LP38512TSX-1.8 [TI]

1.5A Fast-Transient Response Low-Dropout Linear Voltage Regulator with Error Flag;
LP38512TSX-1.8
型号: LP38512TSX-1.8
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1.5A Fast-Transient Response Low-Dropout Linear Voltage Regulator with Error Flag

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LP38512  
LP38512-1.8 1.5A Fast-Transient Response Low-Dropout Linear Voltage  
Regulator with Error Flag  
Literature Number: SNOSAU7E  
March 6, 2009  
LP38512-1.8  
1.5A Fast-Transient Response Low-Dropout Linear  
Voltage Regulator with Error Flag  
General Description  
Features  
The LP38512-1.8 Fast-Transient Response Low-Dropout  
Voltage Regulator offers the highest-performance in meeting  
AC and DC accuracy requirements for powering Digital  
Cores. The LP38512-1.8 uses a proprietary control loop that  
enables extremely fast response to change in line conditions  
and load demands. Output Voltage DC accuracy is guaran-  
teed at 2.5% over line, load and full temperature range from  
-40°C to +125°C. The LP38512-1.8 is designed for inputs  
from the 2.5V, 3.3V, and 5.0V rail, is stable with 10 μF ceramic  
capacitors, and has a fixed 1.8V output. An Error Flag feature  
monitors the output voltage and notifies the system processor  
when the output voltage falls more than 15% below the nom-  
inal value. The LP38512-1.8 provides excellent transient per-  
formance to meet the demand of high performance digital  
core ASICs, DSPs, and FPGAs found in highly-intensive ap-  
plications such as servers, routers/switches, and base sta-  
tions.  
2.25V to 5.5V Input Voltage Range  
1.8V Fixed Output Voltage  
1.5A Output Load Current  
±2.5% Accuracy over Line, Load, and Full-Temperature  
Range from -40°C to +125°C  
Stable with tiny 10 µF ceramic capacitors  
0.20% Output Voltage Load Regulation from 10 mA to  
1.5A  
Enable pin  
Error Flag Indicates Status of Output Voltage  
1uA of Quiescent current in Shutdown  
40dB of PSRR at 100 kHz  
Over-Temperature and Over-Current Protection  
TO-263 and TO-263 THIN Surface Mount Packages  
Applications  
Digital Core ASICs, FPGAs, and DSPs  
Servers  
Routers and Switches  
Base Stations  
Storage Area Networks  
DDR2 Memory  
Typical Application Circuit  
20183001  
© 2009 National Semiconductor Corporation  
201830  
www.national.com  
Ordering Information  
TABLE 1. Package Marking and Ordering Information  
Output  
Voltage  
Order Number  
Package Type  
Package Marking  
Supplied As:  
LP38512TJ-1.8  
LP38512TS-1.8  
LP38512TSX-1.8  
TO263-5 THIN  
TO263-5  
LP38512TJ-1.8  
LP38512TS-1.8  
LP38512TS-1.8  
Tape and Reel  
Rail  
1.8  
TO263-5  
Tape and Reel  
Connection Diagrams  
20183005  
20183004  
Top View  
TO-263 THIN 5 Pin Package  
Top View  
TO-263 5 Pin Package  
Pin Descriptions for TO-263 and TO-263 THIN Packages  
Pin #  
Pin Name  
Function  
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias  
and must be tied to the input voltage, or actively driven.  
1
EN  
2
3
4
IN  
Input Supply Pin  
GND  
OUT  
Ground  
Regulated Output Voltage Pin  
ERROR Flag. A high level indicates that VOUT is within typically 15% (VOUT falling) of the  
nominal regulated voltage.  
5
ERROR  
The TO-263 TAB, and the TO-263 THIN DAP, is used as a thermal connection to remove  
heat from the device to an external heatsink. The TAB/DAP is internally connected to device  
pin 3, and is electrical ground connection.  
