an active command.
38
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APPLICATIONS INFORMATION
Quick Start
This section shows step-by-step instructions to configure the LMP90080-Q1 to perform a simple DC reading from
CH0.
1. Apply VA = VIO = VREFP1 = 5V, and ground VREFN1
2. Apply VINP = ¾VREF and VINN = ¼VREF for CH0. Thus, set CH0 = VIN = VINP - VINN = ½VREF (CH0_INPUTCN
register)
3. Set gain = 1 (CH0_CONFIG: GAIN_SEL = 0x0)
4. Exclude the buffer from the signal path (CH0_CONFIG: BUF_EN = 1)
5. Set the background to BgcalMode2 (BGCALCN = 0x2)
6. Select VREF1 (CH0_INPUTCN: VREF_SEL = 0)
7. To use the internal CLK, set CLK_EXT_DET = 1 and CLK_SEL = 0.
8. Follow the register read/write protocol (Figure 47) to capture ADC_DOUT from CH0.
Connecting the Supplies
VA and VIO
Any ADC architecture is sensitive to spikes on the analog voltage, VA, digital input/output voltage, VIO, and
ground pins. These spikes may originate from switching power supplies, digital logic, high power devices, and
other sources. To diminish these spikes, the LMP90080-Q1’s VA and VIO pins should be clean and well
bypassed. A 0.1 µF ceramic bypass capacitor and a 1 µF tantalum capacitor should be used to bypass the
LMP90080-Q1 supplies, with the 0.1 µF capacitor placed as close to the LMP90080-Q1 as possible.
Since the LMP90080-Q1 has both external VA and VIO pins, the user has two options on how to connect these
pins. The first option is to tie VA and VIO together and power them with the same power supply. This is the most
cost effective way of powering the LMP90080-Q1 but is also the least ideal because noise from VIO can couple
into VA and negatively affect performance. The second option involves powering VA and VIO with separate power
supplies. These supply voltages can have the same amplitude or they can be different.
VREF
Operation with VREF below VA is also possible with slightly diminished performance. As VREF is reduced, the
range of acceptable analog input voltages is also reduced. Reducing the value of VREF also reduces the size of
the LSB. When the LSB size goes below the noise floor of the LMP90080-Q1, the noise will span an increasing
number of codes and performance will degrade. For optimal performance, VREF should be the same as VA and
sourced with a clean source that is bypassed with a ceramic capacitor value of 0.1 µF and a tantalum capacitor
of 10 µF.
LMP90080-Q1 also allows ratiometric connection for noise immunity reasons. A ratiometric connection is when
the ADC’s VREFP and VREFN are used to excite the input device’s (i.e. a bridge sensor) voltage references. This
type of connection severely attenuates any VREF ripple seen the ADC output, and is thus strongly recommended.
ADC_DOUT Calculation
The output code of the LMP90080-Q1 can be calculated as:
§
¨
©
·
¸
¹
(VINP - VINN) x GAIN
VREFP - VREFN
15
(
)
x 2
ADC_DOUT
±
=
Output Code
(15)
ADC_DOUT is in 16−bit two's complement binary format. The largest positive value is 0x7FFF (or 32767 in
decimal), while the largest negative value is 0x8000 (or 32768 in decimal). In case of an over range the value is
automatically clamped to one of these two values.
Figure 58 shows the theoretical output code, ADC_DOUT, vs. analog input voltage, VIN, using the equation
above.
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ADC_DOUT
0x7FFF or 32767d
|
|
1d
(-VREF+1
LSB)
VIN
0xFFFF or -65535d
(VREF-1LSB)
0x8000 or -32768d
Figure 58. ADC_DOUT vs. VIN of a 16-Bit Resolution (VREF = 5.5V, Gain = 1).
Register Read/Write Examples
Writing to Register Examples
Using the register read/write protocol shown in Figure 47, the following example shows how to write three data
bytes starting at register address (ADDR) 0x1F. After the last byte has been written to ADDR 0x21, deassert
CSB to end the register-write.
Transaction 1 ± URA Setup ± necessary only when the previous URA is different than the desired URA.
Instruction Byte 1 (INST1)
[7:0]
Upper Address Byte (UAB)
[7:3]
[2:0]
0x1
0x0
0x10
R/WB = Read/Write Address
0x10: Write Address
0x90: Read Address
Transaction 2 ± Data Access
Data Bytes
[23:0]
Instruction Byte 2 (INST2)
[3:0]
7
0
[6:5]
4
st
nd
The 1 Data Byte will be written to ADDR 0x1F, the 2 Data Byte will
rd
0x2
0
0xF
be written to ADDR 0x20, and the 3 Data Byte will be written to ADR
0x21. After this process, deassert CSB.
R/WB = Read/Write Data
0: Write Data
SZ = Size
0x0: 1 byte
1: Read Data
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 59. Register-Write Example 1
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The next example shows how to write one data byte to ADDR 0x12. Since the URA for this example is the same
as the last example, transaction 1 can be omitted.
Transaction 2 ± Data Access
Instruction Byte 2 (INST2)
Data Byte (s)
7
0
[6:5]
4
[3:0]
[7:0]
0x00
0
0x2
One Data Byte will be written to ADDR 0x12. After this process, deassert CSB.
R/WB = Read/Write Data
0: Write Data
1: Read Data
SZ = Size
0x0: 1 byte
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 60. Register-Write Example 2
Reading from Register Example
The following example shows how to read two bytes. The first byte will be read from starting ADDR 0x24, and
the second byte will be read from ADDR 0x25.
