LMV1032UPX-15/NOPB [TI]
AUDIO AMPLIFIER;
| 型号： | LMV1032UPX-15/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AUDIO AMPLIFIER 放大器 商用集成电路 |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMV1032
www.ti.com
SNAS233G –DECEMBER 2003–REVISED MAY 2013
LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones
Check for Samples: LMV1032
1
FEATURES
DESCRIPTION
The LMV1032s are an audio amplifier series for small
form factor electret microphones. They are designed
to replace the JFET preamp currently being used.
The LMV1032 series is ideal for extended battery life
applications, such as a Bluetooth communication link.
The addition of a third pin to an electret microphones
that incorporates an LMV1032 allows for a dramatic
reduction in supply current as compared to the JFET
equipped electret microphone. Microphone supply
current is thus reduced to 60 µA, assuring longer
battery life. The LMV1032 series is specified for
supply voltages from 1.7V to 5V, and has fixed
voltage gains of 6 dB, 15 dB and 25 dB.
2
•
(Typical LMV1032-15, 1.7V Supply; Unless
Otherwise Noted)
•
•
•
•
•
•
•
•
•
•
•
Output Voltage Noise (A-weighted) −89 dBV
Low Supply Current 60 μA
Supply Voltage 1.7V to 5V
PSRR 70 dB
Signal to Noise Ratio 61 dB
Input Capacitance 2 pF
Input Impedance >100 MΩ
Output Impedance <200Ω
Max Input Signal 170 mVPP
Temperature Range −40°C to 85°C
The LMV1032 series offers low output impedance
over the voice bandwidth, excellent power supply
rejection (PSRR), and stability over temperature.
Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology.
The devices are offered in space saving 4-bump ultra
thin DSBGA lead free packages and are thus ideally
suited for the form factor of miniature electret
microphone packages. These extremely miniature
packages have the Large Dome Bump (LDB)
technology. This DSBGA technology is designed for
microphone PCBs requiring 1 kg adhesion criteria.
APPLICATIONS
•
•
•
•
•
Mobile Communications - Bluetooth
Automotive Accessories
Cellular Phones
PDAs
Accessory Microphone Products
Block Diagram
Electret Microphone
DIAPHRAGM
V
DD
AIRGAP
ELECTRET
BACKPLATE
V
V
OUT
CONNECTOR
IN
1x
GAIN
LMV1032
IC
V
CC
V
DC
V
OUT
GND
GND
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2013, Texas Instruments Incorporated
LMV1032
SNAS233G –DECEMBER 2003–REVISED MAY 2013
www.ti.com
Absolute Maximum Ratings(1)(2)
ESD Tolerance(3)
Human Body Model
Machine Model
VDD - GND
2500V
250V
Supply Voltage
5.5V
Storage Temperature Range
Junction Temperature(4)
Mounting Temperature
−65°C to 150°C
150°C max
235°C
Infrared or Convection (20 sec.)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The Human Body Model (HBM) is 1.5 kΩ in series with 100 pF. The Machine Model is 0Ω in series with 200 pF.
(4) The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings(1)
Supply Voltage
1.7V to 5V
Temperature Range
−40°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
1.7V and 5V Electrical Characteristics(1)
Unless otherwise specified, all limits ensured for TJ = 25°C and VDD = 1.7V and 5V. Boldface limits apply at the temperature
extremes.
Symbol
Parameter
Supply Current
Conditions
Min(2)
Typ(3)
Max(2)
Units
IDD
VIN = GND
60
85
μA
100
SNR
Signal to Noise Ratio
VDD = 1.7V
VIN = 18 mVPP
f = 1 kHz
LMV1032-06
LMV1032-15
LMV1032-25
LMV1032-06
LMV1036-15
LMV1032-25
LMV1032-06
58
61
61
59
61
62
75
dB
VDD = 5V
VIN = 18 mVPP
f = 1 kHz
PSRR
Power Supply Rejection Ratio
1.7V < VDD < 5V
65
60
LMV1032-15
LMV1032-25
60
55
70
65
dB
55
50
VIN
Max Input Signal
f = 1 kHz and THD+N < LMV1032-06
300
170
60
1%
LMV1032-15
mVPP
LMV1032-25
fLOW
fHIGH
Lower −3 dB Roll Off Frequency
Upper −3 dB Roll Off Frequency
RSOURCE = 50Ω
VIN = 18 mVPP
70
Hz
RSOURCE = 50Ω
VIN = 18 mVPP
LMV1032-06
LMV1032-15
LMV1032-25
120
75
kHz
21
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ > TA.
(2) All limits are specified by design or statistical analysis.
(3) Typical values represent the most likely parametric norm.
