LMT01DQXR [TI]
精度为 0.5°C 且具有脉冲序列接口的双引脚温度传感器 | DQX | 2 | -50 to 150;
| 型号： | LMT01DQXR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 精度为 0.5°C 且具有脉冲序列接口的双引脚温度传感器 | DQX | 2 | -50 to 150 温度传感 脉冲 传感器 温度传感器 |
| 文件： | 总27页 (文件大小：974K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LMT01
SNIS189A –JUNE 2015–REVISED JUNE 2015
LMT01 0.5°C Accurate 2-Pin Digital Output Temperature Sensor with Pulse Count
Interface
1 Features
3 Description
The LMT01 is a high-accuracy, 2-pin temperature
sensor with an easy-to-use pulse count interface
which makes it an ideal digital replacement for PTC
or NTC thermistors both on and off board in
automotive, industrial, and consumer markets. The
LMT01 digital pulse count output and high accuracy
over a wide temperature range allow pairing with any
MCU without concern for integrated ADC quality or
availability, while minimizing software overhead. TI’s
LMT01 achieves flat ±0.5°C accuracy with very fine
resolution (0.0625°C) over a wide temperature range
of -20°C to 90°C without system calibration or
hardware/software compensation.
1
•
High Accuracy Over –50°C to 150°C Wide
Temperature Range
–
–
–
–20°C to 90°C: ±0.5°C (max)
90°C to 150°C: ±0.62°C (max)
–50°C to –20°C: ±0.7°C (max)
•
•
•
Precision Digital Temperature Measurement
Simplified in a 2-Pin Package
Single-wire Pulse Count Digital Output Easily
Read with Processor Timer Input
Number of Output Pulses is Proportional to
Temperature with 0.0625°C Resolution
Unlike other digital IC temperature sensors, LMT01’s
single wire interface is designed to directly interface
with a GPIO or comparator input, thereby simplifying
hardware implementation. Similarly, the LMT01's
integrated EMI suppression and simple 2-pin
architecture makes it ideal for on-board and off-board
temperature sensing. The LMT01 offers all the
simplicity of analog NTC or PTC thermistors with the
added benefits of a digital interface, wide specified
performance, EMI immunity, and minimum processor
resources.
•
•
Communication Frequency: 88 kHz
Continuous Conversion Plus Data-Transmission
Period: 100 ms
•
•
Conversion Current: 34 µA
Floating 2 V to 5.5 V (VP–VN) Supply Operation
with Integrated EMI Immunity
•
2-Pin Package Offering TO-92/LPG (3.1 mm × 4
mm × 1.5 mm) – ½ the Size of Traditional TO-92
2 Applications
Device Information
•
•
•
•
•
•
•
Digital Output Wired Probes
White Goods
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMT01
TO-92 / LPG (2)
4.00 mm × 3.15 mm
HVAC
1. For all available packages, see the orderable addendum at
the end of the data sheet.
Power Supplies
Industrial Internet of Things (IoT)
Automotive
Battery Management
2-Pin IC Temperature Sensor
LMT01 Accuracy
V
: 3.0V to 5.5V
DD
1.0
GPIO
0.8
Max Limit
Up to 2m
0.6
0.4
MCU/
FPGA/
ASIC
ët
LMT01
ëb
Min 2.0V
0.2
0.0
-0.2
-0.4
-0.6
GPIO/
COMP
LMT01 Pulse Count Interface
Min Limit
Conversion Time
-0.8
ADC Conversion Result
-1.0
tower hff
0
25
50
75
100
125
150
œ50
œ25
tower hn
LMT01 Junction Temperaure (°C)
C014
Typical units plotted in center of curve.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMT01
SNIS189A –JUNE 2015–REVISED JUNE 2015
www.ti.com
Table of Contents
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 15
Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Applications ................................................ 17
8.3 System Examples .................................................. 20
Power Supply Recommendations...................... 21
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
8
9
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 21
11 Device and Documentation Support ................. 22
11.1 Documentation Support ....................................... 22
11.2 Community Resources.......................................... 22
11.3 Trademarks........................................................... 22
11.4 Electrostatic Discharge Caution............................ 22
11.5 Glossary................................................................ 22
6.6 Electrical Characteristics - Pulse Count to
Temperature LUT....................................................... 6
6.7 Switching Characteristics.......................................... 6
6.8 Timing Specification Waveform ................................ 7
