LMV7291MG/NOPB [TI]

具有轨到轨输入的单路 1.8V 低功耗比较器 | DCK | 5 | -40 to 85;
LMV7291MG/NOPB
型号: LMV7291MG/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有轨到轨输入的单路 1.8V 低功耗比较器 | DCK | 5 | -40 to 85

放大器 信息通信管理 光电二极管 比较器
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LMV7291  
www.ti.com  
SNOSA86E FEBRUARY 2004REVISED MARCH 2013  
LMV7291 Single 1.8V Low Power Comparator with Rail-to-Rail Input  
Check for Samples: LMV7291  
1
FEATURES  
DESCRIPTION  
The LMV7291 is  
a rail-to-rail input low power  
2
(VS = 1.8V, TA = 25°C, Typical  
Values unless Specified)  
comparator, characterized at supply voltage 1.8V,  
2.7V and 5.0V. It consumes only 9uA supply current  
per channel while achieving a 800ns propagation  
delay.  
Single Supply  
Ultra Low Supply Current 9µA per Channel  
Low Input Bias Current 10nA  
Low Input Offset Current 200pA  
Low ensured VOS 4mV  
The LMV7291 is available in SC70 package. With this  
tiny package, the PC board area can be significantly  
reduced. It is ideal for low voltage, low power and  
space critical designs.  
Propagation Delay 880ns (20mV Overdrive)  
The LMV7291 features a push-pull output stage  
which allows operation with minimum power  
consumption when driving a load.  
Input Common Mode Voltage Range 0.1V  
beyond Rails  
The LMV7291 is built with Texas Instruments'  
advance submicron silicon-gate BiCMOS process. It  
has bipolar inputs for improved noise performance  
and CMOS outputs for rail-to-rail output swing.  
APPLICATIONS  
Mobile Communications  
Laptops and PDA's  
Battery Powered Electronics  
General Purpose Low Voltage Applications  
Typical Circuit  
V
IN  
V
CC  
R
1
C1 =  
0.1µF  
C2 =  
10µF  
+
-
V
OUT  
R
2
V
REF  
Figure 1. Threshold Detector  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  
LMV7291  
SNOSA86E FEBRUARY 2004REVISED MARCH 2013  
www.ti.com  
(1)(2)  
Absolute Maximum Ratings  
ESD Tolerance  
(3)  
2KV  
(4)  
200V  
VIN Differential  
±Supply Voltage  
5.5V  
V+ +0.1V, V0.1V  
Supply Voltage (V+ - V)  
Voltage at Input/Output pins  
Soldering Information  
Infrared or Convection (20 sec.)  
Wave Soldering (10 sec.)  
Storage Temperature Range  
235°C  
260°C  
65°C to +150°C  
+150°C  
(5)  
Junction Temperature  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test  
conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) Human body model, 1.5kin series with 100pF.  
(4) Machine Model, 0in series with 200pF.  
(5) Typical values represent the most likely parametric norm.  
(1)  
Operating Ratings  
(2)  
Operating Temperature Range  
40°C to +85°C  
(2)  
Package Thermal Resistance  
SC70  
265°C/W  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test  
conditions, see the Electrical Characteristics.  
(2) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient  
temperature is PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly into a PC board.  
2
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LMV7291  
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SNOSA86E FEBRUARY 2004REVISED MARCH 2013  
1.8V Electrical Characteristics  
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 1.8V, V= 0V. Boldface limits apply at the temperature  
(1)  
extremes.  
