LMV821IDCKRG4 [TI]
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS; 低电压轨到轨输出运算放大器型号: | LMV821IDCKRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS |
文件: | 总35页 (文件大小:764K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
FEATURES
LMV824 . . . D, DGV, OR PW PACKAGE
•
•
•
•
2.5-V, 2.7-V, and 5-V Performance
(TOP VIEW)
–40°C to 125°C Operation
No Crossover Distortion
1
2
3
4
5
6
7
14 4OUT
1OUT
1IN−
1IN+
13
12
11
10
9
4IN−
4IN+
Low Supply Current at VCC+ = 5 V:
– LMV821…0.3 mA Typ
GND/V
3IN+
V
CC+
CC−
– LMV822…0.5 mA Typ
2IN+
2IN−
3IN−
3OUT
– LMV824…1 mA Typ
8
2OUT
•
•
•
Rail-to-Rail Output Swing
Gain Bandwidth of 5.5 MHz Typ at 5 V
Slew Rate of 1.9 V/µs Typ at 5 V
LMV822 . . . D OR DGK PACKAGE
(TOP VIEW)
DESCRIPTION/
1OUT
1IN −
1IN+
V
CC+
1
2
3
4
8
7
6
5
ORDERING INFORMATION
2OUT
2IN −
2IN+
The LMV821 single, LMV822 dual, and LMV824
quad devices are low-voltage (2.5 V to 5.5 V),
GND/V
CC−
low-power
commodity
operational
amplifiers.
Electrical characteristics are very similar to the
LMV3xx operational amplifiers (low supply current,
rail-to-rail outputs, input common-mode range that
includes ground). However, the LMV8xx devices
offer a higher bandwidth (5.5 MHz typical) and faster
slew rate (1.9 V/µs typical).
LMV821 . . . DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
IN+
V
CC+
GND/V
CC−
The LMV8xx devices are cost-effective solutions for
IN−
OUT
applications
requiring
low-voltage/low-power
operation and space-saving considerations. The
LMV821 is available in the ultra-small DCK package,
which is approximately half the size of SOT-23-5.
The DCK package saves space on printed circuit
boards and enables the design of small portable
electronic devices (cordless and cellular phones,
laptops, PDAs, PCMIA). It also allows the designer
to place the device closer to the signal source to
reduce noise pickup and increase signal integrity.
The LMV8xx devices are characterized for operation
from –40°C to 85°C. The LMV8xxI devices are
characterized for operation from –40°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
LMV821DCKR
LMV821DCKT
LMV821DBVR
LMV821DBVT
LMV822D
TOP-SIDE MARKING(2)
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Tube of 75
SC-70 – DCK
RY_
Single
Dual
SOT-23 – DBV
SOIC – D
RB8_
MV822
RA_
Reel of 2500
Tube of 100
Reel of 2500
Tube of 50
LMV822DR
–40°C to 85°C
LMV822DGK
LMV822DGKR
LMV824D
MSOP/VSSOP – DGK
SOIC – D
LMV824
Reel of 2500
Tube of 90
LMV824DR
Quad
LMV824PW
TSSOP – PW
TVSOP – DGV
SC-70 – DCK
MV824
MV824
RZ_
Reel of 2000
Reel of 2000
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Tube of 75
LMV824PWR
LMV824DGVR
LMV821IDCKR
LMV821IDCKT
LMV821IDBVR
LMV821IDBVT
LMV822ID
Single
Dual
SOT-23 – DBV
SOIC – D
RB1_
MV822I
R8_
Reel of 2500
Tube of 100
Reel of 2500
Tube of 50
LMV822IDR
–40°C to 125°C
LMV822IDGK
LMV822IDGKR
LMV824ID
MSOP/VSSOP – DGK
SOIC – D
LMV824I
Reel of 2500
Tube of 90
LMV824IDR
Quad
LMV824IPW
TSSOP – PW
TVSOP – DGV
MV824I
MV824I
Reel of 2000
Reel of 2000
LMV824IPWR
LMV824IDGVR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site.