6.9 Typical Characteristics.............................................. 7
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
Changes from Original (June 2015) to Revision A
Page
•
•
Added full datasheet. ............................................................................................................................................................. 1
Added clarification note. ........................................................................................................................................................ 1
2
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SNIS189A –JUNE 2015–REVISED JUNE 2015
5 Pin Configuration and Functions
TO-92/LPG
2-Pin
VN
VP
Table 1. Pin Functions
PIN NAME
VP
VN
I/O
DESCRIPTION
Input
Positive voltage pin - may be connected to system power supply or bias resistor
Negative voltage pin - may be connected to system ground or a bias resistor
Output
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6 Specifications
(1)(2)
6.1 Absolute Maximum Ratings
MIN
−0.3V
−65
MAX
6V
UNIT
V
Voltage drop (VP-VN)
Storage temperature range, Tstg
175°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
−50
2.0
NOM
MAX
150
5.5
UNIT
°C
Free-air temperature range
Voltage drop range (VP-VN)
V
6.4 Thermal Information
LMT01
THERMAL METRIC(1)
TO-92/LPG
2 PINS
177
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
94
Junction-to-board thermal resistance
152
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Stirred Oil thermal response time to 63% of final value
Still air thermal response time to 63% of final value
33
ψJB
152
0.8
sec
sec
28
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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6.5 Electrical Characteristics
Over operating free-air temperature range and operating VP-VN range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ACCURACY
150°C
120°C
110°C
100°C
-0.625
-0.625
-0.5625
-0.5625
-0.5
0.625
0.625
0.5625
0.5625
0.5
°C
°C
°C
°C
°C
°C
°C
°C
°C
°C
90°C
VP-VN of 2.15 V
to 5.5 V
(1)(2)
Temperature accuracy
25°C
-0.5
±0.125
0.5
-20°C
-30°C
-40°C
-50°C
-0.5
0.5
-0.5625
-0.625
-0.6875
0.5625
0.625
0.6875
PULSE COUNT TRANSFER FUNCTION
Number of pulses at 0°C
800
15
808
816
3228
Output pulse range
Theoretical max (exceeds device
rating)
1
4095
Resolution of one pulse
0.0625
°C
OUTPUT CURRENT
IOL
IOH
Output current variation
Low level
High level
28
34
39
µA
µA
112.5
125
143
High to Low level output current
ratio
3.1
3.7
4.5
POWER SUPPLY
Accuracy sensitivity to change in
40
133
1
m°C/V
µA
2.15 V ≤ VP-VN ≤ 5. 0 V(3)
VDD ≤ 0.4 V
VP-VN
Leakage Current VP-VN
0.002
(1) Calculated using Pulse Count to Temperature LUT and 0.0625°C resolution per pulse, see section Electrical Characteristics - Pulse
Count to Temperature LUT.
(2) Error can be linearly interpolated between temperatures given in table as shown in the Accuracy vs Temperature curves in section
Typical Characteristics.
(3) Limit is using end point calculation.
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6.6 Electrical Characteristics - Pulse Count to Temperature LUT
Over operating free-air temperature range and operating VP-VN range (unless otherwise noted). LUT is short for Look-up
Table.
PARAMETER
TEST CONDITIONS
-50°C
-40°C
-30°C
-20°C
-10°C
0°C
MIN
15
TYP
26
MAX
37
UNITS
172
181
190
329
338
347
486
494
502
643
651
659
800
808
816
10°C
958
966
974
20°C
1117
1276
1435
1594
1754
1915
2076
2237
2398
2560
2721
2883
3047
3208
1125
1284
1443
1602
1762
1923
2084
2245
2407
2569
2731
2893
3057
3218
1133
1292
1451
1610
1770
1931
2092
2253
2416
2578
2741
2903
3067
3228
30°C
40°C
Digital output code
50°C
pulses
60°C
70°C
80°C
90°C
100°C
110°C
120°C
130°C
140°C
150°C
6.7 Switching Characteristics
Over operating free-air temperature range and operating VP-VN range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
tR, tF
Output current rise and fall
time
CL=10 pF, RL=8 k
1.45
µs
fP
Output current pulse
frequency
82
88
94
kHz
Output current duty cycle
40%
46
50%
50
60%
54
tCONV
tDATA
Temperature conversion
time(1)
2.15 V to 5.5 V
ms
ms
Data transmission time
44
47
50
(1) Conversion time includes power up time or device turn on time that is typically 3 ms after POR threshold of 1.2V is exceeded.
