LP2985A-10 [TI]
150-mA Low-noise Low-dropout Regulator With Shutdown;型号: | LP2985A-10 |
厂家: | TEXAS INSTRUMENTS |
描述: | 150-mA Low-noise Low-dropout Regulator With Shutdown |
文件: | 总29页 (文件大小:1206K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LP2985
SLVS522O –JULY 2004–REVISED JANUARY 2015
LP2985 150-mA Low-noise Low-dropout Regulator With Shutdown
1 Features
3 Description
The LP2985 family of fixed-output, low-dropout
regulators offers exceptional, cost-effective
performance for both portable and nonportable
applications. Available in voltages of 1.8 V, 2.5 V, 2.8
V, 2.9 V, 3 V, 3.1 V, 3.3 V, 5 V, and 10 V, the family
has an output tolerance of 1% for the A version (1.5%
for the non-A version) and is capable of delivering
150-mA continuous load current. Standard regulator
features, such as overcurrent and overtemperature
protection, are included.
1
•
Output Tolerance of
–
–
1% (A Grade)
1.5% (Standard Grade)
•
Ultra-Low Dropout, Typically
–
–
280 mV at Full Load of 150 mA
7 mV at 1 mA
•
•
•
•
Wide VIN Range: 16 V Max
Low IQ: 850 μA at Full Load at 150 mA
Shutdown Current: 0.01 μA Typ
Device Information(1)
Low Noise: 30 μVRMS With 10-nF Bypass
PART NUMBER
LP2985
PACKAGE
BODY SIZE (NOM)
Capacitor
SOT-23 (5)
2.90 mm x 1.60 mm
•
Stable With Low-ESR Capacitors, Including
Ceramic
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
•
•
Overcurrent and Thermal Protection
High Peak-Current Capability
Dropout Voltage vs Temperature
0.45
ESD Protection Exceeds JESD 22
150 mA
V
O
= 3.3 V
C
byp
= 10 nF
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
0.4
0.35
0.3
2 Applications
•
•
•
•
Portable Devices
Digital Cameras and Camcorders
CD Players
0.25
0.2
50 mA
10 mA
MP3 Players
0.15
0.1
0.05
0
1 mA
100 125 150
−50
−25
0
25
50
75
Temperature − (°C)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP2985
SLVS522O –JULY 2004–REVISED JANUARY 2015
www.ti.com
Table of Contents
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 11
Application and Implementation ........................ 12
8.1 Application Information............................................ 12
Power Supply Recommendations...................... 16
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions...................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics.......................................... 5
6.6 Typical Characteristics.............................................. 7
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
8
9
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
11 Device and Documentation Support ................. 17
11.1 Trademarks........................................................... 17
11.2 Electrostatic Discharge Caution............................ 17
11.3 Glossary................................................................ 17
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
Changes from Revision N (June 2011) to Revision O
Page
•
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section. ..................................................................................................................... 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
2
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SLVS522O –JULY 2004–REVISED JANUARY 2015
5 Pin Configuration and Functions
DBV (SOT-23) PACKAGE
(TOP VIEW)
1
2
3
5
4
VIN
VOUT
GND
ON/OFF
BYPASS
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
BYPASS
GND
NO.
4
I/O
—
I
Attach a 10-nF capacitor to improve low-noise performance.
2
Ground
ON/OFF
VIN
3
Active-low shutdown pin. Tie to VIN if unused.
Supply input
1
I
VOUT
5
O
Voltage output
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6 Specifications
6.1 Absolute Maximum Ratings
over virtual junction temperature range (unless otherwise noted)(1)
MIN
–0.3
MAX
16
UNIT
VIN
Continuous input voltage range(2)
ON/OFF input voltage range
Output voltage range(3)
V
V
V
VON/ OFF
–0.3
16
–0.3
9
Internally limited
(short-circuit protected)
IO
Output current(4)
—
θJA
TJ
Package thermal impedance(4) (5)
Operating virtual junction temperature
Storage temperature range
206
°C/W
°C
150
150
Tstg
–65
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The PNP pass transistor has a parasitic diode connected between the input and output. This diode normally is reverse biased
(VIN > VOUT), but will be forward biased if the output voltage exceeds the input voltage by a diode drop (see Application Information for
more details).
(3) If load is returned to a negative power supply in a dual-supply system, the output must be diode clamped to GND.
(4) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
2.2(1)
MAX
16
UNIT
V
VIN
Supply input voltage
ON/OFF input voltage
Output current
VON/ OFF
IOUT
TJ
0
VIN
V
150
125
mA
°C
Virtual junction temperature
–40
(1) Recommended minimum VIN is the greater of 2.5 V or VOUT(max) + rated dropout voltage (max) for operating IL.
