LP3470A [TI]

具有可编程延迟和 1% 复位阈值的超低功耗低电平有效复位 IC;
LP3470A
型号: LP3470A
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有可编程延迟和 1% 复位阈值的超低功耗低电平有效复位 IC

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中文:  中文翻译
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LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
具有可编程延迟和 1% 复位阈值的 LP3470A 超低功耗电压监控器  
1 特性  
3 说明  
1
LP3470 引脚对引脚兼容  
5 引脚 SOT-23 封装  
微功耗电压监控电路 LP3470A 器件设计用于在 1% 的  
过热复位阈值内监测电压,与 TI 现有的 LP3470 器件  
引脚对引脚兼容。LP3470A 器件提供精确的毫微功耗  
电压监控,具有可编程延迟功能。  
漏极开路复位输出  
使用外部电容器的可编程复位超时周期  
不受 VCC 短时瞬变干扰  
VCC 电源电压低于复位阈值时,LP3470A 将发出  
复位信号。使用外部电容器可调节复位超时周期。  
VCC 升至阈值电压以上且加一定迟滞后,在某一间隔  
(可通过外部电容器编程)复位保持有效。  
±1% 复位阈值精度(典型值)  
超低静态电流(0.3µA 典型值)  
复位有效低至 VCC = 0.95V  
2 应用  
有关可用复位阈值电压选项的信息,请参阅机械、封装  
和可订购信息。  
关键 µP µC 电源监视  
智能仪表  
器件信息(1)  
计算机  
器件型号  
LP3470A  
封装  
SOT-23 (5)  
封装尺寸(标称值)  
便携式和电池供电类设备  
楼宇自动化:楼宇安全系统、视频监控  
工厂自动化:现场发送器、位置和接近传感器  
电机驱动器  
1.60mm × 2.90mm  
(1) 要了解所有可用封装,请参阅数据表末尾的封装选项附录。  
基本工作电路  
LP3470A 典型电源电流  
0.6  
25°C  
0.55  
-40°C  
125°C  
IN LDO OUT  
0.5  
0.45  
0.4  
VCC  
VCC VCC1  
Microcontroller  
0.35  
0.3  
RESET  
LP3470A  
SRT  
RESET  
0.25  
0.2  
GND  
0.15  
0.1  
0.05  
1
2
3
4
5 6  
VCC (V)  
7
8
9
10  
Iq_v  
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确  
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。  
English Data Sheet: SNVSBF5  
 
 
 
 
 
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
目录  
8.3 Feature Description................................................... 9  
8.4 Device Functional Modes........................................ 11  
Application and Implementation ........................ 12  
9.1 Application Information............................................ 12  
9.2 Typical Application ................................................. 12  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 5  
7.1 Absolute Maximum Ratings ...................................... 5  
7.2 ESD Ratings ............................................................ 5  
7.3 Recommended Operating Conditions....................... 5  
7.4 Thermal Information.................................................. 5  
7.5 Electrical Characteristics........................................... 6  
7.6 Timing Requirements................................................ 6  
7.7 Typical Characteristics ............................................. 7  
Detailed Description .............................................. 9  
8.1 Overview ................................................................... 9  
8.2 Functional Block Diagram ......................................... 9  
9
10 Power Supply Recommendations ..................... 14  
11 Layout................................................................... 14  
11.1 Layout Guidelines ................................................. 14  
11.2 Layout Example .................................................... 14  
12 器件和文档支持 ..................................................... 15  
12.1 接收文档更新通知 ................................................. 15  
12.2 支持资源................................................................ 15  
12.3 ....................................................................... 15  
12.4 静电放电警告......................................................... 15  
12.5 Glossary................................................................ 15  
13 机械、封装和可订购信息....................................... 15  
8
4 修订历史记录  
注:之前版本的页码可能与当前版本有所不同。  
Changes from Revision A (October 2019) to Revision B  
Page  
已更改 将超低静态电流从 0.35 更改为 0.3 以与电气特性表保持一致 .................................................................................. 1  
Changed the typical value of ICC in the Electrical Characteristics table from 300 to 0.3 to match with the units of µA......... 6  
Changes from Original (July 2019) to Revision A  
Page  
首次公开发布 .......................................................................................................................................................................... 1  
2
Copyright © 2019, Texas Instruments Incorporated  
 
LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
5 Device Comparison Table  
PART NUMBER  
LP3470A263  
LP3470A275  
LP3470A293  
LP3470A308  
LP3470A365  
LP3470A400  
LP3470A438  
LP3470A463  
VIT- (typ) (VCC RAMPING DOWN)  
VIT+ (typ) (VCC RAMPING UP)  
2.63 V  
2.75 V  
2.93 V  
3.08 V  
3.65 V  
4.0 V  
2.73 V  
2.85 V  
3.03 V  
3.28 V  
3.85 V  
4.2 V  
4.38 V  
4.63 V  
4.58 V  
4.83 V  
Copyright © 2019, Texas Instruments Incorporated  
3
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
6 Pin Configuration and Functions  
DBV Package  
5-Pin SOT-23  
Top View  
SOT-23 (5)  
DBV (5)  
Top View  
SRT  
GND  
VCC1  
RESET  
1
5
2
3
VCC  
4
Not to scale  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NO.  
NAME  
Set reset time-out. Connect a capacitor between this pin and ground to select the reset time-out period (tD).  
tD = 619 × C1 (CSRT in µF and tD in ms). If no capacitor is connected, leave this pin floating.  
1
SRT  
I
2
3
4
GND  
VCC1  
VCC  
Ground pin.  
I
I
Can be connected to VCC or left floating. DO NOT CONNECT TO GND.  
Supply voltage, and reset threshold monitor input.  
Open-drain, active-low reset output. Connect to an external pullup resistor. RESET changes from high to low  
whenever the monitored voltage (VCC) drops below the reset threshold voltage (VIT-). Once VCC exceeds  
the reset threshold (VIT-) + hysteresis (VHYS), RESET remains low for the reset time-out period (tD) and then  
deasserts to logic high.  
5
RESET  
O
4
Copyright © 2019, Texas Instruments Incorporated  
LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range, unless otherwise noted(1)  
MIN  
–0.3  
–0.3  
–0.3  
MAX  
12  
UNIT  
VCC  
Voltage  
RESET  
12  
V
SRT  
5.5  
Current  
RESET  
±70  
150  
150  
mA  
°C  
Operating junction temperature, TJ  
Storage, Tstg  
–40  
–65  
Temperature(2)  
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) As a result of the low dissipated power in this device, it is assumed that TJ = TA.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per ANSI/ESDA/JEDEC JS-  
001(1)  
± 2000  
V(ESD)  
Electrostatic discharge  
V
Charged device model (CDM), per JEDEC specification  
JESD22-C101(2)  
± 750  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
0.95  
0
NOM  
MAX  
10  
UNIT  
V
VCC  
Input supply voltage  
VRESET, VRESET  
IRESET, IRESET  
TJ  
RESET pin voltage  
10  
V
RESET pin current  
0
±5  
mA  
°C  
Junction temperature (free air temperature)  
–40  
125  
7.4 Thermal Information  
LP3470A  
DBV (SOT23-5)  
5 PINS  
187.5  
THERMAL METRIC(1)  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
109.2  
92.8  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
35.4  
ψJB  
92.5  
RθJC(bot)  
N/A  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
Copyright © 2019, Texas Instruments Incorporated  
5
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
7.5 Electrical Characteristics  
At 0.95 V VCC 10 V, SRT = Open, RESET pull-up resistor (Rpull-up) = 100 kΩ to VCC, output reset load (CLOAD) = 10 pF and  