6
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SNIS189A –JUNE 2015–REVISED JUNE 2015
6.8 Timing Specification Waveform
tCONV
tDATA
Power
125µA
34µA
tR
tower hff
Output
Current
tF
1/fP
6.9 Typical Characteristics
1.0
1.0
0.8
0.8
Max Limit
Max Limit
0.6
0.4
0.6
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.2
-0.4
-0.6
-0.8
-1.0
Min Limit
Min Limit
-0.8
-1.0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C017
C016
Using Electrical Characteristics - Pulse Count to Temperature LUT
Using Electrical Characteristics - Pulse Count to Temperature LUT
VP - VN = 2.15 V
VP - VN = 2.4 V
Figure 1. Accuracy vs LMT01 Junction Temperature
Figure 2. Accuracy vs LMT01 Junction Temperature
1.0
1.0
0.8
0.8
Max Limit
Max Limit
0.6
0.4
0.6
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.2
-0.4
-0.6
Min Limit
Min Limit
-0.8
-0.8
-1.0
-1.0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C015
C014
Using Electrical Characteristics - Pulse Count to Temperature LUT
Using Electrical Characteristics - Pulse Count to Temperature LUT
VP - VN = 2.7 V
VP - VN = 3 V
Figure 3. Accuracy vs LMT01 Junction Temperature
Figure 4. Accuracy vs LMT01 Junction Temperature
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Typical Characteristics (continued)
1.0
1.0
0.8
0.8
Max Limit
Max Limit
0.6
0.4
0.6
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.2
-0.4
-0.6
-0.8
-1.0
Min Limit
Min Limit
75
-0.8
-1.0
0
25
50
75
100
125
150
0
25
50
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C013
C012
Using Electrical Characteristics - Pulse Count to Temperature LUT
Using Electrical Characteristics - Pulse Count to Temperature LUT
VP - VN = 4 V
VP - VN = 5 V
Figure 5. Accuracy vs LMT01 Junction Temperature
Figure 6. Accuracy vs LMT01 Junction Temperature
1.00
0.80
0.625°C
Max Limit
-0.625°C
Min Limit
Max Limit
0.60
0.40
0.20
0.00
-0.20
-0.40
-0.60
Min Limit
-0.80
-1.00
0
25
50
75
100
125
150
-1
+1
œ50
œ25
0
Accuracy (°C)
LMT01 Junction Temperature (°C)
C011
C025
Using Electrical Characteristics - Pulse Count to Temperature LUT
Using Electrical Characteristics - Pulse Count to Temperature LUT
VP - VN = 5.5 V
VP - VN = 2.15 V to 5.5 V
Figure 7. Accuracy vs LMT01 Junction Temperature
Figure 8. Accuracy Histogram at 150°C
0.5°C
Max Limit
0.5°C
Max Limit
-0.5°C
Min Limit
-0.5°C
Min Limit
-1
+1
-1
+1
0
0
Accuracy (°C)
Accuracy (°C)
C024
C023
Using Electrical Characteristics - Pulse Count to Temperature LUT
Using Electrical Characteristics - Pulse Count to Temperature LUT
VP - VN = 2.15 V to 5.5 V
VP - VN = 2.15 V to 5.5 V
Figure 9. Accuracy Histogram at 30°C
Figure 10. Accuracy Histogram at -20°C
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Typical Characteristics (continued)
0.5625°C
-0.5625°C
Min Limit
0.5625°C
-0.5625°C
Min Limit
Max Limit
Max Limit
-1
+1
-1
+1
0
0
Accuracy (°C)
Accuracy (°C)
C022
C021
Using LUT Electrical Characteristics - Pulse Count to Temperature
Using Electrical Characteristics - Pulse Count to Temperature LUT
LUT
VP - VN = 2.15 V to 5.5 V
VP - VN = 2.15 V to 5.5 V
Figure 11. Accuracy Histogram at -30°C
Figure 12. Accuracy Histogram at -40°C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
0.6875°C
Max Limit
-0.6875°C
Min Limit
-1
+1
0
25
50
75
100
125
150
œ50
œ25
0
Accuracy (°C)
LMT01 Junction Temperaure (°C)
C020
C018
Using LUT Electrical Characteristics - Pulse Count to Temperature
LUT
VP - VN = 2.15 V to 5.5 V
Using Temp = (PC/4096 x 256°C ) - 50°C
VP - VN = 2.15 V
Figure 13. Accuracy Histogram at -50°C
Figure 14. Accuracy Using Linear Transfer Function
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
150
125
100
75
50
25
0
High Level Current
Low Level Current
0
25
50
75
100
125
150
2
3
4
5
6
œ50
œ25
LMT01 Junction Temperaure (°C)
VP - VN (V)
C019
C004
Using Temp = (PC/4096 x 256°C ) - 50°C
VP - VN = 5.5V
TA = 30°C
Figure 15. Accuracy Using Linear Transfer Function
Figure 16. Output Current vs VP-VN Voltage
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Typical Characteristics (continued)
150
110
100
90
80
70
60
50
40
30
20
10
0
125
High Level Current
100
75
50
25
0
Low Level Current
0
25