TAB/DAP  
TAB/DAP  
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2
Absolute Maximum Ratings (Note 1)  
Operating Ratings (Note 1)  
Input Supply Voltage, VIN  
Enable Input Voltage, VEN  
ERROR Pin Voltage  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
2.25V to 5.5V  
0.0V to 5.5V  
0.0V to VIN  
Storage Temperature Range  
Soldering Temperature (Note 3)  
TO-220, Wave  
−65°C to +150°C  
Output Current (DC)  
Junction Temperature (Note 4)  
0 mA to 1.5A  
−40°C to +125°C  
260°C, 10s  
235°C, 30s  
TO-263  
ESD Rating (Note 2)  
±2 kV  
Power Dissipation(Note 4)  
Input Pin Voltage (Survival)  
Enable Pin Voltage (Survival)  
Output Pin Voltage (Survival)  
ERROR Pin Voltage (Survival)  
IOUT(Survival)  
Internally Limited  
−0.3V to +6.0V  
−0.3V to +6.0V  
−0.3V to +6.0V  
0.3V to +6.0V  
Internally Limited  
Electrical Characteristics  
Unless otherwise specified: VIN = 2.5V, IOUT = 10 mA, CIN = 10 µF, COUT = 10 µF, VEN = VIN. Limits in standard type are for TJ =  
25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum  
limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at  
TJ = 25°C, and are provided for reference purposes only.  
Symbol  
Parameter  
Conditions  
2.25V VIN 5.5V  
10 mA IOUT 1.5A  
Min  
Typ  
Max  
Units  
Output Voltage Tolerance  
(Note 7)  
-1.0  
−2.5  
+1.0  
+2.5  
VOUT  
0
%
Output Voltage Line  
ΔVOUTVIN Regulation  
0.02  
0.06  
-
-
-
-
%/V  
2.25V VIN 5.5V  
(Notes 5, 7)  
Output Voltage Load  
ΔVOUTIOUT Regulation  
0.25  
0.40  
%/A  
mV  
10 mA IOUT 1.5A  
(Notes 6, 7)  
Dropout Voltage  
(Note 8)  
340  
400  
VDO  
IOUT = 1.5A  
-
-
-
250  
7.5  
9.5  
IOUT = 10 mA  
11  
12  
ERROR pin = GND  
IOUT = 1.5A  
Ground Pin Current, Output  
Enabled  
mA  
13  
IGND  
14  
ERROR pin = GND  
VEN = 0.50V  
Ground Pin Current, Output  
Disabled  
3.5  
12  
-
-
0.1  
2.5  
µA  
A
ERROR pin = GND  
VOUT = 0V  
ISC  
Short Circuit Current  
-
Enable Input  
VEN rising from 0.50V until  
VOUT = ON  
0.90  
0.80  
1.50  
1.60  
VEN(ON)  
Enable ON Threshold  
1.20  
V
VEN falling from 1.60V until  
VOUT = OFF  
0.60  
0.50  
1.40  
1.50  
VEN(OFF)  
VEN(HYS)  
td(OFF)  
Enable OFF Threshold  
Enable Hysteresis  
Turn-off delay  
1.00  
200  
1
VEN(ON) - VEN(OFF)  
-
-
mV  
µs  
Time from VEN < VEN(OFF) to VOUT  
OFF, ILOAD = 1.5A  
=
-
-
Time from VEN >VEN(ON) to VOUT  
ON, ILOAD = 1.5A  
=
td(ON)  
Turn-on delay  
-
25  
-
VEN = VIN  
VEN = 0V  
-
-
1
-
-
IEN  
Enable Pin Current  
nA  
-1  
3
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Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
ERROR Flag  
VOUT rising threshold where  
ERROR Flag goes high  
VOUT falling threshold where  
ERROR Flag goes low  
78  
74  
-
90  
85  
98  
93  
45  
Error Flag Threshold  
(Note 9)  
VTH  
%
ERROR Flag Saturation  
Voltage  
VERROR(SAT)  
Ilk  
ISINK = 100 µA  
VERROR = 5.5V  
12.5  
mV  
ERROR Flag Pin Leakage  
Current  
-
-
1
1
-
-
nA  
µs  
td  
ERROR Flag Delay time  
AC Parameters  
VIN = 2.5V  
f = 120Hz  
VIN = 2.5V  
f = 1 kHz  
-
-
73  
73  
-
-
PSRR  
en  
Ripple Rejection  
dB  
Output Noise Density  
Output Noise Voltage  
f = 120Hz  
-
-
2
-
-
nV/Hz  
µV (RMS)  
BW = 100Hz – 100kHz  
75  
Thermal Characteristics  
TSD  
TJ rising  
Thermal Shutdown  
-
-
165  
10  
-
-
°C  
TJ falling from TSD  
ΔTSD  
Thermal Shutdown Hysteresis  
Thermal Resistance  
Junction to Ambient  
(Note 4)  
θJ-A  
TO-263 and TO-263 THIN  
TO-263 and TO-263 THIN  
-
-
60  
3
-
-
°C/W  
°C/W  
Thermal Resistance  
Junction to Case  
θJ-C  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical Characteristics.  