2
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
SYMBOL (EACH AMPLIFIER)
−
IN −
OUT
+
IN +
LMV824 SIMPLIFIED SCHEMATIC
V
CC
V
BIAS1
V
CC
+
−
V
BIAS2
V
BIAS5
+
−
+
Output
V
CC
V
CC
−
V
BIAS3
+
−
IN−
IN+
V
BIAS4
+
−
3
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
UNIT
VCC Supply voltage(2)
V
VID
VI
Differential input voltage(3)
±VCC
VCC+
Unlimited
97
V
V
Input voltage range (either input)
Duration of output short circuit (one amplifier) to ground(4)
VCC–
At or below TA = 25°C, VCC ≤ 5.5 V
8 pin
D package
14 pin
86
DBV package
DCK package
DGK package
DGV package
PW package
206
θJA
Package thermal impedance(5)(6)
252
°C/W
172
127
113
TJ
Operating virtual junction temperature
150
°C
°C
Tstg Storage temperature range
–65
150
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
MIN
2.5
MAX
5
UNIT
VCC Supply voltage (single-supply operation)
TA Operating free-air temperature
V
LMV8xxI
LMV8xx
–40
–40
125
85
°C
4
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xx 2.5-V Electrical Characteristics
VCC+ = 2.5 V, VCC– = 0 V, VIC = 1 V, VO = 1.25 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xx
TYP
1
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
MAX
3.5
4
25°C
–40°C to 85°C
25°C
VIO
Input offset voltage
mV
2.3
2.2
2.37
0.13
2.46
0.08
High level
Low level
High level
Low level
–40°C to 85°C
25°C
VCC+ = 2.5 V, RL = 600 Ω to 1.25 V
0.2
0.3
–40°C to 85°C
25°C
VO
Output swing
V
2.4
2.3
–40°C to 85°C
25°C
VCC+ = 2.5 V, RL = 2 kΩ to 1.25 V
0.12
0.2
–40°C to 85°C
LMV8xxI 2.5-V Electrical Characteristics
VCC+ = 2.5 V, VCC– = 0 V, VIC = 1 V, VO = 1.25 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xxI
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
TYP
MAX
3.5
25°C
–40°C to 125°C
25°C
1
VIO
Input offset voltage
mV
5.5
2.28
2.18
2.37
0.13
2.46
0.08
High level
Low level
High level
Low level
–40°C to 125°C
25°C
VCC+ = 2.5 V, RL = 600 Ω to 1.25 V
0.22
0.32
–40°C to 125°C
25°C
VO
Output swing
V
2.38
2.28
–40°C to 125°C
25°C
VCC+ = 2.5 V, RL = 2 kΩ to 1.25 V
0.14
0.22
–40°C to 125°C
5
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xx 2.7-V Electrical Characteristics
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO = 1.35 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xx
TYP
1
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
MAX
25°C
3.5
4
VIO
αVIO
IIB
Input offset voltage
mV
µV/°C
nA
–40°C to 85°C
Average temperature coefficient
of input offset voltage
25°C
1
25°C
–40°C to 85°C
25°C
30
90
140
30
Input bias current
Input offset current
0.5
85
85
85
IIO
nA
dB
dB
–40°C to 85°C
25°C
50
70
68
75
70
73
70
CMRR Common-mode rejection ratio
VIC = 0 to 1.7 V
–40°C to 85°C
25°C
Positive supply-voltage
+kSVR
VCC+ = 1.7 V to 4 V, VCC– = –1 V,
VO = 0, VIC = 0
rejection ratio
–40°C to 85°C
25°C
Negative supply-voltage
–kSVR
VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
VO = 0, VIC = 0
dB
V
rejection ratio
–40°C to 85°C
Common-mode input
voltage range
–0.2
to 1.9
–0.3
to 2
VICR
CMRR ≥ 50 dB
25°C
25°C
–40°C to 85°C
25°C
90
85
85
80
95
90
90
85
2.5
2.4
100
RL = 600 Ω to 1.35 V,
Sourcing
VO = 1.35 V to 2.2 V
90
RL = 600 Ω to 1.35 V,
Sinking
VO = 1.35 V to 0.5 V
–40°C to 85°C
25°C
Large-signal voltage
amplification
AV
dB
100
95