50
75
100
125
150
0
120 240 360 480 600 720 840 960 1080 1200
œ50
œ25
LMT01 Juntion Temperature (°C)
Time (seconds)
C003
C033
VP-VN=3.3 V
TINITIAL=23°C,
VP – VN = 3.3 V
Figure 17. Output Current vs Temperature
TFINAL=70°C
Figure 18. Thermal Response in Still Air
110
100
90
80
70
60
50
40
30
20
10
0
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80 100 120 140 160 180 200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Time (seconds)
Time (seconds)
C032
C031
VP-VN=3.3 V
Air Flow=2.34
meters/sec
VP-VN=3.3 V
TINITIAL=23°C, TFINAL=70°C
TINITIAL=23°C, TFINAL=70°C
Figure 19. Thermal Response in Moving Air
Figure 20. Thermal Response in Stirred Oil
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7 Detailed Description
7.1 Overview
The LMT01 temperature output is transmitted over a single wire using a train of current pulses that typically
change from 34 µA to 125 µA. A simple resistor can then be used to convert the current pulses to a voltage. With
a 10 kΩ the output voltage levels range from 340 mV to 1.25 V, typically. A simple microcontroller comparator or
external transistor can be used convert this signal to valid logic levels the microcontroller can process properly
through a GPIO pin. The temperature can be determined by gating a simple counter on for a specific time
interval to count the total number of output pulses. After power is first applied to the device the current level will
remain below 34 µA for at most 54ms while the LMT01 is determining the temperature. Once the temperature is
determined the pulse train will begin. The individual pulse frequency is typically 88 kHz. The LMT01 will
continuously convert and transmit data when the power is applied approximately every 104 ms (max).
The LMT01 uses thermal diode analog circuitry to detect the temperature. The temperature signal is then
amplified and applied to the input of a ΣΔ ADC that is driven by an internal reference voltage. The ΣΔ ADC
output is then processed through the interface circuitry into a digital pulse train. The digital pulse train is then
converted to a current pulse train by the output signal conditioning circuitry that includes high and low current
regulators. The voltage applied across the LMT01's pins is regulated by an internal voltage regulator to provide a
consistent Chip VDD that is used by the ADC and its associated circuitry.
7.2 Functional Block Diagram
ët
Chip VDD
Chip VSS
Voltage
Regulator
and
Output
Signal
Thermal Diode
Analog Circuitry
5ꢀꢁꢀ
Interface
ADC
Conditioning
VREF
[aÇ01
7.3 Feature Description
7.3.1 Output Interface
The LMT01 provides a digital output in the form of a pulse count that is transmitted by a train of current pulses.
After the LMT01 is powered up it will transmit a very low current of 34 µA for less than 54 ms while the part
executes a temperature to digital conversion, as shown in Figure 21. Once the temperature to digital conversion
has completed the LMT01 will start to transmit a pulse train that toggles from the low current of 34 µA to a high
current level of 125 µA. The pulse train total time interval is at maximum 50 ms. The LMT01 will transmit a series
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Feature Description (continued)
of pulses equivalent to the pulse count at a given temperature as described in Electrical Characteristics - Pulse
Count to Temperature LUT. After the pulse count has been transmitted the LMT01 current level will remain low
for the remainder of the 50 ms. The total time for the temperature to digital conversion and the pulse train time
interval is 104 ms (max). If power is continuously applied the pulse train output will repeat start every 104 ms
(max).
Start of data
transmission
Start of next
conversion result data
End of data
Power
ON
End of data
54ms
max
104ms max
Power
50ms max
50ms max
tower
hff
Pulse
Train
Figure 21. Temperature to digital pulse train timing cycle
The LMT01 can be powered down at any time thus conserving system power. Care should be taken though, that
a power down wait time of 50ms, minimum, be used before the device is turned on again.