Symbol  
VOS  
Parameter  
Input Offset Voltage  
Condition  
Min(2)  
Typ(3)  
Max(2)  
Units  
0.3  
4
mV  
6
(4)  
TC VOS  
Input Offset Temperature Drift  
Input Bias Current  
VCM = 0.9V  
LMV7291  
10  
10  
200  
9
uV/C  
nA  
IB  
IOS  
IS  
Input Offset Current  
Supply Current  
pA  
12  
14  
µA  
ISC  
Output Short Circuit Current  
Output Voltage High  
Sourcing, VO = 0.9V  
Sinking, VO = 0.9V  
IO = 0.5mA  
3.5  
4
6
mA  
6
VOH  
VOL  
VCM  
1.7  
1.58  
1.74  
1.63  
52  
V
IO = 1.5mA  
Output Voltage Low  
IO = 0.5mA  
70  
220  
1.9  
mV  
IO = 1.5mA  
166  
Input Common Mode Voltage Range  
CMRR > 45 dB  
V
0.1  
47  
V
CMRR  
PSRR  
Common Mode Rejection Ratio  
Power Supply Rejection Ratio  
Output Leakage Current  
0 < VCM < 1.8V  
V+ = 1.8V to 5V  
VO = 1.8V  
78  
80  
2
dB  
dB  
pA  
55  
ILEAKAGE  
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very  
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical  
tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond  
which the device may be permanently degraded, either mechanically or electrically.  
(2) All limits are specified by testing or statistical analysis.  
(3) Typical values represent the most likely parametric norm.  
(4) Offset Voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.  
1.8V AC Electrical Characteristics  
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 1.8V, V= 0V, VCM = 0.5V, VO = V+/2 and RL > 1Mto V.  
(1)  
Boldface limits apply at the temperature extremes.  
Symbol  
tPHL  
Parameter  
Condition  
Min(2)  
Typ(3)  
Max(2)  
Units  
Propagation Delay  
Input Overdrive = 20mV  
880  
ns  
(High to Low)  
Load = 50pF//5kΩ  
Input Overdrive = 50mV  
Load = 50pF//5kΩ  
570  
1100  
800  
ns  
ns  
ns  
tPLH  
Propagation Delay  
(Low to High)  
Input Overdrive = 20mV  
Load = 50pF//5kΩ  
Input Overdrive = 50mV  
Load = 50pF//5kΩ  
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very  
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical  
tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond  
which the device may be permanently degraded, either mechanically or electrically.  
(2) All limits are specified by testing or statistical analysis.  
(3) Typical values represent the most likely parametric norm.  
Copyright © 2004–2013, Texas Instruments Incorporated  
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SNOSA86E FEBRUARY 2004REVISED MARCH 2013  
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2.7V Electrical Characteristics  
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 2.7V, V= 0V. Boldface limits apply at the temperature  
(1)  
extremes.  
Symbol  
VOS  
Parameter  
Input Offset Voltage  
Conditions  
Min(2)  
Typ(3)  
Max(2)  
Units  
0.3  
4
mV  
6
(4)  
TC VOS  
Input Offset Temperature Drift  
Input Bias Current  
VCM = 1.35V  
10  
10  
200  
9
µV/C  
nA  
IB  
IOS  
IS  
Input offset Current  
Supply Current  
pA  
LMV7291  
13  
15  
µA  
ISC  
Output Short Circuit Current  
Output Voltage High  
Sourcing, VO = 1.35V  
Sinking, VO = 1.35V  
IO = 0.5mA  
12  
12  
15  
15  
mA  
VOH  
VOL  
VCM  
2.63  
2.48  
2.66  
2.55  
50  
V
IO = 2.0mA  
Output Voltage Low  
IO = 0.5mA  
70  
220  
2.8  
mV  
IO = 2mA  
155  
Input Common Voltage Range  
CMRR > 45dB  
V
0.1  
47  
V
CMRR  
PSRR  
Common Mode Rejection Ratio  
Power Supply Rejection Ratio  
Output Leakage Current  
0 < VCM < 2.7V  
V+ = 1.8V to 5V  
VO = 2.7V  
78  
80  
2
dB  
dB  
pA  
55  
ILEAKAGE  
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very  
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical  
tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond  
which the device may be permanently degraded, either mechanically or electrically.  
(2) All limits are specified by testing or statistical analysis.  
(3) Typical values represent the most likely parametric norm.  
(4) Offset Voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.  