over the operating free-air temperature range – 40°C to 125°C, unless otherwise noted. Typical values are at TJ = 25°C.  
PARAMETER  
Input supply voltage  
TEST CONDITIONS  
MIN  
0.95  
–1.5  
175  
75  
TYP  
MAX UNIT  
VCC  
10  
1.5  
V
VIT-  
Negative-going input threshold accuracy  
Hysteresis on VIT- pin  
-40°C to 125°C  
1
200  
100  
%
VHYS  
VHYS  
VIT- = 3.08 V to 4.63 V  
VIT- = 2.64 V to 2.93 V  
VCC = 0.95 V < VCC < 10 V  
225  
125  
mV  
mV  
Hysteresis on VIT- pin  
(1)  
ICC  
Supply current into VCC pin  
VCC > VIT+  
0.3  
1
µA  
TA = -40°C to 125°C  
(2)  
RSRT  
VPOR  
SRT pin internal resistance  
350  
500  
650  
950  
kΩ  
VOL(max) = 0.2 V  
IOUT (Sink) = 5.6 uA  
Power on Reset Voltage(3)  
mV  
1.5 V < VCC < 5 V  
VCC < VIT-  
IOUT(Sink) = 2 mA  
Low level output voltage  
VOL  
200  
90  
mV  
nA  
RESET pin in High Impedance,  
VCC = VRESET = 5.5 V  
VIT+ < VCC  
Ilkg(OD) Open-Drain output leakage current  
(1) VIT+ = VHYS + VIT-  
(2) This parameter is guranteed by design and characterization  
(3) VPOR is the minimum VDD voltage level for a controlled output state. VDD slew rate 100mV/µs  
7.6 Timing Requirements  
At 0.95 V VCC 10 V, SRT = Open, RESET pull-up resistor (Rpull-up) = 100 kΩ to VCC, output reset load (CLOAD) = 10 pF and  
over the operating free-air temperature range – 40°C to 125°C, VCC slew rate < 100mV / us, unless otherwise noted. Typical  
values are at TJ = 25°C.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Propagation detect delay for VCC falling  
below VIT-  
(1)  
tP_HL  
VCC = VIT+ to (VIT-) - 10%  
15  
30  
µs  
SRT pin = open  
VCC = (VIT- -1V) to (VIT+ + 1V)  
50  
µs  
tD  
Reset time delay  
SRT pin = 10 nF(2)(3)  
SRT pin = 1 µF(2)(3)  
5% VIT- overdrive(3)(4)  
6.2  
619  
10  
ms  
ms  
µs  
tGI_VIT-  
Glitch immunity VIT-  
(1) tP_HL measured from threhold trip point (VIT-) to VOL  
(2) Ideal capacitor  
(3) Parameter is guranteed by design.  
(4) Overdrive % = [(VCC/ VIT-) - 1] × 100%  
6
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LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
7.7 Typical Characteristics  
Typical characteristics show the typical performance of the LP3470A device. Test conditions are at TA = TJ = 25°C (unless  
otherwise noted).  
10  
9
8
7
6
5
4
3
2
1
0
0.6  
0.55  
0.5  
25°C  
-40°C  
125°C  
25°C  
-40°C  
125°C  
0.45  
0.4  
0.35  
0.3  
0.25  
0.2  
0.15  
0.1  
0.05  
1
2
3
4
5 6  
VCC (V)  
7
8
9
10  
0
1
2
3
4
5
VCC (V)  
6
7
8
9
10  
Iq_v  
VCC_  
1. Supply Current vs Supply Voltage  
2. Output Voltage vs Supply Voltage for LP3470A293  
0.34  
0.32  
0.3  
50  
45  
40  
35  
30  
25  
20  
15  
25°C  
-40°C  
125°C  
0.28  
0.26  
0.24  
0.22  
0.2  
0.18  
0.16  
0.14  
-40  
-20  
0
20  
40 60  
Temperature (°C)  
80  
100 120 140  
1.4  
1.6  
1.8  
2
2.2  
2.4  
2.6  
2.8  
VIT-  
VCC (V)  
VOL_  
4. Negative-going Input Threshold VIT- Accuracy vs  
3. Low Level Output Voltage vs Supply Voltage  
Temperature  
479  
0.6  
0.55  
0.5  
478.5  
478  
477.5  
477  
0.45  
0.4  
476.5  
476  
0.35  
0.3  
475.5  
475  
0.25  
0.2  
474.5  