7.3.2 Output Transfer Function
The LMT01 will output at minimum 1 pulse and a theoretical maximum 4095 pulses. Each pulse has a weight of
0.0625°C. One pulse corresponds to a temperature less than -50°C while a pulse count of 4096 corresponds to a
temperature greater than 200°C. Note that the LMT01 is only guaranteed to operate up to 150°C. Exceeding this
temperature by more than 5°C may damage the device. The accuracy of the device degrades as well when
150°C in exceeded.
Two different methods of converting the pulse count to a temperature value will be discussed in this section. The
first method that will be discussed is the least accurate and uses a first order equation. The second method is
the most accurate and uses linear interpolation of the values found in the look-up table (LUT) as described in
Electrical Characteristics - Pulse Count to Temperature LUT.
The output transfer function appears to be linear and can be approximated by the following first order equation:
PC
≈
’
Temp =
ì 256èC - 50èC
∆
«
÷
4096
◊
where
•
•
PC is the Pulse Count
Temp is the temperature reading
(1)
Table 2 shows some sample calculations using Equation 1
Table 2. Sample Calculations Using Equation 1
TEMPERATURE (°C)
NUMBER OF PULSES
-49.9375
1
-49.875
-20
0
2
480
800
1280
1600
30
50
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Table 2. Sample Calculations Using Equation 1 (continued)
TEMPERATURE (°C)
NUMBER OF PULSES
100
2400
3200
4095
150
205.9375
The curve shown in Figure 22 shows the output transfer function using equation Equation 1 (blue line) and the
look-up table (LUT) found in Electrical Characteristics - Pulse Count to Temperature LUT (red line). The LMT01
output transfer function as described by the LUT appears to be linear, but upon close inspection it can be seen
that it truly is not linear. To actually see the difference, the accuracy obtained by the two methods must be
compared.
4096
3584
3072
2560
2048
1536
1024
512
0
0
25 50 75 100 125 150 175 200 225
œ50 œ25
LMT01 Junction Temperature (°C)
C002
Figure 22. LMT01 Output Transfer Function
For more exact temperature readings the output pulse count can be converted to temperature using linear
interpolation of the values found in Electrical Characteristics - Pulse Count to Temperature LUT and repeated
here for convenience.
Table 3. Pulse Count to Temperature Look-up Table
TEMPERATURE (°C)
PULSE COUNT
TYPICAL
MINIMUM
15
MAXIMUM
37
-50
-40
-30
-20
-10
0
26
172
181
190
329
338
347
486
494
502
643
651
659
800
808
816
10
958
966
974
20
1117
1276
1435
1594
1754
1915
2076
2237
2398
2560
2721
1125
1284
1443
1602
1762
1923
2084
2245
2407
2569
2731
1133
1292
1451
1610
1770
1931
2092
2253
2416
2578
2741
30
40
50
60
70
80
90
100
110
120
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Table 3. Pulse Count to Temperature Look-up Table (continued)
TEMPERATURE (°C)
PULSE COUNT
TYPICAL
MINIMUM
2883
MAXIMUM
2903
130
140
150
2893
3057
3218
3047
3067
3208
3228
The curves in Figure 23 and Figure 24, show the accuracy of typical units when using the Equation 1 and linear
interpolation using Electrical Characteristics - Pulse Count to Temperature LUT, respectively. When compared,
the improved performance when using the LUT linear interpolation method can clearly be seen. For a limited
temperature range of 25°C to 80°C the error shown in Figure 23 is flat and thus the linear equation will provide
good results. For a wide temperature range it is recommended that linear interpolation and the LUT be used.
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
1.0
0.8
Max Limit
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Min Limit
75
0
25
50
75
100
125
150
œ50
œ25
0
25
50
100
125
150
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C018
C017
Figure 23. LMT01 Accuracy when using first order
equation Equation 1 - 92 typical units plotted at (VP - VN)
= 2.15 V
Figure 24. LMT01 Accuracy using linear interpolation of
LUT found in Electrical Characteristics - Pulse Count to
Temperature LUT - 92 typical units plotted at (VP - VN) =
2.15 V
7.3.3 Current Output Conversion to Voltage
The minimum voltage drop across the LMT01 must be maintained at 2.15 V during the conversion cycle. After
the conversion cycle the minimum voltage drop can decrease to 2.0 V. Thus the LMT01 can be used for low
voltage applications See Application Information section on low voltage operation and other information on
picking the actual resistor value for different applications conditions. The resistor value is dependent on the
power supply level and it's variation and the threshold level requirements of the circuitry it's driving (i.e. MCU
GPIO or Comparator).