2.7V AC Electrical Characteristics  
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 2.7V, V= 0V, VCM = 0.5V, VO = V+/2 and RL > 1Mto V.  
(1)  
Boldface limits apply at the temperature extremes.  
Symbol  
tPHL  
Parameter  
Condition  
Min(2)  
Typ(3)  
Max(2)  
Units  
Propagation Delay  
Input Overdrive = 20mV  
1200  
ns  
(High to Low)  
Load = 50pF//5kΩ  
Input Overdrive = 50mV  
Load = 50pF//5kΩ  
810  
1300  
860  
ns  
ns  
ns  
tPLH  
Propagation Delay  
(Low to High)  
Input Overdrive = 20mV  
Load = 50pF//5kΩ  
Input Overdrive = 50mV  
Load = 50pF//5kΩ  
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very  
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical  
tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond  
which the device may be permanently degraded, either mechanically or electrically.  
(2) All limits are specified by testing or statistical analysis.  
(3) Typical values represent the most likely parametric norm.  
4
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LMV7291  
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SNOSA86E FEBRUARY 2004REVISED MARCH 2013  
5V Electrical Characteristics  
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 5V, V= 0V. Boldface limits apply at the temperature  
(1)  
extremes.  
Symbol  
VOS  
Parameter  
Input Offset Voltage  
Conditions  
Min(2)  
Typ(3)  
Max(2)  
Units  
0.3  
4
mV  
6
(4)  
TC VOS  
Input Offset Temperature Drift  
Input Bias Current  
VCM = 2.5V  
10  
10  
µV/C  
nA  
IB  
IOS  
IS  
Input Offset Current  
Supply Current  
200  
10  
pA  
LMV7291  
14  
16  
µA  
ISC  
Output Short Circuit Current  
Output Voltage High  
Sourcing, VO = 2.5V  
Sinking, VO = 2.5V  
IO = 0.5mA  
28  
28  
34  
34  
mA  
VOH  
VOL  
VCM  
4.93  
4.70  
4.96  
4.77  
27  
V
mV  
V
IO = 4.0mA  
Output Voltage Low  
IO = 0.5mA  
70  
300  
5.1  
IO = 4.0mA  
225  
Input Common Voltage Range  
CMRR > 45dB  
0.1  
47  
CMRR  
PSRR  
Common Mode Rejection Ratio  
Power Supply Rejection Ratio  
Output Leakage Current  
0 < VCM < 5.0V  
V+ = 1.8V to 5V  
VO = 5V  
78  
80  
2
dB  
dB  
pA  
55  
ILEAKAGE  
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very  
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical  
tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond  
which the device may be permanently degraded, either mechanically or electrically.  
(2) All limits are specified by testing or statistical analysis.  
(3) Typical values represent the most likely parametric norm.  
(4) Offset Voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.  
5.0V AC Electrical Characteristics  
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 5.0V, V= 0V, VCM = 0.5V, VO = V+/2 and RL > 1Mto V.  
(1)  
Boldface limits apply at the temperature extremes.  
Symbol  
tPHL  
Parameter  
Condition  
Min(2)  
Typ(3)  
Max(2)  
Units  
Propagation Delay  
Input Overdrive = 20mV  
2100  
ns  
(High to Low)  
Load = 50pF//5kΩ  
Input Overdrive = 50mV  
Load = 50pF//5kΩ  
1380  
1800  
1100  
ns  
ns  
ns  
tPLH  
Propagation Delay  
(Low to High)  
Input Overdrive = 20mV  
Load = 50pF//5kΩ  
Input Overdrive = 50mV  
Load = 50pF//5kΩ  
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very  
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical  
tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond  
which the device may be permanently degraded, either mechanically or electrically.  
(2) All limits are specified by testing or statistical analysis.  
(3) Typical values represent the most likely parametric norm.  