RL = 2 kΩ to 1.35 V,
Sourcing
VO = 1.35 V to 2.2 V
–40°C to 85°C
25°C
RL = 2 kΩ to 1.35 V,
Sinking
VO = 1.35 V to 0.5 V
–40°C to 85°C
25°C
2.58
0.13
2.66
0.08
High level
VCC+ = 2.7 V,
–40°C to 85°C
25°C
RL = 600 Ω to 1.35 V
0.2
0.3
Low level
–40°C to 85°C
25°C
VO
Output swing
V
2.6
2.5
High level
VCC+ = 2.7 V,
–40°C to 85°C
25°C
RL = 2 kΩ to 1.35 V
0.12
0.2
Low level
–40°C to 85°C
25°C
VO = 0 V
Sourcing
Sinking
12
12
16
26
IO
Output current
Supply current
mA
mA
VO = 2.7 V
25°C
25°C
0.22
0.3
0.5
0.6
0.8
1
LMV821
–40°C to 85°C
25°C
0.45
0.72
ICC
LMV822 (both amplifiers)
–40°C to 85°C
25°C
LMV824 (all four amplifiers)
–40°C to 85°C
1.2
6
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xx 2.7-V Electrical Characteristics (continued)
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO = 1.35 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xx
TYP
1.7
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
MAX
SR
GBW Gain bandwidth product
Slew rate(1)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
V/µs
MHz
deg
(2)
(2)
(2)
5
Φm
Phase margin
60
Gain margin
8.6
dB
Amplifier-to-amplifier isolation
Equivalent input noise voltage
Equivalent input noise current
VCC+ = 5 V, RL = 100 kΩ to 2.5 V(3)
f = 1 kHz, VIC = 1 V
f = 1 kHz
135
45
dB
Vn
In
nV/√Hz
pA/√Hz
0.18
f = 1 kHz, AV = –2, RL = 10 kΩ,
VO = 4.1 Vp-p
THD
Total harmonic distortion
25°C
0.01
%
(1) Connected as voltage follower with 1-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL = 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO = 3 Vp-p
7
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xxI 2.7-V Electrical Characteristics
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO = 1.35 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xxI
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
TYP
MAX
25°C
1
3.5
5.5
VIO
αVIO
IIB
Input offset voltage
mV
µV/°C
nA
–40°C to 125°C
Average temperature coefficient
of input offset voltage
25°C
1
25°C
–40°C to 125°C
25°C
30
90
140
30
Input bias current
Input offset current
0.5
85
85
85
IIO
nA
dB
dB
–40°C to 125°C
25°C
50
70
68
75
70
73
70
CMRR Common-mode rejection ratio
VIC = 0 to 1.7 V
–40°C to 125°C
25°C
Positive supply-voltage
+kSVR
VCC+ = 1.7 V to 4 V, VCC– = –1 V,
VO = 0, VIC = 0
rejection ratio
–40°C to 125°C
25°C
Negative supply-voltage
–kSVR
VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
VO = 0, VIC = 0
dB
V
rejection ratio
–40°C to 125°C
Common-mode input
voltage range
–0.2
to 1.9
–0.3
to 2
VICR
CMRR ≥ 50 dB
25°C
25°C
–40°C to 125°C
25°C
90
85
85
80
95
90
90
85
2.5
2.4
100
RL = 600 Ω to 1.35 V,
Sourcing
VO = 1.35 V to 2.2 V
90
RL = 600 Ω to 1.35 V,
Sinking
VO = 1.35 V to 0.5 V
–40°C to 125°C
25°C
Large-signal voltage
amplification
AV
dB
100
95
RL = 2 kΩ to 1.35 V,
Sourcing
VO = 1.35 V to 2.2 V
–40°C to 125°C
25°C
RL = 2 kΩ to 1.35 V,
Sinking
VO = 1.35 V to 0.5 V
–40°C to 125°C
25°C
2.58
0.13
2.66
0.08
High level
VCC+ = 2.7 V,
–40°C to 125°C
25°C
RL = 600 Ω to 1.35 V
0.2
0.3
Low level
–40°C to 125°C
25°C
VO
Output swing
V
2.6
2.5
High level
VCC+ = 2.7 V,
–40°C to 125°C
25°C
RL = 2 kΩ to 1.35 V
0.12
0.2
Low level
–40°C to 125°C
25°C
VO = 0 V
Sourcing
Sinking
12
12
16
26
IO
Output current
Supply current
mA
mA
VO = 2.7 V