Stray capacitance can be introduced when connecting the LMT01 through a long wire. This stray capacitance will
influence the signal rise and fall times. The wire inductance has negligible effect on the AC signal integrity. A
simple RC time constant model as shown in Figure 25 can be used to determine the rise and fall times.
POWER
tHL
LMT01
VF
VHL
OUTPUT
VS
C
100pF
34 and
125 µA
R
10k
Figure 25. Simple RC Model for Rise and Fall Times
VF-V
tHL= R×C× ln l
S p
VF-VHL
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where
•
•
•
•
RC as shown in Figure 25
VHL is the target high level
the final voltage VF = 125 µA × R
the start voltage VS = 34 µA × R
(2)
(3)
For the 10% to 90% level rise time (tr), Equation 2 simplifies to:
tr= R×C×2.197
Care should be taken to ensure under reverse bias conditions that the LMT01 voltage drop does not exceed
300mV, as given in the Absolute Maximum Ratings.
7.4 Device Functional Modes
The only functional mode the LMT01 has is that it provides a pulse count output that is directly proportional to
temperature.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Mounting, Temperature Conductivity and Self Heating
The LMT01 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface to ensure good temperature conductivity. The temperatures of the lands and
traces to the leads of the LMT01 will also affect the temperature reading so they should be a thin as possible.
Alternatively, the LMT01 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LMT01 and accompanying wiring and circuits must be
kept insulated and dry, to avoid excessive leakage and corrosion. Printed-circuit coatings are often used to
ensure that moisture cannot corrode the leads or circuit traces.
The LMT01's junction temperature is the actual temperature being measured by the device. The thermal
resistance junction-to-ambient (RθJA) is the parameter (from
Thermal Information) used to calculate the rise of a device junction temperature (self heating) due to its average
power dissipation. The average power dissipation of the LMT01 is dependent on the temperature it is transmitting
as it effects the output pulse count and the voltage across the device. Equation 4 is used to calculate the self
heating in the LMT01's die temperature (TSH).
:
;
:
;
tCONV
PC
IOL+IOH
4096-PC
tDATA
TSH=HlIOL
×
×VCONVp +FHF
×
G +F
×IOLGI ×
G ×VDATAI ×RꢀJA
:
;
:
;
tCONV+tDATA
tCONV+tDATA
4096
2
4096
where
•
•
•
•
•
•
•
•
TSH is the ambient temperature,
IOL and IOH are the output low and high current level respectively,
VCONV is the voltage across the LMT01 during conversion,
VDATA is the voltage across the LMT01 during data transmission,
tCONV is the conversion time,
tDATA is the data transmission time,
PC is the output pulse count,
RθJA is the junction to ambient package thermal resistance
(4)
Plotted in the curve Figure 26 are the typical average supply current (black line using left y axis) and the resulting
self heating (red and violet lines using right y axis) during continuous conversions. A temperature range of -50°C
to +150°C, a VCONV of 5 V (red line) and 2.15 V (violet line) were used for the self heating calculation. As can be
seen in the curve the average power supply current and thus the average self heating changes linearly over
temperature because the number of pulses increases with temperature. A negligible self heating of about 45m°C
is observed at 150°C with continuous conversions. If temperature readings are not required as frequently as
every 100ms, self heating can be minimized by shutting down power to the part periodically thus lowering the
average power dissipation.
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Application Information (continued)
60
50
40
30
20
10
0
0.06
0.05
0.04
0.03
0.02
0.01
0.00
Average Current
Self Heating at VP-VN=5V
Self Heating at VP-VN=2.15V
-100
-50
0
50
100
150
200
Temperature (°C)
C001
Figure 26. Average current draw and self heating over temperature
8.2 Typical Applications
8.2.1 3.3V System VDD MSP430 Interface - Using Comparator Input
V
DD
3.3V
MSP430
GPIO
5ivider
VREF
2.73V
or
ët
LMT01
ëb
2.24V
ÇLa9w2
COMP_B
CLOCK
+
R
VR
IR = 34
and 125 µA
6.81k
1%
Figure 27. MSP430 Comparator Input Implementation
8.2.1.1 Design Requirements
The following design requirements will be used in the detailed design procedure.
VDD
3.3 V
VDD minimum
3.0 V
LMT01 VP – VN minimum during conversion
LMT01 VP – VN minimum during data transmission
Noise margin
2.15 V
2.0 V
50 mV min
< 1 uA
1%
Comparator input current over temperature range of interest
Resistor tolerance
8.2.1.2 Detailed Design Procedure
First select the R and determine the maximum logic low voltage and the minimum logic high voltage while
ensuring, that when the LMT01 is converting, the minimum (VP - VN) requirement of 2.15 V is met.