Transaction 1 ± URA Setup ± necessary only when the previous URA is different than the desired URA.
Upper Address Byte (UAB)
Instruction Byte 1 (INST1)
[7:0]
[7:3]
[2:0]
0x0
0x2
0x10
R/WB = Read/Write Address
0x10: Write Address
0x90: Read Address
Transaction 2 ± Data Access
Instruction Byte 2 (INST2)
Data Bytes
7
1
[6:5]
4
[3:0]
[15:0]
2 Data Bytes will be read from ADDR 0x24 and ADDR 0x25.
After this process, deassert CSB.
0x1
0
0x4
R/WB = Read/Write Data
0: Write Data
1: Read Data
SZ = Size
0x0: 1 byte
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 61. Register-Read Example
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Streaming Examples
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Normal Streaming Example
This example shows how to write six data bytes starting at ADDR 0x28 using the Normal Streaming mode.
Because the default STRM_TYPE is the Normal Streaming mode, setting up the SPI_STREAMCN register can
be omitted.
Transaction 1 ± URA Setup ± necessary only when the previous URA is different than the desired URA.
Upper Address Byte (UAB)
Instruction Byte 1 (INST1)
[7:0]
[7:3]
[2:0]
0x0
0x2
0x10
R/WB = Read/Write Address
0x10: Write Address
0x90: Read Address
Transaction 2 ± Data Access
Instruction Byte 2 (INST2)
Data Bytes
7
0
[6:5]
4
[3:0]
[47:0]
st
nd
The 1 Data Byte will be written to ADDR 0x28, the 2 Data Byte will be
th
0x3
0
0x8
written to ADDR 0x29, etc. The last and 6 Data Byte will be written to
ADDR 0x2D. After this process, deassert CSB.
R/WB = Read/Write Data
0: Write Data
1: Read Data
SZ = Size
0x0: 1 byte
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 62. Normal Streaming Example
Controlled Streaming Example
This example shows how to read the 16-bit conversion data (ADC_DOUT) four times using the Controlled
Streaming mode. The ADC_DOUT registers consist of ADC_DOUTH at ADDR 0x1A and ADC_DOUTL at ADDR
0x1B.
The first step (Figure 63) sets up the SPI_STREAMCN register. This step enters the Controlled Streaming mode
by setting STRM_TYPE high in ADDR 0x03. Since two registers (ADDR 0x1A - 0x1B) need to be read, the
STRM_RANGE is 1.
42
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Transaction 1 ± URA Setup ± necessary only when the previous URA is different than the desired URA.
Upper Address Byte (UAB)
Instruction Byte 1 (INST1)
[7:0]
[7:3]
[2:0]
0x0
0x0
0x10
R/WB = Read/Write Address
0x10: Write Address
0x90: Read Address
Transaction 2 ± Data Access
Instruction Byte 2 (INST2)
Data Byte (s)
7
0
[6:5]
4
[3:0]
[7:0]
0x0
0
0x3
1000_0001b
R/WB = Read/Write Data
0: Write Data
1: Read Data
SZ = Size
0x0: 1 byte
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 63. Setting up SPI_STREAMCN
The next step shows how to perform the Controlled Streaming mode so that the master device will read
ADC_DOUT from ADDR 0x1A and 0x1B, then wrap back to ADDR 0x1A, and repeat this process for four times.
After this process, deassert CSB to end the Controlled Streaming mode.
Transaction 1 ± URA Setup ± necessary only when the previous URA is different than the desired URA.
Upper Address Byte (UAB)
Instruction Byte 1 (INST1)
[7:0]
[7:3]
[2:0]
0x0
0x1
0x10
R/WB = Read/Write Address
0x10: Write Address
0x90: Read Address
Transaction 2 ± Data Access
Instruction Byte 2 (INST2)
Data Byte (s)
7
1
[6:5]
4
[3:0]
[63:0]
Read ADC_DOUTH and ADC_DOUTL four times. After this process,
deassert CSB.
0x3
0
0xA
R/WB = Read/Write Data
0: Write Data
1: Read Data
SZ = Size
0x0: 1 byte
0x1: 2 bytes
0x2: 3 bytes
0x3: Streaming ± 3+ bytes until CSB is de-asserted
Figure 64. Controlled Streaming Example
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LMP90080-Q1
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Example Applications
3–Wire RTD
www.ti.com.cn
3V
VA
3V
+
+
0.1 PF
1 PF
0.1 PF
1 PF
VIO
SCLK
CSB
SDO
IB1 =
1 mA
IB1
SDI
drdyb = D6
VIN0
RLINE1
LMP90080
RTD
PT-100
RCOMP
= 0:
D5
IB2 =
1 mA
Microcontroller
VIN1
IB2
RLINE2
RLINE3
12 pF
VIN6/VREFP2
XOUT
RREF
XIN/CLK
VIN7/VREFN2
12 pF
Figure 65. Topology #1: 3-wire RTD Using 2 Current Sources
Figure 65 shows the first topology for a 3-wire resistive temperature detector (RTD) application. Topology #1
uses two excitation current sources, IB1 and IB2, to create a differential voltage across VIN0 and VIN1. As a
result of using both IB1 and IB2, only one channel (VIN0-VIN1) needs to be measured. As shown in Equation 16,
the equation for this channel is IB1 x (RTD – RCOMP) assuming that RLINE1 = RLINE2.