2
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SNAS233G –DECEMBER 2003–REVISED MAY 2013
1.7V and 5V Electrical Characteristics(1) (continued)
Unless otherwise specified, all limits ensured for TJ = 25°C and VDD = 1.7V and 5V. Boldface limits apply at the temperature
extremes.
Symbol
en
Parameter
Output Noise
Conditions
Min(2)
Typ(3)
−97
−89
−80
300
500
600
<200
2.3
Max(2)
Units
A-Weighted
VIN = GND
f = 1 kHz
LMV1032-06
LMV1032-15
LMV1032-25
LMV1032-06
LMV1032-15
LMV1032-25
dBV
VOUT
Output Voltage
100
250
300
500
750
mV
1000
RO
IO
Output Impedance
Output Current
Ω
VDD = 1.7V, VOUT = 1.7V, Sinking
VDD = 1.7V, VOUT = 0V, Sourcing
VDD = 5V, VOUT = 1.7V, Sinking
VDD = 5V, VOUT = 0V, Sourcing
0.9
0.5
0.3
0.2
0.64
2.4
mA
0.9
0.5
0.4
1.46
0.1
THD
Total Harmonic Distortion
f = 1 kHz
VIN = 18 mVPP
LMV1032-06
0.11
0.13
0.35
2
LMV1032-15
LMV1032-25
%
CIN
ZIN
AV
Input Capacitance
Input Impedance
Gain
pF
>100
6.2
MΩ
f = 1 kHz
VIN = 18 mVPP
LMV1032-06
LMV1032-15
LMV1032-25
5.5
4.5
6.7
7.7
14.8
14
15.4
25.5
16
17
dB
24.8
26.2
24
27
Connection Diagram
Large Dome 4-Bump DSBGA
A2
B2
OUTPUT
V
CC
X
A1
B1
GND
INPUT
Figure 1. Top View
Note:
Pin numbers are referenced to package marking text orientation.
The actual physical placement of the package marking will vary slightly from part to part. The package will
•
•
designate the date code and will vary considerably. Package marking does not correlate to device type in any
way.
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Typical Performance Characteristics
Unless otherwise specified, VS = 1.7V, single supply, TA = 25°C
Supply Current vs. Supply Voltage (LMV1032-06)
Supply Current vs. Supply Voltage (LMV1032-15)
75
70
65
70
65
60
85°C
85°C
25°C
25°C
60
55
50
55
50
-40°C
-40°C
45
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 2.
Figure 3. '
Supply Current vs. Supply Voltage (LMV1032-25)
Closed Loop Gain and Phase vs. Frequency (LMV1032-06)
10.00
180
70
GAIN
5.00
135
85°C
0.00
-5.00
90
65
45
25°C
0
-10.00
-15.00
-20.00
-25.00
-30.00
60
PHASE
-45
-90
-135
-40°C
55
-180
50
10k
1M
10
100
1k
100k
1.5
2
2.5
3
3.5
4
4.5
5
5.5
FREQUENCY (Hz)
SUPPLY VOLTAGE (V)
Figure 4.
Figure 5.
Closed Loop Gain and Phase vs. Frequency (LMV1032-15)
Closed Loop Gain and Phase vs. Frequency (LMV1032-25)
30
25
20
450
20
450
GAIN
GAIN
15
400
400
350
10
15
10
5
350
300
250
200
PHASE
PHASE
5
0
300
250
200
150
0
-5
-5
-10
-15
-10
-15
150
10k
10
100
1k
100k
1M
10k
10
100
1k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6.
Figure 7.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VS = 1.7V, single supply, TA = 25°C
Power Supply Rejection Ratio vs. Frequency (LMV1032-06)
Power Supply Rejection Ratio vs. Frequency (LMV1032-15)
120
120
100
80
60
40
20
0
100
80
60
40
20
0
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8. \
Figure 9.
Power Supply Rejection Ratio vs. Frequency (LMV1032-25)
Total Harmonic Distortion vs. Frequency (LMV1032-06)
0.7
120
V
= 18 mV
PP
IN
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100
80
60
40
20
0
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10.
Figure 11.
Total Harmonic Distortion vs. Frequency (LMV1032-15)
Total Harmonic Distortion vs. Frequency (LMV1032-25)
0.7
0.6
V
IN
= 18 mV
PP
V
= 18 mV
PP
IN
0.6
0.5
0.5
0.4
0.3
0.2
0.1
0.0
0.4
0.3
0.2
0.1
0.0
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12.
Figure 13.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VS = 1.7V, single supply, TA = 25°C
Total Harmonic Distortion vs.Input Voltage (LMV1032-06)
Total Harmonic Distortion vs. Input Voltage (LMV1032-15)
1.6
1.6
1.4
1.2
1.0
0.8
0.6
0.4
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.2
f = 1 kHz
f = 1 kHz
0.0
0.0
0
50 100 150 200 250 300 350 400
0
50
100
150
200
INPUT VOLTAGE (mV
)
PP
INPUT VOLTAGE (mV
)
PP
Figure 14.