1. Select R using minimum VP-VN during data transmission (2 V) and maximum output current of the LMT01
(143.75 µA)
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–
–
R = (3.0 V – 2 V) / 143.75 µA = 6.993 k the closest 1% resistor is 6.980 k
6.993 k is the maximum resistance so if using 1% tolerance resistor the actual resistor value needs to be
1% less than 6.993 k and 6.98 k is 0.2% less than 6.993 k thus 6.81 k should be used.
2. Check to see if the LMT01's 2.15 V minimum voltage during conversion requirement is met with maximum
IOL of 39 µA and maximum R of 6.81 k + 1%:
–
VLMT01 = 3 V - (6.81 k x 1.01) × 39 µA = 2.73 V
3. Find the maximum low level voltage range using maximum R of 6.81k and maximum IOL 39 µA:
VRLmax = (6.81 k x 1.01) × 39 µA = 268 mV
4. Find the minimum high level voltage using the minimum R of 6.81k and minimum IOH of 112.5 uA:
VRHmin = (6.81 k x 0.99) × 112.5 µA = 758 mV
–
–
Now select the MSP430 comparator threshold voltage that will enable the LMT01 to communicate to the
MSP430 properly.
1. The MSP430 voltage will be selected by selecting the internal VREF and then choosing the appropriate 1 of
n/32 settings for n of 1 to 31.
–
–
VMID= (VRLmax–VRHmin )/2 + VRHmin = (758 mV - 268 mV)/2 + 268 mV= 513 mV
n = (VMID / VREF ) × 32 = (0.513/2.5) × 32 = 7
2. In order to prevent oscillation of the comparator output hysteresis needs to implemented. The MSP430
allows this by enabling different n for rising edge and falling edge of the comparator output. Thus for a falling
comparator output transition N should be set to 6.
3. Determine the noise margin caused by variation in comparator threshold level. Even though the comparator
threshold level theoretically is set to VMID, the actual level will vary from device to device due to VREF
tolerance, resistor divider tolerance, and comparator offset. For proper operation the COMP_B worst case
input threshold levels must be within the minimum high and maximum low voltage levels presented across R,
VRHmin and VRLmax respectively
(N+N_TOL)
:
;
VCHmax=VREF× 1+V_REF_TOL ×
+COMP_OFFSET
32
where
•
•
•
•
•
VREF is the MSP430 COMP_B reference voltage for this example 2.5V,
V_REF_TOL is the tolerance of the VREF of 1% or 0.01,
N is the divisor for the MSP430 or 7
N_TOL is the tolerance of the divisor or 0.5
COMP_OFFSET is the comparator offset specification or 10mV
(N-N_TOL)
(5)
:
;
VCLmin=VREF× 1-V_REF_TOL ×
-COMP_OFFSET
32
where
•
•
•
•
•
VREF is the MSP430 COMP_B reference voltage for this example 2.5V,
V_REF_TOL is the tolerance of the VREF of 1% or 0.01,
N is the divisor for the MSP430 for the hysteresis setting or 6,
N_TOL is the tolerance of the divisor or 0.5,
COMP_OFFSET is the comparator offset specification or 10mV
(6)
(7)
The noise margin is the minimum of the two differences:
(VRHmin–VCHmax) or (VCHmin–VRLmax
)
which works out to be 145 mV.
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ë55
ꢁulse
/ount
{ignal
ëwImax
ëwImin
ë/Imax
ëꢀL5
Noise Margin
Noise Margin
ë/Imin
ëw[max
ëw[min
Db5
Çime (µs)
Figure 28. Pulse Count Signal Amplitude Variation
8.2.1.3 Setting the MSP430 Threshold and Hysteresis
The comparator hysteresis will determine the noise level that the signal can support without causing the
comparator to trip falsely thus resulting in an inaccurate pulse count. The comparator hysteresis is set by the
precision of the MSP430 and what thresholds it is capable of. For this case as the input signal transitions high
the comparator threshold is dropped by 77 mV thus if the noise on the signal as it transitions is kept below this
level the comparator will not trip falsely. In addition the MSP430 has a digital filter on the COMP_B output that be
used to further filter output transitions that occur too quickly.