474  
0.15  
0.1  
473.5  
473  
0.05  
0
472.5  
-40  
-20  
0
20  
40 60  
Temperature (°C)  
80  
100 120 140  
-40  
-20  
0
20  
40 60  
Temperature (°C)  
80  
100 120 140  
RSRT  
VITp  
6. SRT Pin Internal Resistance Overtemperature  
5. Positive-going Input Threshold VIT+ Accuracy vs  
Temperature  
版权 © 2019, Texas Instruments Incorporated  
7
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
Typical Characteristics (接下页)  
Typical characteristics show the typical performance of the LP3470A device. Test conditions are at TA = TJ = 25°C (unless  
otherwise noted).  
600  
500  
400  
300  
200  
100  
0
5
4.5  
4
25°C  
-40°C  
125°C  
25°C  
-40°C  
125°C  
3.5  
3
2.5  
2
1.5  
1
0.5  
0.01  
0.02 0.03 0.050.07 0.1  
0.2 0.3  
0.5 0.7  
1
1
2
3
4
Capacitor Value (µF)  
5
6
7
8 9 10  
Capacitor Value (µF)  
Dela  
Dela  
7. Reset Time Delay vs Small Capacitor Values  
8. Reset Time Delay vs Large Capacitor Values  
8
版权 © 2019, Texas Instruments Incorporated  
LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
8 Detailed Description  
8.1 Overview  
The LP3470A micropower voltage supervisory circuit provides a simple solution to monitor the power supplies in  
microprocessor and digital systems and provides a reset controlled by the factory-programmed reset threshold  
on the VCC supply voltage pin. When the voltage declines below the reset threshold, the reset signal is asserted  
and remains asserted for an interval programmed by an external capacitor after VCC has risen above the  
threshold voltage. The reset threshold options are 2.63 V, 2.75 V, 2.93 V, 3.08 V, 3.65 V, 4 V, 4.38 V, 4.63 V.  
8.2 Functional Block Diagram  
VCC1  
+
VCC  
RESET  
LOGIC  
TIMER  
œ
Reference  
RESET  
GND  
RSRT  
SRT  
GND  
8.3 Feature Description  
8.3.1 RESET Time-Out Period  
The reset time delay can be set to a minimum value of 50 µs by leaving the SRT pin floating, or a maximum  
value of approximately 6.2 seconds by connecting 10 µF delay capacitor. The reset time delay (tD) can be  
programmed by connecting a capacitor no larger than 10 µF between SRT pin and GND.  
The relationship between external capacitor (CSRT) in Farads at SRT pin and the time delay (tD) in seconds is  
given by 公式 1.  
tD = -ln (0.29) x RSRT x CSRT + tD (no cap)  
(1)  
(2)  
(3)  
公式 1 is simplified to 公式 2 by plugging RSRT and tD(no cap) given in Electrical Characteristics section:  
tD = 618937 x CSRT + 50 µs  
公式 3 solves for external capacitor value (CSRT) in units of Farads where tD is in units of seconds  
CSRT = (tD- 50 µs) ÷ 618937  
The reset delay varies according to three variables: the external capacitor variance (CSRT), SRT pin internal  
resistance (RSRT) provided in the Electrical Characteristics table, and a constant. The minimum and maximum  
variance due to the constant is shown in Equation 5 and Equation 6.  
tD (minimum) = -ln (0.36) x RSRT (min) x CSRT (min) + tD (no cap, min)  
tD (maximum) = -ln (0.26) x RSRT (max) x CSRT (max) + tD (no cap, max)  
(4)  
(5)  
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9
 
