LMV324SIDG4 [TI]
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS; 低电压轨到轨输出运算放大器
| 型号： | LMV324SIDG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS |
| 文件： | 总37页 (文件大小：1135K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
1
FEATURES
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE
•
2.7-V and 5-V Performance
(TOP VIEW)
•
•
•
•
–40°C to 125°C Operation
Low-Power Shutdown Mode (LMV324S)
No Crossover Distortion
1
4OUT
13 4IN–
12 4IN+
11 GND
10 3IN+
1OUT
1IN–
1IN+
14
2
3
4
5
6
7
Low Supply Current
V
CC+
–
–
–
–
LMV321 . . . 130 μA Typ
LMV358 . . . 210 μA Typ
LMV324 . . . 410 μA Typ
LMV324S . . . 410 μA Typ
2IN+
2IN–
9
8
3IN–
3OUT
2OUT
•
•
Rail-to-Rail Output Swing
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
ESD Protection Exceeds JESD 22
–
–
2000-V Human-Body Model (A114-A)
1000-V Charged-Device Model (C101)
1OUT
1IN–
1IN+
1
2
3
4
5
6
7
8
16 4OUT
15
14
13
12
11
10
9
4IN–
4IN+
DESCRIPTION/
ORDERING INFORMATION
V
CC
GND
2IN+
2IN–
3IN+
The LMV321, LMV358, and LMV324/LMV324S are
single, dual, and quad low-voltage (2.7 V to 5.5 V)
operational amplifiers with rail-to-rail output swing.
The LMV324S, which is a variation of the standard
LMV324, includes a power-saving shutdown feature
that reduces supply current to a maximum of 5 μA
per channel when the amplifiers are not needed.
Channels 1 and 2 together are put in shutdown, as
are channels 3 and 4. While in shutdown, the outputs
actively are pulled low.
3IN–
2OUT
3OUT
3/4 SHDN
1/2 SHDN
LMV358 . . . D (SOIC), DDU (VSSOP),
DGK (MSOP), OR PW (TSSOP) PACKAGE
(TOP VIEW)
1
1OUT
1IN–
1IN+
GND
V
CC+
8
7
6
5
2
3
4
2OUT
2IN–
2IN+
The LMV321, LMV358, LMV324, and LMV324S are
the most cost-effective solutions for applications
where low-voltage operation, space saving, and low
cost are needed. These amplifiers are designed
specifically for low-voltage (2.7 V to 5 V) operation,
with performance specifications meeting or exceeding
the LM358 and LM324 devices that operate from 5 V
to 30 V. Additional features of the LMV3xx devices
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE
(TOP VIEW)
1
2
3
5
1IN+
GND
1IN–
V
CC+
are
a common-mode input voltage range that
includes ground, 1-MHz unity-gain bandwidth, and
1-V/μs slew rate.
4
OUT
The LMV321 is available in the ultra-small DCK
(SC-70) package, which is approximately one-half the
size of the DBV (SOT-23) package. This package
saves space on printed circuit boards and enables
the design of small portable electronic devices. It also
allows the designer to place the device closer to the
signal source to reduce noise pickup and increase
signal integrity.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
ORDERING INFORMATION(1)
TOP-SIDE
MARKING(3)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 2500
Reel of 250
Tube of 75
LMV321IDCKR
LMV321IDCKT
LMV321IDBVR
LMV321IDBVT
LMV358IDGKR
LMV358IDGKT
LMV358ID
SC-70 – DCK
R3_
Single
SOT-23 – DBV
MSOP/VSSOP – DGK
SOIC – D
RC1_
R5_
PREVIEW
MV358I
Dual
Reel of 2500
Tube of 150
Reel of 2000
Reel of 3000
Tube of 50
LMV358IDR
–40°C to 85°C
LMV358IPW