Note 2: The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin. Test method is per JESD22-A114.  
Note 3: Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperatures and  
times are for Sn-Pb (STD) only.  
Note 4: Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum allowable operating  
junction temperature (TJ(MAX)), and package thermal resistance (θJA).  
Note 5: Output voltage line regulation is defined as the change in output voltage from the nominal value (ΔVOUT) due to a change in the voltage at the input  
(ΔVIN).  
Note 6: Output voltage load regulation is defined as the change in output voltage from the nominal value (ΔVOUT) due to a change in the load current at the output  
(ΔIOUT).  
Note 7: The line and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the output  
voltage tolerance specification.  
Note 8: Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value. For the LP38512-1.8  
the minimum VIN operating voltage is the limiting factor.  
Note 9: The ERROR Flag thresholds are specified as percentage of the nominal regulated output voltage. See Application Information.  
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4
 
 
 
 
 
 
 
 
 
Typical Performance Characteristics Unless otherwise specified: TJ = 25°C, VIN = 2.5V, VEN = VIN,  
CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.  
VOUT vs Temperature  
VOUT vs VIN  
20183011  
20183037  
Ground Pin Current (IGND) vs VIN  
Ground Pin Current (IGND) vs Temperature  
20183012  
20183013  
Ground Pin Current(IGND) vs Temperature, VEN = 0.5V  
Enable Thresholds vs Temperature  
20183016  
20183014  
5
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VOUT vs VEN (td(ON)  
)
VOUT vs VEN (td(OFF))  
20183032  
20183030  
VOUT ERROR Flag Threshold vs Temperature  
ERROR Flag Low vs Temperature  
20183018  
20183017  
Load regulation vs Temperature  
Line Regulation vs Temperature  
20183020  
20183021  
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6
Current Limit vs Temperature  
Load Transient, 10 mA to 1.5A  
COUT = 10 μF Ceramic  
20183022  
20183023  
Load Transient, 10 mA to 1.5A  
COUT = 10 µF Ceramic + 100 µF Aluminum  
Load Transient, 500 mA to 1.5A  
COUT = 10 µF Ceramic  
20183024  
20183025  
Load Transient, 500 mA to 1.5A  
Line Transient  
COUT = 10 μF Ceramic + 100 µF Aluminum  
20183027  
20183026  
7
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PSRR, 10Hz to 1MHz  
Noise  
20183029  
20183031  
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8
Block Diagram  
20183007  
Application Information  
EXTERNAL CAPACITORS  
voltage becomes reversed. A less common condition is when  
an alternate voltage source is connected to the output.  
Like any low-dropout regulator, external capacitors are re-  
quired to assure stability. These capacitors must be correctly  
selected for proper performance.  
There are two possible paths for current to flow from the out-  
put pin back to the input during a reverse voltage condition.  
While VIN is high enough to keep the control circuity alive, and  
the Enable pin is above the VEN(ON) threshold, the control cir-  
cuitry will attempt to regulate the output voltage. Since the  
input voltage is less than the output voltage the control circuit  
will drive the gate of the pass element to the full on condition  
when the output voltage begins to fall. In this condition, re-  
verse current will flow from the output pin to the input pin,  
limited only by the RDS(ON) of the pass element and the output  
to input voltage differential. Discharging an output capacitor  
up to 1000 µF in this manner will not damage the device as  
the current will rapidly decay. However, continuous reverse  
current should be avoided.  