VIN0 = IB1 (RLINE1 + RTD) + (IB1 + IB2) (RLINE3 + RREF)
VIN1 = IB2 (RLINE2 + RCOMP) + (IB1 + IB2) (RLINE3 + RREF)
If RLINE1 = RLINE2, then:
VIN = (VIN0 - VIN1) = IB1 (RTD - RCOMP)
VIN Equation for Topology #1
(16)
The PT-100 changes linearly from 100 Ohm at 0°C to 146.07 Ohm at 120°C. If desired, choose a suitable
compensating resistor (RCOMP) so that VIN can be virtually 0V at any desirable temperature. For example, if
RCOMP = 100 Ohm, then at 0°C, VIN = 0V and thus a higher gain can be used.
The advantage of this circuit is its ratiometric configuration, where VREF = (IB1 + IB2) x (RREF). Equation 17
shows that a ratiometric configuration eliminates IB1 and IB2 from the output equation, thus increasing the
overall performance.
(
)
VIN Gain
n
(
)
2
ADC_DOUT
ADC_DOUT
ADC_DOUT
=
=
=
2VREF
(
)
Gain]
RTD - RCOMP
[IB1
n
(
)
2
)
(
)
2 IB1+IB2 RREF
(
>
)
Gain
RTD - RCOMP
@
n
(
2
( )
2 2
RREF
ADC_DOUT Showing IB1 & IB2 Elimination
(17)
44
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3V
VA
3V
+
+
0.1 PF
2.2 PF
1 PF
0.1 PF
VIO
SCLK
IB1 =
1 mA
CSB
SDO/DRDYB
SDI
IB1
RLINE1
VIN0
VIN1
Microcontroller
RTD
PT-100
LMP90080
D2
RLINE2
RLINE3
VIN6/VREFP2
VIN7/VREFN2
RREF
XIN/CLK
51:
Figure 66. Topology #2: 3-wire RTD Using 1 Current Source
Figure 66 shows the second topology for a 3-wire RTD application. Topology #2 shows the same connection as
topology #1, but without IB2. Although this topology eliminates a current source, it requires two channel
measurements as shown in Equation 18.
VIN0 = IB1 (RLINE1 + RTD + RLINE3 + RREF)
VIN1 = IB1 (RLINE3 + RREF)
VIN6 = IB1 (RREF)
CH0 = VIN0 - VIN1 = IB1 (RLINE1 + RTD)
CH1 = VIN1 - VIN6 = IB1 (RLINE3)
Assume RLINE1 = RLINE3, thus:
CH0 - CH1 = IB1 (RTD)
VIN Equation for Topology #2
(18)
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Thermocouple and IC Analog Temperature
5V
VA
2.7V
VIO
+
+
0.1 PF
1 PF
1 PF
0.1 PF
Thermocouple
Tcold
SCLK
VIN4
Thot
CSB
SDO
10 nF
+
VREFP1
TC [ VIN4 ± VIN3]
-
2.2 PF
2k
SDI
VIN3
2k
D6 = DRDYB
10 nF
LMP90080
Microcontroller
5V
LM94022
IC Temp
Sensor
Tcold
VIN5
+
+
1 PF
0.1 PF
LM [ VIN5]
-
VIN7
XOUT
5V
VREFP1
LM4140-4.1
+
0.1 PF
1 PF
0.1 PF
XIN/CLK
GND
Figure 67. Thermocouple with CJC
The LMP90080-Q1 is also ideal for thermocouple temperature applications. Thermocouples have several
advantages that make them popular in many industrial and medical applications. Compare to RTDs, thermistors,
and IC sensors, thermocouples are the most rugged, least expensive, and can operate over the largest
temperature range.
A thermocouple is a sensor whose junction generates a differential voltage, VIN, that is relative to the
temperature difference (Thot – Tcold). Thot is also known as the measuring junction or “hot” junction, which is
placed at the measured environment. Tcold is also known as the reference or “cold” junction, which is placed at
the measuring system environment.
Because a thermocouple can only measure a temperature difference, it does not have the ability to measure
absolute temperature. To determine the absolute temperature of the measured environment (Thot), a technique
known as cold junction compensation (CJC) must be used.
In a CJC technique, the “cold” junction temperature, Tcold, is sensed by using an IC temperature sensor, such as
the LM94022. The temperature sensor should be placed within close proximity of the reference junction and
should have an isothermal connection to the board to minimize any potential temperature gradients.
Once Tcold is obtained, use a standard thermocouple look-up-table to find its equivalent voltage. Next, measure
the differential thermocouple voltage and add the equivalent cold junction voltage. Lastly, convert the resulting
voltage to temperature using a standard thermocouple look-up-table.
For example, assume Tcold = 20°C. The equivalent voltage from a type K thermocouple look-up-table is 0.798
mV. Next, add the measured differential thermocouple voltage to the Tcold equivalent voltage. For example, if the
thermocouple voltage is 4.096 mV, the total would be 0.798 mV + 4.096 mV = 4.894 mV. Referring to the type K
thermocouple table gives a temperature of 119.37°C for 4.894 mV.
46
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Registers
1. If written to, RESERVED bits must be written to only 0 unless otherwise indicated.
2. Read back value of RESERVED bits and registers is unspecified and should be discarded.
3. Recommended values must be programmed and forbidden values must not be programmed where they are
indicated in order to avoid unexpected results.
4. If written to, registers indicated as Reserved must have the indicated default value as shown below. Any
other value can cause unexpected results.