TSSOP – PW
VSSOP – DDU
MV358I
RA5_
LMV358IPWR
LMV358IDDUR
LMV324ID
LMV324I
Reel of 2500
Tube of 50
LMV324IDR
SOIC – D
LMV324SID
Quad
LMV324SI
Reel of 2500
Reel of 2000
Reel of 2000
Reel of 2500
Reel of 250
Tube of 75
LMV324SIDR
LMV324IPWR
LMV324SIPWR
LMV358QDGKR
LMV358QDGKT
LMV358QD
MV324I
TSSOP – PW
MV324SI
MSOP/VSSOP – DGK
SOIC – D
RH_
MV358Q
Dual
Reel of 2500
Tube of 150
Reel of 2000
Reel of 3000
Tube of 50
LMV358QDR
LMV358QPW
LMV358QPWR
LMV358QDDUR
LMV324QD
TSSOP – PW
VSSOP – DDU
SOIC – D
MV358Q
RAH_
–40°C to 125°C
LMV324Q
Reel of 2500
Tube of 90
LMV324QDR
LMV324QPW
LMV324QPWR
Quad
TSSOP – PW
MV324Q
Reel of 2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DDU/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
2
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
SYMBOL (EACH AMPLIFIER)
–
IN–
OUT
+
IN+
LMV324 SIMPLIFIED SCHEMATIC
V
CC
V
BIAS1
V
CC
+
–
V
BIAS2
+
Output
–
V
CC
V
CC
V
BIAS3
+
–
IN-
V
BIAS4
+
IN+
–
Copyright © 1999–2007, Texas Instruments Incorporated
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3
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
UNIT
VCC
VID
VI
Supply voltage(2)
Differential input voltage(3)
V
±5.5
5.5
V
V
Input voltage range (either input)
–0.2
At or below TA = 25°C,
CC ≤ 5.5 V
Duration of output short circuit (one amplifier) to ground(4)
Unlimited
V
8 pin
97
86
D package
14 pin
16 pin
5 pin
73
DBV package
DCK package
DDU package
DGK package
206
252
TBD
172
149
113
108
150
150
5 pin
θJA
Package thermal impedance(5)(6)
°C/W
8 pin
8 pin
8 pin
PW package
14 pin
16 pin
TJ
Operating virtual junction temperature
Storage temperature range
°C
°C
Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
2.7
1.7
3.5
MAX
UNIT
VCC
VIH
Supply voltage (single-supply operation)
Amplifier turn-on voltage level (LMV324S)(2)
5.5
V
VCC = 2.7 V
VCC = 5 V
V
V
VCC = 2.7 V
VCC = 5 V
0.7
1.5
85
VIL
TA
Amplifier turn-off voltage level (LMV324S)
Operating free-air temperature
I temperature
Q temperature
–40
–40
°C
125
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(2) VIH should not be allowed to exceed VCC
.
4
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
Electrical Characteristics
VCC+ = 2.7 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
VIO
Input offset voltage
1.7
7
mV
Average temperature coefficient of
input offset voltage
αVIO
5
μV/°C
IIB
IIO
Input bias current
Input offset current
11
5
250
50
nA
nA
dB
dB
CMRR Common-mode rejection ratio
VCM = 0 to 1.7 V
50
50
0
63
kSVR
Supply-voltage rejection ratio
VCC = 2.7 V to 5 V, VO = 1 V
60
–0.2
1.9
Common-mode input voltage
range
VICR
CMRR ≥ 50 dB
V
1.7
High level
Low level
VCC – 100
VCC – 10
60
VO
Output swing
RL = 10 kΩ to 1.35 V
mV
180
170
340
680
LMV321I
80
ICC
Supply current
LMV358I (both amplifiers)
140
260
1
μA
LMV324I/LMV324SI (all four amplifiers)
CL = 200 pF
B1
Φm
Gm
Vn
In
Unity-gain bandwidth
Phase margin
MHz
deg
60
Gain margin
10
dB
Equivalent input noise voltage
Equivalent input noise current
f = 1 kHz
f = 1 kHz
46
nV/√Hz
pA/√Hz
0.17
(1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