Input Capacitor  
A ceramic input capacitor of at least 10 µF is required. For  
general usage across all load currents and operating condi-  
tions, a 10 µF ceramic input capacitor will provide satisfactory  
performance.  
Output Capacitor  
A ceramic capacitor with a minimum value of 10 µF is required  
at the output pin for loop stability. It must be located less than  
1 cm from the device and connected directly to the output and  
ground pin using traces which have no other currents flowing  
through them. As long as the minimum of 10 µF ceramic is  
met, there is no limitation on any additional capacitance.  
The internal PFET pass element in the LP38512 has an in-  
herent parasitic diode. During normal operation, the input  
voltage is higher than the output voltage and the parasitic  
diode is reverse biased. However, if the output voltage to input  
voltage differential is more than 500 mV (typical) the parasitic  
diode becomes forward biased and current flows from the  
output pin to the input through the diode. The current in the  
parasitic diode should limited to less than 1A continuous and  
5A peak.  
X7R and X5R dielectric ceramic capacitors are strongly rec-  
ommended, as they typically maintain a capacitance range  
within ±20% of nominal over full operating ratings of temper-  
ature and voltage. Of course, they are typically larger and  
more costly than Z5U/Y5U types for a given voltage and ca-  
pacitance.  
Z5U and Y5V dielectric ceramics are not recommended as  
the capacitance will drops severely with applied voltage. A  
typical Z5U or Y5V capacitor can lose 60% of its rated ca-  
pacitance with half of the rated voltage applied to it. The Z5U  
and Y5V also exhibit a severe temperature effect, losing more  
than 50% of nominal capacitance at high and low limits of the  
temperature range.  
If used in a dual-supply system where the regulator output  
load is returned to a negative supply, the output pin must be  
diode clamped to ground. A Schottky diode is recommended  
for this protective clamp.  
SHORT-CIRCUIT PROTECTION  
The LP38512 is short circuit protected, and in the event of a  
peak over-current condition the short-circuit control loop will  
rapidly drive the output PMOS pass element off. Once the  
power pass element shuts down, the control loop will rapidly  
cycle the output on and off until the average power dissipation  
causes the thermal shutdown circuit to respond to servo the  
REVERSE VOLTAGE  
A reverse voltage condition will exist when the voltage at the  
output pin is higher than the voltage at the input pin. Typically  
this will happen when VIN is abruptly taken low and COUT con-  
tinues to hold a sufficient charge such that the input to output  
9
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on/off cycling to a lower frequency. Please refer to the POW-  
ER DISSIPATION/HEATSINKING section for power dissipa-  
tion calculations.  
trol loop will be active and the ERROR Flag will report the  
status of the output voltage. When the Enable pin is taken low  
the regulator control loop is shutdown, the output is turned off,  
and the ERROR Flag pin is immediately forced low.  
ENABLE OPERATION  
ERROR FLAG OPERATION  
The Enable ON threshold is typically 1.2V, and the OFF  
threshold is typically 1.0V. To ensure reliable operation the  
Enable pin voltage must rise above the maximum VEN(ON)  
threshold and must fall below the minimum VEN(OFF) thresh-  
old. The Enable threshold has typically 200mV of hysteresis  
to improve noise immunity.  
When the LP38512 Enable pin is high, the ERROR Flag pin  
will produce a logic low signal when the output drops by more  
than 15% (typical) from the nominal output voltage. The drop  
in output voltage may be due to low input voltage, current  
limiting, or thermal limiting. This flag has a built in hysteresis.  
The output voltage will need to rise to within 10% (typical) of  
the nominal output voltage for the ERROR Flag to return to a  
logic high state. It should also be noted that when the Enable  
pin is pulled low, the ERROR Flag pin is forced to be low as  
well.  