6.4 Thermal Information
LP2985
DBV
THERMAL METRIC(1)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
206
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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6.5 Electrical Characteristics
at specified virtual junction temperature range, VIN = VOUT(NOM) + 1 V, VON/ OFF = 2 V, CIN = 1 μF, IL = 1 mA, COUT = 4.7 μF
(unless otherwise noted)
LP2985A-xx
LP2985-xx
PARAMETER
TEST CONDITIONS
IL = 1 mA
TJ
UNIT
%VNOM
%/V
MIN
TYP MAX
MIN
TYP MAX
25°C
25°C
–1
–1.5
–2.5
–2.5
–3.5
1
–1.5
–2.5
–3.5
–3
1.5
1.5
2.5
1 mA ≤ IL ≤ 50 mA
1 mA ≤ IL ≤ 150 mA
VIN = [VOUT(NOM) + 1 V] to 16 V
IL = 0
Output voltage
tolerance
ΔVOUT
–40°C to 125°C
25°C
2.5
2.5
3.5
3
4
–40°C to 125°C
25°C
3.5
–4
0.007 0.014
0.032
0.007 0.014
0.032
Line regulation
–40°C to 125°C
25°C
1
3
5
1
3
5
–40°C to 125°C
25°C
7
10
7
10
IL = 1 mA
–40°C to 125°C
25°C
15
15
40
60
40
60
VIN – VOUT Dropout voltage(1)
IL = 10 mA
mV
–40°C to 125°C
25°C
90
90
120
280
65
150
225
350
575
95
120
280
65
150
225
350
575
95
IL = 50 mA
–40°C to 125°C
25°C
IL = 150 mA
–40°C to 125°C
25°C
25°C (LP2985-10)
–40°C to 125°C
125
125
125
125
IL = 0
–40°C to 125°C
(LP2985-10)
160
160
25°C
25°C (LP2985-10)
–40°C to 125°C
25°C
75
120
350
110
140
170
220
250
400
600
650
1000
75
120
350
110
140
170
220
250
400
600
650
1000
IL = 1 mA
IL = 10 mA
IL = 50 mA
IL = 150 mA
25°C (LP2985-10)
–40°C to 125°C
25°C
IGND
GND pin current
μA
25°C (LP2985-10)
–40°C to 125°C
25°C
850 1500
1800
850 1500
1800
25°C (LP2985-10)
–40°C to 125°C
25°C
2500
2500
VON/ OFF < 0.3 V (OFF)
VON/ OFF < 0.15 V (OFF)
0.01
0.05
0.8
2
0.01
0.05
0.8
2
–40°C to 105°C
–40°C to 125°C
25°C
5
5
1.4
0.55
0.01
5
1.4
0.55
0.01
5
VON/ OFF = HIGH → O/P ON
VON/ OFF = LOW → O/P OFF
VON/ OFF = 0
–40°C to 125°C
25°C
1.6
1.6
VON/ OFF
ON/OFF input voltage(2)
ON/OFF input current
V
–40°C to 125°C
25°C
0.15
–2
0.15
–2
–40°C to 125°C
25°C
ION/ OFF
μA
VON/ OFF = 5 V
–40°C to 125°C
15
15
(1) Dropout voltage is defined as the input-to-output differential at which the output voltage drops 100 mV below the value measured with a
1-V differential.
(2) The ON/OFF input must be driven properly for reliable operation (see Application Information).
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Electrical Characteristics (continued)
at specified virtual junction temperature range, VIN = VOUT(NOM) + 1 V, VON/ OFF = 2 V, CIN = 1 μF, IL = 1 mA, COUT = 4.7 μF
(unless otherwise noted)
LP2985A-xx
MIN TYP MAX
LP2985-xx
MIN TYP MAX
PARAMETER
TEST CONDITIONS
TJ
UNIT
BW = 300 Hz to 50 kHz,
COUT = 10 μF,
CBYPASS = 10 nF
Vn
Output noise (RMS)
Ripple rejection
25°C
25°C
30
45
30
45
μV
ΔVOUT
ΔVIN
/
f = 1kHz, COUT = 10 μF,
CBYPASS = 10 nF
dB
IOUT(PK)
IOUT(SC)
Peak output current
Short-circuit current
V
OUT ≥ VO(NOM) – 5%
25°C
25°C
350
400
350
400
mA
mA
RL = 0 (steady state)(3)
(3) See Figure 6 in Typical Performance Characteristics.