Copyright © 2004–2013, Texas Instruments Incorporated  
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Connection Diagram  
1
5
+
V
V
OUT  
2
GND  
+IN  
3
4
-IN  
Figure 2. 5-Pin SC70 – Top View  
See Package Number DCK  
6
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SNOSA86E FEBRUARY 2004REVISED MARCH 2013  
Typical Performance Characteristics  
(TA = 25°C, Unless otherwise specified).  
VOS  
vs.  
VCM  
VOS  
vs.  
VCM  
V
= ±0.9V  
SUPPLY  
V
= ±1.35V  
SUPPLY  
800  
400  
0
800  
400  
0
-40°C  
-40°C  
25°C  
85°C  
-400  
-800  
-400  
-800  
25°C  
85°C  
-0.9 -0.7 -0.5 -0.3 -0.1 0.1 0.3 0.5 0.7 0.9  
(V)  
-1.35 -0.9 -0.45  
0
0.45  
0.9  
1.35  
V
V
(V)  
CM  
CM  
Figure 3.  
Figure 4.  
VOS  
vs.  
VCM  
Short Circuit  
vs.  
Supply Voltage  
40  
V
= ±2.5V  
SUPPLY  
800  
400  
0
SOURCE  
30  
20  
10  
-40°C  
SINK  
-400  
-800  
25°C  
85°C  
0
-2.5 -2  
-1  
0
1
2 2.5  
1.8  
2.44  
3.08  
3.72  
4.36  
5.0  
V
(V)  
CM  
SUPPLY VOLTAGE (V)  
Figure 5.  
Figure 6.  
Supply Current  
vs.  
Supply Voltage  
Supply Current  
vs.  
Supply Voltage  
25  
10  
9
85°C  
20  
15  
10  
5
85°C  
85°C  
8
7
6
5
25°C  
25°C  
-40°C  
-40°C  
V
= HIGH  
OUT  
0
5
1.5  
2
2.5  
3
3.5  
(V)  
4
4.5  
1.8  
2.44  
3.08  
3.72  
4.36  
5.0  
V
SUPPLY  
SUPPLY VOLTAGE (V)  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
(TA = 25°C, Unless otherwise specified).  
Supply Current  
Output Positive Swing  
vs.  
vs.  
Supply Voltage  
VSUPPLY  
600  
500  
400  
25  
20  
I
SOURCE  
85°C  
15  
4mA  
300  
200  
10  
2mA  
25°C  
-40°C  
1.5mA  
5
100  
0
0.5mA  
V
= LOW  
OUT  
4
0
1.8  
2.3  
2.8  
3.3  
3.8  
(V)  
4.3  
4.8  
5
1.5  
2
2.5  
3
3.5  
(V)  
4.5  
V
V
SUPPLY  
SUPPLY  
Figure 9.  
Figure 10.  
Output Negative Swing  
Output Positive Swing  
vs.  
vs.  
VSUPPLY  
ISOURCE  
600  
500  
400  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
V
= 1.8V  
SUPPLY  
I
SINK  
85°C  
4mA  
25°C  
300  
200  
2mA  
1.5mA  
-40°C  
100  
0
0.5mA  
1.8  
2.3  
2.8  
3.3  
3.8  
(V)  
4.3  
4.8  
0
0.5  
1
1.5  
I
2
2.5  
3
3.5  
4
(mA)  
V
SOURCE  
SUPPLY  
Figure 11.  
Figure 12.  
Output Negative Swing  
Output Positive Swing  
vs.  
vs.  
ISINK  
ISOURCE  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.5  
0.45  
0.4  
V
= 1.8V  
V
= 2.7V  
SUPPLY  
SUPPLY  
85°C  
85°C  
0.35  
0.3  
25°C  
25°C  
0.25  
0.2  
0.15  
-40°  
0.1  
-40°C  
0.05  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
0.5  
1
1.5  
2
2.5  
(mA)  
3
3.5  
4
I
I
(mA)  
SINK  
SOURCE  
Figure 13.  
Figure 14.  
8
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Typical Performance Characteristics (continued)  
(TA = 25°C, Unless otherwise specified).  
Output Negative Swing  
Output Negative Swing  
vs.  
vs.  