25°C
25°C
0.22
0.3
0.5
0.6
0.8
1
LMV821
–40°C to 125°C
25°C
0.45
0.72
ICC
LMV822 (both amplifiers)
–40°C to 125°C
25°C
LMV824 (all four amplifiers)
–40°C to 125°C
1.2
8
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xxI 2.7-V Electrical Characteristics (continued)
VCC+ = 2.7 V, VCC– = 0 V, VIC = 1 V, VO = 1.35 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xxI
TYP
1.7
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
MAX
SR
GBW Gain bandwidth product
Slew rate(1)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
V/µs
MHz
deg
(2)
(2)
(2)
5
Φm
Phase margin
60
Gain margin
8.6
dB
Amplifier-to-amplifier isolation
Equivalent input noise voltage
Equivalent input noise current
VCC+ = 5 V, RL = 100 kΩ to 2.5 V(3)
f = 1 kHz, VIC = 1 V
f = 1 kHz
135
45
dB
Vn
In
nV/√Hz
pA/√Hz
0.18
f = 1 kHz, AV = –2, RL = 10 kΩ,
VO = 4.1 Vp-p
THD
Total harmonic distortion
25°C
0.01
%
(1) Connected as voltage follower with 1-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL = 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO = 3 Vp-p
9
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xx 5-V Electrical Characteristics
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO = 2.5 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xx
TYP
1
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
MAX
25°C
3.5
4
VIO
αVIO
IIB
Input offset voltage
mV
µV/°C
nA
–40°C to 85°C
Average temperature coefficient
of input offset voltage
25°C
1
25°C
–40°C to 85°C
25°C
40
100
150
30
Input bias current
Input offset current
0.5
90
IIO
nA
dB
dB
–40°C to 85°C
25°C
50
72
70
CMRR Common-mode rejection ratio
VIC = 0 to 4 V
–40°C to 85°C
25°C
75
85
Positive supply-voltage
+kSVR
VCC+ = 1.7 V to 4 V, VCC– = –1 V,
VO = 0, VIC = 0
rejection ratio
–40°C to 85°C
25°C
70
73
85
Negative supply-voltage
–kSVR
VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
VO = 0, VIC = 0
dB
V
rejection ratio
–40°C to 85°C
70
Common-mode input
voltage range
–0.2
–0.3
to 4.2 to 4.3
VICR
CMRR ≥ 50 dB
25°C
25°C
–40°C to 85°C
25°C
95
90
105
105
105
105
4.84
0.17
4.9
0.1
45
RL = 600 Ω to 2.5 V,
Sourcing
VO = 2.5 V to 4.5 V
95
RL = 600 Ω to 2.5 V,
Sinking
VO = 2.5 V to 0.5 V
–40°C to 85°C
25°C
90
Large-signal voltage
amplification
AV
dB
95
RL = 2 kΩ to 2.5 V,
Sourcing
VO = 2.5 V to 4.5 V
–40°C to 85°C
25°C
90
95
RL = 2 kΩ to 2.5 V,
Sinking
VO = 2.5 V to 0.5 V
–40°C to 85°C
25°C
90
4.75
4.7
High level
VCC+ = 5 V,
–40°C to 85°C
25°C
RL = 600 Ω to 2.5 V
0.25
0.3
Low level
–40°C to 85°C
25°C
VO
Output swing
V
4.85
4.8
High level
VCC+ = 5 V,
–40°C to 85°C
25°C
RL = 2 kΩ to 2.5 V
0.15
0.2
Low level
–40°C to 85°C
25°C
20
15
20
15
VO = 0 V
Sourcing
Sinking
–40°C to 85°C
25°C
IO
Output current
Supply current
mA
mA
40
VO = 5 V
–40°C to 85°C
25°C
0.3
0.5
1
0.4
0.6
0.7
0.9
1.3
1.5
LMV821
–40°C to 85°C
25°C
ICC
LMV822 (both amplifiers)
–40°C to 85°C
25°C
LMV824 (all four amplifiers)
–40°C to 85°C
10
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xx 5-V Electrical Characteristics (continued)
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO = 2.5 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xx
TYP
1.9
PARAMETER
TEST CONDITIONS
VCC+ = 5 V(1)
TA
UNIT
MIN
MAX
SR
Slew rate
25°C
25°C
25°C
25°C
25°C
25°C
25°C