Shutdown Characteristics (LMV324S)
VCC+ = 2.7 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SHDN ≤ 0.6 V
MIN TYP(1)
MAX
UNIT
Supply current in shutdown mode
(per channel)
ICC(SHDN)
5
μA
t(on)
t(off)
Amplifier turn-on time
Amplifier turn-off time
AV = 1, RL = Open (measured at 50% point)
AV = 1, RL = Open (measured at 50% point)
2
μs
40
ns
(1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
5
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
Electrical Characteristics
VCC+ = 5 V, at specified free-air temperature (unless otherwise noted)
(1)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP(2)
MAX
UNIT
25°C
1.7
7
9
VIO
Input offset voltage
mV
Full range
Average temperature
coefficient of input offset
voltage
αVIO
25°C
5
μV/°C
25°C
Full range
25°C
15
250
500
50
IIB
Input bias current
Input offset current
nA
nA
5
IIO
Full range
150
Common-mode rejection
ratio
CMRR
kSVR
VCM = 0 to 4 V
25°C
25°C
50
65
60
dB
dB
Supply-voltage
rejection ratio
VCC = 2.7 V to 5 V, VO = 1 V,
VCM = 1 V
50
0
–0.2
4.2
Common-mode input
voltage range
VICR
CMRR ≥ 50 dB
25°C
V
4
25°C
Full range
25°C
VCC – 300
VCC – 400
VCC – 40
High level
RL = 2 kΩ to 2.5 V
120
VCC – 10
65
300
400
Low level
High level
Low level
Full range
25°C
VO
Output swing
mV
VCC – 100
VCC – 200
Full range
25°C
RL = 10 kΩ to 2.5 V
RL = 2 kΩ
180
280
Full range
25°C
15
10
5
100
Large-signal differential
voltage gain
AVD
V/mV
mA
Full range
Sourcing, VO = 0 V
Sinking, VO = 5 V
60
160
130
Output short-circuit
current
IOS
25°C
10
25°C
Full range
25°C
250
350
LMV321I
210
410
440
ICC
Supply current
LMV358I (both amplifiers)
μA
Full range
25°C
615
830
LMV324I/LMV324SI
(all four amplifiers)
Full range
25°C
1160
B1
Unity-gain bandwidth
Phase margin
CL = 200 pF
1
60
10
MHz
deg
dB
Φm
Gm
25°C
Gain margin
25°C
Equivalent input
noise voltage
Vn
f = 1 kHz
f = 1 kHz
25°C
39
nV/√Hz
Equivalent input
noise current
In
25°C
25°C
0.21
1
pA/√Hz
V/μs
SR
Slew rate
(1) Full range TA = –40°C to 85°C for I temperature and –40°C to 125°C for Q temperature.
(2) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
6
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
Shutdown Characteristics (LMV324S)
VCC+ = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX
UNIT
Supply current in shutdown mode
(per channel)
ICC(SHDN)
SHDN ≤ 0.6 V, TA = –40°C to 85°C
5
μA
t(on)
t(off)
Amplifier turn-on time
Amplifier turn-off time
AV = 1, RL = Open (measured at 50% point)
AV = 1, RL = Open (measured at 50% point)
2
μs
40
ns
(1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
7
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS
LMV321 FREQUENCY RESPONSE
LMV321 FREQUENCY RESPONSE
vs
vs
RESISTIVE LOAD
RESISTIVE LOAD
80
70
60
50
80
70
60
50
120
105
120
105
Vs = 5.0 V
R = 100 kΩ, 2 kΩ, 600 Ω
L
Vs = 2.7 V
R = 100 kΩ, 2 kΩ, 600 Ω
L
Phase
90
75
60
45
30
90
600 Ω
2 kΩ
Phase
75
60
45
30
600 Ω
40
30
20
40
2 kΩ
100 kΩ
100 kΩ
30
20
Gain
Gain
100 kΩ
10
0
600 Ω
10
0
15
0
15
100 kΩ
2 kΩ
600 Ω
2 kΩ
0
−15
10 M
−15
10 M
−10
−10
1 k
10 k
100 k
1 M
1 k
10 k
100 k
1 M
Frequency − Hz
Frequency − Hz
Figure 1.