Figure 15.
Total Harmonic Distortion vs. Input Voltage (LMV1032-25)
Output Voltage Noise vs. Frequency (LMV1032-06)
-100
1.6
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
1.4
1.2
1.0
0.8
0.6
0.4
0.2
f = 1 kHz
0.0
10
100
1k
10k
100k
0
20
40
60
PP
80
FREQUENCY (Hz)
INPUT VOLTAGE (mV
)
Figure 16.
Figure 17.
Output Voltage Noise vs. Frequency (LMV1032-15)
Output Voltage Noise vs. Frequency (LMV1032-25)
-80
-80
-90
-90
-100
-100
-110
-120
-110
-120
-130
-140
-150
-130
-140
-150
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 18.
Figure 19.
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SNAS233G –DECEMBER 2003–REVISED MAY 2013
APPLICATION SECTION
LOW CURRENT
The LMV1032 has a low supply current which allows for a longer battery life. The low supply current of 60µA
makes this amplifier optimal for microphone applications which need to be always on.
BUILT-IN GAIN
The LMV1032 is offered in the space saving small DSBGA package which fits perfectly into the metal can of a
microphone. This allows the LMV1032 to be placed on the PCB inside the microphone.
The bottom side of the PCB has the pins that connect the supply voltage to the amplifier and make the output
available. The input of the amplifier is connected to the microphone via the PCB.
DIAPHRAGM
AIRGAP
ELECTRET
BACKPLATE
CONNECTOR
LMV1032
IC
V
CC
V
OUT
GND
Figure 20. Built-in Gain
A-WEIGHTED FILTER
The human ear has a frequency range from 20 Hz to about 20 kHz. Within this range the sensitivity of the human
ear is not equal for each frequency. To approach the hearing response weighting filters are introduced. One of
those filters is the A-weighted filter.
The A-weighted filter is usually used in signal-to-noise ratio measurements, where sound is compared to device
noise. It improves the correlation of the measured data to the signal-to-noise ratio perceived by the human ear.
10
0
-10
-20
-30
-40
-50
-60
-70
10
100
1k
10k
100k
FREQUENCY (Hz)
Figure 21. A-Weighted Filter
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MEASURING NOISE AND SNR
The overall noise of the LMV1032 is measured within the frequency band from 10 Hz to 22 kHz using an A-
weighted filter. The input of the LMV1032 is connected to ground with a 5 pF capacitor.
A-WEIGHTED FILTER
5pF
Figure 22. Noise Measurement Setup
The signal-to-noise ratio (SNR) is measured with a 1 kHz input signal of 18 mVPP using an A-weighted filter. This
represents a sound pressure level of 94 dB SPL. No input capacitor is connected.
SOUND PRESSURE LEVEL
The volume of sound applied to a microphone is usually stated as the pressure level with respect to the threshold
of hearing of the human ear. The sound pressure level (SPL) in decibels is defined by:
Sound pressure level (dB) = 20 log Pm/PO
Where,
Pm is the measured sound pressure
PO is the threshold of hearing (20μPa)
In order to be able to calculate the resulting output voltage of the microphone for a given SPL, the sound
pressure in dB SPL needs to be converted to the absolute sound pressure in dBPa. This is the sound pressure
level in decibels which is referred to as 1 Pascal (Pa).
The conversion is given by:
dBPa = dB SPL + 20*log 20 μPa
dBPa = dB SPL - 94 dB
Translation from absolute sound pressure level to a voltage is specified by the sensitivity of the microphone. A
conventional microphone has a sensitivity of −44 dBV/Pa.
ABSOLUTE
SOUND
PRESSURE
[dBPa]
SENSITIVITY
[dBV/Pa]
-94dB
SOUND
VOLTAGE
PRESSURE
[dBV]
[dB SPL]
Figure 23. dB SPL to dBV Conversion
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Example: Busy traffic is 70 dB SPL
VOUT = 70 −94 −44 = −68 dBV
This is equivalent to 1.13 mVPP
Since the LMV1032-15 has a gain of 5.6 (15 dB) over the JFET, the output voltage of the microphone is 6.35
mVPP. By replacing the JFET with the LMV1032-15, the sensitivity of the microphone is −29 dBV/Pa (−44 + 15).
LOW FREQUENCY CUT OFF FILTER
To reduce noise on the output of the microphone a low cut filter has been implemented in the LMV1032. This
filter reduces the effect of wind and handling noise.