1.4
V/µs
MHz
deg
(2)
(2)
(2)
GBW Gain bandwidth product
5.5
Φm
Phase margin
64.2
8.7
Gain margin
dB
Amplifier-to-amplifier isolation
Equivalent input noise voltage
Equivalent input noise current
VCC+ = 5 V, RL = 100 kΩ to 2.5 V(3)
f = 1 kHz, VIC = 1 V
f = 1 kHz
135
42
dB
Vn
In
nV/√Hz
pA/√Hz
0.2
f = 1 kHz, AV = –2, RL = 10 kΩ,
VO = 4.1 Vp-p
THD
Total harmonic distortion
25°C
0.01
%
(1) Connected as voltage follower with 3-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL = 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO = 3 Vp-p
11
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xxI 5-V Electrical Characteristics
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO = 2.5 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xxI
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
TYP
MAX
25°C
1
3.5
5.5
VIO
αVIO
IIB
Input offset voltage
mV
µV/°C
nA
–40°C to 125°C
Average temperature coefficient
of input offset voltage
25°C
1
25°C
–40°C to 125°C
25°C
40
100
150
30
Input bias current
Input offset current
0.5
90
IIO
nA
dB
dB
–40°C to 125°C
25°C
50
72
70
CMRR Common-mode rejection ratio
VIC = 0 to 4 V
–40°C to 125°C
25°C
75
85
Positive supply-voltage
+kSVR
VCC+ = 1.7 V to 4 V, VCC– = –1 V,
VO = 0, VIC = 0
rejection ratio
–40°C to 125°C
25°C
70
73
85
Negative supply-voltage
–kSVR
VCC+ = 1.7 V, VCC– = –1 V to –3.3 V,
VO = 0, VIC = 0
dB
V
rejection ratio
–40°C to 125°C
70
Common-mode input
voltage range
–0.2
–0.3
to 4.2 to 4.3
VICR
CMRR ≥ 50 dB
25°C
25°C
–40°C to 125°C
25°C
95
90
105
105
105
105
4.84
0.17
4.9
0.1
45
RL = 600 Ω to 2.5 V,
Sourcing
VO = 2.5 V to 4.5 V
95
RL = 600 Ω to 2.5 V,
Sinking
VO = 2.5 V to 0.5 V
–40°C to 125°C
25°C
90
Large-signal voltage
amplification
AV
dB
95
RL = 2 kΩ to 2.5 V,
Sourcing
VO = 2.5 V to 4.5 V
–40°C to 125°C
25°C
90
95
RL = 2 kΩ to 2.5 V,
Sinking
VO = 2.5 V to 0.5 V
–40°C to 125°C
25°C
90
4.75
4.6
High level
VCC+ = 5 V,
–40°C to 125°C
25°C
RL = 600 Ω to 2.5 V
0.25
0.3
Low level
–40°C to 125°C
25°C
VO
Output swing
V
4.85
4.8
High level
VCC+ = 5 V,
–40°C to 125°C
25°C
RL = 2 kΩ to 2.5 V
0.15
0.2
Low level
–40°C to 125°C
25°C
20
15
20
15
VO = 0 V
Sourcing
Sinking
–40°C to 125°C
25°C
IO
Output current
Supply current
mA
mA
40
VO = 5 V
–40°C to 125°C
25°C
0.3
0.5
1
0.4
0.6
0.7
0.9
1.3
1.5
LMV821
–40°C to 125°C
25°C
ICC
LMV822 (both amplifiers)
–40°C to 125°C
25°C
LMV824 (all four amplifiers)
–40°C to 125°C
12
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
LMV8xxI 5-V Electrical Characteristics (continued)
VCC+ = 5 V, VCC– = 0 V, VIC = 2 V, VO = 2.5 V, and RL > 1 MΩ (unless otherwise noted)
LMV8xxI
TYP
1.9
PARAMETER
TEST CONDITIONS
VCC+ = 5 V(1)
TA
UNIT
MIN
MAX
SR
Slew rate
25°C
25°C
25°C
25°C
25°C
25°C
25°C
1.4
V/µs
MHz
deg
(2)
(2)
(2)
GBW Gain bandwidth product
5.5
Φm
Phase margin
64.2
8.7
Gain margin
dB
Amplifier-to-amplifier isolation
Equivalent input noise voltage
Equivalent input noise current
VCC+ = 5 V, RL = 100 kΩ to 2.5 V(3)
f = 1 kHz, VIC = 1 V
f = 1 kHz
135
42
dB
Vn
In
nV/√Hz
pA/√Hz
0.2
f = 1 kHz, AV = –2, RL = 10 kΩ,
VO = 4.1 Vp-p
THD
Total harmonic distortion
25°C
0.01
%
(1) Connected as voltage follower with 3-V step input. Value specified is the slower of the positive and negative slew rates.