6
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6.6 Typical Characteristics
CIN = 1 μF, COUT = 4.7 μF, VIN = VOUT(NOM) + 1 V, TA = 25°C, ON/OFF pin tied to VIN (unless otherwise specified)
3.345
3.335
3.325
10.20
10.15
10.10
10.05
10.00
9.95
V = 4.3 V
I
VI = 11 V
VO = 10 V
CI = 1 µF
CO = 4.7 µF
IO = 1 mA
V
= 3.3 V
C = 1 mF
O
i
C
= 4.7 mF
= 1 mA
o
I
O
3.315
3.305
3.295
9.90
9.85
−50 −25
0
25
50
75
100
125 150
-50
-25
0
25
50
75
100 125 150
Temperature − (°C)
Temperature – °C
Figure 2. Output Voltage vs Temperature
Figure 1. Output Voltage vs Temperature
0.45
0.4
0.5
0.45
0.4
V = 6 V
I
150 mA
V
= 3.3 V
O
V
= 3.3 V
C = 1 mF
C
= 10 nF
O
byp
i
C
byp
= 0.01 mF
0.35
0.3
0.35
0.3
0.25
0.2
0.25
0.2
50 mA
10 mA
0.15
0.1
0.15
0.1
0.05
0
0.05
1 mA
100 125 150
0
−500
−50
−25
0
25
50
75
0
500
1000
1500
2000
Temperature − (°C)
Time − (ms)
Figure 3. Dropout Voltage vs Temperature
Figure 4. Short-circuit Current vs Time
0.5
320
300
V = 16 V
I
V
O
= 3.3 V
V
= 3.3 V
C = 1 mF
O
0.45
0.4
i
C
byp
= 0.01 mF
0.35
0.3
280
0.25
0.2
260
240
0.15
0.1
220
200
0.05
0
−100
100
300
500
700
0
0.5
1
1.5
2
2.5
3
3.5
Time − (ms)
Output Voltage − (V)
Figure 5. Short-circuit Current vs Time
Figure 6. Short-circuit Current vs Output Voltage
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Typical Characteristics (continued)
CIN = 1 μF, COUT = 4.7 μF, VIN = VOUT(NOM) + 1 V, TA = 25°C, ON/OFF pin tied to VIN (unless otherwise specified)
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
100
90
80
70
60
50
40
30
20
10
0
V
= 3.3 V
O
V = 5 V
I
C
= 10 nF
byp
V
= 3.3 V
= 10 mF
O
C
C
o
= 0 nF
byp
50 mA
1 mA
150 mA
20
40
60
80
100
120
140
160
10
100
1k
10k
100k
1M
0
Load Current − mA
Frequency − (Hz)
Figure 7. Ground Pin Current vs Load Current
Figure 8. Ripple Rejection vs Frequency
100
100
90
80
70
60
50
40
30
20
10
0
V = 3.7 V
I
V = 5 V
I
90
80
70
60
50
40
30
20
10
0
V
= 3.3 V
= 10 mF
= 0 nF
V
= 3.3 V
= 4.7 mF
= 10 nF
O
O
C
C
C
C
o
o
byp
byp
1 mA
1 mA
50 mA
50 mA
150 mA
150 mA
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency − (Hz)
Frequency − (Hz)
Figure 9. Ripple Rejection vs Frequency
Figure 10. Ripple Rejection vs Frequency
100
90
80
70
60
50
40
30
20
10
0
10
C = 1 mF
i
V = 5 V
I
C
= 10 mF
= 3.3 V
o
V
= 3.3 V
= 4.7 mF
O
V
O
C
C
o
= 10 nF
byp
1
1 mA
1 mA
10 mA
100 mA
10 mA
0.1
0.01
100 mA
0.001
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency − (Hz)
Frequency − (Hz)
Figure 11. Ripple Rejection vs Frequency
Figure 12. Output Impedance vs Frequency
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Typical Characteristics (continued)
CIN = 1 μF, COUT = 4.7 μF, VIN = VOUT(NOM) + 1 V, TA = 25°C, ON/OFF pin tied to VIN (unless otherwise specified)
10
10
C = 1 mF
i
I
= 150 mA
LOAD
C
= 4.7 mF
= 3.3 V
o
V
O
1
1 mA
1
10 mA
100 mA
C
= 100 pF
byp
C
= 1 nF
byp
0.1
0.01
0.1
C
byp
= 10 nF
0.01
0.001
100
1k
Frequency − (Hz)
10k
100k
10
100
1k
10k
100k
1M
Frequency − (Hz)
Figure 14. Output Noise Density vs Frequency
Figure 13. Output Impedance vs Frequency
10
1.8
I
= 1 mA
V
O
= 3.3 V
LOAD
C
byp
= 10 nF
1.6
1.4
1.2
1
R
L
= 3.3 kW
1
C
byp
= 100 pF
C
byp
= 1 nF
0.8
0.6
0.1
R
L
= Open
C
byp
= 10 nF
0.4
0.2
0
0.01
100
1k
10k
100k
0
1
2
3
4
5
6
Frequency − (Hz)
Input Voltage − (V)
Figure 15. Output Noise Density vs Frequency
Figure 16. Input Current vs Input Voltage
1400
1200
1000
800
600
400
200
0
V
= 3.3 V
O
C
= 10 nF
byp
150 mA
1 mA
0 mA
50 mA
10 mA
−50
−25
0
25
50
75
100 125
150
Figure 18. 2.2-μF Stable ESR Range
for Output Voltage ≤ 2.3 V
Temperature − (°C)
Figure 17. Ground-pin Current vs Temperature
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Typical Characteristics (continued)
CIN = 1 μF, COUT = 4.7 μF, VIN = VOUT(NOM) + 1 V, TA = 25°C, ON/OFF pin tied to VIN (unless otherwise specified)
Figure 20. 2.2-μF/3.3-μF Stable ESR Range
for Output Voltage ≥ 2.5 V
Figure 19. 4.7-μF Stable ESR Range
for Output Voltage ≤ 2.3 V
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7 Detailed Description
7.1 Overview
The LP2985 family of fixed-output, low-dropout regulators offers exceptional, cost-effective performance for both
portable and nonportable applications. Available in voltages of 1.8 V, 2.5 V, 2.8 V, 2.9 V, 3 V, 3.1 V, 3.3 V, 5 V,
and 10 V, the family has an output tolerance of 1% for the A version (1.5% for the non-A version) and is capable
of delivering 150-mA continuous load current. Standard regulator features, such as overcurrent and
overtemperature protection, are included.