ISINK  
ISINK  
0.5  
0.4  
0.3  
0.2  
V
= 2.7V  
SUPPLY  
V
= 5V  
SUPPLY  
0.45  
0.4  
85°C  
85°C  
0.35  
0.3  
25°C  
25°C  
0.25  
0.2  
0.15  
0.1  
0
0.1  
-40°C  
-40°C  
0.05  
0
0
0.5  
1
1.5  
2
2.5  
(mA)  
3
3.5  
4
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
I
I
(mA)  
SINK  
SINK  
Figure 15.  
Figure 16.  
Output Positive Swing  
vs.  
ISOURCE  
Propagation Delay (tPLH)  
0.4  
0.3  
0.2  
5
4
3
2
1
0
V = 1.8V  
CC  
TEMP = 25°C  
LOAD = 5kW//50pF  
V
= 5V  
SUPPLY  
85°C  
20mV  
50mV  
25°C  
ö
ö
100  
0.1  
0
0
OVERDRIVE  
-40°C  
-100  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
500 1000 1500 2000 2500 3000  
TIME (ns)  
I
(mA)  
SOURCE  
Figure 17.  
Figure 18.  
Propagation Delay (tPHL  
)
Propagation Delay (tPLH)  
5
4
3
2
1
0
5
4
3
2
1
0
V
= 2.7V  
V
= 1.8 V  
CC  
TEMP = 25°C  
LOAD = 5kW//50pF  
CC  
TEMP = 25°C  
LOAD = 5kW//50pF  
50mV  
20mV  
50mV  
20mV  
ö
ö
ö
ö
100  
100  
OVERDRIVE  
OVERDRIVE  
0
0
-100  
-100  
0
500 1000 1500 2000 2500 3000  
TIME (ns)  
0
500 1000 1500 2000 2500 3000  
TIME (ns)  
Figure 19.  
Figure 20.  
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Typical Performance Characteristics (continued)  
(TA = 25°C, Unless otherwise specified).  
Propagation Delay (tPHL  
)
Propagation Delay (tPLH  
)
5
5
4
3
2
1
0
V
= 2.7 V  
V
= 5.0V  
CC  
TEMP = 25°C  
LOAD = 5kW//50pF  
50mV  
CC  
4
3
2
1
0
TEMP = 25°C  
LOAD = 5kW//50pF  
20mV  
50mV  
20mV  
ö
ö
ö
ö
100  
100  
OVERDRIVE  
OVERDRIVE  
0
0
-100  
-100  
0
500  
1500 2000 2500 3000  
1000  
TIME (ns)  
0
500 1000 1500 2000 2500 3000  
TIME (ns)  
Figure 21.  
Figure 22.  
tPHL  
vs.  
Overdrive  
Propagation Delay (tPHL  
)
8
7
6
5
4
3
2
1
0
5
4
3
2
1
0
V
= 5.0 V  
CC  
TEMP = 25°C  
LOAD = 5kW//50pF  
V
= 5V  
S
50mV  
20mV  
V
= 2.7V  
S
ö
ö
100  
OVERDRIVE  
0
-100  
V
= 1.8V  
S
0
500 1000 1500 2000 2500 3000  
TIME (ns)  
0
10  
100  
1000  
OVERDRIVE (mV)  
Figure 23.  
Figure 24.  
tPLH  
vs.  
Overdrive  
5
V
= 5V  
S
4.5  
4
3.5  
3
2.5  
2
V
= 2.7V  
S
1.5  
1
V
= 1.8V  
S
0.5  
0
1
10  
100  
1000  
OVERDRIVE (mV)  
Figure 25.  
10  
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APPLICATION NOTES  
BASIC COMPARATOR  
A comparator is often used to convert an analog signal to a digital signal. As shown in Figure 26, the comparator  
compares an input voltage (VIN) to a reference voltage (VREF). If VIN is less than VREF, the output (VO) is low.  
However, if VIN is greater than VREF, the output voltage (VO) is high.  