Table 5. Register Map
Register Name
Reset Control
ADDR (URA & LRA)
0x00
Type
WO
Default
-
RESETCN
SPI_HANDSHAKECN
SPI_RESET
SPI_STREAMCN
Reserved
SPI Handshake Control
SPI Reset Control
SPI Stream Control
-
0x01
R/W
R/W
R/W
-
0x00
0x00
0x00
0x00
0x00
0x1A
0x02
-
0x02
0x03
0x04 - 0x07
0x08
PWRCN
Power Mode Control and Status
Data Only Read Control 1
Data Only Read Control 2
ADC Restart Conversion
-
RO & WO
R/W
R/W
WO
DATA_ONLY_1
DATA_ONLY_2
ADC_RESTART
Reserved
0x09
0x0A
0x0B
0x0C - 0x0D
0x0E
-
0x00
0x00
-
GPIO_DIRCN
GPIO_DAT
GPIO Direction Control
GPIO Data
R/W
RO & WO
R/W
R/W
R/W
R/W
R/W
-
0x0F
BGCALCN
Background Calibration Control
SPI Data Ready Bar Control
ADC Auxiliary Control
CRC Control
0x10
0x00
0x03
0x00
0x02
0x00
0x0000
0x00
-
SPI_DRDYBCN
ADC_AUXCN
SPI_CRC_CN
SENDIAG_THLD
Reserved
0x11
0x12
0x13
Sensor Diagnostic Threshold
-
0x14
0x15-0x16
0x17
SCALCN
System Calibration Control
ADC Data Available
Sensor Diagnostic Flags
Conversion Data 1 and 0
-
R/W
RO
ADC_DONE
SENDIAG_FLAGS
ADC_DOUT
Reserved
0x18
0x19
RO
-
0x1A - 0x1B
0x1C
RO
-
-
-
SPI_CRC_DAT
CRC Data
0x1D
RO & WO
-
CHANNEL CONFIGURATION REGISTERS
CH_STS
Channel Status
0x1E
0x1F
0x20
0x21
0X22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
0x2C
RO
0x00
0x30
0x01
0x70
0x13
0x70
0x25
0x70
0x37
0x70
0x01
0x70
0x13
0x70
0x25
CH_SCAN
Channel Scan Mode
CH0 Input Control
CH0 Configuration
CH1 Input Control
CH1 Configuration
CH2 Input Control
CH2 Configuration
CH3 Input Control
CH3 Configuration
CH4 Input Control
CH4 Configuration
CH5 Input Control
CH5 Configuration
CH6 Input Control
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CH0_INPUTCN
CH0_CONFIG
CH1_INPUTCN
CH1_CONFIG
CH2_INPUTCN
CH2_CONFIG
CH3_INPUTCN
CH3_CONFIG
CH4_INPUTCN
CH4_CONFIG
CH5_INPUTCN
CH5_CONFIG
CH6_INPUTCN
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Table 5. Register Map (continued)
Register Name
ADDR (URA & LRA)
Type
R/W
-
Default
0x70
CH6_CONFIG
Reserved
CH6 Configuration
-
0x2D
0x2E - 0x2F
0x00
SYSTEM CALIBRATION REGISTERS
CH0_SCAL_OFFSET
Reserved
CH0 System Calibration Offset Coefficients
0x30 - 0x31
0x32
R/W
-
0x0000
0x00
-
CH0_SCAL_GAIN
Reserved
CH0 System Calibration Gain Coefficients
0x33 - 0x34
0x35
R/W
-
0x8000
0x00
-
CH0_SCAL_SCALING
CH0 System Calibration Scaling Coefficients
0x36
R/W
0x01
CH0_SCAL_BITS_
SELECTOR
CH0 System Calibration Bit Selector
0x37
R/W
0x00
CH1_SCAL_OFFSET
Reserved
CH1 System Calibration Offset Coefficients
0x38 - 0x39
0x3A
R/W
-
0x0000
0x00
-
CH1_SCAL_GAIN
Reserved
CH1 System Calibration Gain Coefficient
0x3B - 0x3C
0x3D
R/W
-
0x8000
0x00
-
CH1_SCAL_SCALING
CH1 System Calibration Scaling Coefficients
0x3E
R/W
0x01
CH1_SCAL_BITS_SELECT
OR
CH1 System Calibration Bit Selector
0x3F
0x40 - 0x41
0x42
R/W
R/W
-
0x00
0x0000
0x00
CH2_SCAL_OFFSET
Reserved
CH2 System Calibration Offset Coefficients
-
CH2_SCAL_GAIN
Reserved
CH2 System Calibration Gain Coefficient
0x43 - 0x44
0x45
R/W
-
0x8000
0x00
-
CH2_SCAL_SCALING
CH2 System Calibration Scaling Coefficients
0x46
R/W
0x01
CH2_SCAL_BITS_
SELECTOR
CH2 System Calibration Bit Selector
0x47
R/W
0x00
CH3_SCAL_OFFSET
Reserved
CH3 System Calibration Offset Coefficients
0x48 - 0x49
0x4A
R/W
-
0x0000
0x00
-
CH3_SCAL_GAIN
Reserved
CH3 System Calibration Gain Coefficient
0x4B - 0x4C
0x4D
R/W
-
0x8000
0x00
-
CH3_SCAL_SCALING
CH3 System Calibration Scaling Coefficients
0x4E
R/W
0x01
CH3_SCAL_BITS_
SELECTOR
CH3 System Calibration Bit Selector
-
0x4F
R/W
-
0x00
0x00
Reserved
0x50 - 0x7F
Power and Reset Registers
Table 6. RESETCN
Reset Control (Address 0x00)
Bit Bit Symbol
Bit Description
Register and Conversion Reset0xC3: Register and conversion reset
Others: Neglected
[7:0] REG_AND_CNV_ RST
Table 7. SPI_RESET
SPI Reset Control (Address 0x02)
Bit Description
Bit Bit Symbol
SPI Reset Enable
[0] SPI_ RST
0x0 (default): SPI Reset Disabled
0x1: SPI Reset Enabled(1)
(1) Once written, the contents of this register are sticky. That is, the content of this register cannot be changed with subsequent write.