7.2 Functional Block Diagram
V
IN
ON/OFF
1.23 V
V
REF
−
+
BYPASS
V
OUT
Overcurrent/
Overtemperature
Protection
7.3 Feature Description
The LP2985 has a host of features that makes the regulator an ideal candidate for a variety of portable
applications:
•
•
•
•
•
•
Low dropout: A PNP pass element allows a typical dropout of 280 mV at 150-mA load current and 7 mV at 1-
mA load.
Low quiescent current: The use of a vertical PNP process allows for quiescent currents that are considerably
lower than those associated with traditional lateral PNP regulators.
Shutdown: A shutdown feature is available, allowing the regulator to consume only 0.01 μA when the
ON/OFF pin is pulled low.
Low-ESR-capacitor friendly: The regulator is stable with low-ESR capacitors, allowing the use of small,
inexpensive, ceramic capacitors in cost-sensitive applications.
Low noise: A BYPASS pin allows for low-noise operation, with a typical output noise of 30 μVRMS, with the
use of a 10-nF bypass capacitor.
Small packaging: For the most space-constrained needs, the regulator is available in the SOT-23 package.
7.4 Device Functional Modes
7.4.1 Normal Operation
In normal operation, the device will output a fixed voltage corresponding with the orderable part number. The
device can deliver 150 mA of continuous load current.
7.4.2 Shutdown Mode
Set the ON/OFF pin low to shut down the device when VIN is still present. If a shutdown mode is not needed, tie
the pin to VIN. For proper operation, do not leave ON/OFF unconnected, and apply a signal with a slew rate of
≥40 mV/μs.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The following application schematic shows the standard usage of the LP2985 as a low-dropout regulator.
8.1.1 Typical Application
LP2985
V
OUT
V
IN
1
5
2.2 µF
1 µF
GND
2
ON/OFF
3
4
BYPASS
10 nF
8.1.2 Design Requirements
Minimum COUT value for stability (can be increased without limit for improved stability and transient response)
ON/OFF must be actively terminated. Connect to VIN if shutdown feature is not used.
Optional BYPASS capacitor for low-noise operation
8.1.3 Capacitors
8.1.3.1 Input Capacitor (CIN)
A minimum value of 1 μF (over the entire operating temperature range) is required at the input of the LP2985. In
addition, this input capacitor should be located within 1 cm of the input pin and connected to a clean analog
ground. There are no equivalent series resistance (ESR) requirements for this capacitor, and the capacitance
can be increased without limit.
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Application Information (continued)
8.1.3.2 Output Capacitor (COUT
)
As an advantage over other regulators, the LP2985 permits the use of low-ESR capacitors at the output,
including ceramic capacitors that can have an ESR as low as 5 mΩ. Tantalum and film capacitors also can be
used if size and cost are not issues. The output capacitor also should be located within 1 cm of the output pin
and be returned to a clean analog ground.
As with other PNP LDOs, stability conditions require the output capacitor to have a minimum capacitance and an
ESR that falls within a certain range.
•
•
Minimum COUT: 2.2 μF (can be increased without limit to improve transient response stability margin)
ESR range: see Figure 18 through Figure 20
It is critical that both the minimum capacitance and ESR requirement be met over the entire operating
temperature range. Depending on the type of capacitors used, both these parameters can vary significantly with
temperature (see capacitor characteristics).
8.1.3.3 Noise Bypass Capacitor (CBYPASS
)
The LP2985 allows for low-noise performance with the use of a bypass capacitor that is connected to the internal
bandgap reference via the BYPASS pin. This high-impedance bandgap circuitry is biased in the microampere
range and, thus, cannot be loaded significantly, otherwise, its output – and, correspondingly, the output of the
regulator – changes. Thus, for best output accuracy, dc leakage current through CBYPASS should be minimized as
much as possible and never should exceed 100 nA.
A 10-nF capacitor is recommended for CBYPASS. Ceramic and film capacitors are well suited for this purpose.
