LP324MT/NOPB [TI]
LP324-N/LP2902-N Micropower Quad Operational Amplifier; LP324 -N / LP2902 -N微功耗四路运算放大器
| 型号： | LP324MT/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LP324-N/LP2902-N Micropower Quad Operational Amplifier |
| 文件： | 总18页 (文件大小：1241K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LP2902-N, LP324-N
www.ti.com
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
LP324-N/LP2902-N Micropower Quad Operational Amplifier
Check for Samples: LP2902-N, LP324-N
1
FEATURES
DESCRIPTION
The LP324-N series consists of four independent,
2
•
•
•
•
•
•
•
•
Low Supply Current: 85μA (typ)
Low Offset Voltage: 2mV (typ)
Low Input Bias Current: 2nA (typ)
Input Vommon Mode to GND
high gain internally compensated micropower
operational amplifiers. These amplifiers are specially
suited for operation in battery systems while
maintaining good input specifications, and extremely
low supply current drain. In addition, the LP324-N has
an input common mode range, and output source
range which includes ground, making it ideal in single
supply applications.
Interfaces to CMOS Logic
Wide Supply Range: 3V < V+ < 32V
Small Outline Package Available
Pin-for-pin Compatible with LM324
These amplifiers are ideal in applications which
include portable instrumentation, battery backup
equipment, and other circuits which require good DC
performance and low supply current.
Connection Diagram
Figure 1. 14-Lead SOIC
See NFF0014A or D Package
Figure 2. 14-Pin TSSOP
See PW Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LP2902-N, LP324-N
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
www.ti.com
Simplified Schematic
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
LP324-N
LP2902-N
LP324-N
LP2902-N
LP324-N
LP2902-N
32V or ± 16V
26V or ± 13V
32V
Differential Input Voltage
Input Voltage(3)
26V
−0.3V to 32V
−0.3V to 26V
Continuous
±500V
Output Short-Circuit to GND (One Amplifier)(4)
V+ ≤ 15V and TA = 25°C
ESD Susceptibility(5)
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The input voltage is not allowed to go more than −0.3V below V− (GND) as this will turn on a parasitic transistor causing large currents
to flow through the device.
(4) Short circuits from the output to GND can cause excessive heating and eventual destruction. The maximum sourcing output current is
approximately 30 mA independent of the magnitude of V+. At values of supply voltage in excess of 15 VDC, continuous short-circuit to
GND can exceed the power dissipation ratings (particularly at elevated temperatures) and cause eventual destruction. Destructive
dissipation can result from simultaneous shorts on all amplifiers.
(5) The test circuit used consists of the human body model of 100 pF in series with 1500Ω.
2
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SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
Operating Conditions
TJMAX
150°C
154°C/W
(1)
θJA
PW Package
NFF014A Package
D Package
90°C/W
140°C/W
Operating Temp. Range
Storage Temp. Range
Soldering Information
See(2)
−65°C≤TJ≤ 150°C
260°C(lead temp.)
235°C
Wave Soldering(10sec)
Convection or Infrared(20sec)
(1) For operation at elevated temperatures, these devices must be derated based on a thermal resistance of θJA and TJ max. TJ = TA
θJAPD.
+
(2) The LP2902-N may be operated from −40°C ≤ TA ≤ +85°C, and the LP324-N may be operated from 0°C ≤ TA ≤ +70°C.
Electrical Characteristics(1)
Symbol
Parameter
Conditions
LP2902-N(2)
LP324-N
Typ
2
Tested
Limit(3)
Design
Limit(4)
Typ
2
Tested
Limit(3)
Design
Limit(4)
Units
Limits
VOS
Input Offset
Voltage
4
20
4
10
4
10
2
9
mV
(Max)
IB
Input Bias Current
2
40
2
20
nA
(Max)
IOS
Input Offset Current
Voltage Gain
0.5
70
90
90
85
3.6
0.7
10
5
8
0.2
100
90
90
85
3.6
0.7
10
5
4
nA
(Max)
AVOL
CMRR
PSRR
IS
RL = 10k to GND
V+ = 30V
40
80
80
150
3.4
0.8
7
30
50
80
80
150
3.4
0.8
7
40
V/mV
(Min)
Common Mode Rej.
Ratio
V+ = 30V, 0V ≤ VCM
75
75
dB
(Min)
VCM < V+− 1.5
Power Supply Rej.