However, a Register reset clears the register as well as the sticky status.
48
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Table 8. PWRCN
Power Mode Control and Status (Address 0x08)
Bit Bit Symbol
Bit Description
[7:2] Reserved
-
Power Control
Write Only – power down mode control
0x0: Active Mode
0x1: Power-down Mode
0x3: Stand-by Mode
[1:0] PWRCN
Read Only – the present mode is:
0x0 (default): Active Mode
0x1: Power-down Mode
0x3: Stand-by Mode
ADC Registers
Table 9. ADC_RESTART
ADC Restart Conversion (Address 0x0B)
Bit Bit Symbol
Bit Description
[7:1] Reserved
-
Restart conversion
0
RESTART
1: Restart conversion.
Table 10. ADC_AUXCN
ADC Auxiliary Control (Address 0x12)
Bit Bit Symbol
Bit Description
7
Reserved
-
The System Calibration registers (CHx_SCAL_OFFSET and CHx_SCAL_GAIN) are:
0 (default): preserved even when "REG_AND_CNV_ RST" = 0xC3.
1: reset by setting "REG_AND_CNV_ RST" = 0xC3.
6
RESET_SYSCAL
External clock detection
5
4
CLK_EXT_DET
CLK_SEL
0 (default): "External Clock Detection" is operational
1: "External-Clock Detection" is bypassed
Clock select – only valid if CLK_EXT_DET = 1
0 (default): Selects internal clock
1: Selects external clock
Selects RTD Current as follows:
0x0 (default): 0 µA
0x1: 100 µA
0x2: 200 µA
0x3: 300 µA
0x4: 400 µA
[3:0] RTD_CUR_SEL
0x5: 500 µA
0x6: 600 µA
0x7: 700 µA
0x8: 800 µA
0x9: 900 µA
0xA: 1000 µA
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Table 11. ADC_DONE
ADC Data Available (Address 0x18)
Bit Bit Symbol
Bit Description
Data Available – indicates if new conversion data is available
0x00 − 0xFE: Available
[7:0] DT_AVAIL_B
0xFF: Not available
Table 12. ADC_DOUT(1)
16-bit Conversion Data (two’s complement) (Address 0x1A - 0x1B)
Address
0x1A
Name
Register Description
ADC Conversion Data [15:8]
ADC Conversion Data [7:0]
Reserved
ADC_DOUTH
ADC_DOUTL
Reserved
0x1B
0x1C
(1) Repeat reads of these registers are allowed as long as such reads are spaced apart by at least 72 µs.
Channel Configuration Registers
Table 13. CH_STS
Channel Status (Address 0x1E)
Bit Bit Symbol
Bit Description
[7:2] Reserved
-
Channel Scan Not Ready – indicates if it is okay to program CH_SCAN
0: Update not pending, CH_SCAN register is okay to program
1: Update pending, CH_SCAN register is not ready to be programmed
1
0
CH_SCAN_NRDY
Invalid or Repeated Read Status
INV_OR_RPT_RD_STS
0: ADC_DOUT just read was valid and hitherto unread
1: ADC_DOUT just read was either invalid (not ready) or there was a repeated read.
Table 14. CH_SCAN(1)
Channel Scan Mode (Address 0x1F)
Bit Description
Bit Bit Symbol
Channel Scan Select
0x0 (default): ScanMode0: Single-Channel Continuous Conversion
0x1: ScanMode1: One or more channels Single Scan
0x2: ScanMode2: One or more channels Continuous Scan
0x3: ScanMode3: One or more channels Continuous Scan with Burnout Currents
[7:6] CH_SCAN_SEL
Last channel for conversion
0x0: CH0
0x1: CH1
0x2: CH2
[5:3] LAST_CH
0x3: CH3
0x4: CH4
0x5: CH5
0x6 (default): CH6(2)
(1) While writing to the CH_SCAN register, if 0x7 is written to FIRST_CH or LAST_CH the write to the entire CH_SCAN register is ignored.
(2) LAST_CH cannot be smaller than FIRST_CH. For example, if LAST_CH = CH5, then FIRST_CH cannot be CH6. If 0x7 is written it is
ignored.
50
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Table 14. CH_SCAN(1) (continued)
Channel Scan Mode (Address 0x1F)
Bit Bit Symbol
Bit Description
Starting channel for conversion
0x0 (default): CH0
0x1: CH1
0x2: CH2
[2:0] FIRST_CH
0x3: CH3
0x4: CH4
0x5: CH5
0x6: CH6(3)
(3) FIRST_CH cannot be greater than LAST_CH. For example, if FIRST_CH = CH1, then LAST_CH cannot be CH0. If 0x7 is written it is
ignored.