Figure 2.
LMV321 FREQUENCY RESPONSE
LMV321 FREQUENCY RESPONSE
vs
vs
CAPACITIVE LOAD
CAPACITIVE LOAD
70
70
100
100
Phase
Phase
80
60
80
60
60
50
40
30
20
10
60
50
40
30
20
10
0 pF
0 pF
100 pF
500 pF
100 pF
500 pF
1000 pF
40
40
20
20
1000 pF
100 pF
Gain
0
0
Gain
−20
−40
−60
−20
−40
−60
Vs = 5.0 V
Vs = 5.0 V
R = 600 Ω
C = 0 pF
0
0
0 pF
500 pF
R = 100 kΩ
L
L
100 pF
0 pF
C = 0 pF
−10
−10
L
L
100 pF
500 pF
1000 pF
100 pF
500 pF
1000 pF
500 pF
−20
−30
−20
−30
1000 pF
−80
−80
1000 pF
−100
10 M
−100
10 M
10 k
100 k
1 M
Frequency − Hz
Figure 4.
10 k
100 k
1 M
Frequency − Hz
Figure 3.
8
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
STABILITY
vs
LMV321 FREQUENCY RESPONSE
vs
CAPACITIVE LOAD
TEMPERATURE
120
105
80
70
60
10000
1000
Vs = 5.0 V
= 2 kΩ
2.5 V
R
L
LMV324S
(25% Overshoot)
_
V
O
90
+
V
I
85°C
R
C
L
L
Phase
−2.5 V
75
60
45
50
40
30
25°C
−40°C
LMV3xx
(25% Overshoot)
Gain
100
10
30
15
20
10
85°C
25°C
V
= ±2.5 V
CC
A = +1
V
R
= 2 kΩ
= 100 mV
L
0
0
−40°C
V
O
PP
−15
10 M
−10
−2
−1.5
−1
−0.5
0
0.5
1
1.5
1 k
10 k
100 k
1 M
Frequency − Hz
Output Voltage − V
Figure 5.
STABILITY
vs
Figure 6.
STABILITY
vs
CAPACITIVE LOAD
CAPACITIVE LOAD
10000
1000
100
10000
1000
100
V
R
= ±2.5 V
= 2 kΩ
CC
2.5 V
L
A = 10
_
+
V
LMV324S
(25% Overshoot)
V
O
V
O
= 100 mV
PP
V
I
R
C
L
L
2.5 V
LMV324S
(25% Overshoot)
LMV3xx
(25% Overshoot)
134 kΩ
1.21 MΩ
+2.5 V
V
= ±2.5 V
LMV3xx
(25% Overshoot)
CC
_
+
A = +1
V
V
O
V
I
R = 1 MΩ
L
R
L
C
L
V
O
= 100 mV
PP
−2.5 V
10
10
−2.0 −1.5
−1
−0.5
0
0.5
1
1.5
−2.0 −1.5
−1
−0.5
0
0.5
1
1.5
Output Voltage − V
Output Voltage − V
Figure 7.
Figure 8.
Copyright © 1999–2007, Texas Instruments Incorporated
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LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
STABILITY
vs
SLEW RATE
vs
CAPACITIVE LOAD
SUPPLY VOLTAGE
10000
1000
100
1.500
1.400
1.300
1.200
1.100
R = 100 kΩ
L
V
= ±2.5 V
CC
LMV3xx
(25% Overshoot)
R = 1 MΩ
L
A = 10
V
V
O
= 100 mV
PP
Gain
NSLEW
LMV324S
(25% Overshoot)
LMV3xx
1.000
0.900
0.800
0.700
0.600
0.500
PSLEW
NSLEW
134 kΩ
1.21 MΩ
+2.5 V
_
+
V
O
LMV324S
V
I
R
C
L
L
−2.5 V
−1
PSLEW
10
−2.0
−1.5
−0.5
0
0.5
1
1.5
2.5
3.0
3.5
4.0
4.5
5.0
Output Voltage − V
V
− Supply Voltage − V
CC
Figure 9.