+
V
VOLTS  
V
O
V
REF  
-
V
O
V
IN  
+
V
REF  
-
V
TIME  
V
IN  
Figure 26. LMV7291 Basic Comparator  
RAIL-TO-RAIL INPUT STAGE  
The LMV7291 has an input common mode voltage range (VCM) of 0.1V below the Vto 0.1V above V+. This is  
achieved by using paralleled PNP and NPN differential input pairs. When the VCM is near V+, the NPN pair is on  
and the PNP pair is off. When the VCM is near V, the NPN pair is off and the PNP pair is on. The crossover point  
between the NPN and PNP input stages is around 950mV from V+. Since each input stage has its own offset  
voltage (VOS), the VOS of the comparator becomes a function of the VCM. See Figure 3, Figure 4, and Figure 5 in  
Typical Performance Characteristics. In application design, it is recommended to keep the VCM away from the  
crossover point to avoid problems. The wide input voltage range makes LMV7291 ideal in power supply  
monitoring circuits, where the comparators are used to sense signals close to gnd and power supplies.  
OUTPUT STAGE  
The LMV7291 has a push-pull output stage. This output stage keeps the total system power consumption to the  
absolute minimum. The only current consumed is the low supply current and the current going directly into the  
load. When output switches, both PMOS and NMOS at the output stage are on at the same time for a very short  
time. This allows current to flow directly between V+ and Vthrough output transistors. The result is a short spike  
of current (shoot-through current) drawn from the supply and glitches in the supply voltages. The glitches can  
spread to other parts of the board as noise. To prevent the glitches in supply lines, power supply bypass  
capacitors must be installed. See CIRCUIT TECHNIQUES FOR AVOIDING OSCILLATIONS IN COMPARATOR  
APPLICATIONS for details.  
HYSTERESIS  
It is a standard procedure to use hysteresis (positive feedback) around a comparator, to prevent oscillation, and  
to avoid excessive noise on the output because the comparator is a good amplifier of its own noise.  
Inverting Comparator with Hysteresis  
The inverting comparator with hysteresis requires a three resistor network that are referenced to the supply  
voltage VCC of the comparator (Figure 27). When VIN at the inverting input is less than VA, the voltage at the non-  
inverting node of the comparator (VIN < VA), the output voltage is high (for simplicity assume VO switches as high  
as VCC). The three network resistors can be represented as R1||R3 in series with R2. The lower input trip voltage  
VA1 is defined as  
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VCC R2  
VA1  
=
(R1||R3) + R2  
(1)  
When VIN is greater than VA (VIN > VA), the output voltage is low and very close to ground. In this case the three  
network resistors can be presented as R2//R3 in series with R1. The upper trip voltage VA2 is defined as  
VCC (R2||R3)  
VA2  
=
R1 + (R2||R3)  
(2)  
(3)  
The total hysteresis provided by the network is defined as  
ΔVA = VA1 - VA2  
A good typical value of ΔVA would be in the range of 5 to 50 mV. This is easily obtained by choosing R3 as 1000  
to 100 times (R1||R2) for 5V operation, or as 300 to 30 times (R1||R2) for 1.8V operation.  
Figure 27. Inverting Comparator with Hysteresis  
Non-Inverting Comparator with Hysteresis  
A non-inverting comparator with hysteresis requires a two resistor network, and a voltage reference (VREF) at the  
inverting input (Figure 28). When VIN is low, the output is also low. For the output to switch from low to high, VIN  
must rise up to VIN1, where VIN1 is calculated by  
(4)  
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When VIN is high, the output is also high. To make the comparator switch back to its low state, VIN must equal  
VREF before VA will again equal VREF. VIN can be calculated by:  
(5)  
The hysteresis of this circuit is the difference between VIN1 and VIN2  
.