Table 15. CHx_INPUTCN
Channel Input Control
Register Address (hex): CH0: 0x20, CH1: 0X22, CH2: 0x24, CH3: 0x26, CH4: 0x28, CH5: 0x2A, CH6: 0x2C
Bit
Bit Symbol
Bit Description
Enable sensor diagnostic
7
BURNOUT_EN
0 (default): Disable Sensor Diagnostics current injection for this Channel
1: Enable Sensor Diagnostics current injection for this Channel
Select the reference
6
VREF_SEL
0 (Default): Select VREFP1 and VREFN1
1: Select VREFP2 and VREFN2
Positive input select
0x0: VIN0
0x1: VIN1
0x2: VIN2
[5:3] VINP
0x3: VIN3
0x4: VIN4
0x5: VIN5
0x6: VIN6
0x7: VIN7(1)
Negative input select
0x0: VIN0
0x1: VIN1
0x2: VIN2
[2:0] VINN
0x3: VIN3
0x4: VIN4
0x5: VIN5
0x6: VIN6
0x7: VIN7(1)
(1) To see the default values for each channel, refer to the table below.
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Table 16. Default VINx for CH0-CH6
VINP
VIN0
VIN2
VIN4
VIN6
VIN0
VIN2
VIN4
VINN
VIN1
VIN3
VIN5
VIN7
VIN1
VIN3
VIN5
CH0
CH1
CH2
CH3
CH4
CH5
CH6
Table 17. CHx_CONFIG
Channel Configuration
Register Address (hex): CH0: 0x21, CH1: 0x23, CH2: 0x25, CH3: 0x27, CH4: 0x29, CH5: 0x2B, CH6: 0x2D
Bit Bit Symbol
Reserved
Bit Description
7
-
ODR Select
0x0: 13.42 / 8 = 1.6775 SPS
0x1: 13.42 / 4 = 3.355 SPS
0x2: 13.42 / 2 = 6.71 SPS
0x3: 13.42 SPS
[6:4] ODR_SEL
0x4: 214.65 / 8 = 26.83125 SPS
0x5: 214.65 / 4 = 53.6625 SPS
0x6: 214.65 / 2 = 107.325 SPS
0x7(default): 214.65 SPS
Gain Select
0x0 (default): 1 (FGA OFF)
0x1: 2 (FGA OFF)
0x2: 4 (FGA OFF)
[3:1] GAIN_SEL
0x3: 8 (FGA OFF)
0x4: 16 (FGA ON)
0x5: 32 (FGA ON)
0x6: 64 (FGA ON)
0x7: 128 (FGA ON)
Enable/Disable the buffer
0 (default): Include the buffer in the signal path
1: Exclude the buffer from the signal path(1)
0
BUF_EN
(1) When gain ≥ 16, the buffer is automatically included in the signal path irrespective of this bit.
Calibration Registers
Table 18. BGCALCN
Background Calibration Control (Address 0x10)
Bit Bit Symbol
Bit Description
[7:2] Reserved
-
Background calibration control – selects scheme for continuous background calibration.
0x0 (default): BgcalMode0: Background Calibration OFF
0x1: BgcalMode1: Offset Correction / Gain Estimation
[1:0] BGCALN
0x2: BgcalMode2: Offset Correction / Gain Correction
0x3: BgcalMode3: Offset Estimation / Gain Estimation
52
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Table 19. SCALCN
System Calibration Control (Address 0x17)
Bit Bit Symbol
Bit Description
[7:2] Reserved
-
System Calibration Control
When written, set SCALCN to:
0x0 (default): Normal Mode
0x1: “System Calibration Offset Coefficient Determination” mode
0x2: “System Calibration Gain Coefficient Determination” mode
0x3: Reserved
[1:0] SCALCN
When read, this bit indicates the system calibration mode is in:
0x0: Normal Mode
0x1: "System Calibration Offset Coefficient Determination" mode
0x2: "System Calibration Gain Coefficient Determination" mode
0x3: Reserved(1)
(1) When read, this bit will indicate the current System Calibration status. Since this coefficient determination mode will only take 1
conversion cycle, reading this register will only return 0x00, unless this register is read within 1 conversion window.
Table 20. CHx_SCAL_OFFSET
CH0-CH3 System Calibration Offset Registers (Two's-Complement)
ADDR
Name
Description
CH0
0x30
0x31
0x32
CH1
0x38
0x39
CH2
0x40
0x41
CH3
0x48
0x49
CHx_SCAL_OFFSETH
CHx_SCAL_OFFSETM
System Calibration Offset Coefficient Data [15:8]
System Calibration Offset Coefficient Data [7:0]
-
0x3A 0x42
0x4A Reserved
Table 21. CHx_SCAL_GAIN
CH0-CH3 System Calibration Gain Registers (Fixed Point 1.23 Format)
ADDR
Name
Description
CH0
0x33
0x34
0x35
CH1
CH2
CH3
0x3B 0x43
0x3C 0x44
0x3D 0x45
0x4B CHx_SCAL_GAINH
0x4C CHx_SCAL_GAINL
0x4D Reserved
System Calibration Gain Coefficient Data [15:8]
System Calibration Gain Coefficient Data [7:0]
-
Table 22. CHx_SCAL_SCALING
CH0-CH3 System Calibration Scaling Coefficient Registers
ADDR
Name
Description
CH0
CH1
CH2
CH3
0x36
0x3E 0x46
0x4E CHx_SCAL_SCALING
System Calibration Scaling Coefficient Data [5:0]
Table 23. CHx_SCAL_BITS_SELECTOR
CH0-CH3 System Calibration Bit Selector Registers
ADDR
Name
Description
CH0
CH1
CH2
CH3
0x37
0x3F
0x47
0x4F
CHx_SCAL_BITS_SELECTOR
System Calibration Bit Selection Data [2:0]
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Sensor Diagnostic Registers
Table 24. SENDIAG_THLD
Sensor Diagnostic Threshold (Address 0x14)
Register Description
Address
Name
0x14
SENDIAG_THLD
Sensor Diagnostic threshold
Table 25. SENDIAG_FLAGS
Sensor Diagnostic Flags (Address 0x19)
Bit Bit Symbol
Bit Description
Short Circuit Threshold Flag = 1 when the absolute value of VOUT is within the absolute threshold
voltage set by the SENDIAG_THLD register.