(2) 40-dB closed-loop dc gain, CL = 22 pF
(3) Each amplifier excited in turn with 1 kHz to produce VO = 3 Vp-p
13
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
INPUT CURRENT
vs
TEMPERATURE
1200
1000
800
−30
LMV824
All Channels
V
V
= 5 V
CC+
T
= 855C
= 255C
A
= V
/2
in
CC+
−40
−50
−60
−70
T
A
600
400
200
T
A
= −405C
0
−40
−20
0
20
40
60
80
100
0
1
2
3
4
5
6
T
A
− Temperature − °C
V
CC+
− Supply Voltage − V
Figure 1.
Figure 2.
SOURCING CURRENT
vs
OUTPUT VOLTAGE
SOURCING CURRENT
vs
OUTPUT VOLTAGE
100
100
V
CC+
= 2.7 V
V
CC+
= 5 V
10
1
10
1
0.1
0.1
0.01
0.01
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
10
Output Voltage Referenced to V+ − (V)
Output Voltage Referenced to V+ − (V)
Figure 3.
Figure 4.
14
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
SINKING CURRENT
vs
OUTPUT VOLTAGE
SINKING CURRENT
vs
OUTPUT VOLTAGE
100
100
10
V
CC+
= 2.7 V
V
CC+
= 5 V
10
1
1
0.1
0.01
0.1
0.01
0.1
0.01
1
10
0.1
0.01
1
10
Output Voltage Referenced to GND − V
Output Voltage Referenced to GND − V
Figure 5.
Figure 6.
OUTPUT VOLTAGE SWING
vs
OUTPUT VOLTAGE SWING
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
50
40
80
70
60
R
L
= 10 kΩ to Mid Rail
R
L
= 2 kΩ to Mid Rail
Negative Swing
Positive Swing
50
40
30
30
20
Negative Swing
Positive Swing
20
10
0
10
0
2.6
3
3.4
3.8
4.2
4.6
5
2.6
3
3.4
3.8
4.2
4.6
5
V
CC+
− Supply Voltage − V
V
CC+
− Supply Voltage − V
Figure 7.
Figure 8.
15
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
OUTPUT VOLTAGE SWING
vs
OUTPUT VOLTAGE SWING
vs
SUPPLY VOLTAGE
LOAD RESISTANCE
160
150
140
130
120
110
100
90
160
140
R
L
= 600 Ω to Mid Rail
R
= 5 kΩ to Mid Rail
= 5 V
lL
V
CC+
Negative Swing
Positive Swing
120
100
80
60
40
20
80
70
60
0
100
1000
10k
100k
2.6
3
3.4
3.8
4.2
4.6
5
Resistive Load − Ω
V
CC+
− Supply Voltage − V
Figure 9.
Figure 10.
CROSSTALK REJECTION
+PSRR
vs
FREQUENCY
vs
FREQUENCY
100
160
V
CC
= +2.5 V
+
90
150
80
70
60
50
40
30
20
140
130
V
CC
= +1.35 V
+
120
110
100
90
V
= ±2.5 V
CC+
V = 3 V
I
PP
= 5 kΩ
= 1
R
A
V
L
10
0
1k
10k
100k
1M
100
100
1k
Frequency − Hz
10k
100k
Frequency − Hz
Figure 11.