Ratio
V+ = 5V to 30V
75
75
dB
(Min)
Supply Current
RL = ∞
250
V+−1.9V
1.0
4
250
V+−1.9V
1.0
4
μA
(Max)
VO
Output Voltage Swing IL = 350μA to GND
V
(Min)
VCM = 0V
IL = 350μA to V+
VCM = 0V
V
(Max)
IOUT
Source
Output Source
Current
VO = 3V
VIN (diff) = 1V
mA
(Min)
IOUT
Sink
Output Sink Current
VO = 1.5V
VIN (diff) = 1V
4
3
4
3
mA
(Min)
IOUT
Sink
Output Sink Current
VO = 1.5V
VCM = 0V
4
2
1
4
2
1
mA
(Min)
ISOURCE
Output Short to GND VIN (diff) = 1V
20
15
25
35
35
20
15
25
35
35
mA
(Max)
ISINK
Output Short to V+
VIN (diff) = 1V
30
45
30
45
mA
(Max)
VOS Drift
IOS Drift
GBW
10
10
10
10
μV/C°
pA/C°
KHz
Gain Bandwidth
Product
100
100
SR
Slew Rate
50
50
V/mS
(1) Boldface numbers apply at temperature extremes. All other numbers apply only at TA = TJ = 25°C, V+ = 5V, Vcm = V/2, and RL =100k
connected to GND unless otherwise specified.
(2) The LP2902-N operating supply range is 3V to 26V, and is not tested above 26V.
(3) Specified and 100% production tested.
(4) Specified (but not 100% production tested) over the operating supply voltage range (3.0V to 32V for the LP324-N, LP324-N, and 3.0V to
26V for the LP2902-N), and the common mode range (0V to V+ −1.5V), unless otherwise specified. These limits are not used to
calculate outgoing quality levels.
Copyright © 1999–2013, Texas Instruments Incorporated
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LP2902-N, LP324-N
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Curves
Input Voltage Range
Input Current
Figure 3.
Figure 4.
Supply Current
Voltage Gain
Figure 5.
Figure 6.
Open Loop
Frequency Response
Power Supply
Rejection Ratio
Figure 7.
Figure 8.
4
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Product Folder Links: LP2902-N LP324-N
LP2902-N, LP324-N
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SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
Typical Performance Curves (continued)
Voltage Follower
Pulse Response
Voltage Follower Pulse
Response (Small Signal)
Figure 9.
Figure 10.
Common Mode
Rejection Ratio
Large Signal
Frequency Response
Figure 11.
Figure 12.
Output Characteristics
Current Sourcing
Output Characteristics
Current Sinking
Figure 13.
Figure 14.
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LP2902-N, LP324-N
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Curves (continued)
Current Limiting
Figure 15.
APPLICATION HINTS
The LP324-N series is a micro-power pin-for-pin equivalent to the LM324 op amps. Power supply current, input
bias current, and input offset current have all been reduced by a factor of 10 over the LM324. Like its
predecessor, the LP324-N series op amps can operate on single supply, have true-differential inputs, and remain
in the linear mode with an input common-mode voltage of 0 VDC
.
The pinouts of the package have been designed to simplify PC board layouts. Inverting inputs are adjacent to
outputs for all of the amplifiers and the outputs have also been placed at the corners of the package (pins 1, 7, 8,
and 14).
Precautions should be taken to insure that the power supply for the integrated circuit never becomes reversed in
polarity or the unit is not inadvertently installed backwards in the test socket as an unlimited current surge
through the resulting forward diode within the IC could destroy the unit.
Large differential input voltages can be easily accommodated and, as input differential voltage protection diodes
are not needed, no large input currents result from large differential input voltages. The differential input voltage
may be larger than V+ without damaging the device. Protection should be provided to prevent the input voltages
from going negative more than −0.3 VDC (at 25°C). An input clamp diode with a resistor to the IC input terminal
can be used.
The amplifiers have a class B output stage which allows the amplifiers to both source and sink output currents. In
applications where crossover distortion is undesirable, a resistor should be used from the output of the amplifier
to ground. The resistor biases the output into class A operation.
The LP324-N has improved stability margin for driving capacitive loads. No special precautions are needed to
drive loads in the 50 pF to 1000 pF range. It should be noted however that since the power supply current has
been reduced by a factor of 10, so also has the slew rate and gain bandwidth product. This reduction can cause
reduced performance in AC applications where the LM324 is being replaced by an LP324-N. Such situations
usually occur when the LM324 has been operated near its power bandwidth.