7
6
5
SHORT_THLD_ FLAG
RAILS_FLAG
Rails Flag = 1 when at least one of the inputs is near rail (VA or GND).
Power-on-reset after last read = 1 when there was a power-on-reset event since the last time the
SENDIAG_FLAGS register was read.
POR_AFT_LST_RD
Overflow flags
0x0: Normal operation
0x1: The modulator was not overranged, but ADC_DOUT got clamped to 0x7f_ffff (positive
fullscale) or 0x80_0000 (negative full scale)
[4:3] OFLO_FLAGS
0x2: The modulator was over-ranged (VIN > 1.2*VREF/GAIN)
0x3: The modulator was over-ranged (VIN < -1.2*VREF/GAIN)
Channel Number – the sampled channel for ADC_DOUT and SENDIAG_FLAGS.
[2:0] SAMPLED_CH
SPI Registers
Table 26. SPI_HANDSHAKECN
SPI Handshake Control (Address 0x01)
Bit Bit Symbol
Bit Description
[7:4] Reserved
-
SDO/DRDYB Driver – sets who is driving the SDO/DRYB pin
Whenever CSB is
Asserted and the Device
is Not Reading
ADC_DOUT
Whenever CSB is
Asserted and the Device
is Reading ADC_DOUT
CSB is Deasserted
[3:1] SDO_DRDYB_ DRIVER
0x0 (default)
0x3
SDO is driving
SDO is driving
SDO is driving
Forbidden
DRDYB is driving
DRDYB is driving
High-Z
High-Z
DRDYB is driving
High-Z
0x4
Others
Switch-off trigger - refers to the switching of the output drive from the slave to the master.
0 (default): SDO will be high-Z after the last (16th, 24th, 32nd, etc) rising edge of SCLK. This
option allows time for the slave to transfer control back to the master at the end of the frame.
0
SW_OFF_TRG
1: SDO’s high-Z is postponed to the subsequent falling edge following the last (16th, 24th, 32nd,
etc) rising edge of SCLK. This option provides additional hold time for the last bit, DB0, in non-
streaming read transfers.
Table 27. SPI_STREAMCN
SPI Streaming Control (Address 0x03)
Bit Description
Bit Bit Symbol
Stream type
7
STRM_TYPE
0 (default): Normal Streaming mode
1: Controlled Streaming mode
Stream range – selects Range for Controlled Streaming mode
[6:0] STRM_ RANGE
Default: 0x00
54
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Table 28. DATA_ONLY_1
Data Only Read Control 1 (Address 0x09)
Bit Bit Symbol
Bit Description
7
Reserved
-
Start address for the Data Only Read Transaction
[6:0] DATA_ONLY_ADR
Default: 0x1A
Please refer to the description of DT_ONLY_SZ in Table 29 register.
Table 29. DATA_ONLY_2
Data Only Read Control 2 (Address 0x0A)
Bit Bit Symbol
Bit Description
[7:3] Reserved
-
[2:0]
Number of bytes to be read out in Data Only mode. A value of 0x0 means read one byte and 0x7
means read 8 bytes.
DATA_ONLY_SZ
Default: 0x2
Table 30. SPI_DRDYBCN
SPI Data Ready Bar Control (Address 0x11)
Bit Description
Bit Bit Symbol
Enable DRDYB on D6
0 (default): D6 is a GPIO
1: D6 = drdyb signal
-
7
6
SPI_DRDYB_D6
Reserved
CRC Reset
5
4
CRC_RST
Reserved
0 (default): Enable CRC reset on DRDYB deassertion
1: Disbale CRC reset on DRDYB deassertion
-
Gain background calibration
0 (default): Correct FGA gain error. This is useful only if the device is operating in BgcalMode2
and ScanMode2 or ScanMode3.
3
FGA_BGCAL
1: Correct FGA gain error using the last known coefficients.
[2:0] Reserved
Default - 0x3 (do not change this value)
Table 31. SPI_CRC_CN
CRC Control (Address 0x13)
Bit Bit Symbol
Bit Description
[7:5] Reserved
-
Enable CRC
4
3
2
EN_CRC
0 (default): Disable CRC
1: Enable CRC
Reserved
Default - 0x0 (do not change this value)
DRDYB After CRC
DRDYB_AFT_CRC
0 (default): DRDYB is deasserted (active high) after ADC_DOUTL is read.
1: DRDYB is deasserted after SPI_CRC_DAT (which follows ADC_DOUTL), is read.
[1:0] Reserved
-
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Table 32. SPI_CRC_DAT
CRC Data (Address 0x1D)
Bit Bit Symbol
Bit Description
CRC Data
When written, this register reset CRC:
Any Value: Reset CRC
[7:0] CRC_DAT
When read, this register indicates the CRC data.