The Enable pin (EN) has no internal pull-up or pull-down to  
establish a default condition and, as a result, this pin must be  
terminated either actively or passively.  
If the Enable pin is driven from a single ended device (such  
as discrete transistor) a pull-up resistor to VIN, or a pull-down  
resistor to ground, will be required for proper operation. A  
1 kto 100 kresistor can be used as the pull-up or pull-  
down resistor to establish default condition for the EN pin. The  
resistor value selected should be appropriate to swamp out  
any leakage in the external single ended device, as well as  
any stray capacitance.  
The internal ERROR flag comparator has an open drain out-  
put stage. Hence, the ERROR pin requires an external  
pull-up resistor. The value of the pull-up resistor should be in  
the range of 10 kto 1 M. The ERROR Flag pin should not  
be pulled-up to any voltage source higher than VIN as current  
flow through an internal parasitic diode may cause unexpect-  
ed behavior. The ERROR Flag must be connected to ground  
if this function is not used.  
If the Enable pin is driven from a source that actively pulls high  
and low (such as a CMOS rail to rail comparator output), the  
pull-up, or pull-down, resistor is not required.  
The timing diagram in Figure 1 shows the relationship be-  
tween the ERROR flag and the output voltage.  
If the application does not require the Enable function, the pin  
should be connected to directly to the adjacent VIN pin.  
The status of the Enable pin also affects the behavior of the  
ERROR Flag. While the Enable pin is high the regulator con-  
20183008  
FIGURE 1. ERROR Flag Operation, see Typical Application  
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10  
 
20183034  
FIGURE 2. ERROR Flag Operation, biased from VIN  
POWER DISSIPATION/HEATSINKING  
A heatsink may be required depending on the maximum pow-  
er dissipation (PD(MAX)), maximum ambient temperature  
(TA(MAX)) of the application, and the thermal resistance (θJA  
)
of the package. Under all possible conditions, the junction  
temperature (TJ) must be within the range specified in the  
Operating Ratings. The total power dissipation of the device  
is given by:  
PD = ( (VIN−VOUT) x IOUT) + (VIN x IGND  
)
(1)  
where IGND is the operating ground current of the device  
(specified under Electrical Characteristics).  
20183035  
The maximum allowable junction temperature rise (ΔTJ) de-  
pends on the maximum expected ambient temperature (TA  
(MAX)) of the application, and the maximum allowable junction  
temperature (TJ(MAX)):  
FIGURE 3. θJA vs Copper (1 Ounce) Area for TO-263  
package  
As shown in the figure, increasing the copper area beyond 1  
square inch produces very little improvement. The minimum  
value for θJA for the TO-263 package mounted to a two-layer  
PCB is 32°C/W.  
ΔTJ = TJ(MAX)− TA(MAX)  
(2)  
Figure 4 shows the maximum allowable power dissipation for  
TO-263 packages for different ambient temperatures, assum-  
ing θJA is 35°C/W and the maximum junction temperature is  
125°C.  
The maximum allowable value for junction to ambient Ther-  
mal Resistance, θJA, can be calculated using the formula:  
θJA = ΔTJ / PD(MAX)  
(3)  
HEATSINKING TO-263 PACKAGE  
The TO-263 and the TO-263 THIN packages use the copper  
plane on the PCB as a heatsink. The tab, or DAP, of these  
packages are soldered to the copper plane for heat sinking.  
Figure 3 shows a curve for the θJA of TO-263 package for  
different copper area sizes, using a typical PCB with 1 ounce  
copper and no solder mask over the copper area for heat  
sinking.  
20183036  
FIGURE 4. Maximum Power Dissipation vs Ambient  
Temperature for TO-263 Package  
11  
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Physical Dimensions inches (millimeters) unless otherwise noted  
TO-263, Molded, 5-Lead, 0.067in (1.7mm) Pitch, Surface Mount Package  
NS Package Number TS5B  
TO-263 THIN, Molded, 5-Lead, 1.7mm Pitch, Surface Mount Package  
NS Package Number TJ5A  
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12  
Notes  
13  
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