Output short circuits either to ground or to the positive power supply should be of short time duration. Units can
be destroyed, not as a result of the short circuit current causing metal fusing, but rather due to the large increase
in IC chip dissipation which will cause eventual failure due to excessive junction temperatures. For example: If all
four amplifiers were simultaneously shorted to ground on a 10V supply the junction temperature would rise by
110°C.
Exceeding the negative common-mode limit on either input will cause a reversal of phase to the output and force
the amplifier to the corresponding high or low state. Exceeding the negative common-mode limit on both inputs
will force the amplifier output to a high state. Exceeding the positive common-mode limit on a single input will not
change the phase of the output. However, if both inputs exceed the limit, the output of the amplifier will be forced
to a low state. In neither case does a latch occur since returning the input within the common mode range puts
the input stage and thus the amplifier in a normal operating mode.
6
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Product Folder Links: LP2902-N LP324-N
LP2902-N, LP324-N
www.ti.com
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
The circuits presented in the section on typical applications emphasize operation on only a single power supply
voltage. If complementary power supplies are available, all of the standard op amp circuits can be used. In
general, introducing a pseudo-ground (a bias voltage reference to V+/2) will allow operation above and below this
value in single power supply systems. Many application circuits are shown which take advantage of the wide
input common-mode voltage range which includes ground. In most cases, input biasing is not required and input
voltages which range to ground can easily be accommodated.
Figure 16. Driving CMOS
Figure 17. Comparator with Hysteresis
Figure 18. Non-Inverting Amplifier
Figure 19. Adder/Subtractor
Figure 20. Unity Gain Buffer
Figure 21. Positive Integrator
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LP2902-N, LP324-N
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
www.ti.com
Figure 22. Differential Integrator
Figure 23. Howland Current Pump
Figure 24. Bridge Current Amplifier
Figure 25. μ Power Current Source
Figure 26. Lowpass Filter
8
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Product Folder Links: LP2902-N LP324-N
LP2902-N, LP324-N
www.ti.com
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
Figure 27. 1 kHz Bandpass Active Filter
Figure 28. Band-Reject Filter
Figure 29. Pulse Generator
Figure 30. Window Comparator
Copyright © 1999–2013, Texas Instruments Incorporated
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LP2902-N, LP324-N
SNOSBX6C –SEPTEMBER 1999–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (March 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LP2902M
ACTIVE
SOIC
SOIC
D
14
14
55
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
LP2902M
LP2902M/NOPB
ACTIVE
D
55
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP2902M
LP2902MX
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
2500
2500
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
LP2902M
LP2902M
LP2902MX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP2902N/NOPB
ACTIVE
PDIP
NFF
14
25
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 85
LP2902N
LP2902N/PB
LP324M
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
NFF
D
14
14
14
25
55
55
TBD
Call TI
Call TI
CU SN
Call TI
Call TI
LP2902N
LP324M
LP324M
TBD
0 to 70
0 to 70
LP324M/NOPB
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP324MT
LP324MT/NOPB
LP324MTX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
14
14
14
14
94
94
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
LP324
MT
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
LP324
MT
2500
2500
TBD
LP324
MT
LP324MTX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP324
MT
LP324MX
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
2500
2500
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
LP324M
LP324MX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP324M
LP324N/NOPB
LP324N/PB
ACTIVE
ACTIVE
PDIP
PDIP
NFF
NFF
14
14
25
25
Green (RoHS
& no Sb/Br)
CU SN
Call TI
Level-1-NA-UNLIM
Call TI
0 to 70
LP324N
LP324N
TBD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP2902MX
LP2902MX/NOPB
LP324MTX
SOIC
SOIC
D
D
14
14
14
14
14
14
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
12.4
16.4
16.4
6.5
6.5
9.35
9.35
8.3
2.3
2.3
1.6
1.6
2.3
2.3
8.0
8.0
8.0
8.0
8.0
8.0
16.0
16.0
12.0
12.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
TSSOP
SOIC
PW
PW
D
6.95
6.95
6.5
LP324MTX/NOPB
LP324MX
8.3
9.35
9.35
LP324MX/NOPB
SOIC
D
6.5
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2902MX
LP2902MX/NOPB
LP324MTX
SOIC
SOIC
D
D
14
14
14
14
14
14
2500
2500
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
TSSOP
TSSOP
SOIC
PW
PW
D
LP324MTX/NOPB
LP324MX
LP324MX/NOPB
SOIC
D
Pack Materials-Page 2
MECHANICAL DATA
NFF0014A
N14A (Rev G)
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