Figure 10.
SUPPLY CURRENT
vs
INPUT CURRENT
vs
SUPPLY VOLTAGE − QUAD AMPLIFIER
TEMPERATURE
700
600
500
400
300
200
100
0
−10
V
= 5 V
CC
LMV3xx
V = V /2
I
CC
LMV324S
−20
−30
−40
T
= 85°C
A
T
A
= 25°C
LMV3xx
T = −40°C
A
−50
−60
LMV324S
0
1
2
3
4
5
6
−40 −30−20 −10 0 10 20 30 40 50 60 70 80
V
CC
− Supply Voltage − V
T
A
− °C
Figure 11.
Figure 12.
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
SOURCE CURRENT
SOURCE CURRENT
vs
vs
OUTPUT VOLTAGE
OUTPUT VOLTAGE
100
100
V
CC
= 2.7 V
V
CC
= 5 V
10
1
10
1
LMV3xx
LMV3xx
LMV324S
LMV324S
0.1
0.1
0.01
0.01
0.001
0.001
0.001
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Output Voltage Referenced to V
− V
CC+
Output Voltage Referenced to V
Figure 13.
− V
CC+
Figure 14.
SINKING CURRENT
vs
SINKING CURRENT
vs
OUTPUT VOLTAGE
OUTPUT VOLTAGE
100
100
V
CC
= 5 V
V
CC
= 2.7 V
10
1
10
1
LMV324S
LMV324S
LMV3xx
LMV324
0.1
0.1
0.01
0.01
0.001
0.001
0.001
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Output Voltage Referenced to GND − V
Output Voltage Referenced to GND − V
Figure 15.
Figure 16.
Copyright © 1999–2007, Texas Instruments Incorporated
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11
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
SHORT-CIRCUIT CURRENT
SHORT-CIRCUIT CURRENT
vs
vs
TEMPERATURE
TEMPERATURE
120
100
80
300
270
240
210
180
150
120
90
LMV324S
= 5 V
V
CC
LMV324S
V
CC
= 5 V
LMV3xx
= 5 V
LMV3xx
V
CC
V
CC
= 5 V
60
LMV3xx
= 2.7 V
V
CC
40
LMV3xx
= 2.7 V
LMV324S
V
CC
V
CC
= 2.7 V
60
LMV324S
= 2.7 V
20
V
CC
30
0
0
−40 −30−20−10 0 10 20 30 40 50 60 70 80 90
− °C
−40−30−20−10
0
10 20 30 40 50 60 70 80 90
− °C
T
A
T
A
Figure 17.
−kSVR
Figure 18.
+k
SVR
vs
vs
FREQUENCY
FREQUENCY
80
70
90
80
70
60
LMV324S
LMV324S
V
= −5 V
V
R
= 5 V
= 10 kΩ
CC
CC
R = 10 kΩ
L
L
60
50
40
30
LMV3xx
LMV3xx
50
40
30
20
20
10
0
10
0
1k
100
10k
1M
100k
100
1k
10k
100k
1M
Frequency − Hz
Frequency − Hz
Figure 19.
Figure 20.
12
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
−kSVR
vs
+kSVR
vs
FREQUENCY
FREQUENCY
80
70
80
70
60
LMV324S
V
= 2.7 V
CC
V
= −2.7 V
CC
LMV324S
R = 10 kΩ
L
R = 10 kΩ
L
60
50
LMV3xx
LMV3xx
50
40
30
20
10
40
30
20
10
0
0
100
1k
10k
100k
1M
100
1k
10k
100k
1M
Frequency − Hz
Frequency − Hz
Figure 21.
Figure 22.
OUTPUT VOLTAGE SWING FROM RAILS
OUTPUT VOLTAGE
vs
vs
SUPPLY VOLTAGE
FREQUENCY
6
5
4
3
2
1
0
70
60
50
40
30
20
10
0
R = 10 kΩ
THD > 5%
A = 3
V
L
R = 10 kΩ
L
LMV3xx
= 5 V
LMV3xx
LMV324S
V
CC
Negative Swing
LMV324S
V
CC
= 5 V
LMV3xx
= 2.7 V
V
CC
LMV324S
= 2.7 V
V
CC
Positive Swing
1k
10k
100k
1M
10M
2.5
3.0
3.5
4.0
− Supply Voltage − V
Figure 23.
