LMV393IDGKR [TI]
GENRAL-PURPOSE LOW-VOLTAGE COMPARATORS; GENRAL -目的LOW-电压比较器
| 型号： | LMV393IDGKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | GENRAL-PURPOSE LOW-VOLTAGE COMPARATORS |
| 文件： | 总17页 (文件大小：534K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢀ ꢉꢊ ꢀ ꢁꢂ ꢃ ꢋ ꢃ ꢌꢍꢎ ꢀꢊ ꢀ ꢁꢂ ꢃꢃ ꢋ ꢏ ꢍꢎ ꢌ
ꢈ ꢉꢇꢉ ꢐꢎꢀ ꢑꢒꢍꢐꢒ ꢓ ꢅꢉ ꢀ ꢓ ꢔꢑꢂꢓ ꢀꢕꢎꢈ ꢉ ꢖꢓ ꢁ ꢒꢎ ꢐꢎꢕꢓ ꢐꢅ
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
LMV339 . . . D OR PW PACKAGE
(TOP VIEW)
D
D
2.7-V and 5-V Performance
Low Supply Current:
LMV331 . . . 60 µA Typ
LMV393 . . . 100 µA Typ
LMV339 . . . 170 µA Typ
Input Common-Mode Voltage Range
Includes Ground
1
2
3
4
5
6
7
14
13
12
11
10
9
3OUT
4OUT
GND
4IN+
4IN−
3IN+
3IN−
2OUT
1OUT
V
CC+
D
D
D
1IN−
1IN+
2IN−
2IN+
Low Output Saturation Voltage
. . . 200 mV Typ
8
Open-Collector Output for Maximum
Flexibility
LMV393 . . . D, DDU, DGK, OR PW PACKAGE
(TOP VIEW)
description/ordering information
1
2
3
4
1OUT
1IN−
1IN+
GND
V
CC+
8
7
6
5
The LMV393 and LMV339 devices are
low-voltage (2.7 V to 5.5 V) versions of the dual
and quad comparators, LM393 and LM339, which
operate from 5 V to 30 V. The LMV331 is the
single-comparator version.
2OUT
2IN−
2IN+
LMV331 . . . DBV OR DCK PACKAGE
(TOP VIEW)
The LMV331, LMV339, and LMV393 are the most
cost-effective solutions for applications where
low-voltage operation, low power, space saving,
and price are the primary specifications in circuit
design for portable consumer products. These
devices offer specifications that meet or exceed
the familiar LM339 and LM393 devices at a
fraction of the supply current.
1
IN+
GND
IN−
5
4
V
CC+
2
3
OUT
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
‡
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 2500
Tube of 75
LMV331IDCKR
LMV331IDCKT
LMV331IDBVR
LMV331IDBVT
LMV393IDGKR
LMV393ID
SC-70 (DCK)
R2_
Single
Dual
SOT23-5 (DBV)
R1I_
R9_
MSOP/VSSOP (DGK)
SOIC (D)
MV393I
Reel of 2500
Tube of 90
LMV393IDR
−40°C to 85°C
LMV393IPW
LMV393IPWR
LMV393IDDUR
LMV339ID
TSSOP (PW)
MV393I
RABR
Reel of 2000
Reel of 2000
Tube of 50
VSSOP (DDU)
SOIC (D)
LMV339I
MV339I
Reel of 2500
Tube of 150
Reel of 2000
LMV339IDR
Quad
LMV339IPW
LMV339IPWR
TSSOP (PW)
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2005, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃ ꢃꢄ ꢅꢆ ꢇ ꢈꢀ ꢉꢊ ꢀꢁ ꢂꢃ ꢋ ꢃ ꢌꢍ ꢎꢀ ꢊ ꢀꢁ ꢂꢃ ꢃ ꢋ ꢏ ꢍꢎꢌ
ꢈꢉ ꢇꢉꢐ ꢎ ꢀ ꢑꢒꢍ ꢐ ꢒꢓ ꢅ ꢉ ꢀꢓ ꢔꢑꢂ ꢓꢀꢕꢎꢈ ꢉ ꢖ ꢓꢁ ꢒꢎꢐꢎꢕꢓ ꢐꢅ
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
symbol (each comparator)
IN−
IN+
−
+
OUT
simplified schematic
V
CC+
Q6
Q7
M
OUT
Q1
Q2
Q3
Q4
Q5
IN+
IN−
R1
R2
R3
GND
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
CC+
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Input voltage range, V (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V
ID
I
Package thermal impedance, θ (see Notes 3 and 4): D (8-pin) package . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
D (14-pin) package . . . . . . . . . . . . . . . . . . . . 86°C/W
DBV package . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . 252°C/W
DDU package . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W
DGK package . . . . . . . . . . . . . . . . . . . . . . . 172°C/W
PW (8-pin) package . . . . . . . . . . . . . . . . . . 149°C/W
PW (14-pin) package . . . . . . . . . . . . . . . . . . 113°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and V