Figure 12.
16
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
–PSRR
vs
FREQUENCY
100
90
V
CC
= +2.5 V
+
80
70
60
V
CC
= +1.35 V
+
50
40
30
20
10
0
100
1k
10k
100k
1M
Frequency − Hz
Figure 13.
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 2.7 V, RL = 600 Ω, 2 kΩ, 100 kΩ)
80
70
60
140
120
Phase
100
80
50
40
60
40
30
Gain
20
20
0
10
V
CC+
= 2.7 V
600 Ω
2 kΩ
−20
0
−40
−60
−10
−20
100 kΩ
1k
10k
100k
1M
10M
Frequency − Hz
Figure 14.
17
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 5 V, RL = 600 Ω, 2 kΩ, 100 kΩ)
140
120
100
80
80
70
60
Phase
50
40
60
40
30
20
20
10
Gain
0
−20
V
CC+
= 5 V
600 Ω
2 kΩ
0
−10
−20
−40
−60
100 kΩ
1M
1k
10k
10M
100k
Frequency − Hz
Figure 15.
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 2.7 V, RL = 10 kΩ, CL = 22 pF, 100 pF, 200 pF)
80
70
100
80
60
Phase
60
50
40
30
20
10
40
20
0
−20
−40
−60
Gain
V
R
= 2.7 V
= 10 kΩ
22 pF
100 pF
200 pF
CC+
L
0
−10
−20
−80
−100
1k
10k
100k
1M
10M
Frequency − Hz
Figure 16.
18
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 5 V, RL = 10 kΩ, CL = 22 pF, 100 pF, 200 pF)
80
100
80
70
60
50
40
Phase
60
40
20
0
30
20
10
0
Gain
−20
−40
−60
−80
−100
V
R
= 5 V
= 10 kΩ
22 pF
100 pF
200 pF
CC+
L
−10
−20
1k
10k
100k
1M
10M
Frequency − Hz
Figure 17.
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 2.7 V, RL = 600 Ω, CL = 22 pF, 100 pF, 200 pF)
140
120
100
80
70
60
50
Phase
80
40
30
20
60
40
20
Gain
V
R
= 2.7 V
= 600 Ω
CC+
10
0
0
L
−20
−40
22 pF
100 pF
200 pF
−10
−20
−60
1k
10k
100k
Frequency − Hz
Figure 18.
1M
10M
19
Submit Documentation Feedback
LMV821 SINGLE, LMV822 DUAL, LMV824 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS434I–FEBRUARY 2004–REVISED JULY 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VCC+ = 5-V Single Supply (Unless Otherwise Noted)
GAIN AND PHASE MARGIN
vs
FREQUENCY
(VCC+ = 5 V, RL = 600 Ω, CL = 22 pF, 100 pF, 200 pF)
140
120
80
70
Phase
60
100
80
50
40
60
40
30
20
Gain
20
0
10
0
V
R
= 5 V
= 600 Ω
CC+
L
−20
22 pF
100 pF
200 pF
−10
−20
−40
−60
1k
10k
100k
1M
10M
Frequency − Hz
Figure 19.