8.1.3.4 Reverse Input-Output Voltage
There is an inherent diode present across the PNP pass element of the LP2985.
V
IN
V
OUT
With the anode connected to the output, this diode is reverse biased during normal operation, since the input
voltage is higher than the output. However, if the output is pulled higher than the input for any reason, this diode
is forward biased and can cause a parasitic silicon-controlled rectifier (SCR) to latch, resulting in high current
flowing from the output to the input. Thus, to prevent possible damage to the regulator in any application where
the output may be pulled above the input, or the input may be shorted to ground, an external Schottky diode
should be connected between the output and input. With the anode on output, this Schottky limits the reverse
voltage across the output and input pins to ∼0.3 V, preventing the regulator’s internal diode from forward biasing.
Schottky
V
IN
V
OUT
LP2985
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Application Information (continued)
8.1.4 Detailed Design Procedure
8.1.4.1 Capacitor Characteristics
8.1.4.1.1 Ceramics
Ceramic capacitors are ideal choices for use on the output of the LP2985 for several reasons. For capacitances
in the range of 2.2 μF to 4.7 μF, ceramic capacitors have the lowest cost and the lowest ESR, making them
choice candidates for filtering high-frequency noise. For instance, a typical 2.2-μF ceramic capacitor has an ESR
in the range of 10 mΩ to 20 mΩ and, thus, satisfies minimum ESR requirements of the regulator.
Ceramic capacitors have one major disadvantage that must be taken into account – a poor temperature
coefficient, where the capacitance can vary significantly with temperature. For instance, a large-value ceramic
capacitor (≥ 2.2 μF) can lose more than half of its capacitance as the temperature rises from 25°C to 85°C. Thus,
a 2.2-μF capacitor at 25°C drops well below the minimum COUT required for stability, as ambient temperature
rises. For this reason, select an output capacitor that maintains the minimum 2.2 μF required for stability over the
entire operating temperature range. Note that there are some ceramic capacitors that can maintain a ±15%
capacitance tolerance over temperature.
8.1.4.1.2 Tantalum
Tantalum capacitors can be used at the output of the LP2985, but there are significant disadvantages that could
prohibit their use:
•
In the 1-μF to 4.7-μF range, tantalum capacitors are more expensive than ceramics of the equivalent
capacitance and voltage ratings.
•
Tantalum capacitors have higher ESRs than their equivalent-sized ceramic counterparts. Thus, to meet the
ESR requirements, a higher-capacitance tantalum may be required, at the expense of larger size and higher
cost.
•
The ESR of a tantalum capacitor increases as temperature drops, as much as double from 25°C to –40°C.
Thus, ESR margins must be maintained over the temperature range to prevent regulator instability.
8.1.4.2 ON/OFF Operation
The LP2985 allows for a shutdown mode via the ON/OFF pin. Driving the pin LOW (≤ 0.3 V) turns the device
OFF; conversely, a HIGH (≥ 1.6 V) turns the device ON. If the shutdown feature is not used, ON/OFF should be
connected to the input to ensure that the regulator is on at all times. For proper operation, do not leave ON/OFF
unconnected, and apply a signal with a slew rate of ≥ 40 mV/μs.
8.1.5 Application Curves
200
150
100
50
200
150
100
50
3.4
3.38
3.36
3.34
3.32
3.3
3.4
3.38
3.36
3.34
3.32
3.3
I
I
L
L
V
= 3.3 V
O
0
V = 3.3 V
O
0
C = 10 nF
DI = 100 mA
byp
C
= 10 nF
DI = 150 mA
byp
L
−50
L
−50
V
O
V
O
−100
−150
−200
−250
3.28
3.26
3.24
3.22
−100
−150
−200
−250
3.28
3.26
3.24
3.22
20 ms/div→
20 ms/div→
Figure 21. Load Transient Response
Figure 22. Load Transient Response
14