GPIO Registers
Table 33. GPIO_DIRCN
GPIO Direction (Address 0x0E)
Bit Bit Symbol
Bit Description
7
Reserved
-
GPIO direction control – these bits are used to control the direction of each General Purpose
Input/Outputs (GPIO) pins D0 - D6.
0 (default): Dx is an Input
x
GPIO_DIRCNx
1: Dx is an Output
where 0 ≤ x ≤ 6
For example, writing a 1 to bit 6 means D6 is an Output.(1)
(1) If D6 is used for DRDYB, then it cannot be used for GPIO.
Table 34. GPIO_DAT
GPIO Data (Address 0x0F)
Bit Description
Bit Bit Symbol
7
Reserved
-
Write Only - when GPIO_DIRCNx = 0
0: Dx is LO
1: Dx is HI
Read Only - when GPIO_DIRCNx = 1
0: Dx driven LO
1: Dx driven HI
where 0 ≤ x ≤ 6
x
Dx
For example, writing a 0 to bit 4 means D4 is LO.
It is okay to Read the GPIOs that are configured as outputs and write to GPIOs that are configured
as inputs. Reading the GPIOs that are outputs would return the current value on those GPIOs, and
writing to the GPIOs that are inputs are neglected.
56
Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
REVISION HISTORY
Changes from Revision (May 2013) to Revision A
Page
•
•
Deleted CH_STS and ADC_DOUTM from the sentence: Compute the CRC externally... ................................................ 37
Added sentence to the end of the RESET and RESTART section .................................................................................... 38
Copyright © 2013–2014, Texas Instruments Incorporated
57
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMP90080QMH/NOPB
LMP90080QMHE/NOPB
LMP90080QMHX/NOPB
ACTIVE
HTSSOP
HTSSOP
HTSSOP
PWP
28
28
28
48
RoHS & Green
RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 150
-40 to 150
-40 to 150
LMP90080Q
MH
ACTIVE
ACTIVE
PWP
250
SN
SN
LMP90080Q
MH
PWP
2500 RoHS & Green
LMP90080Q
MH
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMP90080QMHE/NOPB HTSSOP PWP
LMP90080QMHX/NOPB HTSSOP PWP
28
28
250
178.0
330.0
16.4
16.4
6.8
6.8
10.2
10.2
1.6
1.6
8.0
8.0
16.0
16.0
Q1
Q1
2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMP90080QMHE/NOPB
LMP90080QMHX/NOPB
HTSSOP
HTSSOP
PWP
PWP
28
28
250
208.0
356.0
191.0
356.0
35.0
35.0
2500
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
PWP HTSSOP
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LMP90080QMH/NOPB
28
48
495
8
2514.6
4.06
Pack Materials-Page 3
PACKAGE OUTLINE
PWP0028A
PowerPADTM - 1.1 mm max height
S
C
A
L
E
1
.
8
0
0
PLASTIC SMALL OUTLINE
C
6.6
6.2
TYP
SEATING PLANE
A
PIN 1 ID
AREA
0.1 C
26X 0.65
28
1
9.8
9.6
NOTE 3
2X
8.45
14
B
15
0.30
0.19
28X
1.1 MAX
4.5
4.3
0.1
C A
B
NOTE 4
0.20
0.09
TYP
SEE DETAIL A
3.15
2.75
0.25
GAGE PLANE
5.65
5.25
0.10
0.02
THERMAL
PAD
0 - 8
0.7
0.5
DETAIL A
(1)
TYPICAL
4214870/A 10/2014
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MO-153, variation AET.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0028A
PowerPADTM - 1.1 mm max height
PLASTIC SMALL OUTLINE
(3.4)
NOTE 9
(3)
SOLDER
MASK
OPENING
SOLDER MASK
DEFINED PAD
28X (1.5)
28X (1.3)
28X (0.45)
28X (0.45)
1
28
26X
(0.65)
SYMM
(5.5)
(9.7)
SOLDER
MASK
OPENING
(1.3) TYP
14
15
(
0.2) TYP
(1.3)
SEE DETAILS
(0.65) TYP
(0.9) TYP
(6.1)
VIA
SYMM
METAL COVERED
BY SOLDER MASK
HV / ISOLATION OPTION
0.9 CLEARANCE CREEPAGE
OTHER DIMENSIONS IDENTICAL TO IPC-7351
(5.8)
IPC-7351 NOMINAL
0.65 CLEARANCE CREEPAGE
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214870/A 10/2014
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0028A
PowerPADTM - 1.1 mm max height
PLASTIC SMALL OUTLINE
(3)
BASED ON
0.127 THICK
STENCIL
METAL COVERED
BY SOLDER MASK
28X (1.5)
28X (1.3)
28X (0.45)
1
28
26X (0.65)
28X (0.45)
(5.5)
SYMM
BASED ON
0.127 THICK
STENCIL
14
15
SEE TABLE FOR
DIFFERENT OPENINGS
SYMM
(6.1)
FOR OTHER STENCIL
THICKNESSES
(5.8)
HV / ISOLATION OPTION
0.9 CLEARANCE CREEPAGE
OTHER DIMENSIONS IDENTICAL TO IPC-7351
IPC-7351 NOMINAL
0.65 CLEARANCE CREEPAGE
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
3.55 X 6.37
3.0 X 5.5 (SHOWN)
2.88 X 5.16
0.127
0.152
0.178
2.66 X 4.77
4214870/A 10/2014
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
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Copyright © 2022，德州仪器 (TI) 公司
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