ΔVIN = VCCR1/R2  
(6)  
Figure 28. Non-Inverting Comparator with Hysteresis  
CIRCUIT TECHNIQUES FOR AVOIDING OSCILLATIONS IN COMPARATOR APPLICATIONS  
Feedback to almost any pin of a comparator can result in oscillation. In addition, when the input signal is a slow  
voltage ramp or sine wave, the comparator may also burst into oscillation near the crossing point. To avoid  
oscillation or instability, PCB layout should be engineered thoughtfully. Several precautions are recommended:  
1. Power supply bypassing is critical, and will improve stability and transient response. Resistance and  
inductance from power supply wires and board traces increase power supply line impedance. When supply  
current changes, the power supply line will move due to its impedance. Large enough supply line shift will  
cause the comparator to mis-operate. To avoid problems, a small bypass capacitor, such as 0.1uF ceramic,  
should be placed immediately adjacent to the supply pins. An additional 6.8μF or greater tantalum capacitor  
should be placed at the point where the power supply for the comparator is introduced onto the board. These  
capacitors act as an energy reservoir and keep the supply impedance low. In dual supply application, a  
0.1μF capacitor is recommended to be placed across V+ and Vpins.  
2. Keep all leads short to reduce stray capacitance and lead inductance. It will also minimize any unwanted  
coupling from any high-level signals (such as the output). The comparators can easily oscillate if the output  
lead is inadvertently allowed to capacitively couple to the inputs via stray capacitance. This shows up only  
during the output voltage transition intervals as the comparator changes states. Try to avoid a long loop  
which could act as an inductor (coil).  
3. It is a good practice to use an unbroken ground plane on a printed circuit board to provide all components  
with a low inductive ground connection. Make sure ground paths are low-impedance where heavier currents  
are flowing to avoid ground level shift. Preferably there should be a ground plane under the component.  
4. The output trace should be routed away from inputs. The ground plane should extend between the output  
and inputs to act as a guard.  
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5. When the signal source is applied through a resistive network to one input of the comparator, it is usually  
advantageous to connect the other input with a resistor with the same value, for both DC and AC  
consideration. Input traces should be laid out symmetrically if possible.  
6. All pins of any unused comparators should be tied to the negative supply.  
Typical Applications  
POSITIVE PEAK DETECTOR  
A positive peak detect circuit is basically a comparator operated in a unity gain follower configuration, with a  
capacitor as a load to maintain the highest voltage. A diode is added at the output to prevent the capacitor from  
discharging through the output, and a 1Mresistor added in parallel to the capacitor to provide a high  
impedance discharge path. When the input VIN increases, the inverting input of the comparator follows it, thus  
charging the capacitor. When it decreases, the cap discharges through the 1Mresistor. The decay time can be  
modified by changing the resistor. The output should be accessed through a follower circuit to prevent loading.  
+V  
CC  
V
IN  
+
-
V
OUT  
-
C1  
10 mF  
R
1 MW  
2
+
Figure 29. Positive Peak Detector  
NEGATIVE PEAK DETECTOR  
For the negative detector, the output transistor of the comparator acts as a low impedance current sink. Since  
there is no pull-up resistor, the only discharge path will be the 1Mresistor and any load impedance used.  
Decay time is changed by varying the 1Mresistor.  
+V  
CC  
V
IN  
+
V
OUT  
-
R
1
1MW  
C
10mF  
-
1
+
-V  
CC  
Figure 30. Negative Peak Detector  
SQUARE WAVE GENERATOR  
A typical application for a comparator is as a square wave oscillator. The circuit below generates a square wave  
whose period is set by the RC time constant of the capacitor C1and resistor R4. The maximum frequency is  
limited by the large signal propagation delay of the comparator, and by the capacitive loading at the output,  
which limits the output slew rate.  