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LP2985
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Application Information (continued)
3.41
3.39
3.37
3.35
3.33
3.31
3.29
3.27
5.5
5
3.4
200
150
3.38
3.36
100
50
V
I
4.5
I
L
3.34
3.32
3.3
V
= 3.3 V
= 0 nF
= 150 mA
O
C
I
V
= 3.3 V
= 0 nF
DI = 150 mA
byp
O
4
0
C
O
byp
L
−50
3.5
V
O
−100
−150
−200
−250
3.28
3.26
V
O
3
2.5
3.24
3.22
2
20 ms/div→
20 ms/div→
Figure 24. Line Transient Response
Figure 23. Load Transient Response
3.41
3.39
3.37
3.41
3.39
5.5
5.5
5
5
V
I
4.5
V
I
4.5
3.37
3.35
V
= 3.3 V
V
= 3.3 V
= 0 nF
= 1 mA
O
O
4
C
I
= 10 nF
= 150 mA
4
C
I
3.35
3.33
3.31
3.29
3.27
byp
byp
O
O
3.5
3.5
3
3.33
3
3.31
3.29
3.27
2.5
2.5
V
O
V
O
2
2
20 ms/div→
20 ms/div→
Figure 25. Line Transient Response
Figure 26. Line Transient Response
4
3
2
1
10
8
5.5
3.41
3.39
3.37
V
O
5
V
IN
4.5
6
4
3.35
3.33
3.31
V
= 3.3 V
O
0
C
I
= 10 nF
byp
= 1 mA
3.5
O
V
= 3.3 V
O
4
−1
C
= 0
= 150 mA
byp
I
O
3
V
−2
−3
−4
O
V
ON/OFF
2
2.5
2
3.29
3.27
0
100 ms/div→
100 ms/div→
Figure 27. Line Transient Response
Figure 28. Turn-on Time
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LP2985
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www.ti.com
Application Information (continued)
10
10
4
3
4
V
O
V
O
3
2
8
6
4
2
0
8
6
4
2
0
2
1
1
0
0
V
= 3.3 V
O
V
= 3.3 V
O
−1
−2
−3
−4
−1
C
= 1 nF
= 150 mA
byp
C
= 100 pF
= 150 mA
byp
I
LOAD
I
LOAD
V
ON/OFF
−2
V
ON/OFF
−3
−4
2 ms/div→
200 ms/div→
Figure 30. Turn-on Time
Figure 29. Turn-on Time
4
10
8
Input
3
2
1
0
6
4
2
0
V
= 3.3 V
O
−1
−2
C
= 10 nF
= 150 mA
byp
I
LOAD
Output
−3
−4
20 ms/div→
Figure 31. Turn-on Time
9 Power Supply Recommendations
A power supply may be used at the input voltage within the ranges given in the Recommended Operating
Conditions table. It is recommended to use bypass capacitors as described in Layout Guidelines.
16
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LP2985
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SLVS522O –JULY 2004–REVISED JANUARY 2015
10 Layout
10.1 Layout Guidelines
•
•
It is recommended that the input pin be bypassed to ground with a bypass-capacitor.
The optimum placement of the bypass capacitor is closest to the VIN of the device and GND of the system.
Care must be taken to minimize the loop area formed by the bypass-capacitor connection, the VIN pin, and
the GND pin of the system.
•
For operation at full-rated load, it is recommended to use wide trace lengths to eliminate IR drop and heat
dissipation.
10.2 Layout Example
VIN
VOUT
1
2
5
4
1 ꢀF
2.2 ꢀF
LP2985
3
ON/OFF
tied to VIN
if not used
10 nF
Figure 32. Layout Diagram
11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2004–2015, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2015
PACKAGING INFORMATION
Orderable Device
LP2985-10DBVR
LP2985-10DBVT
LP2985-18DBVR
LP2985-18DBVRE4
LP2985-18DBVRG4
LP2985-18DBVT
LP2985-18DBVTE4
LP2985-18DBVTG4
LP2985-25DBVR
LP2985-25DBVRG4
LP2985-25DBVT
LP2985-25DBVTG4
LP2985-28DBVR
LP2985-28DBVT
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LRCG
LRCG
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
250
3000
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
(LPHG ~ LPHL)
LPHG
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS
& no Sb/Br)
CU NIPDAU
LPHG
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
(LPHG ~ LPHL)
LPHG
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
250
Green (RoHS
& no Sb/Br)
LPHG
3000
3000
250
Green (RoHS
& no Sb/Br)
(LPLG ~ LPLL)
(LPLG ~ LPLL)
(LPLG ~ LPLL)
(LPLG ~ LPLL)
(LPGG ~ LPGL)
(LPGG ~ LPGL)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
LP2985-28DBVTE4
LP2985-28DBVTG4
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LPGG
LP2985-29DBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(LPMG ~ LPML)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LP2985-30DBVR