20
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
LMV821DBVR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV821DBVRE4
LMV821DBVRG4
LMV821DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
DBV
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
D
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV821DBVTE4
LMV821DBVTG4
LMV821DCKR
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV821DCKRE4
LMV821DCKRG4
LMV821DCKT
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV821DCKTE4
LMV821DCKTG4
LMV821IDBVR
LMV821IDBVRE4
LMV821IDBVRG4
LMV821IDBVT
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV821IDBVTE4
LMV821IDBVTG4
LMV821IDCKR
LMV821IDCKRE4
LMV821IDCKRG4
LMV821IDCKT
LMV821IDCKTE4
LMV821IDCKTG4
LMV822D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
LMV822DE4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV822DG4
LMV822DGKR
LMV822DGKRG4
LMV822DR
SOIC
MSOP
MSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
MSOP
MSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
TVSOP
TVSOP
TVSOP
SOIC
SOIC
SOIC
SOIC
SOIC
D
DGK
DGK
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV822DRE4
LMV822DRG4
LMV822ID
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV822IDE4
LMV822IDG4
LMV822IDGKR
LMV822IDGKRG4
LMV822IDR
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGK
DGK
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV822IDRE4
LMV822IDRG4
LMV824D
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824DE4
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824DG4
LMV824DGVR
LMV824DGVRE4
LMV824DGVRG4
LMV824DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGV
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824DRE4
LMV824DRG4
LMV824ID
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824IDE4
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
LMV824IDG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824IDGVR
LMV824IDGVRE4
LMV824IDGVRG4
LMV824IDR
TVSOP
TVSOP
TVSOP
SOIC
DGV
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824IDRE4
LMV824IDRG4
LMV824IPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824IPWE4
LMV824IPWG4
LMV824IPWR
LMV824IPWRE4
LMV824IPWRG4
LMV824PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824PWE4
LMV824PWG4
LMV824PWR
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LMV824PWRE4
LMV824PWRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV821, LMV822 :
Automotive: LMV821-Q1, LMV822-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV821DBVR
LMV821DBVR
LMV821DBVT
LMV821DBVT
LMV821DCKR
LMV821DCKT
LMV821IDBVR
LMV821IDBVT
LMV821IDCKT
LMV822DGKR
LMV822DR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DBV
DBV
DCK
DGK
D
5
5
3000
3000
250
180.0
178.0
178.0
180.0
180.0
178.0
179.0
179.0
178.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
9.2
9.0
3.23
3.23
3.23
3.23
2.24
2.4
3.17
3.17
3.17
3.17
2.34
2.5
1.37
1.37
1.37
1.37
1.22
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
5
9.0
8.0
5
250
9.2
8.0
5
3000
250
9.2
8.0
SC70
5
9.0
8.0
SOT-23
SOT-23
SC70
5
3000
250
8.4
3.2
3.2
1.4
8.0
5
8.4
3.2
3.2
1.4
8.0
5
250
9.0
2.4
2.5
1.2
8.0
MSOP
SOIC
8
2500
2500
2500
2500
2000
2500
2000
2500
2000
12.4
12.4
12.4
12.4
12.4
16.4
12.4
16.4
12.4
5.3
3.3
1.3
12.0
12.0
12.0
12.0
12.0
16.0
12.0
16.0
12.0
8
6.4
5.2
2.1
LMV822IDGKR
LMV822IDR
MSOP
SOIC
DGK
D
8
5.3
3.3
1.3
8
6.4
5.2
2.1
LMV824DGVR
LMV824DR
TVSOP
SOIC
DGV
D
14
14
14
14
14
6.8
4.0
1.6
6.5
9.0
2.1
LMV824IDGVR
LMV824IDR
TVSOP
SOIC
DGV
D
6.8
4.0
1.6
6.5
9.0
2.1
LMV824IPWR
TSSOP
PW
6.9
5.6
1.6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV824PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV821DBVR
LMV821DBVR
LMV821DBVT
LMV821DBVT
LMV821DCKR
LMV821DCKT
LMV821IDBVR
LMV821IDBVT
LMV821IDCKT
LMV822DGKR
LMV822DR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DBV
DBV
DCK
DGK
D
5
5
3000
3000
250
205.0
180.0
180.0
205.0
205.0
180.0
203.0
203.0
180.0
346.0
340.5
370.0
340.5
346.0
346.0
346.0
200.0
180.0
180.0
200.0
200.0
180.0
203.0
203.0
180.0
346.0
338.1
355.0
338.1
346.0
346.0
346.0
33.0
18.0
18.0
33.0
33.0
18.0
35.0
35.0
18.0
35.0
20.6
55.0
20.6
29.0
33.0
29.0
5
5
250
5
3000
250
SC70
5
SOT-23
SOT-23
SC70
5
3000
250
5
5
250
MSOP
SOIC
8
2500
2500
2500
2500
2000
2500
2000
8
LMV822IDGKR
LMV822IDR
MSOP
SOIC
DGK
D
8
8
LMV824DGVR
LMV824DR
TVSOP
SOIC
DGV
D
14
14
14
LMV824IDGVR
TVSOP
DGV
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV824IDR
LMV824IPWR
LMV824PWR
SOIC
D
14
14
14
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
33.0
29.0
29.0
TSSOP
TSSOP
PW
PW
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明