8.2.1.4 Application Curves
Amplitude = 200 mV/div
Time Base = 10 µs/div
Δy at cursors = 500 mV
Δx at cursors = 11.7 µs
Amplitude = 200 mV/div
Time Base = 10 µs/div
Δy at cursors = 484 mV
Δx at cursors = 11.7 µs
Figure 29. MSP430 COMP_B Input Signal No Capacitance
Load
Figure 30. MSP430 COMP_B Input Signal 100pF
Capacitance Load
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8.3 System Examples
3.3V
VDD
MCU/
FPGA/
ASIC
ët
LMT01
ëb
100k
GPIO
MMBT3904
7.5k
34 and
125 µA
Figure 31. Transistor Level Shifting
3V to 5.5V
3V to 5.5V
ISO734x
VCC1
VCC2
VDD
ët
LMT01
ëb
MCU/FPGA/
ASIC
Min
2.0V
100k
GPIO
MMBT3904
7.5k
34 and
125 µA
GND2
GND1
Figure 32. Isolation
V
DD
3V to 5.5V
GPIO1
GPIO2
GPIO n
Up to 2.0m
MCU/FPGA/
ASIC
ët
LMT01
U1
ët
LMT01
U2
ët
LMT01
Un
Min
2.0V
ëb
ëb
ëb
GPIO/
COMP
34 and
125 µA
6.81k
(for 3V)
Note: to turn off an LMT01 set the GPIO pin connected to VP to high impedance state as setting it low would cause
the off LMT01 to be reverse biased.
Figure 33. Connecting Multiple Devices to One MCU Input Pin
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9 Power Supply Recommendations
Since the LMT01 is only a 2-pin device the power pins are common with the signal pins, thus the LMT01 has a
floating supply that can vary greatly. The LMT01 has an internal regulator that provides a stable voltage to
internal circuitry.
Care should be taken to prevent reverse biasing of the LMT01 as exceeding the absolute maximum ratings may
cause damage to the device.
Power supply ramp rate can effect the accuracy of the first result transmitted by the LMT01. As shown in
Figure 34 with a 1ms rise time the LMT01 output code is at 1286 which converts to 30.125°C. The scope photo
shown in Figure 35 reflects what happens when the rise time is too slow. As can be seen the power supply
(yellow trace) is still ramping up to final value while the LMT01 (red trace) has already started a conversion. This
causes the output pulse count to decrease from the 1286, shown previously, to 1282 or 29.875°C. Thus, for slow
ramp rates it is recommended that the first conversion be discarded. For even slower ramp rates more than one
conversion may have to be discarded as it is recommended that either the power supply be within final value
before a conversion is used or that ramp rates be faster than 2.5 ms.
Yellow trace = 1 V/div, Red trace = 100 mV/div, Time Base = 20
ms/div
Yellow trace = 1V/div, Red trace = 100 mV/div, Time base = 20
ms/div
TA= 30°C
LMT01 Pulse Count = 1286
Rise Time = 1 ms
TA=30°C
LMT01 Pulse Count = 1282
Rise Time = 100 ms
VP-VN = 3.3 V
VP-VN=3.3 V
Figure 34. Output pulse count with appropriate power
supply rise time
Figure 35. Output pulse count with slow power supply rise
time
10 Layout
10.1 Layout Guidelines
The LMT01 can be mounted to a PCB as shown in Figure 36. Care should be taken to make the traces leading
to the LMT01's pads as small as possible in order to minimize their effect on the temperature the LMT01 is
measuring.
10.2 Layout Example
ët
Figure 36.
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11 Device and Documentation Support
11.1 Documentation Support
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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28-Jun-2015
PACKAGING INFORMATION
Orderable Device
LMT01LPG
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-50 to 150
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
TO-92
TO-92
LPG
2
2
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LMT01
LMT01
LMT01LPGM
ACTIVE
LPG
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-50 to 150
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jun-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
LPG0002A
TO-92 - 5.05 mm max height
S
C
A
L
E
1
.
3
0
0
TO-92
4.1
3.9
3.25
3.05
0.51
0.40
3X
5.05
MAX
2
1
2.3
2.0
2 MAX
6X 0.076 MAX
2X
15.5
15.1
0.48
0.33
0.51
0.33
3X
3X
2X 1.27 0.05
2.64
2.44
2.68
2.28
1.62
1.42
2X (45°)
(0.55)
1
2
0.86
0.66
4221971/A 03/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
LPG0002A
TO-92 - 5.05 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X ( 0.75) VIA
(1.7)
(1.7)
1
2
(1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
TYP
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221971/A 03/2015
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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