4.5
5.0
Frequency − Hz
V
CC
Figure 24.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
13
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
OPEN-LOOP OUTPUT IMPEDANCE
CROSSTALK REJECTION
vs
vs
FREQUENCY
FREQUENCY
150
110
100
90
80
70
60
50
40
30
20
LMV3xx
V
R
A
= 5 V
= 5 kΩ
CC
V
CC
= 2.7 V
LMV3xx
= 5 V
L
140
130
V
V = 1
CC
V
O
= 3 V
PP
120
LMV324S
= 2.7 V
V
CC
110
100
LMV324S
= 5 V
V
CC
90
100
1
1M
2M
3M
4M
1k
10k
100k
Frequency − Hz
Frequency− Hz
Figure 25.
Figure 26.
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV3xx
LMV324S
LMV324S
V
= ±2.5 V
= 2 kΩ
= 85°C
V
R
= ±2.5 V
= 2 kΩ
CC
CC
R
T
L
L
T = 25°C
A
1 µs/Div
1 µs/Div
Figure 27.
Figure 28.
14
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV3xx
LMV324S
LMV324S
V
R
= ±2.5 V
= 2 kΩ
V
= ±2.5 V
R = 2 kΩ
L
CC
CC
L
T
A
= −40°C
T
A
= 25°C
1 µs/Div
1 µs/Div
Figure 29.
Figure 30.
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV324S
LMV3xx
LMV324S
V
CC
= ±2.5 V
V
CC
= ±2.5 V
R
T
= 2 kΩ
= 85°C
R
T
= 2 kΩ
= −40°C
L
L
A
A
1 µs/Div
1 µs/Div
Figure 31.
Figure 32.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
15
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
INVERTING LARGE-SIGNAL
PULSE RESPONSE
INVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV3xx
LMV324S
LMV324S
V
= ±2.5 V
= 2 kΩ
= 25°C
V
R
T
= ±2.5 V
= 2 kΩ
= 85°C
CC
CC
R
T
L
L
A
A
1 µs/Div
1 µs/Div
Figure 33.
Figure 34.
INVERTING LARGE-SIGNAL
PULSE RESPONSE
INVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV3xx
LMV324S
LMV324S
V
R
T
= ±2.5 V
= 2 kΩ
= −40°C
V
= ±2.5 V
= 2 kΩ
= 25°C
CC
CC
R
T
L
L
A
A
1 µs/Div
1 µs/Div
Figure 35.
Figure 36.
16
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
INVERTING SMALL-SIGNAL
PULSE RESPONSE
INVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV3xx
LMV324S
LMV324S
V
R
= ±2.5 V
= 2 kΩ
CC
V
R
T
A
= ±2.5 V
= 2 kΩ
= 85°C
CC
L
L
T = −40°C
A
1 µs/Div
1 µs/Div
Figure 38.
Figure 37.
INPUT CURRENT NOISE
INPUT CURRENT NOISE
vs
vs
FREQUENCY
FREQUENCY
0.50
0.45
0.40
0.80
0.60
0.40
V
CC
= 2.7 V
V
CC
= 5 V
0.35
0.30
0.25
0.20
0.15
0.10
0.20
0.00
0.05
0.00
10
100
1k
10k
10
100
1k
10k
Frequency− Hz
Frequency− Hz
Figure 39.
Figure 40.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
17
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
INPUT VOLTAGE NOISE
vs
THD + N
vs
FREQUENCY
FREQUENCY
10.000
1.000
0.100
0.010
0.001
200
180
160
140
120
100
V
R
= 2.7 V
= 10 kΩ
= 1
CC
L
A
V
V
O
= 1 V
PP
LMV3xx
80
60
40
V
CC
= 2.7 V
LMV324S
V
CC
= 5 V
20
10
1000
10000
100
100000
10
100
1k
10k
Frequency − Hz
Frequency− Hz
Figure 41.