It's also helpful to reduce the proximity effect in directional microphones. This effect occurs when the sound
source is very close to the microphone. The lower frequencies are amplified which gives a bass sound. This
amplification can cause an overload, which results in a distortion of the signal.
20
15
450
GAIN
400
350
10
PHASE
5
0
300
250
200
150
-5
-10
-15
10k
100k
10
100
1k
1M
FREQUENCY (Hz)
Figure 24. Gain vs. Frequency
The LMV1032 is optimized to be used in audio band applications. The LMV1032 provides a flat gain response
within the audio band and offers linearity and excellent temperature stability.
ADVANTAGE OF THREE PINS
The LMV1032 ECM solution has three pins instead of the two pins provided in the case of a JFET solution. The
third pin provides the advantage of a low supply current, high PSRR and eliminates the need for additional
components.
Noise pick-up by a microphone in a cell phone is a well-known problem. A conventional JFET circuit is sensitive
for noise pick-up because of its high output impedance. The output impedance is usually around 2.2 kΩ. By
providing separate output and supply pins a much lower output impedance is achieved and therefore is less
sensitive to noise pick-up.
RF noise is among other caused by non-linear behavior. The non-linear behavior of the amplifier at high
frequencies, well above the usable bandwidth of the device, causes AM demodulation of high frequency signals.
The AM modulation contained in such signals folds back into the audio band, thereby disturbing the intended
microphone signal. The GSM signal of a cell phone is such an AM-modulated signal. The modulation frequency
of 216 Hz and its harmonics can be observed in the audio band. This type of noise is called bumblebee noise.
EXTERNAL PRE-AMPLIFIER APPLICATION
The LMV1032 can also be used outside of an ECM as a space saving external pre-amplifier. In this application,
the LMV1032 follows a phantom biased JFET microphone in the circuit. This is shown in Figure 25. The input of
the LMV1032 is connected to the microphone via the 2.2 µF capacitor. The advantage of this circuit over one
with only a JFET microphone are the additional gain and the high pass filter supplied by the LMV1032. The high
pass filter makes the output signal more robust and less sensitive to low frequency disturbances. In this
configuration the LMV1032 should be placed as close as possible to the microphone.
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V
DD
V
DD
2.2 kW
V
DD
V
V
V
OUT
IN
OUT
2.2 mF
GND
JFET
Microphone
LMV1032
GND
Figure 25. LMV1032 as External Pre-Amplifier
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REVISION HISTORY
Changes from Revision F (May 2013) to Revision G
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2013
PACKAGING INFORMATION
Orderable Device
LMV1032UP-06/NOPB
LMV1032UP-15/NOPB
LMV1032UP-25/NOPB
LMV1032UPX-06/NOPB
LMV1032UPX-25/NOPB
LMV1032UR-15/NOPB
LMV1032UR-25/NOPB
LMV1032URX-15/NOPB
LMV1032URX-25/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YPC
4
4
4
4
4
4
4
4
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
YPC
YPC
YPC
YPC
YPD
YPD
YPD
YPD
250
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2013
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV1032UP-06/NOPB DSBGA
LMV1032UP-15/NOPB DSBGA
LMV1032UP-25/NOPB DSBGA
LMV1032UPX-06/NOPB DSBGA
LMV1032UPX-25/NOPB DSBGA
LMV1032UR-15/NOPB DSBGA
LMV1032UR-25/NOPB DSBGA
LMV1032URX-15/NOPB DSBGA
LMV1032URX-25/NOPB DSBGA
YPC
YPC
YPC
YPC
YPC
YPD
YPD
YPD
YPD
4
4
4
4
4
4
4
4
4
250
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
250
3000
3000
250
250
3000
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Aug-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV1032UP-06/NOPB
LMV1032UP-15/NOPB
LMV1032UP-25/NOPB
LMV1032UPX-06/NOPB
LMV1032UPX-25/NOPB
LMV1032UR-15/NOPB
LMV1032UR-25/NOPB
LMV1032URX-15/NOPB
LMV1032URX-25/NOPB
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YPC
YPC
YPC
YPC
YPC
YPD
YPD
YPD
YPD
4
4
4
4
4
4
4
4
4
250
250
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
250
3000
3000
250
250
3000
3000
Pack Materials-Page 2
MECHANICAL DATA
YPC0004
D
0.350±0.045
E
UPA04XXX (Rev C)
D: Max = 1.184 mm, Min =1.123 mm
E: Max = 1.184 mm, Min =1.123 mm
4215139/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
www.ti.com
MECHANICAL DATA
YPD0004
D
0.350±0.045
E
URA04XXX (Rev D)
D: Max = 1.184 mm, Min =1.123 mm
E: Max = 1.184 mm, Min =1.123 mm
4215141/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
www.ti.com
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