 
 
 
 
 
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
Feature Description (接下页)  
The recommended maximum delay capacitor for the LP3470A is limited to 10 µF as this ensures there is enough  
time for the capacitor to fully discharge when the reset condition occurs. When a voltage fault occurs, the  
previously charged up capacitor discharges, and if the monitored voltage returns from the fault condition before  
the delay capacitor discharges completely, the delay capacitor will begin charging from a voltage above zero and  
the reset delay will be shorter than expected. Larger delay capacitors can be used so long as the capacitor has  
enough time to fully discharge during the duration of the voltage fault.  
8.3.2 RESET Output  
In applications like microprocessor (µP) systems, errors might occur in system operation during power up, power  
down, or brownout conditions. It is imperative to monitor the power supply voltage to prevent these errors from  
occurring.  
The LP3470A asserts a reset signal whenever the VCC supply voltage is below a threshold (VIT-) voltage.  
RESET is ensured to be a logic low for VCC > 0.95 V. Once VCC exceeds the reset threshold plus a hysteresis  
voltage, the reset is kept asserted for a time period (tD) programmed by an external capacitor (CSRT); after this  
interval RESET goes to logic high. If a brownout condition occurs (monitored voltage falls below the reset  
threshold), RESET goes low. When VCC returns above the reset threshold plus a hysteresis voltage, RESET  
remains low for a time period tD before going to logic high. 9 shows this behavior.  
VIT+  
VIT-  
VHYS  
VCC  
VCCmin  
VCC(0v)  
tD  
tD  
tP_HL  
VOH  
RESET  
VOL  
9. RESET Output Timing Diagram  
8.3.3 Pull-up Resistor Selection  
The RESET output structure of the LP3470A is an open-drain N-channel MOSFET switch. A pull-up resistor  
(Rpull-up) must be connected to VCC to keep the output logic high when RESET is not asserted.  
Connect the pull-up resistor to the desired pull-up voltage source and RESET can be pulled up to any voltage up  
to 10 V independent of the VCC voltage. To ensure proper voltage levels, give some consideration when  
choosing the pull-up resistor values. Rpull-up must be large enough to limit the current through the output within  
the recommended operating conditions. The pull-up resistor value determines the actual VOL, the output  
capacitive loading, and the output leakage current (ILKG(OD)). A typical pull-up resistor value of 20 kΩ is sufficient  
in most applications.  
8.3.4 VCC Transient Immunity  
The LP3470A is immune to quick voltage transients or excursions on VCC. Sensitivity to transients depends on  
both pulse duration and overdrive. Overdrive is defined by how much VCC deviates from the specified threshold.  
Threshold overdrive is calculated as a percent of the threshold in question, as shown in 公式 6. A 0.1-µF bypass  
capacitor mounted close to VCC provides additional transient immunity.  
Overdrive = | (VCC / VIT- – 1) × 100% |  
(6)  
10  
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LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
Feature Description (接下页)  
VCC  
VIT+  
VIT-  
VHYS  
Overdrive  
Pulse  
Duration  
10. Overdrive vs Pulse Duration  
8.4 Device Functional Modes  
8.4.1 RESET Output Low  
When the VCC supply voltage is below the reset threshold (VIT-), the RESET pin will output logic low. RESET is  
ensured to be a logic low for VCC > 0.95 V.  
8.4.2 RESET Output High  
When the VCC supply voltage exceeds the reset threshold (VIT-) plus the hysteresis voltage (VHYS), the RESET  
remains asserted for a time period (tD) programmed by an external capacitor (CSRT); after this interval RESET  
goes to logic high.  
版权 © 2019, Texas Instruments Incorporated  
11  
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
9 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The LP3470A is a micropower CMOS voltage supervisor that is ideal for use in battery-powered microprocessor  
and other digital systems. It is small in size and provides voltage monitoring and supervisory functions with nano-  
Iq and programmable delay, making it a good solution in a variety of applications. The LP3470A is available in  
six standard reset threshold voltage options, and the reset time-out period is adjustable using an external  
capacitor providing maximum flexibility in any application. This device can ensure system reliability and ensures  
that a connected microprocessor will operate only when a minimum voltage supply is satisfied.  
9.2 Typical Application  
The LP3470A can be used as a simple supervisor circuit to monitor the input supply to a microprocessor as  
shown in 11.  
IN LDO OUT  
VCC  
VCC VCC1  
Microcontroller  
RESET  
LP3470A  
SRT  
RESET  
GND  
11. Power-On Reset Circuit  
9.2.1 Design Requirements  
For this design example, use the parameters listed in 1 as the input parameters.  
1. Design Parameters  
DESIGN PARAMETER  
Input supply voltage  
EXAMPLE VALUE  
0.95 to 10 V  
Reset threshold voltage  
2.63 V, 2.75 V, 2.93 V, 3.08 V, 3.65 V, 4 V, 4.38 V, 4.63 V  
External pullup resistor  
0.68 to 68 kΩ  
CSRT = 1 nF  
619 µs  
External reset time-out period capacitor  
Reset time-out period  
9.2.2 Detailed Design Procedure  
The minimum application circuit requires the LP3470A Power-On Reset Circuit IC and a pullup resistor  
connecting the reset pin to VCC. The reset delay can be programmed with an additional capacitor connected  
from the SRT pin to GND. See RESET Time-Out Period and Pull-up Resistor Selection for information on  
choosing specific values for components.  
12  
版权 © 2019, Texas Instruments Incorporated  
 