14  
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R
= 100 kW  
4
C
R
= 750 pF  
1
-
V
C
V
O
+
= 100 kW  
R
= 100 kW  
1
3
V
A
+
V
+
V
R
= 100 kW  
2
0
f ö 10 kHz  
Figure 31. Squarewave Oscillator  
To analyze the circuit, consider it when the output is high. That implies that the inverted input (VC) is lower than  
the non-inverting input (VA). This causes the C1 to get charged through R4, and the voltage VC increases till it is  
equal to the non-inverting input. The value of VA at this point is  
V
.R  
2
CC  
V
=
A1  
R
2
+ R ||R  
1 3  
(7)  
If R1 = R2 = R3 then VA1 = 2VCC/3  
At this point the comparator switches pulling down the output to the negative rail. The value of VA at this point is  
V
(R ||R )  
2 3  
CC  
V
=
A2  
R
1
+ (R ||R  
3)  
2
(8)  
If R1 = R2 = R3 then VA2 = VCC/3  
The capacitor C1 now discharges through R4, and the voltage VC decreases till it is equal to VA2, at which point  
the comparator switches again, bringing it back to the initial stage. The time period is equal to twice the time it  
takes to discharge C1 from 2VCC/3 to VCC/3, which is given by R4C1.ln2. Hence the formula for the frequency is:  
F = 1/(2.R4.C1.ln2)  
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REVISION HISTORY  
Changes from Revision D (March 2013) to Revision E  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 15  
16  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jan-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LMV7291MG  
ACTIVE  
SC70  
DCK  
5
1000  
Non-RoHS  
& Green  
Call TI  
Level-1-260C-UNLIM  
-40 to 85  
C36  
Samples  
LMV7291MG/NOPB  
LMV7291MGX/NOPB  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000 RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
C36  
C36  
Samples  
Samples  
3000 RoHS & Green  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jan-2023  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-Oct-2021  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LMV7291MG  
SC70  
SC70  
SC70  
DCK  
DCK  
DCK  
5
5
5
1000  
1000  
3000  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
2.25  
2.25  
2.25  
2.45  
2.45  
2.45  
1.2  
1.2  
1.2  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
LMV7291MG/NOPB  
LMV7291MGX/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-Oct-2021  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LMV7291MG  
SC70  
SC70  
SC70  
DCK  
DCK  
DCK  
5
5
5
1000  
1000  
3000  
208.0  
208.0  
208.0  
191.0  
191.0  
191.0  
35.0  
35.0  
35.0  
LMV7291MG/NOPB  
LMV7291MGX/NOPB  
Pack Materials-Page 2  
PACKAGE OUTLINE  
DCK0005A  
SOT - 1.1 max height  
S
C
A
L
E
5
.
6
0
0
SMALL OUTLINE TRANSISTOR  
C
2.4  
1.8  
0.1 C  
1.4  
1.1  
B
1.1 MAX  
A
PIN 1  
INDEX AREA  
1
2
5
NOTE 4  
(0.15)  
(0.1)  
2X 0.65  
1.3  
2.15  
1.85  
1.3  
4
3
0.33  
5X  
0.23  
0.1  
0.0  
(0.9)  
TYP  
0.1  
C A B  
0.15  
0.22  
0.08  
GAGE PLANE  
TYP  
0.46  
0.26  
8
0
TYP  
TYP  
SEATING PLANE  
4214834/C 03/2023  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Refernce JEDEC MO-203.  
4. Support pin may differ or may not be present.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DCK0005A  
SOT - 1.1 max height  
SMALL OUTLINE TRANSISTOR  
PKG  
5X (0.95)  
1
5
5X (0.4)  
SYMM  
(1.3)  
2
3
2X (0.65)  
4
(R0.05) TYP  
(2.2)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:18X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED METAL  
EXPOSED METAL  
0.07 MIN  
ARROUND  
0.07 MAX  
ARROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214834/C 03/2023  
NOTES: (continued)  
4. Publication IPC-7351 may have alternate designs.  
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DCK0005A  
SOT - 1.1 max height  
SMALL OUTLINE TRANSISTOR  
PKG  
5X (0.95)  
1
5
5X (0.4)  
SYMM  
(1.3)  
2
3
2X(0.65)  
4
(R0.05) TYP  
(2.2)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 THICK STENCIL  
SCALE:18X  
4214834/C 03/2023  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
7. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
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