LP2985-30DBVRG4
LP2985-30DBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(LPNG ~ LPNL)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000
250
Green (RoHS
& no Sb/Br)
(LPNG ~ LPNL)
(LPNG ~ LPNL)
(LPNG ~ LPNL)
(LPFG ~ LPFL)
LPFG
Green (RoHS
& no Sb/Br)
LP2985-30DBVTG4
LP2985-33DBVR
LP2985-33DBVRE4
LP2985-33DBVRG4
LP2985-33DBVT
250
Green (RoHS
& no Sb/Br)
3000
3000
3000
250
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS
& no Sb/Br)
CU NIPDAU
LPFG
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
(LPFG ~ LPFL)
LPFG
LP2985-33DBVTE4
LP2985-33DBVTG4
LP2985-50DBVR
LP2985-50DBVRG4
LP2985-50DBVT
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
250
Green (RoHS
& no Sb/Br)
LPFG
3000
3000
250
Green (RoHS
& no Sb/Br)
(LPSG ~ LPSL)
(LPSG ~ LPSL)
(LPSG ~ LPSL)
(LPSG ~ LPSL)
LRDG
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LP2985-50DBVTG4
LP2985A-10DBVR
LP2985A-10DBVT
LP2985A-18DBVJ
LP2985A-18DBVR
250
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LRDG
10000 Green (RoHS
& no Sb/Br)
LPTL
3000
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
(LPTG ~ LPTL)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LP2985A-18DBVRE4
LP2985A-18DBVRG4
ACTIVE
SOT-23
SOT-23
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
ACTIVE
ACTIVE
DBV
DBV
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LPTG
LP2985A-18DBVT
SOT-23
5
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 125
(LPTG ~ LPTL)
LP2985A-18DBVTE4
LP2985A-25DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LPUG ~ LPUL)
(LPUG ~ LPUL)
(LPUG ~ LPUL)
(LPUG ~ LPUL)
(LPJG ~ LPJL)
(LPJG ~ LPJL)
(LPZG ~ LPZL)
(LRAG ~ LRAL)
(LRAG ~ LRAL)
(LRAG ~ LRAL)
(LPKG ~ LPKL)
LP2985A-25DBVRG4
LP2985A-25DBVT
LP2985A-25DBVTG4
LP2985A-28DBVR
LP2985A-28DBVT
LP2985A-29DBVR
LP2985A-30DBVR
LP2985A-30DBVT
LP2985A-30DBVTG4
LP2985A-33DBVR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
LP2985A-33DBVRE4
LP2985A-33DBVRG4
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LPKG
LP2985A-33DBVT
ACTIVE
SOT-23
DBV
5
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 125
(LPKG ~ LPKL)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LP2985A-33DBVTE4
LP2985A-33DBVTG4
LP2985A-50DBVR
LP2985A-50DBVRG4
LP2985A-50DBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LPKG
LPKG
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
250
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(LR1G ~ LR1L)
(LR1G ~ LR1L)
(LR1G ~ LR1L)
(LR1G ~ LR1L)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LP2985A-50DBVTG4
250
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2015
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP2985-10DBVR
LP2985-10DBVT
LP2985-18DBVR
LP2985-18DBVR
LP2985-18DBVRG4
LP2985-18DBVT
LP2985-18DBVTG4
LP2985-25DBVR
LP2985-25DBVR
LP2985-25DBVT
LP2985-28DBVR
LP2985-28DBVR
LP2985-28DBVT
LP2985-28DBVTG4
LP2985-29DBVR
LP2985-29DBVR
LP2985-30DBVR
LP2985-30DBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
178.0
178.0
180.0
178.0
178.0
180.0
178.0
180.0
178.0
180.0
180.0
178.0
180.0
178.0
180.0
178.0
180.0
178.0
9.0
9.0
9.2
9.0
9.0
9.2
9.0
9.2
9.0
9.2
9.2
9.0
9.2
9.0
9.2
9.0
9.2
9.0
3.23
3.3
3.17
3.2
1.37
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
3000
3000
250
3.17
3.3
3.23
3.2
1.37
1.4
3.3
3.2
1.4
3.17
3.23
3.17
3.3
3.23
3.17
3.23
3.2
1.37
1.37
1.37
1.4
250
3000
3000
250
3.17
3.17
3.23
3.17
3.3
3.23
3.23
3.17
3.23
3.2
1.37
1.37
1.37
1.37
1.4
3000
3000
250
250
3000
3000
3000
3000
3.17
3.23
3.17
3.23
3.23
3.17
3.23
3.17
1.37
1.37
1.37
1.37
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP2985-30DBVT
LP2985-33DBVR
LP2985-33DBVRG4
LP2985-33DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
250
3000
3000
250
180.0
178.0
178.0
178.0
178.0
180.0