2. Differential voltages are at IN+ with respect to IN−.
specified for the measurement of I ) are with respect to the network GND.
OS
CC+
3. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
JA
J
A
ambient temperature is P = (T (max) − T )/θ . Selecting the maximum of 150°C can affect reliability.
D
J
A
JA
4. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢀ ꢉꢊ ꢀ ꢁꢂ ꢃ ꢋ ꢃ ꢌꢍꢎ ꢀꢊ ꢀ ꢁꢂ ꢃꢃ ꢋ ꢏ ꢍꢎ ꢌ
ꢈ ꢉꢇꢉ ꢐꢎꢀ ꢑꢒꢍꢐꢒ ꢓ ꢅꢉ ꢀ ꢓ ꢔꢑꢂꢓ ꢀꢕꢎꢈ ꢉ ꢖꢓ ꢁ ꢒꢎ ꢐꢎꢕꢓ ꢐꢅ
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
recommended operating conditions
MIN
MAX
5.5
UNIT
V
V
V
Supply voltage (single-supply operation)
Output voltage
2.7
CC+
V
CC+
+ 0.3
85
V
OUT
T
A
Operating free-air temperature
−40
°C
electrical characteristics at specified free-air temperature, V
otherwise noted)
= 2.7 V, GND = 0 V (unless
CC+
PARAMETER
TEST CONDITIONS
T
A
MIN
TYP
MAX
UNIT
V
IO
Input offset voltage
25°C
1.7
7
mV
Average temperature coefficient
of input offset voltage
aVIO
−40°C to 85°C
5
mV/°C
25°C
−40°C to 85°C
25°C
10
250
400
50
I
Input bias current
nA
IB
5
I
I
Input offset current
nA
IO
−40°C to 85°C
25°C
150
Output current (sinking)
V
O
≤ 1.5 V
5
23
mA
O
25°C
0.003
Output leakage current
mA
−40°C to 85°C
25°C
1
V
V
Common-mode input voltage range
Saturation voltage
−0.1 to 2
200
V
ICR
I
O
≤ 1 mA
25°C
mV
SAT
LMV331
25°C
40
100
140
200
LMV393 (both comparators)
LMV339 (all four comparators)
25°C
70
I
Supply current
mA
CC
25°C
140
switching characteristics, T = 25°C, V
= 2.7 V, R = 5.1 kΩ, GND = 0 V (unless otherwise noted)
L
A
CC+
PARAMETER
TEST CONDITIONS
TYP
1000
350
UNIT
Input overdrive = 10 mV
t
t
Propagation delay, high- to low-level output switching
ns
PHL
Input overdrive = 100 mV
Input overdrive = 10 mV
Input overdrive = 100 mV
500
Propagation delay, low- to high-level output switching
ns
PLH
400
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃ ꢃꢄ ꢅꢆ ꢇ ꢈꢀ ꢉꢊ ꢀꢁ ꢂꢃ ꢋ ꢃ ꢌꢍ ꢎꢀ ꢊ ꢀꢁ ꢂꢃ ꢃ ꢋ ꢏ ꢍꢎꢌ
ꢈꢉ ꢇꢉꢐ ꢎ ꢀ ꢑꢒꢍ ꢐ ꢒꢓ ꢅ ꢉ ꢀꢓ ꢔꢑꢂ ꢓꢀꢕꢎꢈ ꢉ ꢖ ꢓꢁ ꢒꢎꢐꢎꢕꢓ ꢐꢅ
SLCS136M − AUGUST 1999 − REVISED NOVEMBER 2005
electrical characteristics at specified free-air temperature, V
noted)
= 5 V, GND = 0 V (unless otherwise
CC+
PARAMETER
TEST CONDITIONS
T
A
MIN
TYP
MAX
UNIT
25°C
1.7
7
9
V
IO
Input offset voltage
mV
−40°C to 85°C
Average temperature coefficient
of input offset voltage
aVIO
25°C
5
mV/°C
25°C
−40°C to 85°C
25°C
25
250
400
50
I
Input bias current
nA
IB
2
I
I
Input offset current
nA
IO
−40°C to 85°C
25°C
150
Output current (sinking)
V
O
≤ 1.5 V
10
20
84
mA
O
25°C
0.003
Output leakage current
mA
−40°C to 85°C
25°C
1
V
Common-mode input voltage range
Large-signal differential voltage gain
−0.1 to 4.2
50
V
ICR
A
25°C
V/mV
VD
25°C
200
400