THD + N
Figure 42.
THD + N
vs
vs
FREQUENCY
FREQUENCY
10.000
1.000
0.100
0.010
0.001
10.000
V
= 5 V
CC
V
= 2.7 V
CC
R = 10 kΩ
AV = 1
L
R = 10 kΩ
AV = 10
L
V
O
= 1 V
PP
V
O
= 1 V
PP
1.000
0.100
0.010
0.001
LMV324S
LMV324S
LMV3xx
LMV3xx
10
1000
10000
100
100000
10
100
1000
10000
100000
Frequency− Hz
Frequency − Hz
Figure 43.
Figure 44.
18
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T–AUGUST 1999–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
THD + N
vs
FREQUENCY
10.000
V
CC
= 5 V
R = 10 kΩ
L
AV = 10
V
O
= 2.5 V
PP
1.000
0.100
0.010
0.001
LMV324S
LMV3xx
10
100
1000
10000
100000
Frequency− Hz
Figure 45.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
19
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
LMV321IDBVR
LMV321IDBVRG4
LMV321IDBVT
LMV321IDBVTE4
LMV321IDBVTG4
LMV321IDCKR
LMV321IDCKRG4
LMV321IDCKT
LMV321IDCKTE4
LMV321IDCKTG4
LMV324ID
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
D
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324IDG4
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324IDR
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324IDRG4
LMV324IPWR
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SOIC
PW
PW
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324IPWRG4
LMV324QD
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324QDG4
LMV324QDR
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324QDRG4
LMV324QPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324QPWE4
LMV324QPWG4
LMV324QPWR
LMV324QPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
LMV324SID
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
8
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324SIDE4
LMV324SIDG4
LMV324SIDR
SOIC
SOIC
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV324SIDRE4
LMV324SIDRG4
LMV324SIPWR
LMV324SIPWRE4
LMV324SIPWRG4
LMV358ID
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358IDDUR
LMV358IDDURE4
LMV358IDDURG4
LMV358IDE4
VSSOP
VSSOP
VSSOP
SOIC
DDU
DDU
DDU
D
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358IDG4
SOIC
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358IDGKR
LMV358IDGKRG4
LMV358IDR
MSOP
MSOP
SOIC
DGK
DGK
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358IDRE4
LMV358IDRG4
LMV358IPW
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358IPWE4
LMV358IPWG4
LMV358IPWR
LMV358IPWRE4
LMV358IPWRG4
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
LMV358QD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358QDDUR
LMV358QDDURE4
LMV358QDDURG4
LMV358QDE4
VSSOP
VSSOP
VSSOP
SOIC
DDU
DDU
DDU
D
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358QDG4
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358QDGKR
LMV358QDGKRG4
LMV358QDR
MSOP
MSOP
SOIC
DGK
DGK
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358QDRE4
LMV358QDRG4
LMV358QPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV358QPWE4
LMV358QPWG4
LMV358QPWR
LMV358QPWRE4
LMV358QPWRG4