178.0
180.0
178.0
178.0
330.0
178.0
180.0
178.0
180.0
180.0
178.0
180.0
180.0
178.0
180.0
180.0
178.0
178.0
180.0
180.0
180.0
178.0
178.0
178.0
180.0
178.0
178.0
180.0
180.0
9.2
9.0
9.0
9.0
9.0
9.2
9.0
9.2
9.0
9.0
8.4
9.0
9.2
9.0
9.2
9.2
9.0
9.2
9.2
9.0
9.2
9.2
9.0
9.0
9.2
9.2
9.2
9.0
9.0
9.0
9.2
9.0
9.0
9.2
9.2
3.17
3.3
3.23
3.2
1.37
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3.3
3.2
1.4
3.23
3.23
3.17
3.23
3.17
3.23
3.3
3.17
3.17
3.23
3.17
3.23
3.17
3.2
1.37
1.37
1.37
1.37
1.37
1.37
1.4
LP2985-33DBVTG4
LP2985-50DBVR
LP2985-50DBVR
LP2985-50DBVT
250
3000
3000
250
LP2985A-10DBVR
LP2985A-10DBVT
LP2985A-18DBVJ
LP2985A-18DBVR
LP2985A-18DBVR
LP2985A-18DBVRG4
LP2985A-18DBVT
LP2985A-25DBVR
LP2985A-25DBVR
LP2985A-25DBVT
LP2985A-28DBVR
LP2985A-28DBVR
LP2985A-28DBVT
LP2985A-29DBVR
LP2985A-29DBVR
LP2985A-30DBVR
LP2985A-30DBVR
LP2985A-30DBVT
LP2985A-33DBVR
LP2985A-33DBVR
LP2985A-33DBVRG4
LP2985A-33DBVT
LP2985A-33DBVT
LP2985A-33DBVTG4
LP2985A-50DBVR
LP2985A-50DBVR
LP2985A-50DBVT
3000
250
10000
3000
3000
3000
250
3.17
3.23
3.17
3.23
3.17
3.17
3.23
3.17
3.17
3.23
3.17
3.17
3.23
3.23
3.17
3.17
3.17
3.3
3.23
3.17
3.23
3.17
3.23
3.23
3.17
3.23
3.23
3.17
3.23
3.23
3.17
3.17
3.23
3.23
3.23
3.2
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.4
3000
3000
250
3000
3000
250
3000
3000
3000
3000
250
3000
3000
3000
250
3.3
3.2
1.4
3.23
3.17
3.23
3.23
3.17
3.17
3.17
3.23
3.17
3.17
3.23
3.23
1.37
1.37
1.37
1.37
1.37
1.37
250
250
3000
3000
250
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2985-10DBVR
LP2985-10DBVT
LP2985-18DBVR
LP2985-18DBVR
LP2985-18DBVRG4
LP2985-18DBVT
LP2985-18DBVTG4
LP2985-25DBVR
LP2985-25DBVR
LP2985-25DBVT
LP2985-28DBVR
LP2985-28DBVR
LP2985-28DBVT
LP2985-28DBVTG4
LP2985-29DBVR
LP2985-29DBVR
LP2985-30DBVR
LP2985-30DBVR
LP2985-30DBVT
LP2985-33DBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
180.0
180.0
205.0
180.0
180.0
205.0
180.0
205.0
180.0
205.0
205.0
180.0
205.0
180.0
205.0
180.0
205.0
180.0
205.0
180.0
180.0
180.0
200.0
180.0
180.0
200.0
180.0
200.0
180.0
200.0
200.0
180.0
200.0
180.0
200.0
180.0
200.0
180.0
200.0
180.0
18.0
18.0
33.0
18.0
18.0
33.0
18.0
33.0
18.0
33.0
33.0
18.0
33.0
18.0
33.0
18.0
33.0
18.0
33.0
18.0
3000
3000
3000
250
250
3000
3000
250
3000
3000
250
250
3000
3000
3000
3000
250
3000
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2015
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2985-33DBVRG4
LP2985-33DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
180.0
180.0
180.0
205.0
180.0
205.0
180.0
180.0
358.0
180.0
205.0
180.0
205.0
205.0
180.0
205.0
205.0
180.0
205.0
205.0
180.0
180.0
205.0
205.0
205.0
180.0
180.0
180.0
205.0
180.0
180.0
205.0
205.0
180.0
180.0
180.0
200.0
180.0
200.0
180.0
180.0
332.0
180.0
200.0
180.0
200.0
200.0
180.0
200.0
200.0
180.0
200.0
200.0
180.0
180.0
200.0
200.0
200.0
180.0
180.0
180.0
200.0
180.0
180.0
200.0
200.0
18.0
18.0
18.0
33.0
18.0
33.0
18.0
18.0
35.0
18.0
33.0
18.0
33.0
33.0
18.0
33.0
33.0
18.0
33.0
33.0
18.0
18.0
33.0
33.0
33.0
18.0
18.0
18.0
33.0
18.0
18.0
33.0
33.0
LP2985-33DBVTG4
LP2985-50DBVR
LP2985-50DBVR
LP2985-50DBVT
250
3000
3000
250
LP2985A-10DBVR
LP2985A-10DBVT
LP2985A-18DBVJ
LP2985A-18DBVR
LP2985A-18DBVR
LP2985A-18DBVRG4
LP2985A-18DBVT
LP2985A-25DBVR
LP2985A-25DBVR
LP2985A-25DBVT
LP2985A-28DBVR
LP2985A-28DBVR
LP2985A-28DBVT
LP2985A-29DBVR
LP2985A-29DBVR
LP2985A-30DBVR
LP2985A-30DBVR
LP2985A-30DBVT
LP2985A-33DBVR
LP2985A-33DBVR
LP2985A-33DBVRG4
LP2985A-33DBVT
LP2985A-33DBVT
LP2985A-33DBVTG4
LP2985A-50DBVR
LP2985A-50DBVR
LP2985A-50DBVT
3000
250
10000
3000
3000
3000
250
3000
3000
250
3000
3000
250
3000
3000
3000
3000
250
3000
3000
3000
250
250
250
3000
3000
250
Pack Materials-Page 4
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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