700
120
150
200
250
300
350
V
Saturation voltage
I
≤ 4 mA
mV
SAT
O
−40°C to 85°C
25°C
60
100
170
LMV331
−40°C to 85°C
25°C
I
Supply current
LMV393 (both comparators)
LMV339 (all four comparators)
mA
CC
−40°C to 85°C
25°C
−40°C to 85°C
switching characteristics, T = 25°C, V
= 5 V, R = 5.1 kΩ, GND = 0 V (unless otherwise noted)
L
A
CC+
PARAMETER
TEST CONDITIONS
TYP
600
200
450
300
UNIT
Input overdrive = 10 mV
t
t
Propagation delay, high- to low-level output switching
ns
PHL
Input overdrive = 100 mV
Input overdrive = 10 mV
Input overdrive = 100 mV
Propagation delay, low- to high-level output switching
ns
PLH
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
3-May-2007
PACKAGING INFORMATION
Orderable Device
LMV331IDBVR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV331IDBVRE4
LMV331IDBVRG4
LMV331IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV331IDBVTE4
LMV331IDCKR
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV331IDCKRE4
LMV331IDCKRG4
LMV331IDCKT
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV331IDCKTE4
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV331IDCKTG4
LMV339ID
ACTIVE
ACTIVE
SC70
SOIC
DCK
D
5
250
TBD
Call TI
Call TI
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV339IDE4
LMV339IDG4
LMV339IDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
14
14
14
14
14
14
14
8
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV339IDRE4
LMV339IDRG4
LMV339IPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV339IPWE4
LMV339IPWR
LMV339IPWRE4
LMV393ID
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV393IDDUR
LMV393IDDURE4
LMV393IDE4
VSSOP
VSSOP
SOIC
DDU
DDU
D
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-May-2007
Orderable Device
LMV393IDG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV393IDGKR
LMV393IDGKRG4
LMV393IDR
MSOP
MSOP
SOIC
DGK
DGK
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV393IDRE4
LMV393IDRG4
LMV393IPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV393IPWE4
LMV393IPWR
LMV393IPWRE4
LMV393IPWRG4
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
180
330
330
(mm)
16
LMV339IDR
LMV339IPWR
LMV393IDGKR
LMV393IDR
D
PW
DGK
D
14
14
8
MLA
MLA
HNT
FMX
MLA
6.5
7.0
5.3
6.4
7.0
9.0
5.6
3.4
5.2
3.6
2.1
1.6
1.4
2.1
1.6
8
8
8
8
8
16
12
12
12
12
Q1
Q1
Q1
Q1
Q1
12
13
8
12
LMV393IPWR
PW
8
12
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
LMV339IDR
LMV339IPWR
LMV393IDGKR
LMV393IDR
D
PW
DGK
D
14
14
8
MLA
MLA
HNT
FMX
MLA
333.2
338.1
0.0
333.2
340.5
0.0
28.58
20.64
0.0
8
338.1
338.1
340.5
340.5
20.64
20.64
LMV393IPWR
PW
8
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
相关型号：
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