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV321, LMV324, LMV358 :
Automotive: LMV321-Q1, LMV324-Q1, LMV358-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
LMV321IDBVR
LMV321IDBVR
LMV321IDBVT
LMV321IDBVT
LMV321IDCKR
LMV321IDCKR
LMV321IDCKT
LMV321IDCKT
LMV324IDR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
5
5
3000
3000
250
180.0
178.0
180.0
178.0
178.0
180.0
180.0
178.0
330.0
330.0
330.0
330.0
330.0
330.0
180.0
330.0
330.0
330.0
9.2
9.0
3.23
3.23
3.23
3.23
2.4
3.17
3.17
3.17
3.17
2.5
1.37
1.37
1.37
1.37
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
Q1
Q1
Q3
Q1
Q1
Q1
5
9.2
8.0
5
250
9.0
8.0
5
3000
3000
250
9.0
8.0
SC70
5
9.2
2.24
2.24
2.4
2.34
2.34
2.5
1.22
1.22
1.2
8.0
SC70
5
9.2
8.0
SC70
5
250
9.0
8.0
SOIC
14
14
14
14
16
16
8
2500
2000
2500
2000
2500
2000
3000
2500
2500
2500
16.4
12.4
16.4
12.4
16.4
12.4
9.2
6.5
9.0
2.1
16.0
12.0
16.0
12.0
16.0
12.0
8.0
LMV324IPWR
LMV324QDR
TSSOP
SOIC
PW
D
7.0
5.6
1.6
6.5
9.0
2.1
LMV324QPWR
LMV324SIDR
LMV324SIPWR
LMV358IDDUR
LMV358IDGKR
LMV358IDGKR
LMV358IDR
TSSOP
SOIC
PW
D
7.0
5.6
1.6
6.5
10.3
5.6
2.1
TSSOP
VSSOP
MSOP
MSOP
SOIC
PW
DDU
DGK
DGK
D
7.0
1.6
2.25
5.3
3.35
3.4
1.05
1.4
8
12.4
12.4
12.4
12.0
12.0
12.0
8
5.3
3.3
1.3
8
6.4
5.2
2.1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
LMV358IDR
LMV358IPWR
LMV358QDDUR
LMV358QDGKR
LMV358QDR
SOIC
TSSOP
VSSOP
MSOP
SOIC
D
8
8
8
8
8
8
2500
2000
3000
2500
2500
2000
330.0
330.0
180.0
330.0
330.0
330.0
12.4
12.4
9.2
6.4
7.0
2.25
5.3
6.4
7.0
5.2
3.6
3.35
3.4
5.2
3.6
2.1
1.6
1.05
1.4
2.1
1.6
8.0
8.0
4.0
8.0
8.0
8.0
12.0
12.0
8.0
Q1
Q1
Q3
Q1
Q1
Q1
PW
DDU
DGK
D
12.4
12.4
12.4
12.0
12.0
12.0
LMV358QPWR
TSSOP
PW
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV321IDBVR
LMV321IDBVR
LMV321IDBVT
LMV321IDBVT
LMV321IDCKR
LMV321IDCKR
LMV321IDCKT
LMV321IDCKT
LMV324IDR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
5
5
3000
3000
250
205.0
180.0
205.0
180.0
180.0
205.0
205.0
180.0
346.0
346.0
346.0
200.0
180.0
200.0
180.0
180.0
200.0
200.0
180.0
346.0
346.0
346.0
33.0
18.0
33.0
18.0
18.0
33.0
33.0
18.0
33.0
29.0
33.0
5
5
250
5
3000
3000
250
SC70
5
SC70
5
SC70
5
250
SOIC
14
14
14
2500
2000
2500
LMV324IPWR
LMV324QDR
TSSOP
SOIC
PW
D
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV324QPWR
LMV324SIDR
LMV324SIPWR
LMV358IDDUR
LMV358IDGKR
LMV358IDGKR
LMV358IDR
TSSOP
SOIC
PW
D
14
16
16
8
2000
2500
2000
3000
2500
2500
2500
2500
2000
3000
2500
2500
2000
346.0
333.2
346.0
202.0
358.0
370.0
340.5
346.0
346.0
202.0
358.0
340.5
346.0
346.0
345.9
346.0
201.0
335.0
355.0
338.1
346.0
346.0
201.0
335.0
338.1
346.0
29.0
28.6
29.0
28.0
35.0
55.0
20.6
29.0
29.0
28.0
35.0
20.6
29.0
TSSOP
VSSOP
MSOP
MSOP
SOIC
PW
DDU
DGK
DGK
D
8
8
8
LMV358IDR
SOIC
D
8
LMV358IPWR
LMV358QDDUR
LMV358QDGKR
LMV358QDR
TSSOP
VSSOP
MSOP
SOIC
PW
DDU
DGK
D
8
8
8
8
LMV358QPWR
TSSOP
PW
8
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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