 
LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
9.2.3 Application Curves  
Two capacitor values for CSRT (0.1 µF and 1 µF) are used as examples to show the programmability of the  
output time delay as shown in 12 and 13.  
VDD  
VDD  
Reset Delay (tD) = 5.8 ms  
Reset Delay (tD)= 654 ms  
RESET  
RESET  
12. Reset Delay Time with 0.1-µF Capacitor at SRT  
13. Reset Delay Time with 1-µF Capacitor at SRT  
版权 © 2019, Texas Instruments Incorporated  
13  
 
LP3470A  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
www.ti.com.cn  
10 Power Supply Recommendations  
The input of the LP3470A is designed to handle up to the supply voltage absolute maximum rating of 12 V. If the  
input supply is susceptible to any large transients above the maximum rating, then take extra precautions. An  
input capacitor is optional but not required to help avoid false reset output triggers due to noise.  
11 Layout  
11.1 Layout Guidelines  
Good analog design practice recommends placing a minimum of 0.1-µF ceramic capacitor as near as  
possible to the VCC pin.  
Place components as close as possible to the IC  
Keep traces short between the IC and the CSRT capacitor to ensure the timing delay is as accurate as  
possible.  
For VCC slew rate > 100 mV/µs, increase input capacitance and pull-up resistor value  
11.2 Layout Example  
14 shows a layout example.  
14. LP3470A Layout Example  
14  
版权 © 2019, Texas Instruments Incorporated  
 
LP3470A  
www.ti.com.cn  
ZHCSKC9B JULY 2019REVISED NOVEMBER 2019  
12 器件和文档支持  
12.1 接收文档更新通知  
要接收文档更新通知,请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产品  
信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
12.2 支持资源  
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight  
from the experts. Search existing answers or ask your own question to get the quick design help you need.  
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do  
not necessarily reflect TI's views; see TI's Terms of Use.  
12.3 商标  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.4 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
12.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且  
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2019, Texas Instruments Incorporated  
15  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LP3470A263DBVR  
LP3470A275DBVR  
LP3470A293DBVR  
LP3470A308DBVR  
LP3470A365DBVR  
LP3470A400DBVR  
LP3470A438DBVR  
LP3470A463DBVR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
D263  
D275  
D293  
D308  
D365  
D400  
D438  
D463  
NIPDAU  
NIPDAU  
NIPDAU  
NIPDAU  
NIPDAU  
NIPDAU  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-Dec-2019  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP3470A263DBVR  
LP3470A275DBVR  
LP3470A293DBVR  
LP3470A308DBVR  
LP3470A365DBVR  
LP3470A400DBVR  
LP3470A438DBVR  
LP3470A463DBVR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-Dec-2019  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP3470A263DBVR  
LP3470A275DBVR  
LP3470A293DBVR  
LP3470A308DBVR  
LP3470A365DBVR  
LP3470A400DBVR  
LP3470A438DBVR  
LP3470A463DBVR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
Pack Materials-Page 2  
PACKAGE OUTLINE  
DBV0005A  
SOT-23 - 1.45 mm max height  
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR  
C
3.0  
2.6  
0.1 C  
1.75  
1.45  
1.45  
0.90  
B
A
PIN 1  
INDEX AREA  
1
2
5
(0.1)  
2X 0.95  
1.9  
3.05  
2.75  
1.9  
(0.15)  
4
3
0.5  
5X  
0.3  
0.15  
0.00  
(1.1)  
TYP  
0.2  
C A B  
NOTE 5  
0.25  
GAGE PLANE  
0.22  
0.08  
TYP  
8
0
TYP  
0.6  
0.3  
TYP  
SEATING PLANE  
4214839/G 03/2023  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Refernce JEDEC MO-178.  
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed 0.25 mm per side.  
5. Support pin may differ or may not be present.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DBV0005A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
5X (1.1)  
1
5
5X (0.6)  
SYMM  
(1.9)  
2
3
2X (0.95)  
4
(R0.05) TYP  
(2.6)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED METAL  
EXPOSED METAL  
0.07 MIN  
ARROUND  
0.07 MAX  
ARROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214839/G 03/2023  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DBV0005A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
5X (1.1)  
1
5
5X (0.6)  
SYMM  
(1.9)  
2
3
2X(0.95)  
4
(R0.05) TYP  
(2.6)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE:15X  
4214839/G 03/2